A patch microphone structure and electronic atomization device

Abstract

The present invention discloses a patch microphone structure and an electronic atomization device, wherein the patch microphone structure comprises a microphone and an IC chip, wherein the microphone and the IC chip are separated and patch-mounted on a host PCB board. The present invention sets the microphone and the IC chip separately to avoid the heat generated by the IC chip damaging the components inside the microphone, thereby extending the service life of the microphone. At the same time, the microphone is soldered on the host PCB board by patching, which can be automatically batched and quickly soldered, thereby improving production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of airflow sensing equipment, and in particular to a patch microphone structure and an electronic atomization device. Background Art

[0002] The microphone is an airflow-sensing switch. After it is installed on the electronic cigarette, the user induces the flow of gas inside the electronic cigarette through the mouthpiece. The microphone can sense the change in air pressure caused by the change in airflow, thereby triggering the switch to automatically turn on the electronic cigarette.

[0003] There are two types of existing electronic cigarette microphones. One type is that the microphone is electrically connected to the PCB board of the electronic cigarette through a wire, wherein the welding process of the wire is completed manually, which takes a long time to weld, has a high production cost, is not conducive to mass production, and occupies a large space.

[0004] The other is that the IC chip of the microphone is still set inside the microphone, and the IC chip of the microphone will generate heat during operation, which will cause the diaphragm of the microphone to deform due to heat, which may damage the diaphragm or cause the diaphragm to deform, causing the microphone switch to automatically output and cause malfunction, thus affecting the normal use of the electronic cigarette. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a chip microphone structure, which aims to separate the microphone from the IC chip to prevent the heat generated by the IC chip from damaging the components in the microphone. At the same time, by patching the chip on the host PCB board, it can be automatically and quickly welded in batches to improve production efficiency.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] A patch microphone structure, comprising a microphone and an IC chip; the microphone and the IC chip are separated and patch-mounted on a host PCB board.

[0008] The host PCB board includes a first surface and a second surface that are arranged opposite to each other, the microphone patch is arranged on the first surface, and the IC chip patch is arranged on the second surface.

[0009] The first surface and the second surface of the host PCB board are respectively provided with SMT patch pins, and the microphone and the IC chip are respectively patched on the SMT patch pins.

[0010] The microphone includes an air pressure sensor and a microphone PCB board, the air pressure sensor is arranged on the microphone PCB board, and the microphone PCB board patch is arranged on the surface of the host PCB board.

[0011] Wherein, the microphone includes an air pressure sensor, and the air pressure sensor is arranged on the surface of the host PCB board.

[0012] The microphone further comprises a protective shell, which is fixed on the microphone PCB board and covers the air pressure sensor. An air inlet is arranged on the protective shell, and the microphone PCB board and the host PCB board under the protective shell are provided with air outlets, and the air inlet and the air outlet are staggered.

[0013] Wherein, the connection between the protective shell and the microphone PCB board is sealed.

[0014] The microphone and the IC chip are aligned and arranged on two opposite surfaces of the host PCB board.

[0015] Among them, it also includes an anti-static TVS tube, and the TVS tube patch is arranged on the host PCB board.

[0016] The present invention further proposes an electronic atomization device, comprising an atomizer and a host connected to the atomizer, wherein the host comprises a shell and a bracket arranged in the shell, and the bottom of the bracket is provided with the aforementioned patch microphone structure.

[0017] The patch microphone structure of the present invention can dissipate heat independently by separately arranging the microphone and the IC chip on the host PCB board, and the heat generated by the IC chip will not damage the components in the microphone, thereby ensuring the reliability of the microphone and extending the service life of the microphone. At the same time, the microphone and the IC chip are welded on the host PCB board by patch method, thus avoiding manual welding in the prior art, and the microphone structure can be welded automatically and in batches by a machine, and the welding is efficient and fast, thereby improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 This is a structural schematic diagram of a first embodiment of the present invention in which a patch microphone structure is installed on a host PCB board;

[0020] Figure 2 for Figure 1 Back side schematic diagram of the structure;

[0021] Figure 3 for Figure 1a first exploded schematic diagram of the structure;

[0022] Figure 4 for Figure 1 a second exploded schematic diagram of the structure;

[0023] Figure 5 This is a schematic diagram of the exploded structure of the microphone and the host PCB board;

[0024] Figure 6 It is a schematic diagram of an air inlet hole being arranged on the protective shell;

[0025] Figure 7 This is a schematic diagram of a host PCB board having an air outlet;

[0026] Figure 8 It is a structural schematic diagram of the first embodiment of the electronic atomization device of the present invention;

[0027] Fig. 9 for Figure 8 Schematic diagram of the structure.

[0028] Description of reference numerals:

[0029] 1-microphone, 11-air pressure sensor, 12-microphone PCB board, 13-protective shell, 131-air inlet, 2-IC chip, 3-TVS tube, 4-LED lamp, 100-host PCB board, 101-first surface, 102-second surface, 103-SMT patch pin, 104-air outlet, 200-atomizer, 300-host, 301-shell, 302-bracket, 400-electronic atomization device DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0034] Please refer to Figures 1 to 4 The present invention proposes a patch microphone structure, including a microphone 1 and an IC chip 2. The microphone 1 is used to sense the change of air pressure in the electronic cigarette, and the IC chip 2 processes the change of the electrical signal corresponding to the change of air pressure and sends it to the main control circuit on the host PCB board 100 for comprehensive control.

