A temperature and pressure sensor
By using ceramic parts and pressure-sensitive components in the temperature pressure sensor and connecting conductive components through sealant, the sensor has solved the problems of poor thermal matching, poor sealing and low pressure resistance at high temperatures, and more stable and durable sensor performance.
Patent Information
- Application Number
- CN202011494261.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-12-17
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2040-12-17
AI Technical Summary
Existing temperature pressure sensors have poor thermal matching, poor sealing and low pressure resistance at high temperatures, resulting in liquid or air leakage.
Ceramic parts are directly installed with pressure-sensitive elements, and the ceramic parts and conductive elements are sealed and connected by sealing glue to ensure the thermal expansion of the ceramic parts and pressure-sensitive elements, and improve sealing and pressure resistance.
The thermal expansion of the ceramic parts and pressure-sensitive elements matches the stable performance. At the same time, the sealing connection between the ceramic parts and the conductive elements avoids air leakage, has a large pressure resistance and good sealing.
Smart Images

Figure CN112611504B_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present invention relate to the technical field of pressure sensors, and in particular to a temperature pressure sensor. Background Art
[0002] The temperature and pressure sensor is an integrated sensor that can measure the medium pressure and temperature at the same point at the same time. The temperature and pressure sensor is suitable for measuring the medium temperature while measuring the pressure, such as the pressure and temperature of the automobile air conditioner.
[0003] In the prior art, a TO socket is usually used to install a pressure chip, and the probe of the TO socket usually needs to be sealed by a glass insulator. However, the glass insulator seal is prone to microcracks at high temperatures and has poor thermal matching, which affects the sealing of the temperature and pressure sensor and may even cause liquid or gas leakage. In addition, the TO socket has a low pressure resistance due to the influence of the glass insulation seal. Summary of the invention
[0004] The purpose of the embodiments of the present invention is to provide a temperature and pressure sensor, aiming to solve the problems of poor thermal matching, poor sealing, and low pressure resistance of the temperature and pressure sensor at high temperatures.
[0005] In order to solve the above technical problems, an embodiment of the present invention provides a temperature and pressure sensor, comprising:
[0006] A housing having an installation cavity with upper and lower openings;
[0007] A ceramic component, which is arranged in the installation cavity and has a pressure hole therethrough, and the ceramic component is sealedly connected to the inner wall of the installation cavity to separate the installation cavity into an upper cavity and a medium channel;
[0008] A circuit board is mounted on the upper end of the ceramic member;
[0009] A pressure sensitive element is mounted on the upper surface of the ceramic member, covers the pressure hole and is electrically connected to the circuit board;
[0010] A conductive element, one end of which is electrically connected to the circuit board, and the other end of which passes through the ceramic component and is sealed and connected to the ceramic component by a sealant; and
[0011] The temperature sensitive element is electrically connected to the conductive element.
[0012] The present invention directly installs the pressure sensitive element on the ceramic part by setting a ceramic part. The thermal expansion of the ceramic part and the pressure sensitive element is well matched and the performance is stable. At the same time, the ceramic part and the conductive element are sealed and fixed by sealant. Compared with the traditional sealing using glass insulators, it is less likely to leak and has a higher pressure resistance.
[0013] Preferably, a stopper is provided at the other end of the conductive element, and an upper surface of the stopper is sealed and connected to the ceramic component by a sealant.
[0014] Preferably, the ceramic piece is provided with a accommodating groove with a notch facing downward at a position corresponding to the stopper, the stopper is accommodated in the accommodating groove, and the bottom wall of the accommodating groove is sealed and connected to the upper surface of the stopper by a sealant.
[0015] Preferably, the temperature sensitive element and the conductive element are elastically abutted against each other via an elastic structure, so that the temperature sensitive element and the conductive element are electrically connected.
[0016] Preferably, the elastic structure comprises a conductive spring sheet, one end of which is elastically abutted against the other end of the conductive element, and the other end of which is electrically connected to the temperature sensitive element.
[0017] Preferably, the conductive spring sheet comprises an abutting section extending obliquely upward, and a connecting section extending downward from the abutting section, the abutting section elastically abuts against the conductive element, and the connecting section is electrically connected to the temperature sensitive element;
[0018] The elastic structure further comprises an insulating seat, an upper end of which is provided with a mounting groove with an opening facing upward, and the abutting section is accommodated in the mounting groove.
