Device and method for establishing an electrically conductive connection between two substrates

Abstract

The invention relates to a method for producing an electrically conductive connection between two substrates (1, 2), wherein a first substrate (1) and a second substrate (2) as well as an electrically conductive first connection component (3; 21) and an electrically conductive second connection component (4; 22) are provided. The first connection component (3; 21) is mounted on the first substrate (1) by means of producing a first detachable connection (11), and the second connection component (4; 22) is mounted on the second substrate (2) by means of producing a detachable connection (12). According to the invention, an electrically conductive connection assembly is produced comprising a first connection part (3; 21) and a second connection part (4; 22), wherein an integral connection (16) is established between a connection portion (7) of the first connection part (3) and a connection portion (10) of the second connection part (4) or an electrically conductive cross member (20) is provided, and an integral connection (16) of a first length portion (24) of the cross member (20) to the connection portion (7) of the first connection part (21) and a second integral connection (16') of a second length portion (26) of the cross member (20) to the connection portion (10) of the second connection part are established. The invention also relates to a method and an arrangement (17) for releasing an electrically conductive connection.

Description

Technical Field

[0001] The present disclosure relates to an arrangement and a method for producing an electrically conductive connection between two substrates, in particular between two printed circuit boards. Background Art

[0002] Methods and arrangements of the kind mentioned at the outset are in principle known from the prior art. For example, it is known to connect two substrates by means of an internal plug-in connection, but this is complex and a connection of this kind has only limited robustness. The connection of two substrates by means of a threaded busbar is likewise common; this is also complex and can only provide a limited robustness of the connection. Finally, so-called press-fit connectors are known for connecting two substrates, but these connectors only allow tolerance compensation limited to one direction (in particular vertically). It is also found to be disadvantageous that none of the known connection technologies for connecting substrates combines the following properties: a) releasability and the resulting maintainability (both during manufacturing and in use), b) possible tolerance compensation even with regard to the pre-installation of the substrates and the dimensions of the components, preferably in all three spatial directions, and c) the desired robustness of the connection. Summary of the invention

[0003] Against this background, the object of the present disclosure is to advantageously develop a method of the type mentioned at the outset. In particular, the object is to be able to avoid at least some or, as far as possible, all of the above-mentioned disadvantages.

[0004] A first aspect of the disclosure is directed to a method for establishing an electrically conductive connection between two substrates, in particular a connection having a high current capability.

[0005] According to one step of the method for producing an electrically conductive connection, a first substrate and a second substrate are provided.

[0006] According to a further method step, a first electrically conductive connection component and a second electrically conductive connection component are provided. Each connection component has a mounting portion and a connection portion.

[0007] According to a further method step, the first connecting component is mounted on the first substrate by means of establishing a first releasable connection between a mounting portion of the first connecting component and the first substrate, and the second connecting component is mounted on the second substrate by means of establishing a second releasable connection between a mounting portion of the second connecting component and the second substrate.

[0008] According to a further method step, an electrically conductive connection assembly is produced comprising a first connection element and a second connection element. By means of the connection assembly for producing an electrically conductive connection, an electrically conductive connection between a conductor track structure of a first substrate and a conductor track structure of a second substrate is advantageously produced.

[0009] In one embodiment of the method, producing the connection assembly comprises the method step of establishing a bonding connection between a connection portion of the first connection component and a connection portion of the second connection component.

[0010] In an alternative embodiment of the method, producing the connection assembly comprises the method steps of providing a cross-member, establishing a bonding connection between a first length portion of the cross-member and a connection portion of the first connection component, and establishing a second bonding connection between a second length portion of the cross-member and a connection portion of the second connection component. The cross-member preferably has an elongated shape, and the first and second length portions are offset relative to each other, in particular offset along a main extension direction of the cross-member, and may be spaced apart from each other along the main extension direction.

[0011] In an embodiment of the method according to the first aspect, one or more bonding connections are established after the above-mentioned other method steps.

