X-band highly integrated two-dimensional phased array radar RF front end

Abstract

The present invention belongs to the technical field of phased array radar, and relates to a high-integration two-dimensional phased array radar radio frequency front end in the X band. The device includes an antenna cover, an active phased array subarray using a silicon-based TR chip, a heat dissipation shell, a power division synthesis network, a wave control power board, a sum-difference network, a frequency synthesizer receiver and a data acquisition board; the heat dissipation shell serves as a main support, and a plurality of active phased array subarrays are installed on the heat dissipation shell, and the heat generated by the active phased array subarrays is conducted to the heat dissipation shell, and the heat is conducted to both sides of the heat dissipation shell through the heat pipe on the back of the heat dissipation shell; the sum-difference network and the wave control power board are arranged in the same plane, and the wave control power board and the sum-difference network are installed on the back of the heat dissipation shell, and the two share the back area. The present invention has the characteristics of low cost, high integration, modularization, strong heat dissipation capability, high reliability, and rapid maintenance capability.

Description

Technical Field

[0001] The invention belongs to the technical field of phased array radars and relates to a radio frequency front end of a highly integrated two-dimensional phased array radar in the X-band. Background Art

[0002] Phased array antennas are widely used in the radar field because of their beam agility and can quickly track and search for multiple targets. Currently, due to cost factors and TR size constraints, the application of two-dimensional phased arrays is much less than that of one-dimensional phased arrays.

[0003] On the one hand, the cost of TR components is relatively high, and the number of two-dimensional phased array channels has increased significantly. Each channel corresponds to one TR component, and too many TR components lead to excessively high costs for the two-dimensional phased array. On the other hand, traditional TR components are integrated using discrete devices and are larger in size, which significantly increases the volume and weight of the two-dimensional phased array. Summary of the invention

[0004] The purpose of the present invention is to provide an X-band highly integrated two-dimensional phased array radar RF front end with low cost, high integration, modularization, strong heat dissipation capability, high reliability and rapid maintenance capability in view of the shortcomings of the prior art.

[0005] In order to achieve the above purpose, the present invention proposes the following scheme:

[0006] An X-band highly integrated two-dimensional phased array radar radio frequency front end, characterized in that it includes: a radome, an active phased array sub-array, a heat dissipation housing, a power division and synthesis network, a wave control power supply board, a sum and difference network, a frequency synthesis receiver, a data acquisition board and a centrifugal fan;

[0007] The radome is located on a first plane;

[0008] The active phased array sub-array is located in the second plane;

[0009] The heat dissipation shell is located on the third plane, and the heat dissipation shell serves as a main support. A plurality of active phased array subarrays are mounted on the heat dissipation shell to conduct the heat generated by the active phased array subarrays to the heat dissipation shell, and the heat is conducted to both sides of the heat dissipation shell through the heat pipes on the back of the heat dissipation shell;

[0010] The power division and synthesis network is located on the fourth plane;

[0011] The wave-controlled power supply board is located on the fifth plane;

[0012] The sum-difference network is arranged in the same plane as the wave-controlled power supply board. The wave-controlled power supply board and the sum-difference network are installed on the back of the heat dissipation housing. The two share the back area. The sum-difference network is located in the center and is interconnected with the power division and synthesis network. The wave-controlled power supply board uses the area around the sum-difference network.

[0013] The frequency synthesis receiver and the data acquisition board are stacked and arranged in an external chassis as a whole, and the two are connected by electrical signals through a motherboard.

[0014] Furthermore, a centrifugal fan is arranged outside the heat dissipation housing.

[0015] Furthermore, the active phased array subarray includes an antenna subarray and a transceiver circuit board; wherein the antenna subarray is composed of M×N double-layer broadband microstrip patch radiating units; the transceiver circuit board and all the double-layer broadband microstrip patch radiating units are stacked, and a multi-layer hybrid board structure is used to integrate the corresponding M×N transceiver channels, control power distribution, and power division synthesis network, wherein multiple transceiver channels located in the same partition position are integrated into a plastic-encapsulated silicon-based TR chip on the transceiver circuit board to form a tile-type structure; a heat conduction path is arranged between the plastic-encapsulated silicon-based TR chip and the heat dissipation shell.

