A vertical slicing mechanism for underwater silicon wafers

Abstract

The present invention relates to an underwater silicon wafer vertical slicing mechanism, including a vertical slicing device, a scrubbing and drying device and a discharging and loading device. A transmission slot is provided at the front end of a frame, the vertical slicing device and the scrubbing and drying device are arranged in the transmission slot, and the discharging and loading device is arranged downstream of the frame; the vertical slicing device includes a propulsion device, a wafer suction device and an adsorption manipulator; the wafer suction device includes a wafer suction plate and a wafer suction roller, the wafer suction plate is vertically arranged downstream of the silicon wafer slot, a water suction port is provided on the wafer suction plate, the water suction port is connected to a water pump, and the wafer suction roller is arranged above the wafer suction plate. The beneficial effects of the present invention are: realizing the automated production of cleaning, drying and inserting of semiconductor wafers after cutting; while increasing the equipment capacity, reducing the personnel demand, and reducing the silicon wafer manufacturing cost for the enterprise; at the same time, ensuring the integrity of the silicon wafer and reducing the fragmentation rate.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor equipment, and in particular relates to an underwater silicon wafer vertical slicing mechanism. Background Art

[0002] Existing wafer loading devices all load wafers horizontally. After debonding, the silicon wafers are manually sorted and stacked in the loading device. They are then loaded into the wafer basket via the wafer transfer device. Since the cut silicon rods are all inserted vertically after debonding, they must be manually operated to adapt to horizontal insertion, making automated connection difficult. Known vertical wafer loading technologies include debonding by heating and using a robotic arm to remove the silicon wafers bonded to the material holder after cutting. However, this technology is difficult to grasp the timing of debonding. If the robotic arm removes the wafers too early, it is easy to cause fragmentation. If the robotic arm removes the wafers too late, the subsequent silicon wafers will fall, making it difficult to achieve smooth and sequential vertical removal. Summary of the Invention

[0003] In order to solve the above technical problems, the present invention provides a vertical silicon wafer slicing mechanism in water.

[0004] The technical solution adopted by the present invention is: a vertical slicing mechanism for underwater silicon wafers, including a vertical slicing device, a brushing and drying device, and a discharging and loading device. A transmission trough is provided at the front end of the frame, the vertical slicing device and the brushing and drying device are arranged in the transmission trough, and the discharging and loading device is arranged downstream of the frame.

[0005] Preferably, the vertical sheet separating device includes a propulsion device, a sheet suction device and an adsorption manipulator;

[0006] The propulsion device includes a silicon wafer slot and a push cylinder arranged in the transmission slot. The push cylinder is arranged upstream of the silicon wafer slot. A push piece is provided at the piston end of the push cylinder, and the push piece extends into the silicon wafer slot.

[0007] The wafer suction device includes a wafer suction plate and a wafer suction roller. The wafer suction plate is vertically arranged downstream of the silicon wafer groove. The wafer suction plate is provided with a water suction port connected to a water pump. The wafer suction roller is arranged above the wafer suction plate.

[0008] The adsorption manipulator is a manipulator with a vacuum suction cup at the end, and the vacuum suction cup is connected to a vacuum operating system;

[0009] Preferably, there are no less than three vacuum suction cups.

[0010] Preferably, two flushing devices are symmetrically arranged upstream of the wafer suction plate, each flushing device is provided with a flushing hole connected to a water pump, and the silicon wafer slot is in the shape of a frame with two sides open;

[0011] Preferably, the flushing holes are multiple and arranged in a straight line.

[0012] Preferably, the silicon wafer slot is movably arranged in the transmission slot by a movable cylinder, and a notch is provided at the tail of the silicon wafer slot, and the wafer suction plate can be embedded in the notch.

[0013] Preferably, the sheet suction roller comprises a first roller and a second roller, the first roller is arranged on the upper edge of the sheet suction plate, and the second roller is arranged above the first roller.

[0014] Preferably, the scrubbing and drying device comprises a spraying area, a scrubbing area and a drying area in sequence;

[0015] The spraying area includes a first transmission device and a spray pipe group, wherein one spray pipe group includes two spray pipes symmetrically arranged up and down, and the spray pipes can spray water relative to each other;

[0016] The scrubbing area includes power roller brushes symmetrically arranged up and down, which are connected by a synchronous belt;

[0017] The drying area includes a second transmission device and a drying tube group. One drying tube group includes two drying tubes symmetrically arranged up and down, and the drying tubes can discharge air relative to each other.