[0012] A second aspect discloses a method for releasing a conductive connection between two substrates. The method according to this aspect comprises performing the method for establishing a conductive connection between two substrates according to the first aspect. After a method step of establishing a bonding connection or a method step of establishing a plurality of bonding connections, the first releasable connection and / or the second releasable connection are released, in particular for the purpose of maintenance work. In particular, the connection assembly is released from the first substrate and the second substrate, respectively, by means of releasing the first and second releasable connections, respectively.

[0013] A third aspect discloses an arrangement having a first substrate, a second substrate and a conductive connection assembly. The arrangement is preferably produced using the method according to the first aspect.

[0014] The connection assembly has a conductive first connection component having a mounting portion and a connection portion. It further has a conductive second connection component having a mounting portion and a connection portion. The mounting portion of the first connection component is connected to the first substrate by means of a releasable connection, and the mounting portion of the second connection component is connected to the second substrate by means of a releasable connection.

[0015] In one embodiment, the connecting portion of the first connecting component and the connecting portion of the second connecting component are connected by means of a bonding connection. In an alternative embodiment, the connecting assembly comprises an electrically conductive cross member, wherein a first length portion of the cross member is connected to the connecting portion of the first connecting component by means of a bonding connection, and a second length portion of the cross member is connected to the connecting portion of the second connecting component by means of a second bonding connection.

[0016] The following properties can be combined as advantages: a) releasability and the resulting repairability (during production and in use), b) possible tolerance compensation even with regard to the pre-assembly of the substrates and the dimensions of the components, preferably in all three spatial directions, and c) the desired robustness of the connection. In particular, particularly good repairability is advantageously produced by the above-mentioned releasable connection on the two substrates. In this respect, the releasable connection can also be referred to as a repairable connection.

[0017] In this way, a high degree of automation, in particular automation with short cycle times, can be advantageously achieved. Controlled positioning can be dispensed with. Process control via process parameters can advantageously be possible (in contrast to this, involving a large number of geometrical tolerances, for example in the case of a screw connection). As will be explained below, the invention also advantageously enables particle-free final installation. The method and arrangement are suitable for all connectors of circuit boards and are particularly attractive in the case of high current intensities and strict safety requirements, where - for example due to the preferred particle-free design - good insulation can be enabled.

[0018] It goes without saying that the two connecting parts are connected electrically conductively, in particular by being fixed to each other in direct contact with each other. Since at least two or more substrates can be connected to each other in this electrically conductive manner, in particular with high current capability, the method and the corresponding arrangement also enable high current applications, in particular with a modular design.

[0019] A connection with high current capability is understood to mean a connection suitable for transmitting currents of the order of magnitude of 10 amperes to 1000 amperes, and in particular a connection suitable therefor. In the context of the present invention, a releasable connection is understood in each case to mean a connection which can be released in such a way that at least one connection partner can be reused after the connection has been released. The substrate is preferably a circuit board which, for its part, contains electrically insulating material and electrically conductive connections (conductor tracks) adhered thereto.

[0020] The features of the embodiments and developments of the method according to the first aspect, the method according to the second aspect and the arrangement according to the third aspect will be explained below. Each of these features can also be used for the embodiments and developments of the method and arrangement according to other aspects, even if they are not explicitly discussed in conjunction with the method or arrangement of the corresponding aspect.

[0021] In an advantageous embodiment, the first and / or the second connecting component is a one-piece metal component—that is to say a metal component which is in particular produced from a single workpiece and does not consist of several individual elements—for example a metal block or a sheet metal component.

[0022] In one embodiment of the method according to the first aspect, a first electrically conductive stamped strip is provided as the first connecting part and a second electrically conductive stamped strip is provided as the second connecting part.The stamped strip is for example a metal strip, in particular a sheet metal strip, which can advantageously be produced by stamping.