[0019] Preferably, the insulating seat has a clamping portion, which is clamped in the pressure hole and has an interference fit with the inner wall of the pressure hole.
[0020] Preferably, the clamping portion includes a plurality of protrusions extending upward from the insulating seat, the plurality of protrusions form an installation center, and each of the protrusions extends obliquely upward away from the installation center.
[0021] Preferably, the conductive element is a metal probe, a clearance hole is provided on the ceramic piece, and the metal probe is arranged through the clearance hole.
[0022] Preferably, a protective cover is installed at the lower opening of the shell;
[0023] The temperature sensitive element extends out of the lower end opening of the installation cavity and is accommodated in the protective cover. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0025] Figure 1A three-dimensional diagram of an embodiment of a temperature and pressure sensor provided by the present invention;
[0026] Figure 2 for Figure 1 Schematic diagram of the decomposition of
[0027] Figure 3 for Figure 1 A cross-sectional view of
[0028] Figure 4 for Figure 1 A partial schematic diagram of an embodiment of a middle protective cover;
[0029] Figure 5 for Figure 1 A partial schematic diagram of an embodiment of a structure of the middle part;
[0030] Figure 6 for Figure 5 Schematic diagram of the decomposition of
[0031] Figure 7 for Figure 6 Schematic diagram of the decomposition of the middle part structure;
[0032] Figure 8 for Figure 7 A partial schematic diagram of an embodiment of a middle insulating seat;
[0033] Fig. 9 for Figure 8 A cross-sectional view of
[0034] Fig.10 for Figure 5 A cross-sectional view from one perspective.
[0035] Description of the accompanying drawings of the present invention:
[0036] Label name Label name 100 Temperature and pressure sensors 71 Conductive shrapnel 1 case 711 Abutment section 11 Mounting cavity 712 Connection segment 2 Ceramic parts 72 Insulation seat 21 Pressure hole 721 Mounting slot 22 Make way hole 722 Card connection 23 Storage tank 7221 Protrusion 3 Circuit Board 723 First Channel 4 Pressure sensitive element 724 Card slot 5 Conductive components 8 Protective case 51 Metal probe 81 Vent 511 Stopper 82 Snap-in 6 Temperature sensitive components 9 Terminal 7 Elastic structure 10 Sealing ring
[0037] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0039] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0040] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0041] Figures 1 to 10 A schematic diagram of the temperature and pressure sensor provided by the present invention is shown. Figures 1 to 3 The present invention provides a temperature and pressure sensor 100, which includes a shell 1, a ceramic part 2, a circuit board 3, a pressure sensitive element 4, a conductive element 5 and a temperature sensitive element 6. The shell 1 has an installation cavity 11 with upper and lower openings. The ceramic part 2 is arranged in the installation cavity 11 and is penetrated by a pressure hole 21. The ceramic part 2 is sealed and connected to the inner wall of the installation cavity 11 to separate the installation cavity 11 into an upper cavity and a medium channel. The circuit board 3 is installed at the upper end of the ceramic part 2. The pressure sensitive element 4 (in this embodiment, the pressure sensitive element 4 is a pressure chip) is installed on the upper surface of the ceramic part 2, covers the pressure hole 21 and is electrically connected to the circuit board 3. One end of the conductive element 5 is electrically connected to the circuit board 3, and the other end passes through the ceramic part 2 and is sealed and connected to the ceramic part 2 by a sealant (not shown in the figure). The temperature sensitive element 6 (in this embodiment, the temperature sensitive element 6 is a temperature sensor) is electrically connected to the conductive element 5.
[0042] The present invention directly mounts the pressure sensitive element 4 on the ceramic part 2 by setting the ceramic part 2. The thermal expansion of the ceramic part 2 and the pressure sensitive element 4 is well matched, and the performance is stable. At the same time, the ceramic part 2 and the conductive element 5 are sealed and fixed by a sealant. Compared with the traditional sealing using a glass insulator, it is not easy to leak and has a high pressure resistance.
[0043] Furthermore, glass insulators are traditionally used for sealing, which is prone to leakage at high temperatures (glass insulators usually leak at around 150°C), and the cost of using ceramic metallization technology is too high. The present invention uses sealant to seal the ceramic part 2 and the conductive element 5 (in this embodiment, silicone is usually used, and the temperature resistance of silicone is usually above 180°C). The sealing effect at high temperatures is better than that of glass insulators, and the cost is low.
