Vapor Chamber and Electronic Equipment

Abstract

The present invention relates to a heat spreader and an electronic device. The heat spreader includes a first cover plate, a second cover plate, a capillary wick and a coolant. The second cover plate cooperates with the first cover plate to form a cavity, and the coolant is filled in the cavity. The capillary wick includes a capillary hot end and a capillary cold end. The capillary cold end has an L-shaped capillary channel. One end of the capillary channel is connected to the capillary hot end to form a liquid absorption cavity. The capillary wick is arranged in the cavity so that the coolant can be adsorbed into the liquid absorption cavity. The coolant in the heat spreader will quickly flow back to the capillary hot end along the L-shaped capillary channel in the capillary cold end, which can reduce the probability of dry burning of the heat spreader, thereby increasing the service life of the heat spreader.

Description

Technical Field

[0001] The present invention relates to the technical field of heat transfer devices, and in particular to a heat spreader and electronic equipment. Background Art

[0002] As the power consumption of electronic devices such as mobile phones and tablets increases, the heat generated by the electronic device terminals also increases. In order to quickly dissipate the heat generated by the electronic device terminals to the outside of the terminal, a vapor chamber is used on the terminal. The structure of the vapor chamber includes an upper cover, a lower base, and a capillary wick. The capillary wick, the upper cover, and the lower base are connected together by high-temperature sintering, and the upper cover and the lower base are then welded to form a cavity with a microscopic capillary structure. The vacuum cavity is then evacuated, injected with coolant, and packaged and welded to obtain a vapor chamber. When the heat spreader is applied to electronic equipment, the heat source such as the chip of the electronic equipment terminal is conducted to the vacuum cavity of the heat spreader, the hot end (also called the evaporation zone) of the capillary wick in the vacuum cavity contacts the heat source, the coolant absorbs the heat, then vaporizes and quickly fills the entire hot end, and then is conducted to the cold end (also called the condensation zone) far away from the heat source and with a lower temperature, the gas condenses, and the phase change latent heat of the medium is released and discharged through the gas-liquid transition, and the condensed coolant will flow back to the hot end of the heat source through the capillary structure on the inner wall of the capillary wick, and this process is continuously circulated in the vacuum cavity of the heat spreader, thereby achieving the purpose of heat dissipation.

[0003] The capillary structure of the traditional liquid absorbent core is distributed in a grid or radial manner, and has a capillary structure with a large specific surface area, so the coolant can be quickly adsorbed on the capillary liquid absorbent core. However, during the application process, a part of the coolant will circulate at the cold end of the liquid absorbent core and cannot flow back to the hot end quickly and timely, resulting in a reduction in the coolant at the hot end, reducing the circulation efficiency and heat transfer effect of the coolant in the heat spreader, thereby reducing the heat dissipation effect of the chip, and even causing dry burning to cause the heat spreader to age, reducing the service life of the heat spreader. Based on this, traditional heat spreaders can often only be used in a small area in the heat source area of ​​electronic equipment, and the area of ​​the heat spreader should not be too large and cannot be spread over the entire plane, which further leads to a limited heat dissipation area of ​​the heat spreader, and the heat carried by the heat vaporized coolant cannot be discharged from the cold end in time, thereby increasing the temperature inside the heat spreader chamber, limiting the application of the heat spreader in high-power heat source equipment.

[0004] Therefore, the existing technology still needs to be developed. Summary of the invention

[0005] Based on this, the present invention provides a vapor chamber and an electronic device. The vapor chamber can improve the heat dissipation efficiency and service life of the vapor chamber.

[0006] The technical solution of the present invention is as follows.

[0007] One aspect of the present invention provides a vapor chamber, comprising:

[0008] first cover plate;

[0009] a second cover plate, wherein the second cover plate cooperates with the first cover plate to form a cavity;

[0010] A cooling liquid is filled in the cavity; and

[0011] The capillary wick comprises a capillary hot end and a capillary cold end, wherein the capillary cold end has an L-shaped capillary channel, one end of the capillary channel is connected to the capillary hot end to form a liquid absorption cavity; the capillary wick is arranged in the cavity so that the cooling liquid can be absorbed into the liquid absorption cavity.

