A heat sink assembly for fixing electronic components

Abstract

This invention provides a heat sink assembly for fixing electronic components. When assembling or disassembling electronic components, simply overcome the locking force of the locking structure and rotate the rotating frame in the opposite direction around the heat sink it is hinged to, creating a gap between the rotating frame and the heat sink. This allows the electronic component to be removed from between the heat sink and the clamping member, or the electronic component to be inserted between the heat sink and the clamping member. Then, release the locking structure, causing it to rotate the rotating frame in the forward direction, so that the clamping member presses and fixes the electronic component onto the heat sink. Compared to the screw-fixing method in the prior art, this invention applies a locking force to the rotating frame through the locking structure, causing it to rotate in the forward direction, thus pressing and fixing the electronic component onto the heat sink. Overcoming the locking force of the locking structure allows the electronic component to be removed from the heat sink, making the assembly and disassembly of electronic components much more convenient.

Description

Technical Field

[0001] The invention relates to a radiator assembly for fixing electronic components. Background Art

[0002] At present, the low-voltage power distribution user side is equipped with a comprehensive power quality management device, and the core of the device is the comprehensive power quality management module. In order to ensure the stable operation of the module, the design of key components in the module is extremely important. The core electronic component of the entire module is the MOS tube. The MOS tube has the characteristics of small size and high heat generation. The comprehensive management module is equipped with a MOS tube heat dissipation device to ensure good heat dissipation of the MOS tube to ensure its normal operation.

[0003] In the prior art, for example, the MOS tube heat dissipation installation device disclosed in the Chinese utility model patent with authorization announcement number CN209266393U directly fixes the MOS tube on the heat sink with screws, or the heat dissipation structure of the transistor disclosed in the Chinese utility model patent with authorization announcement number CN203774288U uses a fixing block to press-fit multiple transistors, and then fixes the fixing block on the heat sink with screws to install the transistor on the heat sink. However, both structures adopt the screw fixing assembly method, which has low assembly efficiency and is extremely inconvenient to disassemble and assemble. Summary of the invention

[0004] The object of the present invention is to provide a heat sink assembly for fixing electronic components, so as to solve the technical problems of low assembly efficiency and inconvenient assembly and disassembly when fixing electronic components with screws in the prior art.

[0005] To achieve the above object, the technical solution of the present invention for fixing the heat sink assembly for the electronic components to be cooled is:

[0006] A heat sink assembly for fixing electronic components comprises a heat sink for mounting electronic components for cooling the components; a rotating frame hingedly mounted on the heat sink; a pressing piece arranged on the rotating frame for pressing the electronic components; and a locking structure drivingly connected between the heat sink and the rotating frame and capable of applying a locking force to the rotating frame to drive the rotating frame to rotate in a positive direction, thereby driving the rotating frame to rotate in a positive direction so that the pressing piece presses and fixes the electronic components on the heat sink.

[0007] The beneficial effect of the present invention is that when disassembling and assembling electronic components, it is only necessary to overcome the locking force of the locking structure and rotate the rotating frame in the opposite direction around the heat sink to which it is hingedly assembled, so that a gap is formed between the rotating frame and the heat sink, thereby being able to take out the electronic components between the heat sink and the pressing piece, or to load the electronic components between the heat sink and the pressing piece, and then release the locking structure, so that the locking structure drives the rotating frame to rotate forward, so that the pressing piece presses and fixes the electronic components on the heat sink, thereby improving the assembly efficiency of the electronic components on the heat sink. Compared with the method of fixing electronic components with screws in the prior art, the present invention applies a locking force to the rotating frame through the locking structure to drive it to rotate forward, so that the electronic components are pressed and fixed on the heat sink, and the locking force of the locking structure is overcome, so that the electronic components can be removed from the heat sink, thereby making the disassembly and assembly of the electronic components more convenient.

[0008] Furthermore, the locking structure includes an elastic member, which is transmission-connected between the heat sink and the rotating frame to apply an elastic locking force to the rotating frame.

[0009] Beneficial effect: The elastic member can automatically reset the rotating frame through its elastic locking force, making the use of the radiator assembly simpler and more convenient.

[0010] Furthermore, the locking structure also includes an unlocking lifting rod, which is guided and linearly assembled on the radiator, and the elastic member is transmission-connected between the radiator and the unlocking lifting rod so as to apply an elastic locking force to the rotating frame through the unlocking lifting rod, and the unlocking lifting rod is transmission-connected to the rotating frame so that the unlocking lifting rod drives the rotating frame to rotate in the opposite direction to achieve unlocking.

