refrigerator

Abstract

The present invention provides a refrigerator. The refrigerator includes: a box body, which defines at least a first storage space and a second storage space; a semiconductor refrigeration system, which is configured to provide cold energy to the first storage space; a compression refrigeration system, which is configured to provide cold energy to the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and an air supply component, which is arranged in the first storage space, and the air supply component includes a front cover, a rear cover and a centrifugal fan, the centrifugal fan is arranged in the air duct defined by the front cover and the rear cover, and is configured to transfer the cold energy generated by the semiconductor refrigeration system to the first storage space, and the upper and lower parts of the front side of the front cover are respectively provided with an air supply port and a return air port, and the rear cover is provided with an air intake port at a position corresponding to the centrifugal fan. In the refrigerator of the present invention, the structure of the air supply component matches the semiconductor refrigeration system, and the cold energy generated by the semiconductor refrigeration system is smoothly transferred to the first storage space, so that the first storage space can achieve deep refrigeration.

Description

Technical Field

[0001] The invention relates to the field of household electrical appliances, and in particular to a refrigerator. Background Art

[0002] With the development of society and the continuous improvement of people's living standards, people's pace of life is getting faster and faster, and they may buy and store a lot of food at one time. In order to ensure the storage effect of food, refrigerators have become one of the indispensable household appliances in people's daily life.

[0003] Current refrigerators can generally be divided into compression refrigerators and semiconductor refrigerators according to the type of refrigeration system. The temperature regulation accuracy of compression refrigerators is relatively low, generally ±3.5°C, while the temperature regulation accuracy of semiconductor refrigerators can reach ±0.1°C. Although the temperature regulation accuracy of semiconductor refrigerators is high, they have the following disadvantages: the semiconductor chips in the semiconductor refrigeration system are easily affected by the external ambient temperature. When the external ambient temperature is very high, it is difficult for the hot end of the semiconductor chip to dissipate heat, which will cause the hot end temperature to rise and the cooling capacity to decrease. Due to the low efficiency of the semiconductor refrigeration system, it has always been only applicable to small-volume ordinary refrigeration products or to dissipate heat for certain key components, and low-temperature refrigeration cannot be achieved. In addition, when the semiconductor refrigeration system is applied to small-volume ordinary refrigeration products, due to the small volume of the refrigeration product, the conventional air duct structure cannot meet the requirements of setting up a semiconductor refrigeration system. Summary of the invention

[0004] An object of the present invention is to match an air supply assembly of a refrigerator with a semiconductor refrigeration system.

[0005] A further object of the present invention is to achieve deep refrigeration of a specific storage space in a refrigerator to meet the storage requirements of food.

[0006] In particular, the present invention provides a refrigerator, comprising: a box body, which defines at least a first storage space and a second storage space; a semiconductor refrigeration system, configured to provide cold energy to the first storage space; a compression refrigeration system, configured to provide cold energy to the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and an air supply component, which is arranged in the first storage space, and the air supply component includes a front cover, a rear cover and a centrifugal fan, the centrifugal fan is arranged in an air duct defined by the front cover and the rear cover, and is configured to transfer the cold energy generated by the semiconductor refrigeration system to the first storage space, the upper and lower parts of the front side of the front cover are respectively provided with an air supply port and a return air port, and the rear cover is provided with an air intake port at a position corresponding to the centrifugal fan.

[0007] Optionally, the semiconductor refrigeration system includes: a semiconductor chip, a hot heat exchanger and a cold heat exchanger, wherein the semiconductor chip is arranged between the hot heat exchanger and the cold heat exchanger, and the semiconductor chip has a hot end and a cold end, the hot heat exchanger is partially bonded to the hot end, and the cold heat exchanger is partially bonded to the cold end.

[0008] Optionally, the compression refrigeration system includes: a compressor, a condenser, a capillary tube and an evaporator, and a heat exchanger is arranged between the capillary tube and the evaporator. The low-temperature refrigerant absorbs heat when flowing through the heat exchanger, thereby reducing the temperature of the hot end, and the temperature of the cold end also decreases accordingly. After the cold energy of the cold end is transferred to the cold heat exchanger, the centrifugal fan transfers the cold energy of the cold heat exchanger to the first storage space.

[0009] Optionally, the cold heat exchanger is arranged on the rear side of the rear cover, and a plurality of fins are arranged on the side of the cold heat exchanger facing the rear cover, and a longitudinal channel is formed between two adjacent fins so that air flows through the cold heat exchanger for heat exchange.

[0010] Optionally, the height of a preset number of fins in the middle is lower than the height of the fins on the left and right sides, and the air supply assembly also includes: a first shielding member, arranged in front of the preset number of fins; and two second shielding members, respectively arranged on the left and right sides of the cold heat exchanger.

