Double tube structure flow cell device

Abstract

The double-tube structure flow cell device according to the present invention is characterized in that it includes: a first flow path forming part connected to the medium inflow part for the flow medium to flow in, and the first flow path forming part is formed with a first flow path part for the flow of the flow medium; a second flow path forming part is formed with a second flow path part in a manner of communicating with the first flow path part, and the second flow path forming part is connected to the medium discharge part so that the flow medium of the second flow path part is discharged; and a bubble discharge part is connected to the first flow path forming part to discharge bubbles mixed in the flow medium of the first flow path part. According to the present invention, the high-temperature flow medium flows in the double-tube structure flow cell device, and the wavelength of the flow medium is absorbed by light, so the concentration of the flow medium is measured under the conditions used in the actual semiconductor process, and there is no need to chemically treat the flow medium in multiple times in order to improve the detection sensitivity of the flow medium.

Description

Technical Field

[0001] The present invention relates to a double-tube structure flow cell device (FLOW CELL APPARATUS), and more specifically, to a double-tube structure flow cell device capable of accurately measuring the concentration of a flowing medium by monitoring the state of the flowing medium under the use conditions of the flowing medium. Background Art

[0002] Generally, an etching process is performed in a semiconductor manufacturing process such as a semiconductor wafer or a solar cell. In the etching process, a high-temperature etching solution (flowing medium) such as a phosphoric acid solution is used to etch the silicon nitride film. Silicon and other dissolving substances are dissolved from the semiconductor wafer and then included in the etching solution. Therefore, as the etching process of the semiconductor wafer is performed, the concentration of the dissolving substances in the etching solution increases. If the concentration of the dissolving substances in the etching solution increases to a certain concentration or more, the etching solution is replaced.

[0003] Since it is difficult to micro-analyze the concentration of silicon when the etching solution is at a high temperature, a portion of the etching solution is collected and cooled to room temperature. In order to improve the detection sensitivity of the cooled etching solution, the concentration of the etching solution is detected after multiple chemical treatments.

[0004] However, conventionally, the etching solution is cooled to room temperature before multiple chemical treatments are performed, so the detection error range increases due to the temperature difference of the etching solution. Therefore, it is difficult to accurately predict the state of the etching solution under the use conditions used in actual semiconductor processes.

[0005] Furthermore, when a high-temperature etching solution is cooled to room temperature, elutions are easily precipitated from the etching solution, and therefore it may be difficult to accurately measure the concentration of the elutions in the etching solution.

[0006] Furthermore, in order to accurately measure the concentration of the etching solution, the chemical treatment is performed multiple times, so a complex matrix is ​​formed in the process of analyzing the concentration, which reduces the accuracy of the concentration analysis.

[0007] The background technology of the present invention is disclosed in Korean Patent Gazette No. 1785859 (granted on September 29, 2017, invention title: Fluorescent silicon nanoparticles for copper ion detection, method for manufacturing the same, and detection sensor using the same). Summary of the invention

[0008] Technical problem to be solved by the invention

[0009] The object of the present invention is to provide a double-tube structure flow cell device, which can monitor the state of the flowing medium under the use conditions of the flowing medium and accurately measure the concentration of the flowing medium.

[0010] Solutions to technical problems

[0011] The double-tube structure flow pool device according to the present invention is characterized in that it includes a first flow path forming part, which is connected to the medium inlet part for the flow medium to flow in, and the first flow path forming part is formed with a first flow path part for the flow of the flow medium; a second flow path forming part, which is formed with a second flow path part in a manner connected to the first flow path part, and the second flow path forming part is connected to the medium discharge part to discharge the flow medium of the second flow path part; and a bubble discharge part, which is connected to the first flow path forming part to discharge bubbles mixed in the flow medium of the first flow path part.

[0012] The second flow path forming portion may be disposed inside the first flow path forming portion.

[0013] The first flow path forming portion may include: an outer shell connecting the medium inflow portion and the bubble discharge portion; and light-transmitting portions respectively formed on both sides of the outer shell to allow light to pass therethrough.

[0014] The second flow path forming portion may include: an internal shell having both sides opened to communicate the first flow path portion and the second flow path portion, and the internal shell is connected to the medium discharge portion; and a bubble separation portion formed on an outer side surface of the internal shell.

[0015] The outer shell and the inner shell may be configured in a double tube shape.

[0016] The bubble discharge portion may be disposed on an upper side of the outer housing to discharge bubbles separated from the flowing medium.

[0017] The bubble discharge portions may be respectively formed at both side ends of the outer housing.

[0018] The bubble separation portions may be formed at both side ends of the inner shell, respectively.

