A flexible circuit board structure and manufacturing method thereof, and a display device

Abstract

The present disclosure provides a flexible circuit board structure and a manufacturing method thereof, and a display device, wherein the flexible circuit board structure includes: a flexible circuit board; an electronic component connected to the flexible circuit board, wherein the four sides of the electronic component include a first side; a shielding cover for electromagnetically shielding the electronic component, wherein the shielding cover is arranged on the electronic component, and the shielding cover is an unclosed opening side at least on the first side of the electronic component; and a waterproof adhesive layer, wherein the waterproof adhesive layer is filled at least at the connection position between the electronic component and the flexible circuit board. The flexible circuit board structure and the manufacturing method thereof, and the display device provided by the embodiments of the present disclosure can improve the anti-interference and waterproof and moisture-proof capabilities.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a flexible circuit board structure and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display, foldable display products and flexible display products have thinner flexible circuit boards, and the anti-interference ability and waterproof and moisture-proof ability of the electronic components on the flexible circuit boards are relatively weak. In order to ensure the stability of the touch function of foldable and flexible display products, TIC (touch chip) needs to improve its anti-interference ability and ensure waterproof and moisture-proof ability. Summary of the invention

[0003] The embodiments of the present disclosure provide a flexible circuit board structure and a manufacturing method thereof, and a display device, which can improve anti-interference and waterproof and moisture-proof capabilities.

[0004] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0005] The present disclosure provides a flexible circuit board structure, including:

[0006] Flexible circuit boards;

[0007] An electronic component connected to the flexible circuit board, wherein the four sides of the electronic component include a first side;

[0008] A shielding cover for electromagnetically shielding the electronic component, the shielding cover is arranged on the electronic component, and the shielding cover is an unclosed opening side at least on a first side of the electronic component;

[0009] And, a waterproof adhesive layer, wherein the waterproof adhesive layer at least fills the connection position between the electronic component and the flexible circuit board.

[0010] Exemplarily, the shielding cover is a thin plate-shaped cover body with a thickness less than a threshold value, including a top plate shielding a side of the electronic component away from the flexible circuit board; and at least two side plates surrounding at least two sides of the four sides of the electronic component.

[0011] Exemplarily, the four sides of the electronic component further include a second side, a third side and a fourth side;

[0012] The at least two side panels include a first side panel, a second side panel and a third side panel which are arranged around the outer sides of the second side, the third side and the fourth side of the electronic component.

[0013] Exemplarily, the thickness of the shielding cover is 0.08-0.3 mm.

[0014] Exemplarily, at the opening side of the shielding cover, the orthographic projection of the electronic component on the flexible circuit board is at least partially not covered by the orthographic projection of the shielding cover on the flexible circuit board.

[0015] Exemplarily, at the opening side of the shielding cover, a distance between an edge of the shielding cover and a first side edge of the electronic component in a direction perpendicular to the first side edge is 0-0.5 mm.

[0016] Exemplarily, the gap between the inner wall of the shielding cover and the electronic component is 0.5-1.0 mm.

[0017] Exemplarily, the electronic component includes a touch control chip.

[0018] Exemplarily, the first side of the electronic component is a side facing the middle area of ​​the flexible printed circuit board.

[0019] Exemplarily, a first welding area and a second welding area are provided on the flexible circuit board, the electronic component is welded on the first welding area, and the shielding cover is welded on the second welding area.

[0020] Exemplarily, the shielding cover is further provided with an insulating layer on the inner side wall facing the electronic component.

[0021] The present disclosure also provides a display device, including:

[0022] A display panel; and a flexible circuit board connected to the display panel, wherein the flexible circuit board adopts the flexible circuit board structure provided in the embodiment of the present disclosure.

[0023] The present disclosure also provides a method for manufacturing a flexible circuit board, which is used to manufacture the flexible circuit board structure provided by the present disclosure. The method includes:

[0024] Connecting an electronic component on the flexible circuit board, wherein the four sides of the electronic component include a first side;

[0025] A shielding cover for electromagnetically shielding the electronic component is arranged on the flexible circuit board, the shielding cover is arranged on the electronic component, and the shielding cover is an unclosed opening side at least on a first side of the electronic component;

[0026] A waterproof adhesive layer is provided on the opening side of the shielding cover, and the waterproof adhesive layer at least fills the connection position between the electronic component and the flexible circuit board.

[0027] Exemplarily, in the method for manufacturing the flexible circuit board structure provided by the embodiment of the present disclosure, when surface mounting technology is used to mount components on the flexible circuit board, the electronic components are welded to the first welding area, and the shielding cover is welded to the second welding area.

