An LED lamp module and an assembled LED lamp using the module

Abstract

The present invention discloses an LED lamp module, including a radiator, a heat dissipation column, a substrate and a lens; the radiator includes an intermediate body, a through hole is provided inside the intermediate body, a plurality of heat dissipation fins are connected along the outer surface of the intermediate body, and a plurality of pairs of heat dissipation fins are provided along both sides of the heat dissipation fins; the heat dissipation column is installed at one end of the through hole of the radiator, one end of the heat dissipation column passes through the substrate and is located in a cavity formed by the substrate and the lens; the substrate is installed on an end surface of the radiator, and a through hole for the heat dissipation column to pass through is provided in the middle position of the substrate; the lens is installed on the substrate, the lens has an open groove structure, and a cavity for installing a light source is formed with the substrate through the open groove structure. The present invention improves the heat dissipation performance of the light source by adopting a heat dissipation column with a phase change heat transfer structure and heat dissipation fins radially distributed with the intermediate body as the center. At the same time, a plurality of LED lamp modules using light sources can be assembled into a high-power assembled LED lamp.

Description

Technical Field

[0001] The present invention relates to the field of LEDs, and in particular to an LED lamp module and an assembled LED lamp using the module. Background Art

[0002] LED, also known as light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light. It can directly convert electricity into light.

[0003] Existing LED light sources are mainly divided into COB light sources and SMD light sources, among which:

[0004] COB light source is to bind and package the chip directly on the entire substrate. N chips are integrated together for packaging. It is mainly used to solve the problem of manufacturing high-power LEDs with low-power chips. It can disperse the heat dissipation of the chip, improve the light efficiency, and improve the glare effect of LED lights.

[0005] SMD light source is a light emitting diode mounted on the surface of a substrate, which has the advantages of large light emitting angle, high efficiency, good precision and low false soldering rate.

[0006] Since the heat dissipation performance of SMD light sources is better than that of COB light sources, most of the existing high-power LED lamps are realized by assembling several LED lamp modules of SMD light sources. However, due to the relatively poor heat dissipation performance of COB light sources, when assembling a high-power LED lamp, the number of COB light source modules is limited. If the limited number is exceeded, the heat dissipation performance of the entire high-power LED lamp cannot be met.

[0007] However, in the prior art, a small number of assembled LED lamps using COB light sources are limited by heat dissipation performance, the power of a single light source is limited, and performance cannot be guaranteed. At the same time, due to their structure and light distribution, they are not suitable for SMD light sources. Summary of the invention

[0008] The purpose of the present invention is to provide an LED lamp module and an assembled LED lamp using the module to address the deficiencies in the prior art. The light sources of the LED lamp module and the assembled LED lamp can be either SMD light sources or COB light sources.

[0009] To solve the problems existing in the prior art.

[0010] The technical problem solved by the present invention can be achieved by adopting the following technical solutions:

[0011] An LED lamp module comprises a heat sink, a heat sink column, a substrate and a lens; the heat sink comprises an intermediate body, a through hole is opened inside the intermediate body, a plurality of heat sinks are connected along the outer surface of the intermediate body, and a plurality of pairs of heat sinks are arranged along both sides of the heat sink;

[0012] The heat dissipation column is installed at one end of the through hole of the radiator, and one end of the heat dissipation column passes through the substrate and is located in the cavity formed by the substrate and the lens;

[0013] The substrate is mounted on one end surface of the radiator, and a through hole for the heat dissipation column to pass through is opened in the middle of the substrate;

[0014] The lens is mounted on the substrate, the lens has an open groove structure, and the open groove structure and the substrate form a cavity for mounting the light source.

[0015] Furthermore, a limiting ring is provided at one end of the heat dissipation column, and is connected to the base plate in a limiting manner through the limiting ring.

[0016] Furthermore, the inner end of the heat dissipation fin is integrally connected to the heat sink, and a plurality of groups of connection terminals are provided at the outer end of the heat dissipation fin, and the connection terminals are symmetrically distributed on both sides of the heat dissipation fin.

[0017] Furthermore, a plurality of screw holes are provided along the edge of the lens, a plurality of connecting holes are opened along the edge of the substrate, and fixing holes matching with the connecting holes are provided at the ends of the heat sinks of the heat sink. The lens, the substrate and the heat sink are connected and fixed by screws passing through the screw holes, the connecting holes and the fixing holes in sequence.

[0018] Furthermore, the light source is an SMD light source or a COB light source.

[0019] Furthermore, the heat dissipation column adopts a phase change heat transfer structure, and the heat sinks are radially distributed with the intermediate body as the center.

[0020] An assembled LED lamp comprises the LED lamp module, wherein the LED lamp module is spliced ​​into the assembled LED lamp by using connectors.