[0011] Optionally, a volute is provided at the air suction port of the rear cover, and protruding structures are provided on both the left and right sides of the volute, so that there is a certain distance between the first shielding member and the air suction port.

[0012] Optionally, the air supply assembly also includes: a heat-insulating component, which is arranged in the air duct and has a recessed portion on the side facing the rear cover to set up a centrifugal fan, and has an opening on the top so that the wind blown out by the centrifugal fan can blow toward the air supply port through the opening.

[0013] Optionally, the longitudinal section of the recessed portion is arc-shaped, and a drain port is provided at the bottom of the recessed portion to drain residual water at the centrifugal fan during defrosting.

[0014] Optionally, a plurality of return air outlets are provided, and the middle return air outlet is smaller than the return air outlets on the left and right sides.

[0015] Optionally, an air hood is provided at the air supply port to guide the air blown out by the centrifugal fan to the first storage space; and a plurality of dividing ribs are evenly arranged longitudinally inside the air hood to ensure uniform air supply.

[0016] The refrigerator of the present invention comprises: a box body, which defines at least a first storage space and a second storage space; a semiconductor refrigeration system, which is configured to provide cold to the first storage space; a compression refrigeration system, which is configured to provide cold to the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; and an air supply assembly, which is arranged in the first storage space, and the air supply assembly comprises a front cover, a rear cover and a centrifugal fan, the centrifugal fan is arranged in the air duct defined by the front cover and the rear cover, and is configured to transmit the cold generated by the semiconductor refrigeration system to the first storage space, and the upper and lower parts of the front side of the front cover are respectively provided with an air supply port and a return air port, and the rear cover is provided with an air suction port at a position corresponding to the centrifugal fan. The structure of the air supply assembly matches the semiconductor refrigeration system, and the cold generated by the semiconductor refrigeration system can be smoothly transmitted to the first storage space. In addition, the compression refrigeration system reduces the temperature of the hot end of the semiconductor refrigeration system, which can promote the semiconductor refrigeration system to provide cold to the first storage space, thereby enabling the first storage space to achieve deep refrigeration, meet the storage requirements of food, and improve the storage effect of food.

[0017] Furthermore, in the refrigerator of the present invention, the specific arrangement of the first shielding member, the second shielding member, and the raised structures on both sides of the volute can ensure that the return air is completely heat exchanged through the cold heat exchanger, and avoid the return air being sent to the first storage space through other paths without heat exchange through the cold heat exchanger. There is a certain distance between the first shielding member and the air intake port, which can ensure that the air after heat exchange can smoothly enter the air duct through the air intake port, and then be blown from the air supply port to the first storage space through the centrifugal fan. The overall structure of the air supply assembly occupies a small volume and can ensure smooth air circulation.

[0018] Furthermore, in the refrigerator of the present invention, the low-temperature refrigerant of the compression refrigeration system absorbs heat when flowing through the heat exchanger, lowering the temperature of the hot end, and the temperature of the cold end is lowered accordingly. After the coldness of the cold end is transferred to the cold heat exchanger, the centrifugal fan transfers the coldness of the cold heat exchanger to the first storage space. Combined with the traditional compression refrigeration system of the refrigerator, the heat of the heat exchanger is quickly taken away by the low-temperature refrigerant, and the hot end is maintained in a low-temperature environment. With the help of the temperature difference between the hot end and the cold end of the semiconductor chip, the temperature of the cold end is further reduced, and then the centrifugal fan is used to exchange heat in a strong convection manner to achieve deep refrigeration of the first storage space. The energy consumption during the refrigeration process is low, and the semiconductor refrigeration system directly converts energy from electrical energy, effectively avoiding noise and improving the user experience.

[0019] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0021] Figure 1 is a schematic structural diagram of a refrigerator according to an embodiment of the present invention;

[0022] Figure 2 is a schematic diagram of the connection structure of a compression refrigeration system and a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

[0023] Figure 3 is a schematic structural diagram of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

[0024] Figure 4 is a schematic structural diagram of a heat exchanger of a semiconductor refrigeration system in a refrigerator according to an embodiment of the present invention;

[0025] Figure 5 yes Figure 4 The exploded structural diagram of the heat exchanger shown;

[0026] Figure 6 is a schematic diagram of a semiconductor refrigeration system in a refrigerator providing cold energy to a first storage space according to an embodiment of the present invention;

[0027] Figure 7 is a schematic structural diagram of a semiconductor refrigeration system and an air supply assembly in a refrigerator according to an embodiment of the present invention;

[0028] Figure 8 yes Figure 7 A schematic diagram of the structure of the semiconductor refrigeration system and the air supply assembly from another perspective;

