Headphone upper cover pressure retaining fixture and headphone upper cover assembling method

Abstract

The present application discloses a headphone upper cover pressure-maintaining jig and a headphone upper cover assembly method, and relates to the field of headphone manufacturing technology. The headphone upper cover pressure-maintaining jig includes a pressure-maintaining upper mold, the pressure-maintaining upper mold is provided with a plurality of contoured positioning blocks; a pressure-maintaining lower mold, the pressure-maintaining lower mold is provided with a plurality of headphone positioning grooves, the headphone positioning grooves are provided corresponding to the contoured positioning blocks; a separation pressure block, the separation pressure block is detachably provided on one side of the headphone positioning groove, and the separation pressure block is used to isolate at least two first magnetic parts on the headphone upper cover that are attracted or repelled from each other and are located in the headphone positioning groove. The separation pressure block can be used to separate the first magnetic parts on the headphone upper cover that are attracted or repelled from each other, thereby achieving one-time assembly and reducing assembly costs.

Description

Technical Field

[0001] The present application relates to the field of earphone manufacturing, and in particular to an earphone upper cover pressure-maintaining fixture and an earphone upper cover assembling method. Background Art

[0002] Headphones, such as TWS (True Wireless Stereo) headphones, are usually placed in a headphone box with adsorption and charging functions. Specifically, the TWS headphones are adsorbed and fixed by the headphone cover of the headphone box, so as to ensure that after the TWS headphones are placed, they can be aligned with the charging position for charging. The headphone cover is usually formed in one piece by two slots that match the shape of the headphones, and magnets are provided on the sides of the slots and at the connection between the two slots to provide sufficient adsorption force. However, due to the close distance between the magnets, especially the magnets at the connection between the two slots, there will be attraction or repulsion, resulting in the need to assemble the repelling magnets one by one when assembling the headphone cover, and then assemble after the previously assembled magnets are fixed, so as to avoid changes in the installation position of the magnets due to magnetic attraction or repulsion. However, this method leads to a longer assembly cycle for the headphone cover and high assembly costs. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, a headphone upper cover pressure-maintaining fixture and a headphone upper cover assembly method are proposed, which can shorten the assembly cycle of the headphone upper cover and thus reduce the assembly cost.

[0004] According to an embodiment of the first aspect of the present application, a headphone upper cover pressure maintaining fixture includes:

[0005] A pressure-maintaining upper die, wherein the pressure-maintaining upper die is provided with a plurality of contour positioning blocks;

[0006] A pressure-maintaining lower die, wherein the pressure-maintaining lower die is provided with a plurality of earphone positioning grooves, and the earphone positioning grooves are arranged correspondingly to the contoured positioning blocks;

[0007] A separation pressing block is detachably arranged on one side of the earphone positioning slot, and is used to isolate at least two first magnetic members that attract or repel each other on the earphone upper cover in the earphone positioning slot.

[0008] According to the above-mentioned embodiment of the first aspect of the present application, at least the following beneficial effects are achieved: after the glue-dispensed earphone cover is placed in the earphone positioning groove, one of the first magnetic parts is assembled at the glue-dispensing position, and then the separation pressing block is clamped on the pressure-maintaining lower mold adjacent to the installed first magnetic part, at this time, the first magnetic part is clamped and pressed by the separation pressing block and the earphone; and another first magnetic part is placed on the other side of the separation pressing block; or after the earphone cover is placed in the earphone positioning groove, the separation pressing block is first clamped and fixed, and two first magnetic parts are assembled in sequence, at this time, the earphone cover and the first magnetic part are quickly assembled through different assembly methods, and then the pressure-maintaining upper mold and the pressure-maintaining lower mold are closed and pressed down in sequence to be bonded and fixed. Therefore, the magnetic force between the two adjacent first magnetic parts is blocked by the separation pressing block, so that under the action of the contoured positioning block and the separation pressing block, the two first magnetic parts and the earphone cover can be kept in a compressed state, so that the assembly can be completed at one time, so as to shorten the assembly cycle of the earphone cover and the first magnetic part and reduce the assembly cost.

