Epitaxial film growth device and separation method
By setting up a separation pin device in the epitaxial membrane growth equipment, the metal clamp ring and quartz parts are separated by the reverse force of the connector, the risk of damage to the quartz parts during the equipment maintenance process is solved, safe separation is achieved and the metal substrate is protected.
Patent Information
- Application Number
- CN202110362396.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-04-02
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2041-04-02
AI Technical Summary
During the maintenance of epitaxial membrane growth equipment, quartz parts are easily damaged when manually loosening the metal clamp ring, and it is difficult to easily separate metal heavy objects from quartz parts in the prior art, resulting in a high risk of damage to quartz parts.
Design an epitaxial film growth device, by providing a separation pin device between the metal clamp ring and the metal substrate, a threaded connecting member penetrates the metal clamp ring, and abuts on the surface of the metal substrate at the top of the connecting member, using a reverse direction Force-separate the metal clamp ring from the quartz piece to ensure the safety of the separation process.
The easy separation of the metal clamp ring and the quartz part is achieved, reducing the risk of damage to the quartz part, and preventing the separation pin from wear on the metal substrate by applying the polytetrafluoroethylene protective layer, ensuring the integrity of the equipment.
Smart Images
Figure CN112967958B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip manufacturing, and in particular to an epitaxial film growth device and a separation method. Background Art
[0002] At present, chip manufacturing technology is developing rapidly. Among them, epitaxial growth technology was developed in the late 1950s and early 1960s. In order to manufacture high-frequency and high-power devices, it is necessary to reduce the collector series resistance, and the material is required to withstand high voltage and high current. Therefore, it is necessary to grow a thin high-resistance epitaxial layer on a low-resistance substrate. At this time, epitaxial equipment came into being. When maintaining or repairing the epitaxial machine, it is inevitable to open more than 30 kilograms of metal rings or metal disks. These heavy metal objects are connected to the quartz parts through the upper sealing ring, and the quartz parts are connected to the metal substrate through the lower sealing ring. The distance between the metal ring or metal disk and the metal substrate is less than 1mm. There are 8 screws on the metal ring or metal disk to connect the metal ring and the metal substrate, or the metal disk and the metal substrate.
[0003] After loosening the 8 screws, if you manually open the metal ring or metal disk, if you don't control the force well, it will hit the quartz disk below and cause damage to the quartz parts.
[0004] Therefore, designing an epitaxial film growth device that can relatively easily separate heavy metal objects from quartz parts is a problem that needs to be solved urgently. Summary of the invention
[0005] The purpose of the present invention is to provide an epitaxial film growth device and a separation method. A separation pin device is arranged between a metal clamp ring and a metal substrate of the epitaxial film growth device. The separation pin includes at least two connecting parts with screws. The connecting parts pass through the metal clamp ring. The top of the connecting parts abuts against the surface of the metal substrate. The metal clamp ring and the quartz part are separated by the reverse force of the separation pin. After the metal clamp ring and the quartz part are separated, the metal clamp ring is moved to achieve safe separation of the metal clamp ring and the quartz part, thereby reducing the probability of damaging the quartz part.
[0006] In the first aspect, the above-mentioned invention object of the present invention is achieved through the following technical solutions:
[0007] An epitaxial film growth device comprises a metal clamping ring, an upper quartz disc, and a metal substrate which are sequentially placed from top to bottom. Sealing devices are respectively arranged on the upper surface and the lower surface of the edge of the upper quartz disc, which are used to seal between the upper quartz disc and the upper metal clamping ring or the metal substrate. The device also comprises a separation pin device which is arranged on the upper metal clamping ring and is used to separate the upper metal clamping ring as a whole from the upper quartz disc as a whole.
[0008] The present invention is further configured as follows: the separation pin device includes a connecting piece with a thread, the connecting piece is provided with a thread, a through hole with a threaded inner wall is provided on the upper metal clamp ring, the thread in the through hole matches the thread on the connecting piece, the through hole is located on the outer side of the upper quartz disk, the top end of the connecting piece passes through the through hole and abuts against the upper surface of the metal substrate, and is used to drive the metal clamp ring to move up and down when the connecting piece rotates.
