Heating mechanism for heating atomization and atomization device thereof

Abstract

The present invention discloses a heating mechanism for heating and atomization and an atomizing device thereof. The heating mechanism includes a heating circuit for evaporating liquid and an electrode for connecting a power supply unit. At least two heating circuits are provided. All heating circuits are connected in parallel between two electrode contacts. Two adjacent heating circuits are connected by a plurality of connectors so that the two form a planar whole. A heat sink extending laterally for dispersing the heat of the heating circuit is provided at least in the middle of the outer heating circuit. The atomizing device includes a porous ceramic body and the above-mentioned heating mechanism. The heating mechanism is embedded in the bottom of the porous ceramic body and is flat against the bottom of the porous ceramic body. The heating mechanism of the present invention has good supporting strength and uniform heat distribution. The heating mechanism of the atomizing device is not separated from the ceramic body and has good heating uniformity.

Description

Technical Field

[0001] The invention belongs to the technical field of atomization, and relates to a heating mechanism for heating atomization and an atomization device thereof. Background Art

[0002] Among the heating atomization devices currently available, porous ceramic heating atomization devices are well received by the market due to their stable structure, good atomization effect, and simple and convenient assembly. At present, the main method is to embed sheet-shaped heating plates on the surface of porous ceramic bodies, rely on the porous ceramic body to conduct liquid, and the heating plates generate heat to evaporate and atomize the liquid. There are currently two assembly structures in the industry. The first is to print metal slurry on the surface of porous ceramics. The second is to place a sheet-shaped metal heating element into a ceramic mold, inject ceramic slurry into the mold, and sinter the heating element and porous ceramic together, so that the metal heating element can be embedded on the ceramic surface. Figure 1 As shown, the second assembly structure currently uses a single heating circuit that is formed into a square wave shape and embedded in the bottom of the porous ceramic. In actual use, due to the requirements for the resistance of the heating element, the heating sheet must be thin (generally between 0.1-0.15mm). Such a thin single circuit is uneven due to insufficient support, and it will be detached and completely buried in the ceramic body during the embedding process. It is also because the depth of the single circuit embedded in the porous ceramic body is different, resulting in poor consistency during use. Furthermore, the single circuit is made of metal, and metal conducts heat quickly. Due to the heat conduction effect, the heat in the middle of the heating circuit is higher, and the heat difference between the middle area and the two ends is large. Affecting the effect of atomization, and the single circuit has higher requirements for battery output, the heat distribution is scattered, and the tolerable power range is small. The above problems have a great impact on the consistency of the atomization device during actual use. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a heating mechanism for heating atomization with good supporting strength and uniform heat distribution in view of the defects of the prior art.

[0004] A further technical problem to be solved by the present invention is to provide an atomizing device which is not separated from the ceramic body, has a good supporting strength of the heating mechanism and has uniform heat distribution.

[0005] The technical solution adopted by the present invention to solve the technical problem is:

[0006] A heating mechanism for heating atomization comprises a heating circuit for evaporating liquid and an electrode for connecting a power supply unit, wherein at least two heating circuits are provided, all the heating circuits are connected in parallel between two electrode contacts, two adjacent heating circuits are connected by a plurality of connectors so that the two form a planar whole, and a heat sink extending transversely for dispersing the heat of the heating circuit is provided at least in the middle of the outer heating circuit.

[0007] Furthermore, in the heating mechanism for heating atomization, it is preferred that each of the heating circuits is a structure formed by connecting end to end or crossing at least one of a straight line unit and a curved line unit or a combination thereof.

[0008] Furthermore, in the heating mechanism for heating atomization, preferably all the connecting parts are evenly distributed on the heating circuit or symmetrically arranged about the middle of the heating circuit.

[0009] Furthermore, in the heating mechanism for heating atomization, the connecting member is preferably in the shape of a rod, a strip or a plate, and its shape is a straight line, a curve or a combination of at least one of them.

[0010] Furthermore, in the heating mechanism for heating atomization, preferably all the heat sinks are evenly distributed on the heating circuit or symmetrically arranged about the middle of the heating circuit.