[0009] According to some embodiments of the first aspect of the present application, the separation pressing block is made of iron or copper. By making the separation pressing block of iron, the first magnetic member can be adsorbed on the separation pressing block, thereby fixing the position of the first magnetic member. By making the separation pressing block of copper, the magnetic forces of the two first magnetic members do not affect each other, thereby making it easier to fix the position of the first magnetic member.

[0010] According to some embodiments of the first aspect of the present application, the pressure-holding upper mold includes a bottom cover and a movable pressure plate, the movable pressure plate is arranged between the bottom cover and the pressure-holding lower mold; the movable pressure plate is movably connected to the bottom cover, and the contour positioning block is arranged on the movable pressure plate. By elastically connecting the movable pressure plate, the first magnetic part is subjected to uniform force during the pressure-holding process after mold closing, thereby preventing the position from being offset due to uneven force during the pressure-holding process.

[0011] According to some embodiments of the first aspect of the present application, the bottom cover is elastically connected to the movable pressure plate via a spring.

[0012] According to some embodiments of the present application, the bottom cover is provided with a plurality of limiting holes, and the side of the movable pressure plate opposite to the bottom cover is provided with a plurality of limiting columns, one end of the limiting column is fixedly provided on the movable pressure plate, and the other end of the limiting column is movably provided in the corresponding limiting hole. By providing the limiting holes and limiting columns, the direction of the spring elastic change can be limited, thereby further ensuring that the first magnetic part is subjected to uniform force during the pressure holding process after mold closing.

[0013] According to some embodiments of the first aspect of the present application, a second magnetic member is provided on a side of the pressure-retaining lower die opposite to the pressure-retaining upper die, and at least one second magnetic member is provided; the second magnetic member is provided along the edge of the earphone positioning groove, and one of the second magnetic members is located between the separation pressure block and the pressure-retaining lower die; the second magnetic member is used to adsorb the third magnetic member on the earphone upper cover in the earphone positioning groove. By providing the second magnetic member, when assembling three magnetic members at adjacent positions, the third magnetic member and the two first magnetic members can be fixed respectively with the help of the second magnetic assembly and the separation pressure block, thereby improving the convenience of assembly.

[0014] According to some embodiments of the first aspect of the present application, a flexible object is provided in the earphone positioning groove. By providing the flexible object, when the earphone is pressed by the contoured positioning block, the earphone cover is not easily deformed due to the buffering effect of the flexible object.

[0015] According to some embodiments of the first aspect of the present application, both ends of the pressure-maintaining upper mold and the pressure-maintaining lower mold are provided with protrusions, and the pressure-maintaining upper mold and the pressure-maintaining lower mold are clamped together by the protrusions and grooves provided on the protrusions. By providing protrusions at both ends of the pressure-maintaining upper mold and the pressure-maintaining lower mold and clamping together by the protrusions and grooves on the protrusions, openings are formed on both sides of the pressure-maintaining jig of the upper cover of the earphone after the mold is closed, which makes it easy to observe the assembly process of the upper cover of the earphone and facilitate timely detection of problems.

[0016] According to an embodiment of the second aspect of the present application, a method for assembling an earphone upper cover is implemented by using the earphone upper cover pressure-maintaining jig of the first aspect, and the method includes:

[0017] Apply glue at a preset glue-dispensing position on the upper cover of the earphone to be assembled, and place the upper cover of the earphone into the corresponding earphone positioning slot; wherein at least two glue-dispensing positions are provided, and the two glue-dispensing positions correspond to two first magnetic members arranged opposite to each other;

[0018] The separation pressing block is clamped on one side of the corresponding earphone positioning groove on the pressure-maintaining lower die;

[0019] Assembling two first magnetic parts at the corresponding glue dispensing positions respectively; wherein the two first magnetic parts are respectively located on both sides of the separation pressing block;

[0020] The pressure-maintaining upper mold and the pressure-maintaining lower mold are molded together and the pressure is maintained for a preset time to obtain the assembled earphone upper cover.