[0028] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0029] The flexible circuit board structure and its manufacturing method, and the display device provided by the embodiments of the present disclosure are provided with a shielding cover on the outer cover of the electronic component on the flexible circuit board. The shielding cover can shield the electronic component to achieve the function of shielding external interference and improve the anti-interference ability of the electronic component. The shielding cover is not closed on the first side of the electronic component, but a waterproof glue layer is formed by dispensing glue on the first side to improve the waterproof and moisture-proof ability of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram showing a structure of a flexible circuit board provided by an embodiment of the present disclosure;

[0031] Figure 2 express Figure 1 Top view of the . DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0033] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0034] Before describing in detail the flexible circuit board structure and the manufacturing method thereof and the display device provided by the embodiments of the present disclosure, it is necessary to describe the related technologies as follows:

[0035] In the related art, for foldable display products and flexible display products, the thickness of the flexible circuit board is relatively thin, and the anti-interference ability and waterproof and moisture-proof ability of the electronic components on the flexible circuit board are relatively weak. In order to ensure the stability of the touch function of foldable and flexible display products, the TIC (touch chip) needs to improve its anti-interference ability and ensure waterproof and moisture-proof ability.

[0036] In the related art, the electronic components on the flexible circuit boards of flexible display products have relatively low anti-interference capabilities and are easily affected by interference, and their waterproof and moisture-proof capabilities cannot meet current flexible display requirements.

[0037] In order to solve the above problems, the embodiments of the present disclosure provide a flexible circuit board structure and a manufacturing method thereof, and a display device, which can improve the anti-interference and waterproof and moisture-proof capabilities.

[0038] like Figure 1 and Figure 2 As shown, an embodiment of the present disclosure provides a flexible circuit board structure, including: a flexible circuit board 100, an electronic component 200, a shielding cover 300 and a waterproof adhesive layer 400; the electronic component 200 is connected to the flexible circuit board 100, and the four sides of the electronic component 200 include a first side; the shielding cover 300 is used to electromagnetically shield the electronic component 200, the shielding cover 300 is arranged on the electronic component 200, and the shielding cover 300 is at least an unclosed opening side on the first side of the electronic component 200; the waterproof adhesive layer 400 at least fills the connection position between the electronic component 200 and the flexible circuit board 100.

[0039] The flexible circuit board 100 structure provided by the embodiment of the present disclosure has a shielding cover 300 on the outer cover of the electronic component 200 on the flexible circuit board 100. The shielding cover 300 can shield the electronic component 200 to shield external interference and improve the anti-interference ability of the electronic component 200. The shielding cover 300 is not closed on the first side of the electronic component 200, but a waterproof glue layer 400 is formed by dispensing glue on the first side to improve the waterproof and moisture-proof ability of the electronic component 200.

[0040] In the above solution, the shielding cover 300 is a metal cover design, which covers the electronic component 200 to achieve the ability of shielding external interference. For example, the shielding cover 300 can be made of SUS304 material.

[0041] In some embodiments, Figure 1 and Figure 2As shown, the shielding cover 300 is a thin plate-shaped cover with a thickness less than a threshold, including a top plate 310 shielding the side of the electronic component 200 away from the flexible circuit board 100; and at least two side plates 320 surrounding at least two sides of the four sides of the electronic component 200.

[0042] In the above scheme, the shielding cover 300 is a semi-shielding cover with a window design, including a top plate and other sides of the electronic component 200 except the first side. For example, the four sides of the electronic component 200 also include a second side, a third side and a fourth side; the at least two side panels include a first side panel, a second side panel and a third side panel arranged on the outside of the second side, the third side and the fourth side of the electronic component 200.

[0043] It should be noted that, in some embodiments, the shielding cover 300 shields the other three sides of the electronic component 200 except the first side. In other embodiments, the shielding cover 300 may also only shield one side or both sides of the electronic component 200. In this case, correspondingly, a waterproof adhesive layer 400 may also be provided on the other sides not shielded by the shielding cover 300.

[0044] In addition, in some exemplary embodiments, the thickness of the shielding cover 300 is 0.08-0.3 mm. This is to take into account the overall thickness of the flexible circuit board 100 in the flexible display product, and select a better thickness for the thickness of the shielding cover 300, which will not affect the overall thickness and effectively improve the anti-interference ability. Of course, it is understandable that in other embodiments, the specific thickness of the shielding cover 300 is not limited to this.

[0045] Furthermore, in some embodiments, Figure 1 and Figure 2 As shown, at the opening side of the shielding cover 300 , the orthographic projection of the electronic component 200 on the flexible circuit board 100 is at least partially not covered by the orthographic projection of the shielding cover 300 on the flexible circuit board 100 .