[0011] Furthermore, in the heating mechanism for heating atomization, preferably, the width and / or length of the heat sink gradually decreases from the middle to both ends of each heating circuit; or / and the setting density of the heat sinks on each heating circuit gradually decreases from the middle to both sides.

[0012] Furthermore, in the heating mechanism for heating atomization, it is preferred that the connecting member is provided with a heat sink for directing heat to the ceramic body.

[0013] Furthermore, in the heating mechanism for heating atomization, the heat sink is preferably in the shape of a rod, strip or plate, and its shape is a straight line, a curve or a combination of at least one of them.

[0014] Furthermore, in the heating mechanism for heating atomization, the heat sink preferably extends outward from the heating circuit and its free end is folded out of the plane where the heating circuit is located to form a first folded portion for fixing the heating circuit.

[0015] Furthermore, in the heating mechanism for heating atomization, the heating circuit is preferably provided with a second folding portion folded outward from the plane where the heating circuit is located.

[0016] An atomizing device comprises a porous ceramic body and the above-mentioned heating mechanism, wherein the heating mechanism is embedded in the bottom of the porous ceramic body and is flush with the bottom of the porous ceramic body.

[0017] In the present invention, at least two heating circuits are arranged in parallel, and two adjacent heating circuits are connected by a connector, so that the heating circuits form a mesh, which improves the support strength and flatness of the sheet heating body. At the same time, a plurality of heat sinks are arranged on the heating circuits, and the heat at the higher heat position on the heating circuits is dispersed through the heat sinks, so that the overall heat of the heating mechanism is more balanced. In addition, the connector can also play the role of heat dissipation and heat distribution. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0019] Figure 1 It is a schematic diagram of the prior art structure;

[0020] Figure 2 is a stereogram of Example 1-1 of the present invention;

[0021] Figure 3 is a schematic diagram of the side structure of Example 1-1 of the present invention;

[0022] Figure 4 is a top view of Example 1-1 of the present invention;

[0023] Figure 5 is a top view of embodiment 1-2 of the present invention;

[0024] Figure 6 is a top view of Embodiment 1-3 of the present invention;

[0025] Figure 7 is a top view of Embodiment 1-4 of the present invention;

[0026] Figure 8 is a top view of Embodiment 1-5 of the present invention;

[0027] Fig. 9 is a top view of Embodiment 1-6 of the present invention;

[0028] Fig.10 is a top view of Embodiment 1-7 of the present invention;

[0029] Fig.11 is a top view of Embodiment 1-8 of the present invention;

[0030] Fig.12 is a top view of Embodiment 1-9 of the present invention;

[0031] Fig.13 is a top view of Embodiment 1-10 of the present invention;

[0032] Fig.14 is a top view of Embodiment 1-11 of the present invention;

[0033] Fig.15 is a top view of Embodiment 1-12 of the present invention;

[0034] Fig.16 is a top view of Embodiment 1-13 of the present invention;

[0035] Fig.17 is an exploded view of embodiment 2 of the present invention;

[0036] Fig.18 It is a cross-sectional view of Example 2 of the present invention. DETAILED DESCRIPTION

[0037] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific embodiments of the present invention are now described in detail with reference to the accompanying drawings.

[0038] When a component is referred to as being “fixed to” or “disposed on” another component, it may be directly or indirectly located on the other component. When a component is referred to as being “connected to” another component, it may be directly or indirectly connected to the other component.

[0039] The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the drawings and are only for the convenience of description and cannot be understood as limitations on the technical solution. The terms "first", "second", etc. are only used for the convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0040] Embodiment 1, as Figure 1-16 As shown, a heating mechanism for heating atomization includes a heating circuit 100 for evaporating liquid and an electrode 700 for connecting a power supply unit. At least two heating circuits 100 are provided, and all the heating circuits 100 are connected in parallel between the contacts of two electrodes 700. Two adjacent heating circuits 100 are connected by a plurality of connectors 200 so that the two form a planar whole. A heat sink 300 extending laterally for dispersing the heat of the heating circuit 100 is provided at least in the middle of the outer heating circuit 100.