[0021] Since the headphone top cover assembly method of the second aspect of the present application is assembled by the headphone top cover pressure maintaining fixture of the first aspect, multiple first magnetic parts can be assembled at one time, thereby shortening the assembly cycle of the headphone top cover and reducing the assembly cost.

[0022] According to some embodiments of the second aspect of the present application, there are three dispensing positions; a second magnetic member is provided on a side of the pressure-maintaining lower mold opposite to the pressure-maintaining upper mold, and the second magnetic member is located between the separation pressure block and the pressure-maintaining lower mold; before the step of clamping the separation pressure block on the corresponding side of the earphone positioning groove on the pressure-maintaining lower mold, it also includes:

[0023] Place the third magnetic piece on the second magnetic piece so that the third magnetic piece is aligned with the corresponding glue-dispensing position on the earphone upper cover.

[0024] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 An exploded view of the structure of the earphone upper cover pressure-maintaining fixture of the embodiment of the present application;

[0027] Figure 2 This is a schematic diagram of the pressure-maintaining lower mold structure of the earphone upper cover pressure-maintaining fixture of the embodiment of the present application;

[0028] Figure 3 It is a schematic diagram of an exploded side view of a pressure-maintaining upper mold of a headphone upper cover pressure-maintaining fixture according to an embodiment of the present application;

[0029] Figure 4 A schematic diagram of the process of assembling the earphone cover according to an embodiment of the present application;

[0030] Figure 5 This is a schematic top view of an earphone top cover obtained by using the earphone top cover assembly method according to an embodiment of the present application.

[0031] Reference numerals:

[0032] The pressure-maintaining upper die 100, the contour positioning block 110, the bottom cover 120, the limiting hole 121, the movable pressing plate 130, the limiting column 131, the spring 140, the protrusion 150, the protrusion 151,

[0033] The pressure-maintaining lower mold 200, the earphone positioning groove 210, the groove 152,

[0034] Separation briquetting 300,

[0035] The earphone cover 410 , the slot body 411 , the first magnetic component 420 , the fourth magnetic component 430 , and the fifth magnetic component 440 . DETAILED DESCRIPTION

[0036] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0037] In the description of the present application, the meaning of "several" is one or more, the meaning of "more" is more than two, "greater than", "less than", "exceed", etc. are understood as not including the number itself, and "above", "below", "within", etc. are understood as including the number itself. If there is a description of the first and the second, it is only for the purpose of distinguishing the technical features, and it cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features. It should be understood that the description of the orientation, such as up, down, front, back, left, right, etc., the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0038] As TWS Bluetooth headsets become smarter and more AI-enabled, the internal assembly of their charging boxes uses more magnets, making the 410 profiled surface of the headset cover more complex. At the same time, due to the polarity characteristics of magnets: like charges repel each other and opposite charges attract each other, multiple gluing and assembly bonding and pressure maintenance are required, making it increasingly difficult to assemble the magnets after gluing the headset cover 410, resulting in an increase in labor costs.

[0039] Therefore, in order to enable multiple magnets with different polarities to be quickly assembled onto the earphone cover 410 at a close distance, the present application proposes an earphone cover pressure maintaining fixture and an earphone cover assembly method to shorten the assembly cycle of the earphone cover 410 and reduce the assembly cost.

