A multi-layer motor control board and an assembly method

Abstract

The present application provides a multi-layer motor control board and an assembly method. The multi-layer motor control board includes: a bottom PCB board, a top PCB board, and a constant-height soldering platform; the bottom PCB board is provided with a plurality of first positioning holes, and the bottom PCB board is connected with an IPM and a signal pin connector; the top PCB board is provided with a plurality of second positioning holes, and the bottom PCB board is provided with signal connection holes; the signal connection holes are used for being inserted together with the signal pin connector; the constant-height soldering platform is fixed with a plurality of support columns, and the plurality of first positioning holes and the plurality of second positioning holes respectively correspond to the plurality of support columns one by one. In the above technical solution, by assembling the bottom PCB board and the top PCB board together, a multi-layer control board for controlling a motor is formed; through the provided constant-height soldering platform, the bottom PCB board and the top PCB board can be quickly assembled together, thereby improving work efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of motor control, and particularly to a multi-layer motor control board and an assembly method. Background Art

[0002] With the development of ventilation technology, the requirements for intelligence and energy conservation in the industrial air supply industry are getting higher and higher. With the introduction of new energy efficiency requirements, traditional AC motors are being gradually replaced by energy-saving, high-efficiency, and intelligent integrated brushless DC motors. Currently, the product update and replacement speed in the foreign market is quite fast, and the domestic market follows closely. The brushless DC motor will enter a stage of explosive growth. While the brushless DC motor greatly replaces the application of AC motors, the market also puts forward more stringent requirements.

[0003] The requirements are as follows

[0004] 1) Small loss and high efficiency. Since the permanent magnet excitation is used instead of the electric excitation, the loss generated by the excitation current of the induction motor is eliminated; at the same time, the synchronous operation mode also eliminates the rotational frequency loss of the rotor core of the induction motor. This makes the operating efficiency of the EC motor much higher than that of the induction motor.

[0005] 2) Small volume and light weight. Since the brushless DC motor eliminates the slip rings and brushes for excitation, the motor structure is greatly simplified, resulting in a smaller motor volume and lighter weight. At the same time, due to the structural simplification, the mechanical reliability of the motor is enhanced and the service life is increased.

[0006] Reducing the structural volume of the motor and the controller is beneficial to reducing the windward area of the overall motor, and can fully improve the air volume performance and energy consumption level of the fan.

[0007] When designing the controller, in order to save space, the devices are arranged on two or more PCB boards, and the entire motor controller is formed through the combination form of the PCBs. However, the multi-layer circuit board structure has pain points such as complex installation methods, low efficiency, and unstable installation structures during design and installation. Summary of the Invention

[0008] The present application provides a multi-layer motor control board and an assembly method for quickly assembling the bottom-layer PCB board and the top-layer PCB board together, thereby improving production efficiency.

[0009] The present application provides a multi-layer motor control board and an assembly method. The multi-layer motor control board and the assembly method are applied to a controller for controlling a motor, and can quickly assemble the bottom-layer PCB board and the top-layer PCB board in the controller together, thereby improving production efficiency. The multi-layer motor control board is characterized by comprising: a bottom-layer PCB board, a top-layer PCB board, and a height-fixed soldering platform;

[0010] The underlying PCB board is provided with a plurality of first positioning holes, and the underlying PCB board is connected with an IPM and a signal pin connector; wherein, the underlying PCB board is further connected with through-hole devices and surface mount devices;

[0011] The top PCB board is provided with a plurality of second positioning holes, and the underlying PCB board is provided with signal connection holes; the signal connection holes are used for being inserted together with the signal pin connector, so as to connect the underlying PCB board and the top PCB board in signal;

[0012] The fixed-height soldering platform is fixed with a plurality of support columns, and the plurality of first positioning holes and the second positioning holes respectively correspond to the plurality of support columns one by one, and each support column can pass through the corresponding first positioning hole. In the above technical solution, the underlying PCB board and the top PCB board can form a multi-layer control board in a controller for controlling a motor; and the fixed-height soldering platform can assemble the underlying PCB board and the top PCB board quickly and accurately together.

