Stretchable laminate, stretchable device material, and stretchable device

Abstract

One aspect of the present invention relates to a stretchable laminate fixed to a fabric, comprising: a stretchable circuit substrate having a stretchable insulating layer with an elongation of 10% or more; a fabric substrate; and an adhesive layer for bonding the stretchable circuit substrate and the fabric substrate.

Description

Technical Field

[0001] The present invention relates to a stretchable laminate, a stretchable device material, and a stretchable device. Background Art

[0002] With the development of the electronics field, the demand for miniaturization, thinning, lightness and high density of electronic devices has further increased. In addition, depending on the application, there is sometimes a demand for flexible devices that can be placed on curved surfaces or concave and convex surfaces, or can be freely deformed or bent. Examples of such flexible devices include wearable devices that can be worn by humans, animals such as dogs, and plants.

[0003] As for the technology used in wearable devices, for example, as a biological electrode that can be attached to clothing, there can be cited, for example, the biological electrode described in Patent Document 1. In addition, as a stretchable electrode and wiring sheet for integrating electrical wiring into clothing, there can be cited, for example, the stretchable electrode and wiring sheet described in Patent Document 2. In addition, as a laminated sheet used in clothing with electrodes, there can be cited, for example, the laminated sheet described in Patent Document 2.

[0004] Patent document 1 describes a kind of clothing having a biological electrode, and the biological electrode is fixed in a manner that the electrode portion contacts the biological body, the biological electrode comprising: a mounting member formed of an electrically insulating member fixed to the surface of the clothing that contacts the biological body; the electrode portion formed of a conductive member fixed to the surface of the mounting member that contacts the biological body; a connector fixed to the mounting member for connecting to a biological electrical signal measuring device; a wiring fixed to the mounting member that electrically connects the connector to the electrode portion; and a first insulating member with electrical insulation on the surface of the wiring that covers the portion that contacts the biological body.

[0005] Patent Document 1 discloses that when the attachment member is attached to clothing, even when the clothing is wet with sweat or the like, short circuits between wiring and the living body or between a plurality of electrode portions can be prevented, thereby obtaining desired living body electrical signals.

[0006] Patent document 2 describes a stretchable electrode and wiring sheet, which is a sheet-shaped electrode and wiring that can be stacked on a substrate, the electrode is formed by a first insulating layer and a stretchable conductor layer arranged on the first insulating layer, and the wiring has a three-layer structure consisting of the first insulating layer, the stretchable conductor layer and the second insulating layer, the resistance of the stretchable conductor layer is less than 300Ω / cm, and the load of the electrode and the wiring when stretched at an elongation of 10% is less than 100N.

[0007] Patent Document 2 discloses that high conductivity can be maintained even when stretched, that is, high conductivity can be maintained both when not stretched and when stretched.

[0008] Patent Document 3 describes a laminated sheet including a release sheet, a stretchable conductive layer laminated on the release sheet, and a hot-melt layer laminated on the stretchable conductive layer.

[0009] Patent Document 3 discloses that clothing having a stretchable conductive layer can be manufactured by laminating laminated sheets so that the heat-fusible layer faces the fabric.

[0010] As described above, wearable devices are sometimes used in a state of being integrated with fabrics such as clothing. In this case, the circuit board included in the wearable device is required to be not only flexible but also easy to integrate with fabrics such as clothing.

[0011] Prior art literature

[0012] Patent Literature

[0013] Patent Document 1: International Patent Publication No. 2016 / 093194

[0014] Patent Document 2: International Patent Publication No. 2016 / 114298

[0015] Patent Document 3: Japanese Patent Publication No. 2018-135629 Summary of the invention

[0016] The present invention is made in view of the above situation, and its purpose is to provide a stretchable laminate that can well fix a stretchable circuit substrate to a fabric, a material for a stretchable device that can well fix a stretchable circuit substrate to a fabric, and a stretchable device that can well fix a stretchable circuit substrate to a fabric.

[0017] One aspect of the present invention relates to a stretchable laminate fixed to a fabric, comprising: a stretchable circuit substrate having a stretchable insulating layer with an elongation of 10% or more; a fabric substrate; and an adhesive layer for bonding the stretchable circuit substrate and the fabric substrate.

[0018] Another aspect of the present invention relates to a material for a stretchable device, comprising: a stretchable circuit substrate fixed to a fabric; and a release sheet, wherein the stretchable circuit substrate comprises a stretchable insulating layer having an elongation of 10% or more, and the stretchable circuit substrate and the release sheet are laminated via an adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1This is a cross-sectional view showing an example of the stretchable device material according to the embodiment of the present invention.

[0020] Figure 2 This is a cross-sectional view showing another example of the stretchable device material according to the embodiment of the present invention.

[0021] Figure 3 This is a cross-sectional view showing an example of a stretchable laminate according to an embodiment of the present invention.

[0022] Figure 4 It is a cross-sectional view showing another example of the stretchable laminate according to the embodiment of the present invention.

[0023] Figure 5 It is a plan view showing another example of the stretchable laminate according to the embodiment of the present invention.

[0024] Figure 6 For the general Figure 5 The stretchable laminate shown is a cross-sectional view taken along the cutting line VI-VI.

[0025] Figure 7 It is a cross-sectional view showing another example of the stretchable laminate according to the embodiment of the present invention.

[0026] Figure 8 It is a plan view showing another example of the stretchable laminate according to the embodiment of the present invention.

[0027] Fig. 9 It is a cross-sectional view showing an example of a stretchable device according to an embodiment of the present invention.

[0028] Fig.10 It is a cross-sectional view showing another example of the stretchable device according to the embodiment of the present invention.

[0029] Fig.11 It is a cross-sectional view showing another example of the stretchable device according to the embodiment of the present invention.

[0030] Fig.12 This is a schematic diagram showing an example of clothing to which the stretchable laminate according to the embodiment of the present invention is fixed.

[0031] Fig.13 This is a schematic diagram showing an example of a clothing hanger for hanging and fixing clothing to which the stretchable laminate according to the embodiment of the present invention is attached. DETAILED DESCRIPTION

[0032] The present inventors have focused on the fact that conventional circuit boards have not been studied in terms of being easy to integrate with fabrics such as clothing. For example, the techniques disclosed in Patent Documents 1 to 3 have not been studied in terms of being easy to integrate with fabrics such as clothing.

