Type-C connector with good high-frequency performance

Abstract

The present invention relates to a Type-C connector female seat with good high-frequency performance, including an outer metal shell and a socket tongue. The socket tongue is built-in and fixed in the outer metal shell, and includes an upper terminal group, an intermediate metal shielding sheet, a lower terminal group, a secondary molding insulating plastic body, an upper anti-electromagnetic interference component and a lower anti-electromagnetic interference component. Before performing the secondary molding injection process, the upper anti-electromagnetic interference component is buckled just above the upper terminal group, and the lower anti-electromagnetic interference component is buckled just below the lower terminal group, and a supporting force is applied to the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component, so that the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component are kept in a gap-free contact state relative to the intermediate metal shielding sheet until the secondary molding injection process is completed, and incidentally, an upper injection molding process avoidance gap and a lower injection molding process avoidance gap are formed on the secondary molding insulating plastic body.

Description

Technical Field

[0001] The present invention relates to the technical field of electric connector manufacturing, and in particular to a Type-C connector socket with good high-frequency performance. Background Art

[0002] The most common and widely accepted peripheral devices for electronic products on the market are still the Universal Serial Bus (USB), which is supplemented by the hot-swap function to achieve plug-and-play. In order to face the challenges of other high-speed transmission interfaces, the USB3.1 Type-C connector was introduced, which has good power charging and power supply capabilities, and provides a bandwidth of up to 10GPS. It supports front and back plugging, and it is easier to insert the interface without having to distinguish the front and back. It can also be expanded to thin and light mobile devices such as tablets and smartphones, so it is particularly anticipated by the market. In recent years, the USB4.0 Type-C connector has appeared, which can provide a bandwidth of up to 40GPS and a power supply of up to 100W.

[0003] As the transmission speed of electronic signals continues to increase, it is necessary to use high-speed transmission interfaces in the actual transmission process to meet the transmission speed of a large number of electronic signals. Generally speaking, the upper terminal grouping and the lower terminal grouping are usually distributed according to the GND-Signal-Signal-GND method commonly used in the industry. At a specific speed, crosstalk is easily generated, which in turn affects the integrity of signal transmission. Impedance mismatch will interfere with signal transmission and simultaneously reduce the stability of signal transmission, which will cause the quality of electronic products to deteriorate and signal instability to be lost. In addition, with the miniaturization of electronic products, the high-speed transmission interface has also been greatly reduced. As the transmission amplitude of the high-speed transmission interface has been greatly increased, the number of its terminals has increased and the distribution has become dense. Today's terminals are arranged in a very close distance in space, which can easily lead to serious interference during high-frequency signal transmission (such as electromagnetic wave interference, noise or crosstalk interference between adjacent terminals, etc.), and the phenomenon of electromagnetic wave interference of each signal terminal by external electronic components has also increased, thereby reducing the stability of signal transmission. In addition, EMI is generated because the electromagnetic interference source transfers energy to the sensitive system through the coupling path. EMI includes three basic forms: conduction through wires or common ground wires, radiation through space, or near-field coupling. The harm of EMI is manifested in reducing the quality of transmitted signals, interfering with or even destroying circuits or equipment, and making the equipment unable to meet the technical indicators specified in the electromagnetic compatibility standards.

[0004] To this end, our company has previously applied for a Type-C connector female with good high-frequency performance, with the authorization announcement number CN212062870U, which includes an outer shell and a socket tongue. The socket tongue is built-in and fixed in the outer shell, and it includes an upper terminal group, an intermediate shielding sheet, a lower terminal group and an insulating plastic body. The upper terminal group, the lower terminal group and the intermediate shielding sheet are all inserted and fixed in the insulating plastic body. The intermediate shielding sheet is located between the upper terminal group and the lower terminal group. The upper terminal group is composed of an upper row of signal terminals and an upper grounding terminal that are both conductive to the PCB. The number of upper grounding terminals is at least 2, and they are arranged side by side with the upper row of signal terminals. The lower terminal group is composed of a lower row of signal terminals and a lower grounding terminal that are both conductive to the PCB. The number of lower grounding terminals is at least 2, and they are arranged side by side with the lower row of signal terminals. An upper elastic supporting portion that is elastically supported against the upper plane of the intermediate shielding sheet and a lower elastic supporting portion that is elastically supported against the lower plane of the intermediate shielding sheet are respectively provided on the upper grounding terminal and the lower grounding terminal. The above-mentioned socket tongue also includes an EMI component. The EMI component is also built-in and fixed to the insulating plastic body. The EMI component passes through the middle shielding sheet, contacts and conducts with the middle shielding sheet, and is arranged around the periphery of the upper terminal group and the lower terminal group. The above-mentioned EMI component is formed by the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component being buckled together. The upper anti-electromagnetic interference component includes an upper anti-electromagnetic interference component body and an upper connecting arm. The number of the upper connecting arms is 2, which are respectively formed by the left and right side walls of the upper anti-electromagnetic interference component body extending outward and bending downward, and both are provided with snap-on notches. The lower anti-electromagnetic interference component includes a lower anti-electromagnetic interference component body and a lower connecting arm. The number of the lower connecting arms is set to 2, which are respectively formed by the left and right side walls of the lower anti-electromagnetic interference component body extending outward and bending upward, and both are cut and formed with snap-on connectors that match the shape of the above-mentioned snap-on notches. Theoretically, by adopting the above technical solution, the Type-C connector socket can achieve good anti-EMI function, so as to eliminate the influence of electromagnetic waves and crosstalk on its working performance to the greatest extent. However, when multiple Type-C connector sockets were tested for electromagnetic interference at the same time, it was found that the EMI performance parameter values ​​of different Type-C connector sockets were quite different. In short, some Type-C connector sockets have excellent anti-electromagnetic interference performance, while the anti-electromagnetic interference performance of the remaining Type-C connector sockets is average or poor. In order to find out the reason, the Type-C connector sockets that did not meet the anti-electromagnetic interference performance were cut, and their internal structure was analyzed in detail. Finally, it was found that the problem was that the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component failed to effectively touch the middle shielding sheet, that is, poor contact occurred. As a result, an effective anti-electromagnetic grounding loop would inevitably fail to form inside the Type-C connector socket, which ultimately led to its anti-EMI performance failing to meet the experimental standards.It is known that in the process of molding the socket tongue, first, the upper terminal group and the lower terminal assembly are molded once respectively, and then, the upper terminal group and the lower terminal assembly are symmetrically arranged on the upper and lower sides of the middle shielding sheet, and respectively touch the top wall and the bottom wall of the middle shielding sheet, and then, the upper anti-electromagnetic interference component cover is placed directly above the upper terminal group, and directly touches the top wall of the middle shielding sheet; the lower anti-electromagnetic interference component cover is placed directly below the lower terminal group, and directly touches the bottom wall of the middle shielding sheet, and finally, a secondary molding and injection operation is performed to finally form the socket tongue. However, when performing the secondary molding glue injection operation, the upper and lower anti-electromagnetic interference components will inevitably be affected by external forces or exciting forces, which will cause them to be separated from the middle shielding sheet before the liquid injection molding material is officially injected, which makes it possible for the injected liquid injection molding material to fill the gap between the upper and lower anti-electromagnetic interference components and the middle shielding sheet, thereby completely isolating the upper and lower anti-electromagnetic interference components from the middle shielding sheet, and thus causing the failure of electrical conduction connection. Therefore, it is urgent for technicians to solve the above problems. Summary of the invention

