Protective caps for packages with thermal interface materials

Abstract

A protective cap for a package having a thermal interface material. A package (100) includes a conductive carrier (102), an electronic component (104) on the carrier (102), an encapsulant (106) encapsulating a portion of the carrier (102) and the electronic component (104), an electrically insulating and thermally conductive interface structure (108) covering an exposed surface portion of the carrier (102), and a protective cap (110) covering at least a portion of the interface structure (108).

Description

Technical Field

[0001] Various embodiments generally relate to packages, methods of manufacturing packages, and methods of operating packages. Background Art

[0002] Conventional electronic components mounted on a chip carrier (e.g., lead frame), electrically connected by bonding wires extending from the chip to the chip carrier, and molded in a package may suffer from their thermal insulation within the package. In addition, this conventional approach may reach its limits when complex electronic circuits are to be built.

[0003] For discrete transistor outline (TO) packages and other types of packages, operating performance is generally limited by the heat that can be transferred to a cooling unit (e.g., a heat sink) at the board level. Therefore, thermal interface materials (TIMs) are used as the interface material between the TO package (copper surface) and the cooling unit.

[0004] However, TIM materials are susceptible to damage, for example, by scratches, which limits the reliability of the package. Summary of the invention

[0005] It may be desirable to provide a possibility to manufacture a package with a simple processing architecture and with high reliability.

[0006] According to an exemplary embodiment, a package is provided that includes a conductive carrier, an electronic component on the carrier, an encapsulant encapsulating a portion of the carrier and the electronic component, an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protective cap partially or completely covering the interface structure.

[0007] According to another exemplary embodiment, a method for manufacturing a package is provided, wherein the method includes: mounting an electronic component on a conductive carrier; encapsulating a portion of the carrier and the electronic component by an encapsulant; covering an exposed surface portion of the carrier with an electrically insulating and thermally conductive interface structure; and partially or completely covering the interface structure by a protective cap.

[0008] According to another exemplary embodiment, a method of operating a package having the above-mentioned features is provided, wherein the method comprises: before using the package, sliding a protective cap over the interface structure for protecting the interface structure; and subsequently removing the protective cap from the interface structure for exposing the interface structure for using the package.

[0009] According to an exemplary embodiment, a mechanically robust package is provided, which has an exposed electrically insulating and thermally conductive interface structure for promoting effective heat removal of encapsulated electronic components while ensuring dielectric decoupling of the encapsulated electronic components from the environment. The electrically insulating and thermally conductive interface structure (particularly TIM, thermal interface material) can significantly contribute to the high thermal and electrical reliability of the package, but is susceptible to mechanical damage, such as scratches. According to an exemplary embodiment, effective damage protection for the exposed surface of the electrically insulating and thermally conductive interface structure of the package can be provided in the form of a protective cap, which can be slid onto the package body with the interface structure so as to temporarily and at least partially cover or shield the mechanically sensitive interface structure. For example, a tubular protective cap can be manufactured with a low workload, and effective and easy-to-manage temporary mechanical protection can be provided for the interface structure by installing the protective cap around the discrete package. Therefore, a protective cap that can be simply manufactured and easily managed can be provided for effectively protecting the isolated package from mechanical damage.

[0010] Description of Other Exemplary Embodiments

[0011] In the following, further exemplary embodiments of the package and the method will be explained.

[0012] In the context of the present application, the term "encapsulation" can particularly refer to an electronic device, which can include one or more electronic components mounted on a carrier, the carrier including a single part, multiple parts joined via encapsulation or other encapsulation components, or a subassembly of the carrier, the carrier or a single part, multiple parts joined via encapsulation or other encapsulation components, or a subassembly of the carrier. The components of the package can be at least partially encapsulated by an encapsulant. Optionally, one or more conductive interconnect bodies (e.g., bonding wires and / or clips) can be implemented in the package, for example, for electrically coupling the electronic component to the carrier.

[0013] In the context of the present application, the term "electronic component" may particularly include semiconductor chips (particularly power semiconductor chips), active electronic devices (e.g., transistors), passive electronic devices (e.g., capacitors, or inductors, or ohmic resistors), sensors (e.g., microphones, light sensors, or gas sensors), actuators (e.g., speakers), and micro-electromechanical systems (MEMS). In particular, the electronic component may be a semiconductor chip having at least one integrated circuit element (e.g., a diode or a transistor) in its surface portion. The electronic component may be a bare die, or may be already packaged or encapsulated. The semiconductor chip implemented according to the exemplary embodiment may be formed with silicon technology, germanium nitride technology, silicon carbide technology, etc.

[0014] In the context of the present application, the term "encapsulant" may particularly denote a substantially electrically insulating material surrounding at least a portion of the electronic component and at least a portion of the carrier to provide mechanical protection, electrical insulation and optionally facilitate heat dissipation during operation.

[0015] In the context of the present application, the term "carrier" may particularly refer to a support structure (which may be at least partially conductive) that serves as a mechanical support for one or more electronic components and may also facilitate electrical interconnection between (one or more) electronic components and the periphery of the package. In other words, the carrier may fulfill both a mechanical support function and an electrical connection function. The carrier may comprise a single part, a plurality of parts joined via an encapsulation or other packaging component, or a subassembly of the carrier, or the carrier may consist of a single part, a plurality of parts joined via an encapsulation or other packaging component, or a subassembly of the carrier.

[0016] In the context of the present application, the term "interface structure" may particularly denote any physical structure that forms an interface between a package and its environment. More specifically, an interface material may be any material that is inserted between a carrier and / or encapsulant of a package on the one hand and another body (e.g., a heat sink) from the electronic environment of the package on the other hand, so as to enhance the thermal coupling between them while prohibiting current conduction therebetween. Such an interface structure may be a thermal interface material (TIM) that is electrically insulating and provides an appropriate thermal conductivity. Thus, a TIM may contribute to heat dissipation, wherein the TIM may be inserted between a package that is a device generating heat and a heat dissipation device (e.g., a heat sink). For example, the interface structure may be a thermal grease, a thermal adhesive, a thermal gap filler, a thermally conductive pad, a thermal tape, etc. More generally, the interface structure may particularly be any soft insulating material or thermal interface material that covers a carrier of the package.

[0017] In the context of the present application, the term "protective cap" may particularly denote a cap-shaped physical body that may at least temporarily protect the package body or a portion thereof from damage. In particular, the shape and size of the protective cap may be designed to be slidable or clampable onto the package for at least partially covering the exposed surface of the package. Such a protective cap may be made of a material having sufficient robustness to withstand mechanical loads that typically occur during manipulation of the package, for example, in the case of manipulation of the package when preparing to assemble the package on a mounting substrate (e.g., a printed circuit board (PCB)). For example, the protective cap may be configured to withstand mechanical loads that occur during manual manipulation by an operator or during manipulation by a pick-and-place device.

[0018] In an embodiment, the carrier, the electronic component, the encapsulant and the interface structure may form a package body, and the protective cap may be at least partially attached to the package body to cover at least a portion of the surface of the package body, in particular at least a portion of the surface of the interface structure thereof. Optionally, the package body may include one or more other elements of the package.

[0019] In an embodiment, the protective cap is configured to be removable from the interface structure. In particular, the protective cap may be reversibly attached to and removable from the package body. Thus, the protective cap may be configured to serve as temporary protection, which may be removed by pulling or removing in any other way by a manual operator or a pick-and-place device. Thus, it may be sufficient to simply slide the protective cap over the package body to activate the protection, and then remove the protective cap from the package for further processing or use of the package (e.g., for attaching the interface structure to a heat dissipation body or a heat sink).

[0020] In another embodiment, a protective cap (particularly not removable without destruction) is fixed to the package body, in particular molded onto the package body, or formed by coating or immersion in a liquid precursor of the protective cap. In such an embodiment, an integral connection between the protective cap and the interface structure can be formed, for example by molding the protective cap around at least a portion of the package. The protective cap can also be formed by immersing the package in a liquid medium, which can then be hardened to form the protective cap. In such an embodiment, the removal of the protection can be carried out, for example, by chemical methods, by dissolving the integral protective cap, thereby exposing the interface structure. Such a protective structure can also be removed by rupturing the protective structure to use the package.