[0012] In some embodiments, there are multiple capillary channels in the capillary cold end, and the multiple capillary channels are arranged in a circle to form a capillary channel group. The capillary channel includes a first section and a second section connected in an L shape. In the same capillary channel group, the first sections of the multiple capillary channels are distributed in a ring shape and are located in the same plane.

[0013] In some embodiments, the first section and the second section are vertically connected to each other; and / or

[0014] One end of the first section is connected to the second section, and the other end of the first section extends outward away from the center of the ring.

[0015] In some embodiments, in the capillary cold end, there are multiple capillary channel groups; the first sections of the capillary channel groups overlap in the axial direction of the ring, and the multiple capillary channel groups are distributed in sequence along the axial direction of the ring.

[0016] In some of the embodiments, in the same capillary channel group, the axial distance between the second section of each capillary channel and the ring is equal; in the axial direction of the ring and from one end of the second section connected to the first section to the other end, the axial distance between the second section in each capillary channel group and the ring gradually increases.

[0017] In some embodiments, ends of the second section in each of the capillary channel groups that are away from the first section are located in the same plane that is perpendicular to the axial direction of the ring.

[0018] In some of the embodiments, in the same capillary channel group, the length of the second segment of each capillary channel is equal; in the axial direction of the ring and in the direction from one end of the second segment connected to the first segment to the other end, as the axial distance between the second segment in each capillary channel group and the ring gradually increases, the length of the second segment in each capillary channel group gradually decreases.

[0019] In some embodiments, the capillary hot end and the capillary cold end are sequentially arranged in the cavity along a thickness direction of the first cover plate.

[0020] In some embodiments, the capillary hot end and the capillary cold end are sequentially arranged in the cavity along the length direction of the first cover plate.

[0021] Another aspect of the present invention provides an electronic device, comprising the vapor chamber as described above.

[0022] The present invention further provides an electronic device, comprising the above-mentioned heat sink.

[0023] The above-mentioned heat spreader includes a first cover plate, a second cover plate, a capillary wick and a coolant. The second cover plate cooperates with the first cover plate to form a cavity, and the coolant is filled in the cavity. The capillary wick includes a capillary hot end and a capillary cold end. The capillary cold end has an L-shaped capillary channel. One end of the L-shaped capillary channel is connected to the capillary hot end to form a liquid absorption cavity. The capillary wick is arranged in the cavity so that the coolant can be adsorbed into the liquid absorption cavity. When the heat spreader is working, the coolant at the capillary hot end of the wick absorbs the heat from the heat source and vaporizes. The vaporized gas is conducted to the capillary cold end of the wick which is far away from the heat source and has a lower temperature. The gas undergoes a gas-liquid transition, releases the latent heat of phase change, and obtains liquid coolant. The coolant will quickly flow back to the capillary hot end along the L-shaped capillary channel in the capillary cold end. In this way, the circulation efficiency and heat transfer effect of the coolant in the heat spreader can be improved, thereby improving the heat dissipation effect of the heat spreader on heat sources such as chips, reducing the chance of dry burning of the heat spreader, and increasing the service life of the heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a cross-sectional schematic diagram of a vapor chamber in an example of the present invention;

[0025] Figure 2 is a cross-sectional schematic diagram of a capillary wick in an example of the present invention;

[0026] Figure 3 A top view of a capillary hot end of a capillary wick in an example of the present invention;

[0027] Figure 4 A top view of a capillary hot end of a capillary wick in another example of the present invention;

[0028] Figure 5 is an electron microscope image of a cross section of a capillary cold end of a capillary wick prepared in one embodiment of the present invention;

[0029] Figure 6 FIG. 4 is a cross-sectional schematic diagram of a heat spreader in another example of the present invention. DETAILED DESCRIPTION

[0030] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings.