[0016] Furthermore, it also includes a rear cover plate for installing and fixing the chassis where the frequency synthesis receiver and the data acquisition board are located, and transferring the heat of the two to the heat dissipation teeth on the rear side of the rear cover plate, and forced air cooling through a centrifugal fan.

[0017] Furthermore, there are 36 active phased array sub-arrays arranged in a 6×6 array.

[0018] Furthermore, each of the active phased array sub-arrays includes 4×4 phased array antenna units and a transceiver channel.

[0019] Furthermore, there are 4 power division and synthesis networks in total, and each power division and synthesis network is connected to 3×3 active phased array sub-arrays.

[0020] Furthermore, there are 4 wave-controlled power boards in total, and each wave-controlled power board is connected to 3×3 active phased array sub-arrays.

[0021] Furthermore, the power division and synthesis network and the active phased array sub-array are interconnected via an SMP connector.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention has the characteristics of low cost and modularity. The present invention adopts a tile-type structure, antenna array surface and chip-type TR component subarray module design, and realizes the entire array design based on the standard subarray building block expansion design. The silicon-based chip has a low batch cost, which can effectively reduce the cost of the whole machine.

[0024] 2. The present invention has the characteristics of high integration. The present invention adopts a highly integrated silicon-based microwave TR chip, which can realize multi-channel TR with multiple functions such as low noise amplifier, amplifier, switch, phase shift attenuation, and drive. It has a high degree of integration and can be directly attached to the surface of the printed circuit board after plastic packaging. It is easy to integrate with the antenna radiation unit, and the size fully meets the requirements of the tile two-dimensional phased array antenna.

[0025] 3. The present invention has the characteristic of high reliability. The present invention adopts silicon-based chips to realize the X-band highly integrated two-dimensional phased array radar front end. This type of chip can realize multi-channel TR, which can reduce the number of chips used, simplify the chip peripheral circuits and interconnection processes, reduce the chip circuit area, improve the integration and comprehensive performance of TR components, reduce the space occupied by a single channel circuit of the TR component, and realize the high-density integration and low-cost design of X-band tile-type TR components, solving the problem of limited lateral space of tile-type phased array antennas. Each subarray module is independent of each other and can be debugged separately. If a fault occurs, any subarray can be easily disassembled for testing and maintenance, thereby improving the reliability of the equipment.

[0026] 4. The present invention has the characteristic of strong heat dissipation capability. The present invention has an overall design for heat dissipation capability. The active sub-array, frequency synthesizer receiver, wave control power board, data acquisition board, and sum-difference network can effectively conduct heat to the heat dissipation housing, and both sides and the rear end of the heat dissipation housing are provided with heat dissipation teeth and fans, which effectively form an airflow loop for heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0028] Figure 1 It is a three-dimensional schematic diagram of the radio frequency front end of the X-band highly integrated two-dimensional phased array radar of the present invention;

[0029] Figure 2 for Figure 1 Side view of

[0030] Figure 3 for Figure 1 A top view of the active sub-array and power division and synthesis network;

[0031] Figure 4 for Figure 1 Three-dimensional schematic diagram of the intermediate frequency integrated receiver;

[0032] Figure 5 for Figure 1A three-dimensional schematic diagram of the data acquisition board;

[0033] Figure 6 for Figure 1 Schematic diagram of the three-dimensional structure of the intermediate frequency integrated receiver and the data acquisition board;

[0034] The meanings of the reference numerals are as follows:

