Electronic assembly and method of manufacturing the same

Abstract

The present disclosure provides an electronic component and a manufacturing method thereof, the electronic component including an electronic component body part including a body and an external electrode provided on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating part including a coating layer provided on an outer surface of the electronic component body part and a plurality of protrusions provided on the coating layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0066003, filed on June 1, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference for all purposes. TECHNICAL FIELD

[0002] The disclosure relates to an electronic component and a manufacturing method thereof. BACKGROUND

[0003] A multilayer ceramic capacitor (MLCC, a multilayer chip electronic component) is a chip capacitor mounted on a printed circuit board of various electronic products such as display devices including a liquid crystal display (LCD) and a plasma display panel (PDP), computers, smart phones, cell phones, etc., to allow charging therein and discharging therefrom.

[0004] Since the multilayer ceramic capacitor (MLCC) is relatively small and can be easily mounted while achieving a high capacitance, it is used in various types of electronic devices.

[0005] Recently, with a trend of miniaturization and higher performance of electronic devices, the multilayer ceramic capacitor has tended to be miniaturized and have a higher capacitance. With such a trend, the importance of the reliability of the multilayer ceramic capacitor has increased, and in particular, the importance of the moisture resistance reliability has increased.

[0006] In the automobile industry, with the development of electric cars, self-driving cars, etc., a larger number of multilayer ceramic capacitors are required. In addition, the multilayer ceramic capacitors used in automobiles, etc. need to guarantee more severe moisture resistance reliability conditions. SUMMARY

[0007] An aspect of the disclosure is to provide an electronic component having improved moisture resistance reliability and a manufacturing method thereof.

[0008] An aspect of the disclosure is to provide an electronic component having improved mountability and a manufacturing method thereof.

[0009] An aspect of the disclosure is to provide an electronic component having improved productivity and reduced manufacturing costs and a manufacturing method thereof.

[0010] However, the object of the disclosure is not limited to the above description, and will be more easily understood in the course of describing specific embodiments of the disclosure.

[0011] According to an aspect of the disclosure, an electronic component includes an electronic component body portion including a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode, and a coating portion including a coating layer disposed on an outer surface of the electronic component body portion and a plurality of protrusions disposed on the coating layer.

[0012] According to an aspect of the disclosure, a method of manufacturing an electronic component includes preparing an electronic component body portion including a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode, and forming a coating portion using vapor deposition, the coating portion including a coating layer disposed on an outer surface of the electronic component body portion and a plurality of protrusions disposed on the coating layer.

[0013] According to an aspect of the disclosure, an electronic component includes an electronic component body portion including a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode, and an organic material disposed on an outer surface of the electronic component body portion and including a plurality of protrusions. BRIEF DESCRIPTION OF DRAWINGS

[0014] The above and other aspects, features, and advantages of the disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0015] Figure 1 is a schematic perspective view of an electronic component according to an embodiment of the disclosure.

[0016] Figure 2 is a schematic perspective view of a body portion of the electronic component in Figure 1 except the coating portion.

[0017] Figure 3 is a cross-sectional view taken along line I-I' in Figure 1 .

[0018] Figure 4 is a schematic exploded perspective view of a body in which a dielectric layer and an inner electrode in Figure 2 are laminated.

[0019] Figure 5 is a magnified view of a P region in Figure 3 .

[0020] Figure 6 is an image captured by an atomic force microscope (AFM) showing a surface of the coating portion on a (1 µm x 1 µm) region of a central portion in a width direction and a length direction (Y direction and X direction) of a second surface of a body portion of an electronic component according to an embodiment of the disclosure.

[0021] Figure 7is a graph showing surface roughness of a coated portion measured along a measurement line L1 using an atomic force microscope (AFM). Figure 6

[0022] Figure 8A Figure 8B Figure 8C shows a process of forming a coated portion according to the present disclosure by vapor deposition.

[0023] Figure 9 shows a coated portion formed when a deposition process is performed for a very long period of time, and shows a region corresponding to region P in Figure 5

[0024] Figure 10 is a graph showing the contact angle in Table 1.