[0021] In an embodiment, the protective cap additionally covers at least a portion of the encapsulant. In particular, the protective cap may at least cover the entire interface structure, and preferably covers the surrounding portion of the encapsulant, for example, the annular surrounding portion of the interface structure. This can ensure that no undesirable conductive path is formed from the environment of the package to its interior (in particular, to the encapsulated electronic components).

[0022] In an embodiment, the protective cap comprises or consists of an electrically insulating material. For example, the protective cap may be made of plastic, cardboard or paper. By configuring the protective cap from a dielectric material, any undesired electrical path to the package may be inhibited.

[0023] In an embodiment, the wall thickness of at least one portion of the protective cap on the interface structure is greater than another wall thickness of another portion of the protective cap on the encapsulant. By taking this measure, the usually most mechanically sensitive part of the package, ie the interface structure, can be particularly carefully and reliably protected.

[0024] In an embodiment, a guiding structure for guiding the encapsulant (or more generally, the package body) within the protective cap is formed inside the protective cap. For example, such a guiding structure may be composed of one or more physical structures that protrude inwardly from the inner wall of the protective cap to combine with the package body. This can ensure that the installation process of installing the protective cap on the package body (especially on the encapsulant and the interface structure) is carried out in a predetermined manner (especially along a predetermined trajectory). This in turn can prevent damage caused by misuse of the protective cap, and such damage may, for example, scratch sensitive interface structures. The mentioned guiding structure can guide the package body along the target path into the internal accommodation volume of the protective cap until the target position. When guided by the guiding structure, any physical contact between the interface structure and the interior of the protective cap can be particularly prevented, so that scratches can be effectively prevented. Preferably, the guiding structure can be formed integrally with the rest of the protective cap, for example, by extrusion.

[0025] In an embodiment, the protective cap completely circumferentially surrounds the encapsulant and the interface structure, and is particularly configured as a circumferentially closed sleeve. In other words, the protective cap can completely surround the lateral surface of the package body in an annular manner. In one embodiment, such an annular sleeve of the protective cap can be opened at the top side and at the bottom side. Such a protective cap can be manufactured with a very high workload, for example, by extrusion and cutting. In another embodiment, the protective cap can circumferentially surround the package body, and can be opened at the bottom side and closed at the top side. When the protective cap is properly mounted on the package body, the closed top side can then be used as an abutment surface adjacent to the flange face of the package body.

[0026] In another embodiment, the protective cap only partially circumferentially surrounds the encapsulant and the interface structure, in particular being configured as a circumferentially open clamp. In such an embodiment, for example, the protective cap may be substantially U-shaped or substantially C-shaped and only laterally clamp around a portion of the lateral surface of the protective body. With this configuration, the protective cap can be manufactured with very low material consumption and therefore with very low effort.

[0027] In an embodiment, after removing the protective cap, an electrically insulating and thermally conductive interface structure is attached to a heat dissipation body at the outer surface. For example, such a heat dissipation body can be a heat sink of a plate with high thermal conductivity, which will be attached to the interface structure, and cooling fins extend from the plate. In such an embodiment, the thermal path for discharging the heat generated inside the package can be from the encapsulated electronic components (as a heat source) via the carrier and the interface structure to the heat dissipation body. The temporary protective cap can ensure that the interface structure remains intact until it is in physical contact with the heat sink, thereby allowing effective cooling of the package.

[0028] In an embodiment, the protective cap is made of a deformable material, in particular an elastically deformable material. In this advantageous configuration, the user can use his fingers (or an actuator that can control the pick-and-place device) to temporarily deform the protective cap so that the protective cap is temporarily shaped so that the protective cap is in a deformed state, in which the protective cap can be slid onto the package body. Thereafter, the deformed protective cap can be pulled onto the package body. Further subsequently, the deforming force applied to the protective cap can be released so that the protective cap moves back to its force-free configuration and is thereby clamped to the package body. In this state, the protective cap is fixed to the package body. In order to subsequently remove the protective cap from the package body, the operator or the pick-and-place device can apply a force that resists the elastic deformation so that the protective cap can be easily removed from the package body.

[0029] In an alternative configuration, the protective cap may also be made of a plastically deformable material. After the protective cap is placed on the package body, a plastic deformation force may be applied to secure or fix the protective cap to the package body. In order to remove the plastically deformed protective cap from the package body, an expansion force may be applied by an operator or a pick-and-place device to expand the protective cap (e.g., by breaking it).

[0030] In an embodiment, the protective cap covers the interface structure without physically contacting the interface structure. When covered by the protective cap in a contactless manner, the interface structure can be completely prevented from any contact that may cause scratches.

[0031] In another embodiment, the protective cap covers the interface structure with physical contact, in particular with physical contact with substantially the entire interface structure. In particular, in the case of full surface contact between the interface structure and the inner wall of the protective cap, any mechanical pressure therebetween can be reliably distributed over a large area. Thus, excessive forces applied to the interface structure can be reliably avoided.

[0032] In an embodiment, the protective cap comprises a metal (such as aluminum or copper), or is composed of a metal (such as aluminum or copper). A metal protective cap (e.g., a protective cap made of aluminum or copper) may have a very high thermal conductivity. Therefore, the protective cap itself may be used as a heat sink (particularly an additional or second heat sink) that helps to discharge heat from the internal package. In particular, when the protective cap is made of metal, the protective cap may remain permanently connected to the package body even during use of the package. Such a permanently assembled protective cap may be used as a heat sink. Optionally, thermal grease may be provided between the outer wall of such a permanently assembled protective cap and a heat sink connected to such an outer wall.

[0033] In another embodiment, the protective cap comprises or consists of plastic. In such an embodiment, the protective cap can be used as a relatively soft protective body to protect the interface structure from scratches. Before use, this temporary protective cap can preferably be removed from the package body, thereby exposing the interface structure to the environment.

[0034] In an embodiment, the protective cap has a predetermined breaking point, which is configured to break when a braking force is applied to the protective cap. For example, such a predetermined breaking point can be a locally thinned or mechanically weakened portion of the protective cap, at which the breaking of the protective cap occurs when there is an externally applied mechanical force. By ensuring that the protective cap always breaks at a predetermined position, the breaking process for removing the protective cap (for example, before using the package) can be automatic and can be rendered reproducible.

[0035] In an embodiment, the protective cap is configured to thermally trigger the assembly of the protective cap on the package (or package body) and / or the removal of the protective cap from the package (or package body). In other words, applying a specific temperature to the outside of the protective cap (especially including the package body therein) can transform the protective cap into a specified assembly configuration or disassembly configuration. Moreover, such an embodiment allows the assembly and disassembly to be automated, for example, by a temperature regulating unit cooperating with a robot.

[0036] In an embodiment, the protective cap comprises a removal trigger structure configured to trigger the removal of the protective cap from the package, the removal trigger structure being particularly one of a tab and a zipper. By actuating the removal trigger structure, an operator, a robot or any other entity can easily remove the protective cap to expose the package body, for example, before assembling or using the package.

[0037] In an embodiment, the package includes another electrically insulating and thermally conductive interface structure and another carrier, the other interface structure covering an exposed surface portion of the other carrier. The protective cap covers at least a portion of the other interface structure. In other words, the package can be configured for double-sided cooling. A single protective cap can cover two interface structures in an effective manner.

[0038] In an embodiment, the interface structure is made of a soft material. In order to provide an interface structure with soft material properties, the material of the interface structure may have a compressibility in a range between 1% and 20%, in particular a compressibility in a range between 5% and 15% (which can be measured by applying a force of 1N at an interface structure layer having 250μm using a Vickers micron indenter). When the interface structure is then in contact with the heat sink, the soft material properties of the interface structure ensure proper full-surface contact, and therefore ensure effective heat transfer from the interface structure to the heat sink. In particular, it may be sufficient to directly connect the thermal interface structure to the heat sink using connecting screws or the like, and in particular, no thermal grease is required between the thermal interface material and the heat sink. Although such soft material properties of the interface structure make the interface structure easy to be scratched, a protective cap is provided to protect the interface structure and ensure proper functionality of the package.