[0023] In a development of this embodiment, the first substrate and the second substrate are mounted in a fixed position relative to each other so that the connecting portion of the first stamping band and the connecting portion of the second stamping band overlap in an overlapping area, and a combined connection between the connecting portion of the first stamping band and the connecting portion of the second stamping band is established in the overlapping area, in particular by means of a welding connection.

[0024] In one embodiment of the arrangement, the first connecting member is an electrically conductive first stamped strip and the second connecting member is an electrically conductive second stamped strip. The first substrate and the second substrate are mounted in a fixed position relative to each other such that a connecting portion of the first stamped strip and a connecting portion of the second stamped strip overlap in an overlapping region. The connecting portion of the first stamped strip and the connecting portion of the second stamped strip are connected in the overlapping region by means of a bonding connection.

[0025] In one development, after establishing the first releasable connection, in particular long before establishing the bonding connection, the connecting portion of the first stamped strip extends parallel to or substantially parallel to the extension direction of the first substrate. As an alternative or in addition, after establishing the second releasable connection, in particular long before establishing the bonding connection, the connecting portion of the second stamped strip may extend parallel to or substantially parallel to the extension direction of the second substrate. In this case, it is particularly provided that the first stamped strip has a length portion adjacent to its mounting portion, and that the length portion and the connecting portion of the first stamped strip extend at right angles or substantially at right angles to each other. In addition or as an alternative, it can be provided that the second stamped strip has a length portion adjacent to its mounting portion, and that the length portion and the connecting portion of the second stamped strip extend at right angles or substantially at right angles to each other. In particular, the length portion and the connecting portion of the respective stamped strip form an L-shape in this way. Within the meaning of the present disclosure, a substantially parallel range or a substantially right-angled profile is understood to mean an angle difference of up to 10° as given.

[0026] In some embodiments, after the step of mounting the first substrate and the second substrate in a fixed position relative to each other, there may be a gap between the connecting portion of the first stamped strip and the connecting portion of the second stamped strip. In particular, the connecting portion of the first stamped strip and the connecting portion of the second stamped strip may be spaced apart transversely, in particular perpendicularly, to the longitudinal direction of the connecting portion of the first stamped strip and / or transversely, in particular perpendicularly, to the longitudinal direction of the connecting portion of the second stamped strip. In this case, the longitudinal direction is in particular the main extension direction of the respective portion, in particular a direction parallel to its longest edge.

[0027] In a development of this embodiment, the gap is reduced or eliminated before the connecting part of the first stamped strip is connected to the connecting part of the second stamped strip by means of a bonding connection. The cross-sections of the stamped strips are preferably selected so that they have a certain degree of flexibility, wherein the stamped strips can preferably be bent with relatively low forces in order to eliminate the gap without significantly or even disadvantageously subjecting their connection points to loads of one of the substrates in the process. This also makes it possible to easily compensate for vertical tolerances between the two connecting parts in a simple manner before the bonding connection (for example by bending one or both stamped strips with a pair of pliers) in order to reduce or eliminate the gap, which vertical tolerances can be, for example, 0.4 mm or can be different from each other. In this context, for example, the gap is reduced or eliminated by deforming the first stamped strip and / or the second stamped strip, in particular by means of a pair of pliers, wherein the bending is performed in an elastic, in particular purely elastic manner.

[0028] In one embodiment, the first and second stamped strips are dimensioned and arranged (in particular before the bonding connection is established) such that the connecting portion of the first stamped strip and the connecting portion of the second stamped strip form a flat contact zone with each other in their overlapping region, wherein the area extent of the contact zone is greater than the area extent of the soldered connection. In this way, lateral tolerances between the substrates, which can be in the order of magnitude of 1 mm, for example, can be advantageously compensated.

[0029] In one embodiment, the connection assembly consists of two stamped strips.

[0030] In another embodiment - instead of a stamped strip - a first electrically conductive platform is provided as the first connecting element and a second electrically conductive platform is provided as the second connecting element. The electrically conductive platform is, for example, a metal block, for example a metal cube. The mounting portion is, for example, the surface of the first and second platform facing the first and second substrate, respectively. The connecting portion is, for example, the surface of the respective platform opposite to the mounting portion - in other words: the surface facing away from the respective substrate.