[0046] With the above scheme, since glue is dispensed on the open side of the shielding cover 300 to form a waterproof glue layer 400, in order to avoid the siphon phenomenon caused by the close distance between the waterproof glue layer 400 and the edge of the open side of the shielding cover 300, the edge of the open side of the shielding cover 300 is designed to retain a certain distance from the first side edge of the electronic component 200, so that the electronic component 200 is at least partially not covered by the shielding cover 300 on the first side.

[0047] Exemplarily, at the opening side of the shielding cover 300 , a distance d between an edge of the shielding cover 300 and a first side edge of the electronic component 200 in a direction perpendicular to the first side edge is 0 to 0.5 mm.

[0048] The above values ​​are for the preferred embodiment to avoid glue siphoning and effectively shield the electronic component 200. It should be noted that when d=0 in the above values, if the gap between the inner wall of the shielding cover 300 and the electronic component 200 is large enough, the siphoning can also be avoided.

[0049] Furthermore, in some embodiments, Figure 1 and Figure 2 As shown, the waterproof adhesive layer 400 is a strip-shaped adhesive layer extending along the first side of the electronic component 200 .

[0050] In some embodiments, in order to prevent the waterproof glue layer 400 from extending along the shielding cover 300 due to siphoning during dispensing, there should be a sufficient gap a between the inner wall of the shielding cover 300 and the electronic component 200. For example, the gap a is 0.5 to 1.0 mm. Of course, it can be understood that in actual applications, the specific value of the gap a may also vary according to parameters such as the fluidity of the waterproof glue layer 400 and the thickness of the electronic component 200, but is not limited thereto.

[0051] In addition, the material of the waterproof adhesive layer 400 can be thermosetting adhesive (UF adhesive) or the like.

[0052] In addition, in the structure of the flexible circuit board 100 in the embodiment of the present disclosure, the electronic component 200 includes a touch control chip (TIC), but it is certainly not limited to TIC, and may also be other electronic components 200 or IC chips.

[0053] In addition, considering the wiring on the flexible circuit board 100 in the actual process, the first side of the electronic component 200 is the side facing the middle area of ​​the flexible circuit board 100. That is, the glue is dispensed on the inner side of the electronic component 200 close to the middle area of ​​the flexible circuit board 100.

[0054] In addition, in some exemplary embodiments, Figure 1 and Figure 2 As shown, the flexible circuit board 100 is provided with a first welding area 101 and a second welding area 102 , the electronic component 200 is welded on the first welding area 101 , the shielding cover 300 is welded on the second welding area 102 , and the second welding area 102 is grounded.

[0055] Specifically, Figure 1 and Figure 2As shown, the flexible circuit board 100 may include a substrate 110 and a conductive layer 120 and a shielding layer 130 disposed on the substrate 110, wherein the shielding screen 130 is opened to expose a portion of the conductive layer 120 to form the first welding area 101 and the second welding area 102, and the second welding area 102 is designed to be grounded.

[0056] With the above scheme, the shielding cover 300 is welded by adding a second welding area on the flexible circuit board 100, that is, adding a welding copper exposed point to weld and connect the shielding cover 300. In this way, on the one hand, the electronic component 200 and the shielding cover 300 can be welded simultaneously when SMT (surface assembly technology) is used for assembly. On the other hand, the welding copper exposed point is designed and grounded to realize the anti-interference ability of the shielding cover 300. At the same time, the relative size accuracy of the electronic component 200 and the shielding cover 300 is guaranteed to meet the requirement of adding the shielding cover 300 with minimal impact on the whole machine.

[0057] Of course, it is understandable that the shielding cover may also be fixed on the flexible circuit board in other ways.

[0058] In addition, if Figure 1 and Figure 2 As shown, in some embodiments, the shielding cover is further provided with an insulating layer 500 on the inner side wall facing the electronic component to prevent the shielding cover from accidentally touching and connecting with the electronic component, thereby causing adverse effects on the electronic component. The insulating layer 500 may be an insulating sticker directly attached to the shielding cover.

[0059] In addition, the embodiment of the present disclosure further provides a display device, including: a display panel; and a flexible circuit board 100 connected to the display panel, wherein the flexible circuit board 100 adopts the structure of the flexible circuit board 100 provided in the embodiment of the present disclosure. The display device may include various display products such as mobile phones, tablet computers, and monitors.

