Method for providing electrical connection and printed circuit board

Abstract

A method for providing an electrical connection comprises connecting a first cable to a first conductive structure on a printed circuit board, connecting a second cable to a second conductive structure on the printed circuit board, comparing the following two items: a propagation delay of a first signal path including the first cable and the first conductive structure on the printed circuit board, and a propagation delay of a second signal path including the second cable and the second conductive structure on the printed circuit board; and depending on the result of the comparison, removing conductive material of the first conductive structure and / or the second conductive structure so as to modify the electrical length of the first conductive structure and / or the second conductive structure to obtain a first conductive path and a second conductive path, thereby reducing the difference in propagation delay between the first signal path and the second signal path.

Description

Technical Field

[0001] Embodiments according to the invention relate to a method and a printed circuit board for providing an electrical connection. Background Art

[0002] Today, cable assemblies that require propagation time matching better than + / -25 picoseconds are manufactured by measuring each single wire, sorting it, and performing assembly related to the sorting results. This means a lot of manual work and is therefore costly.

[0003] For example, cables are sorted into groups, and for a differential cable pair, two cables from one group must be sorted into pairs at, for example, a printed circuit board.

[0004] To achieve better than + / -25 picosecond skew matching of the pairs within a cable assembly, it is now necessary to perform the following steps:

[0005] Cut the cable material into defined lengths

[0006] ·Apply connectors on at least one side, which allows measurements with TDR

[0007] Measure the signal propagation delay of each of these prepared lines using TDR

[0008] Sort the lines into groups with similar signal propagation delays (with a limited tolerance)

[0009] For subsequent cable assemblies, ensure that only cable material from a group of lines with similar signal propagation delays is used in a differential pair.

[0010] This approach ensures that the differential pairs within the cable have a certain maximum skew value, but it requires a lot of work and it involves the risk of mixing the lines with different signal propagation delays within one differential pair.

[0011] Therefore, it is desirable to have a concept that provides a better compromise between reducing signal propagation delay within a differential cable pair, efficiency, and cost. Summary of the invention

[0012] According to one embodiment of the present invention, a method for providing electrical connection is disclosed. The method includes the steps of connecting a first cable to a first conductive structure on a printed circuit board and connecting a second cable to a second conductive structure on the printed circuit board. If the first cable and / or the second cable are coaxial cables, the core wires (e.g., CU cores) of the cables may be connected to the first and / or second conductive structures on the printed circuit board. By this method, the following two items can be compared: the propagation delay of the first signal path including the first cable and the first conductive structure on the printed circuit board, and the propagation delay of the second signal path including the second cable and the second conductive structure on the printed circuit board. The comparison can be understood, for example, as calculating the difference between the propagation delay of the first signal path and the propagation delay of the second signal path. The method may also include the step of removing conductive material from the first conductive structure and / or from the second conductive structure depending on the result of the comparison, so as to modify the electrical length of the first conductive structure and / or the second conductive structure, so as to obtain the first conductive path and the second conductive path, thereby reducing the difference in propagation delay between the first signal path and the second signal path.

[0013] This embodiment is based on the idea that the cables are first connected to the printed circuit board, then the propagation delays of the cables are compared, and the propagation delays of the cables are matched by removing the conductive material of the conductive structures connected to the respective cables to change the electrical length of the conductive structures, which is efficient. Based on the comparison of the propagation delay of, for example, the first signal path and the propagation delay of the second signal path, the propagation delay of each single signal path including, for example, the cable and the conductive structures on the printed circuit board can be adjusted. The adjustment can be performed on the printed circuit board, so, for example, no measurement or sorting is required before the soldering process.

[0014] It should be noted that the invented method for providing electrical connection can reduce the difference in signal propagation delay within a differential cable pair (e.g., including a first cable and a second cable) by removing conductive material of conductive structures connected to the respective cables to modify the electrical length. For example, if the propagation delay of a first signal path including a first cable and a first conductive structure on a printed circuit board is longer than the propagation delay of a second signal path including a second cable and a second conductive structure on a printed circuit board, then a portion of the conductive material of the second conductive structure is removed so that the electrical length of the second conductive structure is increased to the electrical length of the first conductive structure to obtain almost the same propagation delay of the first signal path and the second signal path. As the electrical length of the conductive structure increases, the propagation delay of the signal path increases. Thus, for example, the propagation delays of the first signal path and the second signal path can be matched, and the difference between the respective propagation delays can be reduced.

[0015] Furthermore, the method enhances efficiency through the possibility of performing adjustments on the printed circuit board, thereby reducing costs.

[0016] In one embodiment of the method, the propagation delay of the first and second signal paths can be determined by time domain reflectometry measurement. For time domain reflectometry (TDR) measurement, for example, the first and second signal paths can be connected to a TDR measurement system, and all signal paths can then be measured by the system for their signal propagation delays. The propagation delays of the first signal path and the second signal path determined by the time domain reflectometry measurement can be compared. Thus, the accurate propagation delay of the signal path can be obtained by the TDR measurement. Thus, the propagation delay of the signal path can be evaluated very quickly, accurately and efficiently, so that the accuracy of calculating the difference in propagation delay between the first signal path and the second signal path can be improved, and thus the removal of conductive material of the first conductive structure and / or the second conductive structure can be optimized. Thus, it is possible to match the propagation delay of the first signal path and the second signal path, for example, with high accuracy and with only very small or no difference in propagation delay.

[0017] In one embodiment of the method, a propagation delay difference can be determined from the propagation delay of the first signal path and the second signal path. This can be accomplished, for example, by comparing the propagation delay of the first signal path and the propagation delay of the second signal path. Based on the propagation delay difference, the conductive material of the first conductive structure and / or the second conductive structure can be removed to form a first conductive path and a second conductive path (the conductive path can be, for example, in the form of a corrugated, straight, sharp angle or meander), and the propagation delay difference is at least partially compensated. Thus, for example, if the propagation delay of one signal path is longer than the propagation delay of the corresponding signal path, the signal path with the shorter propagation delay can be formed so that the conductive path increases and allows the electrical length of the corresponding signal path. Thus, for example, a signal path with a long propagation delay can include a straight conductive path, and a signal path with a short propagation delay can include a corrugated conductive path. With this implementation, for example, the propagation delay difference between the first signal path and the signal path can be at least partially compensated.

