Electronic packaging and method of manufacturing the same

Abstract

The present invention relates to an electronic package and a manufacturing method thereof, which can be combined with a heat sink on an electronic component via an intermediate structure, wherein the intermediate structure includes a drainage portion and a permanent fluid combined with the drainage portion, so that the permanent fluid contacts the electronic component, so that the intermediate structure has a good heat dissipation effect and can prevent the electronic component or the heat sink from excessive warping due to stress concentration.

Description

Technical Field

[0001] The present invention relates to a packaging structure, in particular to an electronic packaging component with a heat dissipation component and a manufacturing method thereof. Background Art

[0002] As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher density electronic components and electronic circuits, so semiconductor chips will generate more heat energy during operation. In addition, since the traditional packaging colloid that covers the semiconductor chip is a poor heat transfer material with a thermal conductivity of only 0.8Wm-1k-1 (i.e., the heat dissipation efficiency is poor), if the heat generated by the semiconductor chip cannot be effectively dissipated, it will cause damage to the semiconductor chip and product reliability issues.

[0003] Therefore, in order to quickly dissipate the heat to the outside, the industry usually configures a heat sink (heat spreader) in the semiconductor package. The heat sink is usually bonded to the back of the chip through a thermal adhesive to dissipate the heat generated by the semiconductor chip through the thermal adhesive and the heat sink. In addition, the top surface of the heat sink is usually exposed to the packaging glue or directly exposed to the atmosphere to achieve a better heat dissipation effect.

[0004] like Figure 1 As shown, the manufacturing method of the conventional semiconductor package 1 is to first place a semiconductor chip 11 on a package substrate 10 with its active surface 11a by flip chip bonding (i.e., through conductive bumps 110 and bottom glue 111), and then place a heat sink 13 on the inactive surface 11b of the semiconductor chip 11 with its top sheet 130 through heat dissipation glue 12, and the support legs 131 of the heat sink 13 are mounted on the package substrate 10 through an adhesive layer 14. Next, a package molding operation is performed so that the packaging glue (not shown) covers the semiconductor chip 11 and the heat sink 13, and the top sheet 130 of the heat sink 13 is exposed to the packaging glue.

[0005] During operation, the heat energy generated by the semiconductor chip 11 is conducted to the top plate 130 of the heat sink 13 through the inactive surface 11 b and the heat dissipation adhesive 12 to be dissipated to the outside of the semiconductor package 1 .

[0006] However, in the conventional semiconductor package 1 , the heat dissipation adhesive 12 has poor thermal conductivity after curing, resulting in limited heat dissipation effect and difficulty in meeting the high heat dissipation requirements of the semiconductor package 1 .

[0007] In addition, when the semiconductor package 1 is required to be thinner and larger in area, the deformation (i.e., warping) between the heat sink 13 and the heat dissipation adhesive 12 is more obvious due to the large mismatch in the coefficient of thermal expansion (CTE). When the deformation is too large, delamination is likely to occur between the top sheet 130 of the heat sink 13 and the heat dissipation adhesive 12 (or the semiconductor chip 11), which not only reduces the thermal conductivity, but also causes a poor appearance of the semiconductor package 1, and even seriously affects the reliability of the product.

[0008] In addition, in the manufacturing process of the existing semiconductor package 1, the adhesive layer 14 is usually heated and glued to the packaging substrate 10, and then the supporting legs 131 of the heat sink 13 are directly adhered. After the adhesive layer 14 is cooled, an adhesive force is generated to adhere the packaging substrate 10 and the heat sink 13 to each other. However, bubbles are easily generated in the adhesive layer 14 during the heating process, resulting in poor structural strength of the adhesive layer 14, which easily causes the heat sink 13 to fall off.

[0009] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0010] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package and a manufacturing method thereof, which has a good heat dissipation effect.

[0011] The electronic package of the present invention comprises: an electronic component; an intermediate structure disposed on the electronic component, wherein the intermediate structure comprises a drainage portion and a permanent fluid combined with the drainage portion, and the permanent fluid is attached to the electronic component; and a heat sink combined with the electronic component via the intermediate structure.

[0012] The present invention also provides a method for manufacturing an electronic package, comprising: forming an intermediate structure on a heat sink, wherein the intermediate structure includes a drainage portion and a permanent fluid combined with the drainage portion; and pressing an electronic component onto the intermediate structure so that the heat sink is combined with the electronic component via the permanent fluid.

[0013] In the aforementioned electronic packaging component and its manufacturing method, the permanent fluid is liquid metal or oily substance.