[0018] Preferably, the spray pipe is provided with a linear water spray outlet;

[0019] Preferably, the drying tube is provided with a linear air outlet;

[0020] Preferably, the first transmission device is a round belt transmission belt, and the second transmission device is a transmission roller;

[0021] Preferably, first guide plates with gradually closer spacing are symmetrically provided on both sides of the first transmission device, and second guide plates with gradually closer spacing are symmetrically provided on both sides of the second transmission device.

[0022] Preferably, the scrubbing and drying device further comprises a shaping insert area, which comprises a third transmission device and a third guide plate. The third transmission device is a round belt transmission belt. The third guide plates are symmetrically arranged on both sides of the third transmission device, and the distance between the two third guide plates is gradually approaching.

[0023] Preferably, a detection sensor is provided below the third transmission device.

[0024] Preferably, the discharging and loading device includes an empty basket area, a full basket area, a loading area and a transfer robot. The empty basket area and the full basket area are respectively arranged on both sides of the loading area. The empty basket area and the full basket area have opposite transmission directions. A crossbeam is provided on the frame, the crossbeam is arranged above the loading area, and the transfer robot is arranged on the crossbeam.

[0025] Preferably, the upper plate area is provided with an insert lifting module;

[0026] Preferably, the transfer robot comprises two sets of grippers.

[0027] Preferably, the full basket area includes a first transmission line, a second transmission line and a third transmission line arranged in sequence, the length of the first transmission line is one film basket width, the second transmission line is two film basket widths, and the third transmission line is three film basket widths. The first transmission line, the second transmission line and the third transmission line are all located in independent transmission belts and transition smoothly.

[0028] The advantages and positive effects of the present invention are: realizing the automated production of cleaning, drying and inserting of semiconductor wafers after cutting; improving equipment production capacity while reducing personnel requirements, thereby reducing silicon wafer manufacturing costs for enterprises; and ensuring the integrity of silicon wafers and reducing the fragmentation rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of a top view of the structure of an embodiment of the present invention;

[0031] Figure 3 This is a schematic structural diagram of a sheet suction device according to an embodiment of the present invention;

[0032] Figure 4 It is a schematic structural diagram of a scrubbing and drying device according to an embodiment of the present invention.

[0033] In the picture:

[0034] 1. Frame 2. Transmission slot 3. Vertical slicing device

[0035] 31. Propulsion device 32. Suction device 33. Adsorption manipulator

[0036] 34. Flushing device 35. Suction roller 4. Brushing and drying device

[0037] 41. First transmission device 42. Spraying area 43. Scrubbing area

[0038] 44. Drying area 45. Shaping and inserting area 5. Discharging and loading device

[0039] 51. Empty basket area 52. Upper area 53. Full basket area

[0040] 54. Transfer robot DETAILED DESCRIPTION

[0041] An embodiment of the present invention is described below with reference to the accompanying drawings.

[0042] like Figure 1-2As shown, the present invention relates to an underwater silicon wafer vertical slicing mechanism that can fully automatically clean, dry, and insert semiconductor wafers after cutting, reduce labor costs, and improve work efficiency. The mechanism comprises a vertical slicing device 3, a brushing and drying device 4, and a discharging and loading device 5 arranged on a frame 1. A transmission trough 2 is provided at the front end of the frame 1. The vertical slicing device 3 and the brushing and drying device 4 are arranged in the transmission trough 2. The transmission trough 2 is filled with water. After the vertical slicing device 3 and the brushing and drying device 4 slice the silicon wafers, they are brushed clean during the transmission process. The discharging and loading device 5 is arranged downstream of the frame 1, and the silicon wafers complete the loading process at this position.