[0011] Beneficial effect: the unlocking lifting rod is operated to drive the rotating frame to rotate in the opposite direction, which can make the reverse unlocking operation of the rotating frame more convenient.

[0012] Furthermore, the elastic member is a compression spring sleeved on the unlocking lifting rod.

[0013] Beneficial effect: the compression spring is sleeved on the unlocking lifting rod, so that the unlocking lifting rod can guide the compression spring, thereby protecting the compression spring.

[0014] Furthermore, a slider is fixedly mounted on the end of the unlocking lifting rod, and the slider is movably assembled with the rotating frame, so that when the unlocking lifting rod drives the rotating frame to rotate through the slider, the slider and the rotating frame move relative to each other to ensure normal rotation of the rotating frame.

[0015] Beneficial effect: when the unlocking lifting rod moves vertically up and down, the slider can slide on the rotating frame to adjust the relative position of the unlocking lifting rod and the rotating frame, thereby ensuring that the rotating frame can rotate normally.

[0016] Furthermore, the unlocking lifting rod is equipped with a fastening adjustment piece which can be adjusted in the up-down direction, and the fastening adjustment piece is engaged with the lower end stop of the compression spring.

[0017] Beneficial effect: By adjusting the position of the fastening adjustment piece on the unlocking lifting rod, the compression amount of the compression spring can be adjusted, thereby adjusting the pressing force of the electronic components.

[0018] Furthermore, the locking structure is a locking screw, the locking screw is spirally assembled on the heat sink, and the lower end of the locking screw is movably connected to the rotating frame so that the locking screw drives the rotating frame to swing back and forth during the rotation process.

[0019] Beneficial effect: By spirally rotating the locking screw, the rotating frame is driven to rotate forward or reversely. After the locking screw is rotated into place, the position of the rotating frame is relatively fixed without having to operate the locking screw all the time, which can facilitate the operation of the operator.

[0020] Furthermore, a plurality of electronic components are mounted and fixed on the heat sink, and the rotating frame, the pressing member and the locking structure are respectively provided corresponding to each electronic component.

[0021] Beneficial effect: Each electronic component is provided with a rotating frame, a pressing piece and a locking structure, so that each electronic component can be disassembled and assembled individually, making the operation of a single electronic component more convenient.

[0022] Furthermore, the rotating frame and the pressing member are hingedly assembled together.

[0023] Beneficial effect: The pressing piece can be rotated relative to the rotating frame, so that the pressing piece can adjust its angle during the process of pressing the electronic components, so that the pressing piece can be pressed more closely on the electronic components.

[0024] Furthermore, the pressing member comprises a pressing plate, and a plurality of buffering presser feet are evenly distributed on the pressing plate.

[0025] Beneficial effect: ensure that electronic components are evenly compressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of a heat sink assembly equipped with a MOS tube according to an embodiment of the present invention;

[0027] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0028] Figure 3 for Figure 1The structural diagram of the radiator;

[0029] Figure 4 for Figure 1 Schematic diagram of the structure of the fixing fixture;

[0030] Figure 5 for Figure 1 Schematic diagram of the structure of a medium-pressure connector.

[0031] Description of reference numerals:

[0032] 1-heat sink, 2-pull ring screw, 3-compression spring, 4-nut, 5-slider, 6-rotating frame, 60-first hinge hole, 61-sliding hole, 62-through hole, 63-third hinge hole, 7-crimping part, 70-buffer presser foot, 71-crimping plate, 72-fourth hinge hole, 8-MOS tube, 9-substrate, 10-guide circular hole, 11-fin, 12-second hinge hole. DETAILED DESCRIPTION

[0033] The embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0034] The specific embodiment of the heat sink assembly for fixing electronic components provided by the present invention is as follows:

[0035] like Figures 1 to 5 As shown, the electronic component to be cooled is a MOS tube 8, and the radiator assembly includes a radiator 1. The radiator 1 is a T-shaped radiator. The radiator 1 is formed by extrusion of an aluminum profile. The radiator 1 consists of a substrate 9 and fins 11. Both sides of the substrate 9 are smooth planes with a thickness of 10 mm. The MOS tube 8 is closely attached to the planes on the left and right sides of the substrate, thereby realizing the heat dissipation of the MOS tube 8. The fins 11 are distributed on the upper end of the radiator 1 for heat dissipation.