[0021] Furthermore, the connecting piece includes a strip-shaped body, hollow grooves are provided on the left and right sides of the strip-shaped body, and connecting grooves are provided on the upper and lower sides of the strip-shaped body, and the hollow grooves and connecting grooves are distributed along the axial direction of the strip-shaped body.

[0022] Furthermore, the connection grooves are provided in two groups and are symmetrically distributed on the connection piece.

[0023] Furthermore, the connection groove is an inverted "T"-shaped structure, and is connected and fixed to the connection terminals symmetrically distributed on both sides of the heat dissipation fins in the heat sink through the "T"-shaped structure.

[0024] Compared with the prior art, the present invention has the following beneficial effects:

[0025] 1. The heat dissipation performance of the light source is improved by adopting a heat dissipation column with a phase change heat transfer structure and a heat sink radially distributed with the intermediate body as the center.

[0026] 2. By providing universal connection terminals and connectors matching the terminals on the heat sink, several LED lamp modules can be assembled into a high-power assembled LED lamp.

[0027] 3. By adopting a universal structure of LED lamp module, it has strong versatility and can be applied to both assembled LED lamps with SMD light sources and assembled LED lamps with COB light sources. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the LED lamp module of the present invention.

[0029] Figure 2 This is an exploded view of the LED lamp module described in the present invention.

[0030] Figure 3 It is a schematic diagram of the radiator described in the present invention.

[0031] Figure 4 It is a schematic diagram of the heat dissipation column described in the present invention.

[0032] Figure 5 Schematic diagram of the substrate of the present invention.

[0033] Figure 6 It is a front schematic diagram of the lens described in the present invention.

[0034] Figure 7 This is a schematic diagram of the reverse side of the lens of the present invention.

[0035] Figure 8 It is a schematic diagram of the connecting piece described in the present invention.

[0036] Fig. 9 It is a schematic diagram of the assembled LED lamp described in the present invention.

[0037] Fig.10 This is a bottom view of the assembled LED lamp described in the present invention. DETAILED DESCRIPTION

[0038] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0039] See also Figures 1 to 10The LED lamp module described in the present invention includes a heat sink 1, a heat dissipation column 2, a substrate 3 and a lens 4.

[0040] The heat sink 1 comprises a middle body 11, a through hole 111 is provided inside the middle body 11, a plurality of heat sinks 12 are connected along the outer surface of the middle body 11, and the heat sinks 12 are radially distributed with the middle body 11 as the center. A plurality of pairs of heat sinks 13 are provided along both sides of the heat sink 12; the inner ends of the heat sinks 13 are integrally connected to the heat sink 12, and a plurality of groups of connection terminals 131 are provided at the outer ends of the heat sink 13, and the connection terminals 131 are symmetrically distributed on both sides of the heat sink 13.

[0041] The heat dissipation column 2 is installed at one end of the through hole 111 of the radiator 1. One end of the heat dissipation column 2 passes through the substrate 3 and is located in the cavity formed by the substrate 3 and the lens 4. A limiting ring 21 is provided at one end of the heat dissipation column 2, and is limitedly connected to the substrate 3 through the limiting ring 21.

[0042] The heat dissipation column 2 adopts a phase change heat transfer structure. When in use, the heat conducting end of the heat dissipation column 2 is placed in the cavity. The heat generated when the light source is working is absorbed by the medium inside the heat dissipation column 2. The medium undergoes a liquid-gas phase change, from liquid to gas, and is quickly transferred to the heat dissipation end of the heat dissipation column 2. At this time, the medium changes from gas to liquid and releases heat.

[0043] The substrate 3 is mounted on one end surface of the radiator 1, and a through hole 31 for the heat dissipation column 2 to pass through is opened in the middle position of the substrate 3; one end surface, a through hole 31 for the heat dissipation column 2 to pass through is opened in the middle position of the substrate 3;

[0044] The lens 4 is mounted on the substrate 3. The lens 4 has an open groove structure 41, and the open groove structure 41 and the substrate 3 form a cavity for mounting a light source. The light source is an SMD light source or a COB light source. A plurality of screw holes 42 are provided along the edge of the lens 4, a plurality of connecting holes 32 are provided along the edge of the substrate 3, and a fixing hole 14 matching the connecting hole 32 is provided at the end of the heat sink 12 of the heat sink 1. The lens 4, the substrate 3 and the heat sink 1 are connected and fixed by screws passing through the screw holes 42, the connecting holes 32 and the fixing holes 14 in sequence.

[0045] An assembled LED lamp comprises the LED lamp module, wherein the LED lamp module is spliced ​​into an assembled LED lamp by using a connector 5.