[0005] Therefore, in view of the above-mentioned existing problems and defects, the designers of the present invention collected relevant information, conducted multiple evaluations and considerations, and continued to experiment and modify the technology after many years of R&D experience in this industry, which ultimately led to the emergence of this Type-C connector with good high-frequency performance.

[0006] In order to solve the above technical problems, the present invention relates to a Type-C connector female seat with good high-frequency performance, including an outer metal shell and a socket tongue. The socket tongue is built-in and fixed in the outer metal shell, and includes an upper terminal group, an intermediate metal shielding sheet, a lower terminal group and a secondary Molding insulating plastic body. The upper terminal group, the lower terminal group and the intermediate metal shielding sheet are all embedded in the secondary Molding insulating plastic body. The intermediate metal shielding sheet is located between the upper terminal group and the lower terminal group. The upper terminal group includes an upper row signal terminal unit, an upper grounding terminal and an upper first Molding insulating plastic body. The upper row signal terminal unit and the upper grounding terminal are both embedded in the upper first Molding insulating plastic body. The number of upper grounding terminals is set to 2, which are symmetrically arranged on the left and right sides of the upper row signal terminal unit, and are in contact and conductive with the intermediate metal shielding sheet. The upper row signal terminal unit is composed of a plurality of upper row signal terminals that are arranged in sequence in the left and right directions and are all conductive with the PCB board. The lower terminal group includes a lower row signal terminal unit, a lower grounding terminal and a lower primary Molding insulating plastic body. The lower row signal terminal unit and the lower grounding terminal are both embedded in the lower primary Molding insulating plastic body. The number of lower grounding terminals is set to 2, which are symmetrically arranged on the left and right sides of the lower row signal terminal unit, and are in contact with and conductive with the middle metal shielding sheet. The lower row signal terminal unit is composed of a plurality of lower row signal terminals arranged in sequence along the left and right directions and are all conductive with the PCB board. The socket tongue also includes an EMI component. The EMI component is also embedded in the secondary Molding insulating plastic body. The EMI component is in contact with and conductive with the middle metal shielding sheet, and is arranged around the periphery of the upper terminal group and the lower terminal group. The EMI component includes an upper anti-electromagnetic interference component and a lower anti-electromagnetic interference component that are oppositely arranged along the upper and lower directions. The upper anti-electromagnetic interference component is simultaneously conductive with the middle metal shielding sheet, the upper grounding terminal and the outer metal shell. The lower anti-electromagnetic interference component is simultaneously conductive with the middle metal shielding sheet, the lower grounding terminal and the outer metal shell. Before performing the secondary Molding injection process, the upper anti-electromagnetic interference component is buckled onto the upper terminal group, and the lower anti-electromagnetic interference component is buckled onto the lower terminal group, and the upper and lower push-out columns in the injection mold are used to apply a supporting force to the upper and lower anti-electromagnetic interference components respectively, so that the upper and lower anti-electromagnetic interference components are kept in a gap-free contact state relative to the middle metal shielding sheet until the secondary Molding injection process is completed, and incidentally, an upper injection molding process avoidance gap and a lower injection molding process avoidance gap are formed on the secondary Molding insulating plastic body.

[0007] As a further improvement of the technical solution of the present invention, the upper anti-electromagnetic interference component includes an upper anti-electromagnetic interference component body, an upper extension arm and an upper top contact arm. The number of the upper extension arms is set to 2, which are symmetrically distributed on the left and right sides of the upper anti-electromagnetic interference component body, and are respectively formed by continuing to extend outward from the left and right side walls of the upper anti-electromagnetic interference component body and bending downward. The number of the upper top contact arms is also set to 2, which are respectively formed by continuing to extend downward from the bottom wall of the upper extension arm and bending outward at 90°. Correspondingly, the number of the upper injection molding process avoidance notches is set to 2, and they are one-to-one aligned with the upper top contact arm. The lower anti-electromagnetic interference component includes a lower anti-electromagnetic interference component body, a lower extension arm and a lower top contact arm. The number of the lower extension arms is set to 2, which are symmetrically distributed on the left and right sides of the lower anti-electromagnetic interference component body, and are respectively formed by continuing to extend outward from the left and right side walls of the lower anti-electromagnetic interference component body and bending upward. The number of the lower top contact arms is also set to 2, which are formed by the top wall of the lower extension arm continuing to extend upward and folding outward at 90 degrees. Correspondingly, the number of the lower injection molding process avoidance gaps is set to 2, and they are aligned one by one with the lower top contact arms.

[0008] As a further improvement of the technical solution of the present invention, the upper anti-electromagnetic interference component also includes a first upper limit arm. The number of the first upper limit arms is 2, which are symmetrically distributed on the left and right sides of the upper anti-electromagnetic interference component body, and are separated from the upper extension arm by a set distance. The first upper limit arm is formed by continuing to extend outward from the left and right side walls of the upper anti-electromagnetic interference component body and bending downward. Correspondingly, two upper limit slots for inserting the first upper limit arm are formed on the top wall of the upper Molding insulating plastic body. The lower anti-electromagnetic interference component also includes a first lower limit arm. The number of the first lower limit arms is 2, which are symmetrically distributed on the left and right sides of the lower anti-electromagnetic interference component body, and are separated from the lower extension arm by a set distance. The first lower limit arm is formed by continuing to extend outward from the left and right side walls of the lower anti-electromagnetic interference component body and bending upward. Correspondingly, two lower limiting slots for inserting the first lower limiting arms are formed on the bottom wall of the lower primary Molding insulating plastic body.

