Foldable electronic devices

Abstract

A foldable electronic device includes: a flexible display; a hinge assembly configured to fold a first area and a second area of ​​the flexible display together and unfold them away from each other; and a heat diffusion member. The hinge assembly includes: a first hinge frame attached to the bottom surface of the first area by a first adhesive member; a second hinge frame attached to the bottom surface of the second area by a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing including an internal space for accommodating the hinge and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of ​​the heat diffusion member is disposed between the flexible display and the hinge housing, in the internal space, or at a position communicating with the internal space.

Description

Technical Field

[0001] The present disclosure relates generally to foldable electronic devices. Background Art

[0002] As time goes by, portable electronic devices, such as smartphones and tablet personal computers (PCs), have become lighter and thinner for easy carrying, and have been developed in various ways for convenient use. Specifically, foldable electronic devices provide a relatively larger screen than ordinary bar-shaped electronic devices, but have a reduced volume after folding and are more convenient to carry. As an electronic device that meets consumer demand for the above-mentioned features, such foldable electronic devices are becoming a hot topic.

[0003] In a foldable electronic device, at least two or more panels may be pivotally connected to each other by a hinge to be unfolded or folded, and a display may be provided on the panels coupled to each other by the hinge. For example, a plurality of physically separated displays may be arranged on each panel.

[0004] In recent years, with the development of flexible displays, it has become possible to arrange a flexible display capable of providing a large screen on a flat panel without physically disconnecting it. For example, in a window for protecting the outside of the display, by replacing the existing glass substrate with a highly flexible, hard and transparent plastic (e.g., polyimide (PI)) film, it becomes possible to apply a flexible display that is flexible so as to be foldable / unfoldable to a foldable electronic device.

[0005] In electronic devices using precision printed circuit boards, heat dissipation and cooling have been identified as issues related to the reliability of the electronic devices. Specifically, due to the high integration of semiconductor devices in printed circuit boards and the miniaturization of electronic devices, the performance of electronic devices is further improved, but the heat generation per unit area of ​​semiconductor devices tends to increase. Therefore, problems such as degradation of operating performance and / or failure due to overheating have become factors that significantly reduce the reliability of electronic devices.

[0006] In order to solve these types of problems, a heat diffusion member can be used to effectively circulate heat using the phase change of a working fluid (e.g., a heat pipe). Since the working fluid introduced into the vacuum sealed tube absorbs heat from the high temperature portion, evaporates, moves to the low temperature portion, condenses, and dissipates heat, the heat diffusion member can quickly transfer heat. This heat diffusion member can be arranged to connect, for example, a semiconductor element as a heat source and a peripheral metal member so that the heat transferred from the heat source is dissipated into the air through the peripheral metal member.

[0007] In a foldable electronic device, a hinge housing that prevents foreign matter from flowing in and has an aesthetically favorable appearance can be mounted to a portion to which a hinge is connected. In addition, since the hinge housing has a structure including an internal space therein, there is a need to use this structural feature as a heat control mechanism.

[0008] In addition, when the foldable electronic device is opened / closed, stress is generated in a portion where the flexible display is folded, and the stress increases due to a sudden temperature change, which may cause defective phenomena such as warping, cracking, or peeling at the portion. Summary of the invention

[0009] Solution to the problem

[0010] The present disclosure is designed to address at least the above-mentioned problems and / or disadvantages and to provide at least the advantages described below.

[0011] An aspect of the present disclosure provides a foldable electronic device including a heat dissipation structure utilizing an inner space of a hinge housing.

[0012] Another aspect of the present disclosure provides a foldable electronic device that controls sudden temperature changes of a flexible display through a heat dissipation structure.

[0013] Since sudden temperature changes of the flexible display are controlled by the heat dissipation structure, space utilization in the foldable electronic device can be improved without requiring a separate temperature control structure.

[0014] According to aspects of the present disclosure, a foldable electronic device is provided, comprising: a flexible display; a hinge assembly configured to fold a first region and a second region of the flexible display together and unfold them away from each other; and a heat diffusion member. The hinge assembly comprises: a first hinge frame attached to a bottom surface of the first region by a first adhesive member; a second hinge frame attached to a bottom surface of the second region by a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing comprising an internal space for accommodating the hinge and connecting the first hinge frame and the second hinge frame to each other. At least a partial area of ​​the heat diffusion member is disposed between the flexible display and the hinge housing, in the internal space, or at a position communicating with the internal space. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0016] Figure 1shows an open state and a closed state of a foldable electronic device according to an embodiment;

[0017] Figure 2 A foldable electronic device according to an embodiment is shown;

[0018] Figure 3 A foldable electronic device without a flexible display assembled therein according to an embodiment is shown;

[0019] Figure 4 shows a folding portion of a foldable electronic device including a heat diffusion member according to an embodiment;

[0020] Figure 5 shows a folding portion of a foldable electronic device including a plurality of heat diffusion members according to an embodiment;

[0021] Figure 6 shows a folding portion of a foldable electronic device including a flexible heat diffusion member according to an embodiment;

[0022] Figure 7 A folded portion of a foldable electronic device including a heat sink according to an embodiment is shown;

[0023] Figure 8 A folding portion of a foldable electronic device including a heat conductive sheet according to an embodiment is shown;

[0024] Fig. 9 shows a folding portion of a foldable electronic device including a heat diffusion member disposed on a front face of a hinge frame according to an embodiment;

[0025] Fig. 10A A folding portion of a foldable electronic device including a heat diffusion member disposed on a back surface of a hinge frame according to an embodiment is shown;

[0026] Fig. 10B A folding portion of a foldable electronic device including a heat diffusion member disposed on a back surface of a hinge frame according to an embodiment is shown;

[0027] Fig.11 A method for preventing a folded portion of a flexible display from being deformed according to an embodiment is shown;

[0028] Fig.12 A method of preventing a folded portion of a flexible display from being deformed during an event related to state switching of a foldable electronic device according to an embodiment is shown; and

[0029] Fig.13 An electronic device in a network environment according to an embodiment is shown. DETAILED DESCRIPTION

[0030] Hereinafter, various embodiments will be described with reference to the accompanying drawings. For the convenience of description, the components shown in the accompanying drawings may be enlarged or reduced in size, and the present disclosure is not necessarily limited to the components shown. In addition, the same or similar components shown in the accompanying drawings may be represented by the same or similar reference numerals.

[0031] Figure 1 An open state and a closed state of a foldable electronic device according to an embodiment are shown.

[0032] Figure 2 A foldable electronic device according to an embodiment is shown.

[0033] Figure 3 A foldable electronic device without an assembled flexible display according to an embodiment is shown.

[0034] refer to Figures 1 to 3 In the foldable electronic device 100, two or more plates may be rotatably connected by a hinge 135 so as to be unfolded or folded. A hinge housing 137 that prevents entry of foreign matter and has an aesthetically favorable appearance may be mounted to a portion to which the hinge 135 is connected. The hinge housing 137 may have an internal space 137a therein. A heat diffusion member 210 (e.g., a heat pipe) is disposed in the internal space 137a or at a position communicating with the internal space 137a. Therefore, the hinge housing 137 may be used to control heat generation.

[0035] During the opening / closing process of the foldable electronic device 100, stress may be generated in the folded portion 101 of the flexible display 110, and the stress may increase due to a sudden temperature change, which may cause defect phenomena such as warping, cracking, or peeling in the portion 101. In order to solve this problem, in the foldable electronic device 100, a sudden temperature change of the flexible display 110 may be controlled by the heat diffusion member 210.

[0036] In order to provide the above functions, the foldable electronic device 100 includes a flexible display 110, a hinge assembly 130, a heat diffusion member 210, brackets 151 and 153, printed circuit boards 171 and 173, a battery 175, and outer shells 191 and 193. However, the configuration of the foldable electronic device 100 is not limited thereto. For example, the foldable electronic device 100 may omit at least one of the above elements, or the foldable electronic device 100 may include at least one other element. For example, the foldable electronic device 100 also includes an external display 120.

[0037] The flexible display 110 may display various contents (e.g., text, images, videos, icons, or symbols) to the user. The flexible display 110 may include a display panel, a touch panel disposed on the display panel or integrally formed on the display panel, and a window layer disposed on the touch panel. The display panel, the touch panel, and the window layer may be attached to each other by a pressure sensitive adhesive (PSA).

[0038] The window layer may include a highly flexible, hard, and transparent plastic film for manufacturing the flexible display 110. The plastic film may include a polyimide or polyethylene terephthalate (PET) film.

[0039] The window layer can also be formed by a plurality of plastic films. In this case, the plurality of plastic films can be attached to each other by a pressure-sensitive adhesive.

[0040] The display panel may include a flexible display substrate, a plurality of display elements coupled to the display substrate, at least one line coupled to the display substrate and electrically connected to the display elements, and a thin film encapsulation layer. The display substrate may be made of a flexible plastic material. The display substrate may be made of various materials having flexibility.

[0041] The display element may be disposed on the display substrate and form a plurality of pixels. For example, the display element may be arranged in a matrix form on the display substrate to form pixels of the display panel, and may include a fluorescent material or an organic fluorescent material capable of expressing colors. The display element may include an organic light emitting diode (OLED).

