Packaging film

Abstract

The present application relates to a packaging film, an organic electronic device including the same, and a method for manufacturing the organic electronic device using the same, and provides a packaging film that can form a structure that can block moisture or oxygen from the outside from being introduced into the organic electronic device, thereby effectively releasing heat accumulated in the organic electronic device and preventing degradation of the organic electronic device.

Description

Technical Field

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority based on Korean Patent Application No. 10-2018-0104550, filed on September 3, 2018, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0004] The present invention relates to an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same. Background Art

[0005] An organic electronic device (OED) means a device including an organic material layer that generates alternating current of charges using holes and electrons, and examples thereof may include a photovoltaic device, a rectifier, an emitter, an organic light emitting diode (OLED), and the like.

[0006] Organic light emitting diodes (OLEDs) in the above organic electronic devices have lower power consumption and faster response speed than existing light sources, and are conducive to making display devices or lighting devices thinner. In addition, OLEDs have space availability and are therefore expected to be applied to various fields, including various portable devices, monitors, notebook computers, and TVs.

[0007] In the commercialization and application expansion of OLED, the most important issue is the durability issue. Organic materials and metal electrodes, etc. contained in OLED can be easily oxidized by external factors such as moisture, and if the heat generated when driving the OLED panel cannot be released smoothly, the degradation of the components due to the increase in temperature becomes a problem and the warping of the panel when operating at a high temperature becomes a problem. Therefore, various methods that can effectively block the penetration of oxygen or moisture, etc. from the outside into organic electronic devices such as OLED and at the same time effectively release the heat generated from the OLED and prevent the warping of the panel have been proposed. Summary of the invention

[0008] Technical issues

[0009] The present application provides an encapsulation film that can form a structure capable of blocking moisture or oxygen from the outside from being introduced into an organic electronic device, thereby effectively releasing heat accumulated in the organic electronic device and maintaining heat resistance durability under severe conditions such as high temperature and high humidity.

[0010] Technical Solution

[0011] The present application relates to a packaging film, which can be used to package a layer or an organic electronic device such as an OLED.

[0012] In this specification, the term "organic electronic device" means a product or device having a structure including an organic material layer that generates an alternating current of charges using holes and electrons between a pair of electrodes facing each other, and examples thereof may include but are not limited to photovoltaic devices, rectifiers, emitters, and organic light emitting diodes (OLEDs), etc. In one example of the present application, the organic electronic device may be an OLED.

[0013] The exemplary organic electronic element encapsulation film 10 includes an encapsulation layer 11 for encapsulating an organic electronic element and two or more metal layers 12 and 13, such as Figure 1 As shown. The metal layer may be present on the encapsulation layer, but is not limited thereto. The horizontal thermal resistance of the encapsulation film of the present application as measured according to ISO 22007-2 may be 800K / W or less. The lower limit of the horizontal thermal resistance is not particularly limited, but may be, for example, 3K / W, 5K / W, 8K / W, 10K / W or 15K / W or greater. In addition, the upper limit of the horizontal thermal resistance may be 750K / W or less, 700K / W or less, 600K / W or less, 500K / W or less, 450K / W or less, 400K / W or less, 350K / W or less, 300K / W or less, 250K / W or less, 200K / W or less, 180K / W or less, 130K / W or less, 100K / W or less, 80K / W or less, or 50K / W or less. The horizontal thermal resistance can be measured in the direction in which the metal layer exists in the packaging film having a multilayer structure, and can be measured for a unit horizontal area (1m×1m). After measuring the thermal conductivity, the horizontal thermal resistance can be calculated using the formation information of the film (such as thickness), which can be calculated by methods known in the art. By adjusting the horizontal thermal resistance of the packaging film within the above range, the present application can achieve moisture barrier properties while maximizing the heat dissipation effect, and achieve durable reliability by preventing panel warping defects in harsh environments such as high temperature and high humidity.

[0014] In the present specification, the term metal layer may mean the entire metal layer having a multi-layer structure, and the multi-layers constituting the metal layer may be referred to as a first layer and a second layer to be described below.

[0015] The horizontal thermal resistance defined herein is the reciprocal of the thermal conductivity and has a unit of K (Kelvin) / W (watt) or ° C / W. The thermal conductivity means the ratio of the amount of heat flowing through an object per unit area and per unit time to the temperature difference between the two surfaces of the object, that is, the value obtained by dividing the thermal conductivity by the length of the heat transfer direction.

[0016] In one embodiment of the present application, the metal layer may include a first layer and a second layer. For example, the metal layer may be a metal layer having a two-layer structure consisting of a first layer and a second layer, and the metal layer may have a structure including two or more first layers or three layers or more layers including two or more second layers. In one example, the metal layer may include a first layer formed on the encapsulation layer and a second layer formed on the first layer and having a component different from the first layer. The first layer in the metal layer with a multilayer structure may be arranged to contact the encapsulation layer (even if it is not necessary to contact the encapsulation layer, it may be arranged to face the encapsulation layer), and the second layer (for example, it may be illustrated as the first layer / second layer or the first layer / second layer / first layer, etc.) or the first layer (for example, it may be illustrated as the first layer / first layer / second layer, etc.) may also be arranged on the first layer. By adjusting the structure and the lamination order, the present application can simultaneously achieve heat dissipation performance and durable reliability at high temperature and high humidity.

[0017] The thermal conductivity of the metal layer may be 50 W / m·K to 800 W / m·K. The encapsulation layer may seal the entire surface of the organic electronic element formed on the substrate. By providing an encapsulation film of the above structure, in addition to the moisture barrier properties, the present application may also effectively release the heat accumulated inside the organic electronic element, and may prevent residual images (aging) caused by degradation occurring in the organic electronic device.

[0018] In one example, the metal layer and the encapsulation layer in the encapsulation film of the present application are integrally arranged. Conventionally, the encapsulation layer is first applied to the organic electronic element, and then the metal layer is applied separately, but in the present application, the encapsulation film integrally including the metal layer and the encapsulation layer can be applied to the organic electronic element. The integrated encapsulation film is conducive to convenient processing and minimizes the alignment error in the multilayer structure, thereby realizing a packaging structure with high reliability.

[0019] In one example, the thermal conductivity of the metal layer may be, for example, 50 W / m·K to 800 W / m·K. The thermal conductivity may be 50 W / m·K or greater, 80 W / m·K or greater, 90 W / m·K or greater, 100 W / m·K or greater, 110 W / m·K or greater, 120 W / m·K or greater, 130 W / m·K or greater, 140 W / m·K or greater, 150 W / m·K or greater, 200 W / m·K or greater, or 210 W / m·K or greater. The upper limit of the thermal conductivity is not particularly limited, and it may be 800 W / m·K or less or 700 W / m·K or less. In addition, the linear expansion coefficient of the metal layer may be within the following range: 20ppm / ℃ or less, 18ppm / ℃ or less, 15ppm / ℃ or less, 13ppm / ℃ or less, 9ppm / ℃ or less, 5ppm / ℃ or less, or 3ppm / ℃ or less. The lower limit of the linear expansion coefficient is not particularly limited, but may be 0ppm / ℃ or greater, or 0.1ppm / ℃ or greater. Since the encapsulation film includes two or more layers of metal layers, the present application can simultaneously achieve heat dissipation effect and durable reliability at high temperatures.