[0040] like Figures 1 to 3 As shown in the figure, the headphone cover pressure-maintaining fixture includes:

[0041] A pressure-maintaining upper die 100, wherein the pressure-maintaining upper die 100 is provided with a plurality of contoured positioning blocks 110;

[0042] A pressure-maintaining lower die 200, wherein the pressure-maintaining lower die 200 is provided with a plurality of earphone positioning grooves 210, and the earphone positioning grooves 210 are arranged corresponding to the contour positioning blocks 110;

[0043] The separation pressing block 300 is detachably disposed on one side of the earphone positioning slot 210 , and is used to isolate at least two first magnetic members 420 that attract or repel each other on the earphone upper cover 410 in the earphone positioning slot 210 .

[0044] It should be noted that the separation block 300 is a contoured block. The first magnetic member 420 is a magnet; a mounting groove matching the separation block 300 is provided on the pressure-maintaining lower mold 200, so that one end of the separation block 300 can be clamped on the pressure-maintaining lower mold 200, and at this time, the other end of the separation block 300 is clamped on the surface of the earphone cover, so that the two adjacent first magnetic members 420 (such as the first magnetic members 420 located on both sides of the separation block 300) are isolated, so that the magnetic force between the two first magnetic members 420 can be isolated to avoid mutual influence. It should be noted that since the magnet and the earphone cover 410 need to be bonded by dispensing glue, the separation block 300 is detachably connected, which can make it more convenient to assemble the earphone cover 410 and the magnet. At the same time, by designing different separation blocks 300, different magnet shapes or isolation of multiple magnets can be adapted, thereby improving the utilization rate of the earphone cover pressure-maintaining fixture.

[0045] It should be noted that the pressure-holding upper mold 100 and the pressure-holding lower mold 200 are clamped in a matching manner by the groove 152 and the protrusion 151, so that after the mold is closed and during the pressure holding process, the pressure-holding upper mold 100 and the pressure-holding lower mold 200 will not move relative to each other.

[0046] It should be noted that, according to the position and quantity of the first magnetic members 420 to be separated, a plurality of separation pressing blocks 300 may be provided to facilitate assembly and fixation.

[0047] It should be noted that one or more earphone positioning grooves 210 and contoured positioning blocks 110 can be provided, and the provision is made according to the number of earphone upper covers 410 to be pressure-maintained at one time.

[0048] Therefore, after the glue-applied earphone upper cover 410 is placed in the earphone positioning groove 210, one of the first magnetic parts 420 is assembled at the glue-applied position, and then the separation pressure block 300 is clamped on the pressure-holding lower mold 200 adjacent to the installed first magnetic part 420. At this time, the first magnetic part 420 is clamped and pressed by the separation pressure block 300 and the earphone; and another first magnetic part 420 is placed on the other side of the separation pressure block 300; or after the earphone upper cover 410 is placed in the earphone positioning groove 210, the separation pressure block 300 is first clamped and fixed, and the two first magnetic parts 420 are assembled in sequence. At this time, the earphone upper cover 410 and the first magnetic part 420 are quickly assembled through different assembly methods, and then the pressure-holding upper mold 100 and the pressure-holding lower mold 200 are molded and pressed down in sequence to bond and fix them. Therefore, the magnetic force between two adjacent first magnetic parts 420 is blocked by means of the separation pressing block 300, so that under the action of the contoured positioning block 110 and the separation pressing block 300, the two first magnetic parts 420 and the earphone can be kept in a compressed state, so that they can be assembled in one time, thereby shortening the assembly cycle of the earphone cover 410 and the first magnetic parts 420 and reducing the assembly cost.

[0049] It should be noted that the contoured positioning block 110 matches the shape of the upper surface of the earphone cover 410 to be assembled. When the mold is closed and the pressure is maintained, the contoured positioning block 110 will provide a downward force to the earphone cover 410. At this time, under the action of the contoured positioning block 110 and the separation pressing block 300, the earphone cover 410 and the first magnetic part 420 remain in a pressed state, so that they can be bonded and fixed.

[0050] It can be understood that the separation block 300 is made of iron or copper. By making the separation block 300 of iron, the first magnetic member 420 can be adsorbed on the separation block 300, thereby fixing the position of the first magnetic member 420. By making the separation block 300 of copper, the magnetic forces of the two first magnetic members 420 do not affect each other; thus, it is more convenient to fix the position of the first magnetic member 420.

