A chip component electroplating device

Abstract

The present invention discloses a patch element electroplating device, comprising an electroplating tank and a roller rotatably arranged in the electroplating tank, the rotation axis of the roller extending horizontally; an opening is provided on the roller, a cover plate is rotatably arranged on the opening, and a reset member for keeping the cover plate sealed at the opening is provided on the cover plate; a roller is provided on the outer side of the cover plate away from the rotation axis of the cover plate, and the rotation axis of the roller and the rotation axis of the cover plate are parallel to the rotation axis of the roller; a curved magnetic part is also fixed in the electroplating tank, the magnetic part extends in an arc shape from the upper left of the roller to the upper right direction of the roller, and the magnetic part is arranged at intervals on the outer side of the roller. The patch element electroplating device of the present invention can stably perform roller plating of small-sized patch elements, obtain good plating quality, and improve electroplating efficiency.

Description

Technical Field

[0001] The invention relates to the field of electroplating, and in particular to a patch component electroplating device. Background Art

[0002] The multifunctional requirements of electronic devices require that patch components be small in size. For example, in the prior art, patch components with a length of 0.6 mm and a width of 0.3 mm have been widely used. Further, the application of patch components with a length of 0.4 mm and a width of 0.2 mm is becoming popular, and smaller patches, such as those with a length of 0.25 mm and a width of 0.125 mm, are also being developed. In order to meet the solderability and solder resistance requirements of surface mounting, in the manufacturing process of patch components, after the end electrodes are formed, it is generally necessary to form a nickel layer and a tin layer on the end electrodes by roller plating, i.e., drum electroplating. For small-sized patch components such as those mentioned above, the size of the holes on the drum must be small enough to prevent the patch components from leaking out of the drum; however, holes that are too small make it difficult for the plating solution to circulate, and the metal ion concentration in the plating solution cannot remain stable, which reduces the quality of the coating and reduces the efficiency of roller plating. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a patch component electroplating device that can solve the technical problem: in the prior art, due to the small size of the patch and the small holes on the roller, the electroplating solution is difficult to circulate, the metal ion concentration in the electroplating solution cannot be kept stable, the quality of the coating is reduced, and the roller plating efficiency is low.

[0004] In order to achieve the above-mentioned object, the present invention provides a patch component electroplating device, comprising an electroplating tank and a roller rotatably arranged in the electroplating tank, wherein the roller is provided with a through hole, and the rotation axis of the roller extends horizontally;

[0005] The drum is provided with an opening, a cover plate is rotatably provided on the opening, and a reset member for keeping the cover plate sealing the opening is provided on the cover plate;

[0006] A roller is provided on the outer side of the cover plate away from the rotation axis of the cover plate, and the rotation axis of the roller and the rotation axis of the cover plate are parallel to the rotation axis of the drum;

[0007] A curved magnetic part is also fixed in the electroplating tank. The magnetic part extends in an arc shape from the upper left of the roller to the upper right of the roller. The magnetic part is arranged at intervals on the outside of the roller. The interval between the magnetic part and the roller can be adsorbed and connected with the magnetic part to open an opening when the roller rotates close to the magnetic part, and the adsorption connection with the magnetic part is disconnected to close the opening when the roller rotates away from the magnetic part.

[0008] As a preferred solution, the magnetic member includes a magnetic adsorption section and a magnetic connection section with a smooth transition from left to right;

[0009] The distance between the magnetic adsorption section and the outer side of the roller gradually increases, so that when the roller rotates close to the magnetic adsorption section, it is adsorbed and rotated with the magnetic adsorption section, so as to drive the rotation angle of the cover plate to gradually increase;

[0010] The distance between the magnetic connection section and the roller remains unchanged, so that the angle of the cover plate remains unchanged when the cover plate is rotated to the maximum.

[0011] As a preferred solution, the lowest point of the magnetic adsorption section is higher than the center line of the roller, and the lowest point of the magnetic connection section is higher than the center line of the roller;

[0012] The angle between the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller and the horizontal line is 30° to 150°;

[0013] The angle between the vertical connection between the lowest point of the magnetic connection section and the center line of the roller and the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller is 30° to 150°.

[0014] As a preferred solution, the angle between the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller and the horizontal line is 60° to 90°;

[0015] The angle between the vertical connection between the lowest point of the magnetic connection section and the center line of the roller and the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller is 90° to 150°.

