A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals

Abstract

The present invention discloses a substrate-integrated half-fin line circuit structure suitable for broadband terahertz signals, including a top circuit board, an intermediate support plate and a bottom circuit board, wherein the top circuit board and the intermediate support plate are separated by a first support ridge and a second support ridge on both sides, and the intermediate support plate and the bottom circuit board are separated by a third support ridge and a fourth support ridge on both sides, and there are gaps between the first support ridge and the second support ridge, and between the third support ridge and the fourth support ridge. The substrate-integrated half-fin line circuit structure of the present invention is formed by laminating a plurality of printed circuit boards to form a cavity, and a filling medium is filled in the cavity to meet the needs of radar, communication and other fields for substrate-integrated half-fin line circuit structures with large bandwidth, small size, light weight and high quality factor.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits. Background Art

[0002] The production of broadband terahertz signal substrates has multiple printed circuit boards, which are usually assembled by simple stacking. Although this assembly method is simple and low in cost, it has poor reliability and low pressure resistance during actual use, and the broadband terahertz signal generated is unstable. Summary of the invention

[0003] The technical problem to be solved by the present invention is to realize a substrate integrated half-fin line circuit structure suitable for broadband terahertz signals.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a substrate integrated half-fin line circuit structure suitable for broadband terahertz signals, composed of multiple printed circuit boards, the printed circuit board includes a top circuit board and a bottom circuit board, the printed circuit board includes an intermediate support plate arranged between the top circuit board and the bottom circuit board, the top circuit board and the intermediate support plate are separated by a first support ridge and a second support ridge on both sides, the intermediate support plate and the bottom circuit board are separated by a third support ridge and a fourth support ridge on both sides, and there are gaps between the first support ridge and the second support ridge, and between the third support ridge and the fourth support ridge.

[0005] The upper surface and the lower surface of the top circuit board and the bottom circuit board both have conductive planes, and the conductive planes of the top circuit board and the bottom circuit board are connected by conductors.

[0006] The upper surface and the lower surface of the middle support plate both have conductive planes, and the conductive planes on both sides of the middle support plate are both composed of two unconnected conductive sheets.

[0007] The conductive planes on both sides of the middle support plate are AC short-circuited with the conductive plane of the top circuit board, and the conductive planes on both sides of the middle support plate are AC short-circuited with the conductive plane of the bottom circuit board.

[0008] The conductive planes on both sides of the middle support plate are composed of two unconnected large conductive sheets and a small conductive sheet. The small conductive sheet and the conductive plane of the top circuit board together constitute an electrical wall boundary, and the small conductive sheet and the conductive plane of the bottom circuit board together constitute an electrical wall boundary.

[0009] The printed circuit boards are all made of FR-4 material.

[0010] The medium in the gap is air.

[0011] The conductive planes are parallel to each other.

[0012] The substrate integrated half-fin line circuit structure of the present invention is formed by pressing together multiple printed circuit boards to form a cavity, and a filling medium is filled in the cavity to meet the needs of radar, communication and other fields for a substrate integrated half-fin line circuit structure with large bandwidth, small size, light weight and high quality factor. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The following is a brief description of the contents expressed in each figure in the specification of the present invention and the marks in the figure:

[0014] Figure 1 An exploded schematic diagram of a substrate-integrated half-fin circuit structure;

[0015] Figure 2 It is a schematic diagram of the assembly of the substrate integrated half-fin circuit structure;

[0016] The markings in the above figures are: 1. top circuit board; 2. middle support board; 3. bottom circuit board; 4. first support ridge; 5. second support ridge; 6. third support ridge; 7. fourth support ridge. DETAILED DESCRIPTION

[0017] The following is a further detailed description of the specific implementation methods of the present invention, such as the shape, structure, relative position and connection relationship between the various components involved, the function and working principle of each part, the manufacturing process and operation method, etc., through the description of the embodiments with reference to the accompanying drawings, so as to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of the present invention.

[0018] Substrate integrated half-fin circuit structure suitable for broadband terahertz signals Figure 1 As shown, it is formed by pressing together multiple printed circuit boards, all of which are made of FR-4 material. The circuit boards include a top circuit board 1 and a bottom circuit board 3. The top circuit board 1 and the bottom circuit board 3 are parallel to each other. There is an intermediate support plate 2 between the top circuit board 1 and the bottom circuit board 3, which is parallel to the two. The intermediate support plate 2 is used to realize the installation of components with specific functions.