[0033] The present inventors have conducted various studies and found that the above-mentioned object can be achieved by the following present invention, namely: providing a stretchable laminate capable of well fixing a stretchable circuit substrate to a fabric, a material for a stretchable device capable of well fixing a stretchable circuit substrate to a fabric, and a stretchable device capable of well fixing a stretchable circuit substrate to a fabric.

[0034] Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.

[0035] like Figure 1 and Figure 2 As shown, a stretchable device material 11 according to one embodiment of the present invention includes a stretchable circuit substrate 12 having a stretchable insulating layer 13, an adhesive layer 15 disposed on one surface of the stretchable circuit substrate 12, and a release sheet 16 disposed on the adhesive layer 15. Figure 1 It is a cross-sectional view showing an example of the stretchable device material 11 according to the present embodiment. Figure 2 It is a cross-sectional view showing another example of the stretchable device material 11 according to the present embodiment.

[0036] The material for a stretchable device can be preferably used to well fix a stretchable circuit substrate to a fabric. Specifically, the stretchable circuit substrate can be fixed to the fabric via the adhesive layer simply by peeling off the release sheet from the material for a stretchable device and laminating the fabric in a manner that the adhesive layer is in contact with the fabric. In addition, in the material for a stretchable device, the stretchable circuit substrate is provided on the release sheet via the adhesive layer. Thus, the position of the stretchable circuit substrate is fixed by the release sheet, so that electronic components can be easily mounted using solder or the like.

[0037] like Figure 1 and Figure 2 As shown in FIG. 1 , the stretchable device material 11 is preferably provided with an electronic component 17. In this way, the function of the electronic component can be imparted to the stretchable circuit substrate fixed to the fabric. When the electronic component 17 is mounted on the stretchable circuit substrate 12, the mounting surface of the electronic component 17 can be as follows: Figure 1 As shown in the figure, it is the surface on the opposite side to the surface in contact with the above-mentioned adhesive layer 15, and it can also be as shown in the figure. Figure 2 As shown in FIG. 1 , the surface in contact with the adhesive layer 15 is the surface. That is, the stretchable device material 11 may be as follows: Figure 1 As shown in FIG. 1 , the elastic device material 11 further includes an electronic component 17 mounted on a surface of the elastic circuit substrate 12 opposite to the surface in contact with the adhesive layer 15. Figure 2As shown in the figure, an electronic component 17 is further provided, and the electronic component 17 is mounted on the surface of the stretchable circuit substrate 12 that contacts the adhesive layer 15. In the case where the mounting surface of the electronic component 17 is the surface that contacts the adhesive layer 15, when the stretchable laminate is fixed to the fabric, the electronic component is sandwiched between the stretchable circuit substrate and the fabric and embedded in the adhesive layer, so that the electronic component is protected.

[0038] The stretchable circuit substrate 12 includes, for example, components that are included in conventional circuit substrates in addition to the stretchable insulating layer 13. Figure 1 and Figure 2 As shown in FIG. 1 , the stretchable circuit substrate 12 is preferably a circuit substrate having the stretchable insulating layer 13 and the stretchable wiring 14 provided on the stretchable insulating layer 13. By providing the stretchable wiring, an electronic circuit or an electrode for a sensor can be formed. In addition, by providing the stretchable wiring as the wiring provided by the circuit substrate, the stretchability of the stretchable circuit substrate can be maintained. In addition, the electronic component 17 is preferably as shown in FIG. Figure 1 and Figure 2 As shown, the electronic component is electrically connected to the elastic wiring 14. This allows the electronic component to better function.

[0039] The adhesive layer 15 is a layer capable of bonding the stretchable circuit substrate 12 to the fabric, and examples thereof include a layer containing hot melt adhesives such as vinyl acetate copolymer hot melt adhesives, polyolefin hot melt adhesives, polyamide hot melt adhesives, various synthetic rubber hot melt adhesives, acrylic hot melt adhesives, and polyurethane hot melt adhesives. Among them, the adhesive layer is preferably formed of a hot melt adhesive. If the adhesive contained in the adhesive layer is a hot melt adhesive, bonding can be performed by simply heating. For example, the stretchable circuit substrate can be bonded to the fabric easily using an iron or the like. In addition, the adhesive contained in the adhesive layer can use the above-mentioned exemplified adhesives alone, or two or more can be used in combination.

[0040] The release sheet 16 is a sheet that can be peeled off from the adhesive layer 15, and examples thereof include polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, polyphenylene sulfide (PPS) film, polyimide film, polytetrafluoroethylene film, silicone rubber film, polyimide amide film, etc. In addition, the release sheet may be a sheet obtained by subjecting these films to a peeling treatment.

[0041] The stretchable laminate according to one embodiment of the present invention is a stretchable laminate fixed to a fabric. Figures 3 to 8As shown in the figure, the stretchable laminate 21 includes a stretchable circuit substrate 12 including a stretchable insulating layer 13, a fabric substrate 31, and an adhesive layer 15 for bonding the stretchable circuit substrate 12 and the fabric substrate 31. In the stretchable laminate 21, the components other than the fabric substrate such as the stretchable circuit substrate 12 and the adhesive layer 15 may be the same as those in the stretchable device material 11. It should be noted that Figure 3 This is a cross-sectional view showing an example of a stretchable laminate according to an embodiment of the present invention. Figure 4 It is a cross-sectional view showing another example of the stretchable laminate according to the embodiment of the present invention. Figure 5 It is a plan view showing another example of the stretchable laminate according to the embodiment of the present invention. Figure 6 For the general Figure 5 The stretchable laminate shown is a cross-sectional view taken along the cutting line VI-VI. Figure 7 It is a cross-sectional view showing another example of the stretchable laminate according to the embodiment of the present invention. Figure 8 It is a plan view showing another example of the stretchable laminate according to the embodiment of the present invention.

[0042] The above-mentioned stretchable laminate is provided with the above-mentioned fabric substrate, which replaces the release film in the above-mentioned stretchable device material. When the above-mentioned stretchable device material is used, as described above, the above-mentioned release sheet is peeled off from the above-mentioned stretchable device material, and the above-mentioned adhesive layer is bonded to the above-mentioned fabric in a manner that the above-mentioned adhesive layer is in contact with the above-mentioned fabric, thereby fixing the above-mentioned stretchable circuit substrate to the above-mentioned fabric via the above-mentioned adhesive layer. In contrast, the above-mentioned stretchable laminate is not peeled off from the above-mentioned fabric substrate, but the above-mentioned fabric substrate is fixed to the above-mentioned fabric, thereby the above-mentioned stretchable circuit substrate can be well fixed to the fabric. For example, in the case where the above-mentioned fabric substrate is sewn to the above-mentioned fabric and the above-mentioned stretchable laminate is fixed to the above-mentioned fabric, the above-mentioned fabric substrate is easily sewn to the above-mentioned fabric. In addition, when the above-mentioned fabric substrate is bonded to the above-mentioned fabric with an adhesive or the like, thereby fixing the above-mentioned stretchable laminate to the above-mentioned fabric, the above-mentioned fabric substrate and the above-mentioned fabric are easy to bond because they are of the same kind. In addition, the stretchable laminate has a simple structure in which the stretchable circuit substrate is bonded to the fabric substrate via the adhesive layer, so the cost is low. Furthermore, the fabric substrate is soft, so even if the fabric substrate is bonded to the stretchable circuit substrate via the adhesive layer, the softness of the stretchable circuit substrate is not impaired.

