Display substrate and method for manufacturing the same, and display device

Abstract

Provided are a display substrate and a manufacturing method thereof, and a display device. Since the edge region (A2) of the base substrate (01) includes not only a plurality of first grooves (C1) penetrating at least one inorganic film layer (02), but also an organic layer (03) covering the plurality of first grooves (C1), the hardness of the organic material forming the organic layer (03) is greater than the hardness of the inorganic material forming the inorganic film layer (02). Therefore, the impact resistance of the display substrate is effectively improved by the combination of soft and hard, and the problem of cracks extending to the packaging region (A1) causing packaging failure is effectively avoided, thereby ensuring the quality of the display substrate. In addition, by making the orthographic projections of the plurality of first grooves (C1) on the base substrate (01) not overlap with the binding region (A21), it is possible to avoid the metal wiring located in the binding region (A21) from being exposed and corroded when the first grooves (C1) are formed by an etching process, thereby ensuring the yield of the display substrate.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a manufacturing method thereof, and a display device. Background Art

[0002] Active matrix organic light emitting diode (AMOLED) display substrates are widely used in the current display field due to their advantages such as thin thickness, self-luminescence, high contrast, wide color gamut, bendability, and ability to be manufactured on flexible substrates.

[0003] However, due to the poor impact resistance of the AMOLED display substrate, cracks are prone to appear on the edge of the AMOLED display substrate during the manufacturing or transportation process. In addition, since the AMOLED display substrate uses organic light-emitting materials, which are highly sensitive to water vapor or oxygen, when the crack extends to the display area of ​​the AMOLED display substrate, water vapor or oxygen in the air is likely to intrude into the display area through the crack, causing black spots on the display substrate, affecting the quality of the display substrate. Summary of the invention

[0004] The present disclosure provides a display substrate and a manufacturing method thereof, and a display device. The technical solution is as follows:

[0005] In one aspect, a display substrate is provided, the display substrate comprising:

[0006] A substrate substrate, the substrate substrate having a packaging area and an edge area located around the packaging area, the edge area including a binding area on a side where at least one edge of the substrate substrate is located;

[0007] A plurality of inorganic film layers are located on one side of the base substrate and are stacked;

[0008] A plurality of first grooves are located in the edge region and are sequentially spaced apart in a direction away from the packaging region and extend along the periphery of the base substrate, wherein each of the first grooves penetrates at least one inorganic film layer among the plurality of inorganic film layers, and the orthographic projections of the plurality of first grooves on the base substrate do not overlap with the binding region;

[0009] The organic layer covers the plurality of first grooves.

[0010] Optionally, the at least one inorganic film layer includes: a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate.

[0011] Optionally, the plurality of inorganic film layers further include: a buffer layer located between the base substrate and the at least one inorganic film layer, the buffer layer including a first buffer pattern and a second buffer pattern formed integrally;

[0012] The orthographic projection of the first buffer pattern on the base substrate covers the packaging area and a portion of the edge area, the second buffer pattern is located in the edge area, and the thickness of the first buffer pattern is greater than the thickness of the second buffer pattern;

[0013] Among them, the orthographic projection of the organic layer on the buffer layer partially overlaps with the second buffer pattern, and the orthographic projection of the side of the first groove farthest from the encapsulation area among the multiple first grooves close to the encapsulation area on the buffer layer overlaps with the boundary line between the first buffer pattern and the second buffer pattern.

[0014] Optionally, the inorganic film layer between each two adjacent first grooves constitutes a blocking portion; the plurality of inorganic film layers further include: a buffer layer located between the base substrate and the at least one inorganic film layer, the buffer layer including a first buffer pattern and a second buffer pattern formed integrally;

[0015] The orthographic projection of the first buffer pattern on the base substrate covers the packaging area and a portion of the edge area, the second buffer pattern is located in the edge area, and the thickness of the first buffer pattern is greater than the thickness of the second buffer pattern;

[0016] The orthographic projection of the organic layer on the buffer layer partially overlaps with the second buffer pattern, and the orthographic projection of the side of the blocking portion farthest from the encapsulation area on the buffer layer farthest from the encapsulation area overlaps with the boundary line between the first buffer pattern and the second buffer pattern.

[0017] Optionally, the thickness of the second buffer pattern is 20% of the thickness of the first buffer pattern.

[0018] Optionally, the plurality of inorganic film layers include: a barrier layer, a buffer layer, a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate;

[0019] The at least one inorganic film layer includes: the interlayer dielectric layer, the gate insulating layer and a portion of the buffer layer.

[0020] Optionally, the plurality of inorganic film layers include: a barrier layer, a buffer layer, a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate;

[0021] The at least one inorganic film layer includes: the interlayer dielectric layer, the gate insulating layer, the buffer layer and a portion of the barrier layer.

[0022] Optionally, the orthographic projection of each of the first grooves on the substrate is a ring with an opening;

[0023] The ring shape surrounds the packaging area, and the orthographic projection of the opening on the substrate overlaps with the binding area.

[0024] Optionally, the substrate further has a display area, and the packaging area surrounds the display area;

[0025] The shape of a side of the ring away from the binding area matches the shape of a side of the display area away from the binding area.

[0026] Optionally, the encapsulation area includes a display area and a peripheral area surrounding the display area, and the ring includes: a first side edge, a second side edge, a third side edge and a fourth side edge connected in sequence;

[0027] The distance between the first side and the side of the peripheral area away from the display area is equal to the distance between the third side and the side of the peripheral area away from the display area;

[0028] The distance between the intersection of the first side and the second side and the side of the peripheral area away from the display area is smaller than the distance between the intersection of the first side and the fourth side and the side of the peripheral area away from the display area;

[0029] The distance between the intersection of the third side and the second side and the side of the peripheral area away from the display area is smaller than the distance between the intersection of the third side and the fourth side and the side of the peripheral area away from the display area;

[0030] The first side and the third side are arranged opposite to each other, the second side and the fourth side are arranged opposite to each other, the fourth side is located at the side where the binding area is located, and the fourth side is provided with the opening.

[0031] Optionally, among the angles formed by every two adjacent sides of the ring, at least one angle is a rounded angle.

[0032] Optionally, the fourth side includes a first portion and a second portion separated by the opening;

[0033] An angle formed by the first side and the first portion, and an angle formed by the third side and the second portion are both greater than or equal to 90 degrees.

[0034] Optionally, the distances between each part of the ring and the edge of the substrate are equal.

[0035] Optionally, the binding area includes a routing fan-out area and a welding area, and the welding area overlaps with the opening;

[0036] Both ends of the first groove are located at the edge of the side of the substrate close to the binding area, and the distance between each of the two ends of the first groove and the welding area is 5 to 10 micrometers.

[0037] Optionally, the ring is surrounded by at least one of a bar and an arc.

[0038] Optionally, the plurality of first grooves are arranged at equal intervals.

