Heat dissipation fin, preparation method thereof, heat dissipation device and electronic equipment

Abstract

The application provides a heat dissipation fin, a preparation method thereof, a heat dissipation device and electronic equipment, and belongs to the technical field of communication. The heat dissipation fin comprises a first heat dissipation assembly and a second heat dissipation assembly arranged oppositely. The first heat dissipation assembly comprises a first heat dissipation part, and the second heat dissipation assembly comprises a second heat dissipation part. The first heat dissipation part and the second heat dissipation part are arranged oppositely and define a first pipeline. The first heat dissipation assembly further comprises a first connecting part, the second heat dissipation assembly further comprises a second connecting part, the first connecting part is connected with the second connecting part, a second pipeline is defined, and the second pipeline communicates with the first pipeline.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of communication, and particularly relates to a heat dissipation fin, a preparation method thereof, a heat dissipation device and electronic equipment. BACKGROUND

[0002] In the field of electronic industry, the integration of equipment is higher and higher, the volume of chips or core components is smaller and smaller, and the performance is stronger and stronger. If the heat in the narrow space cannot be dissipated in time and effectively, the performance of the chip or core component will be greatly reduced under high temperature, and the energy consumption will be greatly increased; or the instrument and equipment will be damaged.

[0003] The phase change heat transfer plate is a new type of heat transfer element, which takes away heat through latent heat, so that the heat transfer performance is more outstanding on the basis of maintaining compact volume, has great application prospect, and can be widely applied to various military and civilian industries. The heat transfer plate can be connected with the heat dissipation fin and the heat dissipation substrate to form a heat dissipation device. Compared with the general metal fin, the heat transfer plate has higher thermal conductivity, better uniformity, and improved fin efficiency.

[0004] At present, the phase change heat transfer plate is connected by two plates, and the pipe shape is defined between the two plates by printing, and the internal pipe is formed by a blowing process. The heat dissipation assembly is connected to the heat dissipation substrate with a recess through a tooth embedding process. Due to the composite process of the upper and lower two plates and the limitation of the blowing process, the internal pipe distance from the edge must be reserved to ensure that the working medium in the internal pipe does not leak. Due to the limitation of the tooth embedding process of the phase change heat transfer plate and the heat dissipation substrate, the working medium in the phase change heat transfer plate needs to maintain a certain distance from the heat dissipation substrate, otherwise the internal pipe of the phase change heat transfer plate will be damaged during the tooth embedding process. These two aspects result in that the internal working medium of the phase change heat transfer plate is far away from the heat dissipation substrate, so that the thermal resistance is large, which is not conducive to the rapid conduction of heat of the equipment. SUMMARY

[0005] The present application aims to at least solve one of the technical problems in the prior art, and provides a heat dissipation fin, a preparation method thereof, a heat dissipation device and electronic equipment.

[0006] In a first aspect, the present application provides a heat dissipation fin, comprising a first heat dissipation assembly and a second heat dissipation assembly arranged oppositely; wherein the first heat dissipation assembly comprises a first heat dissipation part, and the second heat dissipation assembly comprises a second heat dissipation part; the first heat dissipation part and the second heat dissipation part are arranged oppositely and define a first pipe; the first heat dissipation assembly further comprises a first connecting part, the second heat dissipation assembly further comprises a second connecting part, and the first connecting part and the second connecting part are connected and define a second pipe, and the second pipe communicates with the first pipe.

[0007] Optionally, the first heat dissipation part, the second heat dissipation part, the first connecting part and the second connecting part are in an integrated structure.

[0008] Optionally, the first heat dissipation part and the second heat dissipation part are both in a plurality, and the first heat dissipation part and the second heat dissipation part are arranged one by one and define a plurality of the first pipeline; the adjacent first pipelines are communicated with each other.

[0009] Optionally, the edges of the first heat dissipation assembly and the second heat dissipation assembly are welded or are connected by stamping.

[0010] Optionally, the second pipeline includes a circular shape, an elliptical shape or a trapezoidal shape in a cross section perpendicular to the length direction of the heat dissipation fin.

[0011] In a second aspect, the present application provides a preparation method of a heat dissipation fin, comprising:

[0012] forming a first heat dissipation assembly with a first heat dissipation part and a first connecting part, and forming a second heat dissipation assembly with a second heat dissipation part and a second connecting part; wherein the first heat dissipation part and the second heat dissipation part are arranged oppositely and define a first pipeline, the first connecting part and the second connecting part are connected and arranged oppositely and define a second pipeline; the first pipeline and the second pipeline are communicated.