[0041] Compared with the prior art, the present invention changes the existing single heating circuit 100 into a plurality of heating circuits 100 with at least two. Due to the provision of the plurality of heating circuits 100, the length of each heating circuit 100 can be shortened, which can reduce the heat difference between the middle area and the two ends of the heating circuit 100 caused by the heat conduction effect. In addition, the additional connector 200 and heat sink 300 are provided, and the heat at the higher heat position on the heating circuit 100 is dispersed through the heat sink 300 and the connector 200, so that the overall heat of the heating mechanism is more balanced. Furthermore, the plurality of heating circuits 100 are connected to form an integral plane through the connector 200, and the mutual connection makes this plane relatively flat and not easy to warp, thereby avoiding the situation in which the heating circuit 100 in the prior art is partially separated and completely buried in the ceramic body.

[0042] The main structure of the heating mechanism of the present invention is the heating circuit 100. Generally, the heating circuit 100 is a linear extension or a rotary structure, and the two ends of the heating circuit 100 are connected to the electrodes. In order to fully atomize the liquid, the heating circuit 100 needs to be arranged in a plane. The present invention provides at least two heating circuits 100, and these heating circuits 100 can be the same or different. In order to achieve uniform atomization, the heating circuits 100 of the entire heating mechanism are arranged in a regular pattern. The number of heating circuits 100 generally provided can be 2-8 according to actual needs, and preferably 2-5. The lengths of the heating circuits 100 can be the same or different, and the shapes can be the same or different. It is preferred to use heating circuits 100 of the same length and shape. The material of the heating circuit 100 is made of metal.

[0043] All heating circuits 100 are simultaneously connected between the contacts of the two electrodes 700, that is, all heating circuits 100 are connected in parallel between the contacts of the two electrodes 700, but there are multiple ways to arrange the heating circuits 100. In order to fill a plane, one is to arrange them side by side, that is, the extension directions of multiple heating circuits 100 are the same or substantially the same, and multiple heating circuits 100 are arranged at intervals, and the spacing between adjacent heating circuits 100 can be the same or different, preferably equidistant. The second is a cross or staggered arrangement, that is, the extension directions of multiple heating circuits 100 are different, so that they intersect somewhere or intersect through the connector 200.

[0044] Each heating circuit 100 is a structure formed by connecting or crossing at least one of a straight line unit and a curved line unit or a combination thereof. That is, the heating circuit 100 can be in any shape without limitation, as long as it meets the requirement of uniform heating of the present invention.

[0045] Specifically, the first implementation mode of the heating circuit 100: the heating circuit 100 is composed of one or more linear units, and a linear unit can be arranged in a straight line from one electrode contact to another electrode contact; multiple linear units are connected end to end to form a linear heating circuit 100 or a loop heating circuit 100.

[0046] A second implementation of the heating circuit 100: The heating circuit 100 is composed of one or more curve units, and one curve unit can be arranged from one electrode contact to another electrode contact; multiple curve units are connected end to end to form the heating circuit 100.

[0047] A third implementation of the heating circuit 100: The heating circuit 100 is formed by connecting one or more straight units and curved units end to end. The straight units and the curved units can be arranged separately or alternately.

[0048] A fourth embodiment of the heating circuit 100: The heating circuit 100 is formed by a plurality of linear units being crossed or staggered, and the crossing or staggered connection means that the extension directions of the plurality of heating circuits 100 are varied and the extension directions are crossed or staggered at a certain place. The crossing means that the plurality of linear units are directly connected together, and the staggered means that they are connected together through the connector 200 or the heat sink 300.

[0049] A fifth implementation of the heating circuit 100: The heating circuit 100 is formed by a plurality of curved units being crossed or staggered, wherein crossing means that a plurality of curved units are directly connected together, and staggering means that they are connected together through a connector 200 or a heat sink 300 .

[0050] The sixth implementation of the heating circuit 100: The heating circuit 100 is formed by crossing or staggering at least one straight line unit and at least one curved line unit. This method is a technical solution formed by combining the fourth and fifth implementations.