[0043] The vertical wafer separation device 3 includes a propulsion device 31, a wafer suction device 32, and a suction manipulator 33. The propulsion device 31 is used to propel the vertically placed silicon wafers forward, allowing the frontmost wafer to contact the wafer suction device 32. The propulsion device 31 comprises a wafer trough located within the transfer trough 2 and a propulsion cylinder. The wafer trough is an open frame structure with welded rod-like structures, which can both confine the circular silicon wafers and keep them immersed in the water-filled transfer trough 2 and flushed by the water flow. The propulsion cylinder is located upstream of the wafer trough. The propulsion cylinder piston end is equipped with a pusher blade, which extends into the wafer trough. The pusher blade is pushed forward by the propulsion cylinder, thereby moving the silicon wafers forward and replacing the removed wafers. The propulsion cylinder only needs to be able to achieve the propulsion function. The base of the pusher cylinder can be fixed to the wall of the transfer trough 2 or to the wafer trough frame.

[0044] like Figure 3As shown, the film suction device 32 includes a film suction plate and a film suction roller 35. The film suction plate is vertically arranged downstream of the silicon wafer groove for sucking the nearest silicon wafer. The film suction plate can be rectangular and has a through water suction port. The water suction port on the rear side of the film suction plate is connected to a water pump. The water pump creates suction in front of the film suction plate through the pumping action, and absorbs the nearest silicon wafer; the film suction roller 35 is arranged above the film suction plate and can move the absorbed silicon wafer upward to realize the extraction action of the single silicon wafer; in order to better realize the extraction action, the film suction roller 35 includes a first roller and a second roller. The first roller is arranged on the upper edge of the film suction plate and is connected to the film suction plate with a shaft to realize friction on the absorbed silicon wafer. The second roller is arranged above the first roller and has two ends of the shaft connected to the side wall of the transmission groove 2 to assist the first roller in rubbing the absorbed silicon wafer, so that the silicon wafer moves upward. In this way, the friction formed by the arrangement of multiple rollers can move the absorbed silicon wafer upward faster, thereby realizing the rubbing of the silicon wafer. To facilitate the suction effect of the wafer suction plate, the wafer trough can be movably arranged in the transmission trough 2 by a movable cylinder, so that the wafer trough can move back and forth relative to the transmission trough 2 under the action of the movable cylinder. The rear baffle of the wafer trough is provided with a notch, and the wafer suction plate can be inserted into the notch, conveniently fitting directly with the last silicon wafer to facilitate the suction effect. In order to achieve the suction of a single silicon wafer and reduce the effect of water tension on adjacent silicon wafers, two flushing devices 34 are symmetrically arranged upstream of the wafer suction plate. They flush water towards the silicon wafer passing through the middle, loosening the adjacent silicon wafers and facilitating the suction of the single wafer. The flushing device 34 is provided with a flushing hole, which is higher than the horizontal plane of the transmission trough 2. The flushing holes are multiple and closely arranged in a straight line to maintain continuous water impact. The flushing holes are connected to a water pump.

[0045] The adsorption manipulator 33 is a manipulator with a vacuum suction cup at the end. There are no less than three vacuum suction cups. It is necessary to ensure that at least one suction cup adsorbs the silicon wafer, so that the silicon wafer can be lifted without relative sliding. The silicon wafer that is extracted and moved upward can be adsorbed and grabbed, thereby realizing the slicing action. The vacuum suction cup is connected to a vacuum operating system. The vacuum operating system is the same as the existing one. It should include components such as a vacuum generator, an air-water separator, a vacuum filter, a vacuum check valve, and a vacuum suction cup. In addition, it is also required to have a vacuum degree detection and an air source pressure detection. When the vacuum degree is insufficient or the air source pressure is insufficient, an alarm is implemented to shut down the machine. In addition, in order to avoid accidental injury to the manipulator, a safety grating is set within the vertical slicing device 3. During the normal operation of the equipment, if a person enters the operating area, the slicing-related mechanisms will stop working and an alarm will be issued; when the person exits the area, the operation will resume.