[0019] The air bubble discharge part may include: an air bubble discharge line connected to the outer housing and the first pump; and an opening adjustment valve provided on the air bubble discharge line.

[0020] The cross-sectional area of ​​the first flow path portion may be formed to be larger than the cross-sectional area of ​​the medium inflow portion.

[0021] The double-tube structure flow cell device may further include: a discharge portion connected to the first flow path forming portion.

[0022] The discharge portion may include: a first discharge line connected to the first flow path forming portion and the medium discharge portion; a first switch valve provided in the first discharge line; a second discharge line branched from the first discharge line; and a second switch valve provided in the second discharge line.

[0023] Furthermore, the present invention may further include: a monitoring unit configured to irradiate light to the flowing medium flowing along the second flow path portion to measure a state of the flowing medium.

[0024] Effects of the Invention

[0025] According to the present invention, a high-temperature flowing medium flows in a double-tube structure flow cell device, and the wavelength of the flowing medium is absorbed by light, so the concentration of the flowing medium is measured under the conditions used in actual semiconductor processes, and there is no need to chemically treat the flowing medium multiple times in order to improve the detection sensitivity of the flowing medium.

[0026] Furthermore, according to the present invention, the bubble discharge section is connected to the first flow path forming section, so that while the flowing medium flows in the first flow path section of the first flow path forming section, bubbles are removed and then flow into the second flow path section of the second flow path forming section. Therefore, the monitoring section irradiates light to the flowing medium from which bubbles have been removed to measure the state of the flowing medium, thereby preventing light from being scattered and refracted by bubbles mixed in the flowing medium, and reducing light loss. Therefore, the monitoring section can accurately measure the state of the flowing medium, such as the concentration or the amount of impurities mixed therein.

[0027] Furthermore, according to the present invention, bubbles flowing along the outer side surface of the inner shell can be easily separated from the outer side surface of the inner shell by the bubble separation portion. Therefore, the bubbles separated from the first flow path portion are discharged to the outside of the first flow path forming portion by the bubble discharge portion, and the flow medium from which the bubbles are removed in the first flow path portion can flow into the second flow path portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 FIG. 1 is a perspective view schematically showing a double-tube structure flow cell device according to an embodiment of the present invention.

[0029] Figure 2 FIG. 1 is a cross-sectional view schematically showing a double-tube structure flow cell device according to an embodiment of the present invention.

[0030] Figure 3 1 is a cross-sectional view schematically showing a flow state of a flow medium in a double-tube structure flow cell device according to an embodiment of the present invention.

[0031] Figure 4 1 is a cross-sectional view showing a state in which a double-tube structure flow cell device according to an embodiment of the present invention is tilted toward one side.

[0032] Figure 5 1 is a cross-sectional view showing a state in which a double-tube structure flow cell device according to an embodiment of the present invention is tilted toward the other side.

[0033] Figure 61 is a block diagram showing a state in which a double tube structure flow cell device according to an embodiment of the present invention is applied to a first embodiment of an etching device.

[0034] Figure 7 1 is a block diagram showing a state in which a double tube structure flow cell device according to an embodiment of the present invention is applied to a second embodiment of an etching device.

[0035] Figure 8 1 is a block diagram showing a state in which a double tube structure flow cell device according to an embodiment of the present invention is applied to a third embodiment of an etching device.

[0036] Fig. 9 1 is a block diagram showing a state in which a double tube structure flow cell device according to a fourth embodiment of the present invention is applied to an etching device.

[0037] Description of Reference Numerals

[0038] 100, 100a: double tube structure flow cell device; 110: first flow path forming part; 111: outer shell; 112: first flow path part; 113: medium inflow part; 115: light transmission part; 120: second flow path forming part; 121: inner shell; 122: second flow path part; 123: medium discharge part; 125: bubble separation part; 130: bubble discharge part; 131: bubble discharge line; 133: opening regulating valve; 140: monitoring part; 141: light irradiation part; 143: light detection part; 150: discharge part; 151: first discharge line; 152: first switch valve; 153: second discharge line; 154: second switch valve; 211: phosphoric acid supply part ; 212: phosphoric acid supply line; 213: first valve; 215: additive supply unit; 216: additive supply line; 217: second valve; 221: circulation line; 222: first pump; 223: third valve; 224: fourth valve; 230: mixing tank; 235: connecting line; 236: fifth valve; 237: phosphoric acid addition line; 238: sixth valve; 240: medium supply tank; 242: second discharge line; 243: second discharge valve; 251: supply line; 252: second pump; 253: seventh valve; 254: heater; 255: spray nozzle; 256: branch line; 257: eighth valve; 260: wafer processing tank; 262: outer tank; 265: recovery line. DETAILED DESCRIPTION

[0039] Below, an embodiment of a double-tube structure flow cell device according to the present invention is described with reference to the accompanying drawings. In the process of describing the double-tube structure flow cell device, for the clarity and convenience of the description, the thickness of the lines shown in the accompanying drawings or the size of the constituent elements are sometimes exaggerated. In addition, the terms described below are terms defined in view of the functions in the present invention and may be changed according to the wishes or habits of the user or operator. Therefore, these terms should be defined based on the overall content of this specification.