[0039] Optionally, the substrate is a flexible substrate, the binding area includes: a first sub-area, a bending area, and a second sub-area which are sequentially away from the packaging area, and the welding area in the binding area is located in the second sub-area;

[0040] The orthographic projections of two ends of the first groove on the base substrate do not overlap with the bending region, and are located on a side of the first sub-region close to the bending region.

[0041] Optionally, the plurality of inorganic film layers further have a second groove, and the orthographic projection of the second groove on the base substrate covers the bending area;

[0042] The multiple inorganic film layers include: a barrier layer, a buffer layer, a gate insulation layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate, and the second groove penetrates the interlayer dielectric layer, the gate insulation layer, the buffer layer and part of the barrier layer.

[0043] Optionally, the display substrate further includes: a first groove among the multiple first grooves close to the packaging area, a side close to the packaging area, and a first groove among the multiple first grooves far from the packaging area, a side close to the packaging area, are spaced 60 microns apart.

[0044] Optionally, the packaging area includes a display area and a peripheral area surrounding the display area, and the display substrate further includes: a blocking dam located in the peripheral area;

[0045] An orthographic projection of the organic layer on the base substrate does not overlap with an orthographic projection of the barrier dam on the base substrate.

[0046] In another aspect, a method for manufacturing a display substrate is provided, the method comprising:

[0047] Providing a substrate substrate, the substrate substrate having a packaging area and an edge area located around the packaging area, the edge area including a binding area on a side where at least one edge of the substrate substrate is located;

[0048] Using inorganic materials to form a plurality of stacked inorganic film layers on one side of the base substrate;

[0049] A plurality of first grooves are formed in the edge region and in a direction away from the packaging region, which are spaced apart from each other and extend along the periphery of the base substrate, each of the first grooves penetrates at least one inorganic film layer among the plurality of inorganic film layers, and the orthographic projections of the plurality of first grooves on the base substrate do not overlap with the binding region;

[0050] An organic layer covering the plurality of first grooves is formed by using an organic material.

[0051] In yet another aspect, a display device is provided, comprising: the display substrate as described in the above aspect.

[0052] The beneficial effects brought by the technical solution provided by the present disclosure may at least include:

[0053] In summary, the embodiments of the present disclosure provide a display substrate and a manufacturing method thereof, and a display device. Since the edge region of the base substrate includes not only a plurality of first grooves penetrating at least one inorganic film layer, but also an organic layer covering the plurality of first grooves, wherein the hardness of the organic material forming the organic layer is greater than the hardness of the inorganic material forming the inorganic film layer. Therefore, the impact resistance of the display substrate is effectively improved by a combination of soft and hard, and a buffering effect is played on the external force exerted on the display substrate, effectively avoiding the problem of cracks extending to the packaging area and causing packaging failure, thereby ensuring the quality of the display substrate. In addition, by making the orthographic projections of the plurality of first grooves on the base substrate not overlap with the binding area, it is possible to avoid the metal wiring located in the binding area from being exposed and corroded when the first grooves are formed by an etching process, thereby ensuring the yield of the display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0055] Figure 1 is a top view of a display substrate provided by an embodiment of the present disclosure;

[0056] Figure 2is a cross-sectional view of a display substrate provided by an embodiment of the present disclosure;

[0057] Figure 3 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure;

[0058] Figure 4 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure;

[0059] Figure 5 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure;

[0060] Figure 6 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure;

[0061] Figure 7 is a top view of another display substrate provided by an embodiment of the present disclosure;

[0062] Figure 8 is a top view of another display substrate provided by an embodiment of the present disclosure;

[0063] Fig. 9 is a top view of another display substrate provided by an embodiment of the present disclosure;

[0064] Fig.10 is a top view of another display substrate provided by an embodiment of the present disclosure;

[0065] Fig.11 is a top view of a first annular structure provided by an embodiment of the present disclosure;

[0066] Fig.12 It is a flow chart of a method for manufacturing a display substrate provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0067] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.

[0068] Figure 1 It is a top view of a display substrate provided by an embodiment of the present disclosure. Figure 2 yes Figure 1 The cross-sectional view of the display substrate in the MM' direction is shown in FIG. Figure 1 and Figure 2 As shown, the display substrate may include: a base substrate 01, a plurality of inorganic film layers 02, a plurality of first grooves C1, and an organic layer 03. The inorganic film layer 02 may be made of an inorganic material, and the organic layer 03 may be made of an organic material.

[0069] refer to Figure 1 and Figure 2It can be seen that the substrate 01 may have a packaging area A1 and an edge area A2 located around the packaging area A1. The edge area A2 includes a binding area A21 on the side where at least one edge of the substrate 01 is located, for example, Figure 1 Only the binding area A21 on one side is shown.

[0070] The plurality of inorganic film layers 02 may be located on one side of the base substrate 01 and stacked, for example Figure 2 Only four inorganic film layers stacked on one side of the base substrate 01 are shown.

[0071] The plurality of first grooves C1 may be located in the edge region A2 and spaced apart in sequence in a direction away from the packaging region A1 and extend along the periphery of the base substrate 01 . For example, Figure 2 Four first grooves C1 extending along the periphery of the base substrate 01 are shown. Figure 1 A top view of two first grooves C1 is shown.

[0072] Each first groove C1 may penetrate at least one of the plurality of inorganic film layers 02, and the orthographic projections of the plurality of first grooves C1 on the base substrate 01 do not overlap with the binding area A21. The organic layer 03 may cover the plurality of first grooves C1.

[0073] Since the plurality of first grooves C1 are located in the edge region A2 and there is a gap between the edge region A1, the plurality of first grooves C1 can block cracks appearing at the edge of the display substrate and prevent the cracks from extending to the encapsulation region A1. Since the plurality of first grooves C1 can block the extension of cracks, the inorganic film layer between two adjacent first grooves C1 can constitute a blocking portion, which can also be called a crack dam.

[0074] Optional, reference Figure 1 and Figure 2 It can also be seen that the base substrate 01 may further include a display area A11, and the packaging area A1 may include the display area A11 and a peripheral area A12 surrounding the display area A11. Figure 2 The display area A11 may also be covered with the plurality of inorganic film layers 02. The edge area A2 may be a ring-shaped area surrounding the packaging area A1. The binding area A21 may be located on a side of the edge area A2 close to a flexible printed circuit board (FPC) or a chip on film (COF).

[0075] In summary, the embodiments of the present disclosure provide a display substrate. Since the edge region of the base substrate includes not only a plurality of first grooves penetrating at least one inorganic film layer, but also an organic layer covering the plurality of first grooves, wherein the hardness of the organic material forming the organic layer is greater than the hardness of the inorganic material forming the inorganic film layer. Therefore, the impact resistance of the display substrate is effectively improved by the combination of soft and hard, and a buffering effect is played on the external force exerted on the display substrate, which effectively avoids the problem of cracks extending to the packaging area and causing packaging failure, thereby ensuring the quality of the display substrate. In addition, by making the orthographic projections of the plurality of first grooves on the base substrate not overlap with the binding area, it is possible to avoid the metal wiring located in the binding area from being exposed and corroded when the first grooves are formed by the etching process, thereby ensuring the yield of the display substrate.