[0046] like Figure 4As shown, the scrubbing and drying device 4 includes a spraying area 42, a scrubbing area 43 and a drying area 44 in sequence, which clean and dry the transferred silicon wafers. The spraying area 42 includes a first transmission device 41 and a spray pipe group. The first transmission device 41 is two parallel round belt conveyors. The transmission power adopts a stepping motor. The adsorption manipulator 33 turns the sucked silicon wafers to be placed horizontally on the first transmission device 41. The first transmission device 41 is symmetrically provided with first guide plates with gradually increasing spacing on both sides. The first guide plates are fixedly set on the side wall of the transmission trough 2. The spacing between the outlet ends is greater than the diameter of the silicon wafer. The first guide plates are used to adjust the position of the silicon wafer so that it can smoothly enter the next link. The spray pipe group can be one or more groups. A group of spray The pipe group includes two spray pipes symmetrically arranged on both sides of the first transmission device 41. The spray pipes can spray water relative to each other, thereby cleaning the upper and lower surfaces of the silicon wafers moving on the first transmission device 41. In order to achieve a better spraying effect, the spray pipe is provided with a linear water spray port, and the spray pipe sprays water in a water curtain state; the spray pipe can be connected to the side wall of the transmission trough 2 through a rotating shaft, so that the spray pipe can rotate at an angle. The spray pipe body is connected to a water pump through a water inlet pipe, which can adjust the water curtain pressure and the angle between the water curtain and the silicon wafer surface, thereby adjusting the spray cleaning intensity and effect.

[0047] The scrubbing area 43 includes a set of symmetrically positioned powered roller brushes, which can be one or more sets connected by a synchronous belt. The symmetrically positioned roller brushes rotate at the same speed relative to each other, with the spacing between each set adjustable. The power is provided by a stepper motor. After the silicon wafer passes through the first conveyor 41, the powered roller brushes scrub and convey it. The drying area 44 includes a second conveyor and a drying tube assembly. One drying tube assembly includes two symmetrically positioned drying tubes, each capable of discharging air in a direction opposite to the other. The drying tubes have linear air outlets, and the nozzles discharge air in the form of a curtain. The drying tubes are connected to an air pump, and the flow rate and pressure of the upper and lower curtains can be controlled separately by regulating valves. The drying tubes can be connected to the sidewalls of the conveyor trough 2 via a rotating shaft, allowing the drying tubes to adjust the air direction. The second conveyor is a conveyor roller, which can be made of 304 stainless steel coated with polyurethane or rubber. It can be powered by a stepper motor and a synchronous belt, allowing the silicon wafer to move forward under the action of the conveyor roller. Second guide plates with gradually spaced intervals are symmetrically provided on both sides of the second conveyor to prevent the silicon wafer from shifting sideways.

[0048] The scrubbing and drying device 4 also includes a wafer shaping and insertion area 45, which adjusts the position of the silicon wafers and prepares them for loading. This area 45 includes a third conveyor and third guide plates. The third conveyor is a circular belt conveyor. The third guide plates are symmetrically arranged on either side of the third conveyor, with the two third guide plates gradually spaced apart. After the silicon wafers pass through the wafer shaping and insertion area 45, they are kept in the same position. A detection sensor is located below the third conveyor to detect whether the silicon wafers have passed on time, whether the silicon wafers have been properly inserted into the basket, and whether they have been inserted into the basket. In addition, a debris detection sensor can be installed in the wafer shaping and insertion area 45 to check whether the silicon wafers are intact. Silicon wafer detection sensors can be set in the four areas of the scrubbing and drying device 4. If a silicon wafer is stuck in a certain area, an alarm can be sounded, and the silicon wafer can be manually taken out before continuing to operate; the inlet and outlet sensors of the conveyor line must have a counting function, and the number of wafers is displayed on the main control screen. When a silicon wafer enters the line entrance, after a certain delay, the wafer position sensor does not detect the silicon wafer, and the equipment will alarm to remind that the silicon wafer is stuck in the line, and manual intervention is required; the sensor needs to consider waterproofness and the impact of water droplets on the sensor. The above sensors can be selected from commercially available sensors with corresponding functions.

[0049] The discharging and loading device 5 includes an empty basket area 51, a full basket area 53, an upper wafer area 52 and a transfer robot 54. The empty basket area 51 and the full basket area 53 are respectively arranged on both sides of the upper wafer area 52. The transmission directions of the empty basket area 51 and the full basket area 53 are opposite, and they are respectively used to transmit the empty basket to the upper wafer area 52 and transmit the full basket filled with silicon wafers away; the empty basket transmission line is a whole line body, and a detection sensor can be set at the wafer insertion waiting position, and the wafer insertion waiting position is flush with the upper wafer area 52; a basket separation mechanism can be set to ensure that a single wafer basket enters the wafer insertion waiting position; if necessary, a shaping mechanism can be set at the wafer insertion waiting position to regularize the wafer basket.