[0009] As a further improvement of the technical solution of the present invention, the upper anti-electromagnetic interference component also includes an upper elastic top contact arm. The number of the upper elastic top contact arms is set to 2, which can elastically contact and conduct with the upper grounding terminal in a one-to-one correspondence. The upper elastic top contact arm continues to extend backward from the rear side wall of the upper anti-electromagnetic interference component body, and is folded back in the reverse direction. The lower anti-electromagnetic interference component also includes a lower elastic top contact arm. The number of the lower elastic top contact arms is set to 2, which can elastically contact and conduct with the lower grounding terminal in a one-to-one correspondence. The lower elastic top contact arm continues to extend backward from the rear side wall of the lower anti-electromagnetic interference component body, and is folded back in the reverse direction.

[0010] As a further improvement of the technical solution of the present invention, the upper anti-electromagnetic interference component also includes a second upper limit arm. The second upper limit arm is formed by connecting the first left-placed U-shaped limit bending section, the upper transition connection section and the first right-placed U-shaped limit bending section in sequence. The first left-placed U-shaped limit bending section and the first right-placed U-shaped limit bending section are both extended backward from the rear side wall of the upper anti-electromagnetic interference component body and bent. Correspondingly, a first left-placed limit slot and a first right-placed limit slot are formed on the upper Molding insulating plastic body for inserting the first left-placed U-shaped limit bending section and the first right-placed U-shaped limit bending section respectively. The lower anti-electromagnetic interference component also includes a second lower limit arm. The second lower limit arm is formed by connecting the second left-placed U-shaped limit bending section, the lower transition connection section and the second right-placed U-shaped limit bending section in sequence. The second left-positioned U-shaped limiting bending section and the second right-positioned U-shaped limiting bending section are both extended backwards from the rear side wall of the lower anti-electromagnetic interference component body and are bent. Correspondingly, the lower first-molding insulating plastic body is molded with a second left-positioned limiting notch and a second right-positioned limiting notch for the second left-positioned U-shaped limiting bending section and the second right-positioned U-shaped limiting bending section to be placed therein.

[0011] As a further improvement of the technical solution of the present invention, the second upper limit arm also includes an upper extension top contact piece. The upper extension top contact piece is formed by continuing to extend upward from the top wall of the upper transition connection section, and exceeds the set height of the first left-positioned U-shaped limit bending section and the first right-positioned U-shaped limit bending section, so as to be used to make contact with the top wall of the inner cavity of the outer metal shell. The second lower limit arm also includes a lower extension top contact piece. The lower extension top contact piece is formed by continuing to extend downward from the bottom wall of the lower transition connection section, and exceeds the set height of the second left-positioned U-shaped limit bending section and the second right-positioned U-shaped limit bending section, so as to be used to make contact with the bottom wall of the inner cavity of the outer metal shell.

[0012] As a further improvement of the technical solution of the present invention, the front free end of the upper grounding terminal is bent downward to form an upper arc-shaped elastic top contact section that can elastically contact the middle metal shielding sheet. The front free end of the lower grounding terminal is bent upward to form a lower arc-shaped elastic top contact section that can elastically contact the middle metal shielding sheet.

[0013] As a further improvement of the technical solution of the present invention, a limiting column extends upward from the top wall of the lower Moliding insulating plastic body, and correspondingly, a plurality of plug-in holes compatible with the limiting column are formed on the upper Moliding insulating plastic body, and a through gap for the limiting column to pass through is opened on the middle metal shielding sheet.

[0014] As a further improvement of the technical solution of the present invention, the limiting column and the plug-in hole are assembled by means of interference fit.

[0015] As a further improvement of the technical solution of the present invention, a plurality of interference ribs extend inwardly from the side wall of the mating hole along the radial direction, and the radial dimension of the interference ribs is controlled between 0.02-0.05 mm.

[0016] Compared with the Type-C connector socket with a traditional design structure, in the technical solution disclosed in the present invention, a pressing force is applied to the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component during the injection process to make them press against the middle metal shielding sheet, and an upper injection molding process avoidance gap and a lower injection molding process avoidance gap are formed on the secondary Moliding insulating plastic body to ensure that the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component are respectively kept in a gap-free contact state with the middle metal shielding sheet after the secondary Moliding insulating plastic body is formed, thereby preventing the occurrence of poor contact, and thereby forming a complete grounding loop with the upper grounding terminal and the lower grounding terminal, the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component, the middle shielding sheet and the outer metal shell. In this way, the presence of the middle shielding sheet can effectively adjust the impedance value of the upper row signal terminals and the lower row signal terminals arranged in pairs, so that the upper row signal terminals and the lower row signal terminals have good high-frequency performance in the process of transmitting signals; on the other hand, the middle shielding piece is grounded with the help of the grounding terminal, which can effectively reduce the conduction path of electromagnetic waves and crosstalk interference for grounding, that is, it increases the speed of electromagnetic waves and crosstalk interference guided and transmitted to the ground for release, thereby ensuring the integrity and stability of high-frequency signals transmitted in the Type-C connector socket, and ensuring that the Type-C connector socket has good high-frequency performance; on the other hand, the outer metal shell is respectively connected to the upper grounding terminal and the lower grounding terminal by the upper anti-electromagnetic interference component and the lower anti-electromagnetic interference component, so that the Type-C connector socket itself is always in a good shielding state during actual application, thereby effectively reducing the impact of external electromagnetic interference on the signal transmission process, and ensuring the reliability and stability of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a three-dimensional schematic diagram of the Type-C connector female socket with good high-frequency performance in the present invention.

[0019] Figure 2 It is an exploded schematic diagram of the Type-C connector socket with good high-frequency performance in the present invention.

[0020] Figure 3 It is a three-dimensional schematic diagram of the socket tongue in the Type-C connector female socket with good high-frequency performance of the present invention.

[0021] Figure 4 It is an exploded schematic diagram of a socket tongue in a Type-C connector female socket having good high-frequency performance according to the present invention from one perspective.

[0022] Figure 5 It is an exploded schematic diagram of another perspective of the socket tongue in the Type-C connector female socket with good high-frequency performance of the present invention.

[0023] Figure 6 It is an exploded schematic diagram of the upper terminal grouping in the Type-C connector socket with good high-frequency performance of the present invention.

[0024] Figure 7 It is a three-dimensional schematic diagram of the upper ground terminal in the Type-C connector socket with good high-frequency performance of the present invention.

[0025] Figure 8 It is a three-dimensional schematic diagram of a Moliding insulating plastic body placed on the Type-C connector socket with good high-frequency performance of the present invention.

[0026] Fig. 9 yes Figure 8 Top view of the .

[0027] Fig.10 yes Fig. 9 AA section view.

[0028] Fig.11 It is a three-dimensional schematic diagram of the middle metal shielding sheet in the Type-C connector female socket with good high-frequency performance of the present invention.

[0029] Fig.12 It is an exploded schematic diagram of the lower terminal grouping in the Type-C connector socket with good high-frequency performance of the present invention.