[0025] Figure 11 is a graph showing the center line average roughness Ra in Table 1. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the present disclosure will be described with reference to specific examples and accompanying drawings. However, the embodiments of the present disclosure can be modified in various other forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure can be provided to more completely describe the present disclosure to one of ordinary skill in the art. Therefore, the shape and size of the elements in the drawings can be exaggerated for the sake of description, and elements represented by the same reference numerals in the drawings can be the same elements.

[0027] The values of parameters for describing, for example, 1D dimensions of an element (including but not limited to "length", "width", "thickness", "diameter", "distance", "gap", and / or "size"), 2D dimensions of an element (including but not limited to "area" and / or "size"), 3D dimensions of an element (including but not limited to "volume" and / or "size"), and properties of an element (including but not limited to "roughness", "density", "weight", "weight ratio", and / or "molar ratio") can be obtained by methods and / or tools described in the present disclosure. However, the present disclosure is not limited thereto. Other methods and / or tools that one of ordinary skill in the art understands even if not described in the present disclosure can also be used.

[0028] In the drawings, in order to explain the present disclosure, parts irrelevant to the description will be omitted, and the thickness can be exaggerated to clearly show the layers and regions. In addition, throughout the specification, unless specifically stated otherwise, when an element is referred to as "including" or "comprising" an element, it means that the element can also include other elements in addition to the element, without departing from the description.

[0029] ​​​​In the drawings, the X direction can be defined as the second direction, the L direction, or the length direction; the Y direction can be defined as the third direction, the W direction, or the width direction; and the Z direction can be defined as the first direction, the stacking direction, the T direction, or the thickness direction.

[0030] Electronic assembly

[0031] Figure 1 is a schematic perspective view of an electronic component according to an embodiment of the present disclosure.

[0032] Figure 2 is a schematic perspective view of a main body portion of the electronic component in Figure 1 except for a coated portion.

[0033] Figure 3 is a cross-sectional view taken along line I-I' in Figure 1

[0034] Figure 4 is a schematic exploded perspective view of a main body portion in which a dielectric layer and internal electrodes in Figure 2 are laminated.

[0035] Figure 5 is a magnified view of a P region in Figure 3

[0036] Hereinafter, an electronic component 1000 according to an embodiment of the present disclosure will be described with reference to Figures 1 to 5

[0037] The electronic component 1000 according to an embodiment can include an electronic component main body portion 100 including a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131 and 132 disposed on the main body 110, and a coated portion 140 including a coated layer 140a disposed on an outer surface of the electronic component main body portion 100, and a plurality of protrusions 140b disposed on the coated layer 140a.

[0038] The electronic component main body portion 100 includes the main body 110 and the external electrodes 131 and 132 disposed on the main body 110.

[0039] In the main body 110, the dielectric layer 111 and the internal electrodes 121 and 122 are alternately laminated.

[0040] Although a specific shape of the main body 110 is not necessarily limited, as shown in the drawings, the main body 110 can have a hexahedral shape or the like. Due to shrinkage of ceramic powder particles contained in the main body 110 during a sintering process, the main body 110 can not have a perfect hexahedral shape with completely straight lines, but can have a generally hexahedral shape as a whole.

[0041] ​​​The main body 110 can have a first surface 1 and a second surface 2 opposite each other in a thickness direction (Z direction), a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite each other in a length direction (X direction), and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and opposite each other in a width direction (Y direction).

[0042] The plurality of dielectric layers 111 forming the main body 110 can be in a sintered state, and adjacent dielectric layers 111 can be integrated with each other such that a boundary therebetween is not easily visible without using a scanning electron microscope (SEM).

[0043] According to an embodiment, a raw material for forming the dielectric layer 111 is not necessarily limited as long as sufficient capacitance can be obtained therefrom. For example, the raw material can be a barium titanate-based material, a lead complex perovskite-based material, a strontium titanate-based material, or the like. The barium titanate-based material can include BaTiO3-based ceramic powder particles. Examples of the ceramic powder particles can be (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y )O3, or the like.