[0018] In an embodiment of the method, the method comprises the steps of shaping a first conductive structure on a printed circuit board by removing conductive material so as to obtain therefrom a first conductive path having a first electrical length, and / or shaping a second conductive structure on the printed circuit board by removing conductive material so as to obtain therefrom a second conductive path having a second electrical length, wherein the first electrical length is shorter than the second electrical length. By means of the shaping step of the method, the conductive structure can be formed in many different ways. The conductive structure can, for example, be shaped into a straight line, a wavy line, a line formed at an acute angle, a line formed like a meander, and the like. This enumeration of different shaping forms of the conductive structure must be regarded as exemplary and non-exhaustive. For example, before shaping, a first signal path comprising a first cable and a first conductive structure on a printed circuit board may have a longer propagation delay than a propagation delay of a second signal path comprising a second cable and a second conductive structure on a printed circuit board. In this embodiment, the first electrical length (of the first conductive path) achieved by shaping can be shorter than the second electrical length (of the second conductive path) achieved by shaping, which can, for example, enable partial compensation of the original propagation delay difference between the propagation delay of the first signal path and the propagation delay of the second signal path. In other words, before shaping, the first (overall) signal path (including the first cable) is longer than the second (overall) signal path (including the second cable). Therefore, shaping is performed in a way that the first electrical length (of the first conductive path on the PCB) obtained by removing the conductive material is shorter than the second electrical length (of the second conductive path on the PCB). Therefore, the different lengths of the cables are (at least partially) compensated. Because the first electrical length is shorter than the second electrical length, a signal propagated through the first signal path can propagate through the first conductive path faster than a signal propagated through the second signal path propagates through the second conductive path.

[0019] Because the first electrical length is shorter than the second electrical length, the signal propagates faster through the first signal path than through the second signal path. Thus, for example, if a signal propagating through the first signal path requires a longer propagation time through the first cable than a signal propagating through the second cable of the second signal path, the different electrical lengths of the first electrical length and the second electrical length can ensure that the signals propagating through the first signal path and through the second signal path can complete their respective signal paths at approximately the same time (the original propagation delay difference between the first signal path and the second signal path caused by the different cable lengths can be at least partially compensated by the different electrical lengths of the conductive paths).

[0020] In one embodiment, the method includes the step of removing the conductive material of the first conductive structure so that the obtained first conductive path forms a straight line within the defined range of the first conductive path, and the step of removing the conductive material of the second conductive structure so that the obtained second conductive path forms a non-straight line within the corresponding defined range of the second conductive path. The first conductive structure and / or the second conductive structure may include a conductive path and two contact paths. Thus, the conductive material of the first conductive structure can be removed to obtain the first conductive path, forming a straight line between the opposite contact pads, and the conductive material of the second conductive structure can be removed to obtain the second conductive path, forming a non-straight line between the opposite contact pads. In this embodiment, the first conductive path having a straight line is shorter than the length of the second conductive path having a non-straight line.

[0021] Thus, the signal can propagate faster through the first conductive path (e.g., the first structural area on the printed circuit board) than through the second conductive path (e.g., the second structural area on the printed circuit board), which can at least partially compensate for the original propagation delay difference between the signal propagating through the first signal path (including the first cable) and the signal propagating through the second signal path (including the second cable).

[0022] According to an embodiment of the present invention, a printed circuit board is provided, comprising a first contact pad configured to contact a first cable, a second contact pad configured to contact a second cable, a third contact pad configured to contact a device, a fourth contact pad configured to contact a device, a first conductive path connecting the first contact pad and the third contact pad, and a second conductive path connecting the second contact pad and the fourth contact pad. The conductive material of the conductive structure connecting the second contact pad and the fourth contact pad is removed after defining the conductive structure, thereby defining the second conductive path, so that the propagation delay difference of the signal path including the first conductive path with the first cable and the second conductive path with the second cable is at least partially compensated. The first conductive path may have a defined length between the first contact pad and the third contact pad. The length of the second conductive path may be modified by, for example, ablation of the conductive material of the conductive structure connecting the second contact pad and the fourth contact pad. The physical length of the second conductive path may thus be formed to be shorter or longer than the length of the first conductive path. Before the conductive material of the conductive structure of the second conductive path is removed, the second conductive path may, for example, have the same physical length as the first conductive path. If the signal propagated through the first conductive path has a shorter propagation time than the signal propagated through the second conductive path, the first conductive path may include a conductive structure connecting the first contact pad and the third contact pad, the length of which is extended by removing the conductive material. In another case, if the signal propagated through the first signal path has a longer propagation time than the signal propagated through the second signal path, the conductive structure connecting the second contact pad and the fourth contact pad is extended, for example, by removing the conductive material. Thus, the length of the second conductive path can be modified by removing the conductive material so that there is almost no propagation delay difference between the signal propagated through the first signal path (e.g., the first conductive path and the first cable) and the signal propagated through the second signal path (e.g., the second conductive path and the second cable). Thus, the propagation delay difference of the signal paths can be at least partially compensated. Thus, the printed circuit board can reduce the propagation delay difference between, for example, a differential cable pair (e.g., the first cable and the second cable) with high efficiency and reduced cost.

[0023] In an embodiment, the printed circuit board may be connected to the first cable and the second cable. The shape of the second conductive path on the printed circuit board may be electrically elongated by removing conductive material (e.g., from the second conductive structure) compared to the first conductive path on the printed circuit board so as to at least partially compensate for the propagation delay difference between the first cable and the second cable. Thus, the second signal path may, for example, include a second conductive path having a longer length than the first conductive path and a second cable having a shorter propagation delay than the first cable, whereby the propagation delay difference between the first signal path and the second signal path may be at least partially compensated.

[0024] In an embodiment of the printed circuit board, the first conductive path is shaped so that, by subsequently removing the conductive material of the conductive structure, the width of the first conductive path is constant between the first contact pad and the third contact pad. In addition, the second conductive path is shaped so that, by subsequently removing the conductive material of the conductive structure, the width of the second conductive path is constant between the second contact pad and the fourth contact pad. In particular, the width of the second conductive path may, for example, be the same as the width of the first conductive path. If the width of the conductive path changes, for example, between two contact pads, the inductance and capacitance of the conductive path on the printed circuit board may change and affect the signal propagated through the conductive path (e.g., signal reflection, change in signal amplitude, etc.). Thus, it is necessary to keep the width of the conductive path constant between the contact pads and only change the length of the conductive path. Problems may particularly arise when the first conductive path of a differential cable pair (e.g., a first cable having a first conductive path and a second cable having a second conductive path) comprises a different width than the second conductive path. In this case, for example, a first signal propagated through the first contact path is affected differently from a second signal propagated through the second conductive path.