[0031] Furthermore, in this embodiment, preferably an electrically conductive cross member is provided, the first length portion of the cross member adjoining its first longitudinal end and the second length portion of the cross member adjoining its second longitudinal end. In a development, the first substrate and the second substrate are mounted in a fixed position relative to each other such that the first length portion of the cross member overlaps the connecting portion of the first platform in a first overlapping region and the second length portion of the cross member overlaps the connecting portion of the second platform in a second overlapping region. A bonding connection between the first length portion and the first connecting portion is preferably established in the first overlapping region and a second bonding connection between the second length portion and the second connecting portion is preferably established in the second overlapping region.

[0032] In one embodiment of the arrangement, the first connection component is a conductive first platform and the second connection component is a conductive second platform. The connection assembly has a conductive cross member as a cross member, a first length portion adjacent to a first longitudinal end of the cross member, and a second length portion adjacent to a second longitudinal end of the cross member. The first substrate and the second substrate are mounted in a fixed position relative to each other such that the first length portion overlaps the connection portion of the first platform in a first overlapping region and is connected to the connection portion of the first platform by means of a bonded connection in the first overlapping region, and the second length portion overlaps the connection portion of the second platform in a second overlapping region and is connected to the connection portion of the second platform by means of a second bonded connection in the second overlapping region.

[0033] According to one development, the connecting assembly consists of two platforms and a cross member.

[0034] According to one embodiment, the cross member is a flexible strip, in particular a flexible metal strip. In this way tolerances can be compensated particularly easily.

[0035] As a preferred development for a connection with a high current capability, it is possible that the first connection part contains copper or consists of pure copper and / or the second connection part contains copper or consists of pure copper and / or the cross member contains copper or consists of pure copper. Pure copper is preferred due to its high electrical conductivity, making it particularly suitable for connections with a high current capability. However, it goes without saying that any other metal or any other alloy can be used instead of copper, as long as it is suitable for the described method steps.

[0036] It is considered advantageous if the first releasable connection is a solder connection, in particular by means of through-hole technology (THT) or by means of surface mounting (SMD), or a press fit, and / or if the second releasable connection is a solder connection, in particular by means of through-hole technology (THT) or by means of surface mounting (SMD), or a press fit. Instead of a solder connection or a press fit, any other connection technology that is releasable in the explained sense can be used.

[0037] For example, in one development, as an alloy, in the case of a press fit, CuSn0.15 is used as material for the first connection part and / or the second connection part and / or the cross member. This alloy can also be resistance welded depending on the conditions and thus also opens up new options for producing (multiple) bonding connections.

[0038] According to one embodiment, the one bonding connection, the plurality of bonding connections or the at least one bonding connection are each a welded connection.

[0039] For example, if copper is used as material, a welded connection or multiple welded connections can be established by means of a laser welding method, in particular by means of a green laser, or by means of a resistance welding method. Welding by means of a green laser is associated with the advantage that it is suitable for welding copper and can produce particle-free welded connections, that is, welded connections without welding spatter. In this way, the risk of short circuits on the circuit can be avoided, especially in the case of high-current circuits, which exist in the case of conventional welded connections due to welding spatter. Welding allows a strong connection to be established in a desired manner. It is particularly advantageous that, as mentioned above, tolerance compensation in the lateral and vertical directions is possible in this process. However, instead of welding, any other, preferably particle-free connection technology combined with an overlapping technology for tolerance compensation can also be used.

[0040] According to one embodiment, the first substrate and / or the second substrate is a circuit board, in particular a printed circuit board (PCB) or a ceramic circuit board (DCB). The arrangement according to the third aspect is then in particular a circuit board arrangement. In a development, the method according to the first aspect is a method for producing a circuit board assembly, the circuit board assembly comprising a first substrate, which is in particular a first circuit board, a second substrate, which is in particular a second circuit board, and an electrically conductive connection assembly, wherein an electrically conductive connection between the first substrate and the second substrate is established by means of the connection assembly.