[0042] The conductive line may include at least one gate signal line or at least one data signal line. The conductive line may include a plurality of gate signal lines and a plurality of data signal lines. In this case, the gate signal lines and the data signal lines may be arranged in a matrix, and the display element may be arranged adjacent to the point where the lines intersect to be electrically connected to the lines.

[0043] The thin film encapsulation layer can cover the display substrate, display element and wire to prevent oxygen and moisture from flowing in from the outside. The thin film encapsulation layer can also be formed by alternately stacking one or more organic layers and one or more inorganic layers. In this case, the uppermost layer can be exposed to the outside of the thin film encapsulation layer using an inorganic layer to prevent moisture penetration.

[0044] The flexible display 110 may further include a polarizing film disposed between the display panel and the touch panel. The polarizing film may reduce the thickness and may improve the visibility of the image while ensuring the flexible characteristics. The flexible display 110 may further include a phase delay film located between the display panel and the window layer. The phase delay film may be used to convert linear polarized light into circular polarized light or to convert circular polarized light into linear polarized light. The flexible display 110 may further include a buffer layer attached to the lower portion of the display panel by an adhesive tape or a pressure-sensitive adhesive.

[0045] The hinge assembly 130 allows the foldable electronic device 100 to be folded or unfolded. The hinge assembly 130 includes a first hinge frame 131, a second hinge frame 133, one or more hinges 135, and a hinge housing 137.

[0046] The first hinge frame 131 and the second hinge frame 133 are portions in which one side of the hinge assembly 130 is fixed during opening / closing of the foldable electronic device 100, and may be coupled to the outer housings 191 and 193 or the brackets 151 and 153 coupled to the outer housings 191 and 193. The first hinge frame 131 and the second hinge frame 133 may be coupled to the first outer housing 191 (or the first bracket 151) and the second outer housing 193 (or the second bracket 153), respectively, to support the first outer housing and the second outer housing when the flexible display 110 is folded or unfolded around the folding portion 101 of the foldable electronic device 100.

[0047] The hinge 135 pivotally connects the first hinge frame 131 and the second hinge frame 133 to each other. The first hinge frame 131 includes a first groove 131a, a part of the hinge 135 is disposed in the first groove 131a and coupled to a side facing the second hinge frame 133, and the second hinge frame 133 includes a second groove 133a, another part of the hinge 135 is disposed in the second groove 133a and coupled to a side facing the first hinge frame 131. The first groove 131a and the second groove 133a may be formed to be aligned at positions symmetrical to each other with respect to the folding portion 101. The first groove 131a and the second groove 133a may be formed at positions symmetrical to each other with respect to the central axis of the foldable portion 101 (the central line of the foldable electronic device 100). When the foldable electronic device 100 is viewed from the front (or top surface) above, the hinge 135 may be disposed at a position overlapping with the folding portion 101.

[0048] The hinge assembly 130 may include a plurality of hinges 135 to ensure a stronger coupling force than the coupling force of the first hinge frame 131 and the second hinge frame 133. Figure 2 and Figure 3 As shown, the hinge assembly 130 includes two hinges 135. When the foldable electronic device 100 is viewed from the front (or top) thereof, the hinges 135 may be spaced apart from each other by a predetermined distance in the length direction (or longitudinal direction) (in the direction of the central axis of the folding portion 101) so as to be disposed at a position overlapping the folding portion 101.

[0049] exist Figure 2 and Figure 3In the embodiment, one hinge 135 is disposed above the longitudinal direction of the foldable electronic device 100, and the other hinge 135 is disposed below the longitudinal direction of the foldable electronic device 100. Therefore, first grooves 131a are formed at two locations in the first hinge frame 131 so that the two hinges 135 are seated and coupled thereto, and second grooves 133a are also formed at two locations in the second hinge frame 133.

[0050] The hinge housing 137 can connect the first hinge frame 131 and the second hinge frame 133 to each other, and can accommodate one or more hinges 135. The hinge housing 137 includes a front (or top surface), a back (or bottom surface), and a side that partially surrounds the space between the front and back, and a portion of the front is recessed backward. In addition, the side to the back may include an integrally connected curved surface. When viewed in a longitudinal cross-section of the foldable electronic device 100, the curved surface may have a substantially straight line shape, but when viewed in a width direction (or horizontal) cross-section of the foldable electronic device 100, it may have a substantially semicircular shape. The hinge housing 137 can be set to a semi-cylindrical shape that protrudes backward and extends in the longitudinal direction of the foldable electronic device 100.

[0051] The hinge housing 137 has an inner space 137a therein. The hinge housing 137 may form the inner space 137a in which a portion of the front face is recessed rearward. When the hinge housing 137 is coupled to the first hinge frame 131 and the second hinge frame 133, the inner space 137a may be filled with air. When one side edge of the front face of the hinge housing 137 is coupled to the first hinge frame 131 and the other side edge of the front face of the hinge housing 137 is coupled to the second hinge frame 133, the inner space 137a is formed between the first hinge frame 131 and the second hinge frame 133 and the hinge housing 137, and at least one hinge 135 is accommodated in the inner space 137a.

[0052] The heat diffusion member 210 can effectively circulate heat using the phase change of the working fluid. Since the working fluid introduced into the vacuum sealed tube absorbs heat from the high temperature part, evaporates, moves to the low temperature part, condenses and dissipates the heat, the heat diffusion member 210 can quickly transfer heat. A heat pipe can be used as the heat diffusion member 210.

[0053] The heat diffusion member 210 may include a tube including a pair of metal plates, a pair of inner wall metal layers and an intermediate metal layer, and a working fluid introduced into the tube. The metal plates are portions of opposite sides of the outer wall of the tube constituting the heat diffusion member 210, and may include a metal material having high thermal conductivity to absorb / release heat from / to the outside. Since the metal plates constitute opposite sides of the heat diffusion member 210, a pair of metal plates may be provided and disposed to face each other.

[0054] The inner wall metal layer constitutes the inner wall of the tube body of the heat diffusion member 210 and may be formed on the facing surfaces of a pair of metal plates. A groove may be formed in the inner wall metal layer, and the groove may serve as a capillary for forming a capillary force, thereby forming a circulation path for reflux of the condensed working fluid. The groove may be selectively exposed to the chamber and fluid path formed by the intermediate metal layer.

[0055] The intermediate metal layer is a portion on which the chamber and the fluid path are formed, and can form the side wall of the heat diffusion member 210 to seal the inside thereof. The intermediate metal layer can be inserted between a pair of inner wall metal layers, and a first chamber used as an evaporator to absorb heat and a second chamber used as a condenser for heat dissipation can be formed on one side and the other side of the intermediate metal layer, respectively. In addition, a plurality of fluid paths connecting the chambers can be formed therein.

[0056] The heat diffusion member 210 may be disposed on or near an electronic component (e.g., an application processor (AP), a central processing unit (CPU), or a power management integrated circuit (PMIC)) that generates heat among the electronic components mounted on the printed circuit boards 171 and 173 so as to dissipate the heat generated by the electronic component into the air in the inner space 137a of the hinge housing 137. One end of the heat diffusion member 210 may be disposed on or near the electronic component mounted on the printed circuit boards 171 and 173, and the other end of the heat diffusion member 210 may be disposed in the inner space 137a of the hinge housing 137 or at a position communicating with the inner space 137a.

[0057] Figure 2 and Figure 3 It is shown that first ends of the two heat diffusion members 210 are disposed on or near the processor 173 a mounted on the second printed circuit board 173 of the printed circuit boards 171 and 173 , and second ends of the two heat diffusion members 210 are disposed in the inner space 137 a of the hinge housing 137 .

[0058] In order to dispose the first end of each heat diffusion member 210 on or near the processor 173a mounted on the second printed circuit board 173, the first end of the heat diffusion member 210 may be disposed on or near the processor 173a through the third groove 133b formed in the second hinge frame 133. The third groove 133b may be formed in a side of the second hinge frame 133 facing the first hinge frame 131, and the number of the third grooves 133b may correspond to the number of the heat diffusion members 210.

[0059] In order to set the first end of each heat diffusion member 210 on or near the electronic component as another heat source mounted on the first printed circuit board 171, a fourth groove is formed on the side of the first hinge frame 131 facing the second hinge frame 133, and one end of the heat diffusion member 210 can be mounted on or near the electronic component mounted on the first printed circuit board 171 through the fourth groove.

[0060] In order to increase the contact area with the air in the inner space 137a of the hinge housing 137, a partial area of ​​the heat diffusion member 210 including the second end thereof may be arranged to be elongated in the longitudinal direction of the foldable electronic device 100. Figure 2 and Figure 3 As shown, a first end of the first heat diffusion member 210 may be disposed on or near the processor 173a through one third groove 133b formed in the second hinge frame 133, and a partial area including the second end of the first heat diffusion member 210 may be bent from the first end of the first heat diffusion member 210 to be disposed between the first hinge frame 131 and the second hinge frame 133 to extend above the longitudinal direction of the foldable electronic device 100. A first end of the second heat diffusion member 210 may be disposed on or near the processor 173a through another third groove 133b formed in the second hinge frame 133, and a partial area including the second end of the second heat diffusion member 210 may be bent from the first end of the second heat diffusion member 210 to be disposed between the first hinge frame 131 and the second hinge frame 133 to extend below the longitudinal direction of the foldable electronic device 100.