[0051] In order to maintain the flatness and support performance of the entire heating mechanism, a connector 200 is provided between adjacent heating circuits 100. The connector 200 can be connected to any position of the heating circuit 100. The connector 200 is rod-shaped, strip-shaped or plate-shaped, and its shape is a straight line, a curve or a combination of at least one of them. Rod-shaped, strip-shaped or plate-shaped refers to the lateral width of the connector 200. The structure of the connector 200 can be a narrow rod-shaped, a strip-shaped with a certain width, or a relatively wide plate-shaped. In terms of the overall or length direction, the shape of the connector 200 can be a straight line, a curve or a combination of at least one of them. Here, the combination of at least one of them means: the connector 200 can have multiple straight parts connected end to end or cross-connected as a whole; the connector 200 can have multiple straight parts connected end to end or cross-connected as a whole; the connector 200 can have multiple straight parts and curved parts connected end to end or cross-connected as a whole, or the connector 200 can include curved parts and straight parts on different sides to form a combined shape. The connectors 200 on a single heating circuit 100 may be arranged in parallel or in non-parallel, depending on actual needs.

[0052] In order to maintain flatness and uniform heat conduction, it is preferred that all the connectors 200 are evenly distributed on the heating circuit 100 or symmetrically arranged about the middle of the heating circuit 100. The connectors 200 can be horizontally connected, axially connected, or obliquely connected relative to the heating circuit 100. Adjacent connectors 200 can be arranged at intervals, in parallel, or crosswise.

[0053] The function of the heat sink 300 is to extract the heat in the heating circuit 100 through the heat sink 300, and since there are connectors 200 between the heating circuits 100, the heat sink is generally arranged on the outside of the outermost heating circuit 100, that is, arranged on the outside of all heating circuits 100, and the heat sink 300 extends outward, and the extension direction can be perpendicular to the central axis of the entire heating mechanism, or can be arranged at an angle. The heat sink 300 on a single heating circuit 100 can be arranged in parallel or non-parallel, depending on actual needs.

[0054] In terms of the setting position, the heat sink 300 of the present invention is used to evenly dissipate the heat on the heating circuit 100, especially at the high heat position, that is, the heat sink 300 is at least set in the middle area of ​​the heating circuit 100, and the heat sink 300 can also be set in the two end areas and the middle area of ​​the heating circuit 100. Preferably, all the heat sinks 300 are evenly distributed on the heating circuit 100 or symmetrically arranged about the middle of the heating circuit 100.

[0055] From the structure of the heat sink 300 itself, since the heat in the middle area of ​​the heating circuit 100 is higher than that in the two end areas, the selection of heat sinks 300 at different positions is different. The width and / or length of the heat sink 300 can be selected to gradually decrease from the middle of each heating circuit 100 to the two ends, that is, the area of ​​the heat sink 300 is gradually reduced from the middle of the heating circuit 100 to the two ends; the setting density of the heat sink 300 on each heating circuit 100 can also be selected to gradually decrease from the middle to the two sides. Or the shape, size and density of the heat sink 300 are gradually reduced from the middle to the two sides at the same time. This structure and arrangement can extract high heat as much as possible, reduce the temperature difference, and maintain the heating uniformity of the heating circuit 100.

[0056] The heat sink 300 is in the shape of a rod, strip or plate, and its shape is a straight line, a curve or a combination of at least one of them. The rod, strip or plate shape refers to the structure of the heat sink 300 which can be a narrow rod, a strip with a certain width, or a relatively wide plate in terms of the lateral width of the connector 200. In terms of the overall or length direction, the shape of the heat sink 300 can be a straight line, a curve or a combination of at least one of them. Here, the combination of at least one of them means: the heat sink 300 can have multiple straight parts connected end to end or cross-connected as a whole; the heat sink 300 can have multiple straight parts connected end to end or cross-connected as a whole; the heat sink 300 can have multiple straight parts and curved parts connected end to end or cross-connected as a whole.

[0057] In order to further enhance the heat dissipation efficiency, it is preferred that a heat dissipation member 300 for directing heat to the ceramic body is also provided on the connecting member 200. The structure of the heat dissipation member 300 here can be the same as that of the heat dissipation member 300 in the heating circuit 100, or it can be different. Generally, the connecting member 200 is shorter, and the heat dissipation member 300 provided here is mainly in the form of a plate or sheet.

