Tile-type electrostatic chuck

Abstract

The tile-shaped electrostatic chuck of the present application includes a plurality of electrostatic chucks arranged in a matrix form having M rows and N columns, the M and the N each being 0 or a natural number, each of the plurality of electrostatic chucks including a first insulating layer including an upper surface and a side surface, a first electrode pattern disposed on the upper surface of the first insulating layer, a second electrode pattern disposed on the side surface of the first insulating layer and electrically connected to the first electrode pattern, and a second insulating layer disposed on the first insulating layer so as to cover the first electrode pattern.

Description

Technical Field

[0001] This invention relates to tiled electrostatic chucks, and more specifically, to tiled electrostatic chucks that improve the reliability and efficiency of products and processes. Background Technology

[0002] Recently, electrostatic chucks utilizing electrostatic forces have become widely used. An electrostatic chuck is a device that uses electrostatic forces to fix substrates or similar components to electrodes. Electrostatic chucks can be broadly classified into two types: monopolar chucks, which generate a potential difference between one electrode and the substrate to attract the substrate, and bipolar chucks, which generate a potential difference between two or more electrodes to attract the substrate. Monopolar chucks have weak electrostatic forces and require high voltages, making them unsuitable for large substrates. Conversely, bipolar chucks have strong electrostatic forces and can attract substrates even at low voltages, making them suitable for attracting large substrates. Summary of the Invention

[0003] An embodiment of the present invention aims to provide a tile-type electrostatic chuck that has multiple small-sized electrostatic chucks with side electrode patterns and can adsorb large-area substrates by combining the multiple electrostatic chucks.

[0004] An embodiment of the present invention aims to solve the inefficiencies in manufacturing cost, time, and difficulty of large-size electrostatic chucks for adsorbing large-area substrates.

[0005] In various embodiments, the tile-type electrostatic chuck includes a plurality of electrostatic chucks arranged in a matrix with M rows and N columns, where M and N are 0 or natural numbers. Each of the plurality of electrostatic chucks includes: a first insulating layer including an upper surface and a side surface; a first electrode pattern disposed on the upper surface of the first insulating layer; a second electrode pattern disposed on the side surface of the first insulating layer and electrically connected to the first electrode pattern; and a second insulating layer disposed on the first insulating layer to cover the first electrode pattern.

[0006] Alternatively, any one of the plurality of electrostatic chucks may be electrically connected to a power source.

[0007] Alternatively, the sides of each of the plurality of electrostatic chucks may face each other, and the second electrode patterns of each may be electrically connected to each other.

[0008] Alternatively, the plurality of electrostatic chucks may be arranged such that their respective second electrode patterns are in contact with each other in a first direction or a second direction intersecting the first direction.

[0009] Alternatively, the first electrode pattern and the second electrode pattern may each include an anode pattern and a cathode pattern alternately arranged in the second direction.

[0010] The side may include a first side in a first direction and a second side in a second direction intersecting the first direction, wherein the second electrode pattern is disposed on at least one of the first side and the second side.

[0011] It can be that multiple first electrode patterns and second electrode patterns are respectively provided, and the second electrode pattern disposed on the first side and the second side adjacent to the first side among the multiple second electrode patterns is connected to half of the first electrode pattern among the multiple first electrode patterns.

[0012] Alternatively, the plurality of electrostatic chucks may each have a hexahedral shape.

[0013] (Invention Effects)

[0014] One embodiment of the present invention can ensure high flatness and is more efficient in terms of manufacturing cost, time and difficulty compared to manufacturing a large-size electrostatic chuck in one go.

[0015] In one embodiment of the present invention, when a defect occurs, only the defective electrostatic chuck among the multiple electrostatic chucks that are combined needs to be repaired, thus achieving high efficiency. Attached Figure Description

[0016] Figure 1 This is a perspective view of an electrostatic chuck according to an embodiment of the present invention.

[0017] Figure 2 This is a cross-sectional view of an electrostatic chuck according to an embodiment of the present invention.

[0018] Figure 3 This is a cross-sectional view of an electrostatic chuck according to an embodiment of the present invention.

[0019] Figure 4 This is a perspective view illustrating a first electrode pattern and a second electrode pattern according to an embodiment of the present invention.

[0020] Figure 5 This is a perspective view illustrating a first electrode pattern and a second electrode pattern according to an embodiment of the present invention.

[0021] Figure 6 This is a perspective view of a tile-type electrostatic chuck according to an embodiment of the present invention.

[0022] Figure 7 This is a perspective view of a tile-type electrostatic chuck according to an embodiment of the present invention.