[0029] Fig. 9 is a front view of an air supply assembly in a refrigerator according to an embodiment of the present invention;

[0030] Fig.10 is a rear view of an air supply assembly in a refrigerator according to an embodiment of the present invention; and

[0031] Fig.11 It is a schematic diagram of an exploded view of an air supply assembly in a refrigerator according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] The present embodiment provides a refrigerator, the structure of the air supply component matches the semiconductor refrigeration system, and the cold energy generated by the semiconductor refrigeration system can be smoothly transmitted to the first storage space; the temperature of the hot end of the semiconductor refrigeration system is reduced by the compression refrigeration system, which promotes the semiconductor refrigeration system to provide cold energy to the first storage space, thereby enabling the first storage space to achieve deep refrigeration, meet the storage requirements of food, and improve the storage effect of food. Figure 1 is a schematic structural diagram of a refrigerator 100 according to an embodiment of the present invention, Figure 2 1 is a schematic diagram of the connection structure of the compression refrigeration system 140 and the semiconductor refrigeration system 130 in the refrigerator 100 according to an embodiment of the present invention. Figure 3 is a schematic structural diagram of a semiconductor refrigeration system 130 in a refrigerator 100 according to an embodiment of the present invention. Figure 4 1 is a schematic structural diagram of a heat exchanger 132 of a semiconductor refrigeration system 130 in a refrigerator 100 according to an embodiment of the present invention. Figure 5 yes Figure 4 The exploded structural diagram of the heat exchanger 132 is shown in FIG. Figure 6 FIG. 1 is a schematic diagram of a semiconductor refrigeration system 130 in a refrigerator 100 providing cold energy to a first storage space 111 according to an embodiment of the present invention. Figures 1 to 6 As shown, the refrigerator 100 of this embodiment may generally include: a cabinet 110 , a semiconductor refrigeration system 130 , a compression refrigeration system 140 and an air supply assembly 170 .

[0033] The interior of the box 110 defines at least a first storage space 111 and a second storage space 112. In fact, the number and structure of the storage spaces can be configured according to needs. Moreover, the storage spaces can be configured as refrigerated spaces, frozen spaces, variable temperature spaces or fresh-keeping spaces according to different uses. Each storage space can be divided into multiple storage areas by a partition board, and items can be stored using shelves or drawers. Figure 1 As shown, the box body 110 of the refrigerator 100 of this embodiment may define four storage spaces inside: a first storage space 111, a second storage space 112, a third storage space 113, and a fourth storage space 114. The second storage space 112 may be located at the top and set as a refrigeration space; the first storage space 111 and the third storage space 113 may be arranged side by side below the second storage space 112, the first storage space 111 may be set as a deep freezing space, and the third storage space 113 may be set as a variable temperature space; the fourth storage space 114 may be arranged at the bottom and set as a freezing space.

[0034] The refrigerator 100 of this embodiment may further include: a door body 120, which is pivotally arranged on the front surface of the box body 110, so that the user can open and close the storage space. The door body 120 can be arranged corresponding to the storage space, that is, each storage space corresponds to one or more door bodies 120. The door body 120 can be pivotally opened or can be opened in a drawer-like manner. For example, the door body 120 corresponding to the second storage space 112 is pivotally opened, and the remaining storage spaces can be opened in a drawer-like manner.

[0035] The semiconductor refrigeration system 130 may be configured to provide cold energy to the first storage space 111. The compression refrigeration system 140 may be configured to provide cold energy to the second storage space 112. Since the refrigerator 100 of this embodiment is provided with a third storage space 113 and a fourth storage space 114 in addition to the first storage space 111 and the second storage space 112, the semiconductor refrigeration system 130 may provide cold energy to the first storage space 111, and the compression refrigeration system 140 may provide cold energy to the remaining storage spaces.

[0036] It should be noted that the compression refrigeration system 140 provides different amounts of cold to various types of storage spaces, resulting in different temperatures in various types of storage spaces. The temperature in the refrigerated space is generally between 2°C and 10°C, preferably 4°C to 7°C. The temperature in the freezer space is generally between -22°C and -14°C. Different types of items have different optimal storage temperatures, and therefore different storage spaces are suitable for storage. For example, fruit and vegetable foods are suitable for storage in a refrigerated space or a fresh-keeping space, while meat foods are suitable for storage in a freezer space. A heating device may be provided inside the variable temperature space to heat the food.