[0044] According to an object of the disclosure, various ceramic additives, organic solvents, binders, dispersants, or the like can be added as raw materials for forming the dielectric layer 111 in addition to the ceramic powder particles.

[0045] The main body 110 can include a capacitor forming portion provided in the main body 110, in which a capacitor is formed and which includes a first internal electrode 121 and a second internal electrode 122 provided opposite each other with the dielectric layer 111 interposed therebetween, and an upper protective layer 112 and a lower protective layer 113 provided above and below the capacitor forming portion, respectively.

[0046] The capacitor forming portion contributes to forming a capacitance of a capacitor and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with the corresponding dielectric layers 111 interposed therebetween.

[0047] The upper protective layer 112 and the lower protective layer 113 can be formed by stacking one or two or more dielectric layers in the vertical direction on the upper and lower surfaces of the capacitor formation portion, respectively, and can serve to prevent the first and second internal electrodes 121 and 122 from being damaged by physical or chemical stress.

[0048] The upper and lower protective layers 112 and 113 can not include internal electrodes, and can include the same material as the dielectric layer 111.

[0049] The internal electrodes 121 and 122 can include the first internal electrode 121 and the second internal electrode 122. The first and second internal electrodes 121 and 122 are alternately disposed to face each other with the corresponding dielectric layer 111 of the main body 110 interposed therebetween, and can be respectively exposed to the third and fourth surfaces 3 and 4 of the main body 110.

[0050] Referring to Figure 2 and Figure 4 , the first internal electrode 121 can be spaced apart from the fourth surface 4 and can be exposed through the third surface 3, and the second internal electrode 122 can be spaced apart from the third surface 3 and can be exposed through the fourth surface 4.

[0051] In this case, the first and second internal electrodes 121 and 122 can be electrically separated from each other by the corresponding dielectric layer 111 interposed therebetween.

[0052] Referring to Figure 4 , the main body 110 can be formed by alternately stacking a ceramic green sheet on which the first internal electrode 121 is printed and a ceramic green sheet on which the second internal electrode 122 is printed, and then sintering the stacked ceramic green sheets.

[0053] The material for forming the internal electrodes 121 and 122 is not necessarily limited, and a material having improved electrical conductivity can be used. For example, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes on a ceramic green sheet, the conductive paste including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0054] A screen printing method, a gravure printing method, or the like can be used as a printing method of the conductive paste of the internal electrodes, but the present disclosure is not limited thereto.

[0055] The outer electrodes 131 and 132 can be disposed on the main body 110 and connected to the inner electrodes 121 and 122, respectively. Also, the outer electrodes 131 and 132 can include a first outer electrode 131 and a second outer electrode 132 disposed on the third surface 3 and the fourth surface 4 of the main body 110 to be connected to the first inner electrode 121 and the second inner electrode 122, respectively.

[0056] Although a structure in which the electronic package 1000 includes two outer electrodes 131 and 132 is described in the present embodiment, the number, shape, etc. of the outer electrodes 131 and 132 can be changed according to the shape of the inner electrodes 121 and 122 or other purposes.

[0057] The outer electrodes 131 and 132 can be formed of any material such as metal, etc. as long as it has electrical conductivity, and can be determined in consideration of electrical properties, structural stability, etc. Also, each of the outer electrodes 131 and 132 can have a multi-layer structure.

[0058] For example, the outer electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110, and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0059] According to the present disclosure, the organic acid and molten tin (Sn) can easily penetrate into the outer electrodes 131 and 132 through the area of the coating layer 140a where the protrusions 140b are not disposed (e.g., the area where the coating 140 is partially thin during the soldering process) to improve mountability. Thus, even when the outer electrodes 131 and 132 include the electrode layers 131a and 132a disposed on the main body 110 and the plating layers 131b and 132b formed on the electrode layers 131a and 132a and the coating 140 is disposed on the plating layers 131b and 132b, improved mountability can be achieved.

[0060] As a more detailed example of the electrode layers 131a and 132a, each of the electrode layers 131a and 132a can be a sintered electrode including a conductive metal and glass or a resin-based electrode including a conductive metal and resin.