[0076] Optionally, in the disclosed embodiment, the orthographic projection of the organic layer 03 on the base substrate 01 may not overlap with the binding area A21. Accordingly, the problem that the organic layer covers the welding area in the binding area, causing the metal traces in the binding area to fail to bind normally can be avoided.

[0077] In the embodiment of the present disclosure, the multiple stacked inorganic film layers may cover the encapsulation area A1 and the edge area A2. For example, before forming the multiple first grooves C1, multiple stacked inorganic film layers covering the encapsulation area A1 and the edge area A2 may be formed on the base substrate 01. Then, the portion of at least one inorganic film layer located in the edge area A2 may be etched to obtain the multiple first grooves C1.

[0078] Figure 3 FIG. 1 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure. Figure 3 As shown, the display substrate includes: four inorganic film layers 02 located on one side of the base substrate 01, and the four inorganic film layers 02 may include: a barrier layer 021, a buffer layer 022, a gate insulator (GI) 023 and an inter-level dielectric (ILD) 024 stacked in sequence in a direction away from the base substrate 01. By first forming the barrier layer 021 made of an inorganic material on the side away from the base substrate 01, water vapor or oxygen can be effectively blocked from entering the base substrate 01, thereby improving the water barrier, oxygen barrier and anti-scratch properties of the base substrate 01.

[0079] As an optional implementation, refer to Figure 3Among the multiple inorganic film layers 02, at least one inorganic film layer penetrated by each first groove C1 may include: a gate insulating layer 023 and an interlayer dielectric layer 024 stacked in sequence in a direction away from the base substrate 01. That is, each first groove C1 may only penetrate the gate insulating layer 023 and the interlayer dielectric layer 024.

[0080] Accordingly, reference Figure 3 The barrier formed between two adjacent first grooves C1 can be formed by sequentially stacked gate insulation layer patterns and interlayer dielectric layer patterns, wherein the gate insulation layer pattern is located in the gate insulation layer 023 , and the interlayer dielectric layer pattern is located in the interlayer dielectric layer 024 .

[0081] For further reference, Figure 4 In the embodiment of the present disclosure, the plurality of inorganic film layers 02 may further include: a buffer layer 022 located between the base substrate 01 and at least one inorganic film layer 02. The buffer layer 022 may include a first buffer pattern 0221 and a second buffer pattern 0222 formed integrally.

[0082] Among them, reference Figure 4 It can be seen that the orthographic projection of the first buffer pattern 0221 on the base substrate 01 covers the packaging area A1 and part of the edge area A2, and the second buffer pattern 0222 is located in the edge area A2, that is, the second buffer pattern 0222 is close to the edge of the base substrate 01 relative to the first buffer pattern 0221, and the thickness d1 of the first buffer pattern 0221 is greater than the thickness d2 of the second buffer pattern 0222.

[0083] The orthographic projection of the organic layer 03 on the buffer layer 022 partially overlaps with the second buffer pattern 0222. The orthographic projection of the first groove C1a farthest from the encapsulation area A1 (i.e., the outermost first groove C1a) among the plurality of first grooves C1 is close to the side of the encapsulation area A1, and overlaps with the boundary line between the first buffer pattern 0221 and the second buffer pattern 0222 on the buffer layer 022.

[0084] Since the inorganic film layer between each two adjacent first grooves C1 can form a barrier, Figure 4 As shown, the orthographic projection of the side of the barrier B1 farthest from the encapsulation area A1 (ie, the outermost barrier B1 ) away from the encapsulation area A1 on the buffer layer 022 overlaps with the boundary line between the first buffer pattern 0221 and the second buffer pattern 0222 .

[0085] After forming each functional film layer on the base substrate 01, the base substrate 01 needs to be cut at the edge region A2 of the base substrate 01 to obtain a display substrate. Therefore, by forming a second buffer pattern 0222 with a smaller thickness on the side of the edge region A2 away from the packaging region A1, the probability of the edge of the display substrate being broken due to cutting can be effectively reduced, thereby preventing the break from extending to the packaging region and causing packaging failure. Accordingly, the problem of water vapor or oxygen invading the display region and causing black spots on the display substrate can be avoided, further improving the yield of the display substrate.

[0086] Furthermore, since the first groove C1 (i.e., the outermost first groove C1) of the multiple first grooves C1 farthest from the packaging area A1 is close to the side of the packaging area A1 and overlaps with the boundary line between the first buffer pattern 0221 and the second buffer pattern 0222, that is, the orthographic projection of the multiple first grooves C1 on the buffer layer 022 only overlaps with the first buffer pattern 0221, therefore, by making the orthographic projection of the organic layer 03 on the buffer layer 022 partially overlap with the second buffer pattern 0222, it can be ensured that the organic layer 03 completely covers the blocking portion formed between the multiple first grooves C1, thereby further ensuring the impact resistance of the display substrate.

[0087] Optionally, in the embodiment of the present disclosure, the thickness d2 of the second buffer pattern 0222 may be 20% of the thickness d1 of the first buffer pattern 0221 .

[0088] For example, a buffer layer may be formed on the base substrate 01 first, and then the portion of the buffer layer away from the packaging area A1 may be etched. Alternatively, after forming a plurality of stacked inorganic film layers on the base substrate 01, the portion of the buffer layer away from the packaging area A1 may be etched, and the etching of the buffer layer may be performed simultaneously with the etching of the plurality of first grooves C1. The etching thickness of the buffer layer 022 may be 80% of the thickness of the buffer layer 022, and thus the first buffer pattern 0221 and the second buffer pattern 0222 formed integrally may be obtained.

[0089] As another optional implementation, Figure 5 FIG. 1 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure. Figure 5 As shown, among the multiple inorganic film layers, at least one inorganic film layer penetrated by each first groove C1 may include: an interlayer dielectric layer 024, a gate insulating layer 023, and a portion of the buffer layer 022. That is, each first groove C1 may penetrate the interlayer dielectric layer 024 and the gate insulating layer 023, and only pass through a portion of the buffer layer 022.

[0090] Accordingly, reference Figure 5The barrier formed between two adjacent first grooves C1 can be formed by sequentially stacking a buffer layer pattern, a gate insulation layer pattern and an interlayer dielectric layer pattern. The buffer layer pattern can be located in the buffer layer 022, the gate insulation layer pattern can be located in the gate insulation layer 023, and the interlayer dielectric layer pattern can be located in the interlayer dielectric layer 024.

[0091] As another optional implementation, Figure 6 FIG. 1 is a cross-sectional view of another display substrate provided by an embodiment of the present disclosure. Figure 6 As shown, among the multiple inorganic film layers, at least one inorganic film layer penetrated by each first groove C1 may include: an interlayer dielectric layer 024, a gate insulating layer 023, a buffer layer 022, and a portion of the barrier layer 021. That is, each first groove C1 may penetrate the interlayer dielectric layer 024, the gate insulating layer 023, and the buffer layer 022, and only pass through a portion of the barrier layer 021.