[0040] Figure 1 is a perspective view briefly showing a double tube structure flow cell device according to an embodiment of the present invention, Figure 2 is a cross-sectional view briefly showing a double tube structure flow cell device according to an embodiment of the present invention, Figure 3 is a cross-sectional view briefly showing the flow state of a flow medium in a double tube structure flow cell device according to an embodiment of the present invention, Figure 4 is a cross-sectional view showing a state in which a double-tube structure flow cell device according to an embodiment of the present invention is tilted toward one side. Figure 5 1 is a cross-sectional view showing a state in which a double-tube structure flow cell device according to an embodiment of the present invention is tilted toward the other side.

[0041] Reference Figures 1 to 5 A double-tube structure flow cell device 100 according to an embodiment of the present invention includes a first flow path forming portion 110 , a second flow path forming portion 120 , a bubble exhaust portion 130 , and a monitoring portion 140 .

[0042] The double tube structure flow cell device 100 according to one embodiment of the present invention can be applied to various fields such as batch processing devices (batch type) and single processing devices (single type) for processing semiconductor materials such as chips or solar cells, devices for measuring the dissolution amount of dissolved substances, devices for measuring the concentration change of solutions, etc.

[0043] The first flow path forming portion 110, the second flow path forming portion 120, and the bubble exhaust portion 130 may be formed of any one of quartz, pyrex glass, Teflon, and sapphire materials to prevent thermal deformation and corrosion due to a flowing medium at about 150° C. to 200° C. The first flow path forming portion 110, the second flow path forming portion 120, and the bubble exhaust portion 130 may be formed of a transparent material or an opaque material.

[0044] The flowing medium may be an etching solution used in a semiconductor process when manufacturing a semiconductor wafer or a solar cell, etc. The etching solution may be a phosphoric acid solution at 150°C to 200°C.

[0045] The first flow path forming portion 110 and the second flow path forming portion 120 can flow the flowing medium heated to 150°C to 200°C in a manner that suppresses the precipitation of substances contained in the flowing medium. Therefore, the flowing medium circulating in the semiconductor process directly flows into the first flow path forming portion 110 and the second flow path forming portion 120, so the concentration of the flowing medium used in the semiconductor process can be measured in real time. In addition, there is no need to perform multiple chemical treatments after cooling the flowing medium to room temperature, so detection errors due to temperature differences in the flowing medium can be prevented. In addition, there is no need to cool the high-temperature flowing medium to room temperature, so precipitation of dissolved substances from the flowing medium can be prevented.

[0046] The first flow path forming part 110 is connected to the medium inflow part 113 for the flowing medium to flow in, and the first flow path forming part 110 is formed with a first flow path part 112 for the flowing medium to flow in. The medium inflow part 113 may be connected to an etching device for semiconductor materials.

[0047] The second flow path forming portion 120 is formed with a second flow path portion 122 so as to communicate with the first flow path portion 112 , and the second flow path forming portion 120 is connected to the medium discharge portion 123 to discharge the flowing medium in the second flow path portion 122 .

[0048] The bubble exhaust portion 130 is connected to the first flow path forming portion 110 to exhaust bubbles mixed in the flowing medium of the first flow path portion 112. The bubble exhaust portion 130 is connected to the first flow path forming portion 110, so that the flowing medium flows into the second flow path portion 122 of the second flow path forming portion 120 after bubbles are removed while flowing in the first flow path portion 112 of the first flow path forming portion 110.

[0049] The monitoring unit 140 irradiates light to the flowing medium flowing along the second flow path 122 to measure the state of the flowing medium. The monitoring unit 140 can be connected to the control unit wirelessly or by wire. The monitoring unit 140 irradiates light to the flowing medium from which bubbles are removed to measure the state of the flowing medium, so that light is prevented from being scattered and refracted by bubbles mixed in the flowing medium, and light loss can be reduced. Therefore, the monitoring unit 140 can accurately measure the state of the flowing medium, such as the concentration or the amount of impurities mixed, so the control unit can correctly determine the state of the flowing medium based on the signal received from the monitoring unit 140.