[0061] Alternatively or additionally, the electrode layers 131a and 132a can have a form in which the sintered electrode and the resin-based electrode are sequentially formed on the main body. The electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal to the main body, or can be formed by transferring a sheet including a conductive metal to a sintered electrode.

[0062] A material having improved electrical conductivity can be used as the conductive metal included in the electrode layers 131a and 132a, and the present disclosure is not limited thereto. For example, the conductive metal can be at least one of nickel (Ni), copper (Cu), and alloys thereof.

[0063] As a more detailed example of the plating layers 131b and 132b, the plating layers 131b and 132b can be Ni plating layers or Sn plating layers, and can have a structure in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, or a structure in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed. Alternatively or additionally, the plating layers 131b and 132b can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0064] The coating portion 140 can include a coating layer 140a disposed on an outer surface of the electronic component body portion 100 and a plurality of protrusions 140b disposed on the coating layer 140a.

[0065] Since the body prepared by sintering ceramic powder particles is formed by high-temperature sintering, a metal oxide having high surface energy can be exposed to the outside. Accordingly, the body surface has high hydrophilicity and has a structure in which ion migration easily occurs by condensation of water on the body surface under high-temperature and high-humidity conditions. The term "ion migration" refers to a phenomenon in which a conductive metal is dissolved and ionized in the surface, boundary surface, and interior of an insulator to migrate and precipitate.

[0066] A method of coating a material having low surface energy on the body surface has been proposed to prevent ion migration. However, since not only the outer surface of the body but also the outer electrode is coated, the electrical connectivity of the outer electrode is deteriorated. In addition, defects such as slippage or non-mounting can occur during a process of performing reflow soldering on a printed circuit board (PCB) using Sn.

[0067] Accordingly, in the related art, a coating prevention portion is provided to prevent the surface of the outer electrode from being coated. After coating is completed, the coating prevention portion is removed. Alternatively, the body and the outer electrode are entirely coated, and then the portion coated on the outer electrode is individually removed. Accordingly, productivity can be reduced or manufacturing costs can be increased.

[0068] According to the present disclosure, since the coating portion 140 includes the coating layer 140a disposed on the outer surface of the electronic component body portion 100 and the plurality of protrusions 140b disposed on the coating layer 140a, moisture-proof reliability can be improved, and mountability can be ensured and electrical connectivity can be improved through the area of the coating layer 140a in which the protrusions 140b are not disposed.

[0069] Therefore, a process for preventing the coating portion 140 from being disposed on the outer electrodes 131 and 132 or a process for removing the coating portion 140 formed on the outer electrodes 131 and 132 is not required, and thus, the productivity of the electronic package 1000 can be improved and the manufacturing cost can be reduced.

[0070] The coating layer 140a can substantially seal the pores or cracks of the electronic package body portion 100 to prevent moisture from penetrating into the body 110 through the outer surface of the body 110. In addition, since the organic acid or molten Sn can easily penetrate into the outer electrodes 131 and 132 through the region of the coating layer 140a in which the protrusions 140b are not disposed (for example, the locally thin region of the coating portion 140), the mountability can be improved.

[0071] According to the present disclosure, since the coating layer 140a can have a thin portion or a locally broken region, sufficient moisture-proof reliability improvement effects can not be obtained only through the coating layer 140a. However, since the plurality of protrusions 140b are disposed on the coating layer 140a, sufficient moisture-proof reliability can be ensured even in a high-temperature and high-humidity environment.

[0072] The coating layer 140a is disposed in contact with the outer surface of the outer electrodes 131 and 132, and can be disposed in contact with the region of the outer surface of the body 110 in which the outer electrodes 131 and 132 are not disposed.

[0073] Figure 6 is an image of the surface of the coating portion disposed on a (1 µm x 1 µm) region of the central portion in the width direction and the length direction (Y direction and X direction) of the second surface of the body of the electronic package according to an embodiment of the present disclosure, captured by an atomic force microscope (AFM). From Figure 6 It can be seen that the height of the brightest portion is 3.5 nm, the height of the darkest portion is -3.0 nm, and the coating portion includes a coating layer (dark portion) and a plurality of protrusions (bright portion) disposed on the coating layer.