[0092] Accordingly, reference Figure 6 , the barrier formed between two adjacent first grooves can be formed by sequentially stacked barrier layer patterns, buffer layer patterns, gate insulation layer patterns and interlayer dielectric layer patterns. The barrier layer pattern can be located in the barrier layer 021, the buffer layer pattern can be located in the buffer layer 022, the gate insulation layer pattern can be located in the gate insulation layer 023, and the interlayer dielectric layer pattern can be located in the interlayer dielectric layer 024.

[0093] As another optional implementation, among the multiple inorganic film layers in the packaging area A1, at least one inorganic film layer penetrated by the first groove C1 may only include: the interlayer dielectric layer 024. That is, each first groove C1 may only penetrate the interlayer dielectric layer 024, and accordingly, the blocking portion formed between two adjacent first grooves C1 may be formed only by the interlayer dielectric layer pattern.

[0094] Optional, reference Figure 6 , the distance d3 between the side of the first groove C1 (i.e., the innermost first groove) close to the encapsulation area A1 among the plurality of first grooves C1 and the side of the first groove C1 (i.e., the outermost first groove) far from the encapsulation area A1 among the plurality of first grooves C1 and close to the encapsulation area A1 can be 60 microns. That is, when etching the portion of at least one inorganic film layer located in the edge area A2, etching can be started at a position 60 microns away from the edge of at least one inorganic film layer.

[0095] Figures 7 to 10 is a top view of various display substrates provided by embodiments of the present disclosure. Figures 7 to 10 As shown, the orthographic projection of each first groove C1 on the substrate 01 may be a ring with an opening. Figure 7, which shows a first groove C1 including two annular grooves with openings. Figures 8 to 10 , which are described by taking a first groove C1 closest to the packaging area A1 as an example, in the embodiment of the present disclosure, the inorganic film layer may include a plurality of first grooves C1.

[0096] refer to Figures 7 to 10 It can be seen that each ring (i.e., each first groove C1) can surround the packaging area A1, and the orthographic projection of each opening on the base substrate 01 can overlap with the binding area A21, that is, the width of each opening can be greater than the width of the binding area A21. By setting the first groove C1 in the shape of a ring to surround the packaging area A1, effective protection of the surrounding of the packaging area A1 can be achieved, further ensuring the quality of the display substrate.

[0097] Optional, reference Figure 1 , Figures 7 to 10 The base substrate 01 also has a display area A11. The shape of the side of the ring away from the binding area A21 can match the shape of the side of the display area A11 away from the binding area A21. Fig.10 , the side of the display area A11 away from the binding area A21 has a notch, that is, the middle of the side of the display area A11 away from the binding area A21 is recessed toward the side close to the binding area A21. Correspondingly, the side of the ring away from the binding area A21 also has a notch, that is, Fig.10 The middle part of the ring-shaped first groove C1 away from the binding area A21 is also recessed toward the side close to the binding area A21. The position, shape and size of the cutout on the side of the first groove C1 away from the binding area A21 and the cutout on the side of the display area A11 away from the binding area A21 can be the same.

[0098] Optionally, in the embodiments of the present disclosure, refer to Figure 8 The packaging area A1 may include a display area A11 and a peripheral area A12 surrounding the display area A11. The annular shape of the orthographic projection of the first groove C1 on the base substrate 01 may include: a first side C11, a second side C12, a third side C13 and a fourth side C14 connected in sequence.

[0099] The first side C11 and the third side C13 may be arranged opposite to each other, the second side C12 and the fourth side C14 may be arranged opposite to each other, the fourth side C14 may be located at the side where the binding area A21 is located, and the fourth side C14 may be provided with an opening, that is, referring to Figure 8, the fourth side C14 is divided into two sections by the opening. Optionally, the first side C11 and the third side C13 may be arranged in parallel, and the second side C12 and the fourth side C14 may be arranged in parallel.

[0100] like Figure 8 As shown, a distance d4 between the first side C11 and the side of the peripheral area A12 away from the display area A11 may be equal to a distance d5 between the third side C13 and the side of the peripheral area A12 away from the display area A11.

[0101] A distance d6 between an intersection point P1 of the first side C11 and the second side C12 and the side of the peripheral area A12 away from the display area A11 may be smaller than a distance d8 between an intersection point P2 of the first side C11 and the fourth side C14 and the side of the peripheral area A12 away from the display area A11. A distance d7 between an intersection point P3 of the third side C13 and the second side C12 and the side of the peripheral area A12 away from the display area A11 may be smaller than a distance d9 between an intersection point P4 of the third side C13 and the fourth side C14 and the side of the peripheral area A12 away from the display area A11.

[0102] Furthermore, the distance d6 between the intersection point P1 of the first side C11 and the second side C12 and the side of the peripheral area A12 away from the display area A11 may be equal to the distance d7 between the intersection point P3 of the third side C13 and the second side C12 and the side of the peripheral area A12 away from the display area A11; the distance d8 between the intersection point P2 of the first side C11 and the fourth side C14 and the side of the peripheral area A12 away from the display area A11 is equal to the distance d9 between the intersection point P4 of the third side C13 and the fourth side C14 and the side of the peripheral area A12 away from the display area A11. A distance d4 between the first side C11 and the side of the peripheral area A12 away from the display area A11, and a distance d5 between the third side C13 and the side of the peripheral area A12 away from the display area A11 may be smaller than a distance d6 between an intersection point P1 of the first side C11 and the second side C12 and the side of the peripheral area A12 away from the display area A11, and may be smaller than a distance d7 between an intersection point P3 of the third side C13 and the second side C12 and the side of the peripheral area A12 away from the display area A11.

[0103] That is, the spacing between the left and right sides of the ring and the side of the peripheral area A12 away from the display area A11 can be equal. The spacing between the two corners of the ring away from the binding area A21 and the side of the peripheral area A12 away from the display area A11 is equal. The spacing between the two corners of the ring close to the binding area A21 and the side of the peripheral area A12 away from the display area A11 is equal. The spacing between the two corners of the ring away from the binding area A21 and the side of the peripheral area A12 away from the display area A11 is smaller than the spacing between the two corners of the ring close to the binding area A21 and the side of the peripheral area A12 away from the display area A11. And the spacing between the left and right sides of the ring and the side of the peripheral area A12 away from the display area A11 is smaller than the spacing between the two corners of the ring away from the binding area A21 and the side of the peripheral area A12 away from the display area A11.

[0104] In the embodiment of the present disclosure, for each side of the ring, the distance between each side and the side of the peripheral area A12 away from the display area A11 may refer to: the shortest distance between the side and the side of the peripheral area A12 away from the display area A11.

[0105] Optionally, the distances between each part of the annular shape (ie, the first groove C1 ) and the edge of the substrate 01 may be equal. The distance may refer to the shortest distance between any part of the first groove C1 and the edge of the substrate 01 .