[0013] Optionally, the forming of the first heat dissipation assembly with the first heat dissipation part and the first connecting part, and the forming of the second heat dissipation assembly with the second heat dissipation part and the second connecting part, comprise:

[0014] providing a plate material, the plate material comprising a first region and a second region arranged side by side;

[0015] forming the first heat dissipation part and the first connecting part in the first region, and forming the second heat dissipation part and the second connecting part in the second region;

[0016] folding along the junction of the first connecting part and the second connecting part to form the first heat dissipation assembly and the second heat dissipation assembly arranged oppositely.

[0017] Optionally, the method further comprises:

[0018] sealing the edges of the first heat dissipation assembly and the second heat dissipation assembly.

[0019] Optionally, the sealing of the edges of the first heat dissipation assembly and the second heat dissipation assembly comprises:

[0020] welding the edges of the first heat dissipation assembly and the second heat dissipation assembly by laser welding or hot pressing process to seal them.

[0021] Optionally, the method further comprises: arranging an aluminum wire and / or an aluminum mesh in the second pipeline.

[0022] In a third aspect, an embodiment of the present application provides a heat dissipation device, comprising the heat dissipation fin and a heat dissipation substrate.

[0023] Optionally, the heat dissipation fin is connected to the heat dissipation substrate by adhesion.

[0024] Optionally, the heat dissipation substrate is provided with a groove, and the second pipeline of the heat dissipation fin is riveted to the groove.

[0025] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising the heat dissipation device.

[0026] The present application has the following advantages:

[0027] In the embodiment of the present application, the first heat dissipation component is connected to the second heat dissipation component through the first connecting part and the second connecting part, and a second pipeline is formed, so that the second pipeline is connected to the heat dissipation substrate, thereby reducing the thermal resistance and facilitating the rapid conduction of the heat generated by the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 FIG. 1 is a structural schematic diagram of a heat dissipation device;

[0029] Figure 2 FIG. 3 is a top view of a heat dissipation fin in the heat dissipation device of FIG. 1; Figure 1

[0030] Figure 3 FIG. 5 is a sectional view of the heat dissipation fin in the heat dissipation device of FIG. 1; Figure 1

[0031] Figure 4 FIG. 7 is an expanded schematic diagram of the heat dissipation fin of an embodiment of the present application;

[0032] Figure 5 FIG. 8 is a top view of the heat dissipation fin of an embodiment of the present application;

[0033] Figure 6 FIG. 9 is a side view of the heat dissipation fin of an embodiment of the present application;

[0034] Figure 7 FIG. 10 is a sectional view of the heat dissipation fin of an embodiment of the present application.

[0035] ​​Wherein the reference signs are: 1, heat dissipation fin; 2 heat dissipation base plate, 11, first pipeline, 12, second pipeline; 13, working medium; 101, first heat dissipation assembly; 102, second heat dissipation assembly; 111, first heat dissipation part; 112, first connecting part; 121, second heat dissipation part; 122, second connecting part. DETAILED DESCRIPTION

[0036] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0037] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning understood by a person skilled in the art to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, number or importance, but are only used to distinguish different components. Similarly, "one", "an" or "the" and similar words do not represent a quantity limitation, but represent the existence of at least one. "Including" or "containing" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, and do not exclude other elements or objects. "Connected" or "connected" and similar words are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to represent relative positional relationship, and when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0038] Figure 1 A heat dissipation device is shown, as shown in Figure 1 The heat dissipation device is composed of a heat dissipation base plate 2 and a plurality of heat dissipation fins 1 (i.e. phase change heat transfer plate). The heat dissipation base plate 2 has a plurality of rows of spaced grooves, and the heat dissipation fins 1 are arranged one by one corresponding to the grooves and riveted with the grooves. Of course, the heat dissipation fins 1 and the heat dissipation base plate 2 are connected by adhesive. The heat dissipation fins 1 can be arranged vertically relative to the heat dissipation base plate 2, or can be arranged obliquely relative to the heat dissipation base plate 2. When the heat dissipation device is applied to electronic equipment, the side of the heat dissipation base plate 2 away from the heat dissipation fins 1 is connected with the heat source in the electronic equipment, and specifically the surface of the heat generating element can be attached to the base plate through heat conductive glue or heat conductive medium to reduce the contact thermal resistance.

