Display module and display device

Abstract

A display module and a display device, the display module comprising a display substrate (10) and a flexible circuit board (20), the display substrate (10) comprising a silicon substrate (102), a driving circuit at least partially embedded in the silicon substrate (102), and a first pad (101) electrically connected to the driving circuit, the driving circuit comprising a transistor (103) having a semiconductor layer (1031), the semiconductor layer (1031) being located inside the silicon substrate (102); the flexible circuit board (20) comprising a flexible base (201), a first wiring layer formed on the flexible base (201), and a first wiring layer formed on the first wiring layer away from the flexible base (201). The first reinforcing plate (203) on the side of the display substrate (10), the first wiring layer includes a main wiring portion (202b) and a second pad (202a) electrically connected to the main wiring portion (202b) and extending in a direction away from the main wiring portion (202b), and the second pad (202a) is electrically connected to the first pad (101) through a conductive adhesive (3); the first reinforcing plate (203) covers the main wiring portion (202b) and does not cover the second pad (202a); wherein, in the extension direction of the second pad (202a), the first reinforcing plate (203) is located outside the display substrate (10) and has a non-zero spacing with the display substrate (10). This solution has good signal transmission performance.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of display technology, and more particularly to a display module and a display device. Background Art

[0002] In recent years, with the increasing advancement of Virtual Reality (VR) and Augmented Reality (AR) technologies, display devices suitable for VR / AR are also developing in the direction of miniaturization, high pixel density (PPI), fast response and high color gamut. Silicon-based micro-display OLED (Organic Light-Emitting Diode, organic laser display) panels are one of the prominent directions. Although silicon-based micro-display OLED started late, it is becoming a new focus in the display field with its advantages of miniaturization and high PPI.

[0003] Since it is mainly used in the AR / VR field, in order to facilitate module assembly, flexible printed circuit (Flexible Printed Circuit; FPC for short) has become the main way to connect silicon-based OLED with the driving end. Therefore, higher requirements are put forward on the design of flexible printed circuits and the bonding process of flexible printed circuits and silicon-based OLEDs. Summary of the invention

[0004] The embodiments of the present disclosure provide a display module and a display device having good signal transmission performance.

[0005] In one embodiment of the present disclosure, a display module is provided, comprising:

[0006] A display substrate, comprising a silicon substrate, a driving circuit and a first pad, wherein at least a portion of the driving circuit is embedded in the silicon substrate, the driving circuit comprises a transistor, the transistor has a semiconductor layer, the semiconductor layer is located inside the silicon substrate, and the first pad is electrically connected to the driving circuit;

[0007] A flexible circuit board, the flexible circuit board comprising a flexible substrate, a first wiring layer and a first reinforcement plate, the first wiring layer is formed on the flexible substrate, and the first wiring layer comprises a main wiring portion and a second pad, the second pad is electrically connected to the main wiring portion and extends in a direction away from the main wiring portion, and the second pad is electrically connected to the first pad through a conductive adhesive; the first reinforcement plate is formed on a side of the first wiring layer away from the flexible substrate; the orthographic projection of the first reinforcement plate on the flexible substrate covers the orthographic projection of the main wiring portion on the flexible substrate, and does not overlap with the orthographic projection of the second pad on the flexible substrate; wherein,

[0008] In the extension direction of the second pad, the first reinforcing plate is located outside the display substrate and has a non-zero distance between the first reinforcing plate and the display substrate.

[0009] In an exemplary embodiment of the present disclosure, in an extension direction of the second pad, a distance between the first reinforcing plate and the display substrate is not less than 200 μm.

[0010] In an exemplary embodiment of the present disclosure, the flexible circuit board also includes a second reinforcement plate, which is located on a side of the flexible substrate away from the first wiring layer, and the second reinforcement plate has at least a first reinforcement area, and the orthographic projection of the first reinforcement area on the flexible substrate overlaps with the orthographic projection of the second pad on the flexible substrate.

[0011] In an exemplary embodiment of the present disclosure, the second reinforcement plate further has a second reinforcement area, the second reinforcement area and the first reinforcement area are arranged in sequence and connected in the extension direction of the second pad, and the orthographic projection of the second reinforcement area on the flexible substrate is located within the orthographic projection of the first reinforcement plate on the flexible substrate.