[0106] Optional, reference Figure 8 The fourth side C14 may include a first portion C141 and a second portion C142 separated by an opening. Among the angles formed by each two adjacent sides of the ring, at least one angle may be a rounded angle. Among the two sides forming the rounded angles, a section of each side close to the other side may be in an arc shape.

[0107] For example, refer to Figure 7 and Figure 8 , the angle α formed by the first side C11 and the second side C12, and the angle α formed by the third side C13 and the second side C12 can all be rounded. The angle α formed by the first side C11 and the first part C141 of the fourth side C14, and the angle α formed by the third side C13 and the second part C142 of the fourth side C14 can all be square angles. That is, each side in the first part C141 of the first side C11 and the fourth side C14, a section close to the other side can be straight. Each side in the second part C142 of the third side C13 and the fourth side C14, a section close to the other side can be straight.

[0108] For example, refer to Fig. 9 and Fig.10The ring shape may be a rectangle with one side open, and the angle α formed by each two adjacent sides may be a rounded corner.

[0109] Optionally, in the embodiment of the present disclosure, the angle formed by the first side C11 and the first portion C141, and the angle formed by the third side C13 and the second portion C142 may both be greater than or equal to 90 degrees.

[0110] For example, refer to Figure 7 , the angle α formed by the first side C11 and the first portion C141, and the angle α formed by the third side C13 and the second portion C142 may both be equal to 90 degrees, that is, both are right angles. Figures 8 to 10 , the angle α formed by the first side C11 and the first portion C141, and the angle α formed by the third side C13 and the second portion C142 may both be greater than 90 degrees, that is, both are obtuse angles.

[0111] In the embodiments of the present disclosure, reference Figure 7 and Figure 8 It can be seen that the bonding area A21 may include a bonding pad A211 and a routing fanout area A212. The bonding pad A211 overlaps with the positive projection of the opening K1 on the bonding area A21. Figure 8 The two ends of the first groove C1 are located exactly on the two sides of the welding area A211.

[0112] Furthermore, both ends of the first groove C1 are located at the edge of the side of the base substrate 01 close to the binding area A21, that is, Figure 7 The two ends of the first groove C1 are located at the lower edge M1 of the base substrate 01. The distance d0 between each of the two ends of the first groove C1 and the welding area A211 is 5 to 10 micrometers.

[0113] Optionally, in the embodiment of the present disclosure, the base substrate 01 may be a flexible substrate. That is, the base substrate 01 may be made of a flexible material. Fig. 9 and Fig.10 , the binding area A21 may include: a first sub-area A3, a bending area A4, and a second sub-area A5, and the portion of the base substrate 01 located in the bending area A4 may be bent. The first sub-area A3 is located on the front side of the display substrate, that is, the first sub-area A3 and the display area A11 are located on the same surface, and the second sub-area A5 is bent to the area on the back side of the display substrate, that is, the second sub-area A5 and the display area A11 are located on different surfaces. The welding area A211 in the binding area A21 may be located in the second sub-area A5, and the routing fan-out area A212 in the binding area A21 may be located in the first sub-area A3 and the bending area A4.

[0114] And, reference Fig. 9 and Fig.10 The orthographic projections of the two ends of the first groove C1 on the base substrate 01 do not overlap with the bending area A4 and are located on one side of the first sub-area A3 close to the bending area A4.

[0115] Since the hardness of inorganic materials is relatively low, and since the bending area A4 is realized by bending the base substrate using a special process after forming a plurality of first grooves C1, by arranging the orthographic projections of the plurality of first grooves C1 on the base substrate 01, which are located on the side of the first sub-area A3 close to the bending area A4, it is possible to avoid the blocking portion formed between two adjacent first grooves C1 from being broken when the bending area A4 is formed, thereby further ensuring the quality of the display substrate.

[0116] Optionally, the plurality of inorganic film layers included in the display substrate may further have a second groove, the orthographic projection of the second groove on the base substrate may cover the bending area A4, and the second groove may penetrate the interlayer dielectric layer 024, the gate insulating layer 023, the buffer layer 022, and part of the barrier layer 021. In other words, the second groove may penetrate the interlayer dielectric layer 024, the gate insulating layer 023, and the buffer layer 022, and only pass through part of the barrier layer 021.

[0117] For example, the interlayer dielectric layer 024, the gate insulating layer 023, the buffer layer 022 and the portion of the barrier layer 021 in the plurality of inorganic film layers located in the bending region A4 may be etched to obtain a second groove. Since the bending process of the base substrate 01 is performed after the formation of the plurality of inorganic film layers, the second groove is first formed in the bending region A4, that is, the inorganic film layer in the bending region A4 is first etched so that the film layer thickness on the base substrate 01 in the bending region A4 is thinner, which can facilitate the bending process.

[0118] Optionally, the inorganic film layer in the second sub-region A5 may include an interlayer dielectric layer 024 and a gate insulating layer 023, that is, the inorganic film layer in the second sub-region A5 may not be etched, and the inorganic film layer in the first sub-region A3 may not be etched. In addition, the pin (i.e., pin pin) at the welding area A211 may also include a source metal layer and a drain metal layer located on the side of the plurality of inorganic film layers 02 away from the base substrate 01, and the source metal layer and the source metal layer in the display region A11, and the drain metal layer and the drain metal layer in the display region A11 may be formed by a single patterning process.

[0119] It should be noted that the reference Figures 7 to 10, the edge area A2 of the base substrate 01 may also be provided with a cutting line L1 surrounding the first groove C1. After an inorganic film layer having a plurality of first grooves C1 is formed on one side of the base substrate 01, it may be cut along the cutting line L1 to obtain a display substrate. Accordingly, the shape of the ring matches the shape of the cutting line L1, that is, the first groove C1 in the shape of a ring may be designed along the shape of the cutting line L1.

[0120] Since cracks are likely to appear at the edge of the display substrate during the cutting operation, the first groove C1 is designed along the shape of the cutting line L1 to effectively block the cracks generated during the cutting operation, that is, to effectively prevent the extension of the cracks generated during the cutting operation.

[0121] Optionally, in the embodiment of the present disclosure, if Figures 3 to 7 As shown, the multiple first grooves C1 included in the display substrate can be arranged at equal intervals, that is, the interval between every two adjacent first grooves C1 can be a fixed value. By arranging multiple first grooves C1 at intervals, the extension of cracks can be further effectively avoided, ensuring the quality of the display substrate.

[0122] For example, refer to Figures 3 to 6 , which shows a first groove C1 including five ring-shaped grooves with openings. Figure 7 , which shows that the first grooves C1 include two annular grooves with openings.

[0123] Optionally, in the embodiment of the present disclosure, the ring may be surrounded by at least one of a bar shape and an arc shape. Figures 7 to 10 The ring is formed by a number of strip structures and a number of arc structures.