[0030] Fig.13 It is a three-dimensional schematic diagram of the lower ground terminal in the Type-C connector socket with good high-frequency performance of the present invention.

[0031] Fig.14 It is a three-dimensional schematic diagram from one perspective of a Molding insulating plastic body disposed below the Type-C connector female socket having good high-frequency performance of the present invention.

[0032] Fig.15 It is a three-dimensional schematic diagram from another perspective of a lower Molding insulating plastic body in the Type-C connector female socket with good high-frequency performance of the present invention.

[0033] Fig.16 It is a three-dimensional schematic diagram from one perspective of the secondary molding insulating plastic body in the Type-C connector female socket with good high-frequency performance of the present invention.

[0034] Fig.17 It is a three-dimensional schematic diagram from another perspective of the secondary molding insulating plastic body in the Type-C connector female socket with good high-frequency performance of the present invention.

[0035] Fig.18 It is a three-dimensional schematic diagram of the upper anti-electromagnetic interference component of the Type-C connector female socket with good high-frequency performance of the present invention.

[0036] Fig.19 It is a three-dimensional schematic diagram of the lower anti-electromagnetic interference component of the Type-C connector female socket with good high-frequency performance of the present invention.

[0037] Fig. 20 yes Figure 3 Top view of the .

[0038] Fig.21 yes Fig. 20 BB cross-sectional view.

[0039] Fig. 22 yes Fig. 20 CC cross-sectional view.

[0040] Fig.23 yes Fig. 20 DD cross-sectional view.

[0041] Fig.24 yes Figure 3 Bottom view of .

[0042] Fig.25 yes Fig.24 EE cross-sectional view.

[0043] Fig.26 yes Figure 1 Side view of.

[0044] Fig. 27 See Fig.26 FF cross-sectional view.

[0045] 1-outer metal shell; 2-socket tongue; 21-upper terminal grouping; 211-upper row signal terminal unit; 2111-upper row signal terminal; 212-upper grounding terminal; 2121-upper arc-shaped elastic top contact section; 213-upper primary Moliding insulating plastic body; 2131-upper limit slot; 2132-first left limit slot; 2133-first right limit slot; 2134-mating hole; 21341-interference rib; 22-middle metal shielding sheet; 221-through gap; 23-lower terminal grouping; 231-lower row signal terminal unit; 2311-lower row signal terminal; 232-lower grounding terminal; 2321-lower arc elastic top contact section; 233-lower primary Moliding insulating plastic body; 2331-lower limit slot; 2332-second left limit slot; 2333-second right limit slot; 2334-limiting column; 24-secondary Moliding insulating plastic body; 241-upper injection molding Process avoidance gap; 242-lower injection molding process avoidance gap; 25-EMI component; 251-upper anti-electromagnetic interference component; 2511-upper anti-electromagnetic interference component body; 2512-upper extension arm; 2513-upper top contact arm; 2514-first upper limit arm; 2515-upper elastic top contact arm; 2516-second upper limit arm; 25161-first left U-shaped limit bending section; 25162-upper transition connection section; 251621-upper extension top contact sheet; 25 163-first right-placed U-shaped limiting bending section; 252-lower anti-electromagnetic interference component; 2521-lower anti-electromagnetic interference component body; 2522-lower extension arm; 2523-lower top contact arm; 2524-first lower limiting arm; 2525-lower elastic top contact arm; 2526-second lower limiting arm; 25261-second left-placed U-shaped limiting bending section; 25262-lower transition connecting section; 252621-lower extension top contact sheet; 25263-second right-placed U-shaped limiting bending section. DETAILED DESCRIPTION

[0046] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by the terms "rear", "front", "upper", "lower", "front", "rear", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0047] It is known that the Type-C female connector and the Type-C male connector are mated with each other and work together to achieve signal transmission.

[0048] The present invention will be further described in detail below with reference to specific embodiments. Figure 1 , Figure 2The three-dimensional schematic diagram and the exploded schematic diagram of the Type-C connector female socket with good high-frequency performance of the present invention are respectively shown. It can be seen that it is mainly composed of an outer metal shell 1 and a socket tongue 2. When the socket tongue 2 is injection molded, it is inserted into the outer metal shell 1 as a whole.

[0049] Figure 3 , Figure 4 , Figure 5 The three-dimensional schematic diagram of the socket tongue in the Type-C connector female socket with good high-frequency performance of the present invention and its exploded schematic diagrams from two different perspectives are respectively shown. It can be seen that it is mainly composed of the upper terminal group 21, the middle metal shielding sheet 22, the lower terminal group 23 and the secondary Moliding insulating plastic body 24. Among them, the upper terminal group 21, the lower terminal group 23 and the middle metal shielding sheet 22 are all embedded in the secondary Moliding insulating plastic body 24. The middle metal shielding sheet 22 is located between the upper terminal group 21 and the lower terminal group 23.

[0050] like Figure 6 As shown in the figure, the upper terminal group 21 includes an upper row signal terminal unit 211, an upper grounding terminal 212 and an upper first-molding insulating plastic body 213. The upper row signal terminal unit 211 and the upper grounding terminal 212 are both embedded in the upper first-molding insulating plastic body 213. The number of upper grounding terminals 212 is set to 2, which are symmetrically arranged on the left and right sides of the upper row signal terminal unit 211, and are in contact with and conductive with the middle metal shielding sheet 22. The upper row signal terminal unit 211 is composed of a plurality of upper row signal terminals 2111 arranged in sequence along the left and right directions and all conductive with the PCB board.

[0051] like Fig.12 As shown in the figure, the lower terminal group 23 includes a lower row signal terminal unit 231, a lower grounding terminal 232 and a lower once-molding insulating plastic body 233. The lower row signal terminal unit 231 and the lower grounding terminal 232 are both embedded in the lower once-molding insulating plastic body 233. The number of the lower grounding terminals 232 is set to 2, which are symmetrically arranged on the left and right sides of the lower row signal terminal unit 231, and are in contact with and conductive with the middle metal shielding sheet 22. The lower row signal terminal unit 231 is composed of a plurality of lower row signal terminals 2311 which are arranged side by side in sequence along the left and right directions and are all conductive with the PCB board. The front free end of the upper grounding terminal 212 is bent downward to form an upper arc-shaped elastic top contact section 2121 (such as Figure 7 The front free end of the lower grounding terminal 232 is bent upward to form a lower arc-shaped elastic top contact section 2321 (as shown in FIG. 1 ) that can elastically contact the middle metal shielding sheet 22. Fig.13).