[0050] The monitoring unit 140 includes a light irradiation unit 141 and a light detection unit 143. The light irradiation unit 141 irradiates light to the second flow path portion 122 of the second flow path forming unit 120, and the light detection unit 143 detects light that passes through the flowing medium and absorbs the wavelength of the flowing medium in the second flow path portion 122. The light irradiation unit 141 is arranged on the outside of the light-transmitting unit 115 on one side, and the light detection unit 143 is arranged on the outside of the light-transmitting unit 115 on the other side. The light irradiation unit 141 and the light detection unit 143 can be arranged on both sides of the second flow path portion 122 opposite to each other. The light advances along the advancing direction of the flowing medium in the second flow path portion 122, so that the light is minimized from being scattered and refracted due to bubbles or dissolution when passing through the flowing medium, thereby reducing light loss. In addition, the light can smoothly absorb the wavelength of the dissolution contained in the flowing medium when passing through the flowing medium, so that the light detection efficiency can be improved.

[0051] The second flow path forming portion 120 is disposed inside the first flow path forming portion 110 . Therefore, the flowing medium from which bubbles have been removed in the first flow path forming portion 110 can flow into the second flow path forming portion 120 .

[0052] The first flow path forming part 110 includes an outer shell 111 and a light-transmitting part 115. The outer shell 111 connects the medium inlet part 113 and the bubble outlet part 130. The light-transmitting part 115 is formed on both sides of the outer shell 111 to allow light to pass through. The outer shell 111 can be formed of any one of glass, pyrex glass, Teflon, and sapphire. The outer shell 111 is formed into a cylindrical shape with both sides opened, and the light-transmitting part 115 is provided to close both sides of the outer shell 111. The light irradiated from the monitoring part 140 passes through the light-transmitting part 115.

[0053] The second flow path forming part 120 includes an inner shell 121 and a bubble separator 125, both sides of the inner shell 121 are opened to communicate with the first flow path part 112 and the second flow path part 122, and the inner shell 121 is connected to the medium discharge part 123, and the bubble separator 125 is protrudingly formed on the outer side surface of the inner shell 121. The bubble separator 125 is protrudingly formed on the outer side surface of the inner shell 121, so that bubbles flowing along the outer side surface of the inner shell 121 can be easily separated from the outer side surface of the inner shell 121 by the bubble separator 125. Therefore, the bubbles separated from the first flow path part 112 are discharged to the outside of the first flow path forming part 110 through the bubble discharge part 130, and the flowing medium from which the bubbles have been removed from the first flow path part 112 can flow into the second flow path part 122.

[0054] The outer housing 111 and the inner housing 121 may be formed of the same material or different materials. Also, the light-transmitting portion 115 may be formed of the same material as the outer housing 111 or the inner housing 121 or different materials.

[0055] The outer shell 111 and the inner shell 121 are configured in a double tube shape. At this time, the outer shell 111 and the inner shell 121 can be formed into a cylindrical shape. Therefore, the flow resistance of the flowing medium flowing along the outer shell 111 and the inner shell 121 is reduced, and the stagnation zone of the flowing medium can be prevented.

[0056] The bubble discharge unit 130 is disposed on the upper side of the outer shell 111 to discharge bubbles separated from the flowing medium. A plurality of bubble separation units 125 may be disposed on the upper side of the first flow path forming unit 110. The separated bubbles are lighter than the flowing medium, so they move to the upper side of the inner shell 121 and are discharged to the outside of the first flow path forming unit 110 through the bubble discharge unit 130.

[0057] The bubble exhaust parts 130 are respectively formed at both side ends of the outer shell 111. When the outer shell 111 is horizontally arranged, bubbles can be exhausted through the bubble exhaust parts 130 on both sides (refer to Figure 3 ). In addition, when the outer shell 111 is tilted, the bubbles can be discharged through the bubble discharge part 130 located at a high position (refer to Figure 4 as well as Figure 5 ). Therefore, even if the outer housing 111 is disposed horizontally or inclined, the bubbles separated from the flowing medium of the first flow path portion 112 can be discharged smoothly.

[0058] The bubble discharge unit 130 includes a bubble discharge line 131 and an opening adjustment valve 133. The bubble discharge line 131 is connected to the outer housing 111 and the first pump 222, and the opening adjustment valve 133 is provided on the bubble discharge line 131. The bubble discharge line 131 is connected to the first pump 222, so that bubbles separated from the flow medium can be discharged by the adsorption force of the first pump 222. In addition, by adjusting the opening of the opening adjustment valve 133, the flow medium of the first flow path unit 112 can be prevented from being discharged through the bubble discharge line 131.

