Flexible ionization device for metal-organic complexes

Abstract

The present invention relates to the field of ionization technology, and in particular, to a flexible ionization device for metal organic complexes; the flexible ionization device for metal organic complexes comprises a desolvation mechanism, an atomization mechanism and a semiconductor refrigeration system, the desolvation mechanism is provided with a desolvation chamber; the atomization mechanism comprises an atomizer and a spray needle, the atomizer is connected to the desolvation mechanism, and one end of the atomizer extends into the desolvation chamber; the spray needle is plugged into the atomizer, and the end of the spray needle extends from the end of the atomizer and is located in the desolvation chamber; the semiconductor refrigeration system is used to cool nitrogen and transport the cooled nitrogen into the desolvation chamber and the atomizer. The flexible ionization device for metal organic complexes can improve the problem of the destruction of molecular integrity, is conducive to the detection of molecular ion peaks, and thus facilitates the acquisition of structural information closest to the easy state.

Description

Technical Field

[0001] The invention relates to the technical field of ionization, in particular to a flexible ionization device for metal-organic composites. Background Art

[0002] Atmospheric pressure electrospray ionization (ESI) is a soft ionization technique. Due to the characteristics of ESI's multi-charge ionization, high efficiency of ionization of certain polar compounds (for example, close to 100% for proteins), and soft ionization, ESI-MS has become one of the most effective tools for analyzing polar compounds (including ions in solution), easily decomposed and large molecular weight compounds. The basic principle of ESI ion source is as follows: First, the analyte solution is sprayed out at high speed through the ESI nozzle, and under the action of the spray gas, fine droplets are formed. Under the action of the electric field, the ions with different charges in the ionic compounds in the droplets move in opposite directions, thereby generating initial charged droplets (charged dorplet). The charged droplets fission during the continuous evaporation of the solvent, and the surface charge density continues to increase. When the Rayleigh limit is reached, the ions will escape from the surface (the so-called Coulomb explosion), and the gaseous ions pass through the heated capillary and enter the mass spectrometer for analysis and detection.

[0003] However, due to the different properties of transition metals from other main group metal elements, most of the metal organic compounds synthesized at present are transition metal organic compounds. Transition metal atoms and more than one ligand form complex complexes in the form of coordination bonds, and the structural stability is poor. The analysis and detection methods provided by related technologies are easy to destroy the integrity of the molecule, and it is difficult to detect the molecular ion peak. Summary of the invention

[0004] The object of the present invention is to provide a flexible ionization device for metal organic complexes, which can improve the problem of molecular integrity being destroyed, facilitate detection of molecular ion peaks, and further facilitate obtaining structural information closest to the easy state.

[0005] The embodiment of the present invention is achieved as follows:

[0006] In a first aspect, the present invention provides a flexible ionization device for metal organic composites, comprising:

[0007] A desolventizing mechanism, wherein the desolventizing mechanism is provided with a desolventizing chamber;

[0008] The atomizing mechanism includes an atomizer and a spray needle. The atomizer is connected to the desolvation mechanism, and one end of the atomizer extends into the desolvation chamber; the spray needle is inserted into the atomizer, and the end of the spray needle extends from the end of the atomizer and is located in the desolvation chamber;

[0009] The semiconductor refrigeration system is used to cool the nitrogen and transport the cooled nitrogen to the desolvation chamber and the atomizer.

[0010] In an alternative embodiment, the atomizer is movably connected to the desolvation mechanism.

[0011] In an optional embodiment, the atomization mechanism further includes a sample tube, which is connected to the spray needle.

[0012] In an optional embodiment, the atomization mechanism further includes a two-way connector, and the sample tube and the spray needle are connected via the two-way connector.

[0013] In an optional embodiment, the atomization mechanism also includes a sheath gas pipe, a channel is formed between the spray needle and the atomizer, the sheath gas pipe is arranged in the atomizer, and connects the channel and the semiconductor refrigeration system, and is used to transport nitrogen cooled by the semiconductor refrigeration system into the channel.