[0016] As a preferred solution, the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller is set as OP, the vertical connection between the lowest point of the magnetic connection section and the center line of the roller is set as OQ, and the angle between OP and OQ is 30° to 150°.

[0017] As a preferred solution, when the roller rotates close to the magnetic member and is closest to the magnetic member, there is a gap between the lowest point of the magnetic adsorption section and the roller.

[0018] As a preferred solution, the gap is 1 mm to 2 mm.

[0019] As a preferred solution, the width of the left end of the magnetic member is greater than the length of the roller;

[0020] The width of the right side of the magnetic member gradually decreases from the middle of the magnetic member to the end of the magnetic member.

[0021] As a preferred solution, the reset member is a reset spring, the cover plate is rotatably mounted on one side of the opening via a cover plate rotating shaft, and the reset spring is mounted on the cover plate rotating shaft.

[0022] As a preferred solution, a stopper is provided on the cover plate or at the drum opening for stopping the cover plate from rotating into the opening.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] The patch component electroplating device of the present invention comprises an electroplating tank and a roller rotatably arranged in the electroplating tank, the rotation axis of the roller extends horizontally, and the roller is specifically arranged horizontally and rotates horizontally; an opening is provided on the roller, and a cover plate is rotatably arranged on the opening, and a reset member for keeping the cover plate in a sealed opening state is provided on the cover plate; a roller is provided on the outer side of the cover plate away from the rotation axis of the cover plate, and the rotation axis of the roller and the rotation axis of the cover plate are parallel to the rotation axis of the roller; in this way, the rotation of the roller drives the cover plate and the roller to rotate along the same center line; a curved magnetic member is also fixed in the electroplating tank, and the magnetic member It extends in an arc shape from the upper left of the roller to the upper right of the roller, and the magnetic parts are arranged at intervals on the outside of the roller. The interval between the magnetic parts and the roller can be adsorbed and connected with the magnetic parts to open the opening when the roller rotates close to the magnetic parts, and the adsorption connection with the magnetic parts can be disconnected to close the opening when the roller rotates away from the magnetic parts. In this way, during the adsorption process of the roller and the magnetic parts, the opening can be opened to allow the plating liquid in the plating tank to enter the roller through the opening, which solves the contradiction between the leakage of the patch components from the roller and the difficulty of the plating liquid circulation, and can stably perform roller plating of small-sized patch components, obtain good plating quality, and improve electroplating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of the patch component electroplating device of the present invention;

[0026] Figure 2 It is a cross-sectional view of the cover when the cover is completely closed;

[0027] Figure 3 A schematic diagram of the structure of the magnetic component;

[0028] Figure 4 It is a structural schematic diagram of the initial state of the drum rotation;

[0029] Figure 5 It is a structural schematic diagram of the intermediate state of the drum rotation;

[0030] Figure 6 It is a structural schematic diagram of the roller rotating until the shaft and the magnetic part begin to be magnetically adsorbed;

[0031] Figure 7 It is a structural schematic diagram of the drum rotating until the shaft moves to point S;

[0032] Figure 8It is a structural schematic diagram of the roller rotating until the shaft and the magnetic part are about to end magnetic adsorption;

[0033] Fig. 9 It is a structural schematic diagram of the drum rotating until the shaft is disconnected from the magnetic part.

[0034] In the figure, 1, roller; 2, magnetic part; 3, material; 4, electroplating tank; 5, electroplating solution; 11, opening; 12, cover plate; 13, handle; 14, roller; a, length of the roller; b, side length of the opening parallel to the axial direction of the roller; O, axis of the roller; P, point on the front end of the cross section of the magnetic part; Q, point on the end of the cross section of the magnetic part; S, point between P and Q on the cross section of the magnetic part; A︵B, arc length of the cover plate; α, angle between OP and the horizontal line; β, angle between OQ and line segment OP. DETAILED DESCRIPTION

[0035] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0036] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be understood that the terms "first", "second", etc. are used in the present invention to describe various information, but such information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the "first" information may also be referred to as the "second" information, and similarly, the "second" information may also be referred to as the "first" information.