[0043] As the above-mentioned cloth substrate 31, for example, cloth containing polyester fiber, rayon, cotton, silk, glass fiber, hemp, palm fiber, corduroy, wool, metal fiber, slag cotton, lyocell fiber, cuprammonium fiber, casein fiber, arginine fiber, chitin fiber, rubber fiber, acetate fiber, cellulose fiber, Promix fiber, polyamide fiber, polyvinylidene chloride fiber, acrylic fiber, polyethylene fiber, polypropylene fiber, and polyetherester fiber can be listed. The above-mentioned cloth substrate can use the fibers illustrated alone, or it can use two or more fibers in combination. That is, the above-mentioned cloth substrate can be a cloth formed by one fiber, or it can be a cloth formed by two or more fibers, or it can be a cloth containing substances other than fibers in these cloths. In addition, the above-mentioned cloth substrate can be a cloth containing the above-mentioned fibers, and for example, woven fabrics, knitted fabrics, and nonwoven fabrics can be listed. The above-mentioned cloth substrate can be the same cloth as the above-mentioned cloth, or it can be a different cloth. By using the above-mentioned fabric substrate, the above-mentioned stretchable circuit substrate is reinforced by the above-mentioned fabric substrate via the above-mentioned adhesive layer. In addition, for example, when the above-mentioned stretchable circuit substrate is fixed to the fabric constituting clothing, etc. by sewing with thread instead of using the above-mentioned fabric substrate, the above-mentioned stretchable circuit substrate can be prevented from being broken from the sewn part. It should be noted that the above-mentioned fabric substrate has the same elongation and tensile modulus as the above-mentioned stretchable insulating layer and the above-mentioned stretchable wiring, so when the stretchable laminate of this embodiment is fixed to the fabric for clothing, etc., it is excellent in the followability of following the shape change of clothing, etc., and therefore it is preferred.

[0044] The fabric substrate may be replaced with a foamed resin sheet. That is, the stretchable laminate may be a stretchable laminate fixed to a fabric, and includes a stretchable circuit substrate 12 including a stretchable insulating layer 13 having an elongation of 10% or more, a foamed resin sheet 31, and an adhesive layer 15 for bonding the stretchable circuit substrate 12 and the foamed resin sheet 31. In the stretchable laminate, the stretchable circuit substrate is well fixed to the fabric by fixing the foamed resin sheet to the fabric without peeling off the foamed resin sheet, as in the case of the fabric substrate.

[0045] Examples of the foamed resin sheet include sheets made of a foamed material such as foamed urethane foam and foamed polyethylene foam.

[0046] The surface of the fabric substrate or the foamed resin sheet preferably has greater surface roughness than the stretchable insulating layer. This has the following advantages: when the stretchable circuit substrate is bonded to the fabric via the adhesive layer, the bonding strength between the fabric substrate or the foamed resin sheet and the adhesive layer can be greater than the bonding strength between the stretchable insulating layer and the adhesive layer; and the adhesive layer laid between the stretchable circuit substrate and the fabric substrate and the adhesive layer laid between the fabric substrate and the fabric have different compositions from each adhesive layer.

[0047] The surface roughness of the stretchable insulating layer, the fabric substrate, and the foamed resin sheet in this embodiment can be represented by the surface roughness Rz. In this embodiment, the surface roughness Rz represents a value measured based on JIS B 0031 (2003). Specifically, it can be measured using a surface roughness measuring device, such as a surface roughness meter SJ-310 (manufactured by Mitutoyo Co., Ltd.).

[0048] The surface roughness Rz of the stretchable insulating layer is preferably 0.5 μm or less, more preferably 0.1 μm or less. The lower limit is not particularly specified, but from the viewpoint of productivity, the surface roughness Rz of the stretchable insulating layer is preferably about 0.01 μm or more.

[0049] The surface roughness Rz of the fabric substrate or the foamed resin sheet is preferably greater than 0.5 μm, more preferably not less than 1.0 μm. The upper limit is not particularly limited, but 100 μm is sufficient.

[0050] The rigidity of the fabric substrate or the foamed resin sheet is preferably higher than that of the stretchable insulating layer. This has the advantage that the fabric substrate or the foamed resin sheet can also function as a reinforcing material for the stretchable circuit board.

[0051] In addition, the stretchable device material 11 and the stretchable laminate 21 may be Figure 3 and Figure 6 As shown in the figure, the electronic component 17 is further provided, and the electronic component 17 is mounted on the surface of the stretchable circuit substrate 12 opposite to the surface in contact with the adhesive layer 15, and may be as shown in the figure. Figure 4 and Figure 7As shown in the figure, the electronic component 17 is further provided, and the electronic component 17 is mounted on the surface of the stretchable circuit substrate 12 that contacts the adhesive layer 15. Thus, the function of the electronic component can be imparted to the stretchable device material and the stretchable laminate. In the case where the mounting surface of the electronic component 17 is the surface that contacts the adhesive layer 15, when the stretchable device material and the stretchable laminate are fixed to the fabric, the electronic component is sandwiched between the stretchable circuit substrate and the fabric, and is embedded in the adhesive layer, so that the electronic component is protected.