[0014] In an optional embodiment, the semiconductor refrigeration system includes a first refrigeration mechanism and a second refrigeration mechanism, both of which are used to cool nitrogen, wherein the first refrigeration mechanism is also used to transport the cooled nitrogen to the atomizer, and the second refrigeration mechanism is used to transport the cooled nitrogen to the desolvation chamber.

[0015] In an optional embodiment, the first refrigeration mechanism includes a multi-stage semiconductor refrigeration plate and an air pipe, the air pipe is passed through the multi-stage semiconductor refrigeration plate, and the air pipe is used to transport nitrogen into the atomizer, and the multi-stage semiconductor refrigeration plate is used to cool the nitrogen transported by the air pipe.

[0016] In an optional embodiment, the first refrigeration mechanism further includes a controller and a power supply, and the power supply is electrically connected to the controller and the multi-stage semiconductor refrigeration plate at the same time.

[0017] In an optional embodiment, the first refrigeration mechanism further includes a temperature sensor, which is disposed in the air pipe and is used to detect the temperature of the cooled nitrogen in the air pipe.

[0018] In an optional embodiment, the desolventizing mechanism further includes an exhaust pipe, which is connected to the desolventizing chamber and is used to exhaust waste gas in the desolventizing chamber.

[0019] The beneficial effects of the flexible ionization device for metal-organic composites provided by the embodiment of the present invention include: the flexible ionization device for metal-organic composites provided by the embodiment of the present invention includes a desolvation mechanism, an atomization mechanism and a semiconductor refrigeration system, the desolvation mechanism is provided with a desolvation chamber; the atomization mechanism includes an atomizer and a spray needle, the atomizer is connected to the desolvation mechanism, and one end of the atomizer extends into the desolvation chamber; the spray needle is inserted into the atomizer, and the end of the spray needle extends from the end of the atomizer and is located in the desolvation chamber; the semiconductor refrigeration system is used to cool nitrogen and transport the cooled nitrogen to the desolvation chamber and the atomizer. In this way, by passing nitrogen cooled by the semiconductor refrigeration system into the atomizer and the desolvation chamber, the liquid spray performed by the atomization mechanism and the desolvation process performed by the desolvation mechanism can be cooled by the semiconductor refrigeration system to increase the polarizability of the molecules, so as to promote the ionization of the molecules through solvation, thereby realizing flexible spray ionization; cooling is also beneficial to the aggregation of target molecules, so that the state of the metal complex in the solution can be well maintained, thereby improving the problem of easy destruction of the integrity of the molecules, facilitating the detection of molecular ion peaks, and making it easier to obtain structural information closest to the easy state. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 Schematic diagram of the structure of a flexible ionization device for metal-organic composites in an embodiment of the present invention;

[0022] Figure 2 This is a schematic structural diagram of another flexible ionization device for metal-organic composites in an embodiment of the present invention;

[0023] Figure 3 Schematic diagram of the structure of yet another flexible ionization device for metal-organic composites in an embodiment of the present invention.

[0024] Icons: 010-flexible ionization device for metal organic complexes; 100-desolventizing mechanism; 110-desolventizing chamber; 111-desolventizing chamber; 112-exhaust pipe; 113-mounting hole; 120-fourth temperature sensor; 200-atomizing mechanism; 210-atomizer; 220-spray needle; 221-first temperature sensor; 230-sample tube; 231-two-way connector; 240-sheath gas tube; 241-three-way connector; 242-injection needle; 300-semiconductor refrigeration system; 310-first refrigeration mechanism; 311-multi-stage semiconductor refrigeration plate; 312-gas pipe; 313-controller; 314-power supply; 315-third temperature sensor; 320-second refrigeration mechanism. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0028] In the description of the present invention, it should be noted that the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0029] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] Please refer to Figure 1 The present embodiment provides a flexible ionization device 010 for metal organic composites, which includes a desolvation mechanism 100, an atomization mechanism 200 and a semiconductor refrigeration system 300. The desolvation mechanism 100 is provided with a desolvation chamber 110; the atomization mechanism 200 includes an atomizer 210 and a spray needle 220, the atomizer 210 is connected to the desolvation mechanism 100, and one end of the atomizer 210 extends into the desolvation chamber 110; the spray needle 220 is inserted into the atomizer 210, and the end of the spray needle 220 extends from the end of the atomizer 210 and is located in the desolvation chamber 110; the semiconductor refrigeration system 300 is used to cool nitrogen and transport the cooled nitrogen to the desolvation chamber 110 and the atomizer 210.

