A crystal rod and wafer positioning device based on laser marking machine

Abstract

The invention provides a crystal rod and wafer positioning device based on a laser marking machine, including a base plate, a weighing component, an adjusting component, a clamping component, a marking component, and a positioning component. The weighing component is mounted on the base plate, the adjusting component is mounted on the weighing component, the clamping component includes two clamping units, both clamping units are mounted on the adjusting component, the marking component is mounted on the base plate, the positioning component is mounted on the base plate, the positioning component is arranged between the marking component and the adjusting component, and the marking component includes a laser head, and the output end of the laser head is arranged toward the clamping component. The invention solves the problem that the existing technology of laser marking of crystal rods, wafers, and wafer baskets is time-consuming and labor-intensive, and inefficient when aligning the laser head with the crystal rod and wafer.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor technology, and in particular relates to a crystal rod and wafer positioning device based on a laser marking machine. Background Art

[0002] In the field of semiconductor processing, crystal rods, wafers and baskets are manually placed under the laser marking head for marking. It is time-consuming and laborious, and the work efficiency is low. Therefore, in order to mark crystal rods, wafers and baskets quickly and efficiently, it is necessary to design a semi-automatic positioning device for marking. In the prior art, the method of positioning crystal rods, wafers and baskets generally includes the following steps: manually placing the crystal rods, wafers and baskets under the laser head, and manually moving the laser head to align and mark. The existing technology of laser marking of crystal rods, wafers and baskets is time-consuming and laborious when aligning the laser head with the crystal rods and wafers (focal length), and the efficiency is low. Summary of the invention

[0003] In view of this, the present invention proposes a crystal rod and wafer positioning device based on a laser marking machine to solve the problem of time-consuming, labor-intensive and inefficient alignment of the laser head with the crystal rod and wafer in the existing crystal rod, wafer and wafer basket laser marking technology.

[0004] To achieve the above object, the technical solution created by the present invention is implemented as follows:

[0005] A crystal rod and wafer positioning device based on a laser marking machine includes a base plate, a weighing component, an adjusting component, a clamping component, a marking component, and a positioning component. The weighing component is mounted on the base plate, the adjusting component is mounted on the weighing component, the clamping component includes two clamping units, both clamping units are mounted on the adjusting component, the marking component is mounted on the base plate, the positioning component is mounted on the base plate, the positioning component is arranged between the marking component and the adjusting component, and the marking component includes a laser head, and the output end of the laser head is arranged toward the clamping component.

[0006] Furthermore, the weighing assembly includes a weighing instrument body, the weighing instrument body is mounted on a bottom plate, a mounting plate is fixed on the top of the weighing instrument body, and the adjusting assembly is mounted on the mounting plate.

[0007] Furthermore, the adjustment component includes a bidirectional screw, a bearing seat, and a slider. A bearing seat passes through both ends of the bidirectional screw, and the bearing seat is fixed on the mounting plate. There are two sliders, and both sliders have threaded holes corresponding to the bidirectional screw. The two sliders are arranged at both ends of the bidirectional screw and are threadedly connected to the bidirectional screw. A clamping unit is fixed on each slider.

[0008] Furthermore, linear guides are provided on both sides of the bidirectional lead screw, and the linear guides are installed on the mounting plate through mounting parts. A slider corresponding to the linear guide is fixed to the bottom of the clamping unit, and the slider is sleeved on the linear guide through a reserved through hole.

[0009] Furthermore, a handle is installed at one end of the bidirectional screw rod.

[0010] Furthermore, a film basket positioning base plate is provided on the bidirectional screw rod between the two clamping units, and mounting parts corresponding to the bidirectional screw rod and the linear guide rail are fixed to the bottom of the film basket positioning base plate, and the film basket positioning base plate is installed on the bidirectional screw rod and the linear guide rail through the mounting parts.

[0011] Furthermore, the clamping unit includes a sliding plate, a roller, and an inclined mounting strip. The sliding plate is fixed on the sliding block, the inclined mounting strip is fixed on the sliding plate, the inclined mounting strips on the two sliding plates are arranged opposite to each other, the inclined parts of the two inclined mounting strips are arranged back to back, there are multiple rollers, and the multiple rollers are all installed on the inclined parts of the inclined mounting strip through mounting shafts.

[0012] Furthermore, a pointer is installed on one side of one of the sliding plates away from the standard-reaching component, and a scale ruler that can align with the pointer is provided on the weighing component.

