Diamond bead, diamond wire saw and method for preparing diamond bead

By embedding a spiral coil in the diamond beads and embedded in the diamond base, diamond beads with spiral coils embedded in the inner wall have screw grooves, the problem of insufficient bonding between beads and diamond bases in the prior art is solved, and the cutting ability and protection effect of the diamond rope saw are significantly improved.

CN112958838BActive Publication Date: 2025-04-29XIAMEN ZL DIAMOND TECH CO LTD
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Patent Information

Application Number
CN202110376033.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-04-08
Publication Date
2025-04-29
Estimated Expiration
2041-04-08

AI Technical Summary

Technical Problem

In existing diamond rope saws, the bonding between beads and diamond substrates is insufficient, resulting in poor rotation protection in the axial direction and circumferential rotation direction.

Method used

By embedding a spiral coil in the diamond beads, it is embedded in the diamond base and molded by high temperature sintering to form diamond beads with a spiral coil and a screw groove on the inner wall.

Benefits of technology

It significantly improves the bonding firmness between diamond beads and diamond matrix, and enhances the anti-rotation ability in the axial direction and the anti-rotation ability in the circumferential rotation direction.

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Abstract

The present invention provides a diamond bead, a diamond wire saw and a method for preparing the diamond bead. The diamond bead includes a diamond matrix and a spiral coil. The diamond matrix has a through hole. The spiral coil is coaxially arranged with the diamond matrix and embedded in the diamond matrix. The spiral coil is recessed in the inner wall surface of the diamond matrix, so that the inner wall surface of the diamond matrix forms a screw groove at the position of the spiral coil. The firmness of the combination with the diamond matrix is ​​greatly improved. When applied to the diamond wire saw, the bottleneck in the prior art is broken through. The anti-movement ability of the diamond bead in the axial direction and the anti-rotation ability in the circumferential rotation direction are qualitatively improved. And the scheme provides a method for preparing the diamond bead, which can well prevent the spiral coil from being completely wrapped by the diamond matrix, so as to obtain a diamond bead embedded with a spiral coil and having a screw groove on the inner wall; the preparation steps are simple and ingenious.
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Description

Technical Field

[0001] The invention relates to the field of wire cutting, and in particular to a diamond bead, a diamond wire saw having the diamond bead and a method for preparing the diamond bead. Background Art

[0002] Diamond wire saw, also known as diamond wire, refers to a method of fixing diamond abrasive on a metal wire by electroplating or resin bonding to perform wire cutting. In the prior art, a diamond wire saw generally includes a wire rope, a plurality of beads strung on the wire rope, and a coating layer arranged on the outer surface of the wire rope to fix the beads. In order to prevent the beads from moving in the axial direction and rotating in the circumferential direction, a diamond wire saw and a manufacturing method with a spring inside the beads disclosed in CN103144202A is provided. The spring is provided inside the beads (i.e., the diamond matrix in this case) to limit the reinforcement. In this way, the beads can be effectively prevented from moving in the axial direction and rotating in the circumferential direction. However, the contact between the spring and the beads is poor in firmness, that is, the contact between the spring and the beads becomes a bottleneck for further reinforcement, and the degree of limit reinforcement cannot be further improved. Summary of the invention

[0003] Therefore, the present invention provides a diamond bead, a diamond wire saw having the diamond bead and a method for preparing the diamond bead to solve the above problems.

[0004] To achieve the above purpose, the technical solution provided by the present invention is as follows:

[0005] A method for preparing diamond beads comprises the following steps:

[0006] A1, providing a spiral coil, and coating an isolation layer on the inner circle of the spiral coil;

[0007] A2, preparing a diamond matrix green body on the outer ring of the spiral coil, and making the inner side wall of the diamond matrix green body penetrate into the gap of the spiral coil and be flush with the isolation layer;

[0008] A3, subjecting the product obtained in step A2 to high temperature sintering;

[0009] A4, removing the isolation layer on the inner circle of the spiral coil to obtain a diamond bead with a spiral coil embedded therein and a screw groove on the inner wall.

[0010] Furthermore, the isolation layer is a glue layer that does not bond with metal when the diamond matrix green body is sintered.