[0124] Fig.11 FIG. 1 is a top view of a first groove C1 in a ring shape with an opening provided by an embodiment of the present disclosure. Fig.11 As shown, the ring may be surrounded by a plurality of arc structures. For example, the orthographic projection of each side of the ring on the substrate 01 may be wavy.

[0125] refer to Fig.11 , assuming that when an external force acts on the annular first groove C1, the impact force in the first direction generated at a certain point P on the first groove C1 is F. The impact force F can be decomposed into an impact force in the second direction by the arc-shaped first groove C1, and the impact force F1 in the second direction satisfies: F1=F×sin(β), the second direction is perpendicular to the tangent direction of point P, and β is the angle between the tangent direction and the first direction.

[0126] According to the above analysis, since sin(β) is less than or equal to 1, for the ring formed by the arc, the impact force F1 in the second direction can be less than or equal to F. Compared with the strip, the ring formed by the arc is subjected to a lower impact force, and accordingly, the ability of the first groove C1 to prevent crack extension can be further improved, effectively reducing the risk of crack extension.

[0127] Optional, reference Figures 7 to 10 The encapsulation area A1 includes a display area A11 and a peripheral area A12 surrounding the display area A11. The display substrate may further include a barrier dam 04 located in the peripheral area A12. The barrier dam 04 may also be made of an organic material. The orthographic projection of the organic layer 03 on the base substrate 01 may not overlap with the orthographic projection of the barrier dam 04 on the base substrate 01.

[0128] Since the barrier dam 04 is located in the peripheral area A12, there will be a gap between the barrier dam 04 and the display area A11. Therefore, it can effectively prevent the organic material from flowing out of the packaging area A1 when the organic packaging film layer in the packaging film is formed by using organic materials, thereby effectively preventing the water vapor in the air from entering the display area due to the hydrophilic properties of the organic material and affecting the quality of the display area, thereby further ensuring the quality of the display substrate.

[0129] Optional, reference Figures 7 to 10 The barrier dam 04 may include at least one closed annular structure 041, and each annular structure 041 may surround the display area A11 of the base substrate 01. By surrounding the display area A11 with the annular structure 041, effective protection of the display area A11 can be achieved.

[0130] Optionally, the barrier dam 04 may include a plurality of annular structures 041 arranged at intervals. Figures 7 to 10 The barrier dam 04 includes two annular structures 041. In addition, the multiple annular structures 041 can be arranged at equal intervals, that is, the interval between each two adjacent annular structures 041 can be a fixed value. By arranging multiple annular structures 041 at intervals, the effective protection of the display area A11 can be further improved. For example, the barrier dam 04 can be formed by deposition.

[0131] It should be noted that, in the embodiment of the present disclosure, the substrate 01 may be made of a flexible material, such as a polyimide (PI) material, which has good properties such as high temperature resistance, low temperature resistance and oxidation resistance.

[0132] In summary, the embodiments of the present disclosure provide a display substrate. Since the edge region of the base substrate includes not only a plurality of first grooves penetrating at least one inorganic film layer, but also an organic layer covering the plurality of first grooves, wherein the hardness of the organic material forming the organic layer is greater than the hardness of the inorganic material forming the inorganic film layer. Therefore, the impact resistance of the display substrate is effectively improved by the combination of soft and hard, and a buffering effect is played on the external force exerted on the display substrate, which effectively avoids the problem of cracks extending to the packaging area and causing packaging failure, thereby ensuring the quality of the display substrate. In addition, by making the orthographic projections of the plurality of first grooves on the base substrate not overlap with the binding area, it is possible to avoid the metal wiring located in the binding area from being exposed and corroded when the first grooves are formed by the etching process, thereby ensuring the yield of the display substrate.

[0133] Fig.12 is a flow chart of a method for manufacturing a display substrate provided by an embodiment of the present disclosure. The method can be used to manufacture the above Figures 1 to 10 Any of the display substrates shown. Fig.12 As shown, the method may include:

[0134] Step 101: Provide a substrate.

[0135] The substrate may be a glass substrate. Figure 1 The base substrate 01 may have a packaging area A1 and an edge area A2 located around the packaging area A1. The edge area A2 may include a binding area A21 on a side where at least one edge of the base substrate 01 is located.

[0136] Optionally, the substrate 01 may include two flexible material layers and a barrier layer located between the two flexible material layers, and the flexible material forming the flexible material layer may be a PI material.

[0137] Step 102: Using inorganic materials to form a plurality of stacked inorganic film layers on one side of the base substrate.

[0138] In the embodiment of the present disclosure, inorganic materials may be used to form multiple inorganic film layers on one side of the substrate through a patterning process, wherein the patterning process may include: coating, exposure, development and etching, and the inorganic material may include at least one of silicon oxide, silicon nitride and silicon oxynitride.

[0139] Optionally, the multiple inorganic film layers may include: a barrier layer, a buffer layer, a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the substrate. The barrier layer can effectively block water vapor or oxygen from entering the substrate, thereby improving the water barrier, oxygen barrier and scratch resistance of the substrate. The inorganic material may include at least one of silicon oxide, silicon nitride and silicon oxynitride. In addition, the inorganic materials used to form different inorganic film layers may be the same or different.

[0140] Step 103 : forming a plurality of first grooves spaced apart from each other in the edge region and in a direction away from the packaging region and extending along the periphery of the substrate.

[0141] In the embodiment of the present disclosure, a portion of at least one inorganic film layer among the plurality of inorganic film layers located in the edge region A2 may be etched to obtain the plurality of first grooves.

[0142] Each first groove may penetrate at least one of the plurality of inorganic film layers, and the orthographic projections of the plurality of first grooves on the substrate may not overlap with the binding area. By forming the first grooves in the edge area, cracks in the edge area can be blocked.

[0143] Step 104 : using an organic material to form an organic layer covering the plurality of first grooves.

[0144] In the disclosed embodiment, an organic material can be used to form an organic layer covering the first grooves on the side of the plurality of first grooves away from the base substrate. By forming an organic layer covering the first grooves, a buffering effect can be played when a collision occurs in a direction perpendicular to the base substrate. And because the hardness of organic materials is greater than that of inorganic materials, the impact resistance of the display substrate can be further improved by combining soft and hard materials, and the extension of cracks can be further effectively avoided.

[0145] In summary, the embodiments of the present disclosure provide a method for manufacturing a display substrate. By using an inorganic material to form a plurality of first grooves penetrating at least one inorganic film layer in the edge region, and by using an organic material with a hardness greater than that of the inorganic material to form an organic layer covering the plurality of first grooves, the impact resistance of the display substrate can be effectively improved by a combination of soft and hard, and a buffering effect can be played on the external force exerted on the display substrate, effectively avoiding the problem of cracks extending to the packaging area and causing packaging failure. Furthermore, the problem of cracks extending to the display area, causing water vapor or oxygen to invade the display area through the cracks, and causing black spots on the display substrate is effectively avoided, thereby ensuring the quality of the display substrate. Moreover, by making the orthographic projections of the plurality of first grooves on the base substrate not overlap with the binding area, it is possible to avoid the metal wiring located in the binding area from being exposed and corroded when the first grooves are formed by an etching process, thereby ensuring the yield of the display substrate.