[0020] In one embodiment of the present application, as described above, the metal layer may include a first layer and a second layer, and the component constituting the second layer may be different from the component constituting the first layer. The component constituting the second layer may have a lower thermal conductivity than the component constituting the first layer, and the component constituting the first layer may have a higher linear expansion coefficient than the component constituting the second layer, but is not limited thereto.

[0021] The thermal conductivity of the component constituting the first layer of the metal layer may be 50 W / m·K or greater, 80 W / m·K or greater, 90 W / m·K or greater, 100 W / m·K or greater, 110 W / m·K or greater, 120 W / m·K or greater, 130 W / m·K or greater, 140 W / m·K or greater, 150 W / m·K or greater, 200 W / m·K or greater, or 210 W / m·K or greater. The upper limit of the thermal conductivity is not particularly limited, and it may be 800 W / m·K or less or 700 W / m·K or less. As described above, the metal layer has a high thermal conductivity, whereby the heat generated at the bonding interface during the metal layer bonding process can be released more quickly. In addition, the high thermal conductivity allows the heat accumulated during the operation of the organic electronic device to be released quickly, whereby the temperature of the organic electronic device itself can be kept low, and the occurrence of cracks and defects can be reduced. Thermal conductivity can be measured at any temperature between 0°C and 30°C.

[0022] In this specification, the term "thermal conductivity" is a measure of the ability of a material to transfer heat by conduction, wherein the unit may be represented by W / m·K. The unit represents the degree to which a material transfers heat at the same temperature and distance, which means the unit of heat (watt) to the unit of distance (meter) and the unit of temperature (Kelvin). In this specification, thermal conductivity may mean thermal conductivity measured according to ASTM E1461 or ISO 22007-2. Thermal conductivity may be calculated using thermal diffusivity measured according to ASTM E1461 and a known specific heat value.

[0023] In one example, the encapsulation film of the present application may include not only a first layer component having the above-mentioned thermal conductivity range, but also a second layer component having a low thermal conductivity but a higher linear expansion coefficient relative to the first layer component. By including a metal layer of two or more layers as above, the present application can achieve the physical properties and thermal conductivity required when applied to the encapsulation of organic electronic components. For example, the linear expansion coefficient of the second layer component may be in the following range: 20ppm / ℃ or less, 18ppm / ℃ or less, 15ppm / ℃ or less, 13ppm / ℃ or less, 9ppm / ℃ or less, 5ppm / ℃ or less, or 3ppm / ℃ or less. The lower limit of the linear expansion coefficient is not particularly limited, but may be 0ppm / ℃ or greater, or 0.1ppm / ℃ or greater. By controlling the linear expansion coefficient of the second layer component, the present application can achieve dimensional stability and durability reliability of the film in the panel driven at high temperature. The linear expansion coefficient can be measured according to the standard of ASTME831.

[0024] In one embodiment of the present application, the thickness ratio of the first layer to the second layer in the encapsulation film (first layer thickness / second layer thickness) may be in the range of 0.85 to 40. The lower limit of the thickness ratio is not particularly limited, but may be 0.9, 1.0, 1.1, 1.3, 1.5, 1.8, 2.3, 2.8, 3.3 or 3.8. In addition, the upper limit of the thickness ratio is not particularly limited, but may be 4.3, 4.2, 4.1 or 4.0. In addition, in one embodiment of the present application, the thickness of the first layer may be in the range of 2 μm to 3,500 μm. The lower limit of the thickness of the first layer may be 4 μm, 6 μm, 10 μm, 25 μm, 35 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 100 μm, 110 μm, 200 μm, 500 μm, 1,000 μm, 1,500 μm, 2,000 μm, 2,500 μm, or 2,800 μm. The upper limit of the thickness of the first layer may be 3,300 μm, 3,100 μm, 2,900 μm, 2,600 μm, 2,100 μm, 1,800 μm, 1,200 μm, 800 μm, 400 μm, or 90 μm. In addition, the thickness of the second layer may be in the range of 10 μm to 2,500 μm. The lower limit of the thickness of the second layer can be 18 μm, 25 μm, 33 μm, 43 μm, 50 μm, 55 μm, 60 μm, 70 μm, 100 μm, 500 μm, 1,000 μm, 1,500 μm or 2,000 μm, and the upper limit of the thickness of the second layer can be 2,300 μm, 1,800 μm, 1,300 μm, 800 μm, 400 μm or 90 μm. By adjusting the thickness of the two layers, in the film applied to the encapsulation of organic electronic components, the present application can effectively dissipate the heat accumulated in the organic electronic device while improving the durability reliability of the film, such as dimensional stability.

[0025] In one embodiment of the present application, the metal layer of the encapsulation film may be transparent or may be opaque. The total thickness of the metal layer of the multilayer structure may be in the range of 3 μm to 6,000 μm, 10 μm to 5,000 μm, 20 μm to 4,000 μm, 30 μm to 2,000 μm or 40 μm to 1,000 μm. By controlling the thickness of the metal layer, the present application can provide an encapsulation film as a thin film while fully realizing the heat dissipation effect. The metal layer may be a thin metal foil or a polymer base layer deposited with a metal. The metal layer is not particularly limited as long as it meets the above-mentioned thermal conductivity or linear expansion coefficient and is a material containing metal. The metal layer may include any one of a metal, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal boron oxide, and a combination thereof. For example, the metal layer may include an alloy in which one or more metal elements or non-metallic elements are added to a metal, and may include, for example, Invar, stainless steel (SUS), or an alloy of iron and carbon (carbon steel, mild steel). The alloy of iron and carbon can include such steel: it has a carbon content generally in the range of 0.02 wt % to 2 wt % and also has a small amount of silicon, manganese, phosphorus, sulfur, etc. In addition, in an example, the metal layer can include iron, chromium, copper, aluminum, nickel, iron oxide, chromium oxide, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof. The metal layer can be deposited by electrolysis, rolling, thermal evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma chemical vapor deposition or electron cyclotron resonance source plasma chemical vapor deposition. In an example of the present application, the metal layer can be deposited by reactive sputtering.

[0026] In one embodiment of the present application, the metal layers of two or more layers constituting the encapsulation film can be attached by a pressure-sensitive adhesive or an adhesive. The metal layers of two or more layers can be laminated via a pressure-sensitive adhesive or an adhesive, wherein the material of the pressure-sensitive adhesive or the adhesive is not particularly limited, and known materials can be used. In one example, the pressure-sensitive adhesive or the adhesive can be an acrylic, epoxy-based, urethane-based, silicone-based or rubber-based pressure-sensitive adhesive or adhesive. In addition, in one embodiment, the material of the pressure-sensitive adhesive or the adhesive can be the same or different from the material of the encapsulation layer to be described below.

[0027] In addition, the metal layers of two or more layers constituting the encapsulation film may be directly attached to each other. The meaning of direct attachment herein may mean that the two layers are in contact and attached to each other without any other layer between the two layers. As a method of directly attaching the metal layers of two or more layers, methods known in the art can be used. In one example, the two metal layers of the present application can be laminated by directly welding, rolling, casting or extruding one of the two metal layers to another layer. In addition, the present application is not limited to the above, and a method of depositing the material of another metal layer on one of the metal layers is also possible.