[0039] In an embodiment, the method comprises dividing a tube (or an elongated cylindrical sleeve) into a plurality of protective caps, and using each of the separated protective caps for a given package. For example, such a tube can be manufactured in a simple and effective manner from a plastic material, and then such a tube can be cut into a plurality of tubular pieces. Each of the pieces can be used as a protective cap for a given package. By taking this measure, the protective caps can be manufactured very simply.

[0040] In an embodiment, the method comprises forming the protective cap by extrusion. Extrusion may refer to a process for creating a protective cap or preform thereof of a fixed cross-sectional profile. In this context, the material may be pushed through an extrusion tool having a desired cross-section. After the annular tubular body is obtained by extrusion, the body may be divided into a plurality of protective caps by cutting or chopping the body into a plurality of tubular pieces. The method allows the protective cap to be manufactured in a rapid manner.

[0041] In an alternative embodiment, the method comprises overmolding the interface structure with a protective cap of the molded type. As a result, a protective cap integrally formed with the package body can be obtained. Such a protective cap can be removed chemically (e.g., by selective etching) or by applying a mechanical force to break the protective cap.

[0042] In an embodiment, the sliding includes sliding the protective cap not only onto the interface structure, but also onto the encapsulant. Correspondingly, the removal may include removing the protective cap not only from the interface structure, but also from the encapsulant. Therefore, the process of assembling the protective cap onto the package body and the process of removing the protective cap from the package body may be opposite and preferably also reversible. This may simplify the handling of the package body together with the protective cap. Removing the protective cap from the package body by sliding the protective cap away from the package body may occur before assembling and using the package without the protective cap on a mounting substrate (e.g., a printed circuit board PCB). The disassembled protective cap may be reused for temporarily protecting another package body.

[0043] In an embodiment, the method comprises applying (particularly manually) a compressive force to the protective cap before sliding, and removing the compressive force after sliding, so as to thereby fix the protective cap to the packaging body. It is a simple and intuitive process for mounting the protective cap on the packaging body and for removing the protective cap from the packaging body, and at the same time allows the assembly and disassembly processes to be carried out in a quick manner. Descriptively speaking, the compression can cause the preferably elastic protective cap to be changed into a shape that fits on the packaging body. By releasing the compressive force applied to the protective cap after placing the (e.g., sleeve-shaped) protective cap on the packaging body, the squeezed protective cap can be triggered to move to its initial force-free shape, in which the protective cap can be combined with the packaging body in a clamping or clamping manner.

[0044] In an embodiment, the interface structure is formed by at least one of the group consisting of molding (particularly compression molding or transfer molding), template printing and lamination. Therefore, this manufacturing method can promote the formation of an integral thermal interface, which can also be mixed with a carrier and / or an encapsulant. Alternatively, it is also possible to manufacture the interface structure using a generative or additive (e.g., software-controlled) manufacturing process, such as printing, particularly three-dimensional printing. Alternatively, the thermal interface foil can also be attached to the remainder of the package body. By molding or lamination, the thermal interface structure can be connected to the remainder of the package by applying pressure and heat (optionally under vacuum, preferably accompanied by a curing reaction).

[0045] In an embodiment, the through hole extends at least through the encapsulant and the interface structure so that a fixing element (e.g., a screw or bolt) can be guided through the through hole for fixing the package to a heat sink (e.g., a heat sink body). In an embodiment, the fixing element may form part of the package. It is simple and inexpensive to mount the package to the heat sink body by a fixing element such as a screw.

[0046] In an embodiment, the package includes a clip configured for connecting the package to a heat sink body. Such a clip can be configured to clamp an encapsulated chip carrier arrangement with a thermal interface coating to the heat sink body without the need to form a through hole. Although the amount of work to connect the heat sink body to the rest of the package by the clip is slightly higher than the amount of work when using a fixing element such as a screw, this is advantageous particularly for high-performance applications.

[0047] As an alternative to a screw or clip connection, other fixing techniques may be applied (eg another clamping technique).

[0048] The thermal conductivity of the thermally conductive material of the interface structure is higher than the thermal conductivity of the material of the encapsulant. For example, the thermal conductivity of the material of the encapsulant can be 0.8 Wm -1 K -1 With 8Wm -1 K -1 In the range between 2Wm -1 K -1 With 4Wm -1 K -1 For example, the material of the interface structure may be a silicone-based material (or may be made of any other resin-based material and / or a combination thereof), which may include filler particles for improving thermal conductivity. For example, such filler particles may include aluminum oxide (and / or boron nitride, aluminum nitride, diamond, silicon nitride) or consist of aluminum oxide (and / or boron nitride, aluminum nitride, diamond, silicon nitride). For a thermally conductive interface structure, a thermal conductivity of at least 10 W / m2 may be obtained. -1 K -1 The thermal conductivity value, especially at 20Wm -1 K -1 With 30Wm -1 K -1 Values ​​in the range between .

[0049] In an embodiment, the carrier comprises or consists of a lead frame. The lead frame may be a metal structure within the chip package that is configured for transmitting signals from the electronic components to the outside and / or vice versa. The electronic components within the package may be attached to the lead frame, and bonding wires may then be provided for attaching the pads of the electronic components to the leads of the lead frame. Subsequently, the lead frame may be molded in a plastic housing or any other encapsulant. On the outside of the lead frame, corresponding parts of the lead frame may be cut off, thereby separating the corresponding leads. Prior to such cutting, other processes such as plating, final testing, packaging, etc. may be carried out, as known to those skilled in the art. Prior to encapsulation, the lead frame or chip carrier may be coated, for example, with an adhesion promoter.

[0050] In another embodiment, the carrier comprises a stack consisting of a central electrically insulating and thermally conductive layer (e.g., a ceramic layer), a direct copper bonding (DCB) substrate, and a direct aluminum bonding (DAB) substrate, wherein the central electrically insulating and thermally conductive layer is covered on two opposite main surfaces by corresponding conductive layers (e.g., copper layers or aluminum layers, wherein the corresponding conductive layers can be continuous or patterned layers).

[0051] In an embodiment, the package further comprises the above-mentioned heat dissipation body attached to or to be attached to the exposed interface structure for dissipating the heat generated by the electronic components during operation of the package. For example, the heat dissipation body can be a plate of a suitable thermally conductive body (e.g., copper or aluminum or graphite, diamond, composite material and / or a combination of the mentioned and / or other materials), which can have cooling fins, etc., to further promote the dissipation of heat that can be conducted from the electronic components to the heat dissipation body via the chip carrier and the interface structure. The removal of heat via the heat dissipation body can be further promoted by a cooling fluid such as air or water (more generally gas and / or liquid), which can flow along the heat dissipation body outside the package. Heat pipes can also be implemented.

[0052] In an embodiment, the package is adapted for double-sided cooling. For example, a first interface structure may thermally couple the encapsulated chip and carrier to a first heat dissipation body, and a second interface structure may thermally couple the encapsulated chip and carrier to a second heat dissipation body. When a protective cap covers such a package body for double-sided cooling, the protective cap may specifically cover both interface structures.

[0053] In an embodiment, the electronic component is configured as a power semiconductor chip. Therefore, the electronic component (e.g., semiconductor chip) can be used for power applications in, for example, the automotive field, and can, for example, have at least one integrated insulated gate bipolar transistor (IGBT) and / or at least one transistor of another type (e.g., MOSFET, JFET, etc.) and / or at least one integrated diode. Such an integrated circuit element can be made, for example, with silicon technology or based on a wide bandgap semiconductor (e.g., silicon carbide). The semiconductor power chip may include one or more field effect transistors, diodes, inverter circuits, half bridges, full bridges, drivers, logic circuits, other devices, etc.

[0054] As a substrate or wafer forming the basis of the electronic components, a semiconductor substrate can be used, preferably a silicon substrate. Alternatively, a silicon oxide or another insulator substrate can be provided. A germanium substrate or a III-V semiconductor material can also be implemented. For example, the exemplary embodiments can be implemented with GaN or SiC technology.

[0055] For the encapsulation, plastic materials or ceramic materials can be used.