[0023] Figures 8a to 8d This is a diagram illustrating a method for manufacturing an electrostatic chuck according to an embodiment of the present invention.

[0024] Figure 9 This is a cross-sectional view of an electrostatic chuck according to an embodiment of the present invention.

[0025] (Symbol Explanation)

[0026] EC: Electrostatic chuck; TEC: Tiled electrostatic chuck; GL: Substrate; 1IL: First insulating layer; 2IL: Second insulating layer; 1EP: First electrode pattern; 2EP: Second electrode pattern. Detailed Implementation

[0027] In this specification, when it is mentioned that a certain component (or region, layer, part, etc.) is located on, connected to or combined with other components, it means that it can be directly configured / connected / combined with other components, or a third component can be configured therein.

[0028] The same symbols refer to the same constituent elements. Furthermore, in the accompanying drawings, the thickness, proportions, and dimensions of the constituent elements are exaggerated for the purpose of effectively illustrating the technical content. "And / or" includes all combinations of more than one of the relevant constituent elements.

[0029] The terms "first," "second," etc., can be used to describe various constituent elements, but the constituent elements described should not be limited to these terms. These terms are used only for the purpose of distinguishing one constituent element from another. For example, without departing from the scope of this invention, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element. Singular expressions include plural expressions unless explicitly stated otherwise in the text.

[0030] Additionally, terms such as "below," "on the lower side," "above," and "on the upper side" are used to explain the connection relationships between the components in the diagram. These terms are relative concepts and are explained based on the direction shown in the diagram.

[0031] Terms such as “including” or “having” should be understood as referring to the presence of features, figures, steps, operations, constituent elements, components, or combinations thereof as recorded in the instruction manual, and do not preclude the existence or additional possibilities of one or more other features, figures, steps, operations, constituent elements, components, or combinations thereof.

[0032] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by those skilled in the art. Furthermore, terms defined in commonly used dictionaries shall be interpreted as having a consistent meaning in the relevant technical context, and are hereby explicitly defined, provided they are not interpreted as having an ideal or overly formal meaning.

[0033] When performing various processing steps on the substrate of a display device, the substrate is processed within a process chamber. A space is formed inside the process chamber, which serves as a location for performing processes such as plasma treatment on the substrate. An electrostatic chuck is disposed inside this process chamber. The electrostatic chuck uses electrostatic force to attract and fix the substrate. A bipolar electrostatic chuck with two electrodes is generally used. This invention discloses such an electrostatic chuck. This invention provides an electrostatic chuck capable of arranging multiple block-type electrostatic chucks in a tile-like manner to attract and fix large-area substrates.

[0034] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0035] Figure 1 This is a perspective view of an electrostatic chuck EC according to an embodiment of the present invention. Figure 1 This refers to the electrostatic chuck EC and the substrate GL that is attracted and fixed by the electrostatic chuck EC. Figure 2 This is a cross-sectional view of an electrostatic chuck EC according to an embodiment of the present invention. Figure 2 It was cut off Figure 1 A sectional view of the section I-I'. Figure 3 This is a cross-sectional view of an electrostatic chuck EC according to an embodiment of the present invention. Figure 3 Equivalent to observing in the second direction DR2 Figure 1 A cross-sectional view of the electrostatic chuck EC.

[0036] Reference Figures 1 to 3The electrostatic chuck EC includes a first insulating layer 1IL, a second insulating layer 2IL, a first electrode pattern 1EP, and a second electrode pattern 2EP. The first insulating layer 1IL and the second insulating layer 2IL may include dielectric materials. The first insulating layer 1IL provides a base surface for configuring the first electrode pattern 1EP. The second insulating layer 2IL can cover the first electrode pattern 1EP. A substrate GL can be magnetically attached to the second insulating layer 2IL. The second insulating layer 2IL provides a flat surface for fixing the substrate GL. When a voltage is applied to the first electrode pattern 1EP, the positive and negative charges within the dielectric material of the second insulating layer 2IL will polarize. This induces polarization in adjacent substrates GL, and through the electrostatic attraction generated between the second insulating layer 2IL and the substrate GL, the substrate GL can be fixed to the electrostatic chuck EC.

[0037] In one embodiment, the electrostatic chuck EC may have a hexahedral shape. The first insulating layer 1IL may also have a hexahedral shape. The second insulating layer 2IL may be configured as a hexahedron overlapping the first insulating layer 1IL in the normal direction. The thickness of the second insulating layer 2IL may be less than the thickness of the first insulating layer 1IL. The area of ​​the second insulating layer 2IL on the plane may be equal to the area of ​​the first insulating layer 1IL.