[0025] In an embodiment of the printed circuit board, the first conductive path and the second conductive path are arranged parallel to each other, except that the second path includes an elongated area produced by removing the conductive material of the conductive structure. This means, for example, that the second conductive path includes a longer path than the first conductive path in an area such as a corrugated, meandering, acute angle, etc., such as in this area. In the area where the second conductive path and the first conductive path are arranged parallel to each other, the first conductive path and the second conductive path may include the same length. Due to the parallel area and the elongated area with the second conductive path, the propagation of the signal through the second conductive path can be extended relative to the propagation time of the signal propagated through the first conductive path. Thereby, the propagation delay difference between the first cable connected to the first conductive path and the second cable connected to the second conductive path can be at least partially compensated by the different lengths of the second conductive path and the first conductive path.

[0026] In one embodiment of the printed circuit board, a first design reference line along which the first contact pad and the second pad are arranged is parallel to a second design reference line along which the third contact pad and the fourth contact pad are arranged. Thus, it is possible to use only a small space (area or space, respectively) on the printed circuit board, and the size (size or space, respectively) of the first conductive path between the first contact pad and the third contact pad is, for example, the same length as the size (size or space, respectively) of the second conductive path between the second contact pad and the fourth contact pad. Thus, the printed circuit board according to the present invention can be realized with minimal cost and high efficiency.

[0027] In one embodiment, the printed circuit board may include a connector connected to the third contact pad and the fourth contact pad, wherein the connector is configured to connect to the board. This is a structure that can be applied to a pogo cable assembly in a pogo block, or to a board cable on one side of a board connector.

[0028] In one embodiment of the printed circuit board, one end of a first cable that is not connected to the printed circuit board is connected (i.e., attached) to a connector (i.e., a plug), and one end of a second cable that is not connected to the printed circuit board is connected to the connector. The connector at the first cable can be the same connector as the connector at the second cable, or it can be a different connector. The connector enables the first cable and the second cable to be connected, for example, to a device. Thus, the printed circuit board can be easily integrated into a larger system, network, or device, whereby it is very efficient.

[0029] In an embodiment of the printed circuit board, a first area of ​​the printed circuit board formed by removing the conductive material of the conductive structure by laser ablation, milling, routing or etching is located closer to the cable side edge of the printed circuit board than a second area of ​​the printed circuit board formed by removing the conductive material of the conductive structure by laser ablation, milling, routing or etching. The first area is, for example, adjacent to the first conductive path, and the second area is, for example, adjacent to the second conductive path. This means that, for example, a first or second conductive path leading from one contact pad (for example, the first contact pad or the second contact pad) to another contact pad (for example, the third or fourth contact pad) can be located near the first area and / or the second area. For example, the conductive path (for example from the first pad to the third pad, or from the second pad to the fourth pad) can deviate from a straight line between two corresponding contact pads in the first or second (adjustment) area, so that the (respective) contact path is no longer a straight line. In other words, the conductive path departs from the straight line at the beginning of the first or second area and runs at least to some extent in a direction perpendicular to the straight line (e.g., completely perpendicular, diagonal or with an angle between 0° and 90°), then the conductive path changes direction again and can be parallel to the straight line, and at the end of the first or second area, the conductive path is directed back to the virtual straight line and leads to the corresponding contact pad on the virtual straight line. In other words, for example, the first conductive path between the first contact pad and the third contact pad first goes straight from the first contact pad in the direction of the third contact pad, then goes a little to the right or to the left, and continues straight there for some length, then goes back (left or right, respectively), and then continues straight to the third contact pad. For example, the first conductive path between the first and third contact pads will be provided with a rectangular or trapezoidal area of ​​conductive material, next to the trace or centered on the trace, and connected to the conductive path. The formation (or shaping) of this area allows the electrical extension of the path.

[0030] In an embodiment of the printed circuit board, the first conductive path includes a widening, which is in a staggered layout position with a similar widening of the second conductive path, allowing it to be formed by removing conductive material by laser ablation, milling, routing or etching. This can, for example, meandering, removing conductive material of the widening of the first conductive path and the similar widening of the second conductive path by laser ablation, milling, routing or etching, so that a shaped conductive path (e.g., a corrugated path, a meandering path, etc.) is generated at the widening.

[0031] In an embodiment of the printed circuit board, the first region or the second region is trapezoidal or hexagonal in shape. This enables, for example, the printed circuit board to be realized at minimal cost and high efficiency.

[0032] In an embodiment of the printed circuit board, one of the conductive paths comprises a trapezoidal or hexagonal portion so that a conductive path can be electrically elongated compared to a corresponding conductive path. This means that, for example, the trapezoidal or hexagonal portion of the conductive path can elongate the electrical length of the conductive path compared to the length of the corresponding conductive path. For example, a first conductive path may have a trapezoidal or hexagonal portion, while a second conductive path may not have a trapezoidal or hexagonal portion. In this case, the first conductive path comprises, for example, a longer electrical length than the second conductive path. Thus, the signal propagation delay of the first conductive path is extended relative to the signal propagation delay of the second conductive path. Thus, if the propagation delay of the second signal path is initially longer than the first signal path before removing (shaping) the material on the conductive structure, the difference in propagation delay between the first signal and the second signal is reduced.

[0033] In an embodiment, a printed circuit board may include a first contact pad configured to contact a first cable, a second contact pad configured to contact a second cable, a third contact pad configured to contact a device, a fourth contact pad configured to contact a device, a first conductive structure configured to form a first conductive path connecting the first contact pad and the third contact pad, and a second conductive structure configured to form a second conductive path connecting the second contact pad and the fourth contact pad. The first conductive structure and the second conductive structure may be configured to allow modification of the propagation delay by defining the shape of the first conductive path and the second conductive path. This means, for example, that the first conductive structure and / or the second conductive structure are widened at least in some parts, wherein conductive material may be removed in order to achieve, for example, a special shape of the first conductive path or the second conductive path, which may define the modification of the propagation delay. Due to the different shaping of the first conductive path relative to the second conductive path, the first conductive path may, for example, have a different length than the second conductive path. Thus, the first conductive path may include a different propagation delay than the second conductive path. By this modification, the propagation delay difference between the first cable and the second cable may be reduced. In this embodiment, the modification of the propagation delay may be implemented directly on the printed circuit board. Therefore, the board is very effective in reducing the propagation delay differences of the differential cable pairs and can reduce costs.