[0037] The preferred embodiment of the patch component electroplating device of the present invention is specifically referred to Figure 1-Figure 9As shown, it includes an electroplating tank 4 and a roller 1 rotatably arranged in the electroplating tank 4, the rotation axis of the roller 1 extends horizontally, the roller 1 is specifically arranged horizontally and rotates horizontally, and there is material in the roller 1; an opening 11 is provided on the roller 1, and a cover plate 12 is rotatably provided on the opening 11, and a reset member for keeping the cover plate 12 in a sealed opening state is provided on the cover plate 12; a roller 14 is provided on the outer side of the cover plate 12 away from the rotation axis of the cover plate 12, and the rotation axis of the roller 14 and the rotation axis of the cover plate 12 are parallel to the rotation axis of the roller 1; in this way, the rotation of the roller 1 drives the cover plate 12 and the roller 14 to rotate along the same center line; a curved magnetic member 2 is also fixedly provided in the electroplating tank 4, and the magnetic The magnetic part 2 extends in an arc shape from the upper left of the roller 1 to the upper right direction of the roller 1, and the magnetic part 2 is arranged at intervals on the outside of the roller 1. The interval between the magnetic part 2 and the roller 1 can be adsorbed and connected with the magnetic part 2 to open the opening 11 when the roller 14 rotates close to the magnetic part 2, and the adsorption connection with the magnetic part 2 is disconnected to close the opening 11 when the roller 14 rotates away from the magnetic part 2. In this way, during the adsorption process of the roller 14 and the magnetic part 2, the opening 11 can be opened to allow the plating solution in the plating tank 4 to enter the roller 1 through the opening 11, which solves the problems of leakage of the patch component from the roller 1 and the difficulty in the circulation of the plating solution, and can stably perform the roller plating of small-sized patch components, obtain good plating quality, and improve the electroplating efficiency.

[0038] In the embodiment of the present application, the drum 1 is a hollow straight cylinder; the length of the drum 1 is a. The radius of the circular cross section of the drum 1 is r, and the circumference of the circular cross section of the drum 1 is c. In other embodiments of the present application, the drum 1 may be a hollow regular hexagonal prism or a hollow regular octagonal prism, etc.

[0039] There are multiple through holes (not shown) on at least one side of the drum 1, the diameter of which is slightly smaller than the size of the patch component to ensure that the patch component and the electroplating medium cannot pass through the through holes, but the through holes can still allow a small amount of electroplating liquid to flow. Preferably, through holes are also provided on the two bottom surfaces of the drum 1 to facilitate the circulation of the electroplating liquid.

[0040] In this embodiment, the opening 11 is square, and in other embodiments, the opening 11 may also be other shapes such as trapezoidal or elliptical. The length of the side of the opening 11 parallel to the axial direction of the drum 1 is b, b<a, preferably, 0.5a<b<a.

[0041] In this embodiment, the arc length of the cover plate 12 is A︵B, wherein 0.1c<A︵B<0.2c. The cover plate 12 is opened or closed in a flipping manner with a side of the opening 11 parallel to the axial direction of the drum 1 as the rotation axis. A stopper is provided on the cover plate 12 or at the opening 11 of the drum 1 to stop the cover plate 12 from rotating into the opening 11. The stopper is specifically a stopper block or a stopper boss, so that the cover plate 12 can only be opened toward the outside of the drum 1. The maximum flip angle of the cover plate 12 can be 5° to 90°, preferably 30° to 60°, so that the cover plate 12 does not block the flow of the electroplating solution when it is in the open state.

[0042] The reset member is specifically a reset spring, which keeps the cover plate 12 closed at normal times, and can be opened when subjected to tension. When the cover plate 12 is closed, the opening 11 of the drum 1 can be sealed. When the cover plate 12 is closed, the inner side surface of the cover plate 12 is flush with the inner side surface of the drum 1 or as shown in FIG. Figure 2 As shown, the inner side of the cover plate 12 is slightly protruded than the inner side of the drum 1. In this embodiment, the inner side of the cover plate 12 is slightly protruded than the inner side of the drum 1.

[0043] A handle 13 is provided on the side of the cover plate 12 opposite to the rotating shaft, and a roller 14 is provided on the handle 13. The handle 13 passes through the axis center of the roller 14. The roller 14 is rotatably mounted on the handle 13, and the roller 14 can roll freely on the handle 13. The diameter of the roller 14 can be 8 mm to 15 mm, and the length of the roller 14 can be 2 mm to 10 mm. The material of the roller 14 is nickel, iron or cobalt.