[0013] In a specific feasible embodiment, a first limit post is fixed at the top end of each support column;

[0014] The first limit post is used for passing through the second positioning hole, and the plurality of support columns are used for supporting the top PCB board, so that the top PCB board and the underlying PCB board are arranged at intervals.

[0015] In a specific feasible embodiment, the fixed-height soldering platform is provided with an IPM positioning groove;

[0016] The IPM positioning groove is used for placing the IPM, so that the pads on the underlying PCB board where the IPM is located are butted against the pins of the IPM.

[0017] In a specific feasible embodiment, a plurality of second limit posts are fixedly connected in the IPM positioning groove;

[0018] The plurality of second limit posts are used for positioning the IPM in the IPM positioning groove, so as to facilitate the butting of the pads on the underlying PCB board where the IPM is located against the pins of the IPM.

[0019] In a specific feasible embodiment, a height-fixing device is arranged in the IPM positioning groove;

[0020] The height-fixing device is used for adjusting the height of the IPM in the IPM positioning groove, so as to facilitate the butting of different models of the IPM against the pads on the underlying PCB board where the IPM is located.

[0021] In a specific feasible embodiment, the height fixing device includes a plurality of height fixing grooves formed on opposite inner walls of the IPM positioning groove, and a plurality of corresponding adjustment grooves are formed on both sides of each height fixing groove; wherein, baffles are inserted into the adjustment grooves at the same horizontal height on opposite inner walls of the IPM positioning groove;

[0022] The baffle is used to carry the IPM, and by adjusting the position of the baffle in the adjustment groove, the height of the IPM in the IPM positioning groove is adjusted.

[0023] In a second aspect, a method for assembling a multi-layer motor control board is provided, which is characterized by including the following steps:

[0024] Place the IPM on the height fixing welding platform;

[0025] Place the bottom PCB board on the height fixing welding platform, and then weld the IPM and the bottom PCB board together;

[0026] Place the top PCB board on the height fixing welding platform, and then connect the top PCB board and the bottom PCB board together.

[0027] In a specific feasible embodiment, the step of placing the IPM on the height fixing welding platform is specifically as follows;

[0028] Adjust the height of the height fixing device according to the IPM model;

[0029] Place the IPM into the IPM positioning groove, and the IPM is positioned in the IPM positioning groove by the plurality of second limiting posts.

[0030] In a specific feasible embodiment, the step of placing the bottom PCB board on the height fixing welding platform and then welding the IPM and the bottom PCB board together is specifically as follows;

[0031] Pass the plurality of support posts through the corresponding first positioning holes respectively, and at this time, the pads on the bottom PCB board where the IPM is located are connected to the pins of the IPM;

[0032] Weld the pads on the bottom PCB board where the IPM is located and the pins of the IPM together.

[0033] In a specific feasible embodiment, the step of placing the top PCB board on the height fixing welding platform and then connecting the top PCB board and the bottom PCB board together is specifically as follows;

[0034] Pass the first positioning post through the second positioning hole until the plurality of support posts bear the top - layer PCB board;

[0035] Insert the signal pin connector into the corresponding signal connection hole, thereby connecting the top - layer PCB board and the bottom - layer PCB board together. Description of the Drawings

[0036] Figure 1 It is a schematic structural diagram of the bottom - layer PCB board of a multi - layer motor control board and an assembly method provided by an embodiment of the present application;

[0037] Figure 2 It is a schematic side - view structural diagram of the bottom - layer PCB board of a multi - layer motor control board and an assembly method provided by an embodiment of the present application;

[0038] Figure 3 It is a schematic structural diagram of the top - layer PCB board of a multi - layer motor control board and an assembly method provided by an embodiment of the present application;

[0039] Figure 4 It is a schematic structural diagram of a fixed - height soldering platform of a multi - layer motor control board and an assembly method provided by an embodiment of the present application;

[0040] Figure 5 It is a schematic structural diagram of the bottom - layer PCB board and the top - layer PCB board of a multi - layer motor control board and an assembly method provided by an embodiment of the present application assembled together;

[0041] Figure 6 It is a schematic structural diagram of a fixed - height device of a multi - layer motor control board and an assembly method provided by an embodiment of the present application;

[0042] Figure 7 It is a schematic structural diagram of another implementation manner of a fixed - height soldering platform of a multi - layer motor control board and an assembly method provided by an embodiment of the present application. Detailed Embodiment

[0043] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings.