[0059] The bubble separation part 125 is formed at both side ends of the inner shell 121. The bubble separation part 125 can be formed in a circular ring shape at both side ends of the inner shell 121. In addition, a plurality of bubble separation parts 125 are formed at both sides of the inner shell 121. The bubbles flowing along the outer side surface of the inner shell 121 are separated by the bubble separation part 125 at the end of the inner shell 121, so that the bubbles can be prevented from flowing into the second flow path part 122 of the inner shell 121. In addition, when the flowing medium flows from the first flow path part 112 to the second flow path part 122, the flow direction of the flowing medium changes sharply by about 180 degrees around the end of the inner shell 121, so that the bubbles can be separated more smoothly.

[0060] The cross-sectional area of ​​the first flow path portion 112 is formed to be larger than the cross-sectional area of ​​the medium inlet portion 113. The cross-sectional area of ​​the first flow path portion 112 increases sharply compared to the cross-sectional area of ​​the medium inlet portion 113, so the flow medium of the medium inlet portion 113 can form a turbulent flow when flowing into the first flow path portion 112. In addition, the flow medium can expand when flowing into the first flow path portion 112. Therefore, the retention interval of the flow medium in the first flow path portion 112 can be minimized, and the bubbles mixed in the flow medium can be smoothly separated from the flow medium. In addition, the flow medium of the medium inlet portion 113 forms a turbulent flow when flowing into the first flow path portion 112, so that the phosphoric acid and water contained in the flow medium can be mixed more evenly.

[0061] The cross-sectional area of ​​the second flow path portion 122 is formed to be larger than the cross-sectional area of ​​the first flow path portion 112. The cross-sectional area of ​​the second flow path portion 122 increases sharply compared to the cross-sectional area of ​​the first flow path portion 112, so that the flowing medium of the medium inlet portion 113 can form a turbulent flow when flowing into the second flow path portion 122. In addition, the flowing medium can expand when flowing into the second flow path portion 122. Therefore, at the inlet side of the second flow path portion 122, bubbles mixed in the flowing medium can be separated from the flowing medium. In addition, the flowing medium of the first flow path portion 112 forms a turbulent flow when flowing into the second flow path portion 122, so that the phosphoric acid and water contained in the flowing medium can be mixed more evenly.

[0062] The medium inlet 113 is disposed on the upper side of the first flow path forming portion 110, and the medium outlet 123 is disposed on the lower side of the second flow path forming portion 120. Therefore, the flow direction of the flowing medium is generally downward, so the flow direction of the flowing medium can be formed to be opposite to the separation direction of the bubbles.

[0063] The medium inlet 113 is arranged at the center of the length direction of the first flow path forming part 110, and the medium outlet 123 is arranged at the center of the length direction of the second flow path forming part 120. The flowing medium of the first flow path part 112 is divided and flows to both sides of the first flow path forming part 110, and the flowing medium flowing to both sides of the first flow path forming part 110 is gathered at the center side of the second flow path part 122.

[0064] The double-tube structure flow cell device 100 further includes a drain portion 150 connected to the first flow path forming portion 110. The drain portion 150 is disposed at the lower side of the first flow path forming portion 110. The drain portion 150 is connected to the first flow path forming portion 110, so that when the double-tube structure flow cell device 100 is cleaned, the flow medium stored in the first flow path forming portion 110 and the second flow path forming portion 120 can be discharged through the drain portion 150.

[0065] The discharge unit 150 includes a first discharge line 151 connected to the first flow path forming unit 110 and the medium discharge unit 123, a first on-off valve 152 provided in the first discharge line 151, a second discharge line 153 branched from the first discharge line 151, and a second on-off valve 154 provided in the second discharge line 153. When performing a semiconductor process, the first on-off valve 152 is opened and the second on-off valve 154 is closed. In addition, when discharging the flowing medium for cleaning the double-tube structure flow cell device 100, the first on-off valve 152 is closed and the second on-off valve 154 is opened.

[0066] A first embodiment of an etching device to which the double-tube structure flow cell device according to one embodiment of the present invention is applied will be described.

[0067] Figure 6 1 is a block diagram showing a state in which a double tube structure flow cell device according to an embodiment of the present invention is applied to a first embodiment of an etching device.

[0068] Reference Figure 6 The phosphoric acid supply unit 211 is connected to the phosphoric acid supply line 212 , and the phosphoric acid supply line 212 is connected to the first valve 213 . The additive supply unit 215 is connected to the additive supply line 216 , and the additive supply line 216 is connected to the second valve 217 .