[0052] In addition, by Figure 4 , 5 It can also be seen that the socket tongue 22 also includes an EMI component 25. The EMI component 25 is also embedded in the secondary Moliding insulating plastic body 24. The EMI component 25 is in contact with and conductive with the intermediate metal shielding sheet 22, and is arranged around the periphery of the upper terminal group 21 and the lower terminal group 23. The EMI component 25 includes an upper anti-electromagnetic interference component 251 and a lower anti-electromagnetic interference component 252 that are opposite to each other in the up and down directions. The upper anti-electromagnetic interference component 251 is simultaneously conductive with the intermediate metal shielding sheet 22, the upper grounding terminal 212 and the outer metal shell 1. The lower anti-electromagnetic interference component 252 is simultaneously conductive with the intermediate metal shielding sheet 22, the lower grounding terminal 232 and the outer metal shell 1. As shown Figure 4 As shown in , before the secondary Molding injection process is performed, the upper anti-electromagnetic interference component 251 is buckled on the upper terminal group 21, and the lower anti-electromagnetic interference component 252 is buckled on the lower terminal group 23, and the upper push-out column and the lower push-out column in the injection mold are used to apply a supporting force to the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252 respectively, so that the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252 are kept in a gap-free contact state relative to the middle metal shielding sheet 22 until the secondary Molding injection process is completed, and incidentally, an upper injection molding process avoidance gap 241 and a lower injection molding process avoidance gap 242 are formed on the secondary Molding insulating plastic body 24 (as shown in FIG. Fig.16 , 17 ). Fig. 20 , 23 As shown in FIGS. 24 and 25 , during the injection process, an upper injection molding process avoidance notch 241 and a lower injection molding process avoidance notch 242 are respectively used to apply a supporting force to the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252 so that they are pressed against the middle metal shielding sheet 22, and incidentally, an upper injection molding process avoidance notch 241 and a lower injection molding process avoidance notch 242 are formed on the secondary Moliding insulating plastic body 24.

[0053] By adopting the above technical solution, the Type-C connector with good high-frequency performance has achieved at least the following technical effects, as follows:

[0054] 1) Ensure that the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252 are respectively kept in a gap-free contact state with the middle metal shielding sheet 22 after the secondary molding of the insulating plastic body 24, so as to prevent the occurrence of poor contact, thereby forming a complete grounding loop between the upper grounding terminal 212 and the lower grounding terminal 232, the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252, the middle shielding sheet 22 and the outer metal shell 1;

[0055] 2) The existence of the middle shielding sheet 22 can effectively adjust the impedance value of the upper row signal terminals 2111 and the lower row signal terminals 2311 arranged in pairs, so that the upper row signal terminals 2111 and the lower row signal terminals 2311 have good high frequency performance in the process of transmitting signals;

[0056] 3) The middle shield 22 is grounded by means of the upper grounding terminal 212 and the lower grounding terminal 232 at the same time, thereby effectively reducing the conduction path of electromagnetic waves and crosstalk interference for grounding, that is, increasing the speed of electromagnetic waves and crosstalk interference being guided and transmitted to the ground for release, thereby ensuring the integrity and stability of high-frequency signals transmitted in the Type-C connector socket, and ensuring that the Type-C connector socket has good high-frequency performance;

[0057] 4) The outer metal shell 1 is connected to the upper ground terminal 212 and the lower ground terminal 232 respectively through the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252, so that the Type-C connector socket is always in a good shielding state during actual application, thereby effectively reducing the impact of external electromagnetic interference on the signal transmission process and ensuring the reliability and stability of signal transmission.

[0058] The manufacturing process of the Type-C connector socket with good high-frequency performance is roughly as follows: 1) Molding the upper terminal group 21 and the lower terminal group 23; for the upper terminal group 21, firstly, a plurality of upper row signal terminals 2111 are arranged in sequence from left to right in the injection mold cavity to form an upper row signal terminal unit 211, and two upper grounding terminals 212 are arranged on the left and right sides of the upper row signal terminal unit 211, and are also arranged in the injection mold cavity, and then, a sufficient amount of liquid injection molding material is injected into the injection mold cavity. , to finally form the upper terminal group 21; for the lower terminal group 23, firstly, a plurality of lower signal terminals 2311 are arranged in sequence from left to right in the injection mold cavity to form a lower signal terminal unit 231, and two lower grounding terminals 232 are respectively arranged on the left and right sides of the lower signal terminal unit 231, and are also arranged in the injection mold cavity, and then, a sufficient amount of liquid injection material is injected into the injection mold cavity to finally form the lower terminal group 23; 2) the upper terminal group 21 and the lower terminal group 23 after forming are respectively Arranged on the upper and lower sides of the middle metal shielding sheet 22, and ensure that the upper grounding terminal 212 touches the top wall of the middle metal shielding sheet 22 and the lower grounding terminal 232 touches the bottom wall of the middle metal shielding sheet 22; 3) Before performing the secondary Moliding glue injection process, the upper anti-electromagnetic interference component 251 is buckled on the upper terminal group 21, and the lower anti-electromagnetic interference component 252 is buckled on the lower terminal group 23, and the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252 are respectively applied with a pressing force. At this time, it is necessary It should be noted that during the process of installing the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252, it is necessary to ensure that the two are respectively kept in a benign top contact state with the upper grounding terminal 212 and the lower grounding terminal 232, so that the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252 are kept in a gap-free top contact state relative to the middle metal shielding sheet 22 until the secondary molding and injection process is completed. At this point, the socket tongue 2 is formed; 4) The socket tongue 2 is inserted into the outer metal shell 1 to finally form the Type-C connector female socket.

[0059] As a further refinement of the Type-C connector female socket structure with good high-frequency performance, such as Fig.18As shown in , the upper anti-electromagnetic interference component 251 is preferably composed of several parts such as an upper anti-electromagnetic interference component body 2511, an upper extension arm 2512 and an upper top contact arm 2513. Among them, the number of the upper extension arms 2512 is set to 2, which are symmetrically distributed on the left and right sides of the upper anti-electromagnetic interference component body 1511, and are respectively formed by the left and right side walls of the upper anti-electromagnetic interference component body 2511 continuing to extend outward and bending downward. The number of the upper top contact arms 2513 is also set to 2, which are respectively formed by the bottom wall of the upper extension arm 2512 continuing to extend downward and bending outward at 90°. Correspondingly, the number of the upper injection molding process avoidance notches 241 is set to 2, and are one-to-one correspondingly positioned opposite to the upper top contact arms 2513. As shown Fig.19 As shown in the figure, the lower anti-electromagnetic interference component 252 includes a lower anti-electromagnetic interference component body 2521, a lower extension arm 2522 and a lower top contact arm 2523. The number of the lower extension arms 2522 is set to 2, which are symmetrically distributed on the left and right sides of the lower anti-electromagnetic interference component body 2521, and are respectively formed by the left and right side walls of the lower anti-electromagnetic interference component body 2521 extending outward and bending upward. The number of the lower top contact arms 2523 is also set to 2, which are formed by the top wall of the lower extension arm 2522 extending upward and bending outward at 90 degrees. Correspondingly, the number of the lower injection molding process avoidance notches 242 is set to 2, and they are one-to-one correspondingly positioned in a positive position with the lower top contact arms 2523. Before performing the secondary Molding injection process, a supporting force is applied to the upper top contact arm 2513 and the lower top contact arm 2523 to ensure that they are in good contact with the top wall and the bottom wall of the middle metal shielding sheet 22 respectively. At this time, liquid injection molding material is injected again, which ultimately ensures that after the secondary Molding insulating plastic body 24 is formed, the upper anti-electromagnetic interference component 251 and the lower anti-electromagnetic interference component 252 are also kept in a good conductive state relative to the middle metal shielding sheet 22, effectively eliminating the occurrence of poor contact problems.