[0061] When the first end of each heat diffusion member 210 is set on or near an electronic component mounted on the first printed circuit board 171 through a fourth groove formed in the first hinge frame 131, a partial area including the second end of the heat diffusion member 210 can be bent from the first end of the heat diffusion member 210 to be set to extend above or below the longitudinal direction of the foldable electronic device 100 between the first hinge frame 131 and the second hinge frame 133.

[0062] The heat diffusion member 210 may be bonded to the electronic components or the printed circuit boards 171 and 173 using a material having excellent thermal conductivity or a double-sided adhesive tape having excellent thermal conductivity.

[0063] The brackets 151 and 153 may fix and support the hinge assembly 130. For example, the first hinge frame 131 of the hinge assembly 130 may be seated and fixed to a first seat 151a formed on a right edge portion of the first bracket 151 located on the left side in the width direction of the foldable electronic device 100, and the second hinge frame 133 of the hinge assembly 130 may be seated and fixed to a second seat 153a formed on a left edge portion of the second bracket 153 located on the right side in the width direction of the foldable electronic device 100. Each of the first hinge frame 131 and the second hinge frame 133 may be fixed to the first seat 151a and the second seat 153a, respectively, by an adhesive member or a screw member.

[0064] The first seat portion 151a formed on the first bracket 151 may be recessed backward from the front of the first bracket 151 (e.g., the surface of the first bracket 151 facing the first hinge frame 131). The shape of the first seat portion 151a may correspond to the shape of the first hinge frame 131. The recessed length, width, and height of the first seat portion 151a may be the same or similar to the length, width, and height of the hinge frame 131. The first seat portion 151a may include a first insertion groove 151b in a side portion (e.g., a right portion) thereof facing the second seat portion 153a, and a portion of the hinge 135 may be inserted into the first insertion groove 151b.

[0065] The second seat portion 153a formed on the second bracket 153 may be recessed backward from the front of the second bracket 153 (e.g., the surface of the second bracket 153 facing the second hinge frame 133). The shape of the second seat portion 153a may correspond to the shape of the second hinge frame 133. The recessed length, width, and height of the second seat portion 153a may be the same or similar to the length, width, and height of the second hinge frame 133. The second seat portion 153a may include a second insertion groove 153b in a side portion (e.g., a left portion) thereof facing the first seat portion 151a, and a portion of the hinge 135 may be inserted into the second insertion groove 153b.

[0066] The first and second insertion grooves 151b and 153b may be formed to be aligned at positions symmetrical to each other about the folding portion 101. The first and second insertion grooves 151b and 153b may be formed to be aligned at positions symmetrical to each other about the central axis of the folding portion 101.

[0067] In order to place the first end of each heat diffusion member 210 on or near the processor 173a mounted on the second printed circuit board 173, the second seat 153a may include a third insertion groove 153c into which the first end of the heat diffusion member 210 may be inserted. The third insertion groove 153c may be formed in a side portion of the second seat 153a facing the first seat 151a, and may be arranged to be aligned at a position overlapping with the third groove 133b formed in the second hinge frame 133 when the foldable electronic device 100 is viewed from above the front thereof.

[0068] When the first ends of the heat diffusion members 210 pass through the fourth groove formed in the first hinge frame 131, in order to place the first ends of each heat diffusion member 210 on or near the electronic components mounted on the first printed circuit board 171, the first seat portion 151a may include a fourth insertion groove into which the first ends of the heat diffusion members 210 may be inserted. In this case, the fourth insertion groove may be formed in a side portion of the first seat portion 151a facing the second seat portion 153a, and may be arranged to be aligned at a position overlapping with the fourth groove formed in the first hinge frame 131 when the foldable electronic device 100 is viewed from above the front thereof.

[0069] The brackets 151 and 153 may fix and support the flexible display 110. The flexible display 110 may be disposed on the brackets 151 and 153, and the hinge assembly 130 may be fixedly disposed on the brackets 151 and 153. For example, when the first hinge frame 131 is fixedly disposed on the first seat 151a and the second hinge frame 133 is fixedly disposed on the second seat 153a, the flexible display 110 may be disposed on the first bracket 151, the first hinge frame 131, the second hinge frame 133, and the second bracket 153. In this case, a first region (e.g., a left region) of the flexible display 110 may be attached to the first bracket 151 and the first hinge frame 131 via a first adhesive member, and a second region (e.g., a right region) of the flexible display 110 may be attached to the second bracket 153 and the second hinge frame 133 via a second adhesive member. The first adhesive member and the second adhesive member may include a pressure-sensitive adhesive.

[0070] Various electronic components may be mounted on the printed circuit boards 171 and 173. For example, one or more electronic devices or circuit lines may be mounted on the printed circuit boards 171 and 173, and at least some of them may be electrically connected to each other. The electronic components may include a processor 173a, a memory 173b, a PMIC, and a communication circuit.

[0071] Figure 2The foldable electronic device 100 is shown to include a first printed circuit board 171 and a second printed circuit board 173, but the foldable electronic device 100 is not limited thereto. Alternatively, the foldable electronic device 100 may omit one of the first printed circuit board 171 and the second printed circuit board 173, and the foldable electronic device 100 may also include one or more other printed circuit boards.

[0072] Although Figure 2 The first printed circuit board 171 and the second printed circuit board 173 are shown as being separated from each other, and the first printed circuit board 171 and the second printed circuit board 173 may be electrically connected to each other or may be provided integrally. When the first printed circuit board 171 and the second printed circuit board 173 are provided integrally, the first printed circuit board 171 and the second printed circuit board 173 may be arranged to overlap the first bracket 151 or the second bracket 153 when the foldable electronic device 100 is viewed from above the front. Alternatively, when the first printed circuit board 171 and the second printed circuit board 173 are provided integrally, at least one of the first printed circuit board 171 and the second printed circuit board 173 may include a flexible printed circuit board.

[0073] The battery 175 may supply power to the foldable electronic device 100. For example, the battery 175 may be electrically connected to the printed circuit boards 171 and 173 to supply power to electronic components (e.g., a processor 173a, a memory 173b, etc.) mounted on the printed circuit boards 171 and 173. The battery 175 may be provided integrally with the foldable electronic device 100 or may be provided detachably.

[0074] The outer shells 191 and 193 may protect at least one surface of the foldable electronic device 100 from external impact. The outer shells 191 and 193 may form the rear appearance of the foldable electronic device 100 together with the hinge housing 137. The outer shells 191 and 193 may include a first outer shell 191 accommodating the first bracket 151 and the first hinge bracket 131 fixedly mounted on the first bracket 151, and a second outer shell 193 accommodating the second bracket 153 and the second hinge bracket 133 fixedly mounted on the second bracket 153.

[0075] Each of the first housing body 191 and the second housing body 193 may include a front, a back, and a side that partially surrounds the space between the front and the back. The side refers to the side that is visually seen when looking at the thin side of the foldable electronic device 100, the front refers to the area other than the side and the surface that exposes the screen output by the flexible display 110 to the outside, and the back refers to the surface away from the front. Part of the screen of the flexible display 110 can be exposed to the outside through the back and / or the side. However, unlike the back and / or the side, the front of the flexible display 110 can be provided so that the screen of the flexible display 110 is output in its entire area.

[0076] The outer shells 191 and 193 may fixedly support the internal components of the foldable electronic device 100. For example, the first outer shell 191 may provide a space in which the first hinge frame 131, the first bracket 151, the first printed circuit board 171, etc. are placed, and may fixedly support the placed components. The second outer shell 193 may provide a space in which the second hinge frame 133, the second bracket 153, the second printed circuit board 173, etc. are placed, and may fixedly support the placed components.

[0077] The first housing 191 and the second housing 193 may be connected by the hinge assembly 130. For example, the first bracket 151 fixing the first hinge frame 131 may be fixedly accommodated in the first housing 191; the second bracket 153 fixing the second hinge frame 133 may be fixedly accommodated in the second housing 193; and at least one hinge 135 rotatably connecting the first hinge frame 131 and the second hinge frame 133, and a hinge housing 137 accommodating at least one hinge 135 and connecting the first hinge frame 131 and the second hinge frame 133 may be provided between the first housing 191 and the second housing 193. In this case, the side of the first hinge frame 131 facing the second hinge frame 133 may be fixedly inserted into an opening formed in a side of the first housing facing the second housing 193, and the side of the second hinge frame 133 facing the first hinge frame 131 may be fixedly inserted into an opening formed in a side of the second housing facing the first housing 191. The hinge housing 137 may be fixed to the side of the first housing 191 and the side of the second housing 193 corresponding thereto. For example, the hinge housing 137 may have a left edge fixed to the right side of the first housing 191 and a right edge fixed to the left side of the second housing 193.