[0031] The preferred embodiments of the present invention are given in the specific embodiments. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0032] The overall capillary structure of the liquid wick in the traditional heat spreader is grid-shaped or radially distributed, with a large specific surface area. The coolant can be quickly adsorbed on the capillary liquid wick, but a part of the coolant will circulate at the cold end of the liquid wick and cannot return to the hot end quickly and in time, resulting in a reduction of coolant at the hot end and dry burning, which leads to aging of the heat spreader and reduces the service life of the heat spreader. In recent years, technicians have focused on developing new cover materials with high thermal conductivity, such as using graphene to prepare cover plates, or adding heat dissipation fins to improve the heat dissipation efficiency of the heat spreader. This not only increases the cost of the heat spreader, but is also not conducive to the development of the heat spreader in the direction of ultra-thin and lightweight.

[0033] Based on this, the technicians of the present invention broke the shackles of traditional technology and creatively proposed to improve the heat dissipation performance of the heat spreader by improving the structure of the liquid absorbent core. After a lot of research, the technicians of the present invention found that the capillary structure of the traditional liquid absorbent core is generally distributed in a grid or radial manner, with a large specific surface area, but because the movement of the coolant in the capillary structure is non-directional, part of the coolant will circulate at the cold end of the liquid absorbent core and cannot flow back to the hot end quickly and in time. Based on this, the technicians proposed the technical solution of the present invention.

[0034] See also Figure 1 One embodiment of the present invention provides a heat spreader 10, including a first cover plate 11, a second cover plate 12, a coolant and a capillary wick 14 (see Figure 2 ).

[0035] Please continue reading Figure 1 The second cover plate 12 cooperates with the first cover plate 11 to form a cavity 13 , the cooling liquid is filled in the cavity 13 , and the capillary wick 14 is disposed in the cavity 13 . Figure 1It is a cross-sectional schematic diagram of a vapor chamber, which does not show the cooling liquid and the capillary wick 14 .

[0036] See also Figure 2 The capillary absorbent core 14 includes a capillary hot end 141 and a capillary cold end 142. The capillary cold end 142 has an L-shaped capillary channel 1421. One end of the capillary channel 1421 is connected to the capillary hot end 141 to form a liquid absorption cavity. The capillary absorbent core 14 is arranged in the cavity 13 so that the cooling liquid can be absorbed into the liquid absorption cavity.

[0037] When the above-mentioned heat spreader 10 is working, the coolant at the capillary hot end 141 of the liquid wick 14 absorbs the heat from the heat source and vaporizes, and the vaporized gas is conducted to the capillary cold end 142 of the liquid wick far away from the heat source and at a lower temperature, and the gas undergoes a gas-liquid transition, releasing the latent heat of phase change, and obtaining liquid coolant again, and the coolant will quickly flow back to the capillary hot end 141 along the L-shaped capillary structure channel 1421 in the capillary cold end 142. In this way, the circulation efficiency and heat transfer effect of the coolant in the heat spreader 10 can be improved, thereby improving the heat dissipation effect of the heat spreader 10 on the heat source such as the chip, and reducing the probability of dry burning of the heat spreader 10, thereby improving the service life of the heat spreader 10.

[0038] Please continue reading Figure 2 The capillary hot end 141 can adopt a conventional sintered core capillary structure. Figure 2 Not shown.

[0039] Furthermore, the capillary hot end 141 adopts a conventional sintered core capillary structure, and the capillary structure is distributed in a grid or radial manner. When the capillary structure of the capillary hot end 141 is distributed in a grid manner, its top view is as shown in FIG. Figure 3 As shown, when the capillary structure of the capillary hot end 141 is distributed in a radial manner, its top view is as shown in FIG. Figure 4 As shown. Among them, Figure 3 and Figure 4 The four circles in FIG. 1 represent the projection of the support column on the capillary hot end 141 of the capillary wick 14 .

[0040] The capillary hot ends distributed in a grid pattern can accelerate the gas-liquid conversion of steam, and the capillary hot ends distributed in a radial pattern can accelerate the boiling and evaporation of steam, thereby further promoting the "liquid-gas-liquid" circulation speed inside the heat plate cavity 13. Please continue to refer to Figure 2 In some embodiments, there are multiple capillary channels 1421 in the capillary cold end 142, and the multiple capillary channels 1421 are arranged in a circle to form a capillary channel group. The capillary channel 1421 includes a first section 1421a and a second section 1421b connected in an L shape. In the same capillary channel group, the first sections 1421a of the multiple capillary channels 1421 are distributed in a ring shape and are located in the same plane.