[0051] It can be understood that, Figure 1 As shown, the pressure-holding upper mold 100 includes a bottom cover 120 and a movable pressing plate 130, and the movable pressing plate 130 is arranged between the bottom cover 120 and the pressure-holding lower mold 200; the movable pressing plate 130 is movably connected to the bottom cover 120, and the contour positioning block 110 is arranged on the movable pressing plate 130. By elastically connecting the movable pressing plate 130, the first magnetic member 420 is subjected to uniform force during the pressure-holding process after mold closing, thereby preventing the position from being offset due to uneven force during the pressure-holding process.

[0052] It can be understood that, Figure 3 As shown, the bottom cover 120 and the movable pressing plate 130 are elastically connected via a spring 140 .

[0053] It can be understood that, Figure 3 As shown, a plurality of limiting holes 121 are provided on the bottom cover 120, and a plurality of limiting posts 131 are correspondingly provided on a side of the movable pressing plate 130 opposite to the bottom cover 120, one end of the limiting post 131 is fixedly provided on the movable pressing plate 130, and the other end of the limiting post 131 is movably provided in the corresponding limiting hole 121. By providing the limiting holes 121 and the limiting posts 131, the direction of the elastic change of the spring 140 can be limited, thereby further ensuring that the first magnetic member 420 is subjected to uniform force during the pressure holding process after mold closing.

[0054] It can be understood that the second magnetic member is provided on the side of the pressure-holding lower mold 200 opposite to the pressure-holding upper mold 100, and at least one second magnetic member is provided; the second magnetic member is provided along the edge of the earphone positioning groove 210, and one of the second magnetic members is located between the separation pressing block 300 and the pressure-holding lower mold 200; the second magnetic member is used to adsorb the third magnetic member on the earphone upper cover 410 in the earphone positioning groove 210. By providing the second magnetic member, when assembling three magnetic members at the same position, the third magnetic member and the two first magnetic members 420 can be fixed respectively by means of the second magnetic assembly and the separation pressing block 300, thereby improving the convenience of assembly.

[0055] It should be noted that if Figure 5 The earphone cover 410 shown is formed integrally by two slots 411 matching the shape of the earphones. At this time, two first magnetic members 420 are arranged on the surfaces of the two slots 411 in a relative manner, and a third magnetic member is arranged at the connection of the two slots 411, so that the first magnetic member 420, the third magnetic member, and another first magnetic member 420 are distributed along the earphone cover 410. Therefore, the separation pressing block 300 can be clamped by adsorbing the third magnetic member behind the second magnetic member. At this time, the separation pressing block 300 can fix the third magnetic member and can separate the two first magnetic members 420 that need to be assembled.

[0056] It should be noted that the second magnetic component can be embedded in the pressure-maintaining lower mold 200, or it can be protruded and fixed on the surface of the pressure-maintaining lower mold 200, and it is specifically set according to the bonding position of the third magnetic component.

[0057] It can be understood that a flexible object is laid in the earphone positioning groove 210. By providing the flexible object, when the earphone is pressed by the contoured positioning block 110, the earphone cover is not easily deformed due to the buffering effect of the flexible object.

[0058] It should be noted that the flexible material can be set to be a foam or other material with low elasticity and softness, which can provide a certain buffering force to the earphone cover 410 when maintaining pressure, thereby reducing damage to the surface of the earphone cover 410.

[0059] It can be understood that both ends of the pressure-holding upper mold 100 and the pressure-holding lower mold 200 are provided with protrusions 150, and the pressure-holding upper mold 100 and the pressure-holding lower mold 200 are clamped together by the protrusions 151 and the grooves 152 provided on the protrusions 150. By providing protrusions 150 at both ends of the pressure-holding upper mold 100 and the pressure-holding lower mold 200 and clamping together by the protrusions 151 and the grooves 152 on the protrusions 150, openings are formed on both sides of the earphone upper cover pressure-holding jig after the mold is closed, which can facilitate observation of the assembly process of the earphone upper cover 410 and facilitate timely detection of problems.