[0009] The present invention is further configured as follows: at least two through holes are evenly arranged on the upper metal clamp ring, a separation pin device is respectively arranged at each through hole, and a separation pin device is arranged in each through hole.
[0010] The present invention is further configured as follows: a through hole is respectively arranged at two ends of the same diameter of the upper metal clamp ring, and a separation pin device is arranged in each through hole.
[0011] The present invention is further configured as follows: a through hole is respectively arranged at both ends of each of the two mutually perpendicular diameters of the upper metal clamp ring, and a separation pin device is arranged in each through hole.
[0012] The present invention is further configured as follows: a tough outer coat is provided on the top surface of the connector or on the entire surface of the connector to prevent the connector from abrading the surface of the metal substrate.
[0013] The present invention is further configured as follows: the tough outer coating material is polytetrafluoroethylene, which is disposed on the surface of the top portion of the connector or the entire surface of the connector in a coating manner.
[0014] The present invention is further configured such that the connecting piece adopts a flat head screw.
[0015] In a second aspect, the above-mentioned object of the present invention is achieved through the following technical solutions:
[0016] A separation method for epitaxial film growth equipment comprises the following steps: firstly, a first connecting piece and a second connecting piece located on the same diameter of a metal clamp ring are rotated in the same direction and at the same angle respectively; then, a third connecting piece and a fourth connecting piece located on another diameter perpendicular to the previous diameter are selected and rotated in the same direction and at the same angle respectively; and each connecting piece is rotated repeatedly until the metal clamp ring is separated as a whole from an upper quartz disc as a whole.
[0017] Compared with the prior art, the beneficial technical effects of this application are:
[0018] 1. The present application provides a separation pin on the metal clamp ring, which penetrates the metal clamp ring and abuts against the surface of the metal substrate. The metal clamp ring and the quartz part are separated by the reverse force when the separation pin rotates, thereby achieving easy separation of the metal clamp ring and the quartz part and ensuring the integrity of the quartz part during the separation process.
[0019] 2. Furthermore, the present application applies a protective layer on the surface of the separation pin to prevent the separation pin from wearing the surface of the metal substrate, thereby ensuring the integrity of the metal substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 is a cross-sectional view of an epitaxial film growth device according to a specific embodiment of the present application;
[0021] Figure 2 is a top view of an epitaxial film growth device according to a specific embodiment of the present application;
[0022] Figure 3 It is a partial cross-sectional view of an epitaxial film growth device according to a specific embodiment of the present application. DETAILED DESCRIPTION
[0023] The present invention is further described in detail below in conjunction with the accompanying drawings.
[0024] Existing epitaxial film growth equipment structure, such as Figure 1 As shown, it includes an upper lamp frame 15, an upper metal clamp ring 2, a metal base plate 1, a lower metal clamp ring 13, and a lower lamp frame 17 which are arranged in sequence from top to bottom. The upper lamp frame 15 is a cubic groove structure opening downward, and the lower lamp frame 17 is a cubic groove structure opening upward. The upper metal clamp ring 2, the metal base plate 1, and the lower metal clamp ring 13 are square ring structures respectively. The upper metal clamp ring 2, the metal base plate 1, and the lower metal clamp ring 13 are arranged in sequence at the openings of the upper lamp frame 15 and the lower lamp frame 17 to form a cavity.
[0025] An upper quartz disc 4, a base 12, a base bracket 10, and a lower quartz bell jar 11 are arranged in the cavity. The upper quartz disc 4 and the lower quartz bell jar 11 form a sealed cavity. The base 12 and the base bracket 10 are arranged in the sealed cavity, and the base 12 is arranged on the base bracket 10; the upper surface of the base 12 is a platform structure, and the disc edge of the upper quartz disc 4 is close to the upper surface of the metal substrate 1. The rotating motor 9 is located outside the cavity formed by the upper lamp holder 15 and the lower lamp holder 17, and the shaft of the rotating motor 9 is connected to the base bracket 10.