[0041] According to a further embodiment, the step of mounting the first substrate and the second substrate in a fixed position relative to each other comprises attaching the first substrate and the second substrate to a carrier with which they are commonly associated, in particular to a technical device, to a housing or a heat sink, such as, for example, a metal plate. In this arrangement, the first and second substrates are in particular mounted on a carrier.

[0042] In one development, the substrates are mounted on a carrier such that the first substrate and the second substrate are mounted next to each other, in particular in a common plane, and / or one above the other. In order to produce any desired geometry, it is possible in the case of the method to bend the stamped strips or cross members in any desired way, for example at flat overlap or contact areas. This bending can be performed after one or more bonding connections have been established.

[0043] In one embodiment, each of the two mounting parts, in particular a respective stamped strip or platform, is conductively connected to a conductor track of a substrate with which it is associated for connection purposes, wherein the respective conductive connection is in particular achieved by means of establishing a respective releasable connection to the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The present invention will be described in more detail below with reference to the accompanying drawings, which show preferred exemplary embodiments of the present invention. In the drawings:

[0045] Figure 1 Schematically showing steps 1-3 when implementing a preferred exemplary embodiment of a method according to the invention for establishing an electrically conductive connection between two substrates, and in step 4, a preferred step for releasing the electrically conductive connection between the two substrates, in corresponding cross-sectional views;

[0046] Figure 2 Likewise schematically shown are cross-sectional views of method steps when carrying out a second preferred exemplary embodiment of a method according to the invention for producing an electrically conductive connection between two substrates; and

[0047] Figure 3 The present invention schematically shows cross-sectional views of method steps when the second method according to the invention for producing an electrically conductive connection between two substrates is carried out in a preferred manner. DETAILED DESCRIPTION

[0048] Figure 1 In steps 1, 2 and 3, method steps are shown when performing a preferred exemplary embodiment of a first method for establishing an electrically conductive connection between two substrates 1 and 2 according to the present invention. In this example, each of the two substrates 1, 2 is a printed circuit board (PCB), which includes one or more layers, which are composed of an electrically conductive material and electrically conductive conductor tracks adhered thereto, in a manner not shown in detail. In this example, the method is used to establish a connection with a high current capability. In step 1, a first stamped strip 3 and a second stamped strip 4 are shown, each of which is a flexible strip composed of pure copper, provided for connection. The first stamped strip 3 includes a mounting portion 5, a length portion 6 adjacent thereto and a connecting portion 7, and the second stamped strip 4 includes a mounting portion 8, a length portion 9 adjacent thereto in a straight line and a connecting portion 10. As a result of step 1, the first stamped strip 3 is mounted on the first substrate 1 by means of an electrically conductive first releasable connection 11. In a corresponding manner, the second stamped strip 4 is mounted on the second substrate 2 by means of establishing an electrically conductive second releasable connection 12 between the mounting portion 8 of the second stamped strip 4 and the second substrate 2. In this example, the two releasable connections 11 , 12 are each a soldered connection (not shown in detail) established by means of through hole technology (THT).After step 1 , the two substrates 1 , 2 on which the stamped strips 3 , 4 are mounted are still freely movable relative to each other.

[0049] In this respect, only in step 2, the two substrates 1, 2 are mounted on their common carrier 13 so that the two substrates 1, 2 are in a fixed position or with a fixed gap relative to each other. This mounting can be performed using conventional techniques familiar to those skilled in the art. The mounting is performed in such a way that the connecting portion 7 and the connecting portion 10 overlap in the overlapping area 14, wherein in a direction perpendicular to the substrates 1, 2, there is initially a gap 15 between the two connecting portions 7, 10.