[0039] Figure 2 A top view of a heat dissipation fin 1 is shown, Figure 3 A cross section of the heat dissipation fin 1 is shown. As Figure 2 And 3As shown, the heat dissipation fin 1 comprises oppositely arranged first and second heat dissipation components, and the first and second heat dissipation components are formed by bending a plate; wherein the first heat dissipation component has a plurality of first heat dissipation portions formed by a blow molding process, and after being sealed with the second heat dissipation component, a plurality of first pipes 11 are formed. Due to the limitations of the composite process of the first and second heat dissipation component plates and the blow molding process, there is a certain distance d between the first pipe 11 closest to the groove of the heat dissipation base plate 2 and the heat dissipation base plate 2, that is Figure 2 and 3 the distance d shown in the figure.

[0040] However, the inventors have found that due to the distance d, the working medium in the first pipe 11 is far away from the heat dissipation base plate 2, thereby increasing the thermal resistance and being not conducive to the rapid conduction of heat generated by the electronic device.

[0041] To solve the above technical problems, the embodiments of the present application provide the following technical solutions.

[0042] In a first aspect, the embodiments of the present application provide a heat dissipation fin 1, Figure 4 which shows an unfolded view of the heat dissipation fin of the embodiments of the present application; Figure 5 which shows a top view of the heat dissipation fin 1 of the embodiments of the present application; Figure 5 which shows a side view of the heat dissipation fin 1 of the embodiments of the present application; Figure 7 which shows a cross-sectional view of the heat dissipation fin 1 of the embodiments of the present application; as Figures 4-7 shown, the heat dissipation fin 1 comprises a first heat dissipation component 101 and a second heat dissipation component 102; the first heat dissipation component 101 has a first heat dissipation portion 111 and a first connecting portion 112, and the second heat dissipation component 102 has a second heat dissipation portion 121 and a second connecting portion 122. Wherein the first heat dissipation portion 111 and the second heat dissipation portion 121 are correspondingly arranged and define a first pipe 11; the first connecting portion 112 and the second connecting portion 122 are connected and oppositely arranged, and define a second pipe, and the second pipe communicates with the first pipe 11.

[0043] It should be noted that the first pipe 11 and the second pipe need to be filled with working medium in order to better dissipate heat, so the edges of the first heat dissipation component 101 and the second heat dissipation component 102 are sealed together to form a closed pipe.

[0044] Since in the embodiments of the present application, the first heat dissipation component 101 is connected through the first connecting portion 112 and the second connecting portion 122 of the second heat dissipation component 102 to form a second pipe, connecting the second pipe with the heat dissipation base plate 2 can reduce the thermal resistance and be conducive to the rapid conduction of heat generated by the electronic device.

[0045] In some embodiments, the first connecting portion 112 of the first heat dissipation component 101 and the second connecting portion 122 of the second heat dissipation component 102 are in an integral structure. That is, the first heat dissipation component 101 and the second heat dissipation component 102 are formed by one sheet of material, so that the process of forming the heat dissipation fin 1 is simple, and the first connecting portion 112 of the first heat dissipation component 101 and the second connecting portion 122 of the second heat dissipation component 102 in the integral structure make the formed second pipeline have no connecting gap, and the sealing is better. It should be noted that at this time, the first heat dissipation component 101 and the second heat dissipation component 102 are also in an integral structure.

[0046] In some embodiments, the number of the first heat dissipation portions 111 and the second heat dissipation portions 121 is multiple, and the first heat dissipation portions 111 and the second heat dissipation portions 121 are arranged one by one to define multiple first pipelines 11, and the first pipelines 11 arranged adjacently are communicated, so that each first pipeline 11 is communicated with the second pipeline.