[0060] It should be noted that the protruding column 151 and the recessed groove 152 are respectively disposed at two ends of the pressure-maintaining upper mold 100 (bottom cover 120 ) and the pressure-maintaining lower mold 200 .

[0061] like Figure 4 As shown, the method includes:

[0062] Step S100, glue is applied at preset glue application positions on the earphone cover 410 to be assembled, and the earphone cover 410 is placed into the corresponding earphone positioning slot 210; wherein, at least two glue application positions are provided, and the two glue application positions correspond to two first magnetic parts 420 which are arranged opposite to each other.

[0063] Step S200 , clamping the separation pressing block 300 on one side of the corresponding earphone positioning groove 210 on the pressure-maintaining lower mold 200 .

[0064] Step S300 , assembling the two first magnetic components 420 at corresponding glue dispensing positions respectively; wherein the two first magnetic components 420 are respectively located at two sides of the separation pressing block 300 .

[0065] It should be noted that since the first magnetic parts 420 are arranged on both sides of the separation block 300, the first magnetic parts 420 can be assembled after the separation block 300 is fixed, or one of the first magnetic parts 420 can be assembled and then the separation block 300 can be placed before assembling the other first magnetic part 420.

[0066] Step S400, closing the pressure-maintaining upper mold 100 and the pressure-maintaining lower mold 200 and maintaining the pressure for a preset time to obtain an assembled earphone upper cover 410.

[0067] Since the earphone upper cover assembling method is performed by the earphone upper cover pressure retaining fixture, multiple first magnetic components 420 can be assembled at one time, thereby shortening the assembly cycle of the earphone and reducing the assembly cost.

[0068] It can be understood that there are three dispensing positions; a second magnetic member is provided below the partition of the separation block 300 (that is, the second magnetic member is provided between the pressure-holding lower mold 200 and the separation block 300); and between step S100 and step S200, the following is also included:

[0069] The third magnetic component is placed on the second magnetic component so that the third magnetic component is aligned with the corresponding glue dispensing position on the earphone upper cover 410 .

[0070] It should be noted that when the separation block 300 is clamped, one end of the separation block 300 is fixedly connected to the pressure-holding lower mold 200, and a gap is formed between the other end (partitioning part) of the separation block 300 and the surface of the pressure-holding lower mold 200. Therefore, at this time, the third magnetic part is clamped between the separation block 300 and the second magnetic part.

[0071] Reference below Figures 1 to 5 The headphone upper cover pressure-maintaining fixture of the present application is described in detail with a specific embodiment. It is worth noting that the following description is only an exemplary description and is not a specific limitation of the present application.

[0072] like Figure 5The assembled earphone cover 410 shown in the figure includes two grooves 411, two first magnetic parts 420 at the connection of the two grooves 411 are arranged opposite to each other, three third magnetic parts are arranged along the edge of the earphone cover 410, and the three third magnetic parts include two fourth magnetic parts 430 and one fifth magnetic part 440; wherein, the fifth magnetic part 440 is arranged obliquely below the two first magnetic parts 420, the two fourth magnetic parts 430 are away from the first magnetic parts 420, and the fifth magnetic part 440 is arranged along the edge of the groove 411.

[0073] At this time, first customize the pressure-maintaining fixture according to the upper cover of the earphone to be assembled, such as Figures 1 to 3 As shown in the figure, the headphone cover pressure-maintaining fixture includes:

[0074] The pressure-maintaining upper die 100 is provided with two contoured positioning blocks 110;

[0075] A pressure-maintaining lower die 200, wherein the pressure-maintaining lower die 200 is provided with two earphone positioning grooves 210, and the earphone positioning grooves 210 are provided correspondingly to the contour positioning blocks 110;

[0076] The separation pressing block 300 is detachably disposed on one side of the earphone positioning slot 210 , and is used to isolate two first magnetic members 420 that attract or repel each other on the earphone upper cover 410 in the earphone positioning slot 210 .