[0014] In the aforementioned electronic package and its manufacturing method, the drainage portion is a plate, and the manufacturing process of the intermediate structure includes: leveling the permanent fluid on the heat sink; and placing the plate on the permanent fluid accordingly. For example, the plate is a metal plate. Alternatively, the plate has a plurality of grids of different specifications. Further, the plate has a plurality of first grids and a plurality of second grids, and the width of the first grid is greater than the width of the second grid.

[0015] In the aforementioned electronic package and its manufacturing method, the heat sink comprises a heat sink and a support leg disposed on the heat sink, and the heat sink is combined with the electronic element via the intermediate structure. For example, the heat sink has a concave-convex structure. Alternatively, the support leg has a concave-convex structure.

[0016] In the aforementioned electronic packaging component and its manufacturing method, the heat sink has a concave-convex structure.

[0017] In the aforementioned electronic package and its manufacturing method, the heat sink has an air space for retaining the permanent fluid overflow.

[0018] The aforementioned electronic package and its manufacturing method also include a stopper on the heat sink to prevent the permanent fluid from overflowing. For example, the stopper is bonded to the heat sink via a bonding layer, or the stopper and the heat sink are integrally formed.

[0019] The aforementioned electronic package and its manufacturing method further include a carrier for arranging the electronic component, which is electrically connected to the electronic component. Further, a stopper is provided on the heat sink, and a gap or a strengthening layer is formed between the stopper and the carrier. Alternatively, a gap is formed between the heat sink and the carrier or a strengthening layer is configured.

[0020] In the aforementioned electronic package and its manufacturing method, the intermediate structure further includes an auxiliary portion, which is combined with the electronic component and / or the heat sink to contact the permanent fluid.

[0021] As can be seen from the above, the electronic package and its manufacturing method of the present invention are mainly achieved by using the intermediate structure as a flexible material to effectively disperse thermal stress, and the extremely high thermal conductivity and specific heat capacity of the drainage portion can improve the overall heat transfer efficiency of the intermediate structure, and the large surface tension of the permanent fluid enables the drainage portion to restrain the flow of the permanent fluid on the surface of the electronic component. Therefore, compared with the prior art, the intermediate structure of the electronic package of the present invention not only has a better heat dissipation effect, but also can prevent the electronic component or heat sink from excessive warping due to stress concentration.

[0022] In addition, the configuration of the stopper makes the flow path of the permanent fluid longer, so that the permanent fluid is not easy to flow out of the heat sink.

[0023] In addition, through the design of the air space, when the temperature rises, the volume of the permanent fluid will expand and flow into the air space, thereby preventing the permanent fluid from affecting the operation of the electronic component or the heat sink.

[0024] In addition, the support foot is designed with a concave-convex structure to enhance the bonding property. Therefore, compared with the prior art, the manufacturing method of the present invention can prevent the heat sink from falling off during the heating process by clamping the concave-convex structure and the adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0026] FIG. 2A to FIG. 2D It is a cross-sectional schematic diagram of a method for manufacturing an electronic package of the present invention.

[0027] Figure 2A 'for Figure 2A A partial cross-sectional schematic diagram of another embodiment of the present invention.

[0028] Figure 2B 'and Figure 2B "for Figure 2B A partial top view schematic diagram of .

[0029] Figure 2D 'for Figure 2D A partial top view schematic diagram of .

[0030] Figure 3 FIG. 4 is a partial cross-sectional schematic diagram of another embodiment of the electronic package of the present invention.

[0031] Figure 3 ' is another embodiment of 3.

[0032] Figure 4 It is a partial cross-sectional view of another embodiment of the electronic package of the present invention.

[0033] Description of Reference Numerals

[0034] 1 semiconductor package 10 package substrate

[0035] 11 semiconductor chip 11a active surface

[0036] 11b non-active surface 110 conductive bump

[0037] 111 Base glue 12 Heat dissipation glue

[0038] 13,20 heat sink 130 top sheet

[0039] 131 Support foot 14 Adhesive layer

[0040] 2,3,3', 4 electronic package 200,300 heat sink

[0041] 201 first support leg 202 second support leg

[0042] 203,203' Concavoconvex structure 21 Intermediate structure

[0043] 21a Permanent fluid 21b Drainage part

[0044] 210 Grid 211 First Grid

[0045] 212 Second grid 22 Combining material

[0046] 23,23' Stopper 230 Bonding layer

[0047] 24 Carrier 25 Electronic components

[0048] 25a first side 25b second side

[0049] 25c Side 250 Adhesive Layer

[0050] 33,33' Reinforcement layer 41b Auxiliary part

[0051] A Air space A1 First section

[0052] A2 Second section D1, D2 width

[0053] L Curved path S Accommodation space

[0054] t,t' gap. DETAILED DESCRIPTION

[0055] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0056] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0057] FIG. 2A to FIG. 2D It is a cross-sectional schematic diagram of a method for manufacturing an electronic package 2 of the present invention.