[0035] 1-radome; 2-active phased array sub-array; 3-heat dissipation shell; 4-power division and synthesis network; 5-wave control power supply board; 6-sum and difference network; 7-frequency synthesis receiver; 8-data acquisition board; 9-centrifugal fan; 10-heat dissipation gear; 11-multi-core connector. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] See also Figure 1-Figure 6 , an X-band highly integrated two-dimensional phased array radar radio frequency front end, comprising: a radome 1, an active phased array subarray 2, a heat dissipation housing 3, a power division and synthesis network 4, a wave control power supply board 5, a sum and difference network 6, a frequency synthesis receiver 7, a data acquisition board 8 and a centrifugal fan 9. The heat dissipation housing 3 serves as a main support, and the active phased array subarray 2 is installed on the heat dissipation housing 3, and the heat generated by the active phased array subarray 2 is conducted to the heat dissipation housing 3, and the heat is conducted to both sides of the housing through the heat pipe on the back of the housing, and cooled by the centrifugal fan 9.

[0038] The X-band highly integrated two-dimensional phased array radar RF front end in this embodiment includes 6×6 active phased array sub-arrays 2, each of which includes 4×4 antenna radiating units; and the X-band highly integrated two-dimensional phased array radar RF front end includes 4 power division and synthesis networks 4, each of which is connected to 3×3 active phased array sub-arrays 2, and the power division and synthesis network 4 is interconnected with the active phased array sub-arrays 2 through an SMP connector.

[0039] The X-band highly integrated two-dimensional phased array radar RF front end described in this embodiment includes four wave-controlled power supply boards 5, each of which is connected to 3×3 active phased array sub-arrays 2; the wave-controlled power supply board 5 is arranged in parallel with the sum-difference network 6 and is installed on the back of the heat dissipation housing 3, and the two share the back area, wherein the sum-difference network 6 is located in the central part and is interconnected with the four power division and synthesis networks 4, and the wave-controlled power supply board 5 uses the area around the sum-difference network 6 and is electrically connected to the active phased array sub-array 2 through the J30J multi-core connector 11; the frequency synthesis receiver 7 and the data acquisition board 8 are stacked in a chassis fixed on the rear cover, and the two are electrically connected through the motherboard, and the chassis for fixing the frequency synthesis receiver 7 and the data acquisition board 8 is installed on the rear cover, and the heat of the two is conducted to the heat dissipation teeth 10 on the rear side of the rear cover, and forced air cooling is performed by the centrifugal fan 9.

[0040] The X-band high-integration two-dimensional phased array radar RF front end in this embodiment receives the spatial electromagnetic wave signal through the array antenna, and amplifies the signal, phase compensates, and amplitude compensates through the receiving channel, and then RF synthesizes the multi-channel signal through the power-dividing synthesis single pulse network to form a sum beam, azimuth difference beam, and elevation difference beam, and sends them to the back-end receiver. When the RF front end transmits, the transmission excitation signal generated by the back-end frequency synthesis receiver is sent to the power-dividing synthesis single pulse network, and the power is divided into multiple transmission channels. The signal is phase-compensated and amplified by the transmission channel in the TR module and output to the antenna. The energy is radiated by the antenna to form a beam in the specified direction in space.

[0041] The specific embodiment is based on a four-channel plastic-encapsulated silicon-based chip and adopts an active phased array sub-array with a tile-type structure. The scale of the active phased array sub-array is 6×6, the scale of the array element is 24×24, the operating frequency is X-band, the bandwidth is 1GHz, and the beam scanning range is: azimuth: ±45°, pitch: ±45°. Each active phased array sub-array integrates 16 transmit and receive channels and 16 antenna radiation units.

[0042] This embodiment implements the design of the entire array based on a standard sub-array building block expansion design. The silicon-based chip has a low batch cost and can effectively reduce the cost of the entire machine.