[0056] In addition, exemplary embodiments may use standard semiconductor processing techniques, such as appropriate etching techniques (including isotropic and anisotropic etching techniques, in particular plasma etching, dry etching, wet etching), patterning techniques (which may involve photolithography masks), deposition techniques (e.g., chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), sputtering, etc.).

[0057] The above and other objects, features and advantages will become apparent from the following description and appended claims taken in conjunction with the accompanying drawings in which like parts or elements are designated by like reference numerals. BRIEF DESCRIPTION OF THE DRAWINGS

[0058] The accompanying drawings illustrate exemplary embodiments and are included to provide a further understanding of exemplary embodiments and constitute a part of this specification.

[0059] In the attached picture:

[0060] Figure 1 A cross-sectional view of a package with a protective cap mounted on a mounting structure and coupled to a heat dissipating body is shown according to an exemplary embodiment.

[0061] Figure 2 Different views of a structure obtained during implementation of a method for manufacturing a package with a protective cap according to an exemplary embodiment are shown.

[0062] Figures 3 to 8 Different views of a package with a reversibly attachable and removable protective cap are shown according to an exemplary embodiment.

[0063] Fig. 9 and Fig.10 Different views of a package with an overmolded protective cap according to another exemplary embodiment are shown.

[0064] Figures 11 to 15 Different views of a structure obtained during the implementation of a method for manufacturing a package with a protective cap according to a further exemplary embodiment are shown.

[0065] Fig.16 A package body covered by a protection cap having a locally thickened protection wall in physical contact with an interface structure is shown according to an exemplary embodiment.

[0066] Fig.17 A package body covered by a protection cap having a locally thickened protection wall arranged in a non-contact manner with respect to an interface structure is shown according to an exemplary embodiment.

[0067] Fig.18A package body is shown covered by a protection cap only along a portion of the periphery of the package body according to an exemplary embodiment.

[0068] Fig.19 A portion of a protective cap having a predetermined breaking point according to an exemplary embodiment is shown.

[0069] Figure 20 to Figure 23 A protective cap according to an exemplary embodiment is shown assembled on a jig and stored in an external transport tube after being mounted on a corresponding packaging body.

[0070] Fig.24 and Fig.25 An assembly of a package body having an interface structure covered by a protective cap in full surface contact according to an exemplary embodiment is shown.

[0071] Fig.26 A package body having two interface structures for double-sided cooling covered by a protective cap is shown according to an exemplary embodiment.

[0072] Fig. 27 A protective cap having a predetermined breaking point according to an exemplary embodiment is shown.

[0073] Fig.28 A protective cap having a removal triggering structure configured as a tab during assembly is shown according to an exemplary embodiment.

[0074] Fig.29 Shown according to Fig.28 tabs.

[0075] Fig.30 shows the disassembly period according to Fig.28 and Fig.29 protective cap.

[0076] Fig.31 Shown in open configuration Figures 28 to 30 tabs.

[0077] Fig.32 A protective cap is shown during heat-activated assembly according to an exemplary embodiment.

[0078] Fig.33 A protective cap having a predetermined breaking point according to an exemplary embodiment is shown.

[0079] Fig.34 A protective cap is shown during heat-activated assembly according to an exemplary embodiment.

[0080] Fig.35 A protective cap with a tear-off zipper is shown according to an exemplary embodiment.

[0081] Figure 36 to Figure 39 A protective cap is shown during automated robotic manipulation according to an exemplary embodiment.

[0082] Fig.40 A cross-sectional view of a package with a protective cap, package mounted on a mounting structure and having an inherent heat dissipating body, according to another exemplary embodiment is shown.

[0083] Fig.41 A package with a reversibly attachable and removable protective cap having cooling fins on two opposing sides thereof for double-sided cooling is shown according to an exemplary embodiment.

[0084] Fig.42 A package with a reversibly attachable and removable protective cap having two thermal interface structures is shown according to an exemplary embodiment. DETAILED DESCRIPTION

[0085] The illustrations in the drawings are schematic and not to scale.

[0086] Before describing the exemplary embodiments in more detail with reference to the accompanying drawings, some general considerations will be summarized based on the actual exemplary embodiments that have been developed.

[0087] Given the soft or compressible nature of the thermal interface material covering the exposed portion of the metal carrier of the chip package, it can often happen that the user inadvertently destroys this soft isolation, for example, during lead bending and internal transportation of the package. This often makes such packages with interface structures sometimes difficult to use in mass production.

[0088] According to an exemplary embodiment, a protective cap is provided for covering and thereby protecting at least a portion of a package body, the portion comprising an exposed thermally conductive and electrically insulating interface structure (particularly a thermal interface material TIM). The use of such a (particularly 3-sided-4-sided) protective cap (preferably a plastic protector, which can be made, for example, by an extrusion extrusion process) can allow the dedicated portion of the package body to be protected from handling damage. Such a protective cap can be used as a protector structure, in particular the role of a protector structure for the interface structure of the package (which may be prone to scratches). Preferably, for example, the protection can be designed to have at least one mechanical guiding structure to guide the package body towards a target position within the protective cap. In an embodiment, the protective cap can be deformable by external forces to allow its geometry to be changed for loading and / or unloading purposes. Advantageously, the protective cap or the protective cap structure can keep the packaged device in place via its deformable internal characteristics, thereby allowing the protective cap to return to its initial force-free state when the compressive force used to mount the protective cap on the package body is released.

[0089] Thermal interface materials (TIMs) can provide good thermal properties for a package and can thereby significantly contribute to the dissipation of heat created by the encapsulated electronic components (e.g., power semiconductor chips) during the packaging operation. However, such thermal interface layers may require appropriate handling so as not to scratch the thermal interface layer, which may affect the thermal and / or dielectric properties of the package, or may even cause failures thereat. In addition, it may be difficult for an operator to manipulate an unprotected package, for example, in a less automated environment where the package may be manipulated by batch or manual processing. In addition, when post-processing is desired or required (e.g., lead bending at a facility where the package is assembled onto a mounting substrate, etc.), there may be conventional handling limitations due to the sensitive nature of the exposed thermal interface layer of the package.

[0090] Advantageously, providing a protective cap for at least temporarily protecting a thermal interface structure on an exposed surface of the package body does not involve any risk of chemical reactions with such a thermal interface layer, which could result in residues of the TIM and / or changes in the properties. Furthermore, when the protective cap is removed from the package before use or further processing of the package, there is no risk of the protective cap peeling off the TIM and thereby deteriorating the TIM. Such a risk can be avoided, for example, when the protective cap is removed from the package body by squeezing and then pulling the protective cap away from the package body. Very advantageously, when providing a protective cap that can be fixed by clamping rather than glue, a reliable supply of clamping force can prevent the merely glued protective structure from falling off the package body due to lack of adhesion (for example, when the package slides in a packaging tube). Furthermore, an advantage of a protective cap for protecting the TIM of a package is that it can be manufactured and handled with very low effort.

[0091] The gist of an exemplary embodiment is the use of a plastic covering (e.g., from the trimming of a plastic tube) as a protective piece for sensitive exposed package parts (e.g., thermal interface materials (TIM)). A plastic tube in the form of a preform that can be used as a production protective cap can be manufactured using a plastic extrusion process. By correspondingly designing a dedicated extrusion plate, the target cross-sectional shape can be adjusted. Subsequently, the extruded plastic tube can be cut into pieces of appropriate length, wherein each piece can be used as a protective cap for a specified package body. In particular, the corresponding protective cap can be slid into the package body and used as a protective covering, in particular onto the thermal interface layer. Once the covering protective cap has been applied to the package body, the package can be freely manipulated without the risk of scratching sensitive surface parts such as interface structures.

[0092] Advantageously, extrusion can be used for plastic tube manufacturing, wherein the plastic tube can be cut into a plurality of tubular pieces, each of which serves as a protective cap. This can result in a low manufacturing effort in terms of consumed material and implemented manufacturing tools. In addition, a sufficient accuracy of the dimensions of the obtained protective cap can be obtained with this manufacturing architecture. In addition, the described manufacturing concept enables the manufacturing of protective caps of different sizes (particularly in terms of thickness, length and / or width).