[0047] In some embodiments, the first heat dissipation portions 111 and the second heat dissipation portions 121 are respectively formed by a plurality of concave-convex patterns on the first heat dissipation component 101 and the second heat dissipation component 102. Figure 5 The first heat dissipation portion 111 shown in FIG. 1 is an upper concave pattern formed on the side of the first heat dissipation component 101 close to the second heat dissipation component 102, and the second heat dissipation portion 121 is an upper concave pattern formed on the side of the second heat dissipation component 102 close to the first heat dissipation component 101, at this time, the multiple first pipelines 11 formed are arranged in a honeycomb shape. Figure 5 In some embodiments, the concave-convex patterns of the first heat dissipation component 101 and the second heat dissipation component 102 are circular pits, but this does not constitute a limitation on the embodiments of the present application. In fact, the concave-convex patterns can also be continuous groove structures extending in the length direction or the width direction of the heat dissipation fin 1, or square pits, etc.

[0048] In some embodiments, as shown in FIGS. 1 and 2, the first heat dissipation component 101 and the second heat dissipation component 102 are arranged in a staggered manner. Figure 5 In some embodiments, as shown in FIGS. 1 and 2, the first heat dissipation component 101 and the second heat dissipation component 102 are arranged in a staggered manner. 7 In some embodiments, as shown in FIGS. 1 and 2, the first heat dissipation component 101 and the second heat dissipation component 102 are arranged in a staggered manner. Figure 5 In some embodiments, the cross section of the second pipeline perpendicular to the length direction of the heat dissipation fin 1 is circular, of course, the cross section of the second pipeline perpendicular to the length direction of the heat dissipation fin 1 can also be elliptical, trapezoidal, etc., and the shape of the cross section of the second pipeline perpendicular to the length direction of the heat dissipation fin 1 is not limited in the embodiments of the present application.

[0049] In some embodiments, the edges of the first heat dissipation component 101 and the second heat dissipation component 102 are sealed together, which can be connected by welding, or can be connected by stamping, etc. The welding can be achieved by vacuum diffusion welding or laser welding, and the stamping can be achieved by hot pressing process.

[0050] The following is the summary of the present application by the inventor: Figures 1-3The thermal resistance of the heat dissipation fin 1 shown and the heat dissipation fin 1 of the embodiment of the present application is compared with the temperature. Among them, the distance d shown in Figure 2 and 3 is 6mm, Figures 1-3 The plate thickness of the heat dissipation fin 1 shown and the heat dissipation fin 1 of the embodiment of the present application is 1.2mm, and the comparison is as follows when the heat dissipation fin 1 is uniformly heated at 130W:

[0051]

[0052] Through comparison, the thermal resistance of the heat dissipation fin 1 of the embodiment of the present application is reduced by 12.5%, the temperature difference is reduced by 2.146℃, and the temperature distribution of the heat dissipation fin 1 is more uniform. The pipeline (second pipeline) of the heat dissipation fin 1 of the embodiment of the present application is closer to the heat source position, and the heat can be quickly transmitted to the refrigerant at the second pipeline through the bottom of the heat dissipation fin 1, the phase change is started faster, the refrigerant rapidly undergoes phase change to take away heat, the time to reach steady state of the system is reduced, and at the same time, due to the reduction of distance, the heat conduction path and thermal resistance are reduced, and the heat transfer efficiency is improved.

[0053] In a second aspect, for the above heat dissipation fin 1, the embodiment of the present application provides a preparation method of the heat dissipation fin 1, which comprises:

[0054] forming a first heat dissipation assembly 101 having a first heat dissipation part 111 and a first connecting part 112, and forming a first heat dissipation assembly 101 having a second heat dissipation part 121 and a second connecting part 122; wherein the first heat dissipation part 111 is arranged opposite to the second heat dissipation part 121 to define a first pipeline 11, the first connecting part 112 is connected with the second connecting part 122, and is arranged opposite to define a second pipeline; the first pipeline 11 is in communication with the second pipeline.

[0055] Since in the embodiment of the present application, the first heat dissipation assembly 101 is connected with the second connecting part 122 of the second heat dissipation assembly 102 through the first connecting part 112 to define the second pipeline, connecting the second pipeline with the heat dissipation substrate 2 can reduce the thermal resistance, which is conducive to the rapid conduction of heat generated by the electronic equipment.

[0056] In some embodiments, the steps of forming a first heat dissipation assembly 101 having a first heat dissipation part 111 and a first connecting part 112, and forming a first heat dissipation assembly 101 having a second heat dissipation part 121 and a second connecting part 122 specifically comprise:

[0057] providing a plate material, the plate material comprising a first region and a second region arranged side by side, that is Figure 4 the upper and lower two part regions shown.