[0044] Figure 3 Schematic diagram of the structure of the magnetic member 2. When the drum 1 is placed horizontally (the axis of the drum 1 is kept horizontal), the magnetic member 2 is arranged above the drum 1, and the front end of the magnetic member 2 is closest to the side of the drum 1, and then extends to the end and gradually away from the side of the drum 1, reaching the maximum distance from the side of the drum 1 at a certain point S between the two ends, and then continues to extend to the end along the trajectory of the cylindrical surface, and the arc of the circular cross section of the cylindrical surface is concentric with the arc on the circular cross section of the drum 1.

[0045] Among them, the magnetic part 2 in the present application includes a smoothly transitioned magnetic adsorption section 21 and a magnetic connection section 22 from left to right; the distance between the magnetic adsorption section 21 and the outer side of the drum 1 gradually increases, so that when the roller rotates close to the magnetic adsorption section 21, it is adsorbed and rotated with the magnetic adsorption section 21, so as to drive the rotation angle of the cover plate 12 to gradually increase; the distance between the magnetic connection section 22 and the drum 1 remains unchanged, so that the angle of the cover plate 12 remains unchanged when it rotates to the maximum; and the lowest point of the magnetic adsorption section 21 is higher than the center line of the drum 1, and the lowest point of the magnetic connection section 22 is higher than the center line of the drum 1.

[0046] Specifically, Figure 4As shown, point S on the magnetic member 2 is the turning point of the magnetic adsorption section 21 and the magnetic connection section 22. The turning point means that from point P to point S, each point on the magnetic member 2 continues to gradually move away from the side of the drum 1; and from point S to point Q, the distances from each point on the magnetic member 2 to the side of the drum 1 are equal, that is, each point from S to Q on the magnetic member 2 forms an arc S︵Q, and the arc S︵Q is concentric with the arc on the circular cross section of the drum 1.

[0047] Specifically, Figure 4 As shown, the front end of the magnetic adsorption section 21 is point P, and the height of point P is greater than the height of the axis O of the drum 1, that is, point P is located above the horizontal line on the axis O. The angle between the vertical connection between the lowest point of the magnetic adsorption section 21 and the center line of the drum 1 and the horizontal line is 30° to 150°, that is, the angle α between the line OP connecting point P and the axis O of the drum 1 and the horizontal line is 30° to 150°, preferably 60° to 90°.

[0048] When the roller 14 rotates and approaches the magnetic part 2 and is closest to the magnetic part 2, there is a gap between the lowest point of the magnetic adsorption section 21 and the roller 14, that is, when the roller 14 rotates around the axis of the drum 1 and falls on the line segment OP, there is a gap between the roller 14 and the point P, and the gap can generally be 0.1mm~10mm, preferably 1mm~2mm.

[0049] like Figure 4 As shown, the end of the magnetic connection section 22 is point Q, and the height of point Q is greater than the height of the axis O of the drum 1, that is, point Q is located above the horizontal line on the axis O.

[0050] Among them, the angle between the lowest point of the magnetic connection segment and the vertical connection with the center line of the roller and the line segment OP is 30°~150°, that is, the angle β between the line OQ connecting point Q and the axis O of the roller 1 and the line segment OP is 30°~150°, preferably 90°~150°; at the same time, the length of the line segment OQ is greater than the length of the line segment OP.

[0051] Furthermore, the width of the left end of the magnetic member is greater than the length of the roller; and the width of the right side of the magnetic member gradually decreases from the middle of the magnetic member to the end of the magnetic member.

[0052] Combination Figures 4 to 9 The following describes the method of using the chip component electroplating device of the present invention.

[0053] like Figure 4As shown, the cover plate 12 is opened by the handle 13, and the material 3 composed of the mixed plating medium such as the patch components to be plated and the steel balls is placed into the drum 1 from the opening 11, and the cover plate 12 is loosened, and the cover plate 12 is closed under the action of the reset spring. The drum 1 is connected to the conveying mechanism (not shown), and the conveying mechanism immerses the drum 1 into the plating solution 5 in the plating tank 4, so that the axis of the drum 1 remains horizontal, and then the magnetic part 2 is fixed above the drum 1. The roller 14 on the handle 13 can be initially set on the side close to the end of the magnetic part 2, but keep a distance that will not be attracted by the magnetic part 2. The cathode line can be introduced from the rotating shaft of the drum 1 and contacted with the material 3, and the related devices of the anode can be set at an appropriate position in the plating tank 4 according to the conventional method, which does not need to be described in detail here.