[0093] In addition, the protective cap can be designed to have a desired profile so that it can be easily applied, protected, and removed. When applied, the protective cap can be fixed to the encapsulant of the package (e.g., the package mold), thereby protecting the exposed thermal interface layer from unwanted manipulation. The principle of simply pushing or sliding the protective cap onto the package body for protection purposes is also appropriately compatible with manual manufacturing environments and environments that require post-processing such as lead bending.

[0094] In yet another embodiment, a molded protective cap may be provided that covers the exposed thermal interface structure (particularly only) or covers the entire encapsulant (eg, mold) (eg, except for the lead side).

[0095] In an embodiment, the cap may be made of metal and plastic. A cap made of metal and covered with a thermally conductive but electrically insulating material may be provided. Such a full or half cap may still have the function of protecting, for example, a soft phase change material applied to the exposed metal lead frame (or any other kind of carrier) of the package.

[0096] In an embodiment, a metal cap may provide the functionality of both a fin and a heat sink. Such a cap, which may be made of metal, may be applied but never removed. The package-heat sink-cap arrangement may allow for installation without an additional heat sink.

[0097] Regarding the cap function, the cap can serve as a soft isolation or protection (anti-scratch) of the TIM material. The cap can also include a thin but hard isolation material (eg, 100 μm of hard molding compound).

[0098] In a preferred embodiment, the cap can be formed by immersing the package body into a liquid cap precursor. This precursor can have material properties similar to nail polish. This precursor can be liquid. It can be hardened with UV (ultraviolet radiation) and can then harden. It can be removed with nail polish remover.

[0099] In an embodiment, the method comprises forming a protective cap by immersion in a cap precursor. For example, this can be implemented for simultaneously covering the conductive structures of the package with the cap precursor. Thus, a liquid precursor for the cap can also be used in order to cover the metal leads of the package. The motivation behind this can be to create an inexpensive lead-lead (e.g. collector-emitter) isolation for high voltage (e.g. for applications above 1000V) modules. After making a solder connection to the mounting structure (PCB), the user can siliconize the leads. Thereby, it can be ensured that the PCB creepage distances even meet strict specifications. This can be particularly advantageous for applications in the TO package family.

[0100] Figure 1 A cross-sectional view of a package 100 implemented as a transistor outline (TO) package according to an exemplary embodiment is shown. The package 100 is mounted on what is implemented here as a printed circuit board mounting structure 132.

[0101] The mounting structure 132 includes electrical contacts 134 implemented as plated layers in through holes of the mounting structure 132. When the package 100 is mounted on the mounting structure 132, the electronic components 104 of the package 100 are electrically connected to the electrical contacts 134 via the conductive base 102 of the package 100, here implemented as a copper lead frame.

[0102] The package 100 comprises an electrically conductive carrier 102, an electronic component 104 (which is implemented here as a power semiconductor chip, for example, which comprises an insulated gate bipolar transistor (IGBT)) adhesively (see reference numeral 136) mounted on the carrier 102, and an encapsulant 106 (which is implemented here as a molding compound) encapsulating a part of the carrier 102 and a part of the electronic component 104. Figure 1 It can be seen that pads on the upper main surface of the electronic component 104 are electrically coupled to the carrier 102 via bonding wires 111 .

[0103] During operation of the power package 100, the electronic component 104, which is implemented as a power semiconductor chip, generates a large amount of heat. At the same time, it must be ensured that any undesired current flow between the bottom surface of the package 100 and the environment is reliably avoided.

[0104] In order to ensure electrical insulation of the electronic component 104 and to effectively discharge heat from the electronic component 104 inside the package 100 towards the environment, an electrically insulating and thermally conductive interface structure 108 is provided, which covers an exposed surface portion of the carrier 102, which surface portion is exposed relative to the encapsulant 106. In addition, the interface structure 108 also covers a connection surface portion of the encapsulant 106 at the bottom of the package 100, which connection surface portion surrounds the exposed surface of the carrier 102. The electrically insulating properties of the layer-shaped interface structure 108 prevent the flow of undesired currents, even in the presence of high voltages between the inside and the outside of the package 100. The thermally conductive properties of the interface structure 108 promote the discharge of heat from the electronic component 104 via the (suitably thermally conductive copper) conductive carrier 102 through the interface structure 108 and towards the attachable heat dissipation body 112. The heat sink body 112, which may be made of a highly thermally conductive material (e.g., copper or aluminum), serves as a heat sink, having a base 113 directly connected to the interface structure 108, and having a plurality of cooling fins 116 extending from the base 113 and parallel to each other to discharge heat toward the environment. The mechanically soft and compressible nature of the interface structure 108 ensures that when the heat sink body 112 is mounted on the package 100 (e.g., by screw connection or by clips, not shown), the interface between the interface structure 108 and the heat sink body 112 introduces only a small thermal resistance.

[0105] However, the mechanically soft and compressible nature of the interface structure 108 makes the interface structure 108 susceptible to damage also in case of mechanical impact, such as scratching.

[0106] Likewise Figure 1 As schematically shown in FIG. 1 , in order to overcome the above-mentioned defects, the package 100 may include a removable protective cap 110. Figure 1 In the configuration of FIG. 1 , the protective cap 110 is shown in a removed configuration. The protective cap 110 is provided separately from the package body 199, which in particular contains the carrier 102, the electronic component 104 and the encapsulant 106. When the package body 199 is separated from the heat dissipation body 112, the tubular protective cap 110 (in Figure 1 The protective cap 110 is slid onto the package body 199 in an embodiment with an open top and bottom, so that the through hole 198 extending axially through the protective cap 110 serves as a receiving volume for at least a portion of the package body 199. Figure 1108 and the encapsulant 106 are covered in a protective manner. As a result, the protective cap 110 mechanically protects the interface structure 108 from undesirable damage such as scratches when the protective cap 110 is protectively slid over the package body 199. However, the sleeve-like protective cap 110 shown is configured to be reversibly removed from the interface structure 108 for exposing the interface structure 108. In this exposed configuration, the heat sink body 112 can be connected to the now accessible interface structure 108 to create a heat sink body 112. Figure 1 The construction shown in .

[0107] In the illustrated embodiment, the protective cap 110 may be composed of an electrically insulating material, such as an extrudable plastic. When the protective cap 110 is mounted on the package body 199, the sleeve-shaped protective cap completely circumferentially surrounds the lateral surfaces of the package body 199, more specifically, the lateral surfaces of the encapsulant 106 and the interface structure 108. Figure 1 As shown, the electrically insulating and thermally conductive interface structure 108 is configured to be attached to the heat sink body 112 at the outer surface after the protective cap 110 is removed.

[0108] To operate package 100 in a protection mode, protective cap 110 may be slid over interface structure 108 and encapsulant 106 of package body 199 to specifically protect interface structure 108 from mechanical damage, such as scratching, prior to use of package 100. Thereafter, to initiate a use mode of package 100, protective cap 110 may be removed from interface structure 108 by pulling it away from package body 199 to expose interface structure 108. Thereafter, heat sink body 112 may be attached to the now exposed interface structure 108 for subsequent use of package 100.

[0109] When the protective cap 110 is made of an elastically deformable material, a compressive force may be manually applied to the protective cap 110 by an operator before sliding the protective cap 110 onto the package body 199. By compressing the sleeve-shaped protective cap 110, the protective cap 110 may be converted into a shape in which the central through hole 198 of the protective cap 110 may accommodate the package body 199. By releasing or removing the compressive force after sliding, the operator may automatically fix the protective cap 110 at the package body 199, because the protective cap 110 will be moved back to its initial force-free shape by the automatically generated clamping force, in which the protective cap 110 is combined with the package body 199. This may be achieved by matching the outer shape of the package body 199 with the inner shape of the through hole 198 and by appropriately selecting the thickness and material of the tubular wall of the protective cap 110.

[0110] Figure 2Different views of a structure obtained during implementation of a method for manufacturing a package 100 with a protective cap 110 according to an exemplary embodiment are shown.