[0034] In an embodiment of the printed circuit board, a first line along which the first contact pad and the second contact pad are arranged may be parallel to a second line along which the third contact pad and the fourth contact pad are arranged. This means, for example, that at the beginning, before material is removed from at least one of the two conductive paths between the contact pads, the two conductive paths have the same electrical length, wherein the first conductive path between the first contact pad and the third contact pad is arranged parallel to the second conductive path arranged between the second contact pad and the fourth contact pad. Thus, only a small space is required on the printed circuit board for the conductive structure, whereby costs can be reduced and the production of the printed circuit board can be made more efficient.

[0035] In an embodiment of the printed circuit board, the first conductive structure comprises a conductive adjustment region and the second conductive structure comprises a similar conductive adjustment region. The first or second conductive adjustment region may be intended to allow the conductive material to be removed by laser ablation, milling or etching so that the shape and electrical length of the first conductive path or the second conductive path can be defined by the removal. The conductive adjustment region of the first conductive structure may be denoted as first region or first conductive region hereinafter, and the similar conductive adjustment region of the second conductive structure may be denoted as second region or second conductive region hereinafter. It is possible that the complete conductive structure defines the conductive adjustment region.

[0036] In an embodiment of the printed circuit board, the first region and / or the second region is trapezoidal or hexagonal in shape. The first region and / or the second region may be, for example, a complete conductive structure.

[0037] The method described above is based on the same considerations as the printed circuit board described above. Incidentally, the method can be implemented with all the features and functions also described for the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The drawings are not necessarily to scale, with emphasis generally being placed on illustrating the principles of the invention. In the following description, various embodiments of the invention are described with reference to the following drawings, in which:

[0039] Figure 1 A block diagram of a method for providing electrical connection is shown according to an embodiment of the present invention;

[0040] Figure 2 A schematic diagram of a printed circuit board is shown according to an embodiment of the present invention;

[0041] Figure 3 A schematic diagram of a printed circuit board having 13 conductive paths is shown according to an embodiment of the present invention;

[0042] Figure 4 A schematic diagram of a printed circuit board having a first conductive path and a second conductive path after processing is shown according to an embodiment of the present invention;

[0043] Figure 5 A schematic diagram of a printed circuit board having a first conductive path and a second conductive path before processing is shown according to an embodiment of the present invention;

[0044] Figure 6 A schematic diagram of a first conductive path and a second conductive path with an illustration of processing is shown in accordance with an embodiment of the present invention;

[0045] Figure 7a A schematic diagram of a printed circuit board having a first conductive path and a second conductive path before processing is shown according to an embodiment of the present invention;

[0046] Figure 7b A schematic diagram of a printed circuit board having a first conductive path and a second conductive path with an illustration of a process according to an embodiment of the present invention is shown;

[0047] Figure 7c A schematic diagram of a printed circuit board having a first conductive path and a second conductive path after processing is shown according to an embodiment of the present invention;

[0048] Figure 8Embodiments according to the present invention show printed circuit boards having different layouts for the first conductive paths;

[0049] Figure 9a An embodiment according to the present invention shows a sharp-angle conductive path of a printed circuit board;

[0050] Figure 9b According to an embodiment of the present invention, a trapezoidal conductive path of a printed circuit board is shown;

[0051] Fig.9c An embodiment according to the present invention shows a hexagonal conductive path of a printed circuit board;

[0052] Figure 9d An embodiment according to the present invention shows a corrugated / meandering conductive path of a printed circuit board; and

[0053] Fig.9e An embodiment according to the present invention shows a circular / meandering shaped conductive path of a printed circuit board. DETAILED DESCRIPTION

[0054] In the following description, the same or equivalent elements or elements having the same or equivalent functions are denoted by the same or equivalent reference numerals even if they appear in different drawings.

[0055] In the following description, a number of details are set forth to provide a more thorough description of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be implemented without these specific details. In other cases, well-known structures and devices are illustrated in block diagram form rather than in detail to avoid obscuring embodiments of the present invention. In addition, the features of the different embodiments described below may be combined with each other unless specifically noted otherwise.

[0056] Figure 1 A block diagram of a method 100 for providing an electrical connection is shown. The method 100 comprises the steps of connecting 110 a first cable to a first conductive structure on a printed circuit board, connecting 120 a second cable to a second conductive structure on the printed circuit board, and comparing 130 a propagation delay of a first signal path comprising the first cable and the first conductive structure on the printed circuit board, and a propagation delay of a second signal path comprising the second cable and the second conductive structure on the printed circuit board. Furthermore, the method 100 may comprise the step of removing 140 conductive material of the first conductive structure and / or the second conductive structure depending on the result of the comparison in order to modify the electrical length of the first conductive structure and / or the second conductive structure to obtain a first conductive path and a second conductive path, thereby reducing the difference in propagation delay between the first signal path and the second signal path.

[0057] Optionally, before comparing the propagation delay of the first signal path to the propagation delay of the second signal path, the propagation delays of the first and second signal paths may be determined 125 by time domain reflectometry measurements.

[0058] Optionally, a propagation delay difference may be determined 132 based on the propagation delays of the first and second signal paths, wherein based on the propagation delay difference, conductive material of the first conductive structure and / or the second conductive structure may be removed 140, thereby forming the first conductive path and the second conductive path, and such that the propagation delay difference is at least partially compensated. Determining 132 the propagation delay difference based on the propagation delays of the first and second signal paths does not necessarily have to be a step of its own. The step of comparing 130 the propagation delay of the first signal path and the propagation delay of the second signal path may already be the step of determining 132 the propagation delay difference based on the propagation delays of the first and second signal paths. This means, for example, that determining 132 the propagation delay difference based on the propagation delays of the first and second signal paths may be an example of the step of comparing 130 the propagation delay of the first signal path and the propagation delay of the second signal path.

[0059] Optionally, the method 100 may include shaping 142 a first conductive structure on the printed circuit board by removing conductive material so as to obtain therefrom a first conductive path having a first electrical length, and shaping 144 a second conductive structure on the printed circuit board by removing conductive material so as to obtain therefrom a second conductive path having a second electrical length, wherein the first electrical length is, for example, shorter than the second electrical length. The shaping steps 142 and 144 are not necessarily steps in their own right. They may, for example, be details of a step of removing 140 conductive material of the first conductive structure and / or the second conductive structure. Thus, the shaping steps 142 and 144 may define how the removal 140 of conductive material of the first conductive structure and / or the second conductive structure may be achieved.