[0031] The flexible ionization device 010 for metal organic complexes of this embodiment increases the polarizability of molecules by passing nitrogen cooled by the semiconductor refrigeration system 300 into the atomizer 210 and the desolvation chamber 110, thereby cooling the liquid spray performed by the atomization mechanism 200 and the desolvation process performed by the desolvation mechanism 100 through the semiconductor refrigeration system 300, so as to promote the ionization of molecules through solvation, thereby realizing flexible spray ionization; cooling is also beneficial to the aggregation of target molecules, so that the state of the metal complex in the solution can be well maintained, thereby improving the problem of easy destruction of the integrity of the molecules, and facilitating the detection of molecular ion peaks, thereby facilitating the acquisition of structural information closest to the easy state.

[0032] It should be noted that the molecular polarizability (P) has the following relationship with the vacuum dielectric constant (ε0), relative dielectric constant (εp) and electric field strength (E):

[0033] P=ε0(εp-1)E

[0034] εp=ε0 -T / θ

[0035] Where T = absolute temperature, θ = constant, that is, εp is inversely proportional to temperature. The lower the temperature, the greater the εp and the greater the molecular polarizability. Therefore, thermally unstable molecules can be ionized through solvation by lowering the temperature.

[0036] In this embodiment, please refer to Figure 1 The desolvation mechanism 100 includes a desolvation chamber 111, which is provided with a desolvation chamber 110. The first end of the desolvation chamber 111 is connected to the nebulizer 210, and the end of the nebulizer 210 can extend from the first end of the desolvation chamber 111 into the desolvation chamber 110. The second end of the desolvation chamber 111 is used to communicate with the mass spectrometer port so that the sample to be detected in the desolvation chamber 111 enters the mass spectrometer for detection.

[0037] In this embodiment, the atomizer 210 is movably connected to the desolvation mechanism 100 to adjust the depth of the atomizer 210 extending into the desolvation chamber 110. With such a configuration, when a conventional electrospray ionization source is needed, the end of the atomizer 210 extending into the desolvation chamber 110 can be extended to a position close to the mass spectrometer port, and the semiconductor refrigeration system 300 can be turned off. After applying a high voltage of 2-4 kV to the sample, the switch can be completed to use a conventional electrospray ionization source. It should be noted that if further desolvation is required, the nitrogen gas entering the desolvation chamber 110 can be heated to improve the ionization efficiency.

[0038] Moreover, the flexible ionization device 010 for metal-organic composites of this embodiment has a simple structure and low cost. By shutting down the semiconductor refrigeration system 300, a conventional electrospray ionization source can be used, and the operation is simple and fast.

[0039] Furthermore, a mounting hole 113 is provided at the first end of the desolventizing chamber 111, and the atomizer 210 can be slidably inserted into the mounting hole 113 to facilitate the sliding of the atomizer 210 relative to the desolventizing chamber 111, thereby adjusting the position of the end of the atomizer 210 extending into the desolventizing chamber 110.

[0040] Optionally, the mounting hole 113 opened at the first end of the desolventizing chamber 111 is a threaded hole, and the atomizer 210 is provided with an external thread. The external thread of the atomizer 210 is threadedly matched with the mounting hole 113, so that the atomizer 210 can be reliably disposed in the desolventizing chamber 111, and it is convenient to adjust the position of the end of the atomizer 210 extending into the desolventizing chamber 110 by rotating the atomizer 210.

[0041] Of course, in other embodiments, the atomizer 210 is adapted to the mounting hole 113 so that the atomizer 210 can slide in the mounting hole 113 along its own length direction to adjust the position of the end of the atomizer 210 in the desolvation chamber 110 .

[0042] In this embodiment, the spray needle 220 is movably connected to the atomizer 210 to adjust the length of the end of the spray needle 220 extending from the end of the atomizer 210. Optionally, the length of the end of the spray needle 220 extending from the atomizer 210 can be 1-3 mm, and the length of the end of the spray needle 220 extending from the end of the atomizer 210 can be adjusted according to the ionization situation, which is not specifically limited here.