[0060] In addition, the embodiment of the present disclosure further provides a method for manufacturing a flexible circuit board 100, which is used to manufacture the flexible circuit board 100 structure provided by the embodiment of the present disclosure, and the method includes:

[0061] An electronic component 200 is connected to the flexible circuit board 100, wherein the four sides of the electronic component 200 include a first side;

[0062] A shielding cover 300 for electromagnetically shielding the electronic component 200 is arranged on the flexible circuit board 100, the shielding cover 300 is arranged on the electronic component 200, and the shielding cover 300 is an unclosed opening side at least on a first side of the electronic component 200;

[0063] A waterproof adhesive layer 400 is disposed on the opening side of the shielding cover 300 , and the waterproof adhesive layer 400 at least fills the connection position between the electronic component 200 and the flexible circuit board 100 .

[0064] Illustratively, in the method, when surface mounting technology is used to mount components on the flexible circuit board 100 , the electronic component 200 is welded on the first welding area, and the shielding cover 300 is welded on the second welding area.

[0065] With the above scheme, the shielding cover 300 is welded by adding a second welding area on the flexible circuit board 100, that is, adding a welding copper exposed point to weld and connect the shielding cover 300. In this way, on the one hand, when using SMT (surface assembly technology) to make components, the electronic component 200 and the shielding cover 300 can be welded simultaneously to simplify the process; on the other hand, the welding copper exposed point is designed and grounded to realize the anti-interference ability of the shielding cover 300. At the same time, the relative size accuracy of the electronic component 200 and the shielding cover 300 is guaranteed to meet the requirement of adding the shielding cover 300 to minimize the impact on the whole machine.

[0066] There are a few points to note:

[0067] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0068] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0069] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0070] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A flexible circuit board structure, characterized in that: include: Flexible circuit boards; An electronic component connected to the flexible circuit board, wherein the four sides of the electronic component include a first side; A shielding cover for electromagnetically shielding the electronic component, the shielding cover is arranged on the electronic component, and the shielding cover is an unclosed opening side at least on a first side of the electronic component; and, a waterproof adhesive layer, the waterproof adhesive layer at least filling a connection position between the electronic component and the flexible circuit board; At the opening side of the shielding cover, the orthographic projection of the electronic component on the flexible circuit board is at least partially not covered by the orthographic projection of the shielding cover on the flexible circuit board; the electronic component includes a touch control chip.

2. The flexible circuit board structure according to claim 1, characterized in that: The shielding cover is a thin plate-shaped cover body with a thickness less than a threshold, including a top plate shielding a side of the electronic component away from the flexible circuit board; and at least two side plates surrounding at least two sides of the four sides of the electronic component.

3. The flexible circuit board structure according to claim 2, characterized in that: The four sides of the electronic component also include a second side, a third side and a fourth side; The at least two side panels include a first side panel, a second side panel and a third side panel which are arranged around the outer sides of the second side, the third side and the fourth side of the electronic component.

4. The flexible circuit board structure according to claim 2, characterized in that: The thickness of the shielding cover is 0.08-0.3 mm.

5. The flexible circuit board structure according to claim 1, characterized in that: At the opening side of the shielding cover, a distance between an edge of the shielding cover and a first side edge of the electronic component in a direction perpendicular to the first side edge is 0 to 0.5 mm.

6. The flexible circuit board structure according to claim 1, characterized in that: The gap between the inner wall of the shielding cover and the electronic component is 0.5-1.0 mm.

7. The flexible circuit board structure according to claim 1, characterized in that: The first side of the electronic component is a side facing the middle area of ​​the flexible circuit board.

8. The flexible circuit board structure according to claim 1, characterized in that: The flexible circuit board is provided with a first welding area and a second welding area, the electronic component is welded on the first welding area, and the shielding cover is welded on the second welding area.

9. The flexible circuit board structure according to claim 1, characterized in that: The shielding cover is also provided with an insulating layer on the inner side wall facing the electronic component.

10. A display device, characterized in that: include: Display panel; and a flexible circuit board connected to the display panel, wherein the flexible circuit board adopts the flexible circuit board structure as claimed in any one of claims 1 to 9.

11. A method for manufacturing a flexible circuit board, characterized in that: For manufacturing the flexible circuit board structure according to any one of claims 1 to 9, the method comprises: Connecting an electronic component on the flexible circuit board, wherein the four sides of the electronic component include a first side; A shielding cover for electromagnetically shielding the electronic component is arranged on the flexible circuit board, the shielding cover is arranged on the electronic component, and the shielding cover is an unclosed opening side at least on a first side of the electronic component; A waterproof adhesive layer is provided on the opening side of the shielding cover, and the waterproof adhesive layer at least fills the connection position between the electronic component and the flexible circuit board.

12. The method according to claim 11, characterized in that Used to manufacture the flexible circuit board structure as described in claim 8, in the method, when using surface mounting technology to mount components on the flexible circuit board, the electronic components are welded to the first welding area, and the shielding cover is simultaneously welded to the second welding area.

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