[0038] A first electrode pattern 1EP may be disposed on the upper surface US of the first insulating layer 1IL. A second electrode pattern 2EP may be disposed on the side SS of the first insulating layer 1IL. The second electrode pattern 2EP is exposed to the outside. The first electrode pattern 1EP and the second electrode pattern 2EP may be electrically connected. The first electrode pattern 1EP and the second electrode pattern 2EP may have positive or negative electrodes. The first electrode pattern 1EP and the second electrode pattern 2EP may have the same electrodes.

[0039] The first electrode pattern 1EP can be a line shape extending in the first direction DR1. Multiple first electrode patterns 1EP can be provided. Each of the multiple first electrode patterns 1EP can have a line shape extending in the first direction DR1 and be arranged in a second direction DR2 that intersects the first direction DR1. The first electrode pattern 1EP can be a line shape.

[0040] The second electrode pattern 2EP can be connected to one end of the first electrode pattern 1EP. The second electrode pattern 2EP can extend from one end of the first electrode pattern 1EP to the side surface SS. Multiple second electrode patterns 2EP can be provided. Each second electrode pattern 2EP can extend on a third direction DR3 orthogonal to the first electrode pattern 1EP and be arranged on a second direction DR2. The second electrode pattern 2EP can have a line shape. The second electrode pattern 2EP can be configured on a side surface SS extending from one end of the first electrode pattern 1EP, and the second electrode pattern 2EP may not be configured on other sides adjacent to this side surface SS.

[0041] Although four first electrode patterns 1EP and two electrode patterns 2EP are shown in the accompanying drawings, there can be more than four first electrode patterns 1EP and two electrode patterns 2EP. In one embodiment, the second electrode pattern 2EP can be connected to both ends of the first electrode pattern 1EP and can be configured on two side surfaces SS. Therefore, the number of second electrode patterns 2EP can be twice the number of first electrode patterns 1EP.

[0042] In one embodiment, the first electrode pattern 1EP and the second electrode pattern 2EP may each include an anode pattern 1EP-1, 2EP-1 providing a positive electrode and a cathode pattern 1EP-2, 2EP-2 providing a negative electrode. The anode patterns 1EP-1, 2EP-1 and the cathode patterns 1EP-2, 2EP-2 may be configured alternately. The anode pattern 1EP-1 of the first electrode pattern 1EP and the anode pattern 2EP-1 of the second electrode pattern 2EP are electrically connected, and the cathode patterns 1EP-2 of the first electrode pattern 1EP and the cathode pattern 2EP-2 of the second electrode pattern 2EP are electrically connected.

[0043] The first electrode pattern 1EP or the second electrode pattern 2EP can be used with the power supply PS (refer to...). Figure 6 It is connected to receive the application of positive and negative voltages.

[0044] Figure 4 This is a perspective view illustrating a first electrode pattern 1EP and a second electrode pattern 2EP according to an embodiment of the present invention. Figure 5 This is a perspective view illustrating a first electrode pattern 1EP and a second electrode pattern 2EP according to an embodiment of the present invention.

[0045] exist Figure 4 and Figure 5In this embodiment, the first insulating layer 1IL may include an upper surface US and a side surface SS. In one embodiment, the side surface SS may include a first side surface 1SS and a second side surface 2SS adjacent to the first side surface 1SS. A first electrode pattern 1EP is disposed on the upper surface US of the first insulating layer 1IL, and a second electrode pattern 2EP is disposed on the side surface SS of the first insulating layer 1IL. The second electrode pattern 2EP may be disposed on both the first side surface 1SS and the second side surface 2SS. That is, the second electrode pattern 2EP may be provided on all four sides connecting the upper surface US and the lower surface of the hexahedral-shaped first insulating layer 1IL.

[0046] The first electrode pattern 1EP may have a curved line shape. Multiple first electrode patterns 1EP may be provided. Of the multiple first electrode patterns 1EP extending in the first direction DR1, half may have a shape curved towards one side of the second direction DR2, and the remaining half may have a shape curved towards the other side of the second direction DR2. The two ends of each of the multiple first electrode patterns 1EP may be electrically connected to a second electrode pattern 2EP disposed on the side surface SS. In one embodiment, one end of the second electrode pattern 2EP disposed on the first side surface 1SS may be connected to one end of the first electrode pattern 1EP, and one end of the second electrode pattern 2EP disposed on the second side surface 2SS may be connected to the other end of the same first electrode pattern 1EP.