[0037] More importantly, in addition to providing coldness to the storage space, the compression refrigeration system 140 can also be configured to reduce the temperature of the hot end 136 of the semiconductor refrigeration system 130. The hot end 136 of the semiconductor refrigeration system 130 has difficulty in heat dissipation, which will cause the temperature of the hot end 136 to rise and thus reduce the refrigeration capacity. The compression refrigeration system 140 timely reduces the temperature of the hot end 136 of the semiconductor refrigeration system 130, which can promote the semiconductor refrigeration system 130 to provide coldness to the first storage space 111, thereby achieving deep refrigeration of the first storage space 111, meeting the storage requirements of food, and improving the storage effect of food.

[0038] like Figure 6As shown, the air supply assembly 170 can be arranged in the first storage space 111, and the air supply assembly 170 includes a front cover 171, a rear cover 172 and a centrifugal fan 173. The centrifugal fan 173 is arranged in the air duct 160 defined by the front cover 171 and the rear cover 172, and is configured to transmit the cold generated by the semiconductor refrigeration system 130 to the first storage space 111. The upper and lower parts of the front side of the front cover 171 are respectively provided with an air supply port 161 and an air return port 162, and the rear cover 172 is provided with an air suction port 163 at a position corresponding to the centrifugal fan 173.

[0039] It should be noted that the box body 110 may also include an inner liner 115, and the air supply assembly 170 may be arranged at the back of the inner liner 115 of the first storage space 111. The "front" and "rear" in the front cover 171 and the rear cover 172 are directional descriptions when the refrigerator 100 is in normal use, that is, the front cover 171 is closer to the door body 120 than the rear cover 172. In addition, the upper and lower parts of the front cover 171 are respectively provided with an air supply port 161 and a return air port 162. The upper and lower parts are actually relative to the centrifugal fan 173, and the air supply port 161 is above the centrifugal fan 173, and the return air port 162 is below the centrifugal fan 173. The position settings of the air supply port 161, the return air port 162 and the air suction port 163 match the air inlet and outlet mode of the centrifugal fan 173 to promote air circulation. In the refrigerator 100 of this embodiment, the structure of the air supply assembly 170 matches the semiconductor refrigeration system 130 , and the cold energy generated by the semiconductor refrigeration system 130 can be smoothly transmitted to the first storage space 111 .

[0040] like Figure 2 and Figure 3 As shown, the semiconductor refrigeration system 130 may include: a semiconductor chip 131, a hot heat exchanger 132 and a cold heat exchanger 133. The semiconductor chip 131 is disposed between the hot heat exchanger 132 and the cold heat exchanger 133, and the semiconductor chip 131 has a hot end 136 and a cold end 137, the hot heat exchanger 132 is partially adhered to the hot end 136, and the cold heat exchanger 133 is partially adhered to the cold end 137.

[0041] In a preferred embodiment, the semiconductor refrigeration system 130 may further include: a heat-conducting layer 134 and a heat-insulating layer 135. The heat-conducting layer 134 is made of a material with a high thermal conductivity, and the hot heat exchanger 132 is partially bonded to the hot end 136 through the heat-conducting layer 134, and the cold heat exchanger 133 is partially bonded to the cold end 137 through the heat-conducting layer 134. Due to the high thermal conductivity of the heat-conducting layer 134, good heat conduction can be formed between the hot heat exchanger 132 and the hot end 136, and between the cold end 137 and the cold heat exchanger 133. Specifically, the material of the heat-conducting layer 134 may include, but is not limited to, thermally conductive silicone grease and liquid metal.

[0042] The material of the heat insulating layer 135 is a material with low thermal conductivity, and the heat insulating layer 135 is disposed at a position other than the semiconductor chip 131 between the hot heat exchanger 132 and the cold heat exchanger 133, and is configured to isolate the hot heat exchanger 132 from the cold heat exchanger 133. Since the semiconductor chip 131 is usually thin, the distance between the hot heat exchanger 132 and the cold heat exchanger 133 is relatively close. Adding the heat insulating layer 135 at a position other than the semiconductor chip 131 between the hot heat exchanger 132 and the cold heat exchanger 133 can effectively prevent the hot heat exchanger 132 and the cold heat exchanger 133 from forming heat conduction, thereby affecting the cooling effect. Specifically, the material of the heat insulating layer 135 may include, but is not limited to, foam, foaming material, PE cotton, and aerogel.

[0043] like Figure 2 As shown, the compression refrigeration system 140 may include: a compressor 141, a condenser 142, a capillary tube 143 and an evaporator 144, and the heat exchanger 132 is disposed between the capillary tube 143 and the evaporator 144. When the low-temperature refrigerant flows through the heat exchanger 132, it absorbs heat, lowers the temperature of the hot end 136, and the temperature of the cold end 137 is lowered accordingly. After the cold energy of the cold end 137 is transferred to the cold heat exchanger 133, the centrifugal fan 173 transfers the cold energy of the cold heat exchanger 133 to the first storage space 111. Figures 2 to 5 As shown, the heat exchanger 132 is connected to the capillary tube 143 through the liquid inlet pipe 151 and is connected to the evaporator 144 through the liquid outlet pipe 152.