[0078] As described above, the foldable electronic device 100 can be folded at the hinge 135. Since the flexible display 110 is provided from the first bracket 151 to the second bracket 153 across the first hinge frame 131, the hinge 135, and the second hinge frame 133, the flexible display 110 can be folded or unfolded together with the foldable electronic device 100 by the opening / closing operation of the foldable electronic device 100. For example, when the foldable electronic device 100 is viewed from above the front thereof, the foldable electronic device 100 can be folded or unfolded around the folding portion 101 having a predetermined length in the longitudinal direction of the foldable electronic device 100 while having a width in the width direction of the foldable electronic device 100 that overlaps with the hinge 135 in the width direction of the hinge 135. In this case, the foldable electronic device 100 can provide a first state (unfolded state) and a second state (folded state), in which the flexible display 110 is unfolded around the folding portion 101 so that the first area (e.g., the left area) and the second area (e.g., the right area) are substantially flush with each other, and in the second state (folded state), the flexible display 110 is folded around the folding portion 101 so that the first area and the second area face each other.

[0079] The foldable electronic device 100 may include a plurality of hinge assemblies 130. The hinge assemblies 130 may be provided according to the number of folding portions 101 of the foldable electronic device 100. Since the foldable electronic device 100 may be folded or unfolded about the hinge 135 of the hinge assemblies 130, the foldable electronic device 100 may be provided with the same number of hinge assemblies 130 as the number of folding portions 101 thereof.

[0080] Figure 4 A folding portion of a foldable electronic device including a heat diffusion member according to an embodiment is shown.

[0081] refer to Figure 4 , with respect to the central axis of the folding part of the foldable electronic device, the first hinge frame 131 is disposed on the left side and the second hinge frame 133 is disposed on the right side. The first hinge frame 131 is attached to the back side of the first region 111 of the flexible display 110 via the first adhesive member 410, and the second hinge frame 133 is attached to the back side of the second region 113 of the flexible display 110 via the second adhesive member 430. The first adhesive member 410 and the second adhesive member 430 may include a pressure-sensitive adhesive. The first hinge frame 131 and the second hinge frame 133 may be connected by at least one hinge, and the hinge housing 137 covers the at least one hinge to form the appearance of the foldable electronic device 100. An internal space 137a may be formed between the first hinge frame 131 and the second hinge frame 133 and the hinge housing 137.

[0082] The separation distance between the second hinge frame 133 and the central axis of the folder may be smaller than the separation distance between the first hinge frame 131 and the central axis of the folder. For example, the second hinge frame 133 may be spaced apart from the central axis of the folder by a predetermined distance.

[0083] The heat diffusion member 210 is disposed between the second hinge frame 133 and the central axis of the folding portion. For example, the heat diffusion member 210 may be disposed on the right side with respect to the central axis of the folding portion 101, and the second hinge frame 133 may be disposed on the right side of the heat diffusion member 210. The heat diffusion member 210 is attached to the back surface of the second region 113 of the flexible display 110 via the third adhesive member 450. The third adhesive member 450 may include a pressure-sensitive adhesive.

[0084] In order to increase the contact area with the air in the inner space 137a, the heat diffusion member 210 may be arranged to be elongated in the longitudinal direction of the foldable electronic device. Figure 4 , the heat diffusion member 210 may be elongated in a direction perpendicular to the drawing sheet.

[0085] Figure 5 A folding portion of a foldable electronic device including a plurality of heat diffusion members according to an embodiment is shown. Figure 5 , the following can be omitted Figure 4 Description of the elements of the same arrangement structure.

[0086] refer to Figure 5 , similar to Figure 4 , with respect to the central axis of the folding portion of the foldable electronic device, the first hinge frame 131 is disposed on the left side and the second hinge frame 133 is disposed on the right side. Figure 4 In the embodiment of the present invention, the separation distance between the second hinge frame 133 and the central axis of the folding part may be substantially equal to the separation distance between the first hinge frame 131 and the central axis of the folding part. For example, the first hinge frame 131 is spaced apart from the central axis of the folding part by a predetermined distance, and the second hinge frame 133 is also spaced apart from the central axis of the folding part, wherein the distances may be equal to each other.

[0087] The first heat diffusion member 211 is disposed between the first hinge frame 131 and the central axis of the folding portion, and the second heat diffusion member 213 is disposed between the second hinge frame 133 and the central axis of the folding portion. For example, the first heat diffusion member 211 is disposed on the left side with respect to the central axis of the folding portion, and the first hinge frame 131 is disposed on the left side of the first heat diffusion member 211. The second heat diffusion member 213 is disposed on the right side with respect to the central axis of the folding portion, and the second hinge frame 133 is disposed on the right side of the second heat diffusion member 213. The first heat diffusion member 211 is attached to the back surface of the first region 111 of the flexible display 110 via the fourth adhesive member 451, and the second heat diffusion member 213 is attached to the back surface of the second region 113 of the flexible display 110 via the fifth adhesive member 453. The fourth adhesive member 451 and the fifth adhesive member 453 may include a pressure-sensitive adhesive.

[0088] In order to increase the contact area with the air in the internal space 137a, the first heat diffusion member 211 and the second heat diffusion member 213 may be disposed to be elongated in the longitudinal direction of the foldable electronic device.

[0089] At least one of the first heat diffusion member 211 and the second heat diffusion member 213 may be stacked on the other heat diffusion member in the height direction of the foldable electronic device (a direction parallel to the normal direction of the front face of the foldable electronic device). Figure 5 , another third heat diffusion member may be attached to the bottom surface (or back surface) of the first heat diffusion member 211, and another fourth heat diffusion member may be further attached to the bottom surface of the second heat diffusion member 213. Therefore, the contact area with air in the inner space 137a may be increased, which may lead to faster heat dissipation.

[0090] Figure 6 A folding portion of a foldable electronic device including a flexible heat diffusion member according to an embodiment is shown. Figure 6 , the following can be omitted Figure 4 and Figure 5 Description of the elements of the same arrangement structure.

[0091] refer to Figure 6 , with respect to the central axis of the folding portion of the foldable electronic device, the first hinge frame 131 is disposed on the left side and the second hinge frame 133 is disposed on the right side. The heat diffusion member 210 is disposed between the first hinge frame 131 and the central axis of the folding portion, and is disposed between the second hinge frame 133 and the central axis of the folding portion. For example, the heat diffusion member 210 formed integrally may be disposed between the first hinge frame 131 and the second hinge frame 133.

[0092] Since the heat diffusion member 210 is integrally provided across the central axis of the foldable portion, the heat diffusion member 210 can be folded or unfolded together with the foldable electronic device according to the opening / closing operation of the foldable electronic device. Therefore, the heat diffusion member 210 should have flexibility. A flexible heat diffusion member can also be used as Figure 4 and 5 The heat diffusion member shown in .

[0093] Figure 7 shows a folded portion of a foldable electronic device including a heat sink according to an embodiment, Figure 8 A folded portion of a foldable electronic device including a heat conductive sheet according to an embodiment is shown. Figure 7 and Figure 8 The heat diffusion member shown in can be used to utilize the heat dissipation function of the inner space of the hinge housing, and can be used to control sudden temperature changes of the flexible display.

[0094] refer to Figure 7 and Figure 8 , with respect to the central axis of the folding portion of the foldable electronic device, the first hinge frame 131 is disposed on the left side, and the second hinge frame 133 is disposed on the right side. The first heat diffusion member 211 is disposed between the first hinge frame 131 and the central axis of the folding portion, and the second heat diffusion member 213 is disposed between the second hinge frame 133 and the central axis of the folding portion. For example, the first heat diffusion member 211 is disposed on the left side relative to the central axis of the folding portion, and the first hinge frame 131 is disposed on the left side of the first heat diffusion member 211. The second heat diffusion member 213 is disposed on the right side relative to the central axis of the folding portion, and the second hinge frame 133 is disposed on the right side of the second heat diffusion member 213.

[0095] The heat sink 710 is attached to the back side of the flexible display 110. The heat sink 710 may uniformly diffuse the heat transferred from the first heat diffusion member 211 and the second heat diffusion member 213 to the flexible display 110 toward its surface. In addition, the heat sink 710 may transfer the heat generated by the flexible display 110 to the first heat diffusion member 211 and the second heat diffusion member 213. The heat sink 710 may be attached to the back side of the buffer layer of the flexible display 110, and may be made of a material such as copper (Cu) or graphite.

[0096] refer to Figure 8 The heat conductive sheet 810 is disposed between the first heat diffusion member 211 , the second heat diffusion member 213 and the flexible display 110 .

[0097] More specifically, Figure 8There are shown a heat sink 710 attached to the back side of the flexible display 110, a heat conductive sheet 810 attached to the back side of the heat sink 710, and a first heat diffusion member 211 and a second heat diffusion member 213 attached to the back side of the heat conductive sheet 810. The heat conductive sheet 810 may be used in order to increase the heat transfer effect from the first heat diffusion member 211 and the second heat diffusion member 213 to the flexible display 110. The heat conductive sheet 810 may be formed of a material having high thermal conductivity.