[0060] Furthermore, by Fig.18 It can also be seen that a first upper limit arm 2514 is additionally provided on the upper anti-electromagnetic interference component 251. The number of the first upper limit arms 2514 is two, which are symmetrically distributed on the left and right sides of the upper anti-electromagnetic interference component body 2511 and are separated from the upper extension arm 2512 by a set distance. The first upper limit arm 2514 is formed by extending outward from the left and right side walls of the upper anti-electromagnetic interference component body 2511 and bending downward. Figure 8As shown in the figure, two upper limit slots 2131 are formed on the top wall of the upper molding insulating plastic body 213, which are used to insert the first upper limit arm 2514. When the upper anti-electromagnetic interference component 251 needs to be plugged into the upper terminal group 21, first, the first upper limit arm 2514 is pre-aligned with the upper limit slot 2131, and then it can be pressed down with force. In this way, on the one hand, it is ensured that the upper anti-electromagnetic interference component 251 has a high position accuracy relative to the upper terminal group 21; on the other hand, it is prevented from escaping from the upper terminal group 21 due to the excitation force or the pulling force after the upper anti-electromagnetic interference component 251 is plugged in, and the stability and reliability of the plugging state of the upper anti-electromagnetic interference component 251 relative to the upper terminal group 21 are ensured.

[0061] To achieve the same design purpose, the lower electromagnetic interference prevention component 252 can also be designed with reference to the structure of the upper electromagnetic interference prevention component 251. Fig.19 As shown in , the lower anti-electromagnetic interference component 252 is further provided with a first lower limit arm 2524. The number of the first lower limit arms 2524 is 2, which are symmetrically distributed on the left and right sides of the lower anti-electromagnetic interference component body 2511 and are separated from the lower extension arm 2522 by a set distance. The first lower limit arm 2524 is formed by the left and right side walls of the lower anti-electromagnetic interference component body 2521 extending outward and bending upward. Correspondingly, two lower limit slots 2331 are formed on the bottom wall of the lower first Molding insulating plastic body 233, which are respectively used to insert the above-mentioned first lower limit arms 2524.

[0062] In addition, it can be seen from the above description that in addition to the good top contact between the upper anti-electromagnetic interference component 251, the lower anti-electromagnetic interference component 252 and the intermediate metal shielding sheet 22, which has a vital influence on the formation of a complete grounding loop, the good top contact relative to the upper grounding terminal 212 and the lower grounding terminal 232 also plays a vital role. In view of this, in order to ensure that the upper anti-electromagnetic interference component 251 always maintains a good conductive state relative to the upper grounding terminal 212 after the secondary molding of the insulating plastic body 24, as a further optimization of the structure of the above-mentioned upper anti-electromagnetic interference component 251, as shown in FIG. Fig.18As shown in , it is also provided with an upper elastic top contact arm 2515. The number of the upper elastic top contact arms 2515 is set to 2, which can elastically contact and conduct with the upper grounding terminal 212 in a one-to-one correspondence. The upper elastic top contact arm 2515 is formed by continuing to extend backward from the rear side wall of the upper anti-electromagnetic interference component body 2511 and folding back in the opposite direction. After the upper anti-electromagnetic interference component 251 is mated with the upper terminal group 21, even after the liquid injection molding material is subsequently injected, it can be ensured that the upper elastic top contact arm 2515 always elastically contacts the top wall of the upper grounding terminal 212, thereby ensuring the reliability and stability of the subsequent electrical conduction. In addition, it is necessary to explain here that since the pressure on the upper grounding terminal 212 is an elastic force, it can effectively avoid the phenomenon of plastic deformation caused by excessive pressure on itself.

[0063] To achieve the same design purpose, the lower electromagnetic interference prevention component 252 can also be designed with reference to the structure of the upper electromagnetic interference prevention component 251, such as Fig.19 As shown in FIG. 2 , a lower elastic top contact arm 2525 is further provided. The number of the lower elastic top contact arms 2525 is set to 2, which can elastically contact and conduct with the lower grounding terminal 232 one by one. The lower elastic top contact arm 2525 is formed by continuing to extend backward from the rear side wall of the lower electromagnetic interference prevention component body 2521 and folding back in the opposite direction.

[0064] In addition, if Fig.18 It can also be seen that the upper anti-electromagnetic interference component 251 is additionally provided with a second upper limit arm 2516. The second upper limit arm 2516 is formed by connecting the first left U-shaped limit bending section 25161, the upper transition connection section 25162 and the first right U-shaped limit bending section 25163 in sequence. The first left U-shaped limit bending section 25161 and the first right U-shaped limit bending section 25163 are both extended backward from the rear side wall of the upper anti-electromagnetic interference component body 2511 and are bent. Correspondingly, the upper Molding insulating plastic body 213 is molded with a first left limit slot 2132 and a first right limit slot 2133 (such as Figure 8 When the upper anti-electromagnetic interference component 251 needs to be plugged into the upper terminal group 21, first, the first upper limit arm 2514 is pre-aligned relative to the upper limit slot 2131, the first left-positioned U-shaped limit bending section 25161 is pre-aligned relative to the first left-positioned limit slot 2132, and the first right-positioned U-shaped limit bending section 25163 is pre-aligned relative to the first right-positioned limit slot 2133, and then it can be pressed down with force, and the upper limit arm 2514 cooperates with the joint action, thereby effectively ensuring that the upper anti-electromagnetic interference component 251 has a high position accuracy relative to the upper terminal group 21 (as shown in FIG. Fig. 20 ).