[0026] An upper lamp tube module 14 is disposed on an inner side wall of the upper lamp frame 15 , and a lower lamp tube module 16 is disposed on an inner side wall of the lower lamp frame 17 .
[0027] A rotating motor module is also provided outside the bottom of the lower lamp frame 17, and the motor shaft is connected to the base bracket to control the base 12 to rotate around the central axis.
[0028] The upper quartz disk 4 is an arc structure, and a plane circular ring edge 4-1 is arranged at the edge of the arc. The circular ring edge 4-1 is located between the upper metal clamp ring 2 and the metal substrate 1. An upper sealing ring is arranged between the upper surface of the circular ring edge 4-1 and the lower surface of the upper metal clamp ring 2, and a lower sealing ring is arranged between the lower surface of the circular ring edge 4-1 and the upper surface of the metal substrate 1, which is not shown in the figure.
[0029] The distance between the upper metal clamp ring 2 and the metal substrate 1 is less than 1 mm. The weight of the upper metal clamp ring 2 is about 30 kilograms. During operation, it is sometimes necessary to separate the upper metal clamp ring 2 from the upper quartz disc 4 and remove the upper metal clamp ring.
[0030] In the present application, a separation pin device 18 is arranged on the upper metal clamp ring 2, and a threaded hole is arranged on the upper metal clamp ring 2. One end of the separation pin device 18 passes through the threaded hole and abuts against the upper surface of the metal substrate 1, and the other end is located at or lower than or higher than the upper surface of the upper metal clamp ring 2. The surface of the separation pin device 18 in contact with the threaded hole is provided with a thread matching therewith. Rotating the separation pin device 18 can shorten or increase the distance between the upper metal clamp ring 2 and the metal substrate 1, thereby realizing the compression or separation of the upper metal clamp ring 2 and the metal substrate 1.
[0031] Combination Figure 2 , 3 As shown, Figure 2 Top view of the epitaxial film growth equipment. Figure 3 For along Figure 2 In the cross-sectional view of the middle AA line, the metal substrate 1 is a square frame structure, the upper metal clamp ring 2 is arranged on the metal substrate 1, the upper metal clamp ring 2 includes a circular ring 21 and a circular ring epitaxial block, and four circular ring epitaxial blocks are arranged at the two ends of the two mutually perpendicular diameters AA and BB of the circular ring 21, wherein the first circular ring epitaxial block 3-1 and the second circular ring epitaxial block 3-2 are respectively located at the two ends of the circular ring diameter AA, and the circular ring epitaxial block 3-3 and the fourth circular ring epitaxial block 3-4 are respectively located at the two ends of the circular ring diameter BB. The first to fourth circular ring epitaxial blocks are an integral structure with the circular ring. The four circular ring epitaxial blocks are symmetrical along the diameter and are located on the outside of the upper quartz disc 4.
[0032] On each annular epitaxial block, two fixing devices symmetrical along the diameter are respectively provided for fixing the upper metal clamp ring 2 to the metal substrate 1. Specifically, a first fixing device 31 and a second fixing device 32 are provided on the first epitaxial block 3-1. In the counterclockwise direction, a third fixing device 33 and a fourth fixing device 34 are provided on the third epitaxial block 3-3, a fifth fixing device 35 and a sixth fixing device 36 are provided on the second epitaxial block 3-2, and a seventh fixing device 37 and an eighth fixing device 38 are provided on the fourth epitaxial block 3-4. The positions of the fixing devices are respectively: the first fixing device 31 is located at the first end of the first diameter of the ring 21, and the fifth fixing device 35 is located at the second end of the first diameter of the ring 21; the second fixing device 32 is located at the first end of the second diameter of the ring 21, and the sixth fixing device 36 is located at the second end of the second diameter of the ring 21; the third fixing device 33 is located at the first end of the third diameter of the ring 21, and the seventh fixing device 37 is located at the second end of the third diameter of the ring 21; the fourth fixing device 34 is located at the first end of the fourth diameter of the ring 21, and the eighth fixing device 38 is located at the second end of the fourth diameter of the ring 21; in this way, the first and third diameters are perpendicular to each other, the second and fourth diameters are perpendicular to each other, and the angle between the first and second diameters is less than 45 degrees.