[0060] Optionally, the method 100 may include the steps of removing 146 the conductive material of the first conductive structure so that the obtained first conductive path forms a straight line within the defined range of the first conductive path, and removing 148 the conductive material of the second conductive structure so that the obtained second conductive path forms a non-straight line within the corresponding defined range of the second conductive path. The removal steps 146 and 148 may be examples of the removal 140 of the conductive material of the first conductive structure and / or the second conductive structure. Thus, the removal steps 146 and 148 do not necessarily have to be their own steps.

[0061] In other words, the method 100 can adjust the offset of the differential pairs of the cable assembly. The conductors, e.g., the first cable and the second cable, can be soldered to the pads of the PCB (e.g., the contact pads connected to the conductive structure) without previously measuring the signal propagation time in the conductors. Thereafter, the signal propagation time of the single wire can be measured and stored. The design of the traces (e.g., the conductive paths) connecting the pads and the associated contact pads can include the possibility of subsequently adjusting the length of the traces by removing a portion of these structures, so that the propagation time within the differential pair can be matched. The partial removal of the traces, e.g., metal structures, can be accomplished by etching methods, milling / routing, laser ablation, or any other method that can remove metal trace material.

[0062] Avoiding the pre-measurement and sorting of the individual wires means reducing manual work and thus reducing the overall cost of the final cable assembly. In addition, it is also possible to avoid mixing the wires before welding, which can improve yield and / or quality.

[0063] In other words, in an embodiment of method 100, the cable line is cut to a defined length and the final connector can be applied on one side. The other side can be soldered to the PCB, as is usually applied to a pogo cable assembly in a pogo block, or as is applied to a board cable on the board connector side. No measurement or sorting is necessary before the soldering process. The subassembly is connected to a TDR (time domain reflectometer measurement), for example, and all the lines are then measured for their signal propagation delay, for example. Based on the measured values, the propagation delay of each single line can be adjusted. The adjustment can be made on the PCB (which can be part of the cable subassembly).

[0064] In other words, the method 100 may be used to adjust the electrical path length of a cable.

[0065] Figure 2 A schematic diagram of a printed circuit board 200 (PCB) is shown, which includes contact pads 2101 to 2102 for, for example, mating with a connector or a mating plug. n and contact pads 2121 to 212 for cable cores (eg, inner conductors) 2221, 2222 (signals) n (respectively solder pads), connecting contact pads 2121 to 212 n With contact pads 2101 to 210 n Conductive structures (eg, traces) 2301 to 230 n and an area 240 for grounding, where n may be a natural number.

[0066] The first cable 2201 and the second cable 2202 may be connected to the PCB by, for example, soldering the cable cores 2221 and 2222 to the contact pads 2121 and 2122. The first cable 2201 and the second cable 2202 may include cable cores 2221, 2222, inner dielectric insulators 2241, 2242, conductive shields 2261, 2262, and jackets 2281, 2282. The first cable 2201 and the second cable 2202 may, for example, represent a differential cable pair.

[0067] The present invention is based on the idea that the conductors, for example the first cable 2201 and the second cable 2202, can be cut to a defined length tolerance and then soldered to the PCB without prior measurement and without sorting. n The electrical propagation time to the end of the cable 2201, 2202 not connected to the PCB is measured for each line. n and contact pads 2101 to 210 n The conductive structures 2301 to 230 n In the example, it is possible to subsequently adjust the propagation time of each line (e.g., from contact pad 2101 to 210 n To the end of the cables 2201, 2202). The adjustment of the propagation time of each line / connection can be done, for example, after measuring the pre-assembly (cable / conductor plus PCB). In this way, the tolerance of the soldering position of the conductor to the PCB 200 will also be corrected. Thus, one can save the previous work of measuring, sorting and correctly sorting the soldering. In other words, the invention will avoid the pre-measurement and sorting of the conductors.

[0068] Figure 3 A schematic diagram of a printed circuit board 200 is shown, which includes contact pads 2101 to 210 13 , for contacting such as pogo or board connector, contact pads 2121 to 212 13 , for cable line (signal), conductive path 2301 to 230 13 , are traces, and pad 240 for soldering ground GND (cable shield). Two cables, namely the first cable 2201 and the second cable 2202, can be connected to the PCB 200 by, for example, soldering the cable cores 2221, 2222 to the contact pads 2121, 2122 and connecting the cable shields 2261, 2262 to the ground pad 240. The first cable 2201 and the second cable 2202 may also include inner dielectric insulators 2241, 2242 and jackets 2281, 2282. Thus, the first cable 2201 and / or the second cable 2202 may be coaxial cables.

[0069] The cable cores 2221 , 2222 may be copper cores, and the cable shields 2261 , 2262 may be copper shields.

[0070] The propagation delay adjustment according to the present invention can be performed by the conductive paths 2301 to 230 on the PCB 200. 13 For example, for the first cable 2201 and the second cable 2202, the signal propagation delay adjustment may occur in the region 250. The signal propagation delay of each line may be adjusted, for example, by forming the conductive structures 2301 to 230 13 and thereby giving each conductive path 2301 to 230 13 to achieve their respective lengths.

[0071] In addition, Figure 3 and Figure 2 In the example, only the first cable 2201 and the second cable 2202 are connected to the PCB 200, and each contact pad ( Figure 2 Contact pads 2121 to 212 n and Figure 3 Contact pads 2121 to 212 13 ) to connect the cables. Figure 3 In the embodiment, a total of up to 13 cables can be connected to PCB 200.

[0072] Figure 4 A schematic diagram of a printed circuit board 200 is shown, which includes: a first contact pad 2121 configured to contact a first cable 2201; a second contact pad 2122 configured to contact a second cable 2202; a third contact pad 2101 configured to contact a device 260; a fourth contact pad 2102 configured to contact a device 260; a first conductive path 2301 connecting the first contact pad 2121 and the third contact pad 2101; and a second conductive path 2302 connecting the second contact pad 2122 and the fourth contact pad 2102. In addition, Figure 4 In FIG. 2 , it is shown that the third contact pad 2101 and the fourth contact pad 2102 are configured to contact the same device 260 , but it is also possible that each contact pad is configured to contact an individual device.