[0052] like Figures 5 to 8 As shown in FIG. 1 , the fabric substrate 31 preferably has an exposed portion 31a (31b) which is exposed when the stretchable circuit board 12 and the fabric substrate 31 are stacked with the adhesive layer 15 interposed therebetween and when viewed from the stretchable circuit board 12 side. In addition, as the exposed portion, first, a protruding portion 31a is preferably provided. Figures 5 to 7 As shown in the figure, in a state where the stretchable circuit substrate 12 and the fabric substrate 31 are stacked via the adhesive layer 15, the stretchable circuit substrate 12 is protruded from the fabric substrate 31. The exposed portion 31a (31b) can be fixed to the fabric. In the case where the fabric substrate has the exposed portion, for example, the exposed portion of the fabric substrate provided by the stretchable laminate can be fixed to the fabric in such a manner that the surface of the stretchable laminate having the stretchable circuit substrate faces the fabric. In addition, for example, the protruding portion can be provided on the entire periphery of the fabric substrate by using the fabric substrate that is larger in the surface direction of the stretchable circuit substrate. In this case, by fixing the protruding portion provided on the entire periphery of the fabric substrate to the fabric, the stretchable circuit substrate can be covered, and the stretchable circuit substrate as the stretchable circuit substrate can be protected.

[0053] As the above-mentioned exposed portion, it is also possible to have an exposed portion (missing portion) 31b instead of the above-mentioned protruding portion. The exposed portion (missing portion) 31b is as follows: Figure 8 The portion formed by cutting out a part of the stretchable circuit board 12 as shown is formed by, for example, cutting, etc. This exposed portion can also fix the exposed portion of the fabric base material and the fabric.

[0054] The stretchable insulating layer and the stretchable wiring in this embodiment are stretchable. Here, "stretchable" means elastic deformation, and more specifically, it means having an elongation of 10% or more and a tensile modulus of 0.5 to 500 MPa at room temperature of 25°C. Therefore, the stretchable circuit substrate, the stretchable laminate, and the stretchable device in this embodiment are stretchable.

[0055] The elongation is preferably 25% or more, more preferably 50% or more, and further preferably 100% or more. In addition, the higher the elongation, the better. However, when the elongation exceeds the necessary level, the thermoplastic resin tends to undergo plastic deformation and damage the original shape. From this point of view, it is preferably 500% or less. In addition, the tensile modulus at room temperature of 25°C is 0.5 to 500 MPa, preferably 1 to 300 MPa, more preferably 2 to 200 MPa, and further preferably 5 to 100 MPa. If the elongation and the tensile modulus are within this range, it is easy to deform into any shape. For example, when the stretchable circuit substrate having the stretchable insulating layer is attached to a fabric constituting clothing, etc., the following property of the deformation of clothing is excellent. It should be noted that the tensile modulus refers to the storage modulus at 25°C measured by temperature dependence measurement by tensile test using a dynamic viscoelasticity measuring device. As the dynamic viscoelasticity measuring apparatus, for example, DMS6100 manufactured by Seiko Instruments Inc. etc. can be mentioned.

[0056] The storage modulus of the stretchable insulating layer in the temperature range of 100°C to less than 400°C is preferably 500 kPa or more. If the storage modulus in this temperature range is too low, when the electronic component is mounted on the stretchable insulating layer, or when the stretchable laminate is attached to a cloth or the like, it is difficult to maintain the flatness of the stretchable insulating layer, and thus it is difficult to fix the stretchable circuit substrate to the cloth or the like. The higher the elastic modulus of the stretchable insulating layer, the more preferred it is, but in fact, the upper limit of the storage modulus of the stretchable insulating layer in the temperature range of 100°C to less than 400°C is about 3 MPa. Therefore, the storage modulus is more preferably 500 kPa to 3 MPa. If the stretchable insulating layer has such a storage modulus, when the stretchable circuit substrate is attached to a cloth constituting clothing or the like, it has excellent followability to the deformation of clothing or the like, is soft, has excellent skin touch, and is easy to handle. Since the above-mentioned stretchable circuit substrate has a stretchable insulating layer having the above-mentioned storage modulus, electronic components can be easily mounted with solder, and can also be mounted by reflow. It should be noted that the storage modulus in the present embodiment refers to the storage modulus in a temperature range of 100°C or more and less than 400°C measured by a temperature dependence measurement by a tensile test using a dynamic viscoelasticity measuring device. As the above-mentioned dynamic viscoelasticity measuring device, for example, DMS6100 manufactured by Seiko Instruments Inc. can be cited. It should be noted that according to the research of the present inventors, when a stretchable insulating layer having a storage modulus of 500 kPa or more and 3 MPa or less in a temperature range of 100°C or more and less than 400°C is used, the above-mentioned stretchable circuit substrate is also flat when the above-mentioned stretchable laminate is attached to a cloth, etc., and it is easy to fix the above-mentioned stretchable circuit substrate to the above-mentioned cloth. In addition, the above-mentioned electronic components can be easily mounted on the above-mentioned stretchable circuit substrate with solder.

[0057] The thermal decomposition temperature of the stretchable insulating layer is preferably above 270°C. If the thermal decomposition temperature is too low, there is a tendency that discoloration, deformation, dimensional change, and production line contamination may occur during the installation process of the electronic components in the manufacturing of the equipment such as the stretchable circuit substrate. The higher the thermal decomposition temperature, the better, but the upper limit of the thermal decomposition temperature of the stretchable insulating layer is about 400°C. Therefore, the thermal decomposition temperature is more preferably above 270°C and below 400°C. The stretchable insulating layer having this thermal decomposition temperature has heat resistance that allows electronic components to be installed with solder. It should be noted that the thermal decomposition temperature here can be measured, for example, using TG / DTA6300 manufactured by Seiko Instruments Inc. It should be noted that according to the research of the present inventors, when the stretchable insulating layer having a thermal decomposition temperature of 270°C or more and 400°C or less is used, when the electronic components and the like are mounted on the stretchable circuit substrate by solder, the deformation of the stretchable circuit substrate is sufficiently suppressed, and the electronic components and the like can be easily mounted on the stretchable circuit substrate by solder. In contrast, when the stretchable insulating layer having a thermal decomposition temperature of less than 270°C is used, as described above, when the electronic components are mounted on the stretchable circuit substrate, the stretchable circuit substrate may be deformed, and it may be difficult to mount the electronic components and the like on the stretchable circuit substrate by solder. In addition, it may be difficult to fix the stretchable circuit substrate to the fabric.

[0058] The stretchable insulating layer preferably contains a thermosetting resin. As the thermosetting resin, for example, from the viewpoint of heat resistance and curability, it is more preferable to contain a resin having a hydroxyl group in the molecule or a resin having an epoxy group in the molecule. The stretchable laminate containing the resin has excellent heat resistance, and the stretchable circuit substrate provided by the stretchable laminate has excellent dimensional stability. The stretchable circuit substrate has heat resistance such that electronic components can be mounted using solder, for example.