[0033] The fixing device is a fixing screw. When fixing the upper metal clamp ring 2 and the metal base plate 1, first fix one of the fixing screws, such as the first fixing device 31, and then fix the fifth fixing device 35 on the first diameter; then select the third fixing screw 33 on the third diameter perpendicular to the first diameter for fixing, and in the fourth step fix the seventh fixing device 37 on the third diameter; similarly, fix them in the order of the second fixing device 32, the sixth fixing device 36, the fourth fixing device 34, and the eighth fixing device 38, so as to achieve the purpose of evenly fixing the upper metal clamp ring 2.
[0034] Loosen the upper metal clamp ring 2 and the metal base plate 1 in the same order as when fixing them. In short, first loosen the two fixing screws at both ends of a certain diameter, and then select another diameter perpendicular to the previous diameter and loosen the fixing screws at both ends; loosen all the fixing screws in the same order to evenly loosen the upper metal clamp ring 2 and the metal base plate 1.
[0035] Handles are provided on the first epitaxial block 3 - 1 and the second epitaxial block 3 - 2 which are located at the same diameter. A handle 311 is provided on the annular first epitaxial block 3 - 1 and a handle 321 is provided on the annular second epitaxial block 3 - 2 for lifting the upper metal clamp ring 2 .
[0036] An upper sealing ring 41 is provided between the upper metal clamp ring 2 and the upper surface of the upper quartz disc 4 , and a lower sealing ring 42 is provided between the lower surface of the upper quartz disc 4 and the upper surface of the metal substrate 1 . The upper metal clamp ring 2 is used to clamp the upper quartz disc 4 .
[0037] An epitaxial film growth device of the present application is provided with a separation pin device 18 on the basis of the existing epitaxial film growth device. The separation pin device 18 is a threaded connector, which is arranged between the upper metal clamp ring 2 and the metal substrate 1. A through hole from the upper surface to the lower surface of the upper metal clamp ring 2 is arranged at the epitaxial block of the upper metal clamp ring 2. The inner wall of the through hole is threaded. The thread in the through hole matches the thread on the connector. The threaded connector passes through the through hole, and the top of the connector abuts against the upper surface of the metal substrate 1. Rotating the connector can make the upper metal clamp ring 2 move up and down along the thread of the connector. When the upper metal clamp ring 2 moves upward along the connector, the upper metal clamp ring is separated from the upper quartz disc 4.
[0038] Specifically, in a specific embodiment of the present application, through holes are only set on two epitaxial blocks of one diameter, such as a through hole is set at each end of the diameter of the ring AA, which are the fifth through hole 5 and the sixth through hole 6, or a through hole is set at each end of the diameter of the ring BB, which are the seventh through hole 7 and the eighth through hole 8, and a separation pin device is set at the through hole, and the separation pin position is located on the center line of the epitaxial block and on the outer side of the upper quartz disk 4.
[0039] In the process of separating the upper metal clamp ring 2 from the upper quartz disc 4, first rotate the separation pin located at the fifth through hole 5 by a certain angle, and then rotate the separation pin located at the sixth through hole 6 in the same direction by the same angle, and repeat this process until the upper metal clamp ring 2 is separated from the upper quartz disc 4, and then remove the upper metal clamp ring 2.
[0040] The rotation angle can be half a circle, a circle, or any other angle.
[0041] In a specific embodiment of the present application, separation pin devices are respectively provided at the two ends of the diameter of each epitaxial block, at the fifth through hole 5, the sixth through hole 6, the seventh through hole 7, and the eighth through hole 8. The separation pins have the same structure.