[0044] To facilitate the understanding of a multi - layer motor control board and an assembly method provided by an embodiment of the present application, first, its application scenario is described. This multi - layer motor control board and assembly method are used to quickly assemble multi - layer control boards in a motor controller, thereby improving production efficiency.

[0045] The present application provides a multi-layer motor control board and an assembly method. The multi-layer motor control board is assembled from a bottom-layer PCB board and a top-layer PCB board. The top-layer PCB board is located above the bottom-layer PCB board, and the bottom-layer PCB board is signal-connected to the top-layer PCB board, thereby forming a multi-layer motor control board for controlling a motor.

[0046] Among them, when specifically setting the bottom-layer PCB board, reference can be made to Figure 1 and Figure 2 , Figure 1 is a schematic structural diagram of the bottom-layer PCB board of a multi-layer motor control board and an assembly method provided by an embodiment of the present application, Figure 2 is a schematic side view structural diagram of the bottom-layer PCB board of a multi-layer motor control board and an assembly method provided by an embodiment of the present application. According to Figure 1 and Figure 2 it can be seen that the bottom-layer PCB board is provided with a plurality of first positioning holes 2. The first positioning holes 2 can be provided with 3 to 6. Exemplarily, according to Figure 1 it can be seen that 3 first positioning holes 2 are provided, and the 3 first positioning holes 2 are evenly distributed on the bottom-layer PCB board. The diameter of each first positioning hole 2 can be 8 mm. A plurality of signal pin connectors 3 are fixedly connected to the bottom-layer PCB board, and an IPM 5 is welded in the pad 4 area on the bottom-layer PCB board; continue to refer to Figure 1 , and through-hole devices and surface-mount devices are connected to the bottom-layer PCB board 1.

[0047] In the present application, the full English name of IPM is Intelligent Power Module, that is, an intelligent power module. It not only integrates power switching devices and drive circuits, but also integrates internal fault detection circuits such as overvoltage, overcurrent, and overheating, and can send the detection signals to the CPU. The models adopted by IPM in the present application include but are not limited to models commonly used in the prior art such as PSS15S92F6-AG, etc.

[0048] When specifically setting the top-layer PCB board, reference can be made to Figure 3 , Figure 3 is a schematic structural diagram of the top-layer PCB board of a multi-layer motor control board and an assembly method provided by an embodiment of the present application. According to Figure 3 it can be seen that when specifically setting the top-layer PCB board 6, a plurality of second positioning holes 7 are provided. The second positioning holes 7 can be provided with 3 to 6. Exemplarily, according to Figure 3 it can be seen that 3 second positioning holes 7 can be provided, and the 3 second positioning holes 7 correspond to the 3 first positioning holes 2 one by one. The diameter of each second positioning hole 7 can be 3 mm; continue to refer to Figure 3, a plurality of signal connection holes 8 are further provided on the top-layer PCB board, and the plurality of signal connection holes 8 correspond to the plurality of signal pin connectors 3 one by one. When assembling the multi-layer control boards in the motor controller, place the top-layer PCB board 6 above the bottom-layer PCB board 1, and keep a certain distance between the top-layer PCB board 6 and the bottom-layer PCB board 1. At the same time, insert the signal pin connectors 3 on the bottom-layer PCB board 1 into the corresponding signal connection holes 8 on the top-layer PCB board 6. At this time, the bottom-layer PCB board 1 and the top-layer PCB board 6 are signal-connected together through the signal pin connectors 3 and the signal connection holes 8, thus completing the assembly of the multi-layer control boards in the motor controller.