[0069] The phosphoric acid supply line 212 and the additive supply line 216 are connected to the circulation line 221, and the circulation line 221 is connected to the mixing tank 230. One side of the circulation line 221 is connected to the first pump 222, and the other side of the circulation line 221 is connected to the third valve 223. Phosphoric acid and additives supplied from the phosphoric acid supply part 211 and the additive supply part 215 are mixed inside the mixing tank 230. As the phosphoric acid and the additive are mixed, a flowing medium is formed.

[0070] The mixing tank 230 is connected to the supply line 251, and the supply line 251 is sequentially connected to the second pump 252, the heater 254, and the spray nozzle 255. The spray nozzle 255 sprays the flowing medium to the wafer processing tank 260. The wafer is processed in the wafer processing tank 260.

[0071] The operation of the first embodiment of the etching device configured as described above will be described.

[0072] The first pump 222 is started and the first valve 213 is opened to supply phosphoric acid to the mixing tank 230. After the phosphoric acid supply to the mixing tank 230 is completed, the first valve 213 is closed. The second valve 217 is opened to supply additives to the mixing tank 230. After the additive supply to the mixing tank 230 is completed, the second valve 217 is closed.

[0073] The third valve 223 is closed, and the phosphoric acid and the additive in the mixing tank 230 flow along the circulation line 221 through the pumping pressure of the first pump 222. The phosphoric acid and the additive flow along the circulation line 221. The phosphoric acid and the additive in the circulation line 221 flow into the double-tube structure flow cell device 100, and the double-tube structure flow cell device 100 monitors the concentration of the phosphoric acid and the additive.

[0074] At this time, the flowing medium of the medium inflow section 113 flows into the first flow path section 112 and then removes bubbles, and the flowing medium of the first flow path section 112 flows into the second flow path section 122 after removing bubbles. Then, as the monitoring section 140 irradiates light to the second flow path section 122, the concentration of the flowing medium in the high temperature state in the second flow path section 122 is measured.

[0075] When the control unit determines that the flowing medium is mixed to a predetermined concentration, the control unit drives the second pump 252. If the second pump 252 is driven, the flowing medium in the mixing tank 230 flows along the supply line 251. The flowing medium in the supply line 251 is heated by the heater 254 and then sprayed to the wafer processing tank 260 through the spray nozzle 255.

[0076] Next, a second embodiment of an etching device using a double tube structure flow cell device according to an embodiment of the present invention is described. In the second embodiment, except for the outer tank 262 and the recovery line 265, the other parts are substantially the same as the first embodiment, and the description of the same structure as the first embodiment is omitted, and the characteristic part of the second embodiment is described.

[0077] Figure 7 1 is a block diagram showing a state in which a double tube structure flow cell device according to an embodiment of the present invention is applied to a second embodiment of an etching device.

[0078] Reference Figure 7The outer side of the wafer processing tank 260 is provided with an outer tank 262, and the outer tank 262 and the mixing tank 230 are connected to the recovery line 265. At this time, the double tube structure flow cell device 100 is connected to the circulation line 221.

[0079] After processing the wafer, the flowing medium in the wafer processing tank 260 overflows to the upper side of the wafer processing tank 260 and then flows into the outer tank 262. The flowing medium collected in the outer tank is recovered to the mixing tank 230 again through the recovery line 265.

[0080] On the other hand, when the phosphoric acid and the additive in the mixing tank 230 flow and mix along the circulation line 221, the double tube structure flow cell device 100 measures the mixed concentration of the phosphoric acid and the additive. Also, when the flowing medium in the outer tank 262 is recovered to the mixing tank 230 through the recovery line 265, the concentration of the flowing medium changes due to the dissolution of silicon and other dissolutions from the wafer. At this time, the first pump 222 is driven, so that the flowing medium in the mixing tank 230 flows into the double tube structure flow cell device 100, and the monitoring unit 140 of the double tube structure flow cell device 100 can irradiate light to the flowing medium to measure the concentration change of the flowing medium.

[0081] Therefore, the double-tube structure flow cell device 100 can measure the mixed concentration of phosphoric acid and additives before starting the wafer processing process, and can measure the concentration change of the flowing medium during the wafer processing process.

[0082] Next, a third embodiment of an etching device using a double tube structure flow cell device according to an embodiment of the present invention will be described.

[0083] Figure 8 1 is a block diagram showing a state in which a double tube structure flow cell device according to an embodiment of the present invention is applied to a third embodiment of an etching device.

[0084] Reference Figure 8 The phosphoric acid supply unit 211 is connected to the phosphoric acid supply line 212 , and the phosphoric acid supply line 212 is connected to the first valve 213 . The additive supply unit 215 is connected to the additive supply line 216 , and the additive supply line 216 is connected to the second valve 217 .