[0074] The average thickness of the coating portion 140 can be 5 nm to 30 nm.

[0075] When the average thickness of the coating portion 140 is less than 5 nm, it can be difficult to ensure that the contact angle of the coating portion 140 with water is greater than or equal to 100 degrees. When the contact angle of the coating portion 140 is less than 100 degrees, the moisture-proof reliability improvement effect can be insufficient.

[0076] On the other hand, when the average thickness of the coated portion 140 is greater than 30 nm, it can be difficult to achieve a locally thin region in the coated portion. Thus, the organic acid and molten tin (Sn) can be difficult to penetrate into the outer electrodes 131 and 132 during a soldering process, which results in degraded mountability. In addition, the electrical connectivity of the outer electrodes 131 and 132 can be degraded, and it can be difficult to achieve a structure in which the coated portion 140 can include the coated layer 140a and the plurality of protrusions 140b.

[0077] In one example, referring to Figure 6 , the average thickness of the coated portion 140 can be an average value of the thickness of the coated portion measured using an ellipsometer with respect to a specific line L1 having a length of, for example, 400 nm selected in a (1 μm x 1 μm) region of a central portion in the width direction and the length direction (Y direction and X direction) of the first surface or the second surface of the main body. The ellipsometer is an instrument that can measure a difference in a polarization state between incident light and reflected light on a surface of a thin film to measure the thickness, reflectivity, etc. of the thin film.

[0078] At least one of the plurality of protrusions 140b can have a height tb that is greater than or equal to 3 nm.

[0079] When the height tb of at least one of the plurality of protrusions 140b is less than 3 nm, the average thickness of the coated portion 140 can be less than 5 nm and the moisture-proof reliability improvement effect can be insufficient.

[0080] The height tb of the protrusion can be measured by observing a surface of the coated portion with an atomic force microscope (AMF).

[0081] In one example, the height tb of the protrusion can be a difference At between a valley and a ridge in a graph of surface roughness measured along a specific line L1 having a length of 400 nm selected in a (1 μm x 1 μm) region of a central portion in the width direction and the length direction (Y direction and X direction) of the first surface or the second surface of the main body using an atomic force microscope (AMF).

[0082] From Figure 7 a surface roughness graph obtained from the surface roughness of the coated portion in Figure 6 along L1) it can be seen that the difference At between the valley and the ridge is 3.875 nm, and a sufficient protrusion is formed.

[0083] In addition, the height tb of the protrusion 140b can be greater than twice the thickness ta of the coated layer 140a. Specifically, this is because the height tb of the protrusion 140b can be greater than or equal to twice the thickness ta of the coated layer 140a, to cause the coated portion 140 to have an average thickness of 5 nm to 30 nm.

[0084] A center line average roughness Ra of a surface of the coating portion can be greater than or equal to 0.3 nm.

[0085] As an example, the center line average roughness Ra of the surface of the coating portion can be a value obtained based on Equation 1 from a surface roughness graph measured using an atomic force microscope (AMF) along a specific line L1 having a length of 400 nm selected in a (1 µm x 1 µm) region of a central portion in a width direction and a length direction of the first surface or the second surface of the body. For example, the center line average roughness Ra is expressed in nm, and is a value obtained by dividing an area of roughness by a measurement length based on a center line. Also, since the center line average roughness Ra is measured with respect to a line having a length of 400 nm, L in Equation 1 has a length of 400 nm and the center line is Figure 7 a line in a horizontal axis direction in which a vertical axis is 0.

[0086] Equation 1:

[0087]

[0088] A contact angle of the coating portion 140 with water can be greater than or equal to 100 degrees. This is because when the contact angle of the coating portion 140 with water is less than 100 degrees, the moisture-proof reliability improvement effect can be insufficient.

[0089] The width of the protrusion 140b need not be limited, but the width of the protrusion 140b can be, for example, 30 nm to 100 nm. Specifically, this is because the width of the protrusion 140b can be 30 nm to 100 nm to make the coating portion 140 have an average thickness of 5 nm to 30 nm.