[0098] The adhesive member for attaching the first heat diffusion member 211 and the second heat diffusion member 213 to the back surface of the flexible display 110 or the heat sink 710 may be made of a material having high thermal conductivity. Figure 7 In the embodiment, the fourth and fifth adhesive members 451 and 453 for attaching each of the first and second heat diffusion members 211 and 213 to the heat sink 710 may be made of a material having high thermal conductivity improved by mixing a high thermal conductive inorganic filler material with a viscous polymer material.

[0099] Fig. 9 A folding portion of a foldable electronic device including a heat diffusion member on a front face of a hinge frame according to an embodiment is illustrated.

[0100] refer to Fig. 9 , with respect to the central axis of the folding portion of the foldable electronic device, the first hinge frame 131 is disposed on the left side and the second hinge frame 133 is disposed on the right side. The heat sink 710 is attached to the back side (bottom side) of the flexible display 110, the first hinge frame 131 is attached to the back side of the heat sink 710 via the first adhesive member 410, and the second hinge frame 131 is attached to the back side (or bottom side) of the heat sink 710 via the second adhesive member 430. Alternatively, the heat sink 710 may be omitted. In this case, the first hinge frame 131 may be attached to the back side of the first region 111 of the flexible display 110 via the first adhesive member 410, and the second hinge frame 133 may be attached to the back side of the second region 113 of the flexible display 110 via the second adhesive member 430. The first adhesive member 410 and the second adhesive member 430 may include a pressure-sensitive adhesive.

[0101] In addition, the first hinge frame 131 and the second hinge frame 133 are connected by the hinge housing 137 , and an inner space 137 a is formed between the first hinge frame 131 and the second hinge frame 133 and the hinge housing 137 .

[0102] The separation distance between the first hinge frame 131 and the central axis of the folding portion and the separation distance between the second hinge frame 133 and the central axis of the folding portion may be less than a predetermined size. For example, the distance between the first hinge frame 131 and the second hinge frame 133 may be very small so that the heat diffusion members 211 and 213 cannot be disposed between the first hinge frame 131 and the second hinge frame 133. In this case, the heat diffusion members 211 and 213 may be disposed between the first hinge frame 131 and the second hinge frame 133 and the flexible display 110. For example, Fig. 9 As shown in , the first heat diffusion member 211 can be disposed between the first hinge frame 131 and the heat sink 710 attached to the back side of the flexible display 110, and the second heat diffusion member 213 can be disposed between the second hinge frame 133 and the heat sink 710 attached to the back side of the flexible display 110.

[0103] To increase the heat diffusion rate into the inner space 137a, the distance between the first hinge frame 131 and the second hinge frame 133 may be maintained at a predetermined size or more. Alternatively, at least one of the first hinge frame 131 and the second hinge frame 133 may include a material having high thermal conductivity.

[0104] Fig. 10A shows a folding portion of a foldable electronic device including a heat diffusion member on a back side of a hinge frame according to an embodiment, Fig. 10A A folding portion of a foldable electronic device including a heat diffusion member on the back side of a hinge frame according to another embodiment is shown. Fig. 10A and Fig. 10B In the description of Fig. 9 The components described are similar to the descriptions of the components.

[0105] refer to Fig. 10A and 10B , with respect to the central axis of the folding portion of the foldable electronic device, the first hinge frame 131 is disposed on the left side, and the second hinge frame 133 is disposed on the right side. The heat sink 710 is attached to the back side of the flexible display 110, the first hinge frame 131 is attached to the back side of the heat sink 710 through the first adhesive member 410, and the second hinge frame 133 is attached to the back side of the heat sink 710 via the second adhesive member 430. Alternatively, the heat sink 710 may be omitted.

[0106] The separation distance between the first hinge frame 131 and the central axis of the folding portion and the separation distance between the second hinge frame 133 and the central axis of the folding portion may be less than a predetermined size. For example, when the distance between the first hinge frame 131 and the second hinge frame 133 is small, the heat diffusion members 211 and 213 may not be provided between the first hinge frame 131 and the second hinge frame 133.

[0107] In addition, the separation distance between the first hinge frame 131 and the flexible display 110 (or the heat sink 710) and the separation distance between the second hinge frame 133 and the flexible display 110 may be less than a predetermined size. For example, when the distance between the first hinge frame 131 and the second hinge frame 133 and the flexible display 110 is small, the heat diffusion members 211 and 213 may not be disposed between the first hinge frame 131 and the second hinge frame 133 and the flexible display 110. In this case, the heat diffusion members 211 and 213 may be disposed on the back side (or bottom side) of the first hinge frame 131 and the second hinge frame 133. For example, as Fig. 10A and Fig. 10B As shown, the first heat diffusion member 211 may be disposed on the rear surface of the first hinge frame 131 , and the second heat diffusion member 213 may be disposed on the rear surface of the second hinge frame 133 .

[0108] In order to increase the heat transfer effect between the first and second heat diffusion members 211 and 213 and the flexible display 110 , a heat conductive sheet 810 may be attached to the back side of the flexible display 110 .

[0109] like Fig. 10A As shown, through holes may be formed in predetermined portions of the first hinge frame 131 and the second hinge frame 133 to which the first heat diffusion member 211 and the second heat diffusion member 213 are attached. For example, the first through hole 131b is formed in a portion of the first hinge frame 131 to which the first heat diffusion member 211 is attached, and the second through hole 133c is formed in a portion of the second hinge frame 133 to which the second heat diffusion member 213 is attached. At least one of the first through hole 131b and the second through hole 133c may be filled with a material 1010 having high heat transfer efficiency. The material 1010 may include, for example, thermal conductive silicone grease.

[0110] like Fig. 10BAs shown, the divided portions 131c and 133d may be formed in predetermined portions of the first hinge frame 131 and the second hinge frame 133 to which the first heat diffusion member 211 and the second heat diffusion member 213 are attached. For example, the first divided portion 131c is formed in the first hinge frame 131, and the second divided portion 133d is formed in the second hinge frame 133. The first divided portion 131c and the second divided portion 133d may prevent heat transferred from the first heat diffusion member 211 and the second heat diffusion member 213 to the first hinge frame 131 from being diffused to the outside of the folding portion 101 along the first hinge frame 131 and the second hinge frame 133. Due to the first divided portion 131c, heat transferred from the first heat diffusion member 211 disposed on the right rear surface (or right bottom surface) of the first hinge frame 131 with respect to the first divided portion 131c may not diffuse to the left side of the first hinge frame 131, and due to the second divided portion 133d, heat transferred from the second heat diffusion member 213 disposed on the left rear surface (or left bottom surface) of the second hinge frame 133 with respect to the second divided portion 133d may not diffuse to the right side of the second hinge frame 133.

[0111] Fig.11 A method for preventing a folded portion of a flexible display from deforming according to an embodiment is shown. For example, Fig.11 The method will be described as follows Figures 1 to 3 The foldable electronic device 100 shown implements.

[0112] refer to Fig.11 In step 1110, the processor 173a of the foldable electronic device 100 acquires the first temperature t1 through a temperature sensor capable of measuring the external temperature of the foldable electronic device 100. The temperature sensor may be disposed on one surface of the outer housing 191 or 193 of the foldable electronic device 100, or may be disposed in the inner space 137a of the hinge housing 137. The temperature sensor may be disposed on the back surface (or bottom surface) of the first hinge frame 131 or the second hinge frame 133, adjacent to the heat diffusion member 210 in the inner space 137a formed between the first hinge frame 131 and the second hinge frame 133 and the hinge housing 137.

[0113] In step 1130, the processor 173a acquires a second temperature t2 through a temperature sensor. The second temperature may be a temperature measured when a predetermined time has passed after the first temperature is measured. The first temperature may be measured when the foldable electronic device 100 is being folded, and the second temperature may be measured when a predetermined time has passed after the foldable electronic device 100 is folded. Alternatively, the first temperature may be measured when the foldable electronic device 100 is being unfolded, and the second temperature may be measured when a predetermined time has passed after the foldable electronic device 100 is unfolded. As another alternative, the first temperature may be measured when the foldable electronic device 100 has been unfolded (or folded), and the second temperature may be measured when a predetermined time has passed after the first temperature is measured while the foldable electronic device 100 remains in the same state (i.e., when the foldable electronic device 100 is unfolded (or folded)).

[0114] In step 1150, the processor 173a determines whether the temperature change (difference between t1 and t2) is greater than or equal to a predetermined value. For example, the processor 173a determines whether the absolute value of the difference between the first temperature and the second temperature (|t1-t2|) is greater than or equal to a predetermined value.

[0115] When the temperature change is less than the predetermined value, the method returns to step 1130. For example, the processor 173a acquires the second temperature again.

[0116] When the processor 173a is to perform step 1130 again, the processor 173a may wait until a predetermined time has passed. For example, when obtaining the second temperature again, the processor 173a may obtain the second temperature through the temperature sensor after a predetermined time has passed. If the temperature is measured again too quickly, the obtained temperature value may not change significantly.

[0117] Furthermore, in the process of repeatedly performing operations 1130 and 1150 , the processor 173 a may monitor when the foldable electronic device 100 is placed at a lower temperature point by measuring the temperature outside the foldable electronic device 100 at predetermined time intervals.