[0049] When assembling the bottom-layer PCB board 1 and the top-layer PCB board 6, the bottom-layer PCB board 1 and the top-layer PCB board 6 can be placed on the height-fixed soldering platform 9 for assembly. When specifically setting the height-fixed soldering platform 9, reference can be made to Figure 4 , Figure 4 is a schematic structural diagram of the height-fixed soldering platform for a multi-layer motor control board and an assembly method provided by an embodiment of the present application. According to Figure 4 , it can be seen that a plurality of support columns 10 are fixedly connected to the height-fixed soldering platform 9. The number of the support columns 10 is the same as the number of the first positioning holes 2 and the second positioning holes 7. The height of each support column 10 is 10 mm, the diameter of each support column 10 is 7 mm, and a first limiting column 11 is fixedly connected to each support column 10. The diameter of each first limiting column 11 can be 2 mm; continue to refer to Figure 4 , an IPM positioning groove 12 is formed on the height-fixed soldering platform 9. A plurality of second limiting columns 13 are fixedly connected in the IPM positioning groove 12. The number of the second limiting columns 13 can be specifically set to 2 or 4. When the number of the second limiting columns 13 is 2, the 2 second limiting columns 13 should be located on the opposite inner walls of the IPM positioning groove 12. When the number of the second limiting columns 13 is 4, the 4 second limiting columns 13 should be located on the four inner walls of the IPM positioning groove 12 respectively.

[0050] Furthermore, the size of the IPM positioning groove 12 formed on the height-fixed soldering platform 9 is 40 mm * 28 mm, which can be consistent with the outer dimension of the IPM5; more preferably, the IPM positioning groove 12 can be 1 to 2 mm larger than the outer shape of the IPM5, so that the IPM5 can be placed in the IPM positioning groove 12 more conveniently; at the same time, the convex structure of the second limiting column 13 in the present application cooperates with the concave structure of the IPM5, so as to realize the precise positioning of the position of the IPM5. The convex length of the second limiting column 13 in the present application can be 2 mm, and the arc is a semi-circular shape with D2.6 mm, which is only smaller than the semi-circle of the concave structure D2.8 mm of the IPM5, so that the convex structure of the second limiting column 13 can be conveniently inserted into the concave structure of the IPM5, so as to conveniently position the IPM5 in the IPM positioning groove 12.

[0051] When assembling the top - layer PCB board 6 and the bottom - layer PCB board 1, reference can be made to Figure 5 , Figure 5 which is a schematic structural diagram of the assembly of the bottom - layer PCB board and the top - layer PCB board of a multi - layer motor control board and an assembly method provided by an embodiment of the present application. According to Figure 5 , the IPM5 should be first placed into the IPM positioning groove 12. Under the action of the second limiting post 13, the IPM5 will be positioned in the IPM positioning groove 12. Then, the bottom - layer PCB board 1 is placed on the height - fixed welding platform 9. Specifically, the first positioning hole 2 of the bottom - layer PCB board 1 can be aligned with the support post 10, and then the bottom - layer PCB board 1 is put down. Since the diameter of the support post 10 is 7 mm and the diameter of the first positioning hole 2 is 8 mm, the support post 10 can pass through the first positioning hole 2. At this time, the bottom - layer PCB board 1 is located on the bottom plate of the height - fixed welding platform 9. At this time, the pins of the IPM5 in the IPM positioning groove 12 just contact the pads 4 on the bottom - layer PCB board 1. Then, the pins of the IPM5 are welded to the pads 4 on the bottom - layer PCB board 1, so as to quickly connect the IPM5 and the bottom - layer PCB board 1 together; then, the second positioning hole 7 of the top - layer PCB board 6 is aligned with the first limiting post 11 and put down. Since the diameter of the second positioning hole 7 is 3 mm and the diameter of the first limiting post 11 is 2 mm, the first limiting post 11 can pass through the second positioning hole 7. And because the diameter of the support post 10 is larger than the diameter of the second positioning hole 7, the top - layer PCB board 6 falls on the support post 10 and is carried by the support post 10. At this time, the support post 10 can achieve a stable supporting effect on the top - layer PCB board 6, keep the top - layer PCB board 6 horizontal and parallel to the bottom - layer PCB board 1. At this time, the signal pin connector 3 on the bottom - layer PCB board 1 just inserts into the signal connection hole 8 of the top - layer PCB board 6, and then the signal pin connector 3 and the signal connection hole 8 are welded together. In this way, when the signal pin connector 3 and the signal connection hole 8 are welded, the welding firmness is improved, and welding defects such as missed welding and lack of welding are avoided, and the controller failure caused by insufficient welding is avoided, and the assembly quality of the product is improved. Through the above operations, the signal pin connector 3 and the signal connection hole 8 cooperate with each other to connect the signals of the top - layer PCB board 6 and the bottom - layer PCB board 1 together, thus forming a multi - layer control board in the motor controller.