[0050] In step 3, the gap 15 extending transversely to the connection parts 7, 10 is eliminated by the punched strips 3, 4 being slightly bent by means of a pair of pliers, and the connection parts 7, 10 are connected by means of a solder connection 16 in the overlap area 14. In this example, the mounting part 6 is electrically conductively connected to an electrically conductive conductor track (also not shown) of a printed circuit board corresponding to the substrate 1 by means of a releasable connection 11 in a manner not shown in detail in the drawing. In a corresponding manner, the second punched strip is electrically conductively connected at its mounting part 8 by means of a second releasable connection 12 to an electrical conductor track of a printed circuit corresponding to the second substrate 2 in the example. The two conductor tracks of the substrates 1, 2 or, in this example, the circuit boards corresponding to these substrates 1, 2 are connected to one another in this way and have a high current capability.

[0051] As related to step 1 Figure 1 As shown, after establishing the first releasable connection 11 and before establishing the soldered connection 16, the connecting portion 7 of the first stamped strip 3 is parallel to the plane spanned by the first substrate 1 (perpendicular to Figure 1 The second punched strip 4 extends from the plane of the second punched strip 4 to the plane of the second punched strip 4, wherein the connecting portion 7 extends in a straight line at right angles to the length portion 6 adjacent to the mounting portion 5. The same applies to the second punched strip 4. Figure 1 It can also be clearly seen from the illustrations related to step 3 in that the area of ​​the solder connection 16 is smaller than the area of ​​the contact area located in the overlap area 14. In addition, in the illustrations, the reference numeral 1' indicates a circuit board corresponding to the substrate 1, and the reference numeral 2' indicates a circuit board corresponding to the substrate 2. Figure 1 In the exemplary embodiment shown, the two substrates 1, 2 are mounted next to each other in a common plane on a carrier 13. In this case, the illustration associated with step 3 simultaneously shows a preferred exemplary embodiment of an arrangement 17 according to the invention as a result of the method.

[0052] Figure 1The illustrations contained in the figure relating to step 4 relate to a method according to the invention for releasing an electrically conductive connection between two substrates 1, 2. In an exemplary embodiment, the method first requires the execution of the method described above. It is then provided that the two releasable connections 11, 12 are released again in order to be able to remove the mounting parts 5, 8 from the holes 18, 19 in the substrates 1, 2 associated with the mounting parts 5, 8 in the direction of the indicated arrows. In this way, the two stamped parts 3, 4 connected by means of a solder connection 16 can be removed (for example for the purpose of repair work) and can be replaced, for example, by a new stamped strip and a new solder connection.

[0053] Figure 2 The method steps when carrying out another preferred exemplary embodiment of the method according to the invention are schematically shown. For reasons of increased clarity, Figure 2 (and also Figure 3 ) contains the corresponding Figure 1 , are used for corresponding or comparable details. In this case, except for geometrical deviations, Figure 2 The situation shown is similar to Figure 1 is equivalent to step 2. One difference is that in Figure 2 In the embodiment, the two substrates 1, 2 are not mounted next to each other, but one on top of the other on a carrier 13. The second stamped strip 4 is angled several times so that the connecting parts 7, 10 again extend parallel to each other and form a flat contact area in which a solder connection 16 can be established ( Figure 2 not shown).