[0011] Furthermore, the isolation layer is a ceramic adhesive layer or a graphite adhesive layer.

[0012] Furthermore, the spiral coil is a spring or a non-deformable hard spiral coil.

[0013] Furthermore, between step A1 and step A2, step A1-2 is also included, in which a limiting column is inserted into the spiral coil, and the outer surface of the limiting column just abuts against the isolation layer; when operating step A2, the diamond matrix embryo is cold pressed, so that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil and abuts against the outer surface of the limiting column, that is, it is flush with the isolation layer; after the cold pressing is completed, the limiting column is removed.

[0014] A diamond bead comprises a diamond matrix and a spiral coil, wherein the diamond matrix has a through hole, the spiral coil is coaxially arranged with the diamond matrix and embedded in the diamond matrix, and the spiral coil is recessed in the inner wall surface of the diamond matrix, thereby forming a screw thread groove on the inner wall surface of the diamond matrix at the position of the spiral coil.

[0015] Furthermore, the diamond matrix is ​​extended from both ends of the spiral coil.

[0016] Furthermore, the spiral coil is of the same length as the diamond matrix and is embedded in the diamond matrix.

[0017] Furthermore, the spiral coil is a spring or a non-deformable hard spiral coil.

[0018] A diamond wire saw comprises a wire rope, a plurality of beads strung on the wire rope, and a coating layer arranged on the outer surface of the wire rope to fix the beads; the beads are the diamond beads described above.

[0019] The technical solution provided by the present invention has the following beneficial effects:

[0020] The diamond beads provided in this solution have spiral coils embedded in the diamond matrix, which greatly improves the firmness of the combination with the diamond matrix. When used in diamond wire saws, it breaks through the bottleneck of the existing technology; the anti-movement ability of the diamond beads in the axial direction and the anti-rotation ability in the circumferential direction are qualitatively improved.

[0021] This solution also provides a method for preparing the diamond bead, which can effectively prevent the spiral coil from being completely wrapped by the diamond matrix, thereby obtaining a diamond bead with a spiral coil embedded and a screw groove on the inner wall; the preparation steps are simple and ingenious. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Shown is a cross-sectional view of the diamond beads in Example 1;

[0023] Figure 2 FIG. 1 is a cross-sectional view of a diamond wire saw in Embodiment 1, showing a single diamond bead;

[0024] Figure 3 Shown is a cross-sectional view of the diamond beads in Example 2;

[0025] Figure 4 The figure shows a schematic diagram of the finished product of step A1 in embodiment 3;

[0026] Figure 5 Shown Figure 4 Cross-sectional view of the structure;

[0027] Figure 6 The figure shows a schematic diagram of the finished product of step A3 in embodiment 3;

[0028] Figure 7 The figure shows a flowchart of the preparation process of diamond beads in Example 3. DETAILED DESCRIPTION

[0029] To further illustrate the various embodiments, the present invention provides drawings. These drawings are part of the disclosure of the present invention, which are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, a person of ordinary skill in the art should be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0030] The present invention will now be further described with reference to the accompanying drawings and specific implementation methods.

[0031] Embodiment 1

[0032] Reference Figure 1 As shown, a diamond bead provided in this embodiment includes a diamond matrix 30 and a spiral coil 10, wherein the diamond matrix 30 has a through hole 301, the spiral coil 10 is coaxially arranged with the diamond matrix 30 and embedded in the diamond matrix 30, and the spiral coil 10 is recessed in the inner wall surface of the diamond matrix 30, so that the inner wall surface of the diamond matrix 30 forms a screw groove 31 at the position of the spiral coil 10. Specifically, the diamond matrix 30 is also extended from both ends of the spiral coil 10.

[0033] Reference Figure 2 As shown, this embodiment also provides a diamond wire saw, including a wire rope 40, a plurality of beads strung on the wire rope 40, and a coating layer 50 disposed on the outer surface of the wire rope to fix the beads; the beads are the diamond beads described above.

[0034] In the diamond wire saw, the screw groove 31 on the inner wall of the diamond matrix 30 of the diamond bead is embedded in the coating layer; the end of the spiral coil 10 extending out of the diamond matrix 30 is also embedded in the coating layer to achieve limited fixation to limit the movement of the diamond bead in the axial direction and the rotation in the circumferential direction.