[0044] Furthermore, the heat exchanger 132 is in the shape of a plate, and a groove 155 is provided inside the plate. The low-temperature refrigerant flows into the groove 155 from the liquid inlet pipe 151, flows along the groove 155, and then flows out through the liquid outlet pipe 152. Preferably, the shape of the groove 155 is a curve with a preset number of inflection points, so that the area of ​​the low-temperature refrigerant flowing inside the heat exchanger 132 can be increased, the heat exchange efficiency can be improved, and the temperature of the hot end 136 can be effectively reduced. In a specific embodiment, as Figure 4 and Figure 5 As shown, the heat exchanger 132 may include a cover plate 153 and a back plate 154, the back plate 154 is provided with a groove 155, and the cover plate 153 is covered in the groove 155. In some other embodiments, the heat exchanger 132 may also be punched or copper pipes may be arranged to allow the low-temperature refrigerant to flow therein.

[0045] In a specific embodiment, after the temperature of the hot end 136 is lowered, the temperature of the cold end 137 is lowered to the first temperature value. The refrigeration principle of the semiconductor refrigeration system 130 mainly utilizes the Peltier effect: when a current passes through a loop composed of different conductors, in addition to generating irreversible Joule heat, heat absorption and heat release phenomena will occur at the joints of different conductors depending on the direction of the current. After the semiconductor chip 131 is powered on, a temperature difference will occur between the hot end 136 and the cold end 137. Therefore, after the temperature of the hot end 136 is lowered, the temperature of the cold end 137 is lowered to the first temperature value.

[0046] Further, after the temperature of the cold end 137 is reduced to the first temperature value, the cold energy of the cold end 137 is transferred to the cold heat exchanger 133. It should be noted that the cold end 137 and the cold heat exchanger 133 are arranged on a side close to the first storage space 111, so as to reduce the temperature of the first storage space 111. Specifically, an air supply port 161 may be arranged above the centrifugal fan 173 to deliver the cold energy to the first storage space 111; and a return air port 162 may be arranged below the centrifugal fan 173 to return the air with increased temperature to the semiconductor refrigeration system 130, thereby forming an air circulation.

[0047] In a preferred embodiment, after the cold energy of the cold heat exchanger 133 is transferred to the first storage space 111, the temperature of the first storage space 111 is reduced to a second temperature value, wherein the first temperature value is lower than the second temperature value, and the second temperature value is -30°C to -60°C. In other words, there will be a certain loss in the process of transferring the cold energy of the cold end 137 to the first storage space 111, for example, the first temperature value may be 5°C lower than the second temperature value. The second temperature value of the first storage space 111 can reach -30°C to -60°C, which can meet the storage requirements of some special ingredients.

[0048] A specific embodiment is introduced below: when the compression refrigeration system 140 is running, the low-temperature refrigerant absorbs heat when flowing through the heat exchanger 132, and the heat exchanger 132 is adhered to the hot end 136 by the heat conductive layer 134, so that the hot end 136 is cooled. When the semiconductor chip 131 is powered on, a temperature difference is generated between the hot end 136 and the cold end 137 due to the Peltier effect, and the temperature of the cold end 137 is reduced to a first temperature value. The cold energy of the cold end 137 is transferred to the cold heat exchanger 133 through the heat conductive layer 134, and the centrifugal fan 173 in the air duct 160 transfers the cold energy of the cold heat exchanger 133 to the first storage space 111, so that the internal temperature thereof is reduced to a second temperature value, thereby realizing a deep cooling function.

[0049] It should be noted that when the semiconductor chip 131 is not powered on, the compression refrigeration system 140 operates normally, and the low-temperature refrigerant still flows through the heat exchanger 132 to cool the hot end 136. Although there is no temperature difference between the hot end 136 and the cold end 137, the cold amount can still be transmitted to the first storage space 111 through the cold end 137, the cold heat exchanger 133, and the centrifugal fan 173 in sequence. Although the amount of cold transmitted to the first storage space 111 is less than when the semiconductor chip 131 is powered on, the first storage space 111 can still be used as a normal freezing space without consuming additional electricity. In addition, when the compression refrigeration system 140 stops running, by applying a reverse voltage to the semiconductor chip 131, the hot end 136 and the cold end 137 can be interchanged, so that the cold heat exchanger 133 can be heated and defrosted.