[0085] The phosphoric acid supply line 212 and the additive supply line 216 are connected to the circulation line 221, and the circulation line 221 is connected to the mixing tank 230. One side of the circulation line 221 is connected to the first pump 222, and the other side of the circulation line 221 is connected to the third valve 223 and the fourth valve 224. Inside the mixing tank 230, the phosphoric acid and the additive supplied from the phosphoric acid supply part 211 and the additive supply part 215 are mixed. As the phosphoric acid and the additive are mixed, a flow medium is formed. The circulation line 221 is provided with a first double-tube structure flow cell device 100.

[0086] The circulation line 221 is connected to the connection line 235, and the connection line 235 is provided with a fifth valve 236. The connection line 235 is provided with a medium supply tank 240, and the medium supply tank 240 and the phosphoric acid supply line 212 are connected to the phosphoric acid addition line 237. The phosphoric acid addition line 237 is provided with a sixth valve 238.

[0087] The medium supply tank 240 is connected to the supply line 251, and the supply line 251 is sequentially connected to the second double-tube structure flow cell device 100a, the second pump 252, the seventh valve 253, the heater 254 and the spray nozzle 255. In addition, a branch line 256 is branched between the second pump 252 and the seventh valve 253 in the supply line 251, and the branch line 256 is connected to the medium supply tank 240. The branch line 256 is provided with an eighth valve 257.

[0088] An outer tank 262 is disposed outside the wafer processing tank 260 , and the outer tank 262 and the medium supply tank 240 are connected to a recovery line 265 .

[0089] The operation of the third embodiment of the etching apparatus configured as described above will be described.

[0090] The first pump 222 is started, the first valve 213 is opened, phosphoric acid is supplied to the mixing tank 230, and the first valve 213 is closed after the phosphoric acid supply to the mixing tank 230 is completed. The second valve 217 is opened, the additive is supplied to the mixing tank 230, and the second valve 217 is closed after the additive supply to the mixing tank 230 is completed.

[0091] The third valve 223 and the fourth valve 224 are opened and the fifth valve 236 is closed, and the phosphoric acid and the additive in the mixing tank 230 flow along the circulation line 221 by the pumping pressure of the first pump 222. The phosphoric acid and the additive flow along the circulation line 221. The phosphoric acid and the additive in the circulation line 221 flow into the first double-tube structure flow cell device 100, and the first double-tube structure flow cell device 100 monitors the concentration of the phosphoric acid and the additive.

[0092] At this time, the flowing medium of the medium inflow section 113 flows into the first flow path section 112 and then the bubbles are removed, and the flowing medium of the first flow path section 112 flows into the second flow path section 122 after the bubbles are removed. In addition, the monitoring section 140 irradiates light to the second flow path section 122, thereby measuring the concentration of the flowing medium in the second flow path section 122 in a high temperature state.

[0093] When the control unit determines that the flowing medium is mixed to a predetermined concentration, the control unit drives the second pump 252 and opens the fifth valve 236. If the second pump 252 is driven, the flowing medium in the mixing tank 230 flows into the medium supply tank 240 along the connection line 235.

[0094] The seventh valve 253 is closed and the eighth valve 257 is opened, so that the flowing medium in the medium supply tank 240 flows along the second double-tube structure flow cell device 100a, the second pump 252, the eighth valve 257 and the branch line 256. At this time, the concentration of the flowing medium contained in the medium supply tank 240 and the concentration of etched silicon are measured in the second double-tube structure flow cell device 100a.

[0095] If the concentration of the flowing medium in the medium supply tank 240 is within a predetermined range, the control unit controls to close the eighth valve 257 and open the seventh valve 253. The flowing medium in the medium supply tank 240 flows along the supply line 251. After being heated by the heater 254, the flowing medium in the supply line 251 is sprayed toward the wafer processing tank 260 through the spray nozzle 255. In addition, when the concentration of the flowing medium in the medium supply tank 240 is adjusted, the sixth valve 238 is opened to replenish phosphoric acid to the medium supply tank 240.

[0096] The flowing medium overflowing from the wafer processing tank 260 is collected in the outer tank 262 , and the flowing medium in the outer tank 262 is recovered to the mixing tank 230 through the recovery line 265 .

[0097] Therefore, the first double tube structure flow cell device 100 can measure the mixed concentration of phosphoric acid and additives supplied to the mixing tank 230, and the second double tube structure flow cell device 100a can measure the concentration change of the flowing medium in the medium supply tank 240 and the concentration of the dissolution during the chip processing process.