[0046] The connecting member 5 includes a strip-shaped body 51 , with hollow grooves 52 formed on the left and right sides of the strip-shaped body 51 , and connecting grooves 53 formed on the upper and lower sides of the strip-shaped body 51 . The hollow grooves 52 and connecting grooves 53 are distributed along the axial direction of the strip-shaped body 51 .

[0047] There are two groups of connecting grooves 53 , which are symmetrically distributed on the connecting member 5 .

[0048] The connection groove 53 is an inverted “T”-shaped structure, and is connected and fixed to the connection terminals 131 symmetrically distributed on both sides of the heat dissipation fins 13 in the heat sink 1 through the “T”-shaped structure.

[0049] The heat dissipation principle of the present invention is as follows:

[0050] During operation, the heat generated by the light source will be absorbed and conducted by the heat dissipation column 2. The heat absorbed by the heat dissipation column 2 will cause the medium inside the heat dissipation column 2 to undergo a liquid-gas phase change, from liquid to gas, and quickly transfer to the heat dissipation end of the heat dissipation column 2. At this time, the medium changes from gas to liquid and releases heat. The heat conducted by the heat dissipation column 2 is conducted to the radiator 1 and dissipated by the heat sink 12.

[0051] In the present invention, a plurality of connection terminals 131 are provided at the outer ends of the heat dissipation fins 13. The connection terminals 131 are symmetrically distributed on both sides of the heat dissipation fins 13. A connection groove 53 matching with the connection terminals 131 is provided on the connector 5. According to the required power, a suitable number of LED lamp modules are selected and assembled through the connector 5.

[0052] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An LED lamp module, comprising a heat sink (1), a heat dissipation column (2), a substrate (3) and a lens (4); characterized in that: The heat sink (1) comprises an intermediate body (11), a through hole (111) is provided inside the intermediate body (11), a plurality of heat sinks (12) are connected along the outer surface of the intermediate body (11), and a plurality of pairs of heat sinks (13) are provided along both sides of the heat sink (12); The heat dissipation column (2) is mounted on one end of the through hole (111) of the heat sink (1); one end of the heat dissipation column (2) passes through the substrate (3) and is located in a cavity formed by the substrate (3) and the lens (4); The base plate (3) is mounted on one end surface of the radiator (1), and a through hole (31) for the heat dissipation column (2) to pass through is provided in the middle of the base plate (3); The lens (4) is mounted on the substrate (3); the lens (4) has an open groove structure (41), and the open groove structure (41) and the substrate (3) form a cavity for mounting a light source; The inner end of the heat dissipation fin (13) is integrally connected to the heat dissipation fin (12), and a plurality of groups of connection terminals (131) are provided at the outer end of the heat dissipation fin (13), and the connection terminals (131) are symmetrically distributed on both sides of the heat dissipation fin (13); A plurality of screw holes (42) are provided along the edge of the lens (4), a plurality of connection holes (32) are provided along the edge of the substrate (3), a fixing hole (14) matching with the connection hole (32) is provided at the end of the heat sink (12) of the heat sink (1), and the lens (4), the substrate (3) and the heat sink (1) are connected and fixed by screws passing through the screw holes (42), the connection holes (32) and the fixing holes (14) in sequence.

2. The LED lamp module according to claim 1, characterized in that: A limiting ring (21) is provided at one end of the heat dissipation column (2), and the limiting ring (21) is connected to the base plate (3) in a limiting manner.

3. The LED lamp module according to claim 1, characterized in that: The light source is an SMD light source or a COB light source.

4. The LED lamp module according to claim 1, characterized in that: The heat dissipation column (2) adopts a phase change heat transfer structure, and the heat dissipation fins (12) are distributed radially with the intermediate body (11) as the center.

5. An assembled LED lamp, comprising the LED lamp module according to any one of claims 1 to 4, characterized in that: The LED lamp modules are spliced ​​into assembled LED lamps using connectors (5).

6. The LED lamp module according to claim 5, characterized in that: The connecting member (5) comprises a strip-shaped body (51), hollow grooves (52) are provided on the left and right sides of the strip-shaped body (51), and connecting grooves (53) are provided on the upper and lower sides of the strip-shaped body (51), and the hollow grooves (52) and connecting grooves (53) are distributed along the axial direction of the strip-shaped body (51).

7. The LED lamp module according to claim 6, characterized in that: The connecting grooves (53) are provided in two groups and are symmetrically distributed on the connecting member (5).

8. The LED lamp module according to claim 6, characterized in that: The connection groove (53) is an inverted "T"-shaped structure, and is connected and fixed to the connection terminals (131) symmetrically distributed on both sides of the heat dissipation fins (13) in the heat sink (1) through the "T"-shaped structure.

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