[0041] For further information, see Figure 2 , the first section 1421a and the second section 1421a are vertically connected to each other.

[0042] It can be understood that in the same capillary channel group, when the first sections 1421a of the plurality of capillary channels 1421 are distributed in a ring shape and are located in the same plane, please refer to Figure 2 The first sections 1421a of the capillary channels 1421 distributed in an annular shape form a ring having a central axis, and the extension direction of the first sections 1421a of the plurality of capillary channels 1421 is perpendicular to the axial direction S1 of the central axis.

[0043] Furthermore, the first sections 1421a and the second sections 1421b of the plurality of capillary channels 1421 are vertically connected to each other. At this time, the extension direction of the second section 1421b is the same as the axial direction S1 of the central axis of the ring.

[0044] Please continue reading Figure 2 One end of the first section 1421a is connected to the second section 1421b, and the other end of the first section 1421a extends outward away from the center of the above-mentioned ring.

[0045] In some embodiments, in the capillary cold end 142, there are multiple capillary channel groups; the first sections 1421a of each capillary channel group overlap in the axial direction S1 of the ring, and the multiple capillary channel groups are distributed in sequence along the axial direction S1 of the ring.

[0046] See also Figure 1 It can be understood that when there are multiple capillary channel groups, the ring formed by the first sections 1421a of each ring-shaped capillary channel group has the same central axis, and the ring formed by the first sections 1421a of the multiple capillary channels 1421 in each capillary channel group is distributed in sequence along the axial direction S1 of the central axis of the ring.

[0047] Please continue reading Figure 2 In the same capillary channel group, the second section 1421b of each capillary channel 1421 is at an equal distance from the axial direction of the ring; in the axial direction of the ring and from one end of the second section 1421b connected to the first section 1421a to the other end, the distance between the second section 1421b in each capillary channel group 1421 and the axial direction of the ring gradually increases.

[0048] It can be understood that in the same capillary channel group, the length of the first section 1421a of each capillary channel 1421 is the same. In the direction along the axial direction of the ring and from one end of the second section 1421b connected to the first section 1421a to the other end, that is, in the axial direction S1 of the ring presented by the first section 1421a in a capillary channel group, the length of the first section 1421a in each capillary channel group gradually decreases.

[0049] For further information, please refer to Figure 2The ends of the second section 1421b in each capillary channel group away from the first section 1421a are all located in the same plane perpendicular to the axial direction of the ring.

[0050] It can be understood that at this time, in the capillary absorbent core 14, the ends of the capillary cold end 142 and the capillary hot end 141 forming the absorbent cavity are located in the same horizontal plane and are perpendicular to the axis of the central axis of the ring formed by the capillary channel group.

[0051] Please continue reading Figure 2 In the same capillary channel group, the length of the second section 1421b of each capillary channel is equal; in the axial direction of the ring and in the direction from one end of the second section 1421b connected to the first section 1421a to the other end, as the axial distance between the second section 1421b in each capillary channel group and the ring gradually increases, the length of the second section 1421b in each capillary channel group gradually decreases.

[0052] In other words, in the axial direction S1 of the ring formed by the first section 1421a in the same capillary channel group, the length of the second section 1421b in each capillary channel group gradually decreases.

[0053] In this way, it is beneficial to arrange as many capillary channels 1421 as possible at the capillary cold end 142, so as to further increase the speed of the coolant flowing back to the capillary hot end 141 along the L-shaped capillary structure channel 1421 in the capillary cold end 142, reduce the probability of dry burning of the heat spreader, and further increase the service life of the heat spreader.

[0054] In some embodiments, the inner diameter of the capillary channel 1421 is 1 mm to 5 mm.

[0055] In some embodiments, the capillary wick is made of copper or copper alloy. Specifically, the sintered powder is sintered to form the capillary wick of the above pattern, and the capillary wick includes a capillary hot end and a capillary cold end. Furthermore, the particle size of the sintered powder used for sintering is 50 μm to 200 μm, and the pore diameter inside the capillary wick is 10 μm to 100 μm.