[0058] like Figure 2A As shown, a heat sink 20 is provided, which includes a heat sink 200 and a plurality of first supporting legs 201 and second supporting legs 202 disposed on the heat sink 200, wherein a concave-convex structure 203 is integrally formed on a partial surface of the heat sink 200. Next, a permanent fluid 21a is formed on the heat sink 200, and a bonding material 22 is formed on the first supporting legs 201.

[0059] In this embodiment, the heat sink 20 is a metal component, and the heat sink 200 is a sheet, which defines a first section A1 and a second section A2 adjacent to each other, wherein the first section A1 is configured with the concave-convex structure 203, and the second section A2 is configured with the first supporting leg 201 and the second supporting leg 202.

[0060] In addition, a stopper 23 is disposed on the first section A1 of the heat sink 200 to prevent the permanent fluid 21a from overflowing. For example, the stopper 23 is installed on the concave-convex structure 203. Specifically, the stopper 23 is a ring, such as an O-ring (commonly known as O-Ring), which is bonded to the edge of the first section A1 via a bonding layer 230 such as adhesive, so that the stopper 23 defines a containing space S in the first section A1 for containing the permanent fluid 21a. Or, Figure 2A As shown in FIG. ', the stopper 23' and the heat sink 200 (heat sink 20) ​​may also be formed as one piece, so as to avoid using the bonding layer 230.

[0061] In addition, the heat sink 200 may form an air space A between the second supporting leg 202 and the stopper 23 as required to retain the overflow of the permanent fluid 21 a .

[0062] In addition, the bonding material 22 is a glue material, an adhesive material or a metal glue material, which is different from the material of the permanent fluid 21a, and the permanent fluid 21a is a liquid metal or an oily substance, which remains in a fluid state after the final process is completed, that is, in the final product, the permanent fluid 21a is still not solidified. For example, the permanent fluid 21a is formed in the accommodation space S of the first section A1 of the heat sink 200 by dispensing or spraying.

[0063] like Figure 2BAs shown, the permanent fluid 21a is first shaped (e.g., flattened) in the accommodating space S of the heat sink 200, and then a drainage portion 21b is correspondingly disposed on the permanent fluid 21a, so that the drainage portion 21b and the permanent fluid 21a serve as an intermediate structure 21, and the intermediate structure 21 is formed on the heat sink 20.

[0064] In this embodiment, the drainage portion 21 b is a plate, such as a copper metal plate, which is located in the accommodating space S of the heat sink 200 and does not exceed the stop portion 23 .

[0065] In addition, the drainage portion 21b is a mesh plate having a plurality of meshes of different specifications (eg Figure 2B 'Rectangular holes as shown) or a grid 210 of the same specification (such as Figure 2B ”). For example, Figure 2B In the rectangular grid form shown in FIG. 1 , the plate has a plurality of first grids 211 and a plurality of second grids 212, and the width D1 of the first grid 211 is greater than the width D2 of the second grid 212. Specifically, the width D1 of the first grid 211 is 20 to 500 micrometers (um), and the width D2 of the second grid 212 is less than 20um (even 0um, i.e., no holes).

[0066] like Figure 2C As shown, a carrier 24 having at least one electronic component 25 disposed thereon is provided.

[0067] In this embodiment, the carrier 24 is, for example, a package substrate having a core layer and a circuit structure or a coreless circuit structure, which forms a circuit layer on a dielectric material, such as a fan-out redistribution layer (RDL). It should be understood that the carrier 24 can also be other supporting structures for supporting electronic components such as chips, such as a lead frame or a silicon interposer, and is not limited to the above.

[0068] In addition, the electronic component 25 is an active component, a passive component or a combination of the two, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. For example, the electronic component 25 is electrically connected to the circuit layer of the carrier 24 by flip chip method or wire bonding method. Specifically, the electronic component 25 has a first side 25a and a second side 25b opposite to each other, and the first side 25a is connected to the carrier 24 via a glue layer 250 (such as a primer). However, the method of connecting the electronic component 25 to the carrier 24 is not limited to the above.