[0111] As shown by reference numeral 200, a tubular preform 202 of extruded plastic material having a central through hole 198 is formed by extruding the plastic material using an appropriate extrusion device (not shown). Therefore, the preform of the plurality of protective caps 110 shown can be efficiently manufactured with a low workload by extrusion. Thereafter, the tubular preform 202 is divided into a plurality of pieces by cutting at the separation line 204. As a result, a plurality of separate protective caps 110 are obtained. Thus, the manufacturing method includes dividing the tube into a plurality of protective caps 110, wherein each of the separated protective caps 110 can be used to protect the thermal interface structure 108 (see FIG. 1 ) of a specified package 100. Figure 1 ).

[0112] In order to produce the same Figure 2 The package body 199 shown, the electronic component 104 (e.g., a semiconductor chip) can be mounted on a conductive carrier 102 (e.g., a lead frame). Afterwards, a portion of the carrier 102 and the electronic component 104 can be encapsulated by a molding type encapsulant 106. A connection structure 197, which is implemented as a connection hole here, can be formed at or in the package body 199. The connection structure 197 can be configured to connect the package 100 or a portion thereof to another physical structure, for example, by a connection screw or a connection bolt extending through the connection hole. The surface portion of the carrier 102 that remains exposed after encapsulation can be covered with an electrically insulating and thermally conductive interface structure 108.

[0113] The produced protective cap 110 (see reference numeral 206 ) can be slid onto the package body 199 (see reference numeral 208 ). By the described sliding movement, the sensitive interface structure 108 can be mechanically protected by the protective cap 110 .

[0114] The cross-sectional view 210 of the package 100 consisting of the package body 199 and the protective cap 110 also shows the guide structure 114 in the interior of the protective cap 110. In the illustrated embodiment, the guide structure 114 is configured as two parallel guide rails formed integrally with the protective wall at the interior of the protective cap 110. The guide structure 114 is configured to guide the package body 199 to a target position along a target trajectory when the package body 199 is inserted into the receiving volume or through hole 198 in the interior of the protective cap 110. As a result, the package body 199 is obtained according to the target trajectory. Figure 2 A three-dimensional view of package 100 is shown.

[0115] Finally, the plastic tube (which can be obtained from the extrusion process) can be provided with a desired profile and can be trimmed to a desired length to make it suitable for use as a protective cap 110 for the package body 199. The package body 199 can be inserted into the through hole 198 of the protective cap 110 for starting protection. As shown in the figure numeral 212, when the tubular protective cap 110 is slid onto the package body 199, the top side of the package body 199 can remain exposed.

[0116] Figures 3 to 8 Different views of a package 100 with a slidable and removable protective cap 110 are shown according to an exemplary embodiment.

[0117] refer to Figure 3 , which shows the package 100, a mounting force (see reference numeral 214) is currently being applied to two opposite lateral sides of the tubular protective cap 110. Figure 3 In the embodiment of the present invention, the lower wall of the protective cap 110 is thinner than the upper wall, and thus the lower wall will mainly deform in the presence of the mounting force. More specifically, the wall thickness D of the protective cap 110 on the interface structure 108 can be greater than the other wall thickness d of the protective cap 110 on the opposite main surface of the package body 199, which is only defined or bounded by the encapsulant 106. Due to the applied mounting force, a larger opening or receiving space will be created, and the package body 199 can be allowed to slide into the receiving space defined by the through hole 198.

[0118] like Figure 4 As shown, after the package body 199 has been at least partially installed in the protective cap 110, the applied installation force can be released (particularly manually), as shown by reference numeral 216. As a result, the previously elastically deformed protective cap 110 will return to its original shape and thereby retain the package body 199. In order to remove the protective cap 110 from the package body 199, the force can be applied again. Figure 3 The force 214 shown in FIG. 2 is used to terminate the application of the clamping force. In order to enable the described operation, the protective cap 110 can be made of an elastically deformable plastic material.

[0119] Figure 3 and Figure 4 Also shown is a guide structure 114, which is configured here as two parallel guide rails for guiding the edge portion of the sealant 106 of the package body 199 into the accommodation space inside the protective cap 110. The guide structure 114 is formed in the interior of the protective cap 110 to ensure proper positioning of the package body 199 within the protective cap 110. More specifically, the guide structure 114 is formed at the inner wall surface of the protective cap 110. The guide structure 114 is configured here as two parallel aligned guide rails for engaging with the edge of the package body 199 during assembly and disassembly.

[0120] refer to Figure 5 , which shows a protective cap 110 according to another exemplary embodiment. Figure 3 and Figure 4 The difference is that the guide structure 114 is formed at four different positions on the inner surface of the protective cap 110. Descriptively speaking, according to Figure 5 The four guide structures 114 are formed as guide rails that engage the four edge portions of the encapsulant 106 of the package body 199. This configuration can ensure highly accurate definition of the position of the package body 199 in the interior of the protective cap 110. In other words, Figure 5 Top and bottom guide structures 114 are foreseen at the protective cap 110 .

[0121] refer to Figure 6 , a protective cap 110 according to another embodiment is shown in cross-sectional view. In such an embodiment, the protective cap 110 only partially circumferentially surrounds the encapsulant 106 and the interface structure 108. Descriptively speaking, Figure 6 The cross-sectional view of the protection cap 110 is substantially C-shaped. The protection cap 110 is combined with two opposite sides of the package body 199 by clamping or clamping. Figure 6 The described structure of the protective cap 110 has the advantage that it can be manufactured with very low material consumption. In addition, the operator can easily manipulate the protective cap 110, and the operator only needs to clamp the two opposite free ends of the C-shaped protective cap 110 so that the protective cap 110 is removed from the packaging body 199. Figure 6 The protective cap 110 is implemented as a semi-body protective member for selectively covering the interface structure 108. Figure 6 As shown in FIG. 1 , the circumferentially open seashell-like structure of the protective cap 110 may also be provided with a guide structure 114, which is arranged to be in accordance with the embodiment of the present invention. Figure 3 and Figure 4 Arranged in a similar manner.

[0122] refer to Figure 7 , which shows a further exemplary embodiment of a protective cap 110. In this embodiment, the protective cap 110 is designed as a hollow cylindrical tube and thus has very simple measures. Therefore, the protective cap 110 can also have a circular shape in a cross-sectional view.

[0123] refer to Figure 8 , which shows another embodiment of the protective cap 110, which is Figure 7 The embodiment of FIG. 1 is different in that the cross-section of the protection cap 110 is elliptical instead of circular.

[0124] Fig. 9 and Fig.10Different views of a package 100 with an overmolded protective cap 110 are shown according to another exemplary embodiment. In such an embodiment, the protective cap 110 can be integrally joined with the interface structure 108 in the encapsulant 106, for example, can be molded on the interface structure 108. Correspondingly, the manufacturing method can include overmolding the interface structure 108 with the protective cap 110 of the molded type.

[0125] refer to Fig. 9 , which shows the construction of the protective cap 110 , where it is implemented as a 5-sided cap covering the entire mold, except where the leads 220 of the carrier 102 extend beyond the lead side 218 of the encapsulant 106 .

[0126] refer to Fig.10 , which shows a 4-sided or 5-sided protective cap 110 of a blanket type thermal interface structure 108 .

[0127] Figures 11 to 15 Different views of a structure obtained during implementation of a method for manufacturing a package 100 with a protective cap 110 according to a further exemplary embodiment are shown. Figures 11 to 15 A process of capping the thermal interface structure 108 of the package body 199 is shown to provide mechanical protection from scratching and other damage to the sensitive thermal interface structure 108 (and / or other substructures of the package 100).

[0128] refer to Fig.11 A plastic tube 112 is provided as a basis for manufacturing a plurality of protective caps 110. The cross-section of the tube 112 may be selected according to a specific package type (eg, TO design).

[0129] refer to Fig.12 The tube 112 may be divided (eg, cut) into a plurality of pieces, for example, 30 pieces. Each piece may form a separate protective cap 110.

[0130] refer to Fig.13 , a manual operator 222 can perform a manual capping procedure, that is, cap each individual package body 199 with a designated protective cap 110. For example, this can be performed before the final tube making process.