[0013] Furthermore, the marking assembly also includes a U-shaped part, an upper clamping block, a lower clamping block, and a vertical plate. There are two vertical plates, the bottoms of the two vertical plates are fixed to the base plate, a U-shaped part is fixed to the upper part of each vertical plate, the lower clamping block is arranged in the U-shaped part and is slidably connected to the U-shaped part, each lower clamping block is vertically opened with two strip through holes, the vertical plate is opened with strip through holes corresponding to the lower clamping block, and limiting bolts pass through the strip through holes of the vertical plate and the lower clamping block. The upper clamping block is arranged on the top of the lower clamping block, and the upper clamping block and the lower clamping block are opened with grooves corresponding to the laser head. Threaded holes are opened at both ends of the upper clamping block and the lower clamping block. The screws pass through the upper clamping block through the threaded holes, extend into the threaded holes of the lower clamping block, and are threadedly connected to the upper clamping block and the lower clamping block, and the laser head is installed between the upper clamping block and the lower clamping block.

[0014] Furthermore, the positioning assembly includes a mounting frame, a cover plate, and a fastening screw. A guide rod is fixed to the side of the mounting frame away from the adjustment assembly. A through hole corresponding to the guide rod is opened on the cover plate. The guide rod passes through the through hole and is slidably connected to the cover plate. The end of the fastening screw is rotatably connected to the mounting frame through a bearing. A threaded hole corresponding to the fastening screw is opened on the cover plate. The fastening screw passes through the threaded hole and is threadedly connected to the cover plate. A groove for placing a chip is opened on the side of the mounting frame close to the cover plate.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] (1) The invention proposes a crystal rod and wafer positioning device based on a laser marking machine, which effectively avoids the problem of inaccurate manual marking position through an adjustment component, a clamping component, and a positioning component, thereby saving time and labor and improving work efficiency.

[0017] (2) The pointer makes it easy to intuitively understand the distance between the two clamping units and to adjust the clamping components.

[0018] (3) The height of the laser head can be adjusted by adjusting the relative position of the upper clamping block and the U-shaped piece.

[0019] (4) The roller can tighten the crystal rod without causing wear to the crystal rod, and the sheet basket positioning plate can position the sheet basket, which is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings constituting part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0021] Figure 1 A schematic diagram of the installation of a crystal rod and wafer positioning device based on a laser marking machine according to an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of a crystal rod and wafer positioning device based on a laser marking machine according to an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of a marking assembly according to an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of a positioning assembly according to an embodiment of the present invention;

[0025] Figure 5 Schematic diagram of the wafer basket, wafer and crystal rod described in the embodiment of the present invention.

[0026] Description of reference numerals:

[0027] 5. Crystal rod; 6. Crystal wafer; 7, 8. Weighing instrument body; 9. Mounting plate; 10. Cam follower; 11. Sliding plate; 111. Inclined mounting strip; 12. Sheet basket positioning base plate; 13. Handle 1; 14. Locking bolt; 15. Bearing seat; 16. Bidirectional lead screw; 17. Sliding block; 18. Mounting piece; 19. Linear guide; 20. Pointer; 21. Scale scale; 22. Base plate; 23. Mounting frame; 24. Cover plate; 25. Fastening screw; 26. Vertical plate; 27. U-shaped piece; 28. Lower clamping block; 29. ​​Upper clamping block; 30. Sheet basket; 31. Crystal wafer; 32. Crystal rod; 33. Strip through hole. DETAILED DESCRIPTION

[0028] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0030] In the description of the invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention can be understood according to specific circumstances.

[0031] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0032] like Figure 1 , Figure 2 As shown, a crystal rod 5 and wafer positioning device based on a laser marking machine includes a base plate 22, a weighing component, an adjusting component, a clamping component, a marking component, and a positioning component. The weighing component is mounted on the base plate 22, the adjusting component is mounted on the weighing component, the clamping component includes two clamping units, and the two clamping units are both mounted on the adjusting component. The marking component is mounted on the base plate 22, the positioning component is mounted on the base plate 22, and the positioning component is arranged between the marking component and the adjusting component. The marking component includes a laser head, and the output end of the laser head is arranged toward the clamping component.

[0033] like Figure 1 , Figure 2As shown, the weighing assembly includes a weighing instrument body 8, which is mounted on a base plate 22, a mounting plate is fixed on the top of the weighing instrument body 8, and the adjusting assembly is mounted on the mounting plate.

[0034] like Figure 1 , Figure 2 As shown, the adjustment assembly includes a bidirectional screw 16, a bearing seat 15, and a slider 17. A bearing seat 15 passes through both ends of the bidirectional screw. The bearing seat 15 is fixed on the mounting plate. There are two sliders 17. Both sliders 17 are provided with threaded holes corresponding to the bidirectional screw. The two sliders 17 are arranged at both ends of the bidirectional screw and are threadedly connected to the bidirectional screw. A clamping unit is fixed on each slider 17.