[0043] Through actual processing tests, the size of the prototype is 663mm×536mm×98mm, and the weight is less than 15Kg. It has the characteristics of low cost, high integration, modularization, strong heat dissipation, high reliability and rapid maintenance. It can achieve ±45° beam scanning in azimuth and ±45° beam scanning in elevation, EIRP>85.5dBm, G / T≥3.2dB / K, total power consumption of RF front end <500W, receiving beam width of 4.5°×3.8°, transmitting beam width of 3.8°×3.2°, and has good electrical performance.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An X-band highly integrated two-dimensional phased array radar radio frequency front end, characterized in that: include: Antenna cover (1), active phased array sub-array (2), heat dissipation housing (3), power division and synthesis network (4), wave control power supply board (5), sum and difference network (6), frequency synthesis receiver (7), data acquisition board (8) and centrifugal fan (9); The radome (1) is located on a first plane; The active phased array subarray (2) is located on the second plane, and the active phased array subarray (2) comprises an antenna subarray and a transceiver circuit board; wherein the antenna subarray is composed of M×N double-layer broadband microstrip patch radiation units; the transceiver circuit board and all the double-layer broadband microstrip patch radiation units are stacked and arranged, and a multi-layer hybrid board structure is used to integrate the corresponding M×N transceiver channels, control power distribution, and power division synthesis network into one, wherein multiple transceiver channels located at the same partition position are integrated into a plastic-encapsulated silicon-based TR chip on the transceiver circuit board to form a tile-type structure; a heat conduction path is arranged between the plastic-encapsulated silicon-based TR chip and the heat dissipation housing (3); The heat dissipation housing (3) is located on the third plane, the heat dissipation housing (3) serves as a main support, a plurality of active phased array sub-arrays (2) are mounted on the heat dissipation housing (3), heat generated by the active phased array sub-arrays (2) is conducted to the heat dissipation housing (3), and the heat is conducted to both sides of the heat dissipation housing through the heat pipes on the back of the heat dissipation housing; The power division and synthesis network (4) is located on a fourth plane; The wave-controlled power supply board (5) is located on the fifth plane; The sum-difference network (6) is arranged corresponding to the wave-controlled power supply board (5) on the same plane. The wave-controlled power supply board (5) and the sum-difference network (6) are installed on the back of the heat dissipation housing (3). The two share the back area. The sum-difference network (6) is located in the center part and is interconnected with the power division and synthesis network (4). The wave-controlled power supply board (5) uses the area around the sum-difference network (6); The frequency synthesizer receiver (7) and the data acquisition board (8) are stacked structures and are arranged as a whole in an external chassis. The two are connected by electrical signals through a motherboard.

2. The X-band highly integrated two-dimensional phased array radar radio frequency front end according to claim 1, characterized in that: A centrifugal fan (9) is arranged outside the heat dissipation housing.

3. The X-band highly integrated two-dimensional phased array radar radio frequency front end according to claim 1, characterized in that: It also includes a rear cover plate for installing and fixing the chassis where the frequency synthesizer receiver (7) and the data acquisition board (8) are located, and transferring the heat of the two to the heat dissipation teeth on the rear side of the rear cover plate, and forced air cooling through the centrifugal fan (9).

4. The X-band highly integrated two-dimensional phased array radar radio frequency front end according to claim 1, characterized in that: There are 36 active phased array sub-arrays (2) in total, arranged in a 6×6 array.

5. The X-band highly integrated two-dimensional phased array radar radio frequency front end according to claim 4, characterized in that: Each of the active phased array sub-arrays (2) comprises 4×4 phased array antenna units and a transceiver channel.

6. The X-band highly integrated two-dimensional phased array radar radio frequency front end according to claim 5, characterized in that: There are four power division and synthesis networks (4) in total, and each power division and synthesis network (4) is connected to 3×3 active phased array sub-arrays (2).

7. The X-band highly integrated two-dimensional phased array radar radio frequency front end according to claim 6, characterized in that: There are four wave-controlled power boards (5) in total, and each wave-controlled power board (5) is connected to 3×3 active phased array sub-arrays (2).

8. The X-band highly integrated two-dimensional phased array radar radio frequency front end according to claim 6, characterized in that: The power division and synthesis network (4) and the active phased array sub-array (2) are connected to each other via an SMP connector.

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