[0058] The first heat dissipation part 111 and the first connecting part 112 are formed in the first region, and the second heat dissipation part 121 and the second connecting part 122 are formed in the second region.

[0059] The first heat dissipation part 111 and the first connecting part 112 are formed in the first region, and the second heat dissipation part 121 and the second connecting part 122 are formed in the second region. Figure 4 The first heat dissipation part 111 and the first connecting part 112 are formed in the first region, and the second heat dissipation part 121 and the second connecting part 122 are formed in the second region.

[0060] In some embodiments, after the first heat dissipation part 111 and the first connecting part 112 are formed in the first region, and the second heat dissipation part 121 and the second connecting part 122 are formed in the second region, the method of the embodiment of the present application further comprises the step of sealing the edges of the first heat dissipation part 111 and the second heat dissipation part 121, so that the first pipe 11 forms a closed pipe.

[0061] It should be noted that in order to fill the working medium into the first pipe 11 and the second pipe, the inlet for filling the working medium is not sealed in this step.

[0062] In some embodiments, the step of sealing the edges of the first heat dissipation part 111 and the second heat dissipation part 121 can specifically adopt a welding process to seal the edges of the first heat dissipation part 111 and the second heat dissipation part 121, so that the first pipe 11 forms a closed pipe. The welding process includes but is not limited to vacuum diffusion welding or laser welding. Of course, in some embodiments, the step can also be a hot pressing process to seal the edges of the first heat dissipation part 111 and the second heat dissipation part 121, so that the first pipe 11 forms a closed pipe.

[0063] In some embodiments, after the second pipe is formed, the method further comprises the step of placing aluminum wires and / or woven aluminum mesh in the second pipe, so as to improve the heat transfer efficiency of the heat dissipation fin 1 and improve the anti-gravity performance.

[0064] In the first example, the preparation method of the heat dissipation fin 1 of the embodiment of the present application specifically comprises the following steps:

[0065] A plate is provided, wherein one surface of the plate is a composite surface, and the surface opposite to the composite surface is a non-composite surface; surface treatment such as wire drawing or polishing is performed on the composite surface of the plate, and then a groove is made on the composite surface, that is, a first sealing structure and a first connecting part 112 are formed in the first region, and a second sealing structure and a second connecting part 122 are formed in the second region.

[0066] The plate is folded at the middle part (that is, the intersection position of the first connecting part 112 and the second connecting part 122) of the plate, and a gap is left at the folding part, so as to form a second pipe; after folding, the first region composite surface of the plate is attached to the composite surface of the second region, and at this time, the first heat dissipation part 111 and the second heat dissipation part 121 are formed in a relative arrangement.

[0067] The aluminum wire and / or aluminum wire braid aluminum mesh formed in the second pipe improves the heat transfer efficiency of the phase change heat transfer plate and improves the anti-gravity performance.

[0068] The first heat dissipation assembly 101 and the second heat dissipation assembly 102 formed after the folding are combined together by welding, such as vacuum diffusion welding or laser welding process, to make the first pipe 11 and the second pipe communicate with each other to form a closed pipe.

[0069] The heat transfer working medium is filled in the first pipe 11 and the second pipe, and the pipe inlet is sealed.

[0070] The preparation of the heat dissipation fin 1 is completed.

[0071] In the second example, the first heat dissipation assembly 101 and the second heat dissipation assembly 102 formed after the folding are combined together by hot pressing process to make the first pipe 11 and the second pipe communicate with each other to form a closed pipe. The remaining steps are the same as the first example, and therefore are not repeated here.

[0072] In the third aspect, the embodiment of the present application provides a heat dissipation device, which comprises any of the heat dissipation fins 1 described above, and further comprises a heat dissipation substrate 2, and the heat dissipation fins 1 are arranged on the heat dissipation substrate 2 in a spaced manner.

[0073] In some embodiments, the heat dissipation fins 1 can be connected to the heat dissipation substrate 2 by gluing to form a heat dissipation device.

[0074] In some embodiments, the heat dissipation substrate 2 has a plurality of grooves arranged side by side, the heat dissipation fins 1 are arranged one by one corresponding to the grooves, and are riveted with the grooves. Specifically, the second pipe of the heat dissipation fin 1 can be fastened in the groove by pressing the edge outside the groove of the heat dissipation substrate 2, at this time the heat dissipation fin 1 and the heat dissipation substrate 2 are connected to form a high-efficiency heat dissipation device.