[0146] Optionally, forming the plurality of first grooves (ie, the above step 103 ) may include: etching a portion of at least one inorganic film layer among the plurality of inorganic film layers located in an edge region to obtain the plurality of first grooves.

[0147] Before etching the at least one inorganic film layer, the at least one inorganic film layer to be etched may be processed by processes such as coating, exposure and development.

[0148] As an optional implementation, Figure 3 and Figure 4 As shown, among the multiple inorganic film layers, at least one inorganic film layer penetrated by each first groove C1 may include: a gate insulating layer 023 and an interlayer dielectric layer 024 stacked in sequence in a direction away from the substrate. Accordingly, the above step 103 may be: etching the gate insulating layer and the interlayer dielectric layer in the multiple inorganic film layers located in the edge region.

[0149] Optionally, before the above step 103, the method for manufacturing the display substrate may further include: forming a buffer layer on one side of the base substrate.

[0150] In the embodiment of the present disclosure, an inorganic material may be used to form the buffer layer. Figure 4 , the buffer layer 022 may include an integrally formed first buffer pattern 0221 and a second buffer pattern 0222. The orthographic projection of the first buffer pattern 0221 on the base substrate 01 covers the encapsulation area A1 and part of the edge area A2, and the second buffer pattern 0222 is located in the edge area A2. The thickness of the first buffer pattern 0221 is greater than the thickness of the second buffer pattern 0222. In addition, the orthographic projection of the organic layer 02 on the buffer layer 022 partially overlaps with the second buffer pattern 0222, and the orthographic projection of the first groove C1 farthest from the encapsulation area A1 (i.e., the outermost first groove C1) of the plurality of first grooves C1 close to the encapsulation area A1 on the side of the buffer layer 022 overlaps with the boundary line of the first buffer pattern 0221 and the second buffer pattern 0222.

[0151] After a plurality of functional film layers are formed on the base substrate 01, the base substrate 01 needs to be cut at the edge area A2 of the base substrate 01 to obtain a display substrate. Therefore, by forming a second buffer pattern 0222 with a smaller thickness on the side of the edge area A2 away from the packaging area A1, the probability of the edge of the display substrate being broken due to a large cutting force can be effectively reduced, thereby improving the yield of the display substrate.

[0152] Furthermore, since the orthographic projection of the first groove C1 farthest from the packaging area A1 on the side close to the packaging area A1 on the buffer layer 022 overlaps with the boundary line between the first buffer pattern 0221 and the second buffer pattern 0222, that is, the orthographic projection of the multiple first grooves C1 on the buffer layer 022 only overlaps with the first buffer pattern 0221. Therefore, by making the orthographic projection of the organic layer 03 on the buffer layer 022 partially overlap with the second buffer pattern 0222, it can be ensured that the organic layer 03 completely covers the blocking portion formed between the multiple first grooves C1, thereby further ensuring the impact resistance of the display substrate.

[0153] As another optional implementation, Figure 5 As shown, among the multiple inorganic film layers, at least one inorganic film layer penetrated by each first groove C1 may include: an interlayer dielectric layer 024, a gate insulating layer 023, and a portion of the buffer layer 022. Accordingly, the above step 103 may be: etching the interlayer dielectric layer, the gate insulating layer, and a portion of the buffer layer in the multiple inorganic film layers located in the edge region.

[0154] As another optional implementation, Figure 6 As shown, among the multiple inorganic film layers, at least one inorganic film layer penetrated by each first groove C1 may include: an interlayer dielectric layer 024, a gate insulating layer 023, a buffer layer 022 and a portion of the barrier layer 021. Accordingly, the above step 103 may be: etching the interlayer dielectric layer, the gate insulating layer, the buffer layer and a portion of the barrier layer in the multiple inorganic film layers located in the edge region.

[0155] As another optional implementation, among the multiple inorganic film layers, at least one inorganic film layer penetrated by each first groove C1 may only include: an interlayer dielectric layer arranged in a direction away from the substrate. Accordingly, the above step 103 may be: etching only the portion of the interlayer dielectric layer in the multiple inorganic film layers located in the edge region.

[0156] Before the above steps 102 to 104 , or after the above steps 102 to 104 , the method may further include: using an organic material to form a barrier dam in a peripheral region included in the encapsulation region.

[0157] Optionally, an organic material can be used to form a barrier dam with a gap between the display area and the organic layer on the side away from the base substrate by deposition. In addition, the orthographic projection of the organic layer on the base substrate does not overlap with the orthographic projection of the barrier dam on the base substrate. Since the barrier dam is located in the peripheral area included in the encapsulation area and has a gap with the display area included in the encapsulation area, the barrier dam can effectively prevent the organic material from flowing out of the encapsulation area A1 when the organic encapsulation film layer in the encapsulation film is formed by the organic material, and can effectively prevent the water vapor in the air from entering the display area due to the hydrophilic property of the organic material, thereby affecting the quality of the display area, which further ensures the quality of the display substrate.

[0158] In summary, the embodiments of the present disclosure provide a method for manufacturing a display substrate. By using an inorganic material to form a plurality of first grooves penetrating at least one inorganic film layer in the edge region, and by using an organic material with a hardness greater than that of the inorganic material to form an organic layer covering the plurality of first grooves, the impact resistance of the display substrate can be effectively improved by a combination of soft and hard, and a buffering effect can be played on the external force exerted on the display substrate, effectively avoiding the problem of cracks extending to the packaging area and causing packaging failure. Furthermore, the problem of cracks extending to the display area, causing water vapor or oxygen to invade the display area through the cracks, and causing black spots on the display substrate is effectively avoided, thereby ensuring the quality of the display substrate. Moreover, by making the orthographic projections of the plurality of first grooves on the base substrate not overlap with the binding area, it is possible to avoid the metal wiring located in the binding area from being exposed and corroded when the first grooves are formed by an etching process, thereby ensuring the yield of the display substrate.

[0159] The present disclosure provides a display device, which may include: Figures 1 to 10 Any of the display substrates shown. The display device may be: a liquid crystal panel, electronic paper, an OLED panel, an AMOLED panel, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function. The AMOLED panel may be a flexible display panel.

[0160] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A display substrate, characterized in that: The display substrate comprises: A substrate substrate, the substrate substrate having a packaging area and an edge area located around the packaging area, the edge area including a binding area on a side where at least one edge of the substrate substrate is located; A plurality of inorganic film layers are located on one side of the base substrate and are stacked; A plurality of first grooves are located in the edge region and are sequentially spaced apart in a direction away from the packaging region and extend along the periphery of the base substrate, wherein each of the first grooves penetrates at least one inorganic film layer among the plurality of inorganic film layers, and the orthographic projections of the plurality of first grooves on the base substrate do not overlap with the binding region; an organic layer covering the plurality of first grooves; Wherein, the at least one inorganic film layer comprises: a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate.