[0047] exist Figure 4 In this configuration, the second electrode pattern 2EP can have a line shape extending in the third direction DR3. The second electrode pattern 2EP can be configured only in a portion of the side surfaces (1SS, 2SS).

[0048] exist Figure 5 In this configuration, the second electrode pattern 2EP can have a curved line shape. The second electrode pattern 2EP can be configured to cover all areas of the side SS.

[0049] The first side surface 1SS and the second side surface 2SS can be orthogonal to the upper surface US. Therefore, the second electrode pattern 2EP can be orthogonal to the first electrode pattern 1EP.

[0050] Figure 6 This is a perspective view of a tile-type electrostatic chuck TEC according to an embodiment of the present invention. Figure 7 This is a perspective view of a tile-type electrostatic chuck TEC according to an embodiment of the present invention.

[0051] Reference Figure 6 and Figure 7 The tile-type electrostatic chuck TEC includes multiple electrostatic chucks EC. Each of the multiple electrostatic chucks EC can be equivalent to... Figures 1 to 5This invention relates to an electrostatic chuck (EC) in one embodiment. Multiple electrostatic chucks (ECs) can be electrically connected to each other. The multiple electrostatic chucks (ECs) can be arranged in a matrix form with M rows and N columns. M and N are 0 or natural numbers. Figure 6 In this context, either M or N can be 0. Figure 7 The diagram shows a configuration where both M and N are 2.

[0052] The substrate GL can be magnetically attached to the tile-type electrostatic chuck TEC. The substrate GL can be equivalent to a large-area substrate GL. Multiple electrostatic chucks EC can each magnetically attach and attach the large-area substrate GL. The substrate GL can be fixed to the second insulating layer 2IL of each of the multiple electrostatic chucks EC. In the case of the tile-type electrostatic chuck TEC, since each of the multiple electrostatic chucks EC is manufactured separately, it is easy to ensure the flatness of the second insulating layer 2IL. Therefore, compared with a typical large-area electrostatic chuck EC, the flatness of the upper surface of the second insulating layer 2IL that abuts against the substrate GL is higher.

[0053] Multiple electrostatic chucks (ECs) can be connected with their sides (SS) facing each other. A second electrode pattern (2EP) is arranged on the side (SS) of each of the multiple electrostatic chucks (ECs). The second electrode patterns (2EP) of each of the multiple electrostatic chucks (ECs) can contact each other. That is, the multiple electrostatic chucks (ECs) can be electrically connected to each other through the second electrode patterns (2EP). Therefore, by connecting one of the multiple electrostatic chucks (ECs) to a power supply (PS), voltage can be applied to the entire tile-type electrostatic chuck (TEC).

[0054] Multiple electrostatic chucks EC can be arranged in a first direction DR1 or a second direction DR2 intersecting the first direction DR1, with the second electrode pattern 2EP in contact with each other.

[0055] The area of ​​the tile-type electrostatic chuck TEC can be variably determined based on the area of ​​the substrate GL to be fixed. The area of ​​the tile-type electrostatic chuck TEC is determined by the number of electrostatic chucks EC arranged in the array. Therefore, when manufacturing large-area electrostatic chucks EC for fixing large-area substrates GL of varying sizes, the tile-type electrostatic chuck TEC is highly efficient in terms of both cost and time. Furthermore, in the event of a failure, with the tile-type electrostatic chuck TEC, only one or a few faulty electrostatic chucks EC among the arranged array need to be repaired, thus maintaining high efficiency.

[0056] Figures 8a to 8d This is a diagram illustrating a method for manufacturing an electrostatic chuck EC according to an embodiment of the present invention.

[0057] The method for manufacturing an electrostatic chuck EC includes: forming a plurality of first electrode patterns 1EP arranged in one direction on the upper surface US of a first insulating layer 1IL; forming a plurality of second electrode patterns 2EP on the side surface SS of the first insulating layer 1IL in such a way as to electrically connect to the plurality of first electrode patterns 1EP respectively; and configuring a second insulating layer 2IL above the first insulating layer 1IL in such a way as to cover the plurality of first electrode patterns 1EP.

[0058] exist Figure 8a In this process, a substrate layer BS can be provided for forming a first insulating layer 1IL. The first insulating layer 1IL can then be disposed on the provided substrate layer BS. The substrate layer BS may include a metal.