[0043] Furthermore, in this embodiment, the spray needle 220 and the atomizer 210 are slidably plugged into each other, a through hole is provided at the first end of the atomizer 210, and the first end of the atomizer 210 extends into the desolvation chamber 110; the end of the spray needle 220 extends from the through hole, and the spray needle 220 can slide relative to the atomizer 210 along its own length direction to adjust the length of the end of the spray needle 220 extending out of the atomizer 210.

[0044] It should be noted that the spray needle 220 of this embodiment is a metal spray needle.

[0045] Optionally, the atomization mechanism 200 further includes a first temperature sensor 221, which is disposed in the atomizer 210 and is used to detect the temperature of the spray needle 220, thereby ensuring that the temperature of the atomized sample meets the detection requirements. Further, the first temperature sensor 221 can be attached to the outer wall of the spray needle 220, which is not specifically limited here.

[0046] Please refer to Figure 1 The atomization mechanism 200 of this embodiment further includes a sample tube 230, which is connected to the spray needle 220. This arrangement facilitates adding the sample liquid to be tested into the spray needle 220 through the sample tube 230.

[0047] Furthermore, the atomization structure further includes a two-way joint 231, and the sample tube 230 and the spray needle 220 are connected via the two-way joint 231. Such an arrangement makes the connection between the sample tube 230 and the spray needle 220 simple, reliable, and easy to assemble.

[0048] Furthermore, the sample tube 230 is inserted into the nebulizer 210 from the second end of the nebulizer 210 and connected to the two-way connector 231 .

[0049] It should be noted that the two-way connector 231 of this embodiment is made of insulating material.

[0050] It should be noted that when using a conventional electrospray ionization source, it is necessary not only to adjust the position of the nebulizer 210 so that the first end of the nebulizer 210 located in the desolvation chamber 110 is close to the mass spectrometer port and the semiconductor refrigeration system 300 is turned off, but also to apply a high voltage of 2-4 kV to the sample. Figure 2, the method of applying 2-4kV high voltage to the sample includes: connecting a three-way connector 241 to the end of the sample tube 230 away from the two-way connector 231, one of the other two interfaces of the three-way connector 241 is used for adding the sample, and the other interface is used to connect a high-voltage device, so as to use the high-voltage device to energize the sample added to the sample tube 230 through the three-way connector 241; please refer to Figure 3 Optionally, the method of applying 2-4 kV high voltage to the sample may also include: adding the sample into the sample tube 230 with an injection needle 242 at the end of the sample tube 230 away from the spray needle 220, and applying electricity at the metal needle tip of the injection needle 242 to energize the sample entering the sample tube 230.

[0051] It should be further explained that when the injection needle 242 is used to add sample to the sample tube 230, a driving pump can be used to provide power to the injection needle 242. Of course, the driving pump can also be replaced by an electric push rod or other device, which is not specifically limited here.

[0052] Please refer to Figure 1 The atomizing mechanism 200 of this embodiment further includes a sheath gas pipe 240, a channel is formed between the spray needle 220 and the atomizer 210, the sheath gas pipe 240 is arranged in the atomizer 210, and communicates the channel with the semiconductor refrigeration system 300, and is used to transport the nitrogen cooled by the semiconductor refrigeration system 300 into the channel. In this way, the nitrogen cooled by the semiconductor refrigeration system 300 can be effectively introduced into the atomizer 210, thereby effectively cooling the liquid spraying process performed by the atomizing mechanism 200.

[0053] Furthermore, the sheath gas tube 240 of the present embodiment is made of metal, and a second temperature sensor (not shown) is provided on the wall of the sheath gas tube 240 for detecting the temperature of the nitrogen gas transported by the sheath gas tube 240, thereby ensuring that the temperature of the nitrogen gas passing through the sheath gas tube 240 between the spray needle 220 and the atomizer 210 meets the detection requirements, so that the liquid spray process of the atomization mechanism 200 is effectively cooled.