[0036] A rotating frame 6 is hingedly mounted on the radiator 1, and the rotating frame 6 is arc-shaped. A first hinge hole 60 is provided on the rotating frame 6, and a second hinge hole 12 is provided on the radiator 1. A hinge shaft is inserted between the first hinge hole 60 and the second hinge hole 12 to hinge the rotating frame 6 to the radiator 1.

[0037] A pressing member 7 is provided at the lower end of the rotating frame 6 for pressing the electronic components. The pressing member 7 is hinged on the rotating frame 6, and a fourth hinge hole 72 is provided on the pressing member 7. The rotating frame 6 is provided with a third hinge hole 63. A hinge shaft is inserted between the third hinge hole 63 and the fourth hinge hole 72 to hinge the rotating frame 6 and the pressing member 7 together. The pressing member 7 also includes a pressing plate 71 and buffer presser feet 70 evenly distributed at the four corners of the pressing plate 71. The buffer presser feet 70 are made of rubber or plastic.

[0038] A locking structure is also provided between the heat sink 1 and the rotating frame 6. The locking structure applies a locking force to the rotating frame 6 to drive it to rotate in the forward direction, so as to press and fix the MOS tube 8 on the heat sink 1, and overcome the locking force of the locking structure, so that the locking structure drives the rotating frame 6 to rotate in the reverse direction to achieve unlocking.

[0039] Among them, the locking structure includes an unlocking pull rod, which is a pull ring screw 2. A guide circular hole 10 is arranged on the fin 11 of the radiator 1. The pull ring screw 2 is assembled on the guide circular hole 10 on the radiator 1 in a guided straight-moving manner along the up and down directions. The locking structure also includes a compression spring 3 to apply an elastic locking force to the rotating frame 6. The compression spring 3 is mounted on the pull ring screw 2.

[0040] A tightening adjustment piece is installed on the pull ring screw 2 so that its position can be adjusted in the up and down directions. The tightening adjustment piece is a nut 4, which is spirally installed on the pull ring screw 2. The compression spring 3 is supported between the nut 4 and the fin 11 of the radiator 1. A slider 5 is threadedly installed on the lower end of the pull ring screw 2. The slider 5 is movably installed on the rotating frame 6, that is, the compression spring 3 directly applies elastic force to the nut 4, and the nut 4, the pull ring screw 2 and the slider 5 are an integrated structure, so that the elastic force of the compression spring 3 acts on the rotating frame 6 through the slider 5. The rotating frame 6 rotates forward under the elastic force of the compression spring 3, and then the MOS tube 8 is pressed against the radiator 1 through the clamping piece 7.

[0041] When the nut 4 is rotated, the compression amount of the compression spring 3 can be adjusted, which also adjusts the pressing force of the MOS tube 8 .

[0042] The rotating frame 6 is provided with a sliding hole 61 and a through hole 62 which is interconnected with the sliding hole 61. The slider 5 is clamped in the sliding hole 61 of the rotating frame 6 along the radial direction of the rotating frame 6, so that the slider 5 cannot move radially relative to the rotating frame 6, while the slider 5 can move in the sliding hole 61 along the circumferential direction of the rotating frame 6. The pull ring screw 2 passes through the through hole 62 and is threadedly fixed with the slider 5, so that the pull ring screw 2 can drive the rotating frame 6 to reciprocate through the slider 5 when it moves up and down. Since the slider 5 can slide in the sliding hole 61 along the circumferential direction of the rotating frame 6, when the pull ring screw 2 moves up and down, the slider 5 slides in the sliding hole 61 to adjust the relative position of the pull ring screw 2 and the rotating frame 6, thereby ensuring the normal rotation of the rotating frame 6.

[0043] A plurality of MOS tubes 8 are mounted and fixed on both sides of the left and right sides of the substrate 9 of the heat sink 1, and a set of rotating frames 6, pressing members 7 and locking structures are respectively provided for each MOS tube 8, wherein the locking structure includes a compression spring 3, a pull ring screw 2, a nut 4 and a slider 5, so that each MOS tube can be individually disassembled and assembled, thereby facilitating the operation of a single MOS tube.

[0044] When using the radiator assembly, the pull ring screw 2 is lifted upward to compress the compression spring 3. The pull ring screw 2 drives the rotating frame 6 to rotate in the opposite direction through the slider 5, so that the clamping piece 7 is away from the radiator 1. At this time, the MOS tube 8 between the clamping piece 7 and the radiator 1 can be taken out, or a MOS tube 8 can be installed between the clamping piece 7 and the radiator 1, and then the pull ring screw 2 is loosened. The pull ring screw 2 will move downward under the action of the elastic restoring force of the compressed compression spring 3, and the slider 5 will also drive the rotating frame 6 to rotate downward to compress the MOS tube 8. The disassembly and assembly operation of the MOS tube 8 can be completed by pulling the pull ring screw 2, which improves the assembly efficiency of the MOS tube and makes the disassembly and assembly operation simpler and more convenient.