[0054] Figure 3 The method steps in a preferred exemplary embodiment of another method according to the invention for producing an electrically conductive connection between two substrates 1, 2 are schematically shown. The connection in the example is also a connection with high current capability. In this example, a first platform 21, a second platform 22 and a cross member 20 are used for connection purposes, each consisting of copper to achieve electrical conductivity. The first platform 11 comprises a mounting portion 5 and a connection portion 10. The mounting portion 5 is electrically conductively connected to an electrical conductor track ( Figure 32 ). The second platform 22 is electrically conductively connected to the conductor tracks of the second circuit board 2 'at its mounting portion 8 by means of the electrically conductive second releasable connection 12 in a corresponding manner. The first substrate 1 and the second substrate 2 are mounted on a common carrier 13 in an immutable position relative to one another. The cross member 20 having a first longitudinal end 23 and a length portion 24 adjoining thereto and a second longitudinal end 25 and a length portion 26 adjoining thereto is then supported on the two platforms 21, 22 and in the process is positioned so that its first length portion 24 overlaps the connection portion 7 of the first platform 21 in the first overlap region 14 and so that its second length portion 26 overlaps the connection portion 10 of the second platform 22 in the second overlap region 14'. As indicated by the two arrows, the first length portion 24 is then connected to the first connection portion 7 by means of a first solder connection 16 in the first overlap region 14. In a corresponding manner, the second length portion 26 is connected to the second connection portion 10 by means of a solder connection 16' in the second overlap portion 14'. The solder connections 16, 16' produced by means of a green laser are not shown in detail in this example.

[0055] at the same time, Figure 3 is a preferred exemplary embodiment of an arrangement 27 according to the invention, which comprises two platforms 21 , 22 and a cross member 20 .

[0056] All disclosed features are essential for the invention (individually but also in combination with one another). The dependent claims characterize independent inventive developments of the prior art by their characteristics and are intended, in particular, for the filing of divisional applications on the basis of these claims.

Claims

1. A method for establishing an electrically conductive connection between two substrates (1, 2), comprising the following steps: Providing a first substrate (1) and a second substrate (2), providing a conductive first connection member (3) having a mounting portion (5) at a first end and a connection portion (7) at an opposite second end, mounting the first connecting component (3) on the first substrate (1) by inserting the mounting portion (5) of the first connecting component (3) into a through hole in the first substrate to establish a first releasable connection (11) between the mounting portion (5) of the first connecting component (3) and the first substrate (1), providing a conductive second connection member (4) having a mounting portion (8) at a first end and a connection portion (10) at an opposite second end, mounting the second connecting component (4) on the second substrate (2) by inserting the mounting portion (8) of the second connecting component (4) into a through hole in the second substrate to establish a second releasable connection (12) between the mounting portion (8) of the second connecting component (4) and the second substrate (2), as well as producing a conductive connection assembly comprising the first connection component (3) and the second connection component (4), Wherein, generating the connection component includes establishing a bonding connection (16) between the connecting portion (7) of the first connecting member (3) and the connecting portion (10) of the second connecting member (4), The method further comprises: providing a first conductive stamped strip (3) as the first connecting member, and providing a second conductive stamped strip (4) as the second connecting member, The first substrate (1) and the second substrate (2) are mounted in a fixed position relative to each other so that the connecting portion (7) of the first stamped strip (3) and the connecting portion (10) of the second stamped strip (4) overlap in an overlapping area (14), and A bonding connection is established between the connecting portion (7) of the first connecting component (3) and the connecting portion (10) of the second connecting component (4) in the overlapping area (14).

2. The method according to claim 1, characterized in that A welded connection is produced as the bonding connection (16).

3. The method according to claim 1, characterized in that After establishing the first releasable connection (11) and before establishing the bonding connection (16), the connecting portion (7) of the first stamping tape (3) extends parallel to the extended main plane of the first substrate (1), and / or after establishing the second releasable connection (12) and before establishing the bonding connection (16), the connecting portion (10) of the second stamping tape (4) extends parallel to the extended main plane of the second substrate (2), and in that the length portion (6) of the first stamping tape (3) is adjacent to the mounting portion (5), the length portion (6) of the first stamping tape (3) extends at right angles to the connecting portion (7) of the first stamping tape, and / or the length portion (9) of the second stamping tape (4) is adjacent to the mounting portion (8), the length portion (9) of the second stamping tape (4) extends at right angles to the connecting portion (10) of the second stamping tape.