[0028] In one embodiment of the present application, the encapsulation layer may be formed as a single layer or two or more layers, and when the encapsulation layer is two or more layers, at least one of the metal layers may be present between the two or more encapsulation layers. For example, the above-mentioned first layer may be present between the two or more encapsulation layers, wherein the encapsulation film may have a lamination sequence of a second layer, an encapsulation layer, a first layer, and an encapsulation layer.

[0029] In one example, at least one of the metal layers may be magnetic. Since at least one of the metal layers is magnetic, it can be processed by magnetic force, thereby further improving the processing efficiency. In the present application, the second layer of the metal layer may be magnetic, but is not limited thereto.

[0030] In one embodiment of the present application, as described above, the encapsulation layer can have a single layer or a multilayer structure of two or more layers. When two or more layers constitute the encapsulation layer, the composition of each layer in the encapsulation layer can be the same or different. In an example, the encapsulation layer can be a pressure-sensitive adhesive layer or an adhesive layer comprising a pressure-sensitive adhesive composition or an adhesive composition.

[0031] In one embodiment of the present invention, the encapsulation layer may include an encapsulation resin. The encapsulation resin may include a cross-linkable resin or a curable resin.

[0032] In one example, the glass transition temperature of the encapsulating resin may be lower than 0° C., lower than -10° C., or lower than -30° C., lower than -50° C., or lower than -60° C., and the lower limit may be, for example, 200° C. Here, the glass transition temperature may be the glass transition temperature after curing, and in one embodiment, it may mean the glass transition temperature after curing with an irradiation level of about 1 J / cm 2 The glass transition temperature after the encapsulation resin is irradiated with ultraviolet rays of 1000 nm or greater; or the glass transition temperature after ultraviolet irradiation and further thermal curing.

[0033] In one example, the encapsulation resin may include styrene resin or elastomer, polyolefin resin or elastomer, other elastomers, polyoxyalkylene resin or elastomer, polyester resin or elastomer, polyvinyl chloride resin or elastomer, polycarbonate resin or elastomer, polyphenylene sulfide resin or elastomer, a mixture of hydrocarbons, polyamide resin or elastomer, acrylate resin or elastomer, epoxy resin or elastomer, silicone resin or elastomer, fluororesin or elastomer, or a mixture thereof, etc.

[0034] Here, as styrene resin or elastomer, for example, styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), acrylonitrile-butadiene-styrene block copolymer (ABS), acrylonitrile-styrene-acrylate block copolymer (ASA), styrene-butadiene-styrene block copolymer (SBS), styrene homopolymer, or a mixture thereof can be exemplified. As olefin resin or elastomer, for example, high-density polyethylene resin or elastomer, low-density polyethylene resin or elastomer, polypropylene resin or elastomer, or a mixture thereof can be exemplified. As elastomer, for example, ester thermoplastic elastomer, olefin elastomer, silicone elastomer, acrylic elastomer, or a mixture thereof can be used. In particular, as olefin thermoplastic elastomer, polybutadiene resin or elastomer or polyisobutylene resin or elastomer can be used. As polyoxyalkylene resin or elastomer, for example, polyoxymethylene resin or elastomer, polyethylene oxide resin or elastomer, or a mixture thereof can be exemplified. As polyester resin or elastomer, for example, polyethylene terephthalate resin or elastomer, polybutylene terephthalate resin or elastomer, or mixtures thereof can be exemplified. As polyvinyl chloride resin or elastomer, for example, polyvinylidene chloride can be exemplified. As hydrocarbon mixture, for example, hexatriacotane or paraffin can be exemplified. As polyamide resin or elastomer, for example, nylon can be exemplified. As acrylate resin or elastomer, for example, polybutyl (meth)acrylate can be exemplified. As the epoxy resin or elastomer, for example, there can be exemplified a bisphenol type such as bisphenol A type, bisphenol F type, bisphenol S type and hydrogenated products thereof; a novolac type such as phenol novolac type or cresol novolac type; a nitrogen-containing cyclic type such as triglycidyl isocyanurate type or hydantoin type; an alicyclic type; an aliphatic type; an aromatic type such as naphthalene type and biphenyl type; a glycidyl type such as glycidyl ether type, glycidyl amine type and glycidyl ester type; a dicyclic type such as dicyclopentadiene type; an ester type; an ether ester type; or a mixture thereof; etc. As the silicone resin or elastomer, for example, there can be exemplified polydimethylsiloxane and the like. Examples of the fluororesin or elastomer include polytrifluoroethylene resin or elastomer, polytetrafluoroethylene resin or elastomer, polychlorotrifluoroethylene resin or elastomer, polyhexafluoropropylene resin or elastomer, polyvinylidene fluoride, polyvinyl fluoride, polyethylene fluoride, or mixtures thereof.

[0035] The resins or elastomers listed above can also be used in the following ways: for example, by grafting with maleic anhydride or the like, by copolymerizing with other resins or elastomers via monomers used to produce the resins or elastomers, and by modification with other compounds. Examples of the above other compounds can include carboxyl-terminated butadiene-acrylonitrile copolymers, etc.

[0036] In one example, the encapsulation layer may include, but is not limited to, olefin elastomers, silicone elastomers, acrylic elastomers, etc. among the above types as the encapsulation resin.

[0037] In one embodiment of the present invention, the encapsulating resin may be an olefin-based resin. In one example, the olefin-based resin may be a homopolymer of a butene monomer; a copolymer obtained by copolymerizing a butene monomer with another polymerizable monomer; a reactive oligomer using a butene monomer; or a mixture thereof. The butene monomer may include, for example, 1-butene, 2-butene, or isobutylene.

[0038] Other monomers polymerizable with the butene monomer or derivative may include, for example, isoprene, styrene, or butadiene, etc. By using the copolymer, physical properties such as processability and crosslinking degree can be maintained, and thus heat resistance of the adhesive itself can be ensured when applied to an organic electronic device.

[0039] In addition, the reactive oligomer using butene monomer can include butene polymers with reactive functional groups. The weight average molecular weight of the oligomer can be 500 to 5000. In addition, butene polymers can be combined with other polymers with reactive functional groups. Other polymers can be but are not limited to (meth) alkyl acrylates. The reactive functional group can be hydroxyl, carboxyl, isocyanate or nitrogen-containing groups. In addition, the reactive oligomer and other polymers can be cross-linked by a multifunctional crosslinking agent, and the multifunctional crosslinking agent can be selected from at least one of isocyanate crosslinking agents, epoxy crosslinking agents, aziridine crosslinking agents and metal chelate crosslinking agents.

[0040] In one example, the encapsulation resin of the present application can be a copolymer of a diene and an olefin compound containing a carbon-carbon double bond. Here, the olefin compound can include butene, etc., and the diene can be a monomer that can be polymerized with the olefin compound, and can include, for example, isoprene or butadiene, etc. For example, the copolymer of an olefin compound containing a carbon-carbon double bond and a diene can be butyl rubber.

[0041] In the encapsulation layer, the weight average molecular weight (Mw) of the resin or elastomer component can reach the extent that the pressure-sensitive adhesive composition can be formed into a film shape. That is, even if the encapsulation layer is in an uncured state at room temperature, it can also be a solid phase or a semi-solid phase. In this specification, room temperature can mean, for example, 15°C to 35°C or about 25°C. In one example, the weight average molecular weight of the resin or elastomer can be about 100,000 to 2,000,000, 120,000 to 1,500,000 or 150,000 to 1,000,000 or so. The term weight average molecular weight herein means the value converted to standard polystyrene measured by GPC (gel permeation chromatography). However, the resin or elastomer does not have to have the above-mentioned weight average molecular weight. For example, in the case where the molecular weight of the resin or elastomer component is not at a level sufficient to form a film, a separate binder resin can be blended into the pressure-sensitive adhesive composition.