[0054] Please refer to Figure 1The semiconductor refrigeration system 300 of this embodiment includes a first refrigeration mechanism 310 and a second refrigeration mechanism 320, both of which are used to cool nitrogen, wherein the first refrigeration mechanism 310 is also used to deliver the cooled nitrogen to the atomizer 210, and the second refrigeration mechanism 320 is used to deliver the cooled nitrogen to the desolvation chamber 110. In this way, the first refrigeration mechanism 310 and the second refrigeration mechanism 320 can cool the nitrogen to different temperatures respectively, and then the first refrigeration mechanism 310 and the second refrigeration mechanism 320 can be used to deliver the nitrogen cooled to different temperatures to the atomization mechanism 200 and the desolvation mechanism 100 respectively, so that the liquid spraying performed by the atomization mechanism 200 and the desolvation process performed by the desolvation mechanism 100 can be reliably performed at their respective suitable low temperatures, thereby ensuring that the polarizability of the molecules is increased by cooling.

[0055] It should be noted that the first refrigeration mechanism 310 of the present embodiment is used to keep the spray temperature of the atomization mechanism 200 below -20°C; when the first refrigeration mechanism 310 cools the nitrogen, the temperature of the cooled nitrogen needs to be controlled to be lower than or equal to -20°C. The second refrigeration mechanism 320 of the present embodiment is used to control the temperature of the desolvation process in the desolvation chamber 110 to be between -80°C and 15°C. When the second refrigeration mechanism 320 cools the nitrogen, the nitrogen can be cooled to -80 to 15°C, or the temperature of the nitrogen can be cooled to less than -80°C.

[0056] The structures of the first refrigeration mechanism 310 and the second refrigeration mechanism 320 of this embodiment are similar, and the first refrigeration mechanism 310 is taken as an example for detailed description.

[0057] Please refer to Figure 1 The first refrigeration mechanism 310 of this embodiment includes a multi-stage semiconductor refrigeration sheet 311 and an air pipe 312. The air pipe 312 is arranged through the multi-stage semiconductor refrigeration sheet 311, and the air pipe 312 is used to transport nitrogen into the atomizer 210. The multi-stage semiconductor refrigeration sheet 311 is used to cool the nitrogen transported by the air pipe 312. In this way, the multi-stage semiconductor refrigeration sheet 311 can be used to effectively cool the nitrogen transported in the air pipe 312, and the air pipe 312 can be used to transport the cooled nitrogen to the atomizer 210 to cool the liquid spray process.

[0058] The first end of the air pipe 312 is used to introduce nitrogen, and the second end of the air pipe 312 is connected to the sheath air pipe 240, so that the cooled nitrogen is introduced into the sheath air pipe 240 by the air pipe 312, and then the cooled nitrogen enters the atomizer 210 to cool the liquid spray process.

[0059] The multi-stage semiconductor refrigeration sheet 311 is a cooling device composed of semiconductors. The cooling temperature can be regulated by inputting current into it.

[0060] For further information, please refer to Figure 1 The first refrigeration mechanism 310 further includes a controller 313 and a power supply 314, and the power supply 314 is electrically connected to the controller 313 and the multi-stage semiconductor refrigeration sheet 311. With such a configuration, it is convenient to input different currents to the multi-stage semiconductor refrigeration sheet 311 through the controller 313 and the power supply 314, thereby controlling the multi-stage semiconductor refrigeration sheet 311 to cool the nitrogen gas entering the air pipe 312 to different temperatures, and it is convenient to control the first refrigeration mechanism 310 to cool the nitrogen gas to the temperature required for the liquid spraying process.

[0061] It should be noted that the controller 313 may be a programmable logic controller (PLC) and the power supply 314 may be any type of power supply in the related art, which are not specifically limited herein.

[0062] Furthermore, the first refrigeration mechanism 310 further includes a temperature sensor (hereinafter referred to as the third temperature sensor 315), which is disposed on the air pipe 312 and is used to detect the temperature of the air pipe 312, and further detect the temperature of the nitrogen gas cooled in the air pipe 312. The third sensor is disposed on the air pipe 312 to detect the temperature of the nitrogen gas cooled in the air pipe 312, so as to ensure that the temperature of the nitrogen gas introduced into the atomizer 210 meets the refrigeration requirement of the liquid spray process, and further ensure the reliable performance of the detection process.