[0058] Since the heating circuit 100 needs to be embedded in the ceramic body, but the heating circuit 100 cannot be buried in the ceramic body, which makes it easy for the heating circuit 100 to separate from the ceramic body. In order to strengthen the fixation between the heating circuit 100 and the ceramic body, the heat sink 300 preferably extends to the outside of the heating circuit 100 and its free end is folded out of the plane where the heating circuit 100 is located, forming a first folded portion 500 for fixing the heating circuit 100. The first folded portion 500 is located on one side of the plane of the heating circuit 100 and can be buried in the ceramic body during manufacturing to strengthen the fixation between the heating circuit 100 and the ceramic body.

[0059] In order to further strengthen the supporting force, the heating circuit 100 is preferably provided with a second folding portion 600 folded outward from the plane where the heating circuit 100 is located. The second folding portion 600 is preferably arranged at both ends of the heating circuit 100 to maintain the firmness of the fixing between the heating mechanism and the ceramic body from both ends. The second folding portion 600 is also buried in the ceramic body. Either the first folding portion 500 or the second folding portion 600 can be selected, or both can be provided.

[0060] In order to further illustrate the present invention, several specific embodiments are listed below for detailed description:

[0061] Example 1-1, as Figure 2-4 As shown, a heating mechanism for heating atomization includes a heating circuit 100 for evaporating liquid, wherein two heating circuits 100 are arranged in parallel between two electrode contacts, each heating circuit 100 is formed by tooth-shaped arrangement or V-shaped continuous arrangement, and a heat sink 300 extends outward from the tooth-shaped top, and the heat sink 300 is arranged at each tooth-shaped top, and a connecting member 200 is provided at the tooth-shaped bottom end of the heating circuit 100 to connect with the tooth-shaped top end of another heating circuit 100, and the two heating circuits 100 are connected by a plurality of connecting members 200 so that the two form a planar whole. The connecting members 200 are parallel to each other, and the heat sinks 300 are arranged parallel to each other. The free end of the heat sink 300 is folded outward from the plane where the heating circuit 100 is located, and a first folding portion 500 is provided at the end of the heating circuit 100. At the same time, a second folding portion 600 is provided at the end of the heating circuit 100.

[0062] Embodiment 1-2, as Figure 5 As shown, a heating mechanism for heating atomization in this embodiment is an improvement on the basis of embodiment 1-1. The specific improvement is that a heat sink 300 is also provided on the connecting member 200 to strengthen the heat dissipation in the middle area of ​​the heating circuit 100. The heat sink 300 is a sheet structure, and multiple heat sinks 300 are arranged side by side with the same shape. The rest of the structure is the same as embodiment 1-1, and will not be repeated here.

[0063] Embodiment 1-3, as Figure 6 As shown, a heating mechanism for heating atomization in this embodiment is improved on the basis of embodiment 1-1. The specific improvement is the width of the heat sink 300, which decreases from the middle area to the two ends, that is, the width of the heat sink 300 W1>W2>W3, which strengthens the heat dissipation of the middle area of ​​the heating circuit 100. The rest of the structure is the same as embodiment 1-1, and will not be repeated here.

[0064] Embodiment 1-4, as Figure 7As shown, a heating mechanism for heating atomization in this embodiment is an improvement on the basis of embodiment 1-1. The specific improvement is the setting of the connecting piece 200. In addition to the connecting piece 200 set in embodiment 1-1, a connecting piece 200 is also set at the toothed top end of one heating line 100 and the toothed bottom end of another heating line 100. Such a structure enhances the supporting strength. The rest of the structure is the same as embodiment 1-1 and will not be repeated here.

[0065] Embodiment 1-5, as Figure 8 As shown, a heating mechanism for heating atomization in this embodiment is an improvement on the basis of embodiment 1-1. The specific improvement is that the shape of the heating circuit 100 is changed to a square wave structure, two heat sinks 300 are connected to the top surface of each square wave unit, and two connectors 200 are provided on the bottom surface of the square wave unit to connect to the adjacent heating circuits 100. The connectors 200 are arranged parallel to each other. Similarly, the bottom surface of each square wave unit of another heating circuit 100 is provided with a heat sink 300 extending outward. The heat sinks 300 are arranged parallel to each other, and the rest of the structure is the same as embodiment 1-1, which will not be repeated here.