[0042] In another embodiment, the encapsulation resin according to the present application is a curable resin, which can be, for example, a resin having a glass transition temperature of 85°C or higher and 200°C or lower after curing. The glass transition temperature can be the glass transition temperature after the encapsulation resin is photocured or thermally cured. The specific types of curable resins available in the present invention are not particularly limited, for example, various thermosetting resins or photocurable resins known in the art can be used. The term "thermosetting resin" means a resin that can be cured by appropriate heat application or aging process, and the term "photocurable resin" means a resin that can be cured by irradiation with electromagnetic waves. In addition, the curable resin can be a dual-curing resin including both thermal curing properties and photocuring properties.

[0043] The specific type of curable resin in the present application is not particularly limited, as long as it has the above-mentioned characteristics. For example, the curable resin can be cured to exhibit adhesive properties, which may include such a resin: the resin contains one or more thermosetting functional groups (such as glycidyl, isocyanate, hydroxyl, carboxyl or amide) or contains one or more functional groups that can be cured by irradiation with electromagnetic waves (such as epoxy, cyclic ether, sulfide, acetal or lactone). Specific examples of such resins may include acrylic resins, polyester resins, isocyanate resins or epoxy resins, etc., but are not limited thereto.

[0044] In the present application, as curable resin, aromatic or aliphatic, or linear or branched epoxy resin can be used. In one embodiment of the present invention, an epoxy resin having an epoxy equivalent of 180g / equivalent to 1,000g / equivalent containing two or more functional groups can be used. By using an epoxy resin with an epoxy equivalent in the above range, the characteristics of the cured product such as adhesion and glass transition temperature can be effectively maintained. The example of such epoxy resin can include one or a mixture of two or more of the following: cresol novolac epoxy resin, bisphenol A type epoxy resin, bisphenol A type novolac epoxy resin, phenol novolac epoxy resin, tetrafunctional epoxy resin, biphenyl type epoxy resin, trisphenol methane type epoxy resin, alkyl-modified trisphenol methane epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin or dicyclopentadiene modified phenol type epoxy resin.

[0045] In the present application, as curable resin, epoxy resin containing cyclic structure in molecular structure can be used, and epoxy resin containing aromatic group (for example, phenyl) can be used.When epoxy resin contains aromatic group, cured product has excellent thermal stability and chemical stability, and shows low moisture absorption at the same time, thus can improve the reliability of organic electronic device packaging structure.The specific example of epoxy resin containing aromatic group that can be used in the present invention can be one of the following or a mixture of two or more: biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene modified phenol type epoxy resin, epoxy resin based on cresol, epoxy resin based on bisphenol, epoxy resin based on xylene, multifunctional epoxy resin, phenol novolac epoxy resin, trisphenol methane type epoxy resin and alkyl modified trisphenol methane epoxy resin etc., but not limited to this.

[0046] Furthermore, the encapsulation layer of the present application may include an active energy ray-polymerizable compound that is highly compatible with the encapsulation resin and may form a specific cross-linked structure together with the encapsulation resin.

[0047] For example, depending on the type of encapsulation resin, the encapsulation layer of the present application may contain a multifunctional active energy ray polymerizable compound that can be polymerized together with the encapsulation resin by irradiating active energy rays. The active energy ray polymerizable compound may refer to a compound that contains two or more functional groups that can participate in a polymerization reaction by irradiating active energy rays, such as a functional group containing an ethylenically unsaturated double bond (e.g., an acryloyl group or a methacryloyl group) or a functional group such as an epoxy group or an oxetane group.

[0048] As the multifunctional active energy ray-polymerizable compound, for example, multifunctional acrylate (MFA) can be used.

[0049] In addition, the active energy ray polymerizable compound may be contained in an amount of 3 to 30 parts by weight, 5 to 30 parts by weight, 5 to 25 parts by weight, 8 to 20 parts by weight, 10 to 18 parts by weight, or 12 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin. The present application provides an encapsulating film having excellent durable reliability even under severe conditions such as high temperature and high humidity within the above range.

[0050] A multifunctional active energy ray polymerizable compound that can be polymerized by irradiating active energy rays can be used without any limitation. For example, the compound may include 1,4-butanediol di(meth)acrylate, 1,3-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dicyclopentyl di(meth)acrylate, cyclohexane-1,4-diol di(meth)acrylate, tricyclodecane dimethanol (meth)diacrylate, dimethylol dicyclopentane di(meth)acrylate, neopentyl glycol-modified trimethylolpropane di(meth)acrylate, adamantane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, or a mixture thereof.

[0051] As the multifunctional active energy ray polymerizable compound, for example, a compound having a molecular weight of less than 1,000 and 80 or more and containing two or more functional groups can be used. In this case, the molecular weight may mean a weight average molecular weight or a typical molecular weight. The ring structure contained in the multifunctional active energy ray polymerizable compound may be any of a carbocyclic structure or a heterocyclic structure, or a monocyclic structure or a polycyclic structure.

[0052] In one embodiment of the present application, the encapsulation layer may further include a free radical initiator. The free radical initiator may be a photoinitiator or a thermal initiator. The specific type of the photoinitiator may be appropriately selected in consideration of the curing rate and the possibility of yellowing. For example, a benzoin-based photoinitiator, a hydroxyketone-based photoinitiator, an aminoketone-based photoinitiator, or a phosphine oxide-based photoinitiator may be used, and specifically, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane-1-one, 4-(2- 4-(2-(4-(1-methylvinyl)phenyl)-2-(hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyl dimethyl ketal, acetophenone dimethyl ketal, p-dimethylaminobenzoate, oligo[2-hydroxy-2-methyl-1-[4-(1-methylvinyl)phenyl]propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, etc.

[0053] The free radical initiator may be contained in a ratio of 0.2 to 20 parts by weight, 0.5 to 18 parts by weight, 1 to 15 parts by weight, or 2 to 13 parts by weight relative to 100 parts by weight of the active energy ray polymerizable compound. Therefore, the reaction of the active energy ray polymerizable compound can be effectively induced and the degradation of the physical properties of the encapsulation layer composition due to the residual components after curing can also be prevented.

[0054] In one embodiment of the present application, the encapsulation layer may further include a curing agent according to the type of resin component included in the encapsulation layer of the encapsulation film. For example, it may further include a curing agent capable of reacting with the above-mentioned encapsulation resin to form a cross-linked structure, etc. In this specification, the term encapsulation resin may be used in the same meaning as the resin component.

[0055] The kind of the curing agent may be appropriately selected and used according to the resin component or the type of functional group included in the resin.

[0056] In one example, when the resin component is an epoxy resin, the curing agent is a curing agent for epoxy resin known in the art, for example, one or two or more of the following can be used: amine curing agent, imidazole curing agent, phenol curing agent, phosphorus curing agent or acid anhydride curing agent, etc., but not limited thereto.