[0118] When the temperature outside the foldable electronic device 100 decreases rapidly, the temperature change may be greater than or equal to a predetermined value. When the flexible display 110 is unfolded or folded and the plastic material (e.g., PI) constituting the flexible display 110 hardens, a defect phenomenon (or a risk of deformation) such as warping, cracking, or peeling may occur in the flexible display 110.

[0119] Therefore, when the temperature change is greater than or equal to the predetermined value in step 1150, the processor 173a drives the heat generating component connected to the heat diffusion component 210 to set the time in step 1190. The heat generating component is an electronic component that is a main heat source, and may be, for example, the processor 173a, the PMIC, etc. mounted on the printed circuit boards 171 and 173. The set time may be a time set based on at least one of the first temperature, the second temperature, and the temperature change amount. When the sudden temperature change of the flexible display 110 is controlled by driving the heat generating component for at least the set time, a defect phenomenon (or a risk of deformation) such as warping, cracking, or peeling in the flexible display 110 may be prevented when the foldable electronic device 100 is folded or unfolded.

[0120] Optionally, before performing operation 1190, the processor 173a notifies the user of the risk of deformation of the folded portion 101 (folded portion) of the flexible display 110 due to temperature change in step 1170. For example, the processor 173a may notify the user of the risk of deformation of the folded portion 101 by adjusting the light emitting color, light emitting time, light emitting cycle, etc. of the light emitting device provided in the outer shells 191 and 193.

[0121] As another example, when the foldable electronic device 100 further includes an external display 120 on the back side of the outer shell 191 or 193, the processor 173a may notify the user of the risk of deformation of the folding portion 101 through the external display 120. The processor 173a may use text or an image indicating the danger of deformation of the folding portion 101 to be displayed on the external display 120 to notify the user of the deformation risk of the folding portion 101 via the external display 120. By causing the set time to be displayed on the external display 120, the processor 173a may prompt the user to prohibit folding or unfolding the flexible display 110 before the set time has passed.

[0122] Alternatively, when the second temperature becomes lower than the set temperature, the processor 173a may perform step 1190 (and step 1170). For example, when the temperature outside the foldable electronic device 100 is lower than the set temperature, the processor 173a may drive the heat generating member to increase the temperature of the flexible display 110.

[0123] Fig.12 A method for preventing a folded portion of a flexible display from deforming during an event related to switching a state of a foldable electronic device according to an embodiment is shown. For example, Fig.12 The method will be described as follows Figures 1 to 3 The foldable electronic device 100 shown implements.

[0124] refer to Fig.12In step 1210, the processor 173a of the foldable electronic device 100 obtains the first temperature t1 through the temperature sensor measuring the external temperature of the foldable electronic device 100. The setting position of the temperature sensor can be the same as the reference Fig.11 Same as described.

[0125] In step 1220, the processor 173a determines whether an event related to the state switching of the foldable electronic device 100 occurs. The event related to the state switching may include an event for inducing the foldable electronic device 100 to switch from the folded state to the unfolded state or an event for inducing the foldable electronic device 100 to switch from the unfolded state to the folded state. That is, when the event related to the state switching occurs, the probability that the user unfolds or folds the foldable electronic device 100 is high. The event related to the state switching may include a call receiving event, a message receiving event, an email receiving event, a notification receiving event, an alarm event, a holding event, and the like. During the incoming call receiving event, the message receiving event, the email receiving event, or the notification receiving event, the user may unfold the foldable electronic device 100 to check the received content. During the alarm event, the user may unfold the foldable electronic device 100 to check the time or turn off the alarm. Since the holding event occurs when the user holds the foldable electronic device 100, the probability that the user will unfold or fold the electronic device 100 is high. For example, when a holding event occurs while the foldable electronic device 100 is folded, the processor 173 a may determine that the user will unfold the foldable electronic device 100 .

[0126] When a grip event occurs while the foldable electronic device 100 is unfolded, the processor 173a can determine the grip type (e.g., the number and position of gripping fingers) by analyzing information about the grip event (e.g., the number of touches and the touch position). When the grip type is for folding the foldable electronic device 100, the processor 173a can determine that the user will fold the foldable electronic device 100.

[0127] When no event related to the state transition occurs, the processor 173a repeats step 1220 at a predetermined time interval. For example, the processor 173a may continuously monitor whether an event related to the state switching occurs.

[0128] In step 1230, when an event related to state switching occurs, the processor 173a acquires a second temperature t2 through a temperature sensor. The first temperature may be a temperature measured when the foldable electronic device 100 is being folded, and the second temperature may be a temperature measured when an event related to state switching occurs after the foldable electronic device 100 is folded. Alternatively, the first temperature may be measured when the foldable electronic device 100 is being unfolded, and the second temperature may be measured when an event related to state switching occurs after the foldable electronic device 100 is unfolded. As another example, the first temperature may be measured when the foldable electronic device 100 is already in an unfolded state (or folded state), and the second temperature may be measured when an event related to state switching occurs in the same state (i.e., when the foldable electronic device 100 remains in an unfolded (or folded state)).

[0129] In step 1240, the processor 173a determines whether the temperature change is greater than or equal to a predetermined value. For example, the processor 173a may determine whether the absolute value of the difference between the first temperature and the second temperature (|t1-t2|) is greater than or equal to a predetermined value.

[0130] When the temperature change is less than the predetermined value, the processor 173a terminates the method. For example, when the temperature change is less than the predetermined value, the temperature outside the foldable electronic device 100 does not suddenly drop. Therefore, the processor 173a can terminate the process for preventing the folding portion 101 of the flexible display 110 from deforming.

[0131] However, when the temperature change is greater than or equal to the predetermined value in step 1240, the processor 173a suggests the user to postpone the state switching of the foldable electronic device 100 in step 1250. For example, when the foldable electronic device 100 is folded, the processor 173a may suggest the user to postpone unfolding the foldable electronic device 100, and when the foldable electronic device 100 is unfolded, the processor 173a may suggest the user to postpone folding the foldable electronic device 100. When the foldable electronic device 100 is unfolded or folded, the folded portion 101 (folded portion) of the flexible display 110 may be deformed due to a sudden temperature change. Therefore, the processor 173a may suggest the user to unfold or fold the foldable electronic device 100 later.

[0132] For example, the processor 173a can suggest the user to postpone folding / unfolding the foldable electronic device 100 by adjusting the light color, light time, light cycle, etc. of the light emitting device provided in the outer shell 191 and 193. As another example, when the foldable electronic device 100 further includes an external display 120 on the back of the outer shell 191 or 193, the processor 173a can suggest the user to postpone folding / unfolding the foldable electronic device 100 via the external display 120, for example, using text and / or images to suggest postponing the state change of the foldable electronic device to be displayed on the external display 120.

[0133] The processor 173a may be used to postpone a set time for switching the state of the foldable electronic device 100 to be displayed on the external display 120. For example, the processor 173a may instruct the user to prohibit switching the state of the foldable electronic device 100 within a set time. The set time may be set based on at least one of the first temperature, the second temperature, and the temperature change amount.

[0134] In step 1260, the processor 173a drives the heat generating member connected to the heat diffusion member 210 for a set time. The heat generating member may be an electronic component mounted on the printed circuit boards 171 and 173 that generates sufficient heat, such as the processor 173a, the PMIC, etc. When the sudden temperature change of the flexible display 110 is controlled by driving the heat generating member connected to the heat diffusion member 210 for at least a set time,

[0135] During the state switching of the foldable electronic device 100 , defect phenomena such as warping deformation, cracking, or peeling may not occur in the flexible display 110 .

[0136] After the set time has passed, in step 1270 , the processor 173 a may stop driving the heat generating member.

[0137] In step 1280, the processor 173a notifies the user that it is safe to fold / unfold the foldable electronic device 100. For example, the processor 173a may notify the user of the safety of the state switching of the foldable electronic device 100 by stopping the light emission of the light emitting device or by adjusting the light emission color, light emission time, light emission cycle, etc. of the light emitting device. As another example, when the foldable electronic device 100 further includes an external display 120, the processor 173a may notify the user of the safety of the state switching of the foldable electronic device 100 through the external display 120, for example, using text and / or images to notify the safety of the state change of the foldable electronic device.

[0138] Alternatively, when the second temperature becomes lower than the set temperature, the processor 173a may perform steps 1250 to 1280. For example, when the temperature outside the foldable electronic device 100 is lower than the set temperature, the processor 173a may drive the heat generating member to increase the temperature of the flexible display 110.

[0139] As described above, according to an embodiment, a foldable electronic device may include: a flexible display; a hinge assembly configured to place the flexible display in a first state or in a second state, in which a first region and a second region of the flexible display are substantially flush with each other, and in which the first region and the second region face each other; and a heat diffusion member. The hinge assembly may include: a first hinge frame attached to a bottom surface of the first region by a first adhesive member; a second hinge frame attached to a bottom surface of the second region by a second adhesive member; a hinge pivotally connecting the first hinge frame and the second hinge frame to each other; and a hinge housing having an internal space that accommodates the hinge and connects the first hinge frame and the second hinge frame to each other. At least a partial area of ​​the heat diffusion member may be disposed between the flexible display and the hinge housing and disposed in the internal space or at a position communicating with the internal space.