[0050] A crossbeam is provided on the frame 1, and the crossbeam is arranged above the upper sheet area 52. The transfer robot 54 is arranged on the crossbeam, so that the transfer robot 54 can move horizontally to move the empty or full basket into or out of the upper sheet area 52; the transfer robot 54 is composed of a horizontal movement module, a vertical lifting module and a clamping mechanism. The horizontal movement module adopts a servo motor and a linear module, the vertical lifting module adopts a guide rail and a lead screw, and the clamping mechanism adopts a clamping cylinder. The transfer robot 54 includes two sets of clamps, one set for grabbing the empty basket and the other set for grabbing the full basket. They operate synchronously, and while removing the full basket, they also move the empty basket in the empty basket waiting position to the upper sheet area 52. The upper sheet area 52 is provided with a wafer lifting module. The wafer lifting module adopts a servo motor and a lead screw guide rail. It is used to cooperate with the silicon wafers transmitted by the third transmission device. Similar to the existing wafer lifting module, a fixed clamping device is provided above the lifting platform, a wafer basket detection sensor is provided, and a wafer stop device is added to the rear of the wafer basket.

[0051] The full basket area 53 includes a first, second, and third conveyor line arranged in sequence. The first conveyor line is one basket width long and serves as the placement location for full baskets; the second conveyor line is two basket widths long and serves as the storage location for full baskets; and the third conveyor line is three basket widths long and serves as the unloading location for full baskets. The first, second, and third conveyor lines are all independent conveyor belts with a smooth transition. When a full basket is on the first conveyor line, it is transferred to the second conveyor line, which then moves forward in a step-by-step manner. When the second conveyor line holds two full baskets and there is one full basket on the first conveyor line, the three conveyor lines continue to operate, transferring the three full baskets to the third conveyor line. Operation stops when a full basket on the first conveyor line leaves the first conveyor line.

[0052] Example:

[0053] A vertical slicing mechanism for underwater silicon wafers includes a vertical slicing device 3, a brushing and drying device 4, and a discharging and loading device 5. A transmission trough 2 is provided at the front end of a frame 1, the vertical slicing device 3 and the brushing and drying device 4 are arranged in the transmission trough 2, and the discharging and loading device 5 is arranged downstream of the frame 1.

[0054] The vertical wafer separation device 3 includes a propulsion device 31, a wafer suction device 32 and an adsorption manipulator 33; the propulsion device 31 includes a wafer slot and a push cylinder arranged in the transmission slot 2, the push cylinder is arranged upstream of the wafer slot, and a pusher is provided at the piston end of the push cylinder, and the pusher extends into the wafer slot; the wafer suction device 32 includes a wafer suction plate and a wafer suction roller 35, the wafer suction plate is arranged vertically downstream of the wafer slot, the wafer suction plate is provided with a water pump connected to the water pump, the wafer suction roller 35 is arranged above the wafer suction plate, and the wafer suction roller 35 includes a first roller and a second roller. The first roller is arranged at the upper edge of the wafer suction plate, and the second roller is arranged above the first roller. The silicon wafer slot is movably arranged in the transmission slot 2 by a movable cylinder. A notch is provided at the tail end of the silicon wafer slot, and the wafer suction plate can be inserted into the notch. The suction manipulator 33 is a manipulator with three vacuum suction cups at the end, and the vacuum suction cups are connected to a vacuum operating system. Two flushing devices 34 are symmetrically arranged upstream of the wafer suction plate. The flushing devices 34 are provided with flushing holes. The flushing holes are arranged in a straight line and connected to a water pump. The silicon wafer slot is a frame-shaped frame with open ends.