[0050] It should be emphasized that the temperature difference between the hot end 136 and the cold end 137 is not fixed. In a low temperature environment, the temperature difference between the two may be 20°C to 30°C. In normal environment, the temperature of the two will be larger. In other words, in a low temperature environment, it will be difficult to achieve a low temperature at the cold end 137, and it will also be difficult to achieve a deep cooling function in the storage space. The refrigerator 100 of this embodiment, combined with the traditional compression refrigeration system 140, uses a low-temperature refrigerant to quickly take away the heat of the heat exchanger 132, maintains the hot end 136 in a low temperature environment, and uses the temperature difference between the hot end 136 and the cold end 137 of the semiconductor chip 131 to further reduce the temperature of the cold end 137. Then, the centrifugal fan 173 is used to exchange heat in a strong convection manner to achieve deep cooling of the first storage space 111. The energy consumption during the refrigeration process is low, and the semiconductor refrigeration system 130 directly converts energy from electrical energy, effectively avoiding noise and improving the user experience.

[0051] Figure 7 1 is a schematic structural diagram of a semiconductor refrigeration system 130 and an air supply assembly 170 in a refrigerator 100 according to an embodiment of the present invention. Figure 8 yes Figure 7 A schematic structural diagram of the semiconductor refrigeration system 130 and the air supply assembly 170 from another perspective, Fig. 9 1 is a front view of an air supply assembly 170 in a refrigerator 100 according to an embodiment of the present invention. Fig.10 is a rear view of an air supply assembly 170 in a refrigerator 100 according to an embodiment of the present invention, Fig.11 1 is an exploded schematic diagram of the air supply assembly 170 in the refrigerator 100 according to an embodiment of the present invention. Since the semiconductor chip 131 is relatively thin and is located between the cold heat exchanger 133 and the hot heat exchanger 132, Figure 7 and Figure 8 The semiconductor refrigeration system 130 in the figure does not show the semiconductor chip 131.

[0052] like Figure 7and Figure 8 As shown, the cold heat exchanger 133 is arranged at the rear side of the rear cover 172, and a plurality of fins 138 are arranged on the side of the cold heat exchanger 133 facing the rear cover 172, and a longitudinal channel 139 is formed between two adjacent fins 138, so that air flows through the cold heat exchanger 133 for heat exchange. Specifically, the height of the fins 138 of the preset number in the middle is lower than the height of the fins 138 on the left and right sides, and the air supply assembly 170 also includes: a first shielding member 174 and two second shielding members 175. Among them, the first shielding member 174 is arranged on the front side of the preset number of fins 138; the two second shielding members 175 are respectively arranged on the left and right sides of the cold heat exchanger 133. In addition, the first shielding member 174 and the second shielding member 175 can both be made of foam material.

[0053] It should be noted that the height of the preset number of fins 138 in the middle is lower than the height of the fins 138 on the left and right sides, wherein the height of the fins 138 refers to the size of the fins 138 in the front-to-back direction. Figure 7 , Fig. 9 and Fig.10 As shown, there are multiple return air ports 162, and the middle return air port 162 is smaller than the return air ports 162 on the left and right sides. In this way, most of the return air can reach the bottom of the cold heat exchanger 133 through the return air ports 162 on the left and right sides, and then exchange heat through the fins 138 on the left and right sides of the cold heat exchanger 133; a smaller portion of the return air reaches the bottom of the cold heat exchanger 133 through the middle return air port 162, and then exchanges heat through the fins 138 in the middle of the cold heat exchanger 133. The size of the return air port 162 matches the fins 138 of different heights of the cold heat exchanger 133, which makes the air volume distribution of the cold heat exchanger 133 more reasonable and improves the heat exchange efficiency.

[0054] like Figure 8 As shown, the air inlet 163 of the rear cover 172 is provided with a volute 164, which can effectively prevent the incoming air from generating vortices. In addition, protrusion structures 165 are provided on both sides of the volute 164, so that there is a certain distance between the first shielding member 174 and the air inlet 163. Figure 8As shown, the first shielding member 174 and the air inlet 163 are positioned relative to each other, and there is a certain distance between the first shielding member 174 and the air inlet 163, which can ensure that the air that has undergone heat exchange in the cold heat exchanger 133 can smoothly pass through the air inlet 163 and enter the air duct 160. In fact, the height of the preset number of fins 138 in the middle of the cold heat exchanger 133 in the foregoing text is lower than the height of the fins 138 on the left and right sides, and the height of the first shielding member 174 after being arranged in front of the preset number of fins 138 can be roughly flush with the height of the fins 138 on both sides. Therefore, the raised structures 165 on both sides of the volute 164 can absolutely ensure that there is a certain distance between the first shielding member 174 and the air inlet 163. In addition, the bottom center of the rear cover 172 can also have a shelf 181 extending backward, and the first shielding member 174 is at least partially placed on top of the shelf 181.