[0090] The area occupied by the plurality of protrusions 140b need not be limited, but the area occupied by the plurality of protrusions 140b can be, for example, 10% to 60% of the total area of the coating portion 140. Specifically, this is because the area occupied by the plurality of protrusions 140b is 10% to 60% of the total area of the coating portion 140 to make the coating portion 140 have an average thickness of 5 nm to 30 nm.

[0091] The coating portion 140 can include a siloxane-based polymer and / or a fluorine-based polymer. The siloxane-based polymer and the fluorine-based polymer can have low surface energy and have a hydrophobic property to improve moisture-proof reliability. Also, the siloxane-based polymer and the fluorine-based polymer can easily implement the coating portion 140 of the present disclosure using vapor deposition. In this case, the coating portion 140 can include or be made of an organic material.

[0092] Since the coating layer 140a and the protrusion 140b can be formed using a single process, they can include the same material.

[0093] A method for preparing the coating portion 140 is not necessarily limited, and the coating portion 140 can be formed using atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), or the like.

[0094] The coating layer 140a' can have one or more openings. This is because the growth of the coating layer 140a' can not be sufficient in a particular area, and thus can exist in the form of a crack, as shown in Figure 8B

[0095] In this case, the area of the one or more openings can be greater than 0 and less than or equal to 10% of the total area of the coating layer 140a'. This is because, when the area of the one or more openings is greater than 10% of the total area of the coating layer 140a', the moisture-proof reliability can be degraded.

[0096] Method of manufacturing an electronic assembly

[0097] Hereinafter, a method of manufacturing an electronic component according to another aspect of the disclosure will be described in detail. However, a description repeated with the description given in the electronic component will be omitted to avoid a repetitive description.

[0098] The method of manufacturing an electronic component according to another aspect of the disclosure can include preparing an electronic component main portion including a main body including a dielectric layer and an internal electrode and an external electrode disposed on the main body, and forming a coating portion using vapor deposition, the coating portion including a coating layer disposed on an outer surface of the electronic component main portion and a plurality of protrusions disposed on the coating layer.

[0099] Preparation of an electronic assembly body portion

[0100] The conductive paste of the internal electrode can be applied to the ceramic green sheet using a printing method or the like to print the internal electrode. The printing method of the conductive paste can be a screen printing method, a gravure printing method, or the like, but the disclosure is not limited thereto.

[0101] The ceramic green sheet on which the internal electrode is printed can be stacked and sintered to form the main body 110. The number of the stacked sheets on which the internal electrode is printed can be adjusted according to the capacitance of the capacitor.

[0102] The external electrodes 131 and 132 can be formed on the main body 110 to form the electronic component main portion 100.

[0103] The external electrodes 131 and 132 can be formed by forming the electrode layers 131a and 132a on the main body 110 and forming the plating layers 131b and 132b on the electrode layers 131a and 132a.

[0104] ​The method of forming the electrode layers 131a and 132a is not necessarily limited, and the electrode layers 131a and 132a can be formed by coating a paste including a conductive metal and glass, a paste including a conductive metal and a resin, or the like. Alternatively or additionally, the electrode layers 131a and 132a can be formed by a method of transferring a sheet including a conductive metal to the body 110 or a method of transferring a sheet including a conductive metal to a sintered electrode.

[0105] Forming a coating portion

[0106] The coating portion 140 can be formed on the outer surface of the electronic component body portion 100 using vapor deposition.

[0107] The vapor deposition of forming the coating portion 140 can be atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), or the like.

[0108] When using initiated chemical vapor deposition (iCVD), which is a type of CVD, the formation of the coating portion 140 can be more easily achieved. This is because ALD, MLD, or the like can result in the coating portion having a uniform and significantly low thickness, making it difficult to ensure moisture-proof reliability when the coating portion includes a coating layer and a plurality of protrusions. Furthermore, iCVD can achieve a structure in which the coating portion includes a coating layer and a plurality of protrusions while achieving a suitable thickness.