[0131] refer to Fig.14 As shown in FIG. 224 , a user or operator may squeeze the corresponding protective cap 110 before capping to open the side of the protective cap 110 , which simplifies the capping on the corresponding package body 199 .

[0132] refer to Fig.15After the capping is completed, the compressive force can be released or relaxed. Therefore, the protective cap 110 is combined with the package body 199 in a self-clamping manner. Thus, the plastic protective cap 110 protects the thermal interface structure 108, which can be implemented as a soft TIM layer. Before the use or operation of the package 100, the operator can remove the protective cap 110 from the package body 199 with the opposite manipulation scheme described for the capping.

[0133] Fig.16 A package body 199 is shown covered by a protective cap 110 having a locally thickened protective wall 194 in physical contact with an interface structure 108 according to an exemplary embodiment. More specifically, the protective cap 110 covers the interface structure while being in physical contact with substantially the entire interface structure 108. Fig.16 , the protective cap 110 is designed so that there is no gap between the soft interface structure 108 and the protective cap 110. In the illustrated embodiment, the protective cap 110 can be made of a plastic such as polyvinyl chloride, polycarbonate, etc. When the protective cap 110 is alternatively made of a highly thermally conductive metal (e.g., aluminum), the protective cap 110 can remain permanently connected to the package body 199.

[0134] Fig.17 A package body 199 is shown covered by a protective cap 110 having a locally thickened protective wall 194 arranged in a non-contact manner relative to the interface structure 108 according to an exemplary embodiment. Fig.17 , the protection cap 110 covers the interface structure 108 without physically contacting the interface structure 108. For example, the gap d between the outer surface of the interface structure 108 and the inner surface of the protection cap 110 may be in a range between 50 μm and 1 mm.

[0135] Fig.18 The package body 199 is shown covered by the protective cap 110 only along a portion of the periphery of the package body 199 according to an exemplary embodiment.

[0136] Fig.19 A portion of a protective cap 110 having a predetermined breaking point 173 according to an exemplary embodiment is shown. Thus, the protective cap 110 has a predetermined breaking point 173 that is configured to break when a braking force is applied to the protective cap 110. The predetermined breaking point 173 that provides a localized mechanical weakening allows the protective cap 110 to be easily and predictably removed from the package body 199 by selectively breaking the protective cap 110 at the predetermined breaking point 173.

[0137] Figure 20 to Figure 23A protective cap 110 according to an exemplary embodiment is shown assembled on a fixture 175 or other mounting structure and ultimately stored in an external shipping tube 176 after being mounted on a corresponding package body 199. Fig. 20 , the protective cap 110 is loaded into the fixture 175. Fig.21 , the protective cap 110 is opened by the actuator 181 to be assembled with the corresponding package body 199. Fig. 22 , the package body 199 is loaded into the opened protection cap 110 in the fixture 175. Fig.23 The correspondingly obtained package 100, which may be denoted as an inner transfer capsule, may be inserted into an outer transport tube 176, for example, for further processing or further manipulation or for transport purposes.

[0138] Fig.24 and Fig.25 1 shows an assembly of a package body 199 having an interface structure 108 covered in a contacting manner by a protective cap 110 according to an exemplary embodiment. In this gap-free configuration, the protective cap 110 can be opened by applying mechanical pressure, such as Fig.24 To do this, the side of the protective cap 110 can be pushed to open it, and the package body 199 can be aligned with the bottom and can be slid in. Fig.25 As shown in , the externally applied pressure can then be released to close the protective cap 110, so that the inner wall of the protective cap 110 is in full surface contact with the interface structure 108. Through this full surface contact, the risk of damage to the interface structure 108 caused by scratching due to excessive force peaks can be reduced. In contrast, full surface contact can distribute the force over a large surface of the interface structure 108.

[0139] Fig.26 FIG. 1 shows a package body with two interface structures 108 for double-sided cooling covered by a single protective cap 110 according to an exemplary embodiment. In other words, the interface structures 108 may be provided on both opposing main surfaces of the package body 199, such as Fig.26 As shown in . As a result, heat can be particularly effectively conducted out of the package 100 from the two opposite main surfaces of the package 100. The two interface structures 108 are protected by a common single protective cap 110, that is, by its two opposite walls. In order to assemble the package body 199 into the protective cap 110, the side of the protective cap 110 can be pushed to open it, and then the package body 199 can be slid into the spatially extended protective cap 110.

[0140] Fig. 27A protective cap 110 according to an exemplary embodiment is shown having predetermined breaking points 173 at two lateral sides of the protective cap 110. The predetermined breaking points 173 are local weakened portions of the sidewalls of the protective cap 110. This allows the protective cap 110 to be opened with a reasonable force without destroying the predetermined breaking points 173, and it also allows the protective cap 110 to be intentionally broken at the predetermined breaking points 173 when the force exceeds a predefined threshold.

[0141] Fig.28 The protective cap 110 is shown with a removal trigger structure 179 configured as a tab during assembly according to an exemplary embodiment. In other words, the protective cap 110 includes a removal trigger structure 179, particularly a tab, which is configured for triggering removal of the protective cap 110 from the package body 199. Fig.29 Shown according to Fig.28 Detail of the tabs. Fig.30 shows the disassembly period according to Fig.28 and Fig.29 A protective cap 110 is provided. Fig.31 Shown in open configuration Figures 28 to 30 Therefore, Figure 28 to Figure 31 Operation of a protective cap 110 having a pull tab for removal is shown. Fig.29 As shown, the tab-type removal trigger structure 179 opens at structure 185 and has a locking mechanism 187 that can be unlocked by operating or actuating structure 185. Fig.28 , pushing the protective cap 110 at the side to place the package body 199 therein. Thereafter, releasing the assembly force to keep the package body 199 in the proper position within the protective cap 110 (compare Fig.30 ).like Fig.31 As shown, after the package body 199 is installed in the protective cap 110, the tab can be pulled to open the protective cap 110, thereby releasing the package body 199. Descriptively, the pulling at the removal trigger structure 179 causes the tab-type protective cap 110 to break.

[0142] Fig.32 1 shows the protective cap 110 during heat-triggered assembly according to an exemplary embodiment. In this embodiment, the protective cap 110 is configured for heat-triggered assembly and / or removal of the protective cap 110 on the package 100. For example, Fig.32 The capsule-type protective cap 110 opens in a self-sufficient manner at a predetermined elevated temperature (e.g., when heated to a predetermined elevated temperature above the ambient temperature, the elevated temperature being, for example, in a range between 25° C. and 200° C.). The temperature increase may then be a sufficient trigger mechanism for removing the protective cap 110 .

[0143] Fig.33A protective cap 110 is shown with a predetermined breaking point 173 according to an exemplary embodiment. The application of a lateral force causes the plastic capsule-type protective cap 110 to rupture for releasing the package body 199.

[0144] Fig.34 The protective cap 110 is shown during a heat-triggered assembly according to an exemplary embodiment. A temperature increase (e.g., up to a predetermined temperature that may be in the range from 25° C. to 200° C.) will act on the protective cap 110 and will exert a thermal assembly force 216 thereon to open the protective cap 110. Afterwards, the package body 199 may be assembled within the thermally opened protective cap 110. After the loading process, the temperature increase may be released (i.e., the package 100 may be actively or passively cooled to ambient temperature), which will automatically trigger the connection force between the package body 199 and the protective cap 110.

[0145] Fig.35 A protective cap 110 is shown with a removal trigger structure 179 (particularly a tear-off zipper) according to an exemplary embodiment. Fig.35 It is shown that a zipper may be integrated into the wall of the protective cap 110. After the protective cap 110 is assembled with the package body 199, the protective cap 110 may be removed by actuating the zipper-like removal trigger structure 179.

[0146] Figure 36 to Figure 39 A protective cap 110 is shown during automated robotic manipulation according to an exemplary embodiment. More specifically, Figure 36 to Figure 38 A robot 189 is shown for manipulating the package 100. The robot 189 has a first robot part 191 and a second robot part 193. Fig.36 and Fig.37 , the capsule-type protective cap 110 is pulled off from the packaging body 199 by the robot 189. Fig.38 , the robot 189 pushes out the capsule-type protective cap 110.