[0054] like Figure 5 As shown, the drum 1 is rotated at a preset constant speed and a DC voltage is applied between the cathode and the anode to start the drum plating. The opening 11 of the drum 1 is oriented in the same direction as the rotation direction of the drum 1, that is, the side of the opening 11 at the axis of rotation points to the opposite side in the same direction as the rotation direction of the drum 1. The material 3 is driven by the rotating drum 1 to form a tilted flow state, with one side higher and the other side lower. As the drum 1 rotates, the roller 14 on the handle 13 starts to move away from the end of the magnetic part 2, and then approaches the front end of the magnetic part 2. During this process, the cover 12 remains closed, so the material 3 will not leak out.

[0055] like Figure 6 As shown, when the roller 14 on the handle 13 and the front end point P of the magnetic member 2 reach the closest distance, the roller 14 is attracted by the magnetic member 2 and attached to the magnetic member 2, and the cover 12 begins to be pulled open.

[0056] Point P is set so that when roller 14 rotates around the axis of drum 1 and falls on line segment OP, there is a gap between roller 14 and point P, and the gap is preferably 1mm to 2mm, which can prevent roller 14 from colliding and wearing with the front end of magnetic part 2, while ensuring that there is sufficient suction force to suck roller 14 onto magnetic part 2.

[0057] Preferably, the front end width of the magnetic member 2 is greater than the length of the roller 14 so as to adsorb the roller 14 .

[0058] like Figure 7 As shown, as the drum 1 rotates, the roller 14 slides and rolls against the surface of the magnetic member 2, and as the distance between the magnetic member 2 and the drum 1 gradually increases, the distance between the roller 14 and the drum 1 gradually increases, so that the cover 12 is gradually pulled apart, until the roller 14 moves to the point S of the magnetic member 2, the distance between the roller 14 and the drum 1 reaches the maximum, and the flip angle of the cover 12 also reaches the maximum. In this process, the plating solution 5 inside and outside the drum 1 is circulated and exchanged through the opening 11.

[0059] If the process of opening the cover 12 is too fast, the magnetic member 2 may not be able to attract the roller 1 and may become loose. Therefore, by setting the range from point P to point S, i.e., the magnetic adsorption section 21, each point on the magnetic member 2 gradually moves away from the side of the roller 1, so that the cover 12 is gradually pulled open and stably transitions to the maximum flipping angle.

[0060] The roller 14 can roll freely on the handle 13 , which reduces the friction between the roller 14 and the magnetic member 2 , thereby reducing the resistance to the rotation of the drum 1 .

[0061] like Figure 8 As shown, the roller 14 moves from point S of the magnetic member 2 to point Q at the end of the magnetic member 2. During this process, the distance between the magnetic member 2 and the drum 1 remains unchanged, the cover plate 12 maintains the maximum flip angle, and the plating solution 5 inside and outside the drum 1 can flow and exchange through the opening 11.

[0062] The angle β between the line OQ connecting point Q and the axis O of the drum 1 and the line segment OP is 30° to 150°, preferably 90° to 150°, so that more opening time of the cover plate 12 can be obtained, that is, more circulation and exchange time of the plating solution 5 can be obtained.

[0063] The maximum flipping angle of the cover 12 is preferably 30° to 60°, so that the opening angle of the cover 12 is larger, and the cross-sectional area of ​​the plating solution 5 is larger, which is conducive to sufficient circulation and exchange of the plating solution 5 and maintaining a stable metal ion concentration. The resistance of the plating solution 5 to the cover 12 is smaller, thereby reducing the resistance to the rotation of the drum 1.

[0064] When 0.5a<b<a, and 0.1c<A︵B<0.2c, the cross-sectional area of ​​the electroplating solution 5 is larger, which is beneficial to improving the circulation efficiency of the electroplating solution 5 and maintaining a stable metal ion concentration.

[0065] like Fig. 9 As shown, the roller 14 is disengaged from the end point Q of the magnetic member 2, and the cover plate 12 is closed again under the action of the return spring to prevent leakage of material when the opening 11 rotates to below the material 3.

[0066] The height of the end point Q of the magnetic member 2 is greater than the height of the axis O of the roller 1, which can ensure that the roller 14 is separated from the magnetic member 2 and closed in time to prevent leakage.

[0067] Preferably, near the end of the magnetic member 2 , the width of the magnetic member 2 gradually decreases toward the end Q, so that the suction force can be gradually reduced, making it easier for the roller 14 to detach from the magnetic member 2 at the end Q.