[0056] It is understood that the sintering powder is sintered according to the sintering pattern formed by the desired structure of the capillary wick 14. The sintering powder is metal copper or copper alloy.

[0057] In a specific embodiment, an electron microscope image of a cross section of the capillary cold end 142 of the prepared capillary wick is shown in the attached Figure 5 shown.

[0058] See also Figure 1 The heat sink 10 further includes a support column 15 , which is disposed in the cavity 13 and is used to support the first cover plate 11 and the second cover plate 12 .

[0059] It is understandable that the vapor chamber 10 may include a plurality of support columns 15 .

[0060] Specifically, the support column is formed by sintering metal copper powder.

[0061] Please continue reading Figure 1 In a specific example, the capillary hot end 141 and the capillary cold end 142 are sequentially arranged in the cavity 13 along the thickness direction S2 of the first cover plate. In other words, it can be considered that the cavity 13 is divided into two sub-cavities along the thickness direction S2 of the first cover plate, namely the first sub-cavity 131 and the second sub-cavity 132, and the capillary hot end 141 and the capillary cold end 142 are respectively located in the two sub-cavities.

[0062] In other words, at this time, in the capillary wick 14 , the axial direction S1 of the ring formed by the first section 1421 a in the same capillary channel group is parallel to the thickness direction S2 of the first cover plate 11 .

[0063] The capillary wick 14 is disposed in the cavity 13, and the capillary hot end 141 is located between the first cover plate 11 and the second cover plate 12, and the capillary cold end is located between the capillary hot end 142 and the second cover plate 12. When the vapor chamber 10 is used to prepare electronic equipment, the portion of the sub-cavity where the capillary hot end 141 is located serves as the contact portion between the vapor chamber 10 and the heat source.

[0064] Please refer to Figure 1 , the capillary hot end 141 in the heat spreader 10 is located in the sub-cavity 131, and the capillary cold end 142 is located in the sub-cavity 132. In this specific example, when a heat source such as a chip is set, the heat source can be set on the outer surface of the first cover plate 11, that is, the heat source is set on the cover plate close to the capillary hot end 141, and the heat of the chip is quickly absorbed, thereby performing heat dissipation treatment on the chip.

[0065] Specifically, during the preparation process, the capillary hot end 141 of the capillary wick 14 is sintered with the first cover plate 11, and the capillary cold end 142 of the capillary wick 14 is sintered with the second cover plate 12 to obtain an evaporation cover plate and a condensation cover plate, respectively, and then the condensation cover plate and the evaporation cover plate are sintered and welded by setting support columns to form a heat spreader.

[0066] See also Figure 6 In another specific example, in the heat spreader 10, the capillary hot end 141 and the capillary cold end 142 are sequentially arranged in the cavity 13 along the length direction S3 of the first cover plate. In other words, it can be considered that the cavity 13 is divided into two sub-cavities 131 and 132 along the thickness direction S3 of the first cover plate 11, and the capillary hot end 141 and the capillary cold end 142 are respectively located in the two sub-cavities.

[0067] In other words, it can be understood that in the capillary wick 14 , in the same capillary channel group, the axial direction S1 of the ring formed by the first section 1421 a is the same as the length direction S3 of the first cover plate 11 .

[0068] Specifically, the capillary hot end 141 is located in the sub-cavity 131, and the capillary cold end 142 is located in the sub-cavity 132. At this time, the capillary cold end 142 has a capillary structure channel that can extend to a position far away from the capillary hot end 141, and the capillary hot end 141 is close to the first cover plate 11 and the second cover plate 12 of the heat spreader 10. In this way, the heat dissipation area and space utilization are greatly increased.

[0069] In this specific example, when a heat source such as a chip is provided, the heat source can be provided on the outer surface of the first cover plate 11 and the second cover plate 12 close to the capillary hot end 141 , which greatly improves the heat dissipation efficiency.