[0059] exist Figure 8b In this process, a first electrode pattern 1EP can be formed on the first insulating layer 1IL. The first electrode pattern 1EP can be patterned using a first mask MK1. Figure 8c In this process, a second electrode pattern 2EP can be formed after the first electrode pattern 1EP is formed. The second electrode pattern 2EP can be patterned using a second mask MK2. The first mask MK1 and the second mask MK2 can be provided respectively using masks having the same patterns as the first electrode pattern 1EP and the second electrode pattern 2EP.

[0060] In the step of patterning the second electrode pattern 2EP, the first electrode pattern 1EP can be covered by a third mask MK3. The third mask MK3 can be a patternless mask used to cover the first electrode pattern 1EP in the step of forming the second electrode pattern 2EP to prevent further patterning of the first electrode pattern 1EP.

[0061] In one embodiment, the step of forming the second electrode pattern 2EP may include the first side 1SS of the first insulating layer 1IL (refer to...). Figure 4 ) and the second side 2SS (refer to) Figure 4 The step of forming a second electrode pattern 2EP on at least one side of the first insulating layer 1IL. That is, the second electrode pattern 2EP can be disposed on more than one side of the first insulating layer 1IL.

[0062] exist Figure 8dIn this process, after the first electrode pattern 1EP and the second electrode pattern 2EP are both formed, a second insulating layer 2IL covering the first electrode pattern 1EP can be disposed on the first insulating layer 1IL. The second insulating layer 2IL, like the first insulating layer 1IL, has a flat upper surface and is hexahedral in shape; the second insulating layer 2IL and the first insulating layer 1IL can have the same area. The second insulating layer 2IL is disposed on the first insulating layer 1IL, thereby exposing the side surface SS of the first insulating layer 1IL. Therefore, the second electrode pattern 2EP can be exposed to the outside.

[0063] Figure 9 This is a cross-sectional view of an electrostatic chuck EC according to an embodiment of the present invention. (Refer to...) Figures 1 to 7 In this embodiment, multiple slots GR can be defined on the side surface SS of the first insulating layer 1IL. In one embodiment, a second electrode pattern 2EP can be disposed within the multiple slots GR. The thickness TH, which is the length of the second electrode pattern 2EP on the third-direction DR3, can be equal to the length DE of the multiple slots GR on the third-direction DR3. That is, the second electrode pattern 2EP does not protrude from the side surface SS of the first insulating layer 1IL. In this embodiment, in the case of a tile-type electrostatic chuck TEC, when the second electrode patterns 2EP of each of the multiple electrostatic chucks EC are electrically connected to each other, the side surfaces SS of each of the multiple electrostatic chucks EC can contact each other.

[0064] As described above, embodiments are disclosed in the accompanying drawings and specification. Specific terminology is used herein, but this is merely for illustrative purposes and not intended to limit the scope of the invention as set forth in the claims. Therefore, those skilled in the art will understand that various modifications and equivalent embodiments can be implemented. Thus, the true scope of protection of the invention should be determined by the technical concept of the claims.

Claims

1. A tile-type electrostatic chuck, comprising multiple electrostatic chucks arranged in a matrix with M rows and N columns, M and N are both non-zero natural numbers. The plurality of electrostatic chucks respectively include: The first insulating layer includes an upper surface and a side surface; A first electrode pattern is disposed on the upper surface of the first insulating layer; The second electrode pattern is disposed on the side of the first insulating layer and is electrically connected to the first electrode pattern; as well as A second insulating layer is disposed on the first insulating layer to cover the first electrode pattern. The side surface includes a first side surface in a first direction and a second side surface in a second direction intersecting the first direction. The second electrode pattern is disposed on the first side and the second side, one end of the first electrode pattern is electrically connected to the second electrode pattern on the first side and the other end of the first electrode pattern is electrically connected to the second electrode pattern on the second side.

2. The tile-type electrostatic chuck according to claim 1, wherein, Any one of the plurality of electrostatic chucks is electrically connected to a power source.

3. The tile-type electrostatic chuck according to claim 1, wherein, The sides of the plurality of electrostatic chucks face each other, and the second electrode patterns of the different electrostatic chucks are electrically connected to each other.

4. The tile-type electrostatic chuck according to claim 1, wherein, The plurality of electrostatic chucks are arranged such that the second electrode patterns of the different electrostatic chucks are in contact with each other in a first direction or in a second direction intersecting the first direction.

5. The tile-type electrostatic chuck according to claim 4, wherein, The first electrode pattern and the second electrode pattern respectively include an anode pattern and a cathode pattern alternately arranged in the second direction.

6. The tile-type electrostatic chuck according to claim 1, wherein, The plurality of electrostatic chucks each have a hexahedral shape.

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