[0140] The heat diffusion member may include a first heat diffusion member and a second heat diffusion member. At least a partial area of ​​the first heat diffusion member may be disposed between the second area and the hinge housing and disposed in the internal space or at a position communicating with the internal space to extend above a central axis direction in which the first area and the second area are adjacent to each other, and at least a partial area of ​​the second heat diffusion member may be disposed between the second area and the hinge housing and disposed in the internal space or at a position communicating with the internal space to extend below the central axis direction.

[0141] The heat diffusion member may include a first heat diffusion member and a second heat diffusion member. At least a partial area of ​​the first heat diffusion member may be disposed between the first area and the hinge housing, and may be disposed in the internal space or at a position communicating with the internal space to extend in a central axis direction where the first area and the second area are adjacent to each other, and at least a partial area of ​​the second heat diffusion member may be disposed between the second area and the hinge housing, and may be disposed in the internal space or at a position communicating with the internal space to extend in a central axis direction.

[0142] The heat diffusion member may be formed of a flexible material, and a partial region may be integrally provided across a central axis where the first region and the second region are adjacent to each other.

[0143] The foldable electronic device may further include a heat sink disposed between the first hinge frame and the second hinge frame and the flexible display, and attached to a rear surface of the flexible display.

[0144] The foldable electronic device may further include a heat conductive sheet disposed between the partial area and the flexible display.

[0145] The partial area may be disposed between the first hinge frame or the second hinge frame and the flexible display and may communicate with the internal space.

[0146] The partial area may be disposed in an inner space between the first hinge frame or the second hinge frame and the hinge housing, and may be attached to a rear surface of the first hinge frame or the second hinge frame.

[0147] The foldable electronic device may further include a heat conductive sheet disposed between the first hinge frame or the second hinge frame and the flexible display, with a partial area attached to the first hinge frame or the second hinge frame.

[0148] The first hinge frame or the second hinge frame to which the partial region is attached has a through hole formed in a portion to which the partial region is attached, and the through hole is filled with a heat transfer material.

[0149] The first hinge frame or the second hinge frame to which the partial region is attached has a division portion formed in a portion adjacent to the portion to which the partial region is attached.

[0150] The first hinge frame has a first groove in a side thereof facing the second hinge frame, and a portion of the hinge is seated in and coupled to the first groove.

[0151] The second hinge frame has a second groove in a side thereof facing the first hinge frame, the remaining part of the hinge can be seated in the second groove and coupled to the second groove, and the second hinge frame can have a third groove in a side thereof facing the first hinge frame so that the remaining part of the heat diffusion member is inserted into the third groove.

[0152] The foldable electronic device may further include: a first bracket having a first seat, the first hinge frame being fixedly disposed on the first seat; and a second bracket having a second seat, the second hinge frame being fixedly disposed on the second seat. The first seat may be formed by recessing the first bracket from a first surface facing the first hinge frame toward a surface facing the first surface, and the recessed length, width, and height of the first seat correspond to the length, width, and height of the first hinge frame, respectively. The second seat may be formed by recessing the second bracket from a second surface facing the second hinge frame toward a surface facing the second surface, and the recessed length, width, and height of the second seat correspond to the length, width, and height of the second hinge frame, respectively.

[0153] The foldable electronic device may further include a printed circuit board on which an electronic component as a heat source is mounted, and the remaining portion of the heat diffusion member is disposed on or adjacent to the electronic component.

[0154] The foldable electronic device may further include: a processor mounted on the printed circuit board; and a temperature sensor configured to measure the temperature outside the foldable electronic device. The temperature sensor may be disposed on the back of the first hinge frame or the second hinge frame adjacent to a partial area within the internal space.

[0155] The processor can be configured to obtain a first temperature measured by a temperature sensor; obtain a second temperature measured by the temperature sensor when a predetermined time has passed after obtaining the first temperature; and drive the electronic component to set a time when it is determined that the change from the first temperature to the second temperature is equal to or greater than a predetermined value.

[0156] The processor can be configured to obtain a first temperature measured by a temperature sensor; determine whether an event related to a state switch of a foldable electronic device occurs; when it is determined that an event related to a state switch occurs, obtain a second temperature measured by the temperature sensor; and when it is determined that a change from the first temperature to the second temperature is equal to or greater than a predetermined value, drive the electronic component to set a time.

[0157] The event related to the state switching may include at least one of a call receiving event, a message receiving event, an email receiving event, a notification receiving event, an alarm event, or a holding event.

[0158] The processor may be configured to: when it is determined that the amount of change from the first temperature to the second temperature is equal to or greater than a predetermined value, suggest the user to postpone the state switching; when a set time has passed, stop driving the electronic component; and notify the user that the state switching is safe. The operation of suggesting the user to postpone the state switching may include: adjusting at least one of the light emitting color, light emitting time, or light emitting cycle of the light emitting device provided in the foldable electronic device; causing at least one of the text or image for suggesting the user to postpone the state switching to be displayed on the external display provided in the foldable electronic device; or causing the set time to be displayed on the external display. The operation of notifying that the state switching is safe may include: stopping the light emitting of the light emitting device; adjusting at least one of the light emitting color, light emitting time, or light emitting cycle of the light emitting device; or causing at least one of the text or image for notifying that the state switching is safe to be displayed on the external display.

[0159] Fig.13 An electronic device in a network environment according to an embodiment is shown.

[0160] refer to Fig.13, the electronic device 1301 in the network environment 1300 may communicate with the electronic device 1302 via a first network 1398 (e.g., a short-range wireless communication network), or communicate with the electronic device 1304 or the server 1308 via a second network 1399 (e.g., a long-range wireless communication network). The electronic device 1301 may communicate with the electronic device 1304 via the server 1308. The electronic device 1301 may include a processor 1320, a memory 1330, an input device 1350, a sound output device 1355, a display device 1360, an audio module 1370, a sensor module 1376, an interface 1377, a haptic module 1379, a camera module 1380, a power management module 1388, a battery 1389, a communication module 1390, a user identification module (SIM) 1396, and an antenna module 1397. Alternatively, at least one of the components (eg, the display device 1360 or the camera module 1380 ) may be omitted from the electronic device 1301 , or one or more other components may be added to the electronic device 1301 .

[0161] Alternatively, some of the components may be implemented as a single integrated circuit.For example, the sensor module 1376 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 1360 (eg, a display).

[0162] The processor 1320 may run software (e.g., program 1340) to control at least one other component (e.g., hardware component or software component) of the electronic device 1301 connected to the processor 1320, and may perform various data processing or calculations. As at least part of the data processing or calculation, the processor 1320 may load a command or data received from another component (e.g., sensor module 1376 or communication module 1390) into the volatile memory 1332, process the command or data stored in the volatile memory 1332, and store the resultant data in the non-volatile memory 1334. The processor 1320 includes a main processor 1321 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 1323 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 1321 in operation. Additionally or alternatively, the auxiliary processor 1323 may be adapted to consume less power than the main processor 1321, or to be adapted to be specifically used for a specified function. The auxiliary processor 1323 may be implemented separately from the main processor 1321, or as part of the main processor 1321.

[0163] When the main processor 1321 is in an inactive (e.g., sleep) state, the auxiliary processor 1323 (rather than the main processor 1321) may control at least some of the functions or states related to at least one component (e.g., display device 1360, sensor module 1376, or communication module 1390) among the components of the electronic device 1301, or when the main processor 1321 is in an active state (e.g., running an application), the auxiliary processor 1323 may control at least some of the functions or states related to at least one component (e.g., display device 1360, sensor module 1376, or communication module 1390) among the components of the electronic device 1301 together with the main processor 1321. The auxiliary processor 1323 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 1380 or communication module 1390) that is functionally related to the auxiliary processor 1323.

[0164] The memory 1330 may store various data used by at least one component of the electronic device 1301 (e.g., the processor 1320 or the sensor module 1376). The various data may include software (e.g., the program 1340) and input data or output data for commands related thereto. The memory 1330 includes a volatile memory 1332 or a non-volatile memory 1334.

[0165] The program 1340 may be stored as software in the memory 1330 , and includes, for example, an operating system (OS) 1342 , middleware 1344 , and applications 1346 .

[0166] The input device 1350 may receive commands or data from outside the electronic device 1301 (eg, a user) to be used by other components of the electronic device 1301 (eg, the processor 1320). The input device 1350 may include a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

[0167] The sound output device 1355 can output a sound signal to the outside of the electronic device 1301. The sound output device 1355 may include a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records, and the receiver may be used for incoming calls. The receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0168] The display device 1360 may visually provide information to the outside of the electronic device 1301 (e.g., a user). The display device 1360 may include a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. The display device 1360 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0169] The audio module 1370 can convert sound into an electrical signal, or vice versa. The audio module 1370 can obtain sound via the input device 1350, or output sound via the sound output device 1355 or an earphone of an external electronic device (e.g., electronic device 1302) directly (e.g., wired) or wirelessly connected to the electronic device 1301.