[0109] According to iCVD, a monomer M of a polymer constituting the coating portion 140 in a chamber can be evaporated to form the coating portion 140 by a gas-phase polymerization reaction in which a polymerization reaction of the polymer and a film-forming process are simultaneously performed. The initiator I and the monomer M can be evaporated by iCVD, and thus a chain polymerization reaction can be performed using a free radical R in the gas phase to deposit the coating portion on the surface of the electronic component body portion 100.

[0110] As a detailed example, a monomer M of a siloxane-based polymer and / or a fluorine-based polymer can be evaporated into a gas phase to form the coating portion 140 by a gas-phase polymerization reaction in which a polymerization reaction of the polymer and a film-forming process are simultaneously performed.

[0111] Figure 8A 、 Figure 8B and Figure 8C A process of forming a coating portion according to the present disclosure by vapor deposition is shown.

[0112] Referring to Figure 8A At the start of the deposition process, the coating material 40b starts to adhere to a portion of the surface of the body 110.

[0113] Referring to Figure 8BAs the deposition process is further performed, the coated material adhering to the portion of the surface of the main body 110 starts to be divided into a thin coated layer 140a' and a protrusion 140b'.

[0114] Referring to Figure 8C As the deposition process is further performed, a coated portion 140 including a coated layer 140a and a plurality of protrusions 140b can be formed to obtain the electronic assembly 1000.

[0115] When the deposition process is performed for a very short period of time, a coated portion 40 in which a coated layer and a protrusion are not distinguished can be implemented to have a uniform thickness, and the average thickness of the coated portion 40 can be increased to deteriorate the electrical connectivity of the external electrode, as shown in Figure 9

[0116] It is necessary to appropriately adjust the time required for the deposition process so that the coated portion 140 can include a coated layer 140a disposed on the outer surface of the electronic assembly main body portion 100 and a plurality of protrusions 140b disposed on the coated layer 140a.

[0117] The coated layer 140a' can have one or more openings. As shown in Figure 8B , this is because the growth of the coated layer 140a' is not sufficient in a particular area, and thus the coated layer 140a' can exist in the form of a partial breakage.

[0118] In this case, the area of the one or more openings can be less than or equal to 10% of the total area of the coated layer 140a'. This is because, when the area of the one or more openings is greater than 10% of the total area of the coated layer 140a', the moisture-proof reliability can be deteriorated.

[0119] Example

[0120] A siloxane-based polymer was evaporated to form a coated portion having an average thickness listed in Table 1 on the surface of a capacitor sheet through a vapor phase polymerization reaction. Accordingly, sample sheets were prepared, and then the contact angle and the center line average roughness Ra of each of the samples were listed in Table 1. In addition, a poor mountability test was performed on the samples, and the test results were listed in Table 1.

[0121] The average thickness of the coated portion is an average value of the thickness of the coated portion measured using an ellipsometer with respect to a specific line L1 having a length of 400 nm selected in a (1 µm x 1 µm) region of a central portion in the width direction and the length direction (Y direction and X direction) of the second surface of the main body.

[0122] The contact angle is listed as an average value of values obtained by measuring the contact angle with water in a specific five points of a (1 µm x 1 µm) region by using a contact angle measuring instrument. ​

[0123] The center line average roughness Ra is expressed in nm and is a value obtained by dividing the area of the roughness by the measurement length based on the center line in a surface roughness graph measured with respect to a measurement line using an atomic force microscope (AFM).

[0124] The number of samples pieces indicating poor mountability. 12 sample pieces in each of the samples were soldered on a substrate. A case where a tombstone or both of the outer electrodes were not fixed occurred was determined as a failure. The term "tombstone" refers to a phenomenon in which one of the two outer electrodes is lifted up, thereby causing the piece to rise upward.

[0125] Table 1

[0126]

[0127] In the case of sample Nos. 1 to 3 in which the average thickness of the coating portion was less than 5 nm, the contact angle of 100 degrees or more could not be ensured, so that the moisture-proof reliability was deteriorated.

[0128] In the case of sample No. 9 in which the average thickness of the coating portion was more than 30 nm, poor mountability occurred.

