A substrate integrated half-fin line circuit structure suitable for broadband millimeter wave signals

Abstract

The present invention discloses a substrate-integrated half-fin line circuit structure suitable for broadband millimeter-wave signals, which is composed of multiple printed circuit boards, wherein the printed circuit board includes a top circuit board and a bottom circuit board, wherein the top circuit board and the bottom circuit board are separated by a left supporting ridge and a right supporting ridge on both sides, and an intermediate layer contacting the top circuit board and the bottom circuit board is provided between the left supporting ridge and the right supporting ridge, and there are gaps between the left supporting ridge and the intermediate layer, and between the right supporting ridge and the intermediate layer. The present invention is suitable for a substrate-integrated half-fin line circuit for broadband millimeter-wave signals, which is formed by laminating multiple printed circuit boards to form a cavity, and a filling medium is filled in the cavity, the top and bottom circuit boards have complete conductive planes and are connected by conductors, and the intermediate layer has calculated ridges, which are AC short-circuited with the conductive planes of the top and bottom circuit boards, forming the substrate-integrated half-fin line circuit structure to achieve system requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuits. Background Art

[0002] During production, the substrate of broadband millimeter-wave signals is composed of multiple printed circuit boards, which are usually assembled by simple stacking. Although this assembly method is simple and has low assembly cost, it has poor reliability and low pressure resistance during actual use, and the generated broadband millimeter-wave signals are unstable. Summary of the invention

[0003] The technical problem to be solved by the present invention is to realize a substrate integrated half-fin line circuit structure suitable for broadband millimeter wave signals.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a substrate integrated half-fin line circuit structure suitable for broadband millimeter wave signals, composed of multiple printed circuit boards, the printed circuit boards include a top circuit board and a bottom circuit board, the top circuit board and the bottom circuit board are separated by a left supporting ridge and a right supporting ridge on both sides, an intermediate layer contacting the top circuit board and the bottom circuit board is provided between the left supporting ridge and the right supporting ridge, and there are gaps between the left supporting ridge and the intermediate layer, and between the right supporting ridge and the intermediate layer.

[0005] The upper surface and the lower surface of the top circuit board and the bottom circuit board both have conductive planes, and the conductive planes of the top circuit board and the bottom circuit board are connected by conductors.

[0006] The upper surface and the lower surface of the middle layer both have conductive planes, the conductive plane of the middle layer is AC short-circuited with the conductive plane of the top circuit board, and the conductive plane of the middle layer is AC short-circuited with the conductive plane of the bottom circuit board.

[0007] The upper surface and the lower surface of the intermediate layer have the same conductive plane pattern, and the two are connected by regularly distributed conductors.

[0008] The conductive planes are parallel to each other.

[0009] The printed circuit boards are all made of FR-4 material.

[0010] The medium in the gap is air.

[0011] The present invention is suitable for a substrate-integrated half-fin line circuit for broadband millimeter wave signals. The circuit is formed by pressing together a plurality of printed circuit boards to form a cavity, in which a filling medium is filled. The top and bottom circuit boards have complete conductive planes and are connected by conductors. The middle layer has a calculated ridge, which is AC short-circuited with the conductive planes of the top and bottom circuit boards to form the substrate-integrated half-fin line circuit structure to meet system requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The following is a brief description of the contents expressed in each figure in the specification of the present invention and the marks in the figure:

[0013] Figure 1 An exploded schematic diagram of a substrate-integrated half-fin circuit structure;

[0014] Figure 2 It is a schematic diagram of the assembly of the substrate integrated half-fin circuit structure;

[0015] The markings in the above figures are: 1. Top layer circuit board; 2. Bottom layer circuit board; 3. Left support spine; 4. Middle layer; 5. Right support spine. DETAILED DESCRIPTION

[0016] The following is a further detailed description of the specific implementation methods of the present invention, such as the shape, structure, relative position and connection relationship between the various components involved, the function and working principle of each part, the manufacturing process and operation method, etc., through the description of the embodiments with reference to the accompanying drawings, so as to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of the present invention.