[0065] To achieve the same design purpose, the lower electromagnetic interference prevention component 252 can also be designed with reference to the structure of the upper electromagnetic interference prevention component 251, such as Fig.19 As shown in , a second lower limit arm 2526 is additionally provided. The second lower limit arm 2526 is formed by connecting the second left U-shaped limit bending section 25261, the lower transition connection section 25262 and the second right U-shaped limit bending section 25263 in sequence. The second left U-shaped limit bending section 25261 and the second right U-shaped limit bending section 25263 are both extended backward from the rear side wall of the lower anti-electromagnetic interference component body 2521 and bent. Correspondingly, a second left limit slot 2332 and a second right limit slot 2333 (as shown in FIG. 2 ) are formed in the lower first Molding insulating plastic body 233 for inserting the second left U-shaped limit bending section 25261 and the second right U-shaped limit bending section 25263 respectively. Fig.15 ).

[0066] In order to ensure that it always maintains a good top contact and conduction state relative to the outer metal shell 1, as a further optimization of the structure of the upper anti-electromagnetic interference component 251, as shown in FIG. Fig.18 As shown in , the top wall of the upper transition connecting section 25162 continues to extend upward to form an upper extension top contact piece 251621. The upper extension top contact piece 251621 also exceeds the first left-placed U-shaped limit bending section 25161 and the first right-placed U-shaped limit bending section 25163 to set the height, so as to be used to make a top contact with the top wall of the inner cavity of the outer metal shell 1. Of course, similar to the above-mentioned upper electromagnetic interference prevention component 251, the second lower limit arm 2526 can also be additionally provided with a lower extension top contact piece 252621. The lower extension top contact piece 252621 is formed by the bottom wall of the lower transition connecting section 25262 continuing to extend downward, and exceeds the second left-placed U-shaped limit bending section 25261 and the second right-placed U-shaped limit bending section 25263 to set the height, so as to be used to make a top contact with the bottom wall of the inner cavity of the outer metal shell 1. When the socket tongue 2 is mated with the outer metal shell 1, the upper top contact piece 251621 and the lower top contact piece 252621 respectively reliably contact the top wall and the bottom wall of the metal shell 1 to achieve electrical conduction (such as Fig.26 , 27 ).

[0067] According to the molding process of the Type-C connector socket with good high-frequency performance, it can be known that before performing the injection molding of the secondary Molding insulating plastic body, it is necessary to ensure that the upper terminal group 21 has a high position accuracy relative to the lower terminal group 23, so as to ensure the alignment accuracy of the upper signal terminal unit 211 and the upper grounding terminal 212 with the lower signal terminal unit 231 and the lower grounding terminal 232 respectively, and finally ensure that the upper signal terminal 2111 and the lower signal terminal 2311 have good high-frequency performance in the process of transmitting signals; in addition, it is also beneficial to ensure the regularity of the secondary Molding insulating plastic body after molding. In view of this, as a further optimization of the Type-C connector female socket structure with good high-frequency performance, a limit post 2334 can be extended upward from the top wall of the lower Molding insulating plastic body 233, and correspondingly, a plurality of mating holes 2134 adapted to the limit post 2334 are formed on the upper Molding insulating plastic body 213, and a through notch 221 (such as Figure 8 , 9 , 10, 11, and 14). When the upper terminal group 21 and the lower terminal group 23 are placed in place relative to the middle metal shielding sheet 22, first align each limit column 2334 with the matching plug-in hole 2134, and then press down hard to achieve the precise assembly of the upper terminal group 21 and the lower terminal group 23 (as shown in FIG. Fig. 20 , 22 In addition, the presence of the through notch 221 can effectively prevent the intermediate metal shielding sheet 22 from changing position due to external force during the secondary molding process.

[0068] Finally, it should be noted that the limiting column 2334 and the mating hole 2134 are preferably assembled by interference fit, thereby further improving the position accuracy between the upper terminal group 21 and the lower terminal group 23, and ensuring the regularity of the secondary molding of the insulating plastic body. Specifically, along its radial direction, a plurality of interference ribs 21341 extend inward from the side wall of the mating hole 2134. The radial size of the interference rib 21341 is controlled between 0.02-0.05mm (such as Fig. 9 , 10 , 20, and 22).

[0069] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A Type-C connector female socket with good high-frequency performance, comprising an outer metal shell and a socket tongue; the socket tongue is built-in and fixed in the outer metal shell, and comprises an upper terminal group, an intermediate metal shielding sheet, a lower terminal group and a secondary Molding insulating plastic body; the upper terminal group, the lower terminal group and the intermediate metal shielding sheet are all embedded in the secondary Molding insulating plastic body; the intermediate metal shielding sheet is located between the upper terminal group and the lower terminal group; the upper terminal group comprises an upper row signal terminal unit, an upper grounding terminal and an upper primary Molding insulating plastic body; the upper row signal terminal unit and the upper grounding terminal are both embedded in the upper primary Molding insulating plastic body; the number of the upper grounding terminals is set to 2, The upper row signal terminal unit is symmetrically arranged on the left and right sides, and is in contact with and conductive with the middle metal shielding sheet; the upper row signal terminal unit is composed of a plurality of upper row signal terminals arranged in sequence side by side along the left and right directions, and are all conductive with the PCB board; the lower terminal group includes a lower row signal terminal unit, a lower grounding terminal and a lower first-place Moliding insulating plastic body; the lower row signal terminal unit and the lower grounding terminal are both embedded in the lower first-place Moliding insulating plastic body; the number of the lower grounding terminals is set to 2, which are symmetrically arranged on the left and right sides of the lower row signal terminal unit, and are in contact with and conductive with the middle metal shielding sheet; the lower row signal terminal unit is composed of a plurality of lower row signal terminals arranged in sequence side by side along the left and right directions, and are all conductive with the PCB board, characterized in that, The socket tongue also includes an EMI component; the EMI component is also embedded in the secondary Moliding insulating plastic body; the EMI component is in contact with and conductive with the intermediate metal shielding sheet, and is arranged around the periphery of the upper terminal group and the lower terminal group; the EMI component includes an upper anti-electromagnetic interference component and a lower anti-electromagnetic interference component that are oppositely arranged along the upper and lower directions; the upper anti-electromagnetic interference component is simultaneously conductive with the intermediate metal shielding sheet, the upper grounding terminal and the outer metal shell; the lower anti-electromagnetic interference component is simultaneously conductive with the intermediate metal shielding sheet, the lower grounding terminal and the outer metal shell; Before performing the secondary Molding injection process, the upper anti-electromagnetic interference component is buckled onto the upper terminal group, and the lower anti-electromagnetic interference component is buckled onto the lower terminal group, and the upper and lower pushing columns in the injection mold are used to apply a supporting force to the upper and lower anti-electromagnetic interference components, respectively, so that the upper and lower anti-electromagnetic interference components are kept in a gap-free contact state relative to the intermediate metal shielding sheet until the secondary Molding injection process is completed, and incidentally, an upper injection molding process avoidance gap and a lower injection molding process avoidance gap are formed on the secondary Molding insulating plastic body.