[0077] Specifically, Figure 1 As shown, both ends of the pressure-maintaining upper mold 100 and the pressure-maintaining lower mold 200 are provided with protrusions 150 , and the pressure-maintaining upper mold 100 and the pressure-maintaining lower mold 200 are clamped together by means of protruding columns 151 and grooves 152 respectively provided on the protrusions 150 .

[0078] Furthermore, the separation compact 300 is made of iron.

[0079] Further, if Figure 1 As shown, the pressure-maintaining upper mold 100 includes a bottom cover 120 and a movable pressure plate 130 , and the movable pressure plate 130 is arranged between the bottom cover 120 and the pressure-maintaining lower mold 200 ; the movable pressure plate 130 is movably connected to the bottom cover 120 , and the contoured positioning block 110 is arranged on the movable pressure plate 130 .

[0080] Specifically, Figure 3 As shown, the bottom cover 120 and the movable pressing plate 130 are elastically connected via a spring 140 .

[0081] Further, if Figure 3As shown, a plurality of limiting holes 121 are provided on the bottom cover 120 , and a plurality of limiting columns 131 are provided on the side of the movable pressure plate 130 opposite to the bottom cover 120 , one end of the limiting column 131 is fixedly provided on the movable pressure plate 130 , and the other end of the limiting column 131 is movably provided in the limiting hole 121 .

[0082] Furthermore, a second magnetic member is disposed below the separation pressing block 300. Figure 2 As shown, a second magnetic component is also disposed at a position opposite to the fourth magnetic component 430 and the fifth magnetic component 440 .

[0083] Furthermore, foam is laid in the earphone positioning groove 210 .

[0084] At this time, refer to Figure 4 The assembly method shown, first, as in step S100, glue is dispensed at 5 positions on the headphone cover 410 to be assembled and placed in the corresponding headphone positioning slot 210. Then, two fourth magnetic parts 430 and one fifth magnetic part 440 are respectively assembled above the corresponding second magnetic parts, and the separation pressing block 300 is clamped on one side of the fifth magnetic part 440 with reference to step S200. At this time, the other end of the separation pressing block 300 presses the fifth magnetic part 440; the two sides of the separation pressing block 300 correspond to the installation positions of the first magnetic part 420. Further, with reference to step S300, the two first magnetic parts 420 are respectively assembled to the corresponding glue dispensing positions, and finally, with reference to step S410, the assembled headphone cover 410 is assembled.

[0085] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0086] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0087] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

[0088] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present application.

Claims

1. A headphone cover pressure-maintaining fixture, characterized in that: include: A pressure-maintaining upper die, wherein the pressure-maintaining upper die is provided with a plurality of contour positioning blocks; A pressure-maintaining lower die, wherein the pressure-maintaining lower die is provided with a plurality of earphone positioning grooves, and the earphone positioning grooves are arranged correspondingly to the contoured positioning blocks; A separation pressing block, which is detachably arranged on one side of the earphone placement slot, and is made of iron or copper; the separation pressing block is used to separate at least two first magnetic members that attract or repel each other on the earphone upper cover to be bonded in the earphone placement slot, and the separation pressing block is made of iron so that the first magnetic member is adsorbed on the separation pressing block; the separation pressing block is made of copper so that the magnetic forces of the two first magnetic members do not affect each other; Wherein, the pressure-maintaining upper die comprises a bottom cover and a movable pressing plate, wherein the movable pressing plate is arranged between the bottom cover and the pressure-maintaining lower die; the movable pressing plate is movably connected to the bottom cover, and the contoured positioning block is arranged on the movable pressing plate; A second magnetic part is provided on the side of the pressure-holding lower mold opposite to the pressure-holding upper mold, and at least one second magnetic part is provided; the second magnetic part is arranged along the edge of the earphone positioning groove, and one of the second magnetic parts is located between the separation pressure block and the pressure-holding lower mold; the second magnetic part is used to absorb the third magnetic part to be bonded to the upper cover of the earphone in the earphone positioning groove.