[0069] In addition, the permanent fluid 21 a may be coated on the second side 25 b of the electronic component 25 as required.

[0070] like Figure 2D As shown, under a vacuum state, the electronic component 25 is pressed onto the intermediate structure 21 with its second side 25b facing the heat sink 20, so that the heat sink 200 of the heat sink 20 is combined with the second side 25b of the electronic component 25 through the permanent fluid 21a, so that the intermediate structure 21 serves as a thermal interface material (Thermal Interface Material, abbreviated as TIM), and the heat sink 20 is combined with the carrier 24 with its first supporting leg 201 through the combining material 22.

[0071] In this embodiment, the grid 210 (or second grid 212) of the drainage portion 21b is configured corresponding to the hot spot area of ​​the electronic component 25. For example, the drainage portion 21b is configured with more second grids 212 in the hot spot area of ​​the electronic component 25 (i.e., small grids are configured at a high density to increase the metal distribution area in the hot spot area), and more first grids 211 are configured in the non-hot spot area of ​​the electronic component 25. Specifically, Figure 2D As shown in FIG. 1 , one corner (upper left corner) of the electronic component 25 is a hot spot area, so the second grid 212 is densely configured at the corner of the drainage portion 21b to increase the heat dissipation efficiency of the hot spot area of ​​the electronic component 25.

[0072] In addition, at least one gap t (eg, Figure 2D ), which is at least greater than 0.3 mm (mm) to reduce the risk of damaging the support member 24 (such as rupture) due to thermal expansion and contraction of the stopper 23, thereby preventing the permanent fluid 21a from flowing out of the crack of the support member 24. Or, Figure 3 In the electronic package 3 shown, a strengthening layer 33 can be arranged between the stopper 23 and the carrier 24 as required. The strengthening layer 33 is a porous elastic bonding material to prevent the permanent fluid 21a from flowing out and absorb stress, so that the carrier 24 is not easily deformed. Similarly, a gap t' (such as Figure 3 As shown) or configure a strengthening layer 33' (as Figure 3 'As shown in the figure, the porous elastic binding material is used to prevent the permanent fluid 21a from flowing out and the supporting member 24 from being damaged.

[0073] In addition, the surface of the first section A1 of the heat sink 300 may also be flat without forming the concave-convex structure 203. Figure 3As shown, the first supporting leg 201 (or the second supporting leg 202 ) can be formed with at least one concave-convex structure 203 ′ which can be filled with colloid (such as the bonding material 22 ) according to the needs to prevent the permanent fluid 21 a from flowing out.

[0074] In addition, if Figure 4 In the electronic package 4 shown, the intermediary structure 21 further includes an auxiliary portion 41b, such as a metal layer (such as titanium, copper, gold, silver, indium, gallium, tin or other) or a polymer layer, which is combined with the electronic component 25 and / or the heat sink 20. For example, the auxiliary portion 41b is formed on the electronic component 25 so that the permanent fluid 21a and the electronic component 25 have better bonding. Specifically, a metal layer such as a titanium layer is first used as the auxiliary portion 41b to cover the surface of the second side 25b and the side surface 25c of the electronic component 25, the glue layer 250 and a part of the surface of the carrier 24, and even covers the heat sink 200, so that when the electronic component 25 and the heat sink 20 are pressed together, the permanent fluid 21a can be combined with the auxiliary portion 41b.

[0075] The manufacturing method of the present invention is mainly achieved by the permanent fluid 21a and the drainage portion 21b being both flexible materials to effectively disperse thermal stress, and the extremely high thermal conductivity and specific heat capacity of the drainage portion 21b can improve the overall heat transfer efficiency of the TIM, and the large surface tension of the permanent fluid 21a allows the drainage portion 21b to restrain the flow of the permanent fluid 21a on the surface of the electronic component 25 (such as the second side 25b and the side surface 25c of the electronic component 25), so that the permanent fluid 21a adheres to the electronic component 25. Therefore, compared with the prior art, the intermediate structure 21 of the electronic package 2 of the present invention not only has a better heat dissipation effect, but also can prevent the electronic component 25 or the heat sink 20 from excessive warping due to stress concentration.

[0076] In addition, the configuration of the stopper 23 makes the flow path of the permanent fluid 21a longer (eg Figure 3 As shown in the curved path L), the permanent fluid 21a is not easy to flow out of the heat sink 20.