[0059] As the stretchable wiring, there can be cited wiring formed of a conductive stretchable material as described below. In addition, as the stretchable wiring, there can be cited wavy wiring, meandering wiring, etc. In addition, the stretchable wiring can be wiring formed of a conductive stretchable material and in the above-mentioned shape.

[0060] As the above-mentioned stretchable wiring, in addition to wiring formed of a conductive stretchable material and wiring in the above-mentioned shape, wiring in which at least a portion of the above-mentioned stretchable wiring is formed of copper foil can also be used. If the wiring formed of the copper foil is used, a pad used for mounting electronic components etc. via solder can be appropriately formed, and existing equipment can be used, thereby reducing the manufacturing cost.

[0061] [Stretchable insulation layer]

[0062] The resin composition used in the stretchable insulating layer is not particularly limited in composition as long as the cured product thereof has the properties such as the elongation and the tensile modulus.

[0063] The resin composition preferably comprises a thermosetting resin and a curing agent thereof. As a more specific example of the resin composition, a resin composition comprising a polyrotaxane (A), a thermosetting resin (B) and a curing agent (C) can be cited. Each component is described in more detail below.

[0064] Specific examples of the polyrotaxane (A) include polyrotaxanes described in Japanese Patent Publication No. 4482633 or International Publication No. WO2015 / 052853. Commercially available products can be used as the polyrotaxane (A), and specifically, SeRM SuperPolymer A1000 manufactured by Advanced Softmaterials Inc. can be used.

[0065] Examples of the thermosetting resin (B) include, without particular limitation, thermosetting resins such as epoxy resins, phenol resins, polyimide resins, urea resins, melamine resins, unsaturated polyesters, and urethane resins. Among them, epoxy resins are preferably used.

[0066] Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, aralkyl epoxy resin, phenol novolac epoxy resin, alkylphenol novolac epoxy resin, biphenol epoxy resin, naphthalene epoxy resin, dicyclopentadiene epoxy resin, epoxides of condensates of phenols and aromatic aldehydes having a phenolic hydroxyl group, triglycidyl isocyanurate, alicyclic epoxy resins, etc. These may be used alone or in combination of two or more, depending on the circumstances.

[0067] As the epoxy resin, preferably, for example, an epoxy resin having two or more epoxy groups in one molecule and a molecular weight of 500 or more can be exemplified. As such epoxy resin, commercially available products can be used, for example, JER1003 (manufactured by Mitsubishi Chemical Corporation, molecular weight 1300, difunctional), EXA-4816 (manufactured by DIC Corporation, molecular weight 824, difunctional), YP50 (manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., molecular weight 60000 to 80000, difunctional) and the like can be cited.

[0068] As epoxy resins other than the above-mentioned epoxy resins, for example, there can be mentioned epoxy resins having a modified group modified by an alkylene oxide having 2 to 3 carbon atoms, and containing 4 mol or more of the modified group in 1 mol of epoxy molecules, and having 2 mol or more of epoxy groups, and having an epoxy equivalent of 450 eq / mol or more. By including the epoxy resin as the above-mentioned thermosetting resin (B) and the above-mentioned curing agent (C), it is also possible to obtain a resin composition whose cured product has the above-mentioned elongation and the above-mentioned tensile modulus. As such epoxy resins, specifically, propylene oxide addition type bisphenol A type epoxy resin (manufactured by ADEKA Corporation, EP4003S), ethylene oxide addition type hydroxyphenylfluorene type epoxy resin (manufactured by Osaka Gas Chemicals Co., Ltd., EG-280), etc. can be mentioned. In addition, the above-mentioned epoxy resins can be used alone or in combination of two or more.

[0069] A resin composition comprising any one of the polyrotaxane (A) and the thermosetting resin (B) and the curing agent (C) may be used. However, from the viewpoint of easily obtaining a resin composition whose cured product has the above-mentioned elongation and tensile modulus, a resin composition comprising both components ((A) and (B)) and the curing agent (C) is preferably used.

[0070] As the above-mentioned curing agent (C), as long as it works as the curing agent of the above-mentioned thermosetting resin (B), there is no particular limitation. In particular, as the curing agent that can be preferably used as epoxy resin, the curing agent of phenolic resin, amine compound, acid anhydride, imidazole compound, thioether resin, bisamide, sulfonium salt etc. can be listed as an example. The above-mentioned curing agent (C) can be used alone, or two or more can be used in combination. In addition, the above-mentioned resin combination can contain a curing accelerator as needed. As the above-mentioned curing accelerator, for example, imidazole compound etc. can be listed.

[0071] In the above resin composition, a crosslinking agent may be further added to the resin composition containing the polyrotaxane (A). Such a crosslinking agent may be used without particular limitation as long as it can form a crosslinking structure with at least a part of the cyclic molecules of the above polyrotaxane (at least one reactive group possessed by the cyclic molecules of the polyrotaxane). Specific examples thereof include isocyanate resins and cyanuric chloride.

[0072] The proportion of each component in the above-mentioned resin composition is not particularly limited as long as the effect of the present invention can be exerted. For example, in the case of all components including (A), (B) and (C), when the total of the above-mentioned (A) to (C) components is set to 100 parts by mass, the above-mentioned polyrotaxane (A) is 10 to 80 parts by mass, more preferably about 30 to 50 parts by mass; the above-mentioned thermosetting resin (B) is 10 to 89.9 parts by mass, more preferably 30 to 50 parts by mass; the above-mentioned curing agent (C) is 0.1 to 30 parts by mass, more preferably about 0.1 to 20 parts by mass. It should be noted that when the resin composition of this embodiment contains an isocyanate resin as a cross-linking agent, the isocyanate resin can be added to the above-mentioned polyrotaxane (A) component by 0 to 50 parts by mass, and more preferably by 10 to 40 parts by mass. When the component (B) and the component (C) are included but the component (A) is not included, when the total amount of the above-mentioned resin composition is set to 100 parts by mass, the above-mentioned thermosetting resin (B) is 50 to 99 parts by mass, and more preferably about 60 to 80 parts by mass; the above-mentioned curing agent (C) is 1 to 50 parts by mass, and more preferably about 1 to 40 parts by mass.

[0073] Furthermore, the resin composition may contain other additives such as a curing catalyst (curing accelerator), a flame retardant, a flame retardant auxiliary, a leveling agent, a colorant, etc. as necessary within a range not impairing the effects of the present invention.