[0035] At the same time, the structure of embedding the spiral coil 10 into the diamond matrix 30 greatly improves the bonding strength with the diamond matrix 30 compared with the existing method in the background technology. When applied to the diamond wire saw, it breaks through the bottleneck in the existing technology; the anti-swaying ability of the diamond beads in the axial direction and the anti-rotation ability in the circumferential rotation direction are qualitatively improved.

[0036] Specifically, in this embodiment, the spiral coil 10 is directly replaced by a spring in the prior art, and the material is easy to obtain. Of course, in other embodiments, a non-deformable hard spiral coil, that is, a spiral coil structure with the same shape as a spring but without elasticity, can also be used to achieve the role of limiting and fixing.

[0037] Furthermore, in the present embodiment, the wire rope 40 is a steel wire rope commonly used in the prior art. Of course, in other embodiments, the wire rope 40 may also be other types of ropes.

[0038] Furthermore, in this embodiment, the coating layer 50 is also a plastic layer commonly used in the prior art. Of course, in other embodiments, the coating layer 50 can also be replaced by other materials.

[0039] Embodiment 2

[0040] The structure of the diamond beads provided in this embodiment is substantially the same as that of the diamond beads in the first embodiment, except that: Figure 3 As shown, in this embodiment, the spiral coil 10 is equal in length to the diamond matrix 30 and is embedded in the diamond matrix 30; that is, the end of the spiral coil 10 is not exposed, so the limit of the spiral coil segments at both ends of the diamond matrix 30 is omitted, thereby shortening the length of a single diamond bead; compared with the diamond beads of Example 1, after the diamond beads of this embodiment are prepared into a diamond wire saw, although the axial anti-movement and circumferential anti-rotation capabilities are worse than those of the diamond wire saw of Example 1, the effect is not worse than that of the prior art due to the technical bottlenecks overcome. At the same time, the length of a single diamond bead is reduced, and the density of the diamond beads on the diamond wire saw is also greater, which effectively improves the cutting ability of the diamond wire saw; and the wire saw has better bending ability.

[0041] Embodiment 3

[0042] This embodiment provides a method for preparing the diamond beads in the first embodiment or the second embodiment, wherein the diamond beads in the first embodiment are taken as an example, referring to Figure 7 As shown, a method for preparing diamond beads is provided, comprising the following steps:

[0043] A1, a spiral coil 10 is provided, and an isolation layer 20 is coated on the inner circle of the spiral coil 10, such as Figure 4 , Figure 5 shown.

[0044] The thickness of the isolation layer 20 is the depth of the screw groove 31 on the inner wall of the diamond substrate 30 . Therefore, the depth of the screw groove 31 on the inner wall of the diamond substrate 30 can be determined by controlling the thickness of the isolation layer 20 , thereby achieving controllability.

[0045] A2, preparing a diamond matrix green body on the outer ring of the spiral coil 10, and making the inner side wall of the diamond matrix green body penetrate into the gap of the spiral coil 10 and be flush with the isolation layer 20.

[0046] Specifically, in order to ensure that the diamond matrix embryo penetrates into the gap of the spiral coil 10 and is flush with the isolation layer 30 when making the diamond matrix embryo, the preferred method is: between step A1 and step A2, it also includes step A1-2, inserting a limit column (not shown) into the spiral coil 10, and the outer surface of the limit column just abuts against the isolation layer 20; when operating step A2, the diamond matrix embryo is cold pressed, so that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil 10 and abuts against the outer surface of the limit column, that is, it is flush with the isolation layer 20; after the cold pressing is completed, the limit column is removed. In this way, through the cooperation of the limit column, it is possible to well achieve that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil 10 and is flush with the isolation layer 20, and the operation is simpler, and there is no need to deliberately control the parameters such as the pressure and time of the cold pressing, and the diamond matrix embryo is more compact. Of course, in other embodiments, it is also possible not to use the limit method of the limit column.

[0047] A3, the product obtained in step A2 is subjected to high temperature sintering to obtain a diamond matrix embryo. Thus, the diamond matrix is ​​formed, such as Figure 6 shown.