[0077] In addition, through the design of the air space A, when the temperature rises, the volume of the permanent fluid 21a will expand and flow into the air space A, thereby preventing the permanent fluid 21a from pressing the electronic component 25 or the heat sink 20 and affecting the operation.

[0078] In addition, the first support leg 201 is designed with a concave-convex structure 203' to strengthen the bonding of the bonding material 22. Therefore, if bubbles are generated in the bonding material 22 during heating and the structural strength of the bonding material 22 is weakened, the concave-convex structure 203' and the bonding material 22 can still be clamped together to prevent the heat sink 20 from falling off.

[0079] The present invention further provides an electronic package 2 , 3 , 3 ′, 4 , comprising: an electronic component 25 , an intermediate structure 21 and a heat sink 20 .

[0080] The intermediary structure 21 is disposed on the electronic component 25 , wherein the intermediary structure 21 includes a drainage portion 21 b and a permanent fluid 21 a combined with the drainage portion 21 b , and the permanent fluid 21 a is attached to the electronic component 25 .

[0081] The heat sink 20 is combined with the electronic component 25 via the intermediate structure 21 .

[0082] In one embodiment, the permanent fluid 21a is liquid metal or oil.

[0083] In one embodiment, the drainage portion 21b is a plate, such as a metal plate. For example, the plate has a plurality of grids of different specifications. Specifically, the plate has a plurality of first grids 211 and a plurality of second grids 212, and the width D1 of the first grid 211 is greater than the width D2 of the second grid 212 (the width of the second grid 212 may be zero).

[0084] In one embodiment, the heat sink 20 includes a heat sink 200, 300 and a plurality of first supporting legs 201 and second supporting legs 202 disposed on the heat sink 200, 300. The heat sink 200, 300 is combined with the electronic component 25 via the intermediate structure 21. For example, the heat sink 200 is formed with a concave-convex structure 203. Alternatively, the first or second supporting legs 201, 202 are formed with a concave-convex structure 203'.

[0085] In one embodiment, the heat dissipation element 20 is formed with concave-convex structures 203 , 203 ′.

[0086] In one embodiment, the heat dissipation element 20 has at least one air space A for retaining the overflow of the permanent fluid 21 a .

[0087] In one embodiment, the electronic package 2, 3, 3', 4 further includes at least one stopper 23, 23' provided on the heat sink 20 to prevent the permanent fluid 21a from overflowing. For example, the stopper 23 is mounted on the heat sink 20. Specifically, the stopper 23 is bonded to the heat sink 20 via a bonding layer 230. Alternatively, the stopper 23' and the heat sink 20 are integrally formed.

[0088] In one embodiment, the electronic package 2, 3, 3', 4 further comprises a carrier 24 on which the electronic component 25 is mounted and electrically connected to the electronic component 25. Further, a stopper 23, 23' may be disposed on the heat sink 20, and a gap t or a strengthening layer 33 may be formed between the stopper 23, 23' and the carrier 24. Alternatively, a gap t' (e.g., Figure 3 The electronic package 3 shown in FIG. 3 ) or the configuration strengthening layer 33 ′ (such as Figure 3 'The electronic package 3 shown').

[0089] In one embodiment, the interposer structure 21 further includes an auxiliary portion 41 b , such as a metal layer or a polymer layer, which is combined with the electronic component 25 and / or the heat sink 20 to contact the permanent fluid 21 a .

[0090] In summary, the electronic package and the manufacturing method thereof of the present invention, through the design of the permanent fluid and the drainage portion, enables the intermediate structure of the electronic package of the present invention to not only have a better heat dissipation effect, but also avoid the problem of stress concentration.

[0091] In addition, the design of the stopper makes it difficult for the permanent fluid to flow out of the heat sink.

[0092] In addition, the air space is designed to prevent the permanent fluid from affecting the operation of the electronic component or the heat sink.

[0093] In addition, the support foot is designed with a concave-convex structure to enhance the bonding property, thereby preventing the heat sink from falling off.

[0094] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, characterized in that: include: Electronic components; an intermediary structure, which is disposed on the electronic component, the intermediary structure comprises a drainage portion and a permanent fluid combined with the drainage portion, and the permanent fluid is attached to the electronic component, the drainage portion is a plate, and the plate has a plurality of grids of different specifications; and A heat sink is combined with the electronic component via the intermediate structure.

2. The electronic package according to claim 1, characterized in that: The permanent fluid is liquid metal or oil.

3. The electronic package according to claim 1, characterized in that: The plate is a metal plate.

4. The electronic package according to claim 1, characterized in that: The plate has a plurality of first grids and a plurality of second grids, and the width of the first grid is greater than the width of the second grid.