[0075] In the fourth aspect, the embodiment of the present application provides an electronic device, which comprises the heat dissipation device described above, wherein the side of the heat dissipation substrate 2 of the heat dissipation device away from the heat dissipation fin 1 is connected with a heat generating element in the electronic device.

[0076] In some embodiments, the heat generating element is connected with the heat dissipation substrate 2 through heat-conducting glue or heat-conducting medium, so that the heat generated by the heat generating element is better conducted to the heat dissipation device to improve the heat dissipation efficiency.

[0077] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the present application, but the present application is not limited thereto. Various modifications and improvements can be made by those skilled in the art without departing from the spirit and essence of the present application, and these modifications and improvements are also regarded as the protection scope of the present application.

Claims

1. A heat dissipation fin comprising a first heat dissipation assembly and a second heat dissipation assembly arranged oppositely; wherein, The first heat dissipation component includes a first heat dissipation part, and the second heat dissipation component includes a second heat dissipation part; the first heat dissipation part and the second heat dissipation part are oppositely arranged and define a first pipeline; characterized in that the first heat dissipation component further includes a first connecting part, and the second heat dissipation component further includes a second connecting part; a gap is left at a folding position of the joint position of the connected first connecting part and second connecting part to form a second pipeline, and the second pipeline is in communication with the first pipeline. The first heat dissipation part, the second heat dissipation part, the first connecting part and the second connecting part are an integral structure.

2. The heat dissipating fin according to claim 1, wherein The first heat dissipation part and the second heat dissipation part are both multiple, and the first heat dissipation part and the second heat dissipation part are arranged one by one and define multiple first pipelines; the adjacent first pipelines are in communication with each other.

3. The heat dissipating fin according to claim 1, wherein The edges of the first heat dissipation component and the second heat dissipation component are welded or are connected by stamping.

4. The heat dissipating fin according to claim 1, wherein The second pipeline includes a circular shape, an oval shape or a trapezoidal shape in a cross section perpendicular to the length direction of the heat dissipation fin.

5. A method of manufacturing a heat dissipating fin, characterized by, Comprising: forming a first heat dissipation component with a first heat dissipation part and a first connecting part, and forming a first heat dissipation component with a second heat dissipation part and a second connecting part; wherein the first heat dissipation part and the second heat dissipation part are oppositely arranged and define a first pipeline, and a gap is left at a folding position of the joint position of the connected first connecting part and second connecting part to form a second pipeline; the first pipeline is in communication with the second pipeline; The forming of the first heat dissipation component with a first heat dissipation part and a first connecting part, and the forming of the first heat dissipation component with a second heat dissipation part and a second connecting part, comprises: providing a plate material, the plate material including a first region and a second region arranged side by side; forming the first heat dissipation part and the first connecting part in the first region, and forming the second heat dissipation part and the second connecting part in the second region; folding along the joint position of the first connecting part and the second connecting part to form oppositely arranged first heat dissipation components and second heat dissipation components.

6. The method of claim 5, wherein the fin is formed by a process selected from the group consisting of a mechanical process, a chemical process, and a combination thereof. Further comprising: sealing the edges of the first heat dissipation component and the second heat dissipation component.

7. The method of claim 6, wherein the heat dissipation fins are formed by a process comprising: The sealing of the edges of the first heat dissipation component and the second heat dissipation component comprises: welding the edges of the first heat dissipation component and the second heat dissipation component by laser welding or hot pressing process to seal them.

8. The method of claim 5, wherein the fin is formed by a process selected from the group consisting of a mechanical process, a chemical process, and a combination thereof. Further comprising: setting aluminum wires and / or aluminum mesh in the second pipeline.

9. A heat dissipating device characterized by comprising: The heat dissipation device comprises the heat dissipation fin according to any one of claims 1-4 and a heat dissipation substrate; the heat dissipation fin is connected with the heat dissipation substrate.

10. The heat dissipating device of claim 9, wherein, The heat dissipation fin is connected with the heat dissipation substrate by gluing.

11. The heat dissipating device of claim 9, wherein The heat dissipation substrate is provided with a groove, and the second pipeline of the heat dissipation fin is riveted with the groove.

12. An electronic arrangement characterized by The heat dissipation device comprises the heat dissipation device according to any one of claims 9-11.

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