[0052] Furthermore, since the height of the support post 10 is 10 mm, in order to ensure that the signal pin connector 3 on the bottom - layer PCB board 1 just inserts into the signal connection hole 8 of the top - layer PCB board 6, the height of the signal pin connector 3 should also be 10 mm, so as to avoid signal line connection misalignment or missing caused by too high or too low height.

[0053] In this application, at the corresponding position between the bottom PCB board 1 and the height-fixed welding platform 9, the height-fixed welding platform 9 is hollowed out and grooved. The height of the groove should be greater than the length of the welding pins left at the bottom of the bottom PCB board 1, and the depth can be 4 mm optionally.

[0054] In this application, in order to facilitate the connection and cooperation between different models of IPM5 and the bottom PCB board 1, a height-fixed device should be provided in the IPM positioning groove 12. This height-fixed device can adjust the height of the IPM5 in the IPM positioning groove 12 according to different models of IPM5, so that different models of IPM5 can be accurately connected to the pad 4 area on the bottom PCB board 1 in the IPM positioning groove 12.

[0055] When specifically setting the height-fixed device, reference can be made to Figure 6 , Figure 6 which is a schematic structural diagram of the height-fixed device of a multi-layer motor control board and an assembly method provided by an embodiment of this application. According to Figure 6 , it can be known that the height-fixed device includes a set of height-fixed grooves 14 opened on the opposite inner walls of the IPM positioning groove 12. Each height-fixed groove 14 is vertically opened, and multiple groups of adjustment grooves 15 are opened on both sides of each height-fixed groove 14. Each adjustment groove 15 is horizontally arranged and is connected to the height-fixed groove 14; continue to refer to Figure 6 , the height-fixed device further includes a baffle 16. The two ends of the baffle 16 are respectively located in two adjustment grooves 15 at the same height that are connected to a set of height-fixed grooves 14. Further, in this application, multiple groups of height-fixed grooves 14 can be provided to facilitate the stable support of the IPM5. First, according to the different models of the IPM5, adjust the height of the baffle 16 in the height-fixed groove 14, then place the IPM5 on the baffle 16, and the baffle 16 bears the IPM5. At this time, the pins of the IPM5 can just be connected to the pad 4 area of the bottom PCB board 1 located in the height-fixed welding platform 9, and then the pins of the IPM5 are welded to the pad 4 of the bottom PCB board 1.

[0056] In this application, the height-fixed range of the height-fixed device can be 6 - 9 mm. By adjusting the position of the baffle 16 on the height-fixed groove 14, the height-fixed height can be flexibly adjusted according to requirements. The height-fixed height is flexibly set and maintains a high height-fixed accuracy of ±0.1 mm.

[0057] In another embodiment, refer to Figure 7 , Figure 7 which is a schematic structural diagram of another implementation manner of the height-fixed welding platform of a multi-layer motor control board and an assembly method provided by an embodiment of this application. When the space in the height-fixed welding platform 9 is insufficient, the support columns 10 on the height-fixed welding platform 9 can be set at the edge, and the number of support columns 10 can be reduced to 2 or 1. The remaining support points can be supported by the signal connection pin base 3.

[0058] In this application, when it comes to a combination of three or more layers of PCB boards, the levels of the support columns on the height-fixed soldering platform 9 can be reasonably adjusted, and multi-level support columns are set to achieve the support combination of multiple PCB boards. Corresponding positioning holes and matching pin sockets are added to the PCB boards, so that the height-fixed soldering platform 9 can meet the combined installation of multiple PCB boards.

[0059] It can be seen from the above description that by assembling the bottom-layer PCB board and the top-layer PCB board together, a multi-layer control board for controlling the motor is formed; through the provided height-fixed soldering platform, the bottom-layer PCB board and the top-layer PCB board can be quickly assembled together, thus improving work efficiency; through the provided height-fixing device, it is possible to facilitate the quick and accurate docking of the pins of different IPMs with the solder pad areas on the bottom-layer PCB board.