[0035] The microphone 1 and the IC chip 2 of the present invention are separated and patch-mounted on the host PCB board 100. That is, the microphone 1 and the IC chip 2 are separately arranged on the host PCB board 100, and can be separately arranged on the same surface of the host PCB board 100, or can be separately arranged on two opposite surfaces of the host PCB board 100. The host PCB board 100 is printed with wires to electrically connect the separately arranged microphone 1 and the IC chip 2. The host PCB board is also provided with other circuits such as the LED light 4, the main control circuit of the electronic cigarette, the key circuit, the charging circuit, the heating control circuit, etc.

[0036] In the present invention, since the microphone 1 and the IC chip 2 are separately arranged, the heat generated by the IC chip 2 can be directly dissipated, which is beneficial to the heat dissipation of the microphone structure. At the same time, the heat generated by the IC chip 2 will not enter the microphone 1, avoiding the defect in the prior art that the heat generated by the IC chip 2 disposed in the microphone 1 will damage the components in the microphone 1.

[0037] The microphone 1 and the IC chip 2 of the present invention are mounted on the host PCB board 100, so there is no need for manual welding as in the prior art, but mechanical equipment such as a mounter can be used for automatic welding. In this way, the patch microphone structure of the present invention can be welded on the host PCB board 100 in batches and quickly, greatly improving production efficiency.

[0038] Specifically, Figure 3 and Figure 4 As shown, the host PCB board 100 of the present invention comprises a first surface 101 and a second surface 102 arranged oppositely, the microphone 1 patch is arranged on the first surface 101, and the IC chip 2 patch is arranged on the second surface 102. That is, in this embodiment, the microphone 1 and the IC chip 2 are located on different surfaces on the host PCB board 100, so that the connection line between the IC chip 2 and the microphone 1 can pass through the host PCB board 100; if the IC chip 2 and the microphone 1 are arranged on the same side of the host PCB board 100, then it is necessary to add wiring on the host PCB board 100, so the cost is higher than the above, and from the perspective of heat dissipation, the heat dissipation effect of the IC chip 2 and the microphone 1 arranged oppositely is also better, that is, the heat generated by the chip 2 has less influence on the microphone 1.

[0039] The first surface 101 and the second surface 102 of the host PCB board 100 of this embodiment are respectively provided with SMT patch pins 103, and the microphone 1 and the IC chip 2 are respectively mounted on the SMT patch pins 103. The arrangement of the SMT patch pins 103 on the first surface 101 and the second surface 102 facilitates the automated patch welding of the microphone 1 and the IC chip 2.

[0040] Furthermore, the microphone 1 and the IC chip 2 are aligned on two opposite surfaces of the host PCB board 100. That is, the position of the microphone 1 on the first surface 101 of the host PCB board 100 and the position of the IC chip 2 on the second surface 102 of the host PCB board 100 are aligned, so that the connecting wire between the microphone 1 and the IC chip 2 is the shortest, saving costs.

[0041] Preferably, Figure 1 and Figure 3 As shown, the microphone structure of the present invention further includes an anti-static TVS tube 3, and the TVS tube 3 patch is arranged on the host PCB board 100. The TVS tube 3 is a transient voltage suppression diode, which can absorb surge power of up to several kilowatts and clamp the voltage between the two electrodes to a predetermined value, thereby effectively protecting the precision components in the electronic circuit from damage by various surge pulses, and having an anti-static effect.

[0042] Since static electricity often occurs in life, and the IC chip 2 of the microphone in the prior art has a low static resistance, it is easily damaged by static electricity in daily use. However, the present invention provides an anti-static TVS tube 3 on the host PCB board 100, and the TVS tube 3 is electrically connected to the IC chip 2 through the wire on the host PCB board 100, thereby providing anti-static protection for the IC chip 2.

[0043] In this embodiment, two TVS tubes 3 are provided, which are respectively mounted on two sides of the microphone 1 on the host PCB board 100 .

[0044] As an implementation method, Figure 5 As shown, the microphone 1 of the present invention includes an air pressure sensor 11 and a microphone PCB board 12, the air pressure sensor 11 is arranged on the microphone PCB board 12, and the microphone PCB board 12 is patch-mounted on the surface of the host PCB board 100.

[0045] The microphone 1 in the prior art uses a diaphragm to sense airflow changes, but the diaphragm is easily damaged. The microphone 1 in the embodiment of the present invention uses an air pressure sensor 11 to replace the diaphragm in the prior art to sense airflow changes, thereby extending the service life of the microphone 1.