5. The electronic package according to claim 1, characterized in that: The heat sink comprises a heat sink and supporting legs arranged on the heat sink. The heat sink is combined with the electronic element via the intermediate structure.

6. The electronic package according to claim 5, characterized in that: The heat sink has a concave-convex structure.

7. The electronic package according to claim 5, characterized in that: The supporting foot has a concave-convex structure.

8. The electronic package according to claim 1, characterized in that: The heat dissipation element has a concave-convex structure.

9. The electronic package according to claim 1, characterized in that: The heat sink has an air space for retaining the permanent fluid overflow.

10. The electronic package according to claim 1, characterized in that The electronic package also includes a stopper disposed on the heat sink to prevent the permanent fluid from overflowing.

11. The electronic package according to claim 10, characterized in that: The stopper is combined on the heat sink via a combining layer.

12. The electronic package according to claim 10, characterized in that: The stopper and the heat sink are integrally formed.

13. The electronic package according to claim 1, characterized in that The electronic package also includes a carrier for arranging the electronic element, and the carrier is electrically connected to the electronic element.

14. The electronic package according to claim 13, characterized in that: The electronic package also includes a stopper portion arranged on the heat sink, and a gap or a reinforcement layer is formed between the stopper portion and the carrier.

15. The electronic package according to claim 13, characterized in that: A gap is formed or a strengthening layer is arranged between the heat dissipation component and the carrier component.

16. The electronic package according to claim 1, characterized in that The intermediary structure further includes an auxiliary portion that is combined with the electronic component and / or the heat sink to contact the permanent fluid.

17. A method for manufacturing an electronic package, characterized in that: include: Forming an intermediary structure on a heat sink, wherein the intermediary structure includes a drainage portion and a permanent fluid combined with the drainage portion, the drainage portion is a plate, and the plate has a plurality of grids of different specifications; as well as The electronic component is pressed onto the intermediate structure so that the heat sink is combined with the electronic component via the permanent fluid.

18. The method for manufacturing an electronic package according to claim 17, characterized in that: The permanent fluid is liquid metal or oil.

19. The method for manufacturing an electronic package according to claim 17, characterized in that: The manufacturing process of the intermediate structure includes: leveling the permanent fluid on the heat sink; and placing the plate on the permanent fluid accordingly.

20. The method for manufacturing an electronic package according to claim 17, characterized in that: The plate is a metal plate.

21. The method for manufacturing an electronic package according to claim 17, characterized in that: The plate has a plurality of first grids and a plurality of second grids, and the width of the first grid is greater than the width of the second grid.

22. The method for manufacturing an electronic package according to claim 17, characterized in that: The heat sink comprises a heat sink and supporting legs arranged on the heat sink. The heat sink is combined with the electronic element via the intermediate structure.

23. The method for manufacturing an electronic package according to claim 22, characterized in that: The heat sink has a concave-convex structure.

24. The method for manufacturing an electronic package according to claim 22, characterized in that: The supporting foot has a concave-convex structure.

25. The method for manufacturing an electronic package according to claim 17, characterized in that: The heat dissipation element has a concave-convex structure.

26. The method for manufacturing an electronic package according to claim 17, characterized in that: The heat sink has an air space for retaining the permanent fluid overflow.

27. The method for manufacturing an electronic package according to claim 17, characterized in that: The manufacturing method also includes a stopper disposed on the heat sink to prevent the permanent fluid from overflowing.

28. The method for manufacturing an electronic package according to claim 27, characterized in that: The stopper is combined on the heat sink via a combining layer.

29. The method for manufacturing an electronic package according to claim 27, characterized in that: The stopper and the heat sink are integrally formed.

30. The method for manufacturing an electronic package according to claim 17, wherein: The manufacturing method also includes firstly arranging the electronic component on a carrier, and then pressing the electronic component onto the intermediate structure.

31. The method for manufacturing an electronic package according to claim 30, characterized in that: The manufacturing method further comprises arranging a stopper on the heat dissipation component, and forming a gap or a strengthening layer between the stopper and the supporting component.

32. The method for manufacturing an electronic package according to claim 30, characterized in that: A gap is formed or a strengthening layer is arranged between the heat dissipation component and the carrier component.

33. The method for manufacturing an electronic package according to claim 17, wherein: The intermediary structure further includes an auxiliary portion that is combined with the electronic component and / or the heat sink to contact the permanent fluid.

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