[0066] Embodiment 1-6, as Fig. 9 As shown, a heating mechanism for heating atomization in this embodiment is three heating circuits 100, and the three heating circuits 100 are arranged in parallel between two electrode contacts. The heating circuits 100 are all straight-line and arranged parallel to each other. The two outer heating circuits 100 have heat sinks 300 extending outward, and the heat sinks 300 are perpendicular to the heating circuits 100. A connector 200 is provided between two adjacent heating circuits 100 to connect the two together. In the horizontal direction, the connector 200 is in a straight line, and is also in a straight line with the outer heat sink 300. In other embodiments, in the horizontal direction, the connector 200 can be staggered, and the heat sink 300 can also be staggered with the connector 200. Or the heat sink 300 and the connector 200 are gradually sparse from the middle to the sides. Since the heat is concentrated more in the middle, more heat sinks 300 are required.

[0067] Embodiment 1-7, as Fig.10As shown, a heating mechanism for heating atomization in this embodiment is an improvement on the basis of embodiments 1-6. The specific improvement is the setting position and density of the heat sink 300 and the connector 200. The density decreases from the middle area to the two ends, that is, the heat sink 300 is densely arranged in the middle area of ​​the heating circuit 100, and sparsely arranged in the two end areas, so as to enhance the heat dissipation in the middle area of ​​the heating circuit 100. The middle connector 200 and the heat sinks 300 on both sides can be staggered. The strength of the heating circuit 100 in this embodiment is better than that of the non-staggered one, and it is not easy to deform. The distance for heat conduction to the heat sink 300 is short, and the heat sink 300 can dissipate heat better. The remaining structures are the same as embodiments 1-6, and will not be repeated here.

[0068] Embodiment 1-8, as Fig.11 As shown, a heating mechanism for heating atomization in this embodiment is an improvement on the basis of embodiments 1-6. The specific improvement is that the number of heating circuits 100 is changed to two mutually parallel heating circuits 100. The heat sink 300 and the connecting member 200 are arranged alternately. The rest of the structure is the same as that of embodiments 1-6, and will not be repeated here.

[0069] Embodiment 1-9, as Fig.12 As shown, a heating mechanism for heating atomization in this embodiment includes two heating circuits 100 of circuitous circuits, which are arranged in parallel between two electrode contacts. Both heating circuits are formed by connecting the curve units end to end or connecting the curve units and the straight line units alternately end to end to form a waveform circuit. A heat sink 300 is connected to the top of the waveform of each curve, and a connector 200 is connected between the top and bottom of the adjacent waveform. In this embodiment, the connector 200 is relatively short and forms an integral structure with the adjacent waveform. The circuitous circuit is also a good arrangement for heat balance, so that a heating element with a large resistance and a long heating circuit 100 can be produced. The rounded corner design of the circuitous point can be convenient for processing. In other embodiments, on the basis of this embodiment, the two heating circuits 100 can adopt a method in which the middle section spacing is large and the spacing at both ends is slightly dense, so that the problem of high heat in the middle section of the two heating circuits 200 can be avoided. In addition, the connector 200 between the two circuits can also play a good role in heat dissipation and heat balancing. The remaining structures are the same as those in Example 1-1, and will not be repeated here.

[0070] Embodiment 1-10, as Fig.13As shown, a heating mechanism for heating atomization in this embodiment includes two heating circuits 100 arranged in parallel between two electrode contacts, each heating circuit 100 is formed by two straight line units connected end to end, and the two straight line units extend in different directions, forming an outward arch in the middle, and the two heating circuits 100 form a diamond structure, that is, the distance between the two heating circuits 100 is large in the middle and small at both ends. At the same time, the width of the heat sink 300 decreases from the middle area to the two ends, that is, the width of the heat sink 300 is W1>W2>W3, which strengthens the heat dissipation of the middle area of ​​the heating circuit 100. Furthermore, the connecting member 200 and the heat sink 300 have the same change trend. In the horizontal direction, the heat sink 300 and the connecting member 200 are on a straight line, and the widths of the two are the same. The remaining structures are the same as those in Examples 1-6 and will not be repeated here.