4. The method according to claim 1, wherein: After the step of installing the first substrate (1) and the second substrate (2) in a fixed position relative to each other, a gap (25) exists between the connecting portion (7) of the first stamping belt (3) and the connecting portion (10) of the second stamping belt (4) transversely to the longitudinal direction of the connecting portion (7) of the first stamping belt (3) and / or transversely to the longitudinal direction of the connecting portion (10) of the second stamping belt (4), and before the connecting portion (7) of the first stamping belt (3) is connected to the connecting portion (10) of the second stamping belt (4) by means of the bonding connection (16), the gap (25) is reduced or eliminated by elastically bending the first stamping belt (3) and / or the second stamping belt (4).

5. The method according to claim 1, characterized in that The step of mounting the first substrate (1) and the second substrate (2) in a fixed position relative to each other comprises attaching the first substrate (1) and the second substrate (2) to a carrier (13) commonly associated therewith.

6. The method according to claim 1, characterized in that The step of mounting the first substrate (1) and the second substrate (2) in a fixed position relative to each other comprises attaching the first substrate (1) and the second substrate (2) to a technical device.

7. The method according to claim 1, characterized in that The step of mounting the first substrate (1) and the second substrate (2) in a fixed position relative to each other comprises attaching the first substrate (1) and the second substrate (2) to a housing or a heat sink.

8. The method according to claim 7, characterized in that The heat sink is a metal plate.

9. A method for releasing an electrically conductive connection between two substrates (1, 2), characterized in that A method for establishing an electrically conductive connection between two substrates (1, 2) according to any of the preceding claims is performed and, after the method step of establishing a bonding connection (16), the connection component is released from the first substrate (1) and the second substrate (2), respectively, by releasing the first releasable connection (11) and / or by releasing the second releasable connection.

10. The method according to claim 9, wherein: For the purpose of maintenance work, the connection assembly is released from the first base plate (1) and the second base plate (2), respectively, by releasing the first releasable connection (11) and / or by releasing the second releasable connection.

11. An arrangement (17) comprising a first substrate (1), a second substrate (2) and a conductive connection assembly, wherein - the connection assembly comprises a first conductive connection member (3) having a mounting portion (5) at a first end and a connection portion (7) at an opposite second end, and a second conductive connection member (4) having a mounting portion (8) at the first end and a connection portion (10) at an opposite second end, - the mounting portion (5) of the first connecting component (3) is inserted into a through hole in the first substrate and connected to the first substrate (1) by means of a first releasable connection (11), and the mounting portion (8) of the second connecting component (4) is inserted into a through hole in the second substrate and connected to the second substrate (2) by means of a second releasable connection (12), and the connecting portion (7) of the first connecting component (3) and the connecting portion (10) of the second connecting component (4) are connected by means of a bonding connection (16), in, The first connecting member is a first electrically conductive stamped strip (3), and the second connecting member is a second electrically conductive stamped strip (4), The first substrate (1) and the second substrate (2) are mounted in a fixed position relative to each other so that the connecting portion (7) of the first stamped strip (3) and the connecting portion (10) of the second stamped strip (4) overlap in an overlapping area (14), and The connecting portion (7) of the first punched strip (3) and the connecting portion (10) of the second punched strip (4) are connected in an overlapping region (14) by means of a welded connection as a bonding connection (16).

12. Arrangement (17) according to claim 11, characterized in that The first connection member (3) comprises copper, and / or the second connection member (4) comprises copper.

13. Arrangement (17) according to claim 11 or 12, characterized in that The first connecting component (3) is made of pure copper, and / or the second connecting component (4) is made of pure copper.

14. Arrangement (17) according to claim 11 or 12, characterized in that The first releasable connection (11) and / or the second releasable connection (12) is a soldered connection.

15. Arrangement (17) according to claim 11 or 12, characterized in that The first substrate (1) and / or the second substrate (2) is a circuit board (1').

16. Arrangement (17) according to claim 11 or 12, characterized in that The first substrate (1) and / or the second substrate (2) is a printed circuit board (PCB).

17. Arrangement (17) according to claim 16, characterized in that The printed circuit board (PCB) is a ceramic circuit board (DCB).

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