[0073] The conductive material of the conductive structure 2322 connecting the second contact pad 2122 and the fourth contact pad 2102 is removed after defining the conductive structure 2322, thereby defining the second conductive path 2302, so that the propagation delay difference of the signal path including the first conductive path 2301 and the second conductive path 2302 is at least partially compensated. Figure 4The conductive structures 2321, 2322 in the figure are only schematic and do not necessarily have to be straight lines of rectangular geometric shapes. The conductive structures 2321, 2322 can have any shape, such as trapezoidal, hexagonal, circular, and can include bends or turns.

[0074] This means that, for example, for each cable, the first cable 2201 and the second cable 2202, a propagation delay can be measured. The first cable 2201 and the second cable 2202 may represent a differential cable pair, whereby it is desired that the signal propagated through the first cable 2201 arrives at the third contact pad 2101 and the signal propagated through the second cable 2202 arrives at the fourth contact pad 2102 almost simultaneously within a defined small tolerance. For example, if the signal propagating through the second cable 2202 is faster than the signal propagating through the first cable 2201, the propagation delay can be measured by, for example, Figure 4 The conductive material of the conductive structure (e.g., adjustment region) 2322 is removed (e.g., as shown by the shaded portion) in a manner to form a zigzag path as shown to extend the second conductive path 2302. The conductive material is removed from the first conductive structure 2321 (e.g., as shown by the shaded portion), for example, so that the first conductive path forms a straight line between the first contact pad 2121 and the third contact pad 2101. Figure 4 As shown in , the first conductive path 2301 is now a straight line, while the second conductive path 2302 has a portion that is a sharp angle. Thus, the second conductive path 2302 is longer than the first conductive path 2301, and by this modification, the signals propagating through the first cable 2201 and the signals propagating through the second cable 2202 can reach the third contact pad 2101 and the fourth contact pad 2102 almost at the same time. Thus, the removal of the conductive material of the conductive structure 232 can lead to at least partial compensation for the difference in propagation delay of the signal propagated through the first cable 2201 and the signal propagated through the second cable 2202.

[0075] Thus, the shape of the second conductive path 2302 on the printed circuit board 200 is electrically elongated by removing conductive material compared to the first conductive path 2301 on the printed circuit board 200 to at least partially compensate for the propagation delay difference between the first cable 2201 and the second cable 2202 .

[0076] In one embodiment, by subsequently removing the conductive material of the conductive structure 2321 , the first conductive path 2301 is shaped such that the trace width of the first conductive path 2301 is constant between the first contact pad 2121 and the third contact pad 2101 .

[0077] Both conductive paths 2301 and 2302 have similar trace geometry 2321, 2322 (e.g., similar conductive adjustment areas) before removing the conductive material, for example. After removing the conductive material, for example, the first conductive path 2301 is a straight line with a constant width, while the second conductive path 232 is a line with a constant width but a zigzag geometry.

[0078] In one embodiment, the first conductive path 2301 and the second conductive path 2302 may be arranged parallel to each other, except where the second conductive path 2302 includes an elongated area (e.g., the area of ​​the conductive structures 2321, 2322) produced by removing conductive material of the conductive structure. In one embodiment, the first conductive path 2301 and the second conductive path 2302 may be arranged parallel to each other, but include an adjustment area in each trace to allow propagation delay adjustment. In other words, the conductive paths 2301, 2302 may be arranged in a complete area parallel to each other (e.g., between each pad). They only include conductive structures (adjustment areas) that are configured to control the propagation delay difference (between the first signal path and the second signal path).

[0079] According to an embodiment, the first line 2701 along which the first contact pad 2121 and the second contact pad 2122 are arranged may be parallel to the second line 2702 along which the third contact pad 2101 and the fourth contact pad 2102 are arranged. Thus, the distance between the first contact pad 2121 and the third contact pad 2101 is the same as the distance between the second contact pad 2122 and the fourth contact pad 2102. The propagation delay of each line (the first line is, for example, the first cable 2201, the first contact pad 2121, the first conductive path 2301 with the first conductive structure 2321, and the contact pad 2101. The second line is, for example, the second cable 2202, the second contact pad 2122, the conductive path 2302 with the conductive structure 2322, and the fourth contact pad 2102.) may be measured under the same conditions, whereby no conductive material is removed from the conductive structures 2321, 2322 during the measurement. The shaded portions of the conductive structures 2321, 2322 are not modified in the first measurement of the propagation delay. When the propagation delay difference between the two lines is known, the conductive material of the conductive structures 2321 , 2322 may be removed so that the propagation delay difference is at least partially compensated.

[0080] In an embodiment, the printed circuit board 200 includes a connector connected to the third contact pad 2101 and the fourth contact pad 2102, wherein the connector is configured to be connected to a board. Thus, it is easy to connect the printed circuit board according to the present invention with the device 260.

[0081] In an embodiment of the printed circuit board 200 , one end of a first cable 2201 not connected to the printed circuit board 200 is attached to the connector, and one end of a second cable 2202 not connected to the printed circuit board 200 is attached to the connector.

[0082] Figure 5 A section of a printed circuit board is shown, including: a first contact pad 2121 configured to contact a first cable 2201; a second contact pad 2122 configured to contact a second cable 2202; a third contact pad 2101 configured to contact a device; a fourth contact pad 2102 configured to contact a device; a first conductive structure 2321 configured to form a first conductive path 2301 connecting the first contact pad 2121 and the third contact pad 2101; and a second conductive structure 2322 configured to form a second conductive path 2302 connecting the second contact pad 2122 and the fourth contact pad 2102. The first conductive structure 2321 (i.e., the first adjustment region) and the second conductive structure 2322 (i.e., the second adjustment region) are configured to allow modification of propagation delay. This may be an example of a printed circuit board before any modification.

[0083] According to one embodiment, the entire first conductive path 2301 between the pads 2101 and 2121 can be designed as a first conductive structure 2321 (i.e., the adjustment area (A1)), and similarly for other conductive paths. According to one embodiment of the printed circuit board, the first conductive structure 2321 and the second conductive structure 2322 can be arranged parallel to each other. Thus, it is easier to remove the conductive material of the conductive structures 2321 and 2322, and space on the printed circuit board can be saved and electrical performance can be improved.

[0084] Optionally, a first design reference line 2701 on which the first contact pad 2121 and the second contact pad 2122 are arranged may be parallel to a second design reference line 2702 on which the third contact pad 2101 and the fourth contact pad 2102 are arranged.