[0045] In this embodiment, the locking structure is an elastic part. In other embodiments, the elastic part may not be provided. In this case, the locking structure may be a locking screw, which is directly threadedly assembled on the radiator. The locking screw may be a screw such as a cross slot screw or a hexagon socket screw. The locking screw can be turned by a cross screwdriver or a hexagonal wrench. The lower end of the locking screw is movably connected to the rotating frame through a slider. By spirally rotating the locking screw, the rotating frame can be driven to rotate back and forth.

[0046] In this embodiment, the elastic member is a compression spring mounted on the pull ring screw. In other embodiments, the compression spring and the pull ring screw may not be provided. In this case, a torsion spring is installed on the hinge shaft of the rotating frame. The torsion spring is arranged between the radiator and the rotating frame, so that the rotating frame can be directly operated to rotate in the reverse direction to achieve unlocking. When the rotating frame is released, the rotating frame will rotate forward under the elastic action of the torsion spring and automatically reset.

[0047] In this embodiment, the fastening adjustment member is a nut. In other embodiments, the fastening adjustment member may also be a pin. In this case, multiple pin holes are arranged along the axial direction of the pull ring screw, and the compression spring is arranged between the pin and the radiator. Pin holes in different positions can be selected to change the compression amount of the compression spring.

[0048] In this embodiment, the slider is movably assembled on the rotating frame. In other embodiments, a connecting rod can be hinged between the rotating frame and the pull ring screw, one end of the connecting rod is hinged on the rotating frame, and the other end of the connecting rod is hinged to the lower end of the pull ring screw to form a transmission connection mechanism, so that the pull ring screw can drive the rotating frame to rotate by pulling the connecting rod.

[0049] In this embodiment, the pressing member is hingedly assembled on the rotating frame. In other embodiments, the pressing member may also be fixedly assembled on the rotating frame.

[0050] In this embodiment, the rotating frame is in an arc shape. In other embodiments, the rotating frame may also be in other shapes such as an angle shape.

[0051] In this embodiment, the radiator is a T-shaped radiator. In other embodiments, the radiator may also be an F-shaped radiator.

[0052] In this embodiment, the electronic component is a MOS tube. In other embodiments, the electronic component may also be other semiconductor tubes with heat dissipation requirements.

Claims

1. A heat sink assembly for fixing electronic components, comprising: Radiators, used to mount electronic components to cool them; It is characterized in that A rotating frame, hingedly assembled on the radiator; A pressing member, arranged on the rotating frame, for pressing the electronic components; The locking structure includes an unlocking lifting rod and a compression spring sleeved on the unlocking lifting rod, the compression spring is transmission-connected between the heat sink and the rotating frame to apply an elastic locking force to the rotating frame through the unlocking lifting rod, thereby driving the rotating frame to rotate forward so that the pressing member presses and fixes the electronic components on the heat sink; the unlocking lifting rod is guided and linearly assembled on the heat sink, and the unlocking lifting rod is transmission-connected with the rotating frame so that the unlocking lifting rod drives the rotating frame to rotate in the opposite direction to achieve unlocking; a slider is fixedly assembled on the end of the unlocking lifting rod, and the slider is movably assembled with the rotating frame so that when the unlocking lifting rod drives the rotating frame to rotate through the slider, the slider and the rotating frame move relative to each other to ensure the normal rotation of the rotating frame.

2. The heat sink assembly for fixing electronic components according to claim 1, characterized in that: The unlocking lifting rod is equipped with a fastening adjustment piece which can be adjusted in the up and down directions, and the fastening adjustment piece is matched with the lower end of the compression spring.

3. The heat sink assembly for fixing electronic components according to claim 1 or 2, characterized in that: A plurality of electronic components are mounted and fixed on the heat sink, and the rotating frame, the pressing member and the locking structure are respectively arranged corresponding to each electronic component.

4. The heat sink assembly for fixing electronic components according to claim 1 or 2, characterized in that: The rotating frame and the pressing member are hingedly assembled together.

5. The heat sink assembly for fixing electronic components according to claim 1 or 2, characterized in that: The pressing member comprises a pressing plate, and a plurality of buffering pressing feet are evenly distributed on the pressing plate.

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