2. The display substrate according to claim 1, characterized in that: The plurality of inorganic film layers further include: a buffer layer located between the base substrate and the at least one inorganic film layer, the buffer layer including a first buffer pattern and a second buffer pattern formed integrally; The orthographic projection of the first buffer pattern on the base substrate covers the packaging area and a portion of the edge area, the second buffer pattern is located in the edge area, and the thickness of the first buffer pattern is greater than the thickness of the second buffer pattern; Among them, the orthographic projection of the organic layer on the buffer layer partially overlaps with the second buffer pattern, and the orthographic projection of the side of the first groove farthest from the encapsulation area among the multiple first grooves close to the encapsulation area on the buffer layer overlaps with the boundary line between the first buffer pattern and the second buffer pattern.

3. The display substrate according to claim 1, characterized in that: The inorganic film layer between each two adjacent first grooves constitutes a blocking portion; the plurality of inorganic film layers further include: a buffer layer located between the base substrate and the at least one inorganic film layer, the buffer layer including a first buffer pattern and a second buffer pattern formed in one piece; The orthographic projection of the first buffer pattern on the base substrate covers the packaging area and a portion of the edge area, the second buffer pattern is located in the edge area, and the thickness of the first buffer pattern is greater than the thickness of the second buffer pattern; The orthographic projection of the organic layer on the buffer layer partially overlaps with the second buffer pattern, and the orthographic projection of the side of the blocking portion farthest from the encapsulation area on the buffer layer farthest from the encapsulation area overlaps with the boundary line between the first buffer pattern and the second buffer pattern.

4. The display substrate according to claim 2, characterized in that: The thickness of the second buffer pattern is 20% of the thickness of the first buffer pattern.

5. The display substrate according to claim 1, characterized in that: The plurality of inorganic film layers include: a barrier layer, a buffer layer, a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate; The at least one inorganic film layer includes: the interlayer dielectric layer, the gate insulating layer and a portion of the buffer layer.

6. The display substrate according to claim 1, characterized in that: The plurality of inorganic film layers include: a barrier layer, a buffer layer, a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate; The at least one inorganic film layer includes: the interlayer dielectric layer, the gate insulating layer, the buffer layer and a portion of the barrier layer.

7. The display substrate according to any one of claims 1 to 6, characterized in that: The orthographic projection of each of the first grooves on the substrate is a ring having an opening; The ring shape surrounds the packaging area, and the orthographic projection of the opening on the substrate overlaps with the binding area.

8. The display substrate according to claim 7, characterized in that: The base substrate also has a display area; The shape of a side of the ring away from the binding area matches the shape of a side of the display area away from the binding area.

9. The display substrate according to claim 7, characterized in that: The encapsulation area includes a display area and a peripheral area surrounding the display area, and the ring includes: a first side edge, a second side edge, a third side edge and a fourth side edge connected in sequence; The distance between the first side and the side of the peripheral area away from the display area is equal to the distance between the third side and the side of the peripheral area away from the display area; The distance between the intersection of the first side and the second side and the side of the peripheral area away from the display area is smaller than the distance between the intersection of the first side and the fourth side and the side of the peripheral area away from the display area; The distance between the intersection of the third side and the second side and the side of the peripheral area away from the display area is smaller than the distance between the intersection of the third side and the fourth side and the side of the peripheral area away from the display area; The first side and the third side are arranged opposite to each other, the second side and the fourth side are arranged opposite to each other, the fourth side is located at the side where the binding area is located, and the fourth side is provided with the opening.

10. The display substrate according to claim 9, characterized in that: Among the angles formed by every two adjacent sides of each side of the ring, at least one angle is a rounded angle.

11. The display substrate according to claim 10, characterized in that: The fourth side includes a first portion and a second portion separated by the opening; An angle formed by the first side and the first portion, and an angle formed by the third side and the second portion are both greater than or equal to 90 degrees.

12. The display substrate according to claim 7, characterized in that: The distances between each part of the ring and the edge of the substrate are equal.

13. The display substrate according to claim 7, characterized in that: The binding area includes a routing fan-out area and a welding area, and the welding area overlaps with the opening; Both ends of the first groove are located at the edge of the side of the substrate close to the binding area, and the distance between each of the two ends of the first groove and the welding area is 5 to 10 microns.

14. The display substrate according to claim 7, characterized in that: The ring is surrounded by at least one of a bar shape and an arc shape.

15. The display substrate according to any one of claims 1 to 6, characterized in that: The plurality of first grooves are arranged at equal intervals.

16. The display substrate according to any one of claims 1 to 6, characterized in that: The substrate is a flexible substrate, the binding area comprises: a first sub-area, a bending area and a second sub-area which are sequentially away from the packaging area, and the welding area in the binding area is located in the second sub-area; The orthographic projections of two ends of the first groove on the base substrate do not overlap with the bending region, and are located on a side of the first sub-region close to the bending region.

17. The display substrate according to claim 16, characterized in that: The plurality of inorganic film layers further have a second groove, and the orthographic projection of the second groove on the base substrate covers the bending area; The multiple inorganic film layers include: a barrier layer, a buffer layer, a gate insulation layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate, and the second groove penetrates the interlayer dielectric layer, the gate insulation layer, the buffer layer and part of the barrier layer.

18. The display substrate according to any one of claims 1 to 6, characterized in that: A spacing between a side of a first groove close to the packaging area among the plurality of first grooves and a side of a first groove far from the packaging area and close to the packaging area among the plurality of first grooves is 60 micrometers.

19. The display substrate according to any one of claims 1 to 6, characterized in that: The packaging area includes a display area and a peripheral area surrounding the display area, and the display substrate further includes: a blocking dam located in the peripheral area; An orthographic projection of the organic layer on the base substrate does not overlap with an orthographic projection of the barrier dam on the base substrate.

20. A method for manufacturing a display substrate, characterized in that: For manufacturing a display substrate as claimed in any one of claims 1 to 19, the method comprises: Providing a substrate substrate, the substrate substrate having a packaging area and an edge area located around the packaging area, the edge area including a binding area on a side where at least one edge of the substrate substrate is located; Using inorganic materials to form a plurality of stacked inorganic film layers on one side of the base substrate; A plurality of first grooves are formed in the edge region and in a direction away from the packaging region, which are spaced apart from each other and extend along the periphery of the base substrate, each of the first grooves penetrates at least one inorganic film layer among the plurality of inorganic film layers, and the orthographic projections of the plurality of first grooves on the base substrate do not overlap with the binding region; Using an organic material to form an organic layer covering the plurality of first grooves; Wherein, the at least one inorganic film layer comprises: a gate insulating layer and an interlayer dielectric layer stacked in sequence in a direction away from the base substrate.

21. A display device, characterized in that: The display device comprises: a display substrate as described in any one of claims 1 to 19.

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