[0057] In one example, as the curing agent, an imidazole compound which is solid at room temperature and has a melting point or decomposition temperature of 80° C. or more and 200° C. or less can be used. As such a compound, for example, 2-methylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, or 1-cyanoethyl-2-phenylimidazole can be exemplified, but it is not limited thereto.

[0058] The content of the curing agent can be selected according to the composition of the composition (e.g., the type or ratio of the encapsulating resin). For example, relative to 100 parts by weight of the resin component, the curing agent can be included in an amount of 1 to 20 parts by weight, 1 to 10 parts by weight, or 1 to 5 parts by weight. However, the weight ratio can be changed according to the type and ratio of the encapsulating resin or the functional group of the resin, or the crosslinking density to be achieved, etc.

[0059] When the resin component is a resin that can be cured by irradiation with active energy rays, for example, a cationic photopolymerization initiator can be used as the initiator.

[0060] As the cationic photopolymerization initiator, As an ionized cationic initiator of a salt or organic metal salt series, or a non-ionized cationic photopolymerization initiator of an organic silane or latent sulfonic acid series. The salt-based initiator can be exemplified by diaryliodonium Examples of the initiator of the organic metal salt series include ferroarene, and examples of the initiator of the organic silane series include o-nitrobenzyl triarylsilyl ether, triarylsilyl peroxide or acyl silane. Examples of the initiator of the latent sulfonic acid series include α-sulfonyloxy ketone or α-hydroxymethyl benzoin sulfonate, but are not limited thereto.

[0061] In one example, as the cationic initiator, an ionizing cationic photopolymerization initiator may be used.

[0062] In one example, the encapsulation layer may also include a tackifier, wherein the tackifier may preferably be a hydrogenated cycloolefin polymer. As a tackifier, for example, a hydrogenated petroleum resin obtained by hydrogenating a petroleum resin may be used. The hydrogenated petroleum resin may be partially or completely hydrogenated, and may also be a mixture of such resins. Such a tackifier may be selected to have good compatibility with the pressure-sensitive adhesive composition, excellent moisture barrier properties, and less organic volatile components. Specific examples of hydrogenated petroleum resins may include hydrogenated terpene resins, hydrogenated ester resins, or hydrogenated dicyclopentadiene resins, etc. The weight average molecular weight of the tackifier may be about 200 to 5,000. The content of the tackifier may be appropriately adjusted as needed. For example, the content of the tackifier may be selected in consideration of the gel content to be described below, and according to one example, relative to 100 parts by weight of the resin component, the tackifier may be included in a ratio of 5 parts by weight to 100 parts by weight, 8 parts by weight to 95 parts by weight, 10 parts by weight to 93 parts by weight, or 15 parts by weight to 90 parts by weight.

[0063] As described above, the encapsulation layer may further include a moisture adsorbent. In the present specification, the term "moisture adsorbent" may mean a chemically reactive adsorbent capable of removing moisture or moisture, for example, by chemically reacting with moisture or moisture that penetrates into the encapsulation film, as described below.

[0064] For example, the moisture adsorbent may be present in the encapsulation layer or the encapsulation film in a uniformly dispersed state. Here, the uniformly dispersed state may mean a state in which the moisture adsorbent is present at the same or substantially the same density even in any part of the encapsulation layer or the encapsulation film. The moisture adsorbent that can be used for the above may include, for example, metal oxides, sulfates, or organic metal oxides, etc. Specifically, examples of sulfates may include magnesium sulfate, sodium sulfate, or nickel sulfate, etc., and examples of organic metal oxides may include aluminum oxide octanoate, etc. Here, specific examples of metal oxides may include: phosphorus pentoxide (P2O5), lithium oxide (Li2O), sodium oxide (Na2O), barium oxide (BaO), calcium oxide (CaO), or magnesium oxide (MgO), etc., and examples of metal salts may include: sulfates, such as lithium sulfate (Li2SO4), sodium sulfate (Na2SO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), cobalt sulfate (CoSO4), gallium sulfate (Ga2(SO4)3), titanium sulfate (Ti(SO4)2) or nickel sulfate (NiSO4); metal halides, such as calcium chloride (CaCl 2), magnesium chloride (MgCl2), strontium chloride (SrCl2), yttrium chloride (YCl3), copper chloride (CuCl2), cesium fluoride (CsF), tantalum fluoride (TaF5), niobium fluoride (NbF5), lithium bromide (LiBr), calcium bromide (CaBr2), cesium bromide (CeBr3), selenium bromide (SeBr4), vanadium bromide (VBr3), magnesium bromide (MgBr2), barium iodide (BaI2) or magnesium iodide (MgI2); or metal chlorates, such as barium perchlorate (Ba(ClO4)2) or magnesium perchlorate (Mg(ClO4)2); and the like, but not limited thereto. As a moisture adsorbent that can be included in the encapsulation layer, one or two or more of the above-mentioned compositions can also be used. In one example, when two or more are used as moisture adsorbents, calcined dolomite or the like can be used.

[0065] Such a moisture adsorbent can be controlled to a suitable size according to the application. In one example, the average particle size of the moisture adsorbent can be controlled to be about 10nm to 15000nm. The moisture adsorbent having a size within the above range has a not too fast reaction rate with moisture and is therefore easy to store, and can effectively remove moisture without damaging the components to be packaged.

[0066] The content of the moisture adsorbent is not particularly limited and may be appropriately selected in consideration of desired barrier properties.

[0067] If necessary, the encapsulation layer may also include a moisture blocker. In this specification, the term "moisture blocker" may refer to a material that is non-reactive or low-reactive with moisture, but can physically block or hinder the movement of moisture or humidity in the film. As a moisture blocker, for example, one or two or more of the following may be used: alumina, clay, talc, needle-shaped silica, plate-shaped silica, porous silica, zeolite, titanium dioxide or zirconium oxide. In addition, the moisture blocker may be surface treated with an organic modifier to promote the penetration of organic matter. As such an organic modifier, for example, dimethylbenzyl hydrogenated tallow quaternary ammonium, dimethyl hydrogenated tallow quaternary ammonium, methyl tallow bis-2-hydroxyethyl quaternary ammonium, dimethyl hydrogenated tallow 2-ethylhexyl quaternary ammonium, dimethyl dehydrogenated tallow quaternary ammonium, or a mixture thereof may be used.

[0068] The content of the moisture blocking agent is not particularly limited and may be appropriately selected in consideration of desired barrier properties.

[0069] The encapsulation layer may also include a bright spot inhibitor, the adsorption energy of the bright spot inhibitor for exhaust as calculated by density functional theory is 0 eV or less. The lower limit of the adsorption energy is not particularly limited, but may be -20 eV. The type of exhaust is not particularly limited, but may include H atoms, H2 molecules and / or NH3. When the encapsulation film includes a bright spot inhibitor, the present application can block moisture from being introduced into the organic electronic element and simultaneously prevent bright spots caused by exhaust generated in the organic electronic device. In addition, when the encapsulation layer may include a first layer and a second layer and the bright spot inhibitor is included in the second layer in the encapsulation layer that is not in contact with the organic electronic element, the encapsulation film of the present application can prevent damage to the organic electronic element due to stress concentration caused by the bright spot inhibitor. In view of the above, based on the mass of the total bright spot inhibitor in the encapsulation film, the first layer in the encapsulation layer may include a bright spot inhibitor in an amount of 15% or less or may not include a bright spot inhibitor. In addition, based on the mass of the total bright spot inhibitor in the encapsulation film, the layer that does not contact the organic electronic element (excluding the first layer in the encapsulation layer) may contain 85% or more of the bright spot inhibitor. That is, in the present application, the additional encapsulation layer may contain a bright spot inhibitor at a higher content than the first layer in the encapsulation layer that contacts the organic electronic element when sealing the organic electronic element, thereby preventing physical damage applied to the element while achieving the moisture barrier properties and bright spot prevention properties of the film.