[0063] It should be noted that the third temperature sensor 315 is electrically connected to the controller 313 so that the third temperature sensor sends a detection signal to the controller 313, and then the controller 313 that receives the detection signal sent by the third temperature sensor 315 controls the power supply 314 to input current to the multi-stage semiconductor refrigeration plate 311 according to the corresponding detection signal, so that the multi-stage semiconductor refrigeration plate 311 cools the nitrogen to the required temperature.

[0064] It should be further explained that the first temperature sensor 221 and the second temperature sensor can also be electrically connected to the controller 313 so as to send their corresponding detection signals to the controller 313, so that the controller 313 can control the power supply 314 to input current to the multi-stage semiconductor refrigeration plate 311 according to the received signal, thereby enabling the multi-stage semiconductor refrigeration plate 311 to cool the nitrogen to the temperature required for the liquid spray process.

[0065] Please refer to Figure 1 In this embodiment, the desolventizing mechanism 100 further includes an exhaust pipe 112 , which is connected to the desolventizing chamber 110 and is used to exhaust the waste gas in the desolventizing chamber 110 .

[0066] Furthermore, the exhaust pipe 112 is connected to the desolventizing chamber 111 , and connects the desolventizing chamber 110 with the outside of the desolventizing chamber 111 , so that the exhaust gas in the desolventizing chamber 110 can be discharged through the exhaust pipe 112 .

[0067] The desolventizing mechanism 100 of this embodiment also includes a fourth temperature sensor 120, which is arranged on the inner wall of the desolventizing chamber 111, that is, the fourth temperature sensor 120 is arranged in the desolventizing chamber 110, and is used to detect the temperature in the desolventizing chamber 110, so that the temperature of the desolventizing process in the desolventizing chamber 110 meets the detection requirements.

[0068] The second refrigeration mechanism 320 of this embodiment is similar to the first refrigeration mechanism 310, and the air pipe of the second refrigeration mechanism 320 is connected to the desolvation chamber 111, and the air pipe is used to pass the cooled nitrogen into the desolvation chamber 110. Further, the air pipe of the second refrigeration mechanism 320 is provided with a temperature sensor for detecting the temperature of the nitrogen delivered to the desolvation chamber 110 by the second refrigeration mechanism 320, thereby ensuring that the temperature of the nitrogen passed into the desolvation chamber 110 for cooling the desolvation process meets the requirements of the process; the temperature sensor provided on the air pipe of the second refrigeration mechanism 320 is electrically connected to the controller of the second refrigeration mechanism 320 to feed back the detection signal to the controller, thereby enabling the controller of the second refrigeration mechanism 320 to control the power supply of the second refrigeration mechanism 320 to input current to the multi-stage semiconductor refrigeration plate of the second refrigeration mechanism 320 to adjust the temperature of the nitrogen cooled by the second refrigeration mechanism 320. Furthermore, the fourth temperature sensor 120 is electrically connected to the controller of the second refrigeration mechanism 320, so that the controller of the second refrigeration mechanism 320 can control the power supply of the second refrigeration mechanism 320 to input current to the multi-stage semiconductor refrigeration plate of the second refrigeration mechanism 320 according to the information fed back by the fourth temperature sensor 120, so as to adjust the temperature of the nitrogen cooled by the second refrigeration mechanism 320.

[0069] It should be noted that the above-mentioned temperature sensors may be provided or not as required. For example, in other embodiments, the first temperature sensor 221 may not be provided, and no specific limitation is made here.

[0070] When the flexible ionization device 010 for metal-organic composites provided in this embodiment is in use, a sample is added to the spray needle 220 from the sample tube 230, and the first refrigeration device and the second refrigeration device respectively pass cooled nitrogen into the atomizer 210 and the desolvation chamber 111, wherein the first refrigeration device passes the cooled nitrogen into the channel between the spray needle 220 and the atomizer 210, so that the spray needle 220 is cooled by the nitrogen, thereby cooling the liquid spray process, so that the ionized sample to be tested sprayed from the spray needle 220 is atomized and sprayed out and enters the desolvation chamber 110; the second refrigeration device passes the cooled nitrogen into the desolvation chamber 110 to cool the desolvation process.