[0019] The first support ridge 4 and the second support ridge 5 are provided on both sides of the upper surface of the middle support plate 2, and the top circuit board 1 is supported by the first support ridge 4 and the second support ridge 5. The third support ridge 6 and the fourth support ridge 7 are provided on both sides of the lower surface of the middle support plate 2, and the bottom circuit board 3 is supported by the third support ridge 6 and the fourth support ridge 7. There are cavities between the first support ridge 4 and the second support ridge 5, and between the third support ridge 6 and the fourth support ridge 7. The cavity gap is filled with a filling medium to form a semi-fin line circuit structure. The addition of fins, compared with the traditional SIW, mainly brings a wider bandwidth, and the advantage of the upper and lower layers of parallel ridges is that it is easier to manufacture than another structure.

[0020] The top and bottom surfaces of the top circuit board 1 and the bottom circuit board 3 both have conductive planes. In the figure, the conductive planes of the top circuit board 1 and the bottom circuit board 3 are the outermost of the structure. The small holes on them are all VIAs produced by the PCB process. The conductive planes of the top circuit board 1 and the bottom circuit board 3 are connected by conductors. The upper and lower surfaces of the middle support plate 2 also have conductive planes. The conductive planes on both sides of the middle support plate 2 are composed of two unconnected conductive sheets. The conductive planes on both sides of the middle support plate 2 are AC short-circuited with the conductive plane of the top circuit board 1 (indicating that the AC signal can pass through the two without obstacles, and there is no AC potential difference between the two). The conductive planes on both sides of the middle support plate 2 are AC short-circuited with the conductive plane of the bottom circuit board 3. The electric field direction of the conductive plane of the middle support plate 2 is parallel to the conductive planes of the top circuit board 1 and the bottom circuit board 3. Preferably, the conductive planes on both sides of the middle support plate 2 are composed of two unconnected large conductive sheets and a small conductive sheet. The small conductive sheet and the conductive plane of the top circuit board 1 together constitute an electric wall boundary (indicating that the direction of the electric field is the same as the normal direction of the boundary and does not have a specific physical structure), and the small conductive sheet and the conductive plane of the bottom circuit board 3 together constitute an electric wall boundary.

[0021] The present invention is described above by way of example in conjunction with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A substrate-integrated half-fin circuit structure suitable for broadband terahertz signals, consisting of multiple printed circuit boards, characterized in that: The printed circuit board comprises a top circuit board and a bottom circuit board, wherein an intermediate support plate is arranged between the top circuit board and the bottom circuit board, the top circuit board and the intermediate support plate are separated by a first support ridge and a second support ridge on both sides, the intermediate support plate and the bottom circuit board are separated by a third support ridge and a fourth support ridge on both sides, and there is a gap between the first support ridge and the second support ridge, and between the third support ridge and the fourth support ridge; The upper surface and the lower surface of the middle support plate both have conductive planes, and the conductive planes on both sides of the middle support plate are both composed of two unconnected conductive sheets.

2. The substrate integrated half-fin line circuit structure suitable for broadband terahertz signals according to claim 1, characterized in that: The conductive planes on both sides of the middle support plate are AC short-circuited with the conductive plane of the top circuit board, and the conductive planes on both sides of the middle support plate are AC short-circuited with the conductive plane of the bottom circuit board.

3. The substrate integrated half-fin line circuit structure suitable for broadband terahertz signals according to claim 2, characterized in that: The conductive planes on both sides of the middle support plate are composed of two unconnected large conductive sheets and a small conductive sheet. The small conductive sheet and the conductive plane of the top circuit board together constitute an electrical wall boundary, and the small conductive sheet and the conductive plane of the bottom circuit board together constitute an electrical wall boundary.

4. The substrate integrated half-fin line circuit structure suitable for broadband terahertz signals according to claim 2 or 3, characterized in that: The printed circuit boards are all made of FR-4 material.

5. The substrate integrated half-fin line circuit structure suitable for broadband terahertz signals according to claim 4, characterized in that: The medium in the gap is air.

6. The substrate integrated half-fin line circuit structure suitable for broadband terahertz signals according to claim 5, characterized in that: The conductive planes are parallel to each other.

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