[0070] In one embodiment of the present application, the adsorption energy between the bright spot inhibitor and the atoms or molecules that cause the bright spot can be calculated by electronic structure calculation based on density functional theory. The above calculation can be performed by methods known in the art. For example, in the present application, a two-dimensional flat plate structure in which the densest packing surface of the bright spot inhibitor having a crystal structure is exposed on the surface is manufactured and then structurally optimized, and the structure in which the molecules that cause the bright spots are adsorbed on the surface in a vacuum state is structurally optimized, and the value obtained by subtracting the total energy of the molecules that cause the bright spots from the total energy difference of the two systems is defined as the adsorption energy. For the total energy calculation of each system, a modified PBE function as a function of the GGA (Generalized Gradient Approximation) series is used as an exchange-correlation to simulate the interaction between electrons, and the electron kinetic energy cutoff used is 500eV, and only the gamma point corresponding to the origin of the reciprocal space is included, and calculated. The conjugate gradient method is used to optimize the atomic structure of each system and iterative calculations are performed until the interatomic force is or smaller. A series of calculations were performed by VASP which is a commercially available code.

[0071] The material of the bright spot suppressor is not limited as long as the material has the effect of preventing bright spots on the panel of the organic electronic device when the encapsulation film is applied to the organic electronic device. For example, the bright spot suppressor can be a material that can absorb the following materials, such as H2 gas, ammonia (NH3) gas, H + NH 2+ , NHR2 or NH2R. Here, R may be an organic group, for example, an alkyl group, an alkenyl group, an alkynyl group, etc., but is not limited thereto.

[0072] In one example, the material of the bright spot inhibitor is not limited, as long as it meets the above adsorption energy value, and it can be a metal or a non-metal. The bright spot inhibitor can include, for example, Li, Ni, Ti, Rb, Be, Mg, Ca, Sr, Ba, Al, Zn, In, Pt, Pd, Fe, Cr, Si, or a combination thereof, can include oxides or nitrides of the materials, and can include alloys of the materials. In one example, the bright spot inhibitor can include nickel particles, nickel oxide particles, titanium nitride, titanium-based iron-titanium alloy particles, manganese-based iron-manganese alloy particles, manganese-based manganese-nickel alloy particles, rare earth-based alloy particles, zeolite particles, silica particles, carbon nanotubes, graphite, aluminum phosphate molecular sieve particles, or mesoporous silica particles. In the encapsulation film, the bright spot inhibitor may be contained in an amount of 3 to 150 parts by weight, 6 to 143 parts by weight, 8 to 131 parts by weight, 9 to 123 parts by weight, 10 to 116 parts by weight, 10 to 95 parts by weight, 10 to 50 parts by weight, or 10 to 35 parts by weight relative to 100 parts by weight of the resin component in the encapsulation layer. The present application can achieve bright spot prevention of organic electronic devices within the above content range while improving the adhesion and durability of the film. In addition, the particle size of the bright spot inhibitor may be in the following ranges: 10 nm to 30 μm, 50 nm to 21 μm, 105 nm to 18 μm, 110 nm to 12 μm, 120 nm to 9 μm, 140 nm to 4 μm, 150 nm to 2 μm, 180 nm to 900 nm, 230 nm to 700 nm, or 270 nm to 400 nm. In the present application, the particle size measurement may be based on D50 particle size analysis. By including a bright spot inhibitor, the present application may achieve moisture barrier properties and durable reliability of the encapsulation film while effectively adsorbing hydrogen generated in an organic electronic device. In the present specification, the term resin component may be an encapsulation resin and / or a tackifier resin described below.

[0073] In addition to the above-mentioned constitution, the encapsulation layer may further include various additives according to the application and manufacturing process of the encapsulation film described below. For example, according to the expected physical properties, the encapsulation layer may include a curable material, a crosslinking agent, a filler, etc. in an appropriate content range.

[0074] In one embodiment of the present application, the encapsulation layer may be formed as a single layer structure as described above, or may be formed of two or more layers. When the encapsulation layer is formed of two or more layers, the outermost layer of the encapsulation layer may not contain a moisture adsorbent, or may contain a moisture adsorbent in a lower amount than other encapsulation layers.

[0075] In one example, considering that the encapsulation film is applied to the encapsulation of an organic electronic component, the content of the moisture adsorbent can be controlled in consideration of damage to the component. For example, the layer in contact with the component may contain a small amount of moisture adsorbent, or may not contain a moisture adsorbent. In one example, the encapsulation layer (first layer) in contact with the component may contain 0% to 20% of moisture adsorbent relative to the total mass of the moisture adsorbent contained in the encapsulation film. In addition, the encapsulation layer (second layer) that does not contact the component may contain 80% to 100% of moisture adsorbent relative to the total mass of the moisture adsorbent contained in the encapsulation film.

[0076] In one example, the encapsulation film of the present application may also include a protective layer formed on the metal layer. The protective layer may include a resin component. The material constituting the protective layer is not particularly limited. In one example, the protective layer may be a waterproof layer capable of blocking moisture penetration. In one example, the resin component constituting the protective layer may include one or more selected from the following: polyorganosiloxane, polyimide, styrene-based resin or elastomer, polyolefin-based resin or elastomer, polyoxyalkylene-based resin or elastomer, polyester-based resin or elastomer, polyvinyl chloride-based resin or elastomer, polycarbonate-based resin or elastomer, polyphenylene sulfide-based resin or elastomer, polyamide-based resin or elastomer, acrylate-based resin or elastomer, epoxy-based resin or elastomer, silicone-based resin or elastomer, and fluorine-based resin or elastomer, but not limited thereto.

[0077] In one embodiment of the present application, the encapsulation film may also include a pressure-sensitive adhesive or adhesive between the protective layer and the metal layer. The material of the pressure-sensitive adhesive or adhesive is not particularly limited, and known materials can be used. In one example, the pressure-sensitive adhesive or adhesive can be an acrylic, epoxy-based, urethane-based, silicone-based or rubber-based pressure-sensitive adhesive or adhesive. In addition, in one embodiment, the material of the pressure-sensitive adhesive or adhesive can be the same or different from the material of the encapsulation layer as described above.

[0078] The encapsulation film may further include a base film or a release film (hereinafter, may be referred to as a "first film"), and the encapsulation film may have a structure in which an encapsulation layer is formed on the base film or the release film. In addition, the structure may further include a base film or a release film (hereinafter, may be referred to as a "second film") formed on the metal layer.

[0079] The specific type of the first film that can be used in the present application is not particularly limited. In the present application, for example, a general polymer film in the art can be used as the first film. In the present application, for example, as a base film or a release film, a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutylene film, a polybutadiene film, a polyvinyl chloride film, a polyurethane film, an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film or a polyimide film etc. can be used. In addition, a suitable demoulding process can be carried out on one or both sides of the base film or the release film of the present application. As an example of a release agent in the demoulding process for the base film, an alkyd series, a silicone series, a fluorine series, an unsaturated ester series, a polyolefin series or a wax series etc. can be used, wherein, in terms of heat resistance, a release agent of an alkyd series, a silicone series or a fluorine series is preferably used, but is not limited thereto.