[0129] Further, in the case of sample Nos. 4 to 8 in which the average thickness of the coating portion was 5 nm to 30 nm, the contact angle was 100 degrees or more, so that the moisture-proof reliability was improved and no poor mountability occurred.

[0130] Referring to a graph showing the contact angle in Table 1 Figure 10 and a graph showing the center line average roughness Ra in Table 1 Figure 11 It can be confirmed that the contact angle of 100 degrees or more can be stably ensured from 5 nm (average thickness of the coating portion), and the center line average roughness Ra of 0.3 nm or more can be stably ensured.

[0131] As described above, the coating portion including the coating layer and the plurality of protrusions provided on the coating layer can be provided on the outer surface of the electronic component main body portion to improve the moisture-proof reliability.

[0132] In addition, the mountability can be ensured by the region of the coating portion in which the protrusions are not provided.

[0133] Further, the coating portion can be implemented using vapor deposition to improve productivity and reduce manufacturing costs.

[0134] Although embodiments have been shown and described above, it will be obvious to those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. An electronic component, comprising: An electronic component body includes a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode; as well as The coating portion includes a coating layer disposed on the outer surface of the electronic component body and a plurality of protrusions disposed on the coating layer. The coating layer includes a first region having the protrusions and a second region located between the first region and without the protrusions.

2. The electronic component according to claim 1, wherein, The coating has an average thickness of 5 nm to 30 nm.

3. The electronic component according to claim 1, wherein, At least one of the plurality of protrusions has a height of 3 nm or more.

4. The electronic component according to any one of claims 1-3, wherein, The average roughness of the centerline of the coated part is greater than or equal to 0.3 nm.

5. The electronic component according to any one of claims 1-3, wherein, The contact angle between the coated part and water is greater than or equal to 100 degrees.

6. The electronic component according to any one of claims 1-3, wherein, The coating portion comprises siloxane polymers and / or fluoropolymers.

7. The electronic component according to any one of claims 1-3, wherein, The coating and the protrusion are made of the same material.

8. The electronic component according to any one of claims 1-3, wherein, The coating layer has one or more openings.

9. The electronic component according to claim 8, wherein, The area of ​​the one or more openings is greater than 0 and less than or equal to 10% of the total area of ​​the coating layer.

10. The electronic component according to any one of claims 1-3, wherein, The coating layer contacts the outer surface of the external electrode and also contacts the area on the outer surface of the body where the external electrode is not located.

11. The electronic component according to any one of claims 1-3, wherein, The external electrode includes an electrode layer disposed on the main body and a plating layer disposed on the electrode layer.

12. A method for manufacturing an electronic component, the method comprising: An electronic component body portion is fabricated, the electronic component body portion including a body and an external electrode disposed on the body, the body including a dielectric layer and an internal electrode; as well as A coating is formed using vapor deposition, the coating comprising a coating layer disposed on the outer surface of the electronic component body and a plurality of protrusions disposed on the coating layer. The coating layer includes a first region having the protrusions and a second region located between the first region and without the protrusions.

13. The method according to claim 12, wherein, The coating has an average thickness of 5 nm to 30 nm.

14. The method according to claim 12 or 13, wherein, At least one of the plurality of protrusions has a height of 3 nm or more.

15. The method according to claim 12 or 13, wherein, The external electrode includes an electrode layer disposed on the main body and a plating layer disposed on the electrode layer.

16. The method according to claim 12 or 13, wherein, The vapor deposition includes initiation chemical vapor deposition.

17. An electronic component, comprising: An electronic component body includes a body and an outer electrode disposed on the body, the body including a dielectric layer and an inner electrode; as well as An organic material is disposed on the outer surface of the electronic component body and includes multiple protrusions. The organic material includes a first region having the protrusions formed thereon and a second region located between the first region and without the protrusions formed thereon.

18. The electronic component according to claim 17, wherein, The organic materials include siloxane polymers and / or fluoropolymers.

19. The electronic component according to claim 17, wherein, At least one of the plurality of protrusions has a height of 3 nm or more.

20. The electronic component according to any one of claims 17-19, wherein, The organic material has an average thickness of 5 nm to 30 nm.

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