[0070] In a specific preparation process of the heat sink, the capillary wick and the first cover plate 11 are sintered to obtain the first sintered cover plate, and the capillary wick and the second cover plate 12 are sintered to obtain the second sintered cover plate. The axial direction S1 of the ring presented by the first section 1421a in the same capillary channel group in the capillary wick is the same as the length direction S2 of the first cover plate 11 and the second cover plate 12.

[0071] Then, the first sintered cover plate and the second sintered cover plate are sintered and welded by setting support columns to form a heat spreader with a cavity, wherein the capillary cold ends in the first sintered cover plate and the second sintered cover plate are opposite to each other.

[0072] In some embodiments, the above welding step adopts diffusion welding, the welding temperature is 650℃~750℃, the pressure is 1MPa / cm 2 ~1.5MPa / cm 2 .

[0073] In some of the embodiments, the sintering conditions are: sintering at 700° C. to 800° C. for 1 h to 2 h.

[0074] In some embodiments, the material of the first cover plate 11 and / or the second cover plate 12 is copper-molybdenum alloy or copper-tungsten alloy.

[0075] In traditional technology, semiconductor chips, especially chips of high-power power electronic devices such as thyristors, IGBTs, IGCTs, etc., are very sensitive to thermal stress caused by temperature changes, so they usually need to be designed and attached to heat sink materials. The heat sink material needs to have good thermal conductivity and low thermal expansion coefficient. When the thermal expansion coefficient of the heat sink material of the heat spreader is similar to that of the corresponding chip material, the thermal stress generated by the chip during use and when the ambient temperature changes is small, ensuring its safe operation. The heat sink material is then connected to the heat spreader and its corresponding heat dissipation module by welding or thermal conductive adhesive to achieve the purpose of fast and efficient heat conduction and heat dissipation required by heat sources such as chips.

[0076] However, the connection process between the chip and the heat sink is through the heat sink material and the heat sink heat dissipation module, which adds at least two layers of thermal resistance: one is the thermal resistance of the heat sink material itself, and the other is the thermal resistance of the welding layer or thermal conductive glue connecting the heat sink material and the heat sink. Thermal resistance is a crucial parameter that affects the heat dissipation and working stability of the chip. In addition, the increase in the connection layer also causes structural changes, increases in geometric dimensions and weight, and relatively reduces the reliability of the device. Because one more layer of connection means one more possibility of contact failure.

[0077] Therefore, the heat sink material such as copper-molybdenum alloy or copper-tungsten alloy is directly designed as the first cover plate and / or the second cover plate of the heat spreader, thereby greatly improving and simplifying the conventional integrated structure: chip + bonding layer + heat sink material + bonding layer + heat spreader heat dissipation module, forming a streamlined integrated structure: chip + bonding layer + heat spreader heat dissipation module. The heat spreader achieves the effects of heat sink and heat dissipation. Therefore, the invention greatly reduces the thermal resistance generated by the original multi-layer structure integration, saves the required thickness space, and achieves the purpose of light, thin and fast heat conduction and heat dissipation.

[0078] Among them, copper-molybdenum alloy and copper-tungsten alloy have excellent physical properties, such as high thermal conductivity, heat resistance and low thermal expansion coefficient, etc., and also have good mechanical properties such as high elastic modulus, which can meet the heat sink application of high-power integrated circuits and microwave devices. Using the heat sink plate as the cover of the heat sink, the heat sink material and the heat sink can be integrated to ensure that the semiconductor chip is not greatly affected by the thermal stress of temperature changes, greatly reduce the thermal resistance of the chip and the entire module required for heat dissipation, improve the working stability and reliability of the chip, and effectively solve the heat dissipation problem of high-heat electronic components.

[0079] Furthermore, the thermal expansion coefficient of copper-molybdenum alloy and copper-tungsten alloy can be 7×10 -6 / K~10×10 -6 / K adjustment, the thermal conductivity is 280W / m·K~300W / m·K.

[0080] In some embodiments, the heat spreader 10 further includes a liquid guide tube; one end of the liquid guide tube is connected to a cavity formed by the second cover plate 11 and the first cover plate 12, and is used to guide the coolant into the cavity 13 formed by the second cover plate 11 and the first cover plate 12.