[0044] In order to facilitate installation and increase the contact area between the sealant and the conductive element 5, a stopper 511 is provided at the other end of the conductive element 5, and the upper surface of the stopper 511 is sealed and connected to the ceramic part 2 by the sealant. In this embodiment, the sealant is silicone. The temperature and pressure sensor 100 can be an air-conditioning temperature and pressure sensor, or a temperature and pressure sensor 100 for measuring other scenarios. When the temperature and pressure sensor 100 is an air-conditioning temperature and pressure sensor, the sealant is refrigerant-resistant silicone.
[0045] Specifically, see Fig.10 The ceramic part 2 is provided with a receiving groove 23 with a notch facing downward at a position corresponding to the stopper 511, the stopper 511 is received in the receiving groove 23, and the bottom wall of the receiving groove 23 is sealed and connected with the upper surface of the stopper 511 by a sealant.
[0046] The connection between the temperature sensitive element 6 and the conductive element 5 can be welded or other electrical connection methods. In this embodiment, the temperature sensitive element 6 and the conductive element 5 are elastically abutted by the elastic structure 7 to make the temperature sensitive element 6 and the conductive element 5 conductive. The present invention uses the temperature sensitive element 6 and the conductive element 5 to elastically abut to make the temperature sensitive element 6 and the conductive element 5 conductive, which is simpler to connect and occupies less space. The elastic abutment makes the connection more stable. Specifically, the elastic structure 7 elastically abuts against the stopper 511, which can increase the contact surface and make the abutment effect more stable.
[0047] When detecting temperature and pressure, after the measured medium (in this embodiment, the temperature and pressure sensor 100 is an air conditioning temperature sensor, and the measured medium is air) enters the medium channel, the temperature is sensed by the temperature sensitive element 6, and the measured medium entering the pressure hole 21 through the medium channel contacts the back side of the pressure sensitive element 4, so that the pressure is sensed by the pressure sensitive element 4.
[0048] The elastic structure 7 can be arranged in various forms. For example, a conductive sheet can be arranged on the elastic element. The conductive sheet is elastically abutted against the other end of the conductive element 5 through the elastic element. The conductive sheet is electrically connected to the temperature sensitive element 6. In other embodiments, please refer to Figures 5 to 7, the elastic structure 7 may also include a conductive spring 71, one end of which elastically abuts against the other end of the conductive element 5, and the other end of which is electrically connected to the temperature sensitive element 6. Specifically, the conductive spring 71 includes an abutting section 711 extending obliquely upward, and a connecting section 712 extending downward from the abutting section 711. The abutting section 711 elastically abuts against the conductive element 5, and the connecting section 712 is electrically connected to the temperature sensitive element 6. In order to facilitate the installation of the conductive spring 71, the elastic structure 7 also includes an insulating seat 72. The upper end of the insulating seat 72 is provided with a mounting groove 721 with an opening facing upward, and the abutting section 711 is accommodated in the mounting groove 721, so that misalignment and offset can be prevented. In this embodiment, the insulating seat 72 is a plastic part. Specifically, the insulating seat 72 is provided with a first channel 723 opposite to the pressure hole 21, which is used for the measured medium to pass through and flow into the pressure hole 21.
[0049] During installation, the insulating seat 72 is fixedly connected with the ceramic part 2. Specifically, the insulating seat 72 has a clamping portion 722, which is clamped in the pressure hole 21 and has an interference fit with the inner wall of the pressure hole 21. In this embodiment, the clamping portion 722 includes a plurality of protrusions 7221 extending upward from the insulating seat 72, and the plurality of protrusions 7221 form an installation center. Each of the protrusions 7221 extends upward away from the installation center, so that the plurality of protrusions 7221 will have an interference fit after being clamped into the pressure hole 21 and will not easily fall out. The installation center can be the central position formed by the plurality of protrusions 7221.
[0050] In this embodiment, the conductive element 5 is a metal probe 51, and a clearance hole 22 is provided on the ceramic part 2, and the metal probe 51 is arranged through the clearance hole 22. The sealant can be poured into the clearance hole 22 after the metal probe 51 passes through the clearance hole 22, or it can be poured without being specifically limited here.