[0017] Substrate integrated half-fin circuit structure suitable for broadband millimeter wave signals Figure 1 As shown, it is formed by pressing together multiple printed circuit boards, generally including two printed circuit boards, namely a top circuit board 1 and a bottom circuit board 2. The printed circuit boards are all made of FR-4 material. The top circuit board 1 and the bottom circuit board 2 are parallel to each other. The top circuit board 1 and the bottom circuit board 2 are supported by a left supporting ridge 3 and a right supporting ridge 5. An intermediate layer 4 is provided between the left supporting ridge 3 and the right supporting ridge 5 to contact the top circuit board 1 and the bottom circuit board 2. The intermediate layer 4 is used to realize the installation of components with specific functions, and the components are lumped parameter devices.

[0018] There is a gap between the left supporting ridge 3 and the middle layer 4, and between the right supporting ridge 5 and the middle layer 4. This gap is a cavity, which is filled with a medium, which can be air, and forms a semi-fin circuit structure with the top circuit board 1 and the bottom circuit board 2. The addition of fins has the main advantage of wider bandwidth compared to traditional SIW, and the advantage of parallel ridges is that it is easier to manufacture than the other structure.

[0019] The top and bottom surfaces of the top circuit board 1 and the bottom circuit board 2 both have conductive planes. In the figure, the conductive planes of the top circuit board 1 and the bottom circuit board 3 are the outermost of the structure, and the small holes on them are all VIAs produced by the PCB process. The middle layer 4 has a calculated conductive plane of the middle layer 4. The conductive plane of the middle layer 4 is divided into upper and lower pieces with the same pattern and connected by regularly distributed conductors. The top circuit board 1 and the bottom circuit board 2 have complete conductive planes and are connected by conductors. The conductive plane of the middle layer 4 is AC short-circuited with the conductive planes of the top circuit board 1 and the bottom circuit board 2 (indicating that the AC signal can pass through without obstacles between the two, and there is no AC potential difference between the two). The electric field direction is perpendicular to the top and bottom circuit boards 2, and together with the conductive planes of the top circuit board 1 and the bottom circuit board 2, it forms an electric wall boundary (indicating that the electric field direction is the same as the normal direction of the boundary and does not have a specific physical structure).

[0020] The above-mentioned substrate-integrated half-fin line circuit structure suitable for broadband millimeter-wave signals can solve the needs of radar, communication and other fields for substrate-integrated half-fin line circuit structures with large bandwidth, small size, light weight and high quality factor.

[0021] The present invention is described above by way of example in conjunction with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the present invention, or the concept and technical solution of the present invention are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.

Claims

1. A substrate integrated half-fin circuit structure suitable for broadband millimeter wave signals, consisting of multiple printed circuit boards, characterized in that: The printed circuit board comprises a top circuit board and a bottom circuit board, wherein the top circuit board and the bottom circuit board are separated by a left supporting ridge and a right supporting ridge on both sides, an intermediate layer contacting the top circuit board and the bottom circuit board is arranged between the left supporting ridge and the right supporting ridge, and there are gaps between the left supporting ridge and the intermediate layer, and between the right supporting ridge and the intermediate layer; The upper surface and the lower surface of the top circuit board and the bottom circuit board both have conductive planes, and the conductive planes of the top circuit board and the bottom circuit board are connected by a conductor; The upper surface and the lower surface of the middle layer both have conductive planes, the conductive plane of the middle layer is AC short-circuited with the conductive plane of the top circuit board, and the conductive plane of the middle layer is AC short-circuited with the conductive plane of the bottom circuit board; The middle layer is used for mounting components, and the components are lumped parameter devices.

2. The substrate integrated half-fin line circuit structure suitable for broadband millimeter wave signals according to claim 1, characterized in that: The upper surface and the lower surface of the intermediate layer have the same conductive plane pattern, and the two are connected by regularly distributed conductors.

3. The substrate integrated half-fin line circuit structure suitable for broadband millimeter wave signals according to claim 2, characterized in that: The conductive planes are parallel to each other.

4. The substrate integrated half-fin line circuit structure suitable for broadband millimeter wave signals according to any one of claims 1 to 3, characterized in that: The printed circuit boards are all made of FR-4 material.

5. The substrate integrated half-fin line circuit structure suitable for broadband millimeter wave signals according to claim 4, characterized in that: The medium in the gap is air.

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