[0081] In the specific preparation process, in the step of welding the first cover plate and the second cover plate, a reserved hole is formed on the formed heat spreader body. Then, a liquid guide tube is welded to the reserved hole on the heat spreader body, and the coolant is injected into the cavity of the heat spreader body through the liquid guide tube, and then vacuum is drawn until the pressure inside the cavity of the heat spreader body is below 10Pa, and finally spot welding is used to seal it.

[0082] In some embodiments, the packaged heat spreader is polished and nickel-plated and / or gold-plated on the surface to improve the surface flatness and prevent rust, corrosion and other problems.

[0083] Another embodiment of the present invention provides an electronic device, which includes the vapor chamber as described above.

[0084] Specifically, the electronic device can be a mobile phone or smart phone, a portable gaming device, a computer, a PDA, a portable Internet device, a music player and a data storage device, other handheld devices and devices such as watches, in-ear headphones, pendants, headphones, etc.; it can also be other wearable devices such as: electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, smart watches, head-mounted devices (HMD).

[0085] In some of the embodiments, the electronic device further comprises the heat source, and the location of the heat source is not described in detail here.

[0086] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0087] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A heat sink, characterized in that: include: first cover plate; a second cover plate, wherein the second cover plate cooperates with the first cover plate to form a cavity; A coolant filled in the cavity; and The capillary absorbent core comprises a capillary hot end and a capillary cold end, wherein the capillary cold end has an L-shaped capillary channel, and one end of the capillary channel is connected to the capillary hot end to form a liquid absorption cavity; The capillary absorption core is arranged in the cavity so that the cooling liquid can be adsorbed into the absorption cavity; there are multiple capillary channels in the capillary cold end, and the multiple capillary channels are arranged in a circle to form a capillary channel group; the capillary channel includes a first section and a second section connected in an L shape, and in the same capillary channel group, the first sections of the multiple capillary channels are distributed in a ring shape and are located in the same plane; the first sections of the capillary channel group distributed in a ring shape form a ring, and the ring has a central axis, and the extension direction of the first sections of the multiple capillary channels is perpendicular to the axial direction of the central axis.

2. The vapor chamber according to claim 1, characterized in that: The first section and the second section are vertically connected to each other.

3. The vapor chamber according to claim 1, characterized in that: One end of the first section is connected to the second section, and the other end of the first section extends outward away from the center of the ring.

4. The vapor chamber according to claim 1, characterized in that: In the capillary cold end, there are multiple capillary channel groups; when there are multiple capillary channel groups, the rings formed by the first sections of each of the capillary channel groups distributed in a ring shape have the same central axis, and the rings formed by the first sections of the multiple capillary channels in each capillary channel group are distributed in sequence along the axial direction of the central axis of the ring.

5. The vapor chamber according to claim 4, characterized in that: In the same capillary channel group, the axial distance between the second section of each capillary channel and the ring is equal; in the axial direction of the ring and from one end of the second section connected to the first section to the other end, the axial distance between the second section in each capillary channel group and the ring gradually increases.

6. The vapor chamber according to claim 5, characterized in that: The ends of the second sections in each of the capillary channel groups that are away from the first sections are located in the same plane that is perpendicular to the axial direction of the ring.

7. The vapor chamber according to claim 5, characterized in that: In the same capillary channel group, the length of the second section of each capillary channel is equal; in the axial direction of the ring and in the direction from one end of the second section connected to the first section to the other end, as the axial distance between the second section in each capillary channel group and the ring gradually increases, the length of the second section in each capillary channel group gradually decreases.

8. The vapor chamber according to any one of claims 1 to 7, characterized in that: The capillary hot end and the capillary cold end are sequentially arranged in the cavity along the thickness direction of the first cover plate.

9. The vapor chamber according to any one of claims 1 to 7, characterized in that: The capillary hot end and the capillary cold end are sequentially arranged in the cavity along the length direction of the first cover plate.

10. An electronic device, characterized in that: The electronic device comprises the heat spreader as described in any one of claims 1 to 9.

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