[0055] like Fig.11 As shown, the air supply assembly 170 also includes: a heat preservation member 176, which is arranged in the air duct 160, and a recessed portion 177 is formed on the side facing the rear cover 172 to set the centrifugal fan 173, and an opening 178 is provided on the top thereof, so that the wind blown by the centrifugal fan 173 is blown toward the air supply port 161 through the opening 178. The heat preservation member 176 has a heat preservation effect, which can effectively prevent the temperature rise of the first storage space 111 from being too large when the reverse voltage is applied to defrost the cold heat exchanger 133. Preferably, the longitudinal section of the recessed portion 177 is arc-shaped, and the shape of the recessed portion 177 can actually be matched with the centrifugal fan 173 to avoid affecting the rotation of the centrifugal fan 173. A drain port 179 can be provided at the bottom of the recessed portion 177 to discharge the residual moisture at the centrifugal fan 173 during defrosting. When the cold heat exchanger 133 is defrosted, there may be residual moisture in the centrifugal fan 173, so the drain port 179 can drain the residual moisture in time to avoid affecting the operation of the centrifugal fan 173. Fig.11 As shown, the shapes of the bottom of the rear cover 172 and the insulation component 176 are matched, and the center of the bottom of the rear cover 172 and the insulation component 176 are higher than the two sides, so that the return air at the return air outlet 162 of the front cover 171 can pass smoothly and reach the bottom of the cold heat exchanger 133.

[0056] like Figure 7 , Figure 8 , Fig. 9 and Fig.11 As shown, a hood 166 may be provided at the air outlet 161 to guide the air blown out by the centrifugal fan 173 to the first storage space 111. The hood 166 guides the air supply direction to avoid short circuits between the air supply and the return air. In addition, a plurality of dividing ribs 167 may be evenly provided longitudinally inside the hood 166 to ensure uniform air supply. Figure 7 and Fig. 9As shown, a fixing groove 168 may also be provided on the front cover 171 , and a temperature sensor may be provided in the fixing groove 168 to detect the temperature of the first storage space 111 .

[0057] A limit position 169 can also be provided on the top of the front cover 171 to ensure that the air supply assembly 170 is installed in the correct position. Since the air supply assembly 170 can be provided on the back of the inner liner 115 of the first storage space 111, in fact, the bottom and top of the inner liner 115 cooperate to limit the path of air circulation. For example, in the process of the return air reaching the bottom of the cold heat exchanger 133 from the return air port 162, the bottom of the inner liner 115 is limited; in the process of the air heated by the cold heat exchanger 133 entering the air duct 160 through the air suction port 163, the top of the inner liner 115 is also limited. In short, after the air temperature of the first storage space 111 rises, the air is returned to the bottom of the cold heat exchanger 133 through the return air port 162, flows upward, passes through the cold heat exchanger 133, exchanges heat, enters the air duct 160 through the air suction port 163, and then blows out through the air supply port 161 through the centrifugal fan 173, thus forming an air circulation.

[0058] In the refrigerator 100 of this embodiment, the structure of the air supply assembly 170 matches the semiconductor refrigeration system 130, and the cold energy generated by the semiconductor refrigeration system 130 can be smoothly transmitted to the first storage space 111. In addition, the compression refrigeration system 140 reduces the temperature of the hot end 136 of the semiconductor refrigeration system 130, which can promote the semiconductor refrigeration system 130 to provide cold energy to the first storage space 111, thereby achieving deep refrigeration of the first storage space 111, meeting the storage requirements of food, and improving the storage effect of food.

[0059] Furthermore, the refrigerator 100 of this embodiment, the specific arrangement of the first shielding member 174, the second shielding member 175, and the protruding structures 165 on both sides of the volute 164 can ensure that the return air is completely heat exchanged through the cold heat exchanger 133, and avoid the return air from being sent to the first storage space 111 through other paths without heat exchange through the cold heat exchanger 133. There is a certain distance between the first shielding member 174 and the air inlet 163, which can ensure that the air after heat exchange can smoothly pass through the air inlet 163 into the air duct 160, and then be blown from the air supply port 161 to the first storage space 111 through the centrifugal fan 173. The overall structure of the air supply assembly 170 occupies a small volume and can ensure smooth air circulation.