[0055] The scrubbing and drying device 4 includes a spraying area 42, a scrubbing area 43 and a drying area 44 in sequence; the spraying area 42 includes a first transmission device 41 and a spray pipe group, the first transmission device 41 is a round belt transmission belt, and the first transmission device 41 is symmetrically provided with first guide plates with a gradual spacing on both sides, and a group of spray pipe groups includes two spray pipes symmetrically arranged in an upper and lower manner, the spray pipes can spray water relative to each other, and the spray pipes are provided with linear water spray ports; the scrubbing area 43 includes power roller brushes symmetrically arranged in an upper and lower manner, and the power roller brushes are connected by a synchronous belt, including two groups of four power roller brushes symmetrically arranged; the drying area 44 includes a second transmission device and a drying tube group, the second transmission device is a transmission roller, and second guide plates with a gradual spacing are symmetrically arranged on both sides of the second transmission device. A group of drying tube groups includes two drying tubes symmetrically arranged up and down, and 3 groups are arranged. The drying tubes can discharge air relative to each other, and the drying tubes are provided with a linear air outlet; the scrubbing and drying device 4 also includes a shaping insert area 45, the shaping insert area 45 includes a third transmission device and a third guide plate, the third transmission device is a round belt transmission belt, the third guide plates are symmetrically arranged on both sides of the third transmission device, and the two third guide plates are gradually spaced apart. A detection sensor is provided under the third transmission device.

[0056] The discharging and loading device 5 includes an empty basket area 51, a full basket area 53, an upper sheet area 52 and a transfer robot 54. The empty basket area 51 and the full basket area 53 are respectively arranged on both sides of the upper sheet area 52. The upper sheet area 52 is provided with a sheet insertion lifting module. The transmission directions of the empty basket area 51 and the full basket area 53 are opposite. A crossbeam is provided on the frame 1, and the crossbeam is arranged above the upper sheet area 52. The transfer robot 54 is arranged on the crossbeam, and the transfer robot 54 includes two sets of clamps; the full basket area 53 includes a first transmission line, a second transmission line and a third transmission line arranged in sequence. The length of the first transmission line is one sheet basket width, the second transmission line is two sheet basket widths, and the third transmission line is three sheet basket widths. The first transmission line, the second transmission line and the third transmission line are all located in independent conveyor belts and have a smooth transition.

[0057] The working process of this example is as follows: the moving cylinder pushes the silicon wafer slot so that the slot is engaged with the adsorption plate, and the water outlet pumps water so that the adsorption plate adsorbs the nearest silicon wafer, and the silicon wafer is rubbed up by the roller, and is grabbed and prevented from being placed on the first transmission device 41 by the adsorption manipulator 33. The silicon wafer moves forward under the drive of the first transmission device 41, and is sprayed by the upper and lower water curtains within the spray area 42, and then enters the scrubbing area 43, where it is scrubbed and moved forward by the power roller brush, so that the silicon wafer enters the drying process. In area 44, the wafers are air-dried through the drying tube under the action of the transmission roller, and the falling water enters the transmission trough 2. The wafers are kept moving in a straight line under the action of the first guide plate, the second guide plate and the third guide plate, and matched with the wafer loading device. The wafers are loaded into the wafer basket of the upper wafer area 52 in turn. When the wafer basket of the upper wafer area 52 is full, the transfer robot 54 grabs the empty basket at the empty basket waiting position and the full basket of the upper wafer area 52 respectively. After translation, the empty basket is placed in the upper wafer area 52, and the full basket is moved to the full basket area 53.

[0058] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A vertical silicon wafer separation mechanism in water, characterized by: It includes a vertical slicer, a scrubbing and drying device and a discharging and loading device. A transmission trough is provided at the front end of the frame. The vertical slicer and the scrubbing and drying device are arranged in the transmission trough. The discharging and loading device is arranged downstream of the frame. The vertical sheet separation device comprises a propulsion device, a sheet suction device and an adsorption manipulator; The propulsion device is used to propel the vertically placed silicon wafers forward, so that the frontmost silicon wafer can contact the wafer suction device; The wafer suction device is used to suck the nearest silicon wafer and move the sucked silicon wafer upward to realize the extraction of a single silicon wafer; the suction manipulator can suck and grab the extracted and moved silicon wafer to realize the wafer separation action, and the suction manipulator turns the sucked silicon wafer to horizontally place it on the first transmission device of the scrubbing and drying device; The discharging and loading device includes an empty basket area, a full basket area, a loading area and a transfer robot. The full basket area includes a first transmission line, a second transmission line and a third transmission line arranged in sequence. The length of the first transmission line is one sheet basket width, which is a full basket placement position; the second transmission line is two sheet basket widths, which is a full basket storage position; the third transmission line is three sheet basket widths, which is a full basket unloading position; the first transmission line, the second transmission line and the third transmission line are all located on independent conveyor belts and have a smooth transition.