[0080] In the present application, the thickness of the base film or release film (first film) as above is not particularly limited, and it can be appropriately selected according to the application to which the base film or release film is applied. For example, in the present application, the thickness of the first film can be 10 μm to 500 μm, preferably about 20 μm to 200 μm. If the thickness is less than 10 μm, deformation of the base film may easily occur during the manufacturing process, and if the thickness exceeds 500 μm, the economic efficiency is low.

[0081] The thickness of the encapsulation layer included in the encapsulation film of the present application is not particularly limited, and it can be appropriately selected according to the following conditions in consideration of the application to which the film is applied. The thickness of the encapsulation layer may be 5 μm to 200 μm, preferably about 5 μm to 100 μm. When the encapsulation layer is multilayered, the thickness may refer to the thickness of the multilayer. If the thickness of the encapsulation layer is less than 5 μm, it may not exhibit sufficient moisture blocking ability, and if the thickness exceeds 200 μm, it is difficult to ensure processability, and the thickness expansion caused by moisture reactivity is large, so that the deposited film of the organic light-emitting element may be damaged, and the economic efficiency is low.

[0082] The present application also relates to organic electronic devices. Figure 2 As shown, the organic electronic device may include a substrate 21; an organic electronic element 22 formed on the substrate 21; and the above-mentioned organic electronic element encapsulation film 10 for encapsulating the entire surface of the organic electronic element 22. The encapsulation film may encapsulate the entire surface of the organic electronic element formed on the substrate, such as the entire upper part and the side surface. The encapsulation film may include an encapsulation layer containing a cross-linked or cured pressure-sensitive adhesive composition or an adhesive composition. In addition, the organic electronic device may be formed so that the encapsulation layer contacts the entire surface of the organic electronic element.

[0083] Here, the organic electronic element may be, for example, an organic light emitting element.

[0084] The encapsulation layer may be formed as a structural adhesive in an organic electronic device that effectively fixes and supports a substrate and a metal layer while exhibiting excellent moisture barrier properties.

[0085] Furthermore, the encapsulation layer can be formed as a stable encapsulation layer regardless of the form of the organic electronic device (eg, top emission or bottom emission).

[0086] In addition, the organic electronic element of the present application may include a protective film. The protective film can prevent damage to the electrode of the element, and the protective film can be formed of conventional materials in the art, for example, SiNx or Al2O3 as inorganic materials can be included. The protective film can be a passivation film in which organic films and inorganic films are alternately deposited.

[0087] The present application also provides a method for manufacturing an organic electronic device. The manufacturing method may include the step of applying the above-mentioned encapsulation film to a substrate on which an organic electronic element is formed to cover the organic electronic element. In addition, the manufacturing method may also include the step of curing the encapsulation film. The curing step of the encapsulation film may mean the curing of the encapsulation layer, and the curing may be performed before or after the encapsulation film covers the organic electronic element.

[0088] In the present specification, the term "curing" may mean that the pressure-sensitive adhesive composition of the present invention forms a cross-linked structure by heating or UV irradiation process, etc., thereby being manufactured into the form of a pressure-sensitive adhesive. Alternatively, it may mean that the adhesive composition is cured and attached as an adhesive.

[0089] In one example, in the manufacturing method, the organic electronic element can be formed by forming a transparent electrode on a glass or polymer film used as a substrate by a method such as vacuum evaporation or sputtering, forming a light-emitting organic material layer composed of, for example, a hole transport layer, a light-emitting layer, and an electron transport layer on the transparent electrode, and then further forming an electrode layer on the light-emitting organic material layer. Subsequently, an encapsulation layer of an encapsulation film can be placed to cover the entire surface of the organic electronic element of the substrate subjected to the above process.

[0090] Beneficial Effects

[0091] The encapsulation film of the present application can be applied to seal or encapsulate organic electronic devices such as OLED, etc. The film can form a structure that can block moisture or oxygen from the outside from being introduced into the organic electronic device, thereby effectively releasing the heat accumulated in the organic electronic device, achieving durable reliability under harsh conditions of high temperature and high humidity, and preventing the degradation of the organic electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0092] Figure 1is a cross-sectional view showing a packaging film according to one example of the present application.

[0093] Figure 2 is a cross-sectional view showing an organic electronic device according to one example of the present application.

[0094] Figure 3 3 is a diagram showing a method of measuring horizontal thermal resistance according to Experimental Example 2.

[0095] [Explanation of Reference Numerals]

[0096] 10: Organic electronic component packaging film

[0097] 11: Encapsulation layer

[0098] 12: Metal layer (first layer)

[0099] 13: Metal layer (second layer)

[0100] 21: Base

[0101] 22: Organic electronic components DETAILED DESCRIPTION

[0102] Hereinafter, the present invention will be described in more detail through Examples according to the present invention and Comparative Examples not according to the present invention, but the scope of the present invention is not limited by the following Examples.

[0103] Example 1

[0104] Fabrication of encapsulation layer

[0105] A CaO (average particle size less than 5 μm) solution (solid content 50%) was prepared as a moisture adsorbent. Separately, a solution (solid content 50%) in which 200 g of butyl rubber resin (BT-20, Sunwoo Chemtech) and 60 g of DCPD petroleum resin (SU5270, Sunwoo Chemtech) were diluted with toluene was prepared, and then the solution was homogenized. 10 g of multifunctional acrylate (trimethylolpropane triacrylate, Miwon) and 3 g of photoinitiator (Irgacure 819, Ciba) were introduced into the homogenized solution, the solution was homogenized, and then 100 g of CaO solution was introduced therein, and then stirred at high speed for 1 hour to prepare an encapsulation layer solution.

[0106] The encapsulation layer solution prepared above was applied to the release surface of the release PET using a comma coater and dried in a dryer at 130° C. for 3 minutes to form an encapsulation layer having a thickness of 50 μm.

[0107] Manufacturing of packaging films

[0108] The release-treated PET attached to the outer side of the encapsulation layer manufactured above was peeled off and roll-laminated under the conditions of a temperature of 70° C. and a gap of 1 mm, and a 70 μm aluminum foil (the first layer of the metal layer, thermal conductivity: 240 W / m·K) was attached thereto. Subsequently, 80 μm of Invar (the second layer of the metal layer, linear expansion coefficient: 1.2 ppm / ° C., thermal conductivity: about 15 W / m·K) was roll-laminated on the first layer using a urethane-based pressure-sensitive adhesive to manufacture an encapsulation film in which the metal layer (the second layer and the first layer) and the encapsulation layer were laminated in this order (the second layer, the first layer, and the encapsulation layer order).

[0109] The manufactured encapsulation film was cut into square sheets with a cutting knife by a wood forming cutting machine to manufacture a film for encapsulating an organic electronic element.

[0110] Example 2

[0111] A packaging film was manufactured in the same manner as in Example 1, except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 30 μm.

[0112] Example 3

[0113] A packaging film was manufactured in the same manner as in Example 1, except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 20 μm.