2. The headphone upper cover pressure-maintaining fixture according to claim 1, characterized in that: The bottom cover is elastically connected to the movable pressing plate via a spring.

3. The headphone upper cover pressure-maintaining fixture according to claim 1, characterized in that: The bottom cover is provided with a plurality of limiting holes, and a side of the movable pressure plate opposite to the bottom cover is correspondingly provided with a plurality of limiting columns, one end of the limiting column is fixedly provided on the movable pressure plate, and the other end of the limiting column is movably provided in the corresponding limiting hole.

4. The headphone upper cover pressure-maintaining fixture according to claim 1, characterized in that: A flexible object is laid in the earphone positioning groove.

5. The headphone upper cover pressure-maintaining fixture according to claim 1, characterized in that: Both ends of the pressure-maintaining upper mold and the pressure-maintaining lower mold are provided with protrusions, and the pressure-maintaining upper mold and the pressure-maintaining lower mold are clamped and molded with each other through the protrusions and grooves arranged on the protrusions.

6. A method for assembling an earphone cover, characterized in that: A method for assembling the headphone upper cover is implemented by using a headphone upper cover pressure-holding jig, the headphone upper cover pressure-holding jig includes a pressure-holding upper die, a pressure-holding lower die and a separation pressure block; the pressure-holding upper die is provided with a plurality of contoured positioning blocks; the pressure-holding lower die is provided with a plurality of headphone positioning grooves, and the headphone positioning grooves are arranged corresponding to the contoured positioning blocks; the separation pressure block is detachably arranged on one side of the headphone positioning groove, and the separation pressure block is made of iron or copper; the separation pressure block is used to isolate two first magnetic parts on the headphone upper cover located in the headphone positioning groove that attract or repel each other; wherein, the pressure-holding upper die It comprises a bottom cover and a movable pressing plate, wherein the movable pressing plate is arranged between the bottom cover and the pressure-maintaining lower die; the movable pressing plate is movably connected to the bottom cover, and the contoured positioning block is arranged on the movable pressing plate; a second magnetic member is arranged on a side of the pressure-maintaining lower die opposite to the pressure-maintaining upper die, and at least one second magnetic member is arranged; the second magnetic member is arranged along the edge of the earphone positioning groove, and one of the second magnetic members is located between the separation pressing block and the pressure-maintaining lower die; the second magnetic member is used to adsorb the third magnetic member on the earphone upper cover in the earphone positioning groove; The method comprises: Glue is applied to the preset glue-applying positions on the upper cover of the earphone to be assembled, and the upper cover of the earphone is placed into the corresponding earphone positioning slot; wherein at least two glue-applying positions are provided, and the two glue-applying positions correspond to two first magnetic members that attract or repel each other respectively; Placing the third magnetic member on the second magnetic member so that the third magnetic member is aligned with the corresponding glue-dispensing position on the upper cover of the earphone; The separation pressing block is clamped on one side of the corresponding earphone positioning groove on the pressure-maintaining lower die; Assemble the two first magnetic parts at the corresponding dispensing positions respectively; wherein the two first magnetic parts are respectively located on both sides of the separation pressing block; the separation pressing block is made of iron so that the first magnetic part is adsorbed on the separation pressing block; the separation pressing block is made of copper so that the magnetic forces of the two first magnetic parts do not affect each other; The pressure-maintaining upper mold and the pressure-maintaining lower mold are molded together and the pressure is maintained for a preset time to obtain an assembled earphone upper cover.

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