[0035] like Figure 1 , Figure 2 As shown, linear guides 19 are provided on both sides of the bidirectional lead screw, and the linear guides 19 are installed on the mounting plate through mounting members 18. A slider 17 corresponding to the linear guide 19 is fixed to the bottom of the clamping unit, and the slider 17 is sleeved on the linear guide 19 through a reserved through hole.

[0036] like Figure 1 , Figure 2 As shown, a handle is also installed at one end of the bidirectional screw.

[0037] like Figure 1 , Figure 2 As shown, a film basket positioning base plate 12 is also provided on the bidirectional screw rod between the two clamping units, and a mounting piece 18 corresponding to the bidirectional screw rod and the linear guide rail 19 is fixed to the bottom of the film basket positioning base plate 12. The film basket positioning base plate 12 is installed on the bidirectional screw rod and the linear guide rail 19 through the mounting piece 18.

[0038] like Figure 1 , Figure 2 As shown, the clamping unit includes a sliding plate 11, a roller, and an inclined mounting strip 111. The sliding plate 11 is fixed on the slider 17, and the inclined mounting strip 111 is fixed on the sliding plate 11. The inclined mounting strips 111 on the two sliding plates 11 are arranged opposite to each other, and the inclined portions of the two inclined mounting strips 111 are arranged back to back. There are multiple rollers, and the multiple rollers are all installed on the inclined portions of the inclined mounting strips 111 through mounting shafts.

[0039] like Figure 2 As shown, a pointer 20 is also installed on one side of the sliding plate 11 away from the standard component, and the weighing component is provided with a scale 21 that can be aligned with the pointer 20. The pointer 20 facilitates intuitive understanding of the distance between the two holding units and facilitates adjustment of the holding component.

[0040] like Figure 3As shown, the marking assembly also includes a U-shaped piece, an upper clamping block, a lower clamping block, and a vertical plate. There are two vertical plates, and the bottoms of the two vertical plates are fixed on the bottom plate 22. A U-shaped piece is fixed on the upper part of each vertical plate. The lower clamping block is arranged in the U-shaped piece and is slidably connected to the U-shaped piece. Two strip through holes are vertically opened on each lower clamping block. The vertical plate is provided with a strip through hole corresponding to the lower clamping block. The strip through holes of the vertical plate and the lower clamping block are penetrated by limited bolts. The upper clamping block is arranged on the top of the lower clamping block. The upper clamping block and the lower clamping block are provided with grooves corresponding to the laser head. The upper clamping block and the lower clamping block are provided with threaded holes at both ends. The screws pass through the upper clamping block through the threaded holes and extend into the threaded holes of the lower clamping block, and are threadedly connected with the upper clamping block and the lower clamping block. The laser head is installed between the upper clamping block and the lower clamping block. By adjusting the relative position of the upper clamping block and the U-shaped piece, the height of the laser head can be adjusted.

[0041] like Figure 4 As shown, the positioning assembly includes a mounting frame 23, a cover plate 24, and a fastening screw. A guide rod is fixed to the side of the mounting frame 23 away from the adjustment assembly. A through hole corresponding to the guide rod is opened on the cover plate 24. The guide rod passes through the through hole and is slidably connected to the cover plate 24. The end of the fastening screw is rotatably connected to the mounting frame 23 through a bearing. A threaded hole corresponding to the fastening screw is opened on the cover plate 24. The fastening screw passes through the threaded hole and is threadedly connected to the cover plate 24. A groove for placing a wafer is opened on the side of the mounting frame 23 close to the cover plate 24.

[0042] A laser marking machine-based crystal rod 5 and wafer positioning device operation includes the following steps:

[0043] Step 1: Turn the handle to rotate the bidirectional screw rod, move the two rows of rollers to the specified position, put in the crystal rod 5, push it until it contacts the stopper, and laser mark the crystal rod 5 (it is compatible with crystal rods 5 of different sizes).

[0044] Step 2: Manually move the two rows of rollers in opposite directions, clamp the film basket positioning plate onto the guide rail, and then put the film basket in for laser marking.

[0045] Step 3: Rotate the fastening screw to place the wafer in the groove of the positioning assembly, and then loosen the spring clamp to position the wafer.

[0046] The roller can tighten the crystal rod 5 without causing wear to the crystal rod 5, and the sheet basket positioning plate can position the sheet basket, which is highly practical.