[0071] Embodiment 1-11, as Fig.14 As shown, a heating mechanism for heating atomization in this embodiment is an improvement based on embodiment 1-10. The specific improvements are the shape of the heating circuit 100 and the shape of the connecting piece 200. The shape of the heating circuit 100 is changed to a sawtooth structure, and the two heating circuits 100 have the same shape. A heat sink 300 is connected to the vertex of each sawtooth, and a connecting piece 200 is provided at the bottom of the sawtooth to connect to the adjacent heating circuit 100. In this embodiment, the shape of the connecting piece 200 is a straight line connected end to end to form a broken line. Compared with embodiment 1-10, the forming of the broken line by the connecting piece 200 in this embodiment can arrange the entire heating mechanism more evenly and improve the uniformity of heating. The remaining structure is the same as embodiment 1-1, and will not be repeated here.

[0072] On the basis of the above-mentioned embodiments, the straight line unit can be changed into a broken line composed of straight line units or a rotating arc composed of curve units, etc., so that there are more detours, the contact area between the heating circuit and the heating element is larger, and the resistance value of the detour circuit can be made larger.

[0073] Embodiment 1-12, as Fig.15 As shown, a heating mechanism for heating atomization in this embodiment is an improvement on the basis of embodiment 1-1. The specific improvement is the shape of the heating circuit 100. The tooth-shaped structure formed by the straight line unit is changed to a waveform unit formed by a special-shaped structure formed by a straight line + a curve. Each waveform unit includes straight edges and curved edges arranged alternately. The heating circuit 100 is designed to be an arc. The advantage of the arc is that there are no sharp corners that are difficult to process, and the bends are relatively smooth and easy to process. The rest of the structure is the same as embodiment 1-1, and will not be repeated here.

[0074] Embodiment 1-13, as Fig.16As shown, a heating mechanism for heating atomization in this embodiment is improved on the basis of embodiments 1-12. The specific improvement is also the shape of the heating circuit 100, which is changed from a tooth-shaped structure formed by a straight line unit to a waveform unit formed by a special-shaped structure formed by a straight line + a curve. Each waveform unit includes a straight edge and a curved edge, with the curved edge outside and the straight edge inside. The bending part is relatively smooth and easy to process. The rest of the structure is the same as embodiments 1-12, and will not be repeated here.

[0075] Embodiment 2, as Figure 17-18 As shown, an atomization device includes a porous ceramic body 1 and a heating mechanism 2 of Example 1, wherein the heating mechanism 2 is embedded in the bottom of the porous ceramic body 1 and is flush with the bottom of the porous ceramic body 1 .

[0076] The porous ceramic body 1 is a square groove structure, and the heating mechanism 2 is embedded in the bottom of the porous ceramic body 1. The first folding portion 500 and the second folding portion 600 in the heating mechanism 2 are embedded in the porous ceramic body 1 during manufacturing, and at least two heating circuits 100 are attached to the bottom of the porous ceramic body 1.

[0077] The specific structure of the heating mechanism 1 is the same as that of the first embodiment and will not be described in detail here.

[0078] Comparative test: Using a single circuit of the prior art, the present invention selects three embodiments for testing. Test method: Select different heating mechanisms, the materials of the heating mechanisms are all made of nickel-chromium alloy, and the resistance value is 1.0±0.05Ω. Power supply 1.5V (divided into three sections for heating. Each 0.5V is powered on for 10 seconds), and an infrared thermal imaging thermometer (accuracy is ±0.1℃) is used to observe the temperature difference between the middle point range and the two side points of the heating mechanism. There are three test points, A is in the middle of the ceramic, B and C are on both sides of the ceramic (the highest temperature value is taken). The temperature values ​​of each position in different temperature sections are divided into temperature difference values ​​(mainly testing data between 70-350 degrees)

[0079] Prior art comparative example

[0080] serial number Point A temperature (℃) Point B temperature (℃) Point C temperature (℃) Maximum temperature difference 1 70.5 66.1 66.5 4.4 2 168.5 143.1 142.1 26.4 3 202.4 174.3 175.8 28.1 4 231.2 192.9 192.5 38.7 5 273.9 229.3 234.2 44.6 6 321.8 264.3 277.7 58.4