[0074] For the preparation method of the resin combination comprising the above-mentioned epoxy resin, it is not particularly limited, for example, epoxy resin, curing agent and solvent are mixed in a uniform manner. The solvent used is not particularly limited, and for example toluene, xylene, methyl ethyl ketone, acetone, etc. can be used. These solvents can be used alone, or two or more can be used in combination. In addition, organic solvents and various additives for adjusting viscosity can also be mixed as required.

[0075] By heating and drying the resin composition obtained as described above, the resin composition can be cured while evaporating the solvent, thereby obtaining the insulating layer of the present embodiment.

[0076] The method, apparatus, and conditions for heating and drying the resin composition may be the same as in the past or their improved methods. The specific heating temperature and time may be appropriately set according to the crosslinking agent, solvent, etc. used. For example, the resin composition may be cured by heating and drying at 50 to 200° C. for about 60 to 180 minutes.

[0077] The insulating layer thus obtained (a molded body as a cured product of the resin composition, etc.) may be subjected to surface treatment to stably form wiring (conductive layer) on one surface thereof. In addition, various additives such as antioxidants, weathering stabilizers, flame retardants, antistatic agents, etc. may be added within a range that does not impair its characteristics.

[0078] [Flexible wiring]

[0079] The conductive stretchable material constituting the stretchable wiring may include a conductive composition containing a conductive filler and a stretchable adhesive. Specifically, the conductive composition may include a resin composition containing a resin (D) that becomes a stretchable adhesive, a curing agent (E) that reacts with the resin (D), and a conductive filler (F), wherein the resin (D) has a functional group with a functional group equivalent of 400 g / eq or more and 10000 g / eq or less, and the cured product of the resin (D) and the conductive composition has a glass transition temperature (Tg) or softening point of 40°C or less, or an elastic modulus of less than 1.0 GPa at 30°C, and the conductive filler (F) has an intrinsic volume resistivity of 1×10 -4 The conductive material with a resistance of less than Ω·cm is formed.

[0080] Hereinafter, each component will be described.

[0081] Specifically, the conductive composition includes a resin composition comprising a resin (D) that becomes a stretchable adhesive, a curing agent (E) that reacts with the resin (D), and a conductive filler (F), wherein the resin (D) has a functional group with a functional group equivalent of 400 g / eq or more and 10000 g / eq or less, and a cured product of the resin (D) and the conductive composition has a glass transition temperature (Tg) or a softening point of 40°C or less, or an elastic modulus of less than 1.0 GPa at 30°C, and the conductive filler (F) has an intrinsic volume resistivity of 1×10 -4 The conductive material with a resistance of less than Ω·cm is formed.

[0082] The resin (D) preferably has a weight average molecular weight of 50,000 or more. It is believed that, as a result, when the conductive composition is used to print a conductive pattern, etc., penetration is less likely to occur. On the other hand, the upper limit of the weight average molecular weight is not particularly limited, but when the molecular weight exceeds 3,000,000, the viscosity may increase and the handling property may decrease. Therefore, the weight average molecular weight range of the resin (D) is preferably 50,000 or more and 3,000,000 or less, and more preferably 100,000 or more and 1,000,000 or less.

[0083] As the curing agent (E), any of various curing agents can be used without particular limitation as long as they are reactive with the resin (D) as described above. Specific examples of the curing agent (E) include free radical acid generators such as imidazole compounds, amine compounds, phenol compounds, acid anhydride compounds, isocyanate compounds, mercapto compounds, onium salts, and peroxides, and photoacid generators.

[0084] The conductive filler (F) has an intrinsic volume resistivity of 1×10 -4 The conductive material with a resistivity of less than Ω·cm is formed. The intrinsic volume resistivity at room temperature exceeds 1×10 -4 Ω·cm, when it is made into a conductive composition, its volume resistivity will reach about 1×10 -3 Ω·cm~1×10 -2 Therefore, when a circuit is made, the resistance value becomes high and the power loss becomes large.

[0085] As the conductive material (with an intrinsic volume resistivity of 1×10 -4 The conductive material (e.g., conductive material with a conductivity of less than Ω·cm) may include, for example, simple substances composed of metal elements such as silver, copper, and gold; compounds such as oxides, nitrides, carbides, and alloys of these elements. In addition to the conductive filler (F), a conductive or semiconductive conductive auxiliary agent may be added to the conductive composition for the purpose of further improving the conductivity. As the conductive or semiconductive auxiliary agent, conductive polymers, ionic liquids, carbon black, acetylene black, carbon nanotubes, inorganic compounds for antistatic agents, etc. may be used, and one or more of them may be used simultaneously.

[0086] The conductive filler (F) is preferably flat in shape, and the aspect ratio of the thickness to the in-plane long side direction is preferably 10 or more. When the aspect ratio is 10 or more, the surface area of ​​the conductive filler becomes larger relative to the mass ratio, which not only improves the conductivity efficiency, but also has the effect of improving the adhesion with the resin component and improving the elasticity. From the viewpoint that better conductivity and printability can be ensured if the aspect ratio is 1000 or less, it is preferably 10 or more and 1000 or less, and more preferably 20 or more and 500 or less. As an example of a conductive filler having this aspect ratio, a tap density of 6.0 g / cm 3 The following conductive fillers. And, the tap density is 2.0g / cm 3 In the following cases, the aspect ratio becomes larger, which is more preferable.

[0087] Regarding the blending ratio of the conductive filler (F) in the conductive composition, from the viewpoints of conductivity, cost and printability, the blending ratio of the conductive filler (F) is preferably 40 to 95% by mass, more preferably 60 to 85% by mass, relative to the total amount of the conductive composition.

[0088] In addition to the above-mentioned components, additives may be added to the conductive composition according to the purpose. Examples of the additives include elastomers, surfactants, dispersants, colorants, aromatics, plasticizers, pH adjusters, viscosity adjusters, ultraviolet absorbers, antioxidants, lubricants, and the like.

[0089] The particle size of the conductive filler (F) is not particularly limited. From the viewpoint of printability during screen printing and achieving an appropriate viscosity during mixing of the compound, the average particle size (particle size at 50% volume accumulation; D50) measured by a laser beam scattering method is preferably greater than 0.5 μm and less than 30 μm, and more preferably greater than 1.5 μm and less than 20 μm.

[0090] The conductive filler (F) is preferably a conductive filler having a surface coupling treatment. Alternatively, the conductive composition may contain a coupling agent. This has the advantage of further improving the adhesion between the binder resin and the conductive filler.

[0091] As the coupling agent added to the conductive composition or used for coupling the conductive filler, any coupling agent can be used without particular limitation as long as it is adsorbed on the filler surface or reacts with the filler surface. Specific examples of the coupling agent include silane coupling agents, titanate coupling agents, aluminum coupling agents, and the like.