[0048] A4, removing the isolation layer 20 on the inner circle of the spiral coil 10, obtaining a diamond bead with the spiral coil 10 embedded therein and the inner wall having a screw groove 31, that is, Figure 1 The structure shown.

[0049] This solution provides a method for preparing the diamond bead, which can effectively prevent the spiral coil 10 from being completely wrapped by the diamond matrix 30, thereby obtaining a diamond bead with the spiral coil 10 embedded and the inner wall having a screw groove 31; the preparation steps are simple and ingenious.

[0050] Specifically, in order to better remove the isolation layer 20, the isolation layer 20 is a glue layer that does not bond with the metal under the condition of sintering the diamond matrix green body. That is, the isolation layer will not bond with the spiral coil 10 and the diamond matrix 30 in step A3, and is easy to remove. At the same time, when the isolation layer 20 is removed, it can be removed quickly.

[0051] More specifically, the isolation layer 20 is a ceramic adhesive layer or a graphite adhesive layer, that is, it is prepared by using ceramic adhesive or graphite adhesive in the prior art. Of course, in other embodiments, the material of the isolation layer is not limited thereto.

[0052] Although the present invention has been specifically shown and described in conjunction with the preferred embodiments, it should be understood by those skilled in the art that various changes may be made to the present invention in form and details without departing from the spirit and scope of the present invention as defined by the appended claims, all of which are within the scope of protection of the present invention.

Claims

1. A method for preparing diamond beads, characterized in that: The steps include: A1, providing a spiral coil, and coating an isolation layer on the inner circle of the spiral coil; A2, preparing a diamond matrix green body on the outer ring of the spiral coil, and making the inner side wall of the diamond matrix green body penetrate into the gap of the spiral coil and be flush with the isolation layer; A3, subjecting the product obtained in step A2 to high temperature sintering; A4, removing the isolation layer on the inner circle of the spiral coil to obtain a diamond bead with a spiral coil embedded therein and a screw groove on the inner wall.

2. The method for preparing diamond beads according to claim 1, characterized in that: The isolation layer is a glue layer that does not bond with metal under the condition of sintering the diamond matrix green embryo.

3. The method for preparing diamond beads according to claim 2, characterized in that: The isolation layer is a ceramic adhesive layer or a graphite adhesive layer.

4. The method for preparing diamond beads according to claim 1, characterized in that: The spiral coil is a spring or a non-deformable hard spiral coil.

5. The method for preparing diamond beads according to claim 1, characterized in that: Between step A1 and step A2, step A1-2 is also included, in which a limiting column is inserted into the inner ring of the spiral coil, and the outer surface of the limiting column just abuts against the isolation layer; when operating step A2, the diamond matrix embryo is cold pressed, so that the inner side wall of the diamond matrix embryo penetrates into the gap of the spiral coil and abuts against the outer surface of the limiting column, that is, it is flush with the isolation layer; after the cold pressing is completed, the limiting column is removed.

6. A diamond bead, characterized in that: The invention comprises a diamond matrix and a spiral coil, wherein the diamond matrix has a through hole, the spiral coil is coaxially arranged with the diamond matrix and embedded in the diamond matrix, and the spiral coil is recessed in the inner wall surface of the diamond matrix, so that the inner wall surface of the diamond matrix forms a screw groove at the position of the spiral coil.

7. The diamond bead according to claim 6, characterized in that: The diamond matrix is ​​also extended from both ends of the spiral coil.

8. The diamond bead according to claim 6, characterized in that: The spiral coil is equal in length to the diamond matrix and is embedded in the diamond matrix.

9. The diamond bead according to claim 6, characterized in that: The spiral coil is a spring or a non-deformable hard spiral coil.

10. A diamond wire saw, comprising a wire rope, a plurality of beads strung on the wire rope, and a coating layer disposed on the outer surface of the wire rope to fix the beads; characterized in that: The beads are the diamond beads described in any one of claims 6 to 9.

Citation Information

Patent Citations

  • Spring-built-in-string bead type diamond rope saw and manufacturing method

    CN103144202A

  • Novel diamond string beads and diamond string bead wire utilizing same

    CN204309132U

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    CN211030709U

  • Diamond string bead and diamond wire saw

    CN214602292U