[0042] The separation pin device includes a connecting piece with a thread. After the connecting piece passes through the through hole, one end of the connecting piece abuts against the upper surface of the metal substrate, and the other end is located on the upper surface of the upper metal clamp ring, or is lower than, higher than or parallel to the upper surface of the upper metal clamp ring.
[0043] In the process of separating the upper metal clamp ring 2 from the upper quartz disc 4, first rotate the separation pin at the fifth through hole 5 by a certain angle, then rotate the separation pin at the sixth through hole 6 by the same angle in the same direction, rotate the separation pin at the seventh through hole 7 by the same angle in the same direction, and finally rotate the separation pin at the eighth through hole 8 by the same angle, and repeat the above process until the upper metal clamp ring 2 is separated from the quartz disc 4.
[0044] In a specific embodiment of the present application, the connectors are evenly distributed on the circular ring 21 of the upper metal clamp ring, located outside the upper quartz disk 4, and abut against the upper surface of the metal substrate 1 through the through holes from the upper surface of the upper metal clamp ring 2.
[0045] Specifically, the connecting piece adopts a flat head screw, and the flat structure of the top end of the flat head screw can prevent the connecting piece from wearing the upper surface of the metal substrate.
[0046] In order to further reduce the wear of the connecting piece on the upper surface of the metal substrate, a tough outer coating 18-1 is coated on the entire surface or the top surface of the screw.
[0047] Specifically, the tough outer coating material is polytetrafluoroethylene.
[0048] The embodiments of this specific implementation method are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.
Claims
1. An epitaxial film growth device, comprising an upper metal clamping ring, an upper quartz disc, and a metal substrate, which are sequentially arranged from top to bottom, an upper sealing ring is arranged between the edge of the upper quartz disc and the upper metal clamping ring, and a lower sealing ring is arranged between the edge of the upper quartz disc and the metal substrate, for sealing between the upper quartz disc and the upper metal clamping ring or the metal substrate, characterized in that: It also includes a separation pin device, which is arranged on the upper metal clamp ring and is used to separate the upper metal clamp ring as a whole from the upper quartz disc as a whole; the separation pin device includes a connector with threads, the surface of the connector is provided with threads, a through hole with a threaded inner wall is provided on the upper metal clamp ring, the threads in the through hole match the threads on the connector, the through hole is located on the outer side of the upper quartz disc, the top of the connector passes through the through hole and abuts against the upper surface of the metal substrate, and is used to drive the upper metal clamp ring to move up and down when the connector rotates; at least two through holes are evenly arranged on the upper metal clamp ring, and a separation pin device is respectively arranged at each through hole; a through hole is respectively arranged at both ends of the same diameter of the upper metal clamp ring, and a separation pin device is arranged in each through hole; a through hole is respectively arranged at both ends of each diameter of two mutually perpendicular diameters of the upper metal clamp ring, and a separation pin device is arranged in each through hole; the upper quartz disc is an arc structure, and a plane circular ring edge is arranged at the edge of the arc.
2. The epitaxial film growth device according to claim 1, characterized in that: A tough outer coat is provided on the surface of the top portion of the connector or on the surface of the connector to prevent the connector from abrading the surface of the metal substrate.
3. The epitaxial film growth device according to claim 2, characterized in that: The material of the tough outer coat is polytetrafluoroethylene, which is arranged on the surface of the top part of the connector or on the surface of the connector in a coating manner.
4. The epitaxial film growth device according to claim 1, characterized in that: The connections are made with flat head screws.
5. A method for separating an epitaxial film growth device, characterized in that: Applicable to the epitaxial film growth equipment described in any one of claims 1 to 4, first, the first connecting member and the second connecting member located on the same diameter of the upper metal clamp ring are rotated in the same direction by the same angle; then the third connecting member and the fourth connecting member on another diameter perpendicular to the previous diameter are selected and rotated in the same direction by the same angle, and the rotation of each connecting member is repeated until the upper metal clamp ring is separated from the upper quartz disk as a whole.