2. The underwater silicon wafer vertical slicing mechanism according to claim 1, characterized in that: The propulsion device comprises a silicon wafer slot and a push cylinder arranged in the transmission slot, wherein the push cylinder is arranged upstream of the silicon wafer slot, and a push piece is arranged at the piston end of the push cylinder, and the push piece extends into the silicon wafer slot; The wafer suction device comprises a wafer suction plate and a wafer suction roller, wherein the wafer suction plate is vertically arranged downstream of the silicon wafer groove, the wafer suction plate is provided with a water suction port, the water suction port is connected to a water pump, and the wafer suction roller is arranged above the wafer suction plate; The adsorption robot is a robot with a vacuum suction cup at the end, and the vacuum suction cup is connected to a vacuum operating system.

3. The underwater silicon wafer vertical slicing mechanism according to claim 2, characterized in that: The number of vacuum suction cups is no less than three.

4. The underwater silicon wafer vertical slicing mechanism according to claim 2, characterized in that: Two flushing devices are symmetrically arranged upstream of the wafer suction plate. The flushing devices are provided with flushing holes, and the flushing holes are connected to a water pump. The silicon wafer slot is in the shape of a frame with two sides open.

5. The underwater silicon wafer vertical slicing mechanism according to claim 4, characterized in that: The flushing holes are a plurality of holes arranged in a straight line.

6. The underwater silicon wafer vertical slicing mechanism according to claim 2, characterized in that: The silicon wafer slot is movably arranged in the transmission slot by a movable cylinder, and a notch is arranged at the tail of the silicon wafer slot, and the wafer suction plate can be embedded in the notch.

7. The underwater silicon wafer vertical slicing mechanism according to claim 2, characterized in that: The film suction roller includes a first roller and a second roller, wherein the first roller is arranged on the upper edge of the film suction plate, and the second roller is arranged above the first roller.

8. The underwater silicon wafer vertical slicing mechanism according to any one of claims 2 to 7, characterized in that: The scrubbing and drying device comprises a spraying area, a scrubbing area and a drying area in sequence; The spraying area includes the first transmission device and a spraying pipe group, one group of the spraying pipe group includes two spraying pipes symmetrically arranged up and down, and the spraying pipes can spray water relative to each other; The scrubbing area includes power roller brushes symmetrically arranged up and down, and the power roller brushes are connected by a synchronous belt; The drying area includes a second transmission device and a drying tube group. One group of the drying tube groups includes two drying tubes symmetrically arranged up and down, and the drying tubes can discharge air relative to each other.

9. The underwater silicon wafer vertical slicing mechanism according to claim 8, characterized in that: The spray pipe is provided with a linear water spray port; the drying pipe is provided with a linear air outlet.

10. The underwater silicon wafer vertical slicing mechanism according to claim 8, characterized in that: The first transmission device is a round belt transmission belt, and the second transmission device is a transmission roller.

11. The underwater silicon wafer vertical slicing mechanism according to claim 8, characterized in that: The first transmission device is symmetrically provided with first guide plates with a gradual interval on both sides, and the second transmission device is symmetrically provided with second guide plates with a gradual interval on both sides.

12. The underwater silicon wafer vertical slicing mechanism according to claim 8, characterized in that: The scrubbing and drying device also includes a shaping insert area, which includes a third transmission device and a third guide plate. The third transmission device is a round belt transmission belt. The third guide plates are symmetrically arranged on both sides of the third transmission device, and the distance between the two third guide plates is gradually close.

13. The underwater silicon wafer vertical slicing mechanism according to claim 12, characterized in that: A detection sensor is provided below the third transmission device.

14. The underwater silicon wafer vertical slicing mechanism according to any one of claims 2 to 7, characterized in that: The empty basket area and the full basket area are respectively arranged on both sides of the upper sheet area, and the transmission directions of the empty basket area and the full basket area are opposite. A crossbeam is provided on the frame, and the crossbeam is arranged above the upper sheet area. The transfer robot is arranged on the crossbeam.

15. The underwater silicon wafer vertical slicing mechanism according to claim 14, characterized in that: The upper plate area is provided with an insert plate lifting module.

16. The underwater silicon wafer vertical slicing mechanism according to claim 14, characterized in that: The transfer robot comprises two sets of clamping claws.

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