[0081] Example 1-1

[0082]

[0083]

[0084] Examples 1-3

[0085] serial number Point A temperature (℃) Point B temperature (℃) Point C temperature (℃) Maximum temperature difference 1 73.2 75.1 73 1.9 2 133.3 138.7 133.2 5.4 3 162.2 168.3 162.6 6.1 4 190.5 198.8 191.1 8.3 5 266.7 277.5 267.5 10.8 6 320.1 335.1 322.6 15

[0086] Examples 1-5

[0087] serial number Point A temperature (℃) Point B temperature (℃) Point C temperature (℃) Maximum temperature difference 1 80.2 85.1 80.6 4.5 2 141.1 151.7 141.2 10.6 3 152.2 162.5 151.6 16.3 4 180.5 196.8 182.1 16.3 5 253.7 273.5 254.5 19.8 6 310.1 335.1 314.6 25

[0088] It can be seen from the above data that the temperature difference of the prior art gradually increases with the increase of temperature, and the maximum temperature difference is 58.4°C. However, the embodiment of the present invention can distribute the temperature of the heating mechanism to the porous ceramic by setting the layout of the heat sink and the connecting parts, so that the temperature difference between the middle section and the two side sections caused by heat conduction and heat radiation problems can be adjusted to the minimum. From the data of the above embodiment, it can be seen that the maximum temperature difference is reduced to 15-25°C, making the temperature of the bottom heating surface of the entire atomizing heating mechanism more balanced and the heat distribution more uniform. The above data show that the structure of the present invention makes the heat distribution more uniform, and that the structure of the heating mechanism can well solve the problem of uneven temperature distribution caused by thermal radiation, so that the temperature difference becomes smaller or even approaches temperature uniformity.

Claims

1. A heating mechanism for heating atomization, comprising a heating circuit for evaporating liquid and an electrode for connecting a power supply unit, characterized in that: At least two heating circuits are provided, and all the heating circuits are connected in parallel between the two electrode contacts; two adjacent heating circuits are connected by a plurality of connecting members so that the two form a planar whole, and a heat sink extending laterally for dispersing the heat of the heating circuit is provided at least in the middle of the outer heating circuit; The width and / or length of the heat sink gradually decreases from the middle to both ends of each heating circuit; or / and the arrangement density of the heat sinks on each heating circuit gradually decreases from the middle to both sides; The heat sink extends outward from the heating circuit and its free end is folded to form a first folded portion for fixing the heating circuit; The two ends of the heating circuit are provided with second folded parts folded outward from the plane where the heating circuit is located, so as to maintain the fixed connection between the heating mechanism and the ceramic body from both ends through the second folded parts.

2. The heating mechanism for heating atomization according to claim 1, characterized in that: Each of the heating circuits is a structure formed by at least one of a straight line unit and a curved line unit, or a combination of these units connected end to end or crossed.

3. The heating mechanism for heating atomization according to claim 1, characterized in that: All the connecting parts are evenly distributed on the heating circuit or symmetrically arranged about the middle of the heating circuit.

4. The heating mechanism for heating atomization according to claim 1, characterized in that: The connecting piece is in the shape of a rod, a strip or a plate, and its shape is a straight line, a curve or a combination of at least one of them.

5. The heating mechanism for heating atomization according to claim 1, characterized in that: All the heat sinks are evenly distributed on the heating circuit or symmetrically arranged about the middle of the heating circuit.

6. The heating mechanism for heating atomization according to claim 1, characterized in that: The connecting member is provided with a heat sink for directing heat to the ceramic body.

7. The heating mechanism for heating atomization according to claim 1 or 6, characterized in that: The heat sink is in the shape of a rod, strip or plate, and its shape is a straight line, a curve or a combination of at least one of them.

8. An atomizing device, characterized in that: It comprises a porous ceramic body and a heating mechanism according to any one of claims 1 to 7, wherein the heating mechanism is embedded in the bottom of the porous ceramic body and is flush with the bottom of the porous ceramic body.

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