[0085] According to an embodiment, the first conductive structure 2321 comprises a conductive region and the second conductive structure 2322 comprises a similar conductive region. The first region and / or the second region is intended to allow the conductive material to be removed by laser ablation, milling or etching so that the shape and electrical length of the first conductive path 2301 or the second conductive path 2302 can be defined by the removal.

[0086] The first conductive structure 2321 and / or the second conductive structure 2322 may have a trapezoidal or hexagonal shape. Figure 5 , a trapezoidal shape is exemplarily illustrated.

[0087] exist Figure 5In the section of the printed circuit board (eg, a cut section), a ground pad 240 is also shown.

[0088] The first cable 2201 and the second cable 2202 may be coaxial cables. Thus, for example, the cable cores 2221, 2222 may be soldered to the contact pads 2121, 2122, and the cable shields 2261, 2262 may be soldered to the ground pad 240. The cable cores 2221, 2222 may be separated from the cable shields 2261, 2262 by inner dielectric insulators 2241, 2242.

[0089] The first conductive path 2301 and the second conductive path 2302 may, for example, include a copper material. These copper lines (eg, the first conductive path 2301 and / or the second conductive path 2302) may be explicitly extended to achieve, for example, a possible propagation time increase.

[0090] Figure 5 The details shown in can be, for example, Figure 2 A section of a printed circuit board 200 is shown in FIG.

[0091] If measurements of the complete signal path including welded cables 2201 , 2202 show that line A is x picoseconds shorter than line B, elongation may be achieved by (eg mechanical) post-processing (eg milling the traces, eg milling conductive structures 2321 , 2322 ).

[0092] This post-processing can be Figure 6 As can be seen in the figure, the figure shows that Figure 5 Details of the first conductive path 2301 and the second conductive path 2302 are shown.

[0093] like Figure 6 As shown in the figure, the black shaded areas 2341, 2342 can be removed. Graduation is also possible. According to one embodiment, the black shaded area 2341 represents a first area of ​​the printed circuit board, which is formed by removing the conductive material of the conductive structure 2321 by laser ablation, milling, routing or etching, and the position of the first area is closer to the cable side edge of the printed circuit board than the second area represented by the black shaded area 2342 of the printed circuit board, which is formed by removing the conductive material of the conductive structure by laser ablation, milling, routing or etching.

[0094] By removing the shaded area 2341 of the conductive structure 2321, the first conductive path 2301 is lengthened. And with the removal of the shaded area 2342 of the conductive structure 2322, the second conductive path 2302 can be geometrically made shorter (but electrically almost equal) than the first conductive path 2301. Thus, by this modification, the propagation delay difference of x picoseconds between line A and line B can be at least partially compensated.

[0095] The first conductive path 2301 and the second conductive path 2302 are arranged parallel to each other, except that the first conductive path 2301 is used to receive elongated trace segments 2381, 2382 generated by removing conductive material of the first conductive adjustment region 2321. Similar trace segments 2381, 2382 as shown for the first conductive path 2301 can be implemented for the second conductive path 2302. The decision for which path 2301 or 2302 to receive the elongated trace segment 2381, 2382 depends on, for example, which path 2301, 2302 must be elongated to at least partially compensate for the propagation delay difference between line A and line B.

[0096] Figure 7a , Figure 7b and Figure 7c For example, a diagram of three steps of a method for providing two electrical connections as a differential pair with a very small propagation delay difference therebetween may be shown.

[0097] Figure 7a A schematic diagram of a printed circuit board 200 is shown, which may include Figure 5 The same properties shown have the same functions. In region 250, the PCB traces (e.g., first conductive path 2301 and second conductive path 2302) have segments with larger widths (e.g., in conductive structure 2321 and second conductive structure 2322) to achieve an increase in signal propagation delay when needed.

[0098] Through Figure 7a The printed circuit board 200 shown with the assembled cables can perform TDR measurements to measure the propagation delay of line A and line B. Line A includes the third contact pad 2101, the conductive path 2301, the conductive structure 2321, the first contact pad 2121, and the first cable 2201. Line B includes, for example, the fourth contact pad 2102, the second conductive path 2302, the conductive structure 2322, the second contact pad 2122, and the second cable 2202.

[0099] If the TDR measurement shows that line A is electrically shorter than line B, then line A can be made longer, for example. This can be done by removing the marked area 2341 in signal path A. Physically, this can be achieved by milling, laser ablation or a defined etching process. The increased line width 2342 (i.e., enlargement) of line B can also be removed. According to one embodiment, the marked area 2341 represents a first area of ​​the printed circuit board, which is formed by removing the conductive material of the conductive structure 2321 by laser ablation, milling, routing or etching, and the first area is located closer to the cable side edge of the printed circuit board than the second area represented by the increased line width 2342 of the printed circuit board, which is formed by removing the conductive material of the conductive structure by laser ablation, milling, routing or etching.

[0100] Figure 7b Can be shown with Figure 7a Same properties and functionality as shown in .

[0101] Figure 7c It can also be shown that Figure 7b or Figure 7a The printed circuit board 200 shown has the same properties and functions as the printed circuit board 200 .

[0102] Figure 7c The printed circuit board 200 is shown, for example, after modification. As a result, the lines can be matched with very low propagation delay differences.

[0103] like Figure 7c As shown in , the first conductive path 2301 includes a trapezoidal portion, so that the first conductive path 2301 is electrically elongated compared to the corresponding second linear conductive path 2302.

[0104] An advantage of the invention described herein is that the cables 2201, 2202 do not need to be measured and sorted before the assembly step (avoiding mix-ups). In addition, the measurement of the wires can be performed in the produced cable assembly state and the post-processing (milling step) can be automated.

[0105] Figure 8 A printed circuit board according to an embodiment of the present invention is shown, which may include Figure 7a , Figure 7b and Figure 7c The printed circuit board 200 shown in FIG. Figure 8 As shown in , the area 2341 of the conductive structure 2321 can have a smaller increment. Thus, the first conductive path 2301 only requires a small space.

[0106] Figure 9a , 9b, 9c, 9d and 9e show a conductive path 230 having a conductive structure 232 according to an embodiment of the present invention. The conductive structure 232 can be configured to allow modification of the propagation delay by defining the shape of the conductive path 230. The conductive material marked by the shaded area 234 can be removed from the conductive structure 232 to modify the electrical length of the conductive structure 232 to obtain the conductive path 230.

[0107] The conductive path 230 may thus include a region 232 which is, for example, acutely angled (see Figure 9a ), trapezoid (see Figure 9b ), hexagon (see Fig.9c ), corrugated (see Figure 9d ) or round (see Fig.9e ). This list of shapes of conductive paths 230 should be considered exemplary and not exhaustive.