[0170] The sensor module 1376 may detect an operating state (e.g., power or temperature) of the electronic device 1301 or an environmental state (e.g., a user's state) outside the electronic device 1301, and then generate an electrical signal or data value corresponding to the detected state. The sensor module 1376 may include a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0171] The interface 1377 may support one or more specific protocols to be used to connect the electronic device 1301 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 1302). The interface 1377 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0172] The connection end 1378 may include a connector, wherein the electronic device 1301 can be physically connected to an external electronic device (eg, the electronic device 1302) via the connector. The connection end 1378 may include an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

[0173] The haptic module 1379 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment of the present disclosure, the haptic module 1379 may include a motor, a piezoelectric element, or an electrical stimulator.

[0174] The camera module 1380 may capture still images or moving images. The camera module 1380 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0175] The power management module 1388 may manage power supply to the electronic device 1301. The power management module 1388 may be implemented as at least part of a power management integrated circuit (PMIC).

[0176] The battery 1389 may power at least one component of the electronic device 1301. The battery 1389 may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0177] The communication module 1390 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1301 and an external electronic device (e.g., electronic device 1302, electronic device 1304, or server 1308), and perform communication via the established communication channel. The communication module 1390 may include one or more communication processors capable of operating independently from the processor 1320 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. The communication module 1390 may include a wireless communication module 1392 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1394 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 1398 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 1399 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a Wide Area Network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 1392 can identify and authenticate the electronic device 1301 in a communication network (such as the first network 1398 or the second network 1399) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1396.

[0178] The antenna module 1397 may transmit or receive a signal or power to or from the outside of the electronic device 1301 (e.g., an external electronic device). The antenna module 1397 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). The antenna module 1397 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 1398 or the second network 1399) may be selected from the plurality of antennas by, for example, the communication module 1390 (e.g., the wireless communication module 1392). Then, a signal or power may be transmitted or received between the communication module 1390 and the external electronic device via the selected at least one antenna. Another component other than the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 1397.

[0179] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0180] According to an embodiment of the present disclosure, a command or data may be sent or received between the electronic device 1301 and the external electronic device 1304 via the server 1308 connected to the second network 1399. Each of the electronic device 1302 and the electronic device 1304 may be a device of the same type as the electronic device 1301, or a device of a different type from the electronic device 1301. All or some operations to be executed in the electronic device 1301 may be executed in one or more of the external electronic device 1302, the external electronic device 1304, or the server 1308. For example, if the electronic device 1301 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 1301 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 1301 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 1301. The electronic device 1301 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0181] The electronic device according to the embodiment may be one of various types of electronic devices. The electronic device may include a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device is not limited to the above.

[0182] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or replacement forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., a second element)”, “coupled to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0183] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "part," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or part of the single integrated component. For example, according to an embodiment of the present disclosure, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0184] The various embodiments described herein may be implemented as software (e.g., program 1340) including one or more instructions stored in a storage medium (e.g., internal memory 1336 or external memory 1338) that can be read by a machine (e.g., electronic device 1301). For example, under the control of a processor, a processor (e.g., processor 1320) of the machine (e.g., electronic device 1301) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

[0185] The methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) the computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, a server of an application store, or a forwarding server).

[0186] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performs one or more functions before integration. The operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0187] According to an embodiment, heat generation in a foldable electronic device may be controlled using a heat dissipation structure utilizing an inner space of a hinge housing.

[0188] Furthermore, since the sudden temperature change of the flexible display is controlled by the heat dissipation structure, the space utilization of the foldable electronic device can be improved without the need for a separate temperature control structure.

[0189] Furthermore, since sudden temperature changes of the flexible display are controlled, the risk of deformation of the flexible display during the opening / closing process of the foldable electronic device can be reduced.

[0190] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. A foldable electronic device, comprising: Flexible displays; a hinge assembly configured to fold the first and second regions of the flexible display toward each other and unfold the first and second regions of the flexible display away from each other, respectively; Wherein, the hinge assembly comprises: a first hinge frame disposed below at least a portion of the first region and supporting the first region; a second hinge frame disposed below at least a portion of the second region and supporting the second region; a first hinge pivotally connecting a first portion of the first hinge frame and a second portion of the second hinge frame to each other; and a second hinge pivotally connecting the third portion of the first hinge frame and the fourth portion of the second hinge frame to each other; a hinge housing including an inner space accommodating the first hinge and the second hinge and connecting the first hinge frame and the second hinge frame to each other; a heat diffusion member configured to dissipate heat generated by electronic components included in the foldable electronic device, at least a portion of the heat diffusion member overlapping the first hinge when viewed in a direction from a first end of a folding axis of the hinge assembly to a second end of the folding axis of the hinge assembly; a first bracket, the first bracket comprising a first recessed seat, the first hinge frame being fixedly disposed on the first recessed seat, the recessed length, width and height of the first recessed seat corresponding to the length, width and height of the first hinge frame, respectively; and a second bracket, the second bracket comprising a second recessed seat, the second hinge frame being fixedly disposed on the second recessed seat, the recessed length, width and height of the second recessed seat corresponding to the length, width and height of the second hinge frame, respectively; One end of the heat diffusion member is disposed on or near the electronic component, and the other end of the heat diffusion member is disposed in the inner space of the hinge housing or at a position communicating with the inner space.

2. The foldable electronic device according to claim 1, wherein: The at least a portion of the heat diffusion member overlaps the second hinge when viewed in a direction from the first end to the second end.

3. The foldable electronic device according to claim 1, wherein: The first hinge and the second hinge are spaced apart from each other by a predetermined distance in a direction from the first end to the second end.

4. The foldable electronic device according to claim 1, wherein: The at least a portion of the heat diffusion member is disposed between the first hinge and the second hinge when viewed in a direction perpendicular to a direction from the first end to the second end.

5. The foldable electronic device according to claim 1, further comprising: a flexible printed circuit board, wherein the flexible printed circuit board connects a first electronic component disposed in the first bracket and a second electronic component disposed in the second bracket, wherein the first hinge frame comprises a first opening, and when viewed in a direction perpendicular to the flexible display, a first portion of the flexible printed circuit board is disposed above the first opening, and The second hinge frame includes a second opening, and when viewed in a direction perpendicular to the flexible display, the second portion of the flexible printed circuit board is disposed above the second opening.

6. The foldable electronic device according to claim 1, wherein: The second hinge frame includes a groove, and at least a portion of the heat diffusion member is disposed above the groove when viewed in a direction perpendicular to the flexible display.

7. The foldable electronic device according to claim 6, wherein: The at least a portion of the heat diffusion member is disposed on or near the electronic component through the groove included in the second hinge frame.

8. The foldable electronic device according to claim 1, wherein: The heat diffusion member is made of a flexible material.

9. The foldable electronic device according to claim 1, wherein: When the flexible display is folded, at least a portion of the first hinge frame and at least a portion of the second hinge frame are spaced apart from the first hinge.

10. The foldable electronic device according to claim 3, wherein: When the flexible display is folded, at least a portion of the first hinge frame and at least a portion of the second hinge frame are spaced apart from the second hinge.

11. The foldable electronic device according to claim 1, wherein: The heat diffusion member includes a first heat diffusion member and a second heat diffusion member.

12. The foldable electronic device according to claim 11, wherein: At least a portion of the first heat diffusion member is disposed between the first hinge frame and the flexible display, and Wherein, at least a portion of the second heat diffusion member is disposed between the second hinge frame and the flexible display.

13. The foldable electronic device according to claim 11, wherein: When viewed in a direction perpendicular to the flexible display, at least a portion of the first heat diffusion member is disposed above a first groove formed in the first hinge frame, and Wherein, when viewed in a direction perpendicular to the flexible display, at least a portion of the second heat diffusion member is disposed above a second groove formed in the second hinge frame.

14. The foldable electronic device according to claim 13, wherein: The at least a portion of the first heat diffusion member is disposed on or near the electronic component through the first groove formed in the first hinge frame, and Wherein, the at least a portion of the second heat diffusion member is disposed on or near the electronic component through the second groove formed in the second hinge frame.

15. The foldable electronic device according to claim 13, wherein: The electronic component comprises a first electronic component and a second electronic component, wherein the at least a portion of the first heat diffusion member is disposed on or near the first electronic component through the first groove formed in the first hinge frame, and Wherein, the at least a portion of the second heat diffusion member is disposed on or near the second electronic component through the second groove formed in the second hinge frame.

16. The foldable electronic device according to claim 1, wherein: At least a portion of the heat diffusion member is disposed in the inner space between the first hinge frame or the second hinge frame and the hinge housing, and is attached to a rear surface of the first hinge frame or the second hinge frame.

17. The foldable electronic device according to claim 16, further comprising: A heat conductive sheet is disposed between the first hinge frame or the second hinge frame and the flexible display, and the at least a portion of the heat diffusion member is attached to the first hinge frame or the second hinge frame.

18. The foldable electronic device according to claim 1, further comprising: A heat sink is disposed between the first hinge frame and the second hinge frame and the flexible display and is attached to a rear surface of the flexible display.

19. The foldable electronic device according to claim 1, further comprising: A heat conductive sheet is disposed between at least a portion of the heat diffusion member and the flexible display.

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