[0071] In summary, the flexible ionization device 010 for metal organic complexes provided by the present invention increases the polarizability of molecules by passing nitrogen cooled by the semiconductor refrigeration system 300 into the atomizer 210 and the desolvation chamber 110, thereby cooling the liquid spray performed by the atomization mechanism 200 and the desolvation process performed by the desolvation mechanism 100 through the semiconductor refrigeration system 300, so as to promote the ionization of molecules through solvation, thereby realizing flexible spray ionization; cooling is also beneficial to the aggregation of target molecules, so that the state of the metal complex in the solution can be well maintained, thereby improving the problem that the integrity of the molecules is easily destroyed, and is beneficial to the detection of molecular ion peaks, thereby facilitating the acquisition of structural information closest to the easy state.

[0072] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A flexible ionization device for metal organic composites, characterized in that: include: A desolventizing mechanism, wherein the desolventizing mechanism is provided with a desolventizing chamber; Atomizing mechanism, the atomizing mechanism comprises an atomizer and a spray needle, the atomizer is connected to the desolvation mechanism, and one end of the atomizer extends into the desolvation chamber; the spray needle is inserted into the atomizer, and the end of the spray needle extends from the end of the atomizer and is located in the desolvation chamber; A semiconductor refrigeration system, used for cooling nitrogen and delivering the cooled nitrogen into the desolvation chamber and the atomizer; The atomizer is connected to the first end of the desolvation chamber, and the second end of the desolvation chamber is used to communicate with the mass spectrometer port, so that the sample to be detected in the desolvation chamber enters the mass spectrometer for detection; The atomizer is movably connected to the desolvation mechanism to adjust the depth of the atomizer extending into the desolvation chamber.

2. The flexible ionization device for metal organic composites according to claim 1, characterized in that: The atomization mechanism further comprises a sample tube, and the sample tube is communicated with the spray needle.

3. The flexible ionization device for metal organic composites according to claim 2, characterized in that: The atomization mechanism further comprises a two-way joint, and the sample tube and the spray needle are connected via the two-way joint.

4. The flexible ionization device for metal organic composites according to claim 1, characterized in that: The atomization mechanism also includes a sheath air pipe, a channel is formed between the spray needle and the atomizer, the sheath air pipe is arranged in the atomizer, and connects the channel and the semiconductor refrigeration system, and is used to transport the nitrogen cooled by the semiconductor refrigeration system into the channel.

5. The flexible ionization device for metal organic composites according to claim 1, characterized in that: The semiconductor refrigeration system includes a first refrigeration mechanism and a second refrigeration mechanism, both of which are used to cool nitrogen, wherein the first refrigeration mechanism is also used to transport the cooled nitrogen to the atomizer, and the second refrigeration mechanism is used to transport the cooled nitrogen to the desolvation chamber.

6. The flexible ionization device for metal organic composites according to claim 5, characterized in that: The first refrigeration mechanism includes a multi-stage semiconductor refrigeration sheet and an air pipe. The air pipe is penetrated by the multi-stage semiconductor refrigeration sheet and is used to transport nitrogen into the atomizer. The multi-stage semiconductor refrigeration sheet is used to cool the nitrogen transported by the air pipe.

7. The flexible ionization device for metal organic composites according to claim 6, characterized in that: The first refrigeration mechanism also includes a controller and a power supply, and the power supply is electrically connected to the controller and the multi-stage semiconductor refrigeration plate at the same time.

8. The flexible ionization device for metal organic composites according to claim 6, characterized in that: The first refrigeration mechanism further includes a temperature sensor, which is disposed in the gas pipe and is used to detect the temperature of the nitrogen gas cooled in the gas pipe.

9. The flexible ionization device for metal organic composites according to claim 1, characterized in that: The desolventizing mechanism further includes an exhaust pipe, which is communicated with the desolventizing chamber and is used for exhausting waste gas in the desolventizing chamber.

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