2. According to claim 1, the Type-C connector female socket with good high-frequency performance is characterized in that: The upper anti-electromagnetic interference component includes an upper anti-electromagnetic interference component body, an upper extension arm and an upper top contact arm; the number of the upper extension arms is set to 2, which are symmetrically distributed on the left and right sides of the upper anti-electromagnetic interference component body, and are respectively extended outward from the left and right side walls of the upper anti-electromagnetic interference component body and bent downward; the number of the upper top contact arms is also set to 2, which are respectively extended downward from the bottom wall of the upper extension arm and bent outward at 90°; Correspondingly, the number of the upper injection molding process avoidance gaps is set to 2, and they are one-to-one aligned with the upper top contact arms; the lower anti-electromagnetic interference component includes a lower anti-electromagnetic interference component body, a lower extension arm and a lower top contact arm; the number of the lower extension arms is set to 2, which are symmetrically distributed on the left and right sides of the lower anti-electromagnetic interference component body, and are respectively extended outward by the left and right side walls of the lower anti-electromagnetic interference component body and bent upward; the number of the lower top contact arms is also set to 2, which are extended upward by the top wall of the lower extension arm and bent outward at 90°; correspondingly, the number of the lower injection molding process avoidance gaps is set to 2, and they are one-to-one aligned with the lower top contact arms.

3. According to claim 2, the Type-C connector female socket with good high-frequency performance is characterized in that: The upper anti-electromagnetic interference component also includes a first upper limit arm; the number of the first upper limit arms is 2, which are symmetrically distributed on the left and right sides of the upper anti-electromagnetic interference component body and are separated from the upper extension arm by a set distance; the first upper limit arm is formed by continuing to extend outward from the left and right side walls of the upper anti-electromagnetic interference component body and bending downward; correspondingly, two upper limit slots for inserting the first upper limit arm are formed on the top wall of the upper first Moliding insulating plastic body; the lower anti-electromagnetic interference component also includes a first lower limit arm; the number of the first lower limit arms is 2, which are symmetrically distributed on the left and right sides of the lower anti-electromagnetic interference component body and are separated from the lower extension arm by a set distance; the first lower limit arm is formed by continuing to extend outward from the left and right side walls of the lower anti-electromagnetic interference component body and bending upward; correspondingly, two lower limit slots for inserting the first lower limit arm are formed on the bottom wall of the lower first Moliding insulating plastic body.

4. According to claim 3, the Type-C connector female socket with good high-frequency performance is characterized in that: The upper anti-electromagnetic interference component also includes an upper elastic top contact arm; the number of the upper elastic top contact arms is set to 2, which can elastically contact and conduct with the upper grounding terminal in a one-to-one correspondence; the upper elastic top contact arm continues to extend backward from the rear side wall of the upper anti-electromagnetic interference component body and is folded back in the reverse direction; the lower anti-electromagnetic interference component also includes a lower elastic top contact arm; the number of the lower elastic top contact arms is set to 2, which can elastically contact and conduct with the lower grounding terminal in a one-to-one correspondence; the lower elastic top contact arm continues to extend backward from the rear side wall of the lower anti-electromagnetic interference component body and is folded back in the reverse direction.

5. According to claim 4, the Type-C connector female socket with good high-frequency performance is characterized in that: The upper anti-electromagnetic interference component also includes a second upper limit arm; the second upper limit arm is formed by connecting a first left-placed U-shaped limit bending section, an upper transition connection section and a first right-placed U-shaped limit bending section in sequence; the first left-placed U-shaped limit bending section and the first right-placed U-shaped limit bending section are both extended backward from the rear side wall of the upper anti-electromagnetic interference component body and bent; correspondingly, a first left-placed limit slot and a first right-placed limit slot are formed on the upper first-molding insulating plastic body for inserting the first left-placed U-shaped limit bending section and the first right-placed U-shaped limit bending section respectively; The lower anti-electromagnetic interference component also includes a second lower limit arm; the second lower limit arm is formed by connecting a second left-placed U-shaped limit bending section, a lower transition connection section and a second right-placed U-shaped limit bending section in sequence; the second left-placed U-shaped limit bending section and the second right-placed U-shaped limit bending section are both extended backward from the rear side wall of the lower anti-electromagnetic interference component body and bent; correspondingly, a second left-placed limit slot and a second right-placed limit slot are molded in the lower first-molding insulating plastic body for the second left-placed U-shaped limit bending section and the second right-placed U-shaped limit bending section to be placed therein respectively.

6. According to claim 5, the Type-C connector female socket with good high-frequency performance is characterized in that: The second upper limit arm also includes an upper top contact piece; the upper top contact piece is formed by continuing to extend upward from the top wall of the upper transition connection section, and exceeds the set height of the first left-placed U-shaped limit bending section and the first right-placed U-shaped limit bending section, so as to be used to make top contact with the top wall of the inner cavity of the outer metal shell; the second lower limit arm also includes a lower top contact piece; the lower top contact piece is formed by continuing to extend downward from the bottom wall of the lower transition connection section, and exceeds the set height of the second left-placed U-shaped limit bending section and the second right-placed U-shaped limit bending section, so as to be used to make top contact with the bottom wall of the inner cavity of the outer metal shell.

7. The Type-C female connector with good high-frequency performance according to any one of claims 1 to 6, characterized in that: The front free end of the upper grounding terminal is bent downward to form an upper arc-shaped elastic top contact section that can elastically contact the middle metal shielding sheet; the front free end of the lower grounding terminal is bent upward to form a lower arc-shaped elastic top contact section that can elastically contact the middle metal shielding sheet.

8. The Type-C female connector with good high-frequency performance according to any one of claims 1 to 6, characterized in that: A limiting column extends upward from the top wall of the lower Moliding insulating plastic body, and correspondingly, a plurality of plug-in holes matched with the limiting column are formed on the upper Moliding insulating plastic body, and a through notch for the limiting column to pass through is opened on the middle metal shielding sheet.

9. The Type-C connector female socket with good high-frequency performance according to claim 8, characterized in that: The limiting column and the inserting hole are assembled by means of interference fit.

10. The Type-C connector female socket with good high-frequency performance according to claim 9, characterized in that: Along the radial direction, a plurality of interference ribs extend inwardly from the side wall of the mating hole; the radial dimension of the interference ribs is controlled between 0.02-0.05 mm.

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