[0060] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of changes or substitutions, which should all be covered within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

1. A multi-layer motor control board, characterized in that, Including: A bottom-layer PCB board, a top-layer PCB board, and a constant-height soldering platform; The bottom-layer PCB board is provided with a plurality of first positioning holes, and the bottom-layer PCB board is connected with an IPM and a signal pin connector; wherein, the bottom-layer PCB board is further connected with through-hole devices and surface-mount devices; The top-layer PCB board is provided with a plurality of second positioning holes, and the bottom-layer PCB board is provided with signal connection holes; the signal connection holes are used for being inserted together with the signal pin connector, so as to connect the bottom-layer PCB board and the top-layer PCB board in terms of signals; The constant-height soldering platform is fixed with a plurality of support columns, and the plurality of first positioning holes and the plurality of second positioning holes respectively correspond to the plurality of support columns one by one, and each support column can pass through the corresponding first positioning hole; The constant-height soldering platform is provided with an IPM positioning groove, and the IPM positioning groove is used for placing the IPM, so as to enable the pads where the IPM is located on the bottom-layer PCB board to be docked with the pins of the IPM; A constant-height device is arranged in the IPM positioning groove, and the constant-height device is used for adjusting the height of the IPM in the IPM positioning groove; The constant-height device includes a plurality of constant-height grooves opened on opposite inner walls of the IPM positioning groove, and a plurality of corresponding adjustment grooves are opened on both sides of each constant-height groove; wherein The adjustment grooves at the same horizontal height on opposite inner walls of the IPM positioning groove are inserted with baffles, and the baffles are used for carrying the IPM.

2. A multi-layer motor control board according to claim 1, characterized in that, A first limiting column is fixed at the top end of each support column; The first limiting column is used for passing through the second positioning hole, and the plurality of support columns are used for supporting the top-layer PCB board, so that the top-layer PCB board and the bottom-layer PCB board are arranged at intervals.

3. A multi-layer motor control board according to claim 2, wherein, A plurality of second limiting columns are fixedly connected in the IPM positioning groove; The plurality of second limiting columns are used for positioning the IPM in the IPM positioning groove.

4. An assembling method for the multi-layer motor control board according to any one of claims 2-3, characterized in that, Including the following steps: Put the IPM into the constant-height soldering platform; Place the bottom-layer PCB board on the constant-height soldering platform, and then weld the IPM and the bottom-layer PCB board together; Place the top-layer PCB board on the constant-height soldering platform, and then connect the top-layer PCB board and the bottom-layer PCB board together.

5. An assembling method for the multi-layer motor control board described in claim 3, characterized in that, Including the following steps: Put the IPM into the constant-height soldering platform; Place the bottom-layer PCB board on the constant-height soldering platform, and then weld the IPM and the bottom-layer PCB board together; Place the top-layer PCB board on the constant-height soldering platform, and then connect the top-layer PCB board and the bottom-layer PCB board together; The step of putting the IPM into the constant-height soldering platform is specifically: Adjust the height of the constant-height device according to the IPM model; Put the IPM into the IPM positioning groove, and the IPM is positioned in the IPM positioning groove through the plurality of second limiting columns.

6. The assembling method of a multi-layer motor control board according to claim 5, characterized in that, The step of placing the bottom-layer PCB board on the constant-height soldering platform and then welding the IPM and the bottom-layer PCB board together is specifically: Pass a plurality of the support columns through corresponding first positioning holes respectively. At this time, the pads on the bottom-layer PCB board where the IPM is located are connected to the pins of the IPM; Weld the pads on the bottom-layer PCB board where the IPM is located to the pins of the IPM.

7. A method for assembling a multi-layer motor control board according to claim 5, characterized in that, When placing the top-layer PCB board on the fixed-height soldering platform and then connecting the top-layer PCB board and the bottom-layer PCB board together, specifically; Pass the first limit column through the second positioning hole until a plurality of the support columns bear the top-layer PCB board; Insert the signal pin connector into the corresponding signal connection hole, thereby connecting the top-layer PCB board and the bottom-layer PCB board together.

Images