[0060] Furthermore, in the refrigerator 100 of this embodiment, the low-temperature refrigerant of the compression refrigeration system 140 absorbs heat when flowing through the heat exchanger 132, thereby reducing the temperature of the hot end 136, and the temperature of the cold end 137 is reduced accordingly. After the coldness of the cold end 137 is transferred to the cold heat exchanger 133, the centrifugal fan 173 transfers the coldness of the cold heat exchanger 133 to the first storage space 111. In combination with the conventional compression refrigeration system 140 of the refrigerator 100, the heat of the heat exchanger 132 is quickly taken away by the low-temperature refrigerant, and the hot end 136 is maintained in a low-temperature environment. With the temperature difference between the hot end 136 and the cold end 137 of the semiconductor chip 131, the temperature of the cold end 137 is further reduced, and then the centrifugal fan 173 is used to exchange heat in a strong convection manner to achieve deep refrigeration of the first storage space 111. The energy consumption is low during the refrigeration process, and the semiconductor refrigeration system 130 directly converts energy from electrical energy, effectively avoiding noise and improving the user experience.

[0061] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived based on the content disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all these other variations or modifications.

Claims

1. A refrigerator, comprising: A box body, which defines at least a first storage space and a second storage space; A semiconductor refrigeration system, configured to provide cold energy to the first storage space; A compression refrigeration system configured to provide coldness to the second storage space and reduce the temperature of the hot end of the semiconductor refrigeration system; as well as An air supply assembly is arranged in the first storage space, and the air supply assembly includes a front cover, a rear cover and a centrifugal fan, The centrifugal fan is disposed in an air duct defined by the front cover and the rear cover, and is configured to transmit the cold energy generated by the semiconductor refrigeration system to the first storage space. The upper and lower parts of the front side of the front cover are respectively provided with an air supply port and an air return port, and the rear cover is provided with an air suction port at a position corresponding to the centrifugal fan. The semiconductor refrigeration system comprises: a cold heat exchanger, the cold heat exchanger is arranged at the rear side of the rear cover, and a plurality of fins are arranged on the side of the cold heat exchanger facing the rear cover, and a longitudinal channel is formed between two adjacent fins so that air flows through the cold heat exchanger for heat exchange; The height of the fins of the preset number in the middle is lower than the height of the fins on the left and right sides, and the air supply assembly further includes: a first shielding member, which is arranged on the front side of the preset number of fins; and two second shielding members, which are respectively arranged on the left and right sides of the cold heat exchanger; there are multiple return air inlets, and the return air inlet in the middle is smaller than the return air inlets on the left and right sides, so that most of the return air reaches the bottom of the cold heat exchanger through the return air inlets on the left and right sides, and then exchanges heat through the fins on the left and right sides of the cold heat exchanger; a smaller part of the return air reaches the bottom of the cold heat exchanger through the return air inlet in the middle, and then exchanges heat through the fins in the middle of the cold heat exchanger; A volute is provided at the air intake port of the rear cover, and raised structures are provided on both the left and right sides of the volute, so that there is a certain distance between the first shielding member and the air intake port. The first shielding member and the air intake port are positioned relative to each other, ensuring that the air heat exchanged by the cold heat exchanger can smoothly pass through the air intake port into the air duct.

2. The refrigerator according to claim 1, wherein: The semiconductor refrigeration system further comprises: a semiconductor chip and a heat exchanger, wherein the semiconductor chip is arranged between the heat exchanger and the cold heat exchanger, and The semiconductor chip has the hot end and the cold end, the hot heat exchanger is partially bonded to the hot end, and the cold heat exchanger is partially bonded to the cold end.

3. The refrigerator according to claim 2, wherein: The compression refrigeration system comprises: a compressor, a condenser, a capillary tube and an evaporator, and The heat exchanger is arranged between the capillary tube and the evaporator. The low-temperature refrigerant absorbs heat when flowing through the heat exchanger, thereby reducing the temperature of the hot end, and the temperature of the cold end also decreases accordingly. After the cold energy of the cold end is conducted to the cold heat exchanger, the centrifugal fan transfers the cold energy of the cold heat exchanger to the first storage space.

4. The refrigerator according to claim 1, wherein the air supply assembly further comprises: The heat-insulating component is arranged in the air duct, and a recess is formed on the side of the heat-insulating component facing the rear cover to arrange the centrifugal fan, and an opening is provided on the top of the heat-insulating component so that the wind blown out by the centrifugal fan can be blown toward the air supply port through the opening.

5. The refrigerator according to claim 4, wherein: The longitudinal section of the recessed portion is arc-shaped, A drainage port is provided at the bottom of the recessed portion to discharge residual water at the centrifugal fan during defrosting.

6. The refrigerator according to claim 1, wherein: The air supply port is provided with an air duct to guide the air blown out by the centrifugal fan to the first storage space; and A plurality of dividing ribs are evenly arranged longitudinally inside the air induced hood to ensure uniform air supply.

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