[0092] When the coupling agent is used in the conductive composition, the amount of the coupling agent added is preferably about 1 to 20% by mass based on the entire resin composition.

[0093] The ratio of each component in the conductive composition is not particularly limited as long as the effects of the present invention can be exhibited, and the blending ratio of the resin (D): the curing agent (E) can be appropriately determined according to the types of the resin and the curing agent and in consideration of the equivalent ratio and the like.

[0094] In addition to the above components, additives may be added to the conductive composition according to the purpose. Examples of additives include elastomers, surfactants, dispersants, colorants, aromatics, plasticizers, pH adjusters, viscosity adjusters, ultraviolet absorbers, antioxidants, lubricants, and the like.

[0095] The method for forming the stretchable wiring is not particularly limited, and examples thereof include a method of applying or printing the conductive composition on the insulating layer described above to form a coating film of the conductive composition to form a desired wiring (conductive pattern).

[0096] The conductive pattern formed by the above wiring can be formed on the surface of the above insulating layer by the following process. That is, the above conductive composition is first applied or printed on the above insulating layer to form a coating film, and the volatile components contained in the coating film are removed by drying. The conductive pattern composed of the above stretchable wiring can be formed by a process of curing the resin (D) and the curing agent (E) (for example, a subsequent curing process such as heating, electron beam, light irradiation) and a process of reacting the coupling agent and the conductive filler (F) and reacting the resin (D) and the curing agent (E). The conditions in the above curing process and the reaction process are not particularly limited and can be appropriately set according to the types of resins, curing agents, fillers, etc., and the desired form.

[0097] The process of coating the conductive composition on the substrate (on the stretchable insulating layer) is not particularly limited, and may be, for example, a coating method using an applicator, a wire rod, a comma roller, a gravure roller, or a printing method using a screen, offset printing, flexographic printing, inkjet, stamping, a dispenser, a squeegee, or the like.

[0098] The stretchable device (first stretchable device) 91 according to the embodiment of the present invention is as follows: Fig. 9 The material shown in the figure comprises: the stretchable circuit substrate 12 and the adhesive layer 15, and the fabric 92, the stretchable circuit substrate 12 comprises a stretchable wiring 14, and an electronic component 17 electrically connected to the stretchable wiring 14. The stretchable device can be obtained by peeling off the release sheet from the material for the stretchable device and attaching it to the fabric. Therefore, the first stretchable device is a stretchable device in which the stretchable circuit substrate is fixed to the fabric via the adhesive layer. It should be noted that Fig. 9 It is a cross-sectional view showing an example of a stretchable device 91 according to an embodiment of the present invention.

[0099] The stretchable device (second stretchable device) 91 according to the embodiment of the present invention is as follows: Fig.10The device shown in the figure comprises: the stretchable laminate 21 having the electronic component 17, a fabric 102, and a fixing member 101 for fixing the stretchable laminate 21 and the fabric 102. The fixing member 101 may be the same as the adhesive layer 15 of the stretchable laminate 21. The stretchable device can be obtained by fixing the fabric substrate of the stretchable laminate to the fabric. Thus, the second stretchable device is a stretchable device in which a stretchable circuit substrate is fixed to the fabric. It should be noted that Fig.10 It is a cross-sectional view showing another example of the stretchable device 91 according to the embodiment of the present invention.

[0100] The stretchable device (third stretchable device) 91 according to the embodiment of the present invention is as follows: Figures 6 to 8 The third stretchable device 91 is provided with the stretchable laminate 21 as shown in FIG. 1 , wherein the stretchable laminate 21 includes the fabric substrate 31 having the exposed portion 31a. Fig.11 The stretchable laminate 21 includes the fabric substrate 31 having the exposed portion 31a, the fabric 111, and a fixing member 112 for fixing the exposed portion 31a of the fabric substrate 31 of the stretchable laminate 21 and the fabric 111. Fig.11 It is a cross-sectional view showing another example of the stretchable device 91 according to the embodiment of the present invention.

[0101] As the fixing member 112, for example, adhesives, wires, etc. can be cited. In addition, as for the wire used as the fixing member, it is preferably a conductive wire. If it is such a conductive wire, the fixing member can be used as a ground in the wiring for mounting electronic components by using the fixing member as an electrode or by making the fixing member contact with the human body, etc.

[0102] From the perspective of well fixing the stretchable laminate 21 to the fabric 111, the third stretchable device 91 is as follows: Fig.11 As shown in FIG. 1 , it is preferred that the fixing member 112 fixes the exposed portion 31a and the fabric 111 at two or more locations. When the fixing locations are two or more, it is preferred that the length of the fabric 111 between adjacent fixing locations is shorter than the length of the stretchable laminate 21 between adjacent fixing locations. If the length is such that Fig.11 As shown, when the exposed portion 31 a of the fabric base material 31 and the fabric 111 are fixed, the length of the fabric 111 between the fixed positions is shorter than the length of the stretch laminate 21 .

[0103] By fixing in this way, the stretchable laminate can be fixed to the fabric without stretching the stretchable laminate. In addition, even if the fabric is stretched, the stretchable laminate will not be strongly pressed against the fabric. That is, a so-called play can be formed in the stretchable laminate. As a result, the stretchable laminate and the fabric will not be too closely attached, and damage to the stretchable laminate can be suppressed. For example, poor conduction of electronic components mounted on the stretchable circuit substrate can be suppressed.

[0104] It should be noted that "the length of the fabric between adjacent fixing positions" and "the length of the stretchable laminate between adjacent fixing positions" refer to: when the same two fixing positions are set as the two fixing positions for fixing the exposed portion and the fabric, then "the length of the fabric" and "the length of the stretchable laminate" between the two. Therefore, the fixed positions are positions where the exposed portion and the fabric are fixed, and in the case of two fixing positions, each fixed position is the closest position between the two fixed positions. For example, when an adhesive is used as a fixing member and two fixing positions are formed, each position is located on the inner side of the area where the exposed portion and the fabric are fixed and they are closest. In addition, when a wire is used as a fixing member and two fixing positions are formed, it is also the closest position.