[0147] according to Fig.39 , which shows a protective cap 110 with an integrated heat sink 169. Descriptively speaking, Fig.39 The embodiment of the embodiment relates to a protective member with an extended heat sink 169. This provides damage protection for the surface of the corresponding package 100, wherein, in this embodiment, the protective cap 110 also serves as a heat sink 169 to dissipate the package heat. More specifically, a heat conduction path is established from the encapsulated component 104 via the carrier 102, the interface structure 108 to the protective cap 110, wherein the heat sink 169 is formed on the outside of the protective cap 110. Therefore, Fig.39The protective cap 110 also performs a cooling function. Preferably, the cap material is heat-conductive or heat-conductive (which can provide high voltage insulation through the package 100). The protective cap 110 having the function of a heat sink 169 can be used permanently. Fig.39 In the illustrated embodiment, the heat sink 169 is provided with a plurality of cooling fins 167 for facilitating heat removal. Thus, the protective cap 110 may include an integrated heat sink 169 .

[0148] Fig.40 1 shows a cross-sectional view of a package 100 having a protective cap 110 mounted on a mounting structure 132 and having an inherent heat dissipating body or heat sink 169 according to another exemplary embodiment. Figure 1 However, according to Fig.40 , the heat sink 169 forms part of the package 100, more specifically, forms part of the cap 100. Therefore, Fig.40 The metal cap 110 serves as a heat sink 169 and is not removed during operation of the vertical package 100 .

[0149] Fig.41 A package 100 is shown with a reversibly attachable and detachable protective cap 110 having cooling fins 167 on two opposing sides for double-sided cooling according to an exemplary embodiment. Fig.41 Examples and Fig.39 The embodiment of is different in that a respective heat sink 169 is provided on each of the two opposite sides of the package 100 in order to discharge the heat to the two opposite sides in a very efficient manner.

[0150] Fig.42 A package 100 is shown having a reversibly attachable and removable protective cap 110 having two thermal interface structures or materials 108 ′, 108 ″ according to an exemplary embodiment.

[0151] according to Fig.42 , and even more generally, the material of cap 110 can be metal (providing high thermal conductivity and no electrical insulation), plastic (for providing low thermal conductivity or even no thermal conductivity and providing high electrical insulation), or metal covered with a thermal interface (thermally conductive, but electrically insulating).

[0152] Reference again Fig.42, the cap 110 has an outer metal shell 157 (for example, made of aluminum or copper), a first thermal interface material 108' in contact with the package body 199, and a second thermal interface material 108' between the metal shell 157 and the first thermal interface material 108'. The first thermal interface material 108' can be a soft TIM to be protected (for example, thermal grease or phase change material) and is not necessarily electrically insulating. The second thermal interface material 108" can also be an electrically insulating TIM material (hard or soft) and can be pre-applied to the protective cap 110. Therefore, the interface structure 108 can include two parts 108' and 108" sections of different materials.

[0153] It should be noted that the term "comprising" does not exclude other elements or features, and "a" does not exclude a plurality. In addition, elements described in association with different embodiments may be combined. It should also be noted that the reference numerals should not be interpreted as limiting the scope of the claims. In addition, the scope of the present application is not intended to be limited to the specific embodiments of the processes, machines, manufactures, material compositions, devices, methods and steps described in the specification. In addition, the appended claims are intended to include these processes, machines, manufactures, material compositions, devices, methods or steps within their scope.

Claims

1. A package (100), comprising: A conductive carrier (102); an electronic component (104) on the carrier (102); an encapsulant (106) encapsulating a portion of the carrier (102) and the electronic component (104); an electrically insulating and thermally conductive interface structure (108) covering an exposed surface portion of the carrier (102); and a protective cap (110) covering at least a portion of the interface structure (108), The protective cap (110) is configured to be reversibly attached to and removable from a packaging body (199), wherein the packaging body (199) is formed by the carrier (102), the electronic component (104), the encapsulant (106) and the interface structure (108).

2. The package (100) according to claim 1, wherein: The protective cap (110) additionally covers at least a portion of the encapsulant (106).

3. The package (100) according to claim 1, wherein: The protective cap (110) comprises or consists of an electrically insulating material.

4. The package (100) according to claim 3, wherein: The electrically insulating material comprises a plastic material.

5. The package (100) according to any one of claims 1 to 4, wherein: A wall thickness (D) of the protective cap (110) on at least a portion of the interface structure (108) is greater than another wall thickness (d) of the protective cap (110) on at least a portion of the encapsulant (106).

6. The package (100) according to any one of claims 1 to 4, wherein: The protective cap (110) includes a guide structure (114) in the interior of the protective cap (110), the guide structure (114) being used to guide the encapsulant (106) within the protective cap (110).

7. The package (100) according to any one of claims 1 to 4, comprising one of the following features: in, The protective cap (110) completely circumferentially surrounds the encapsulant (106) and the interface structure (108); wherein the protective cap (110) only partially circumferentially surrounds the encapsulant (106) and the interface structure (108); Wherein, the protective cap (110) is made of a deformable material; Wherein, the protective cap (110) is made of an elastically deformable material; wherein the protective cap (110) covers the interface structure (108) without physically contacting the interface structure (108); wherein the protective cap (110) covers the interface structure (108) while being in physical contact with the entire interface structure (108); Wherein, the protective cap (110) comprises metal or is composed of metal; Wherein, the protective cap (110) comprises plastic or consists of plastic; The protective cap (110) has a predetermined breaking point (173), and the predetermined breaking point (173) is configured to break when a braking force is applied to the protective cap (110); Wherein, the protective cap (110) is configured to be used for thermally triggering the assembly and / or disassembly of the protective cap (110); wherein the protective cap (110) comprises a removal triggering structure (179) configured to trigger the removal of the protective cap (110); wherein the protective cap (110) comprises one of a tab and a zipper configured to trigger removal of the protective cap (110); Wherein, the protective cap (110) includes an integrated heat sink (169); Wherein, the interface structure (108) is made of soft material; The interface structure (108) includes two sections (108', 108") made of different materials.

8. The package (100) according to any one of claims 1 to 4, comprising another electrically insulating and thermally conductive interface structure (108) and another carrier (102), wherein the another electrically insulating and thermally conductive interface structure (108) covers an exposed surface portion of the another carrier (102); in, The protective cap (110) covers at least a portion of the other electrically insulating and thermally conductive interface structure (108).

9. A method of manufacturing a package (100), the method comprising: Mounting an electronic component (104) on a conductive carrier (102); encapsulating a portion of the carrier (102) and the electronic component (104) by an encapsulant (106); covering the exposed surface portion of the carrier (102) with an electrically insulating and thermally conductive interface structure (108); as well as At least a portion of the interface structure (108) is covered by a protective cap (110), The protective cap (110) is configured to be reversibly attached to and removable from a packaging body (199), wherein the packaging body (199) is formed by the carrier (102), the electronic component (104), the encapsulant (106) and the interface structure (108).

10. The method according to claim 9, wherein: The method includes dividing the tube into a plurality of protective caps (110), and using each of the divided protective caps (110) for a designated package (100).

11. The method according to claim 9, wherein: The method includes forming the protective cap (110) by extrusion.

12. The method according to claim 9, wherein: The method includes overmolding the interface structure (108) with a molded-type protective cap (110).

13. The method according to any one of claims 9 to 12, wherein: The method includes forming the protective cap (110) by dipping into a cap precursor to simultaneously cover exposed conductive structures of the package (100) with the cap precursor.

14. A method of operating a package (100) according to any one of claims 1 to 8, the method comprising: Before using the package (100), sliding the protective cap (110) onto the interface structure (108) to protect the interface structure (108); as well as The protective cap (110) is then removed from the interface structure (108) to expose the interface structure (108) for use of the package (100).

15. The method according to claim 14, comprising at least one of the following features: in, The method comprises applying a compressive force to the protective cap (110) before the sliding, and removing the compressive force after the sliding, thereby fixing the protective cap (110); The method includes attaching the electrically insulating and thermally conductive interface structure (108) to a heat dissipation body (112) after the removing.

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