[0098] Next, a fourth embodiment of an etching device using a double-tube structure flow cell device according to an embodiment of the present invention is described. In the fourth embodiment, compared with the third embodiment, except for the arrangement of the second double-tube structure flow cell device, the other is substantially the same as the third embodiment. Below, the characteristic part of the fourth embodiment is described.

[0099] Fig. 9 1 is a block diagram showing a state in which a double tube structure flow cell device according to a fourth embodiment of the present invention is applied to an etching device.

[0100] Reference Fig. 9 The medium supply tank 240 is connected to a second discharge line 242 , and the second discharge line 242 is provided with a second discharge valve 243 and a second double tube structure flow cell device 100 a .

[0101] The flowing medium in the outer tank 262 is recovered to the medium supply tank 240 through the recovery line 265, and the flowing medium in the medium supply tank 240 is discharged at fixed time intervals through the second discharge line 242. New flowing medium equivalent to the amount of flowing medium discharged from the medium supply tank 240 is supplied from the mixing tank 230 to the medium supply tank 240.

[0102] The flowing medium of the second discharge line 242 is discharged to the outside after passing through the second double-tube structure flow cell device 100a. In the second double-tube structure flow cell device 100a, the concentration of dissolved substances such as silicon in the flowing medium discharged through the second discharge line 242 is measured.

[0103] Therefore, the first double tube structure flow cell device 100 can measure the mixed concentration of phosphoric acid and additives supplied to the mixing tank 230, and the second double tube structure flow cell device 100a can measure the concentration of the eluate stored in the medium supply tank 240 during the wafer processing process.

[0104] The present invention has been described with reference to the embodiments shown in the drawings, but these embodiments are merely exemplary, and those skilled in the art in the art to which the present invention belongs should understand that various modifications and other equivalent embodiments may be obtained therefrom.

Claims

1. A double tube structure flow cell device, characterized in that: include: A first flow path forming portion includes an outer shell, wherein a first flow path portion is formed inside the outer shell for a flowing medium to flow, and the first flow path forming portion is connected to a medium inflow portion at one side of the outer shell for a flowing medium to flow in; as well as The second flow path forming part includes an inner shell arranged inside the outer shell, the second flow path forming part forms a second flow path part inside the inner shell in a manner communicating with the first flow path part, and the second flow path forming part is connected to the medium discharge part on one side of the inner shell so that the flowing medium of the second flow path part is discharged, Both sides of the inner case are opened, and the first flow path portion and the second flow path portion are communicated with each other at both side ends of the inner case.

2. The double tube structure flow cell device according to claim 1, characterized in that: The double-tube structure flow cell device further includes a bubble exhaust portion connected to the other side of the outer shell to exhaust bubbles mixed in the flow medium of the first flow path portion.

3. The double tube structure flow cell device according to claim 1, characterized in that: The first flow path forming portion further includes: The light-transmitting parts are respectively formed on both sides of the outer shell to allow light to pass through.

4. The double tube structure flow cell device according to claim 3, characterized in that: The second flow path forming portion further includes: A bubble separation portion is formed on an outer side surface of the inner shell.

5. The double tube structure flow cell device according to claim 4, characterized in that: The outer shell and the inner shell are configured in a double tube shape.

6. The double tube structure flow cell device according to claim 2, characterized in that: The bubble discharge portion is disposed on an upper side of the outer housing to discharge bubbles separated from the flowing medium.

7. The double tube structure flow cell device according to claim 6, characterized in that: The bubble discharge portions are respectively formed at both side ends of the outer shell.

8. The double tube structure flow cell device according to claim 4, characterized in that: The bubble separation parts are respectively formed at both side ends of the inner shell.

9. The double tube structure flow cell device according to claim 6, characterized in that: The bubble discharge unit comprises: a bubble exhaust line connected to the outer housing and the first pump; and The opening regulating valve is arranged on the bubble exhaust line.

10. The double tube structure flow cell device according to claim 1, characterized in that: The cross-sectional area of ​​the first flow path portion is formed to be larger than the cross-sectional area of ​​the medium inflow portion.

11. The double tube structure flow cell device according to claim 1, characterized in that: The double-tube structure flow cell device further includes a discharge portion connected to the first flow path forming portion.

12. The double tube structure flow cell device according to claim 11, characterized in that: The discharge unit comprises: a first discharge line connected to the first flow path forming portion and the medium discharge portion; a first switch valve, disposed on the first discharge line; a second discharge line branching from the first discharge line; and The second switch valve is arranged on the second discharge line.

13. The double tube structure flow cell device according to claim 1, characterized in that: Also includes: The monitoring unit irradiates light to the flowing medium flowing along the second flow path portion to measure a state of the flowing medium.

Images