[0114] Example 4

[0115] A packaging film was manufactured in the same manner as in Example 1, except that the thickness of the aluminum foil (the first layer of the metal layer) was changed to 12 μm.

[0116] Example 5

[0117] A packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film (thermal conductivity: 390 W / m·K) and the thickness was changed to 18 μm.

[0118] Example 6

[0119] A packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film and the thickness was changed to 9 μm.

[0120] Example 7

[0121] A packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film and the thickness was changed to 5 μm.

[0122] Example 8

[0123] The encapsulation film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was a copper film and the thickness was changed to 3 μm.

[0124] Example 9

[0125] The packaging film was manufactured in the same manner as in Example 1, except that a 120 μm aluminum sheet was applied as the first layer of the metal layer, 60 μm carbon steel (mild steel) was applied as the second layer, and 120 μm aluminum was applied as the first layer (a three-layer laminate structure of the first layer, the second layer and the first layer).

[0126] Example 10

[0127] The packaging film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was an aluminum sheet (thermal conductivity: 240 W / m·K) and the thickness was changed to 350 μm.

[0128] Comparative Example 1

[0129] The encapsulation film was manufactured in the same manner as in Example 1, except that the first layer of the metal layer was not applied.

[0130] Comparative Example 2

[0131] A packaging film was manufactured in the same manner as in Example 1, except that a polyethylene terephthalate film (thermal conductivity: 0.24 W / m·K) was applied instead of the first layer of the metal layer.

[0132] Comparative Example 3

[0133] An encapsulation film was manufactured in the same manner as in Comparative Example 1, except that 20 parts by weight of carbon black relative to 100 parts by weight of the butyl rubber resin was added to the encapsulation layer.

[0134] Comparative Example 4

[0135] The packaging film was manufactured in the same manner as in Example 1, except that 20 μm thick titanium (thermal conductivity: 21.9 W / m·K) was applied as the first layer of the metal layer, and 40 μm of Invar (thermal conductivity: 15 W / m·K) was applied as the second layer of the metal layer.

[0136] Experimental Example 1-Measurement of Heat Dissipation Performance

[0137] A heating film with a constant calorific value (VOLUN WM-90-P30, size: 15cm×25cm, thickness: 0.25mm) was placed on the center of a glass (30cm×50cm) with a thickness of 0.7μm, the PET attached to each encapsulation layer in the encapsulation film manufactured in the embodiment and the comparative example was peeled off, and the encapsulation film was laminated at a temperature of 70°C and a gap of 1mm so that the encapsulation layer was in contact with the top of the glass and the heating film. At this time, the temperature of the central part of the heating film was measured.

[0138] Experimental Example 2-Measurement of Horizontal Thermal Resistance

[0139] The thermal conductivity (k) of the first and second metal layers and the encapsulation layer constituting the encapsulation films manufactured in the above Examples and Comparative Examples was measured using a hot plate method (TPS2200) according to the procedure specified in ISO 22007-2. i The thickness of each layer in the cross section of the final laminated packaging film was measured using SEM (L i ), and through Figure 3 The thermal resistance (R tot )value.

[0140] Here, Figure 3 3D view showing the structure of a packaging film in which a second layer and a first layer of a metal layer and a packaging layer are sequentially laminated from above, wherein the thermal resistance in the packaging film is calculated based on the horizontal area (W=1m, D=1m). Here, L means the thickness of each layer, W means the long side, D means the short side, k means thermal conductivity, T means temperature, R means thermal resistance, and Q means heat transfer (unit: W). The thermal conductivity of the exemplary packaging layer of the present application is about 0.1W / m·K to 0.45W / m·K or 0.2W / m·K to 0.31W / m·K, and the thermal conductivity of the packaging layer manufactured in Examples 1 to 10 is about 0.184W / m·K to 0.3041W / m·K. The thermal conductivity of the packaging layer in Comparative Example 3 is about 0.32W / m·K to 0.4W / m·K.

[0141] [Table 1]

[0142] Driving temperature(℃) Horizontal thermal resistance (K / W) Example 1 51 56 Example 2 57 119 Example 3 60 166 Example 4 66 244 Example 5 56 123 Example 6 63 214 Example 7 67 318 Example 8 72 422 Example 9 48 17 Example 10 45 12 Comparative Example 1 80 824 Comparative Example 2 75 808 Comparative Example 3 80 821 Comparative Example 4 92 949

[0143] It can be found that the packaging film manufactured in Example 10 has some warping problems of the metal layer under high temperature and high humidity conditions of a temperature of 85° C. and 85% RH.

Claims

1. An organic electronic element encapsulation film, comprising an encapsulation layer encapsulating an organic electronic element and two or more metal layers formed on the encapsulation layer, wherein the horizontal direction thermal resistance of the encapsulation film measured according to ISO 22007-2 is 800K / W or less, wherein the metal layer comprises any one of metal, metal oxide, metal nitride, metal carbide, metal oxynitride, metal oxyboride, and combinations thereof, wherein the metal layer includes a first layer formed on the encapsulation layer and a second layer formed on the first layer and having a composition different from that of the first layer, and The thermal conductivity of the metal layer is 50 W / m·K to 800 W / m·K. 2 . The organic electronic element encapsulation film according to claim 1 , wherein a linear expansion coefficient of the metal layer is 20 ppm / ° C. or less. 3 . The organic electronic element encapsulation film according to claim 1 , wherein a thickness ratio of the first layer to the second layer is in a range of 0.85 to 4.

3. 4 . The organic electronic element encapsulation film according to claim 1 , wherein a thickness of the first layer is in the range of 2 μm to 3,500 μm. 5 . The organic electronic element encapsulation film according to claim 1 , wherein a thickness of the second layer is in the range of 10 μm to 2,500 μm. 6 . The organic electronic element encapsulation film according to claim 1 , wherein the two or more metal layers are attached by a pressure-sensitive adhesive or an adhesive other than the pressure-sensitive adhesive. 7 . The organic electronic element encapsulation film according to claim 1 , wherein the two or more metal layers are directly attached to each other. 8 . The organic electronic element encapsulation film according to claim 1 , wherein the encapsulation layer is formed of a multilayer of two or more layers. 9 . The organic electronic element encapsulation film according to claim 1 , wherein the encapsulation layer is formed of two or more layers and at least one layer of the metal layers exists between the two or more layers of the encapsulation layer. 10 . The organic electronic element encapsulation film according to claim 1 , wherein the encapsulation layer comprises an encapsulation resin and a moisture adsorbent. 11 . The organic electronic element encapsulation film according to claim 10 , wherein the encapsulation resin comprises a curable resin or a cross-linkable resin. 12 . The organic electronic element encapsulation film according to claim 10 , wherein the moisture adsorbent comprises a chemically reactive adsorbent. 13 . The organic electronic element encapsulation film according to claim 1 , wherein the encapsulation layer seals the entire surface of the organic electronic element formed on the substrate. 14 . The organic electronic element encapsulation film according to claim 1 , further comprising a protective layer formed on the metal layer.

15. An organic electronic device comprising: substrate; an organic electronic element formed on the substrate; and an organic electronic element encapsulation film according to claim 1 for encapsulating the entire surface of the organic electronic element. 16 . A method for manufacturing an organic electronic device, comprising the step of applying the organic electronic element encapsulation film according to claim 1 to a substrate having an organic electronic element formed thereon to cover the organic electronic element.

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