[0068] By properly setting the positions of the front and rear ends of the magnetic member 2, the filling rate of the material 3 in the drum 1 can be maximized to increase the production capacity while obtaining more opening time of the cover plate 12, that is, obtaining more circulation and exchange time of the plating solution 5.

[0069] By arranging that when the cover 12 is closed, the inner side surface of the cover 12 is flush with the inner side surface of the drum 1 or slightly protrudes than the inner side surface of the drum 1, rather than being lower than the inner side surface of the drum 1, a small amount of material 3 can be prevented from being placed on the step of the side wall of the opening 11 and leaking out when the cover 12 is opened.

[0070] The patch component electroplating device of the present invention can stably perform roller plating of small-sized patch components, solves the contradiction between leakage of patch components from the roller and difficulty in the circulation of electroplating solution, obtains good plating quality, and improves electroplating efficiency.

[0071] The patch component electroplating device of the present invention can also be used for barrel plating of larger patch components, but is particularly suitable for small-sized patch components such as 0201, 01005, and 008004. The patch component electroplating device of the present invention is also suitable for barrel plating of other parts besides patch components, especially small-sized parts.

[0072] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A patch component electroplating device, characterized in that: It comprises an electroplating tank and a roller rotatably arranged in the electroplating tank, wherein the roller is provided with a through hole, and the rotation axis of the roller extends horizontally; The drum is provided with an opening, a cover plate is rotatably provided on the opening, and a reset member for keeping the cover plate sealing the opening is provided on the cover plate; A roller is provided on the outer side of the cover plate away from the rotation axis of the cover plate, and the rotation axis of the roller and the rotation axis of the cover plate are parallel to the rotation axis of the drum; A curved magnetic member is also fixedly provided in the electroplating tank, the magnetic member extends in an arc shape from the upper left of the roller to the upper right of the roller, the magnetic member is arranged at intervals on the outer side of the roller, and the interval between the magnetic member and the roller can be adsorbed and connected with the magnetic member to open the opening when the roller rotates close to the magnetic member, and disconnected from the magnetic member to close the opening when the roller rotates away from the magnetic member; The magnetic member includes a magnetic adsorption section and a magnetic connection section with a smooth transition from left to right; The distance between the magnetic adsorption section and the outer side of the roller gradually increases, so that when the roller rotates close to the magnetic adsorption section, it is adsorbed and rotated with the magnetic adsorption section, so as to drive the rotation angle of the cover plate to gradually increase; The distance between the magnetic connection section and the roller remains constant, so that the angle of the cover plate remains constant when the cover plate is rotated to the maximum; The lowest point of the magnetic adsorption section is higher than the center line of the roller, and the lowest point of the magnetic connection section is higher than the center line of the roller; The angle between the vertical connection between the lowest point of the magnetic adsorption section and the center line of the drum and the horizontal line is 30° to 150°; The angle between the vertical connection between the lowest point of the magnetic connection section and the center line of the roller and the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller is 30° to 150°; Suppose the perpendicular connection between the lowest point of the magnetic adsorption section and the center line of the roller is OP, and the perpendicular connection between the lowest point of the magnetic connection section and the center line of the roller is OQ, and the angle between OP and OQ is 30°~150°.

2. The patch component electroplating device according to claim 1, characterized in that: The angle between the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller and the horizontal line is 60° to 90°; The angle between the vertical connection between the lowest point of the magnetic connection section and the center line of the roller and the vertical connection between the lowest point of the magnetic adsorption section and the center line of the roller is 90° to 150°.

3. The chip component electroplating device according to claim 1, characterized in that: When the roller rotates and approaches the magnetic part and is closest to the magnetic part, a gap exists between the lowest point of the magnetic attraction section and the roller.

4. The patch component electroplating device according to claim 3, characterized in that: The gap is 1 mm to 2 mm.

5. The chip component electroplating device according to claim 1, characterized in that: The width of the left end portion of the magnetic member is greater than the length of the roller; The width of the right side of the magnetic member gradually decreases from the middle of the magnetic member to the end of the magnetic member.

6. The chip component electroplating device according to claim 1, characterized in that: The reset member is a reset spring. The cover plate is rotatably mounted on one side of the opening through a cover plate rotating shaft, and the reset spring is mounted on the cover plate rotating shaft.

7. The chip component electroplating device according to claim 1, characterized in that: A stopping member for stopping the cover plate from rotating into the opening is provided on the cover plate or at the opening of the drum.

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