[0047] The beneficial effect of the invention is that the crystal rod 5, wafer, and sheet basket positioning device and method based on laser marking can realize the positioning and marking of crystal rods 5, wafers, and sheet baskets of various sizes, effectively avoiding the problem of inaccurate manual marking position, saving time and labor, and improving work efficiency.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A crystal rod and wafer positioning device based on a laser marking machine, characterized in that: The device comprises a base plate (22), a weighing component, an adjusting component, a clamping component, a marking component, and a positioning component, wherein the weighing component is mounted on the base plate (22), the adjusting component is mounted on the weighing component, the clamping component comprises two clamping units, both of which are mounted on the adjusting component, the marking component is mounted on the base plate (22), the positioning component is mounted on the base plate (22), the positioning component is arranged between the marking component and the adjusting component, and the marking component comprises a laser head, wherein the output end of the laser head is arranged toward the clamping component; The marking assembly also includes a U-shaped piece, an upper clamping block, a lower clamping block, and a vertical plate. There are two vertical plates, and the bottoms of the two vertical plates are fixed to the bottom plate (22). A U-shaped piece is fixed to the upper part of each vertical plate. The lower clamping block is arranged in the U-shaped piece and is slidably connected to the U-shaped piece. Each lower clamping block is vertically opened with two strip through holes. The vertical plate is also opened with a strip through hole, and the strip through holes correspond to the strip through holes on the lower clamping block. Limiting bolts pass through the strip through holes of the vertical plate and the lower clamping block. The upper clamping block is arranged at the top of the lower clamping block. The upper clamping block and the lower clamping block are both opened with grooves corresponding to the laser head. Both ends of the upper clamping block and the lower clamping block are opened with threaded holes. The screws pass through the upper clamping block through the threaded holes and extend into the threaded holes of the lower clamping block to be threadedly connected with the upper clamping block and the lower clamping block. The laser head is installed between the upper clamping block and the lower clamping block. The positioning assembly comprises a mounting frame (23), a cover plate (24), and a fastening screw. A guide rod is fixed to a side of the mounting frame (23) away from the adjustment assembly. A through hole corresponding to the guide rod is opened on the cover plate (24). The guide rod passes through the through hole and is slidably connected to the cover plate (24). An end of the fastening screw is rotatably connected to the mounting frame (23) through a bearing. A threaded hole corresponding to the fastening screw is opened on the cover plate (24). The fastening screw passes through the threaded hole and is threadedly connected to the cover plate (24). A groove for placing a wafer is opened on a side of the mounting frame (23) close to the cover plate (24).

2. The crystal rod and wafer positioning device based on a laser marking machine according to claim 1, characterized in that: The weighing assembly comprises a weighing instrument body (8), the weighing instrument body (8) is mounted on a bottom plate (22), a mounting plate is fixed on the top of the weighing instrument body (8), and the adjusting assembly is mounted on the mounting plate.

3. The crystal rod and wafer positioning device based on a laser marking machine according to claim 2, characterized in that: The adjustment component comprises a bidirectional screw (16), a bearing seat (15), and a first slider. Both ends of the bidirectional screw are penetrated by a bearing seat (15), and the bearing seat (15) is fixed on a mounting plate. There are two first sliders, and both first sliders are provided with threaded holes corresponding to the bidirectional screw. The two first sliders are arranged at both ends of the bidirectional screw and are both threadedly connected to the bidirectional screw. A clamping unit is fixed on each first slider.

4. The crystal rod and wafer positioning device based on a laser marking machine according to claim 3, characterized in that: Linear guide rails (19) are also provided on both sides of the bidirectional screw rod. The linear guide rails (19) are installed on the mounting plate through a first mounting member. A second sliding block corresponding to the linear guide rail (19) is fixed at the bottom of the clamping unit. The second sliding block is sleeved on the linear guide rail (19) through a reserved through hole.

5. The crystal rod and wafer positioning device based on a laser marking machine according to claim 3, characterized in that: A handle is also installed at one end of the bidirectional screw rod.

6. The crystal rod and wafer positioning device based on a laser marking machine according to claim 4, characterized in that: A film basket positioning base plate (12) is also provided on the bidirectional screw rod between the two clamping units. A second mounting member corresponding to the bidirectional screw rod and the linear guide rail (19) is fixed to the bottom of the film basket positioning base plate (12). The film basket positioning base plate (12) is mounted on the bidirectional screw rod and the linear guide rail (19) via the second mounting member.

7. The crystal rod and wafer positioning device based on a laser marking machine according to claim 4, characterized in that: The clamping unit comprises a sliding plate (11), a roller, and an inclined mounting strip (111); the sliding plate (11) is fixed on a first sliding block and a second sliding block; the inclined mounting strip (111) is fixed on the sliding plate (11); the inclined mounting strips (111) on the two sliding plates (11) are arranged opposite to each other; the inclined portions of the two inclined mounting strips (111) are arranged opposite to each other; there are a plurality of rollers, and the plurality of rollers are all mounted on the inclined portions of the inclined mounting strips (111) via mounting shafts.

8. The crystal rod and wafer positioning device based on a laser marking machine according to claim 7, characterized in that: A pointer (20) is also installed on one side of the sliding plates (11) away from the marking component, and a scale (21) corresponding to the pointer (20) is provided on the weighing component.

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