[0108] Although some aspects have been described in the context of an apparatus, it is clear that these aspects also represent a description of a corresponding method, where a block or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent a description of a corresponding block or item or feature of a corresponding apparatus.

[0109] The above embodiments are merely illustrative of the principles of the present invention. It is to be understood that modifications and variations to the arrangements and details described herein will be apparent to other persons skilled in the art. Therefore, it is intended that the scope of the independent patent claims alone be limited, rather than being limited by the specific details presented by the description and explanation of the embodiments herein.

Claims

1. A method (100) for providing an electrical connection, comprising: connecting (110) a first cable to a first conductive structure on a printed circuit board; connecting (120) a second cable to a second conductive structure on the printed circuit board; comparing (130) a propagation delay of a first signal path including the first cable and a first conductive structure on the printed circuit board and a propagation delay of a second signal path including the second cable and a second conductive structure on the printed circuit board; and Depending on a result of the comparison, conductive material of the first conductive structure and / or the second conductive structure is removed (140) so as to modify an electrical length of the first conductive structure and / or the second conductive structure to reduce a difference between a propagation delay of the first signal path and a propagation delay of the second signal path.

2. The method (100) of claim 1, wherein the propagation delay of the first signal path and the propagation delay of the second signal path are determined (125) by time domain reflectometry measurements.

3. The method (100) according to claim 1 or 2, comprising: shaping (142) a first conductive structure on the printed circuit board by removing conductive material so as to obtain therefrom a first conductive path having a first electrical length, and / or A second conductive structure on the printed circuit board is shaped (144) by removing conductive material to obtain a second conductive path having a second electrical length therefrom, wherein the first electrical length is shorter than the second electrical length.

4. The method (100) according to claim 1 or 2, comprising: removing (146) conductive material of the first conductive structure so that the resulting first conductive path forms a straight line within the confines of the first conductive path, and Conductive material of the second conductive structure is removed (148) such that the resulting second conductive path forms a non-straight line within a corresponding defined extent of the second conductive path.

5. A printed circuit board (200), comprising: A first contact pad (2121) configured to contact the first cable (2201); a second contact pad (2122) configured to contact the second cable (2202); a third contact pad (2101) configured to contact the device (260); a fourth contact pad (2102) configured to contact the device (260); A first conductive path (2301), connecting the first contact pad (2121) and the third contact pad (2101), and comprising a first conductive structure (2321); a second conductive path (2302), connecting the second contact pad (2122) and the fourth contact pad (2102), and comprising a second conductive structure (2322), wherein the conductive material of the second conductive structure (2322) connecting the second contact pad (2122) and the fourth contact pad (2102) is removed after defining the second conductive structure (2322), thereby defining the second conductive path (2302), so that the difference between the propagation delay of the signal path including the first conductive path (2301) and the propagation delay of the signal path including the second conductive path (2302) is at least partially compensated.

6. A printed circuit board (200) according to claim 5, wherein the shape of the second conductive path (2302) on the printed circuit board (200) is electrically elongated by removing conductive material compared to the first conductive path (2301) on the printed circuit board (200) to at least partially compensate for the propagation delay difference between the first cable (2201) and the second cable (2202).

7. A printed circuit board (200) according to claim 5 or 6, wherein the first conductive path (2301) is shaped so that the width of the first conductive path (2301) is constant between the first contact pad (2121) and the third contact pad (2101) by subsequently removing the conductive material of the first conductive structure (2321).

8. The printed circuit board (200) according to claim 5 or 6, wherein the printed circuit board (200) comprises a connector connected to the third contact pad (2101) and the fourth contact pad (2102), wherein the connector is configured to be connected to a board.

9. A printed circuit board (200) according to claim 5 or 6, wherein the end of the first cable (2201) not connected to the printed circuit board (200) is attached to a connector, and wherein the end of the second cable (2202) not connected to the printed circuit board (200) is attached to the connector.

10. A printed circuit board (200) according to claim 5 or 6, wherein a first area (2361) of the printed circuit board (200) formed by removing the conductive material of the first conductive structure by at least one of laser ablation, milling, routing or etching is located closer to the cable side edge of the printed circuit board than a second area (2362) of the printed circuit board (200) formed by removing the conductive material of the second conductive structure by at least one of laser ablation, milling, routing or etching.

11. The printed circuit board (200) according to claim 10, wherein the first region (2361) or the second region (2362) is trapezoidal or hexagonal in shape.

12. A printed circuit board (200) according to claim 5 or 6, wherein one of the first conductive path (2301) and the second conductive path (2302) includes a trapezoidal or hexagonal portion, so that the conductive path can be electrically elongated compared to the other conductive path of the first conductive path (2301) and the second conductive path (2302).

13. A printed circuit board (200), comprising: A first contact pad (2121) configured to contact the first cable (2201); a second contact pad (2122) configured to contact the second cable (2202); a third contact pad (2101) configured to contact the device (260); a fourth contact pad (2102) configured to contact the device (260); A first conductive structure (2321) configured to form a first conductive path (2301) connecting the first contact pad (2121) and the third contact pad (2101); a second conductive structure (2322) configured to form a second conductive path (2302) connecting the second contact pad (2122) and the fourth contact pad (2102); The first conductive structure (2321) and the second conductive structure (2322) are configured to allow modification of propagation delay by removing conductive material to define the shapes of the first conductive path (2301) and the second conductive path (2302).

14. The printed circuit board (200) according to claim 13, wherein the first design reference line (2701) is parallel to the second design reference line (2702), the first contact pad (2121) and the second contact pad (2122) are arranged along the first design reference line, and the third contact pad (2101) and the fourth contact pad (2102) are arranged along the second design reference line.

15. The printed circuit board (200) according to claim 13 or 14, wherein the first conductive structure (2321) comprises a first conductive adjustment region (A1), and the second conductive structure (2322) comprises a second conductive adjustment region (A2); The first conductive adjustment region (A1) or the second conductive adjustment region (A2) is intended to allow the conductive material to be removed by laser ablation, milling or etching so that the shape and electrical length of the first conductive path (2301) or the second conductive path (2302) can be defined by the removal.

16. The printed circuit board (200) according to claim 15, wherein the first conductive adjustment region (A1) and / or the second conductive adjustment region (A2) is / are in a trapezoidal or hexagonal shape.

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