[0105] As the above-mentioned fabrics 92, 102, 111, for example, fabrics constituting clothing can be cited. In addition, when the above-mentioned fabrics are fabrics constituting clothing, the obtained clothing is clothing to which the above-mentioned stretchable circuit substrate is fixed. As the above-mentioned clothing to which the stretchable circuit substrate is fixed, for example, Fig.12 As the clothing 121 fixed with the stretchable circuit substrate 12, for example, when the electronic components of the stretchable circuit substrate are used to obtain the movement trajectory of the salesperson, the clothing may include uniforms, and the fabric may include fabrics constituting the uniforms. In addition, when the electronic components of the stretchable circuit substrate are used for sports purposes, the clothing may include sports team uniforms, T-shirts worn during sports, etc., and the fabric may include fabrics constituting these. It should be noted that Fig.12 This is a schematic diagram showing an example of clothing to which the stretchable circuit board according to the present embodiment is fixed.

[0106] As the fixing position of the stretchable circuit board in the clothing, there can be cited a position where the electronic components of the stretchable circuit board can work well. As the fixing position, for example, there can be cited a position located on the upper and inner side of the back side when the clothing 121 is worn, a position close to the hanger when the clothing is hung on a hanger, and other positions where a label or the like is attached.

[0107] In the case where the fabric in the stretchable device is a fabric constituting clothing, it is preferred that the stretchable circuit substrate be fixed at a position such that when the clothing is hung on a clothing hanger having electronic components for power transmission that can perform contactless communication or contactless power transmission with the electronic components possessed by the stretchable circuit substrate, the electronic components possessed by the stretchable circuit substrate can perform contactless communication or contactless power transmission with the electronic components for power transmission. It is preferred that the clothing hanger has the electronic components for power transmission at a position where the electronic components possessed by the stretchable circuit substrate can perform contactless communication or contactless power transmission with the electronic components for power transmission. Specifically, the clothing hanger 131 includes the following: Fig.13 When the clothes are hung as shown, the hanger or the like having the power transmission electronic component 132 is provided at the upper part of the back side and close to the inner side when the clothes are worn. Fig.13 The present invention is a schematic diagram showing an example of a clothing hanger for hanging and fixing clothing having a stretchable circuit substrate according to an embodiment of the present invention. Thus, by simply hanging clothing having the stretchable circuit substrate on the clothing hanger, contactless communication between the electronic component of the stretchable circuit substrate and the power transmission electronic component of the clothing hanger can be achieved, or contactless power can be supplied from the power transmission electronic component of the clothing hanger to the electronic component of the stretchable circuit substrate.

[0108] The clothes hanger may be configured such that the electronic component for transmitting power to the electronic component provided by the stretchable circuit substrate is detachable. Thus, the electronic component for transmitting power can be easily charged. In addition, the clothes hanger may be configured such that, for example, the electronic component for transmitting power to communicate with the electronic component provided by the stretchable circuit substrate is detachable. Thus, data can be easily retrieved from the electronic component for transmitting power. Since the time for hanging the clothes on the clothes hanger can be short, it is effective when the clothes are wetted by sweat or the like.

[0109] This application is based on Japanese patent application No. 2019-079144 filed on April 18, 2019, the contents of which are incorporated herein by reference.

[0110] In order to describe the present invention, the present invention has been appropriately and fully described above through the embodiments, but it should be recognized that those skilled in the art can easily change and / or improve the above embodiments. Therefore, as long as the modified embodiments or improved embodiments implemented by those skilled in the art do not deviate from the protection scope of the claims recorded in the claims, the modified embodiments or improved embodiments can be interpreted as being included in the protection scope of the claims.

[0111] Industrial Applicability

[0112] According to the present invention, a stretchable laminate capable of satisfactorily fixing a stretchable circuit substrate to a fabric, a stretchable device material capable of satisfactorily fixing a stretchable circuit substrate to a fabric, and a stretchable device capable of satisfactorily fixing a stretchable circuit substrate to a fabric are provided.

Claims

1. A telescopic device, characterized in that include: Stretchable laminate; cloth; as well as a fixing member for fixing the stretchable laminate and the fabric, The stretchable laminate is a stretchable laminate fixed to the fabric, and includes: A stretchable circuit substrate having a stretchable insulating layer with an elongation of more than 10%; a fabric substrate different from the fabric; and an adhesive layer for bonding the stretchable circuit substrate and the fabric substrate, The fabric substrate has: an exposed portion, wherein the exposed portion is exposed when viewed from the side of the stretchable circuit substrate in a state where the stretchable circuit substrate and the fabric base material are stacked via the adhesive layer, The exposed portion and the fabric are fixed at two or more locations by the fixing member. The length of the fabric between the adjacent fixing positions is shorter than the length of the stretchable laminate between the adjacent fixing positions.

2. The retractable device according to claim 1, characterized in that The exposed portion is a protruding portion that protrudes from the fabric base material toward the stretchable circuit board in a state where the stretchable circuit board and the fabric base material are stacked with the adhesive layer interposed therebetween.

3. The retractable device according to claim 1, characterized in that: The adhesive layer is formed of a hot melt adhesive.

4. The retractable device according to claim 1, characterized in that The storage modulus of the stretchable insulating layer in a temperature range of 100° C. or higher and lower than 400° C. is 500 kPa or higher.

5. The retractable device according to claim 1, characterized in that: The thermal decomposition temperature of the stretchable insulating layer is 270° C. or higher.

6. The retractable device according to claim 1, characterized in that The stretchable insulating layer includes a resin having a hydroxyl group in a molecule or a resin having an epoxy group in a molecule.

7. The retractable device according to claim 1, characterized in that The stretchable circuit substrate further includes stretchable wiring.

8. The retractable device according to claim 7, characterized in that At least a portion of the stretchable wiring is formed of copper foil.

9. The retractable device according to claim 7, characterized in that Also includes: The electronic component is electrically connected to the stretchable wiring.

10. The retractable device according to claim 9, characterized in that The electronic component is mounted on a surface of the stretchable circuit board that is opposite to a surface in contact with the adhesive layer.

11. The retractable device according to claim 9, characterized in that The electronic component is mounted on a surface of the stretchable circuit board that is in contact with the adhesive layer.

12. The telescopic device according to any one of claims 1 to 11, characterized in that: The fixing member is a conductive wire.

13. The telescopic device according to any one of claims 9 to 11, characterized in that: The cloth is a cloth constituting clothing, The stretchable circuit substrate is fixed at the following position, wherein when the clothing is hung on a clothing hanger having a power-transmitting electronic component capable of performing contactless communication or contactless power supply with the electronic component possessed by the stretchable circuit substrate, the electronic component possessed by the stretchable circuit substrate can perform contactless communication or contactless power supply with the power-transmitting electronic component.

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