[0046] The microphone PCB board 12 is used to electrically connect the air pressure sensor 11 with the wires on the host PCB board 100. The arrangement of the microphone PCB board 12 facilitates the connection between the air pressure sensor 11 and the host PCB board 100 and reduces the production cost. Because directly welding the air pressure sensor 11 on the host PCB board 100 requires special equipment for welding, the equipment cost is very high, while welding the air pressure sensor 11 with the microphone PCB board 12 on the host PCB board 100 has a simple process and low cost, and only needs to weld the microphone PCB board 12 on the host PCB board 100 by means of patch.

[0047] It can be understood that, as another embodiment, the microphone 1 of the present invention includes an air pressure sensor 11, and the air pressure sensor 11 is arranged on the surface of the host PCB board 100. In this embodiment, the air pressure sensor 11 is directly arranged on the host PCB board 100.

[0048] The air pressure sensor 11 of the present invention is a capacitive air pressure sensor 11. The capacitive air pressure sensor 11 has high sensitivity, simple structure and low cost.

[0049] like Figure 6 and Figure 7As shown, the microphone 1 of the embodiment of the present invention further includes a protective shell 13, the protective shell 13 is fixed on the microphone PCB board 12 and covers the air pressure sensor 11, the protective shell 13 is provided with an air inlet 131, the microphone PCB board 12 and the host PCB board 100 under the protective shell 13 are penetrated with an air outlet 104, and the air inlet 131 and the air outlet 104 are staggered. The air inlet 131 is connected with the air outlet 104, and the air outlet 104 penetrates the microphone PCB board 12 and the host PCB board 100. The airflow enters from the air inlet 131 on the protective shell 13, and then is led out from the other side of the host PCB board 100 through the air outlet 104. In this process, because the airflow passes through the air pressure sensor 11, the air pressure sensor 11 senses the change of the airflow and obtains the air pressure signal, which is processed by the IC chip 2 and sent to the main control circuit. The main control circuit controls the opening and closing of the heating circuit of the electronic cigarette according to the air pressure signal. The staggered arrangement of the air inlet 131 and the air outlet 104 allows the air flow to fully flow through the air pressure sensor 11 .

[0050] Preferably, the connection between the protective shell 13 and the microphone PCB board 12 is sealed. A sealant or a sealing ring can be used for the sealing, so as to prevent the airflow from leaking from the edge of the protective shell 13 and affecting the sensing effect of the air pressure sensor 11.

[0051] like Figure 8 and Fig. 9 As shown, the present invention also proposes an electronic atomization device 400, including an atomizer 200 and a host 300 connected to the atomizer 200, the host 300 includes a shell 301 and a bracket 302 arranged in the shell 301, and the bottom of the bracket 302 is provided with the above-mentioned patch microphone structure.

[0052] The SMD microphone structure and the electronic atomization device 400 proposed in the embodiment of the present invention, by separately arranging the microphone 1 and the IC chip 2 on the host PCB board 100, the IC chip 2 can dissipate heat independently, and the heat generated by the IC chip 2 will not damage the components in the microphone 1, thereby ensuring the reliability of the microphone 1 and extending the service life of the microphone 1. At the same time, the microphone 1 and the IC chip 2 are soldered on the host PCB board 100 by SMD, so that the microphone structure can be automatically and batch-welded by a machine, and the welding is efficient and fast, thereby improving production efficiency.

[0053] The above description is only an example to clearly illustrate the present invention, and does not limit the patent scope of the present invention. It is impossible to list all the implementation methods here. All equivalent structural changes made by using the contents of the technical solution of the present invention under the concept of the present invention, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A patch microphone structure, characterized in that: Including microphone and IC chip; The microphone and the IC chip are separated and mounted on the host PCB board; The microphone and the IC chip are aligned and arranged on two opposite surfaces of the host PCB board; It also includes an anti-static TVS tube, and the TVS tube patch is arranged on the host PCB board; The microphone includes an air pressure sensor and a microphone PCB board, the air pressure sensor is arranged on the microphone PCB board, and the microphone PCB board patch is arranged on the surface of the host PCB board.

2. The patch microphone structure according to claim 1, characterized in that: The host PCB board includes a first surface and a second surface which are arranged opposite to each other, the microphone patch is arranged on the first surface, and the IC chip patch is arranged on the second surface.

3. The patch microphone structure according to claim 2, characterized in that: The first surface and the second surface of the host PCB board are respectively provided with SMT patch pins, and the microphone and the IC chip are respectively patched on the SMT patch pins.

4. The patch microphone structure according to claim 1, characterized in that: The microphone also includes a protective shell, which is fixed on the microphone PCB board and covers the air pressure sensor. The protective shell is provided with an air inlet hole, and the microphone PCB board and the host PCB board under the protective shell are penetrated with air outlet holes, and the air inlet holes are staggered with the air outlet holes.

5. The patch microphone structure according to claim 4, characterized in that: The connection between the protective shell and the microphone PCB board is sealed.

6. An electronic atomization device, comprising an atomizer and a host connected to the atomizer, characterized in that: The host comprises a shell and a bracket arranged in the shell, and the bottom of the bracket is provided with a patch microphone structure as described in any one of claims 1 to 5.

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