[0051] To protect the temperature sensitive components 6, please refer to Figure 3 and Figure 4 The lower opening of the housing 1 is provided with a protective cover 8; the temperature sensitive element 6 extends out of the lower opening of the mounting cavity 11 and is accommodated in the protective cover 8. Furthermore, the protective cover 8 is provided with a plurality of vents 81, and the measured medium directly contacts the temperature sensitive element 6 through the vents 81, so that the detected temperature is more direct and accurate. For the convenience of installation, the protective cover 8 is snap-fitted with the insulating seat 72. In this embodiment, please refer to Figure 3 , Figure 8 as well as Fig. 9The periphery of the insulating seat 72 and the protective sleeve 8, one of which is provided with a snap-in groove 724, and the other is provided with a snap-in portion 82 for snap-fitting with the snap-in groove 724.
[0052] See also Figures 1 to 3 The temperature and pressure sensor 100 further includes a terminal 9, which can be a conventional terminal 9 in the art and is not specifically limited here. In this embodiment, the terminal 9 is a plastic part, so it can resist various chemicals.
[0053] The bottom wall of the installation cavity 11 is recessed toward the direction close to the medium channel to form a groove, and the bottom wall of the groove is sealed with the lower end of the ceramic member 2. In this embodiment, a sealing ring 10 can be provided between the bottom wall of the groove and the lower end of the ceramic member 2, and the sealing ring 10 is used to seal. The sealing ring 10, the lower end of the ceramic member 2 and the bottom wall of the groove are surrounded to form a cavity, and the other end of the conductive element 5 is accommodated in the cavity, so that when the measured medium enters the pressure hole 21 from the medium channel, leakage is prevented and the front and back sides of the pressure sensitive element 4 are separated.
[0054] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.
Claims
1. A temperature and pressure sensor, characterized in that: include: A housing having an installation cavity with upper and lower openings; A ceramic component, which is arranged in the installation cavity and has a pressure hole therethrough, and the ceramic component is sealedly connected to the inner wall of the installation cavity to separate the installation cavity into an upper cavity and a medium channel; A circuit board is mounted on the upper end of the ceramic member; A pressure sensitive element is mounted on the upper surface of the ceramic member, covers the pressure hole and is electrically connected to the circuit board; A conductive element, one end of which is electrically connected to the circuit board, and the other end of which passes through the ceramic component and is sealed and connected to the ceramic component by a sealant, wherein a clearance hole is provided on the ceramic component, and the conductive element passes through the clearance hole; and a temperature sensitive element, electrically connected to the conductive element; Among them, the temperature sensitive element and the conductive element are elastically abutted by an elastic structure so that the temperature sensitive element and the conductive element are conductive; the elastic structure includes a conductive spring sheet, one end of the conductive spring sheet is elastically abutted against the other end of the conductive element, and the other end is electrically connected to the temperature sensitive element.
2. The temperature and pressure sensor according to claim 1, characterized in that: A stopper is provided at the other end of the conductive element, and an upper surface of the stopper is sealed and connected to the ceramic component by a sealant.
3. The temperature and pressure sensor according to claim 2, characterized in that: The ceramic piece is provided with a receiving groove with a notch facing downward at a position corresponding to the stopper, the stopper is received in the receiving groove, and the bottom wall of the receiving groove is sealed and connected to the upper surface of the stopper by a sealant.
4. The temperature and pressure sensor according to claim 1, characterized in that: The conductive spring sheet includes a contact section extending obliquely upward, and a connecting section extending downward from the contact section, the contact section elastically contacts the conductive element, and the connecting section is electrically connected to the temperature sensitive element; The elastic structure further comprises an insulating seat, an upper end of which is provided with a mounting groove with an opening facing upward, and the abutting section is accommodated in the mounting groove.
5. The temperature and pressure sensor according to claim 4, characterized in that: The insulating seat is provided with a clamping portion, which is clamped in the pressure hole and is interference-fitted with the inner wall of the pressure hole.
6. The temperature and pressure sensor according to claim 5, characterized in that: The clamping portion includes a plurality of protrusions extending upward from the insulating seat, wherein the plurality of protrusions form an installation center, and each of the protrusions extends upward and away from the installation center.
7. The temperature and pressure sensor according to claim 1, characterized in that: The conductive element is a metal probe.
8. The temperature and pressure sensor according to claim 1, characterized in that: A protective cover is installed at the lower opening of the shell; The temperature sensitive element extends out of the lower end opening of the installation cavity and is accommodated in the protective cover.
Citation Information
Patent Citations
Pressure temperature sensing module
CN207423260U
Temperature pressure sensor
CN214010393U
Temperature pressure sensor
CN214010629U