[0012] In an exemplary embodiment of the present disclosure, a size of the second reinforcement region in an extension direction of the second pad is not less than 500 μm.

[0013] In an exemplary embodiment of the present disclosure, the first reinforcement area and the second reinforcement area are integrally formed.

[0014] In an exemplary embodiment of the present disclosure, the flexible circuit board further includes a second wiring layer and a third reinforcement plate, wherein the second wiring layer is located on a side of the flexible substrate away from the first wiring layer and is electrically connected to the main wiring portion through a via; the third reinforcement plate is formed on a side of the second wiring layer away from the flexible substrate;

[0015] The orthographic projection of the second wiring layer on the flexible substrate is located within the orthographic projection of the first reinforcement plate on the flexible substrate, and is located within the orthographic projection of the third reinforcement plate on the flexible substrate.

[0016] In an exemplary embodiment of the present disclosure, a plurality of via holes are provided.

[0017] In an exemplary embodiment of the present disclosure, a fracture is provided between the third reinforcement plate and the second reinforcement area.

[0018] In an exemplary embodiment of the present disclosure, the third reinforcement plate covers a side of the second wiring layer facing the second reinforcement region.

[0019] In an exemplary embodiment of the present disclosure, the conductive adhesive is anisotropic conductive adhesive.

[0020] In an exemplary embodiment of the present disclosure, the display substrate has a display area and a binding area located at least on one side of the display area, and the first pad is located in the binding area;

[0021] The display substrate further comprises a light emitting element located in the display area. The light emitting element is formed on a side of the driving circuit away from the base substrate and is electrically connected to the driving circuit.

[0022] In one embodiment of the present disclosure, a display module is provided, comprising:

[0023] A display substrate, comprising a silicon substrate, a driving circuit and a first pad, wherein at least a portion of the driving circuit is embedded in the silicon substrate, the driving circuit comprises a transistor, the transistor has a semiconductor layer, the semiconductor layer is located inside the silicon substrate, and the first pad is electrically connected to the driving circuit;

[0024] A flexible circuit board comprises a flexible substrate and a first wiring layer formed on the flexible substrate, wherein the first wiring layer comprises a main wiring portion and a second pad, the second pad is electrically connected to the main wiring portion and extends in a direction away from the main wiring portion, and the second pad is electrically connected to the first pad through a conductive adhesive; wherein:

[0025] The conductive adhesive covers the first pad and an edge region of the display substrate close to the main wiring portion.

[0026] In an exemplary embodiment of the present disclosure, the conductive adhesive extends in a direction close to the main wiring portion and extends out of the boundary of the display substrate, and a portion of the conductive adhesive extending out of the boundary of the display substrate is not less than 200 μm.

[0027] In an exemplary embodiment of the present disclosure, the flexible circuit board further includes a first reinforcement plate and a second reinforcement plate.

[0028] The first reinforcing plate is formed on a side of the first wiring layer away from the flexible substrate, the orthographic projection of the first reinforcing plate on the flexible substrate covers the orthographic projection of the main wiring portion on the flexible substrate, and does not overlap with the orthographic projection of the second pad on the flexible substrate;

[0029] The second reinforcement plate is located on a side of the flexible substrate away from the first wiring layer, the second reinforcement plate has a first reinforcement area and a second reinforcement area, the orthographic projection of the first reinforcement area on the flexible substrate overlaps with the orthographic projection of the second pad on the flexible substrate; the second reinforcement area and the first reinforcement area are arranged sequentially and connected in the extension direction of the second pad, and the orthographic projection of the second reinforcement area on the flexible substrate is located within the orthographic projection of the first reinforcement plate on the flexible substrate.

[0030] In an exemplary embodiment of the present disclosure, a size of the second reinforcement region in an extension direction of the second pad is not less than 500 μm.

[0031] In one embodiment of the present disclosure, a display device is provided, comprising any one of the display modules described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. The above and other features and advantages will become more apparent to those skilled in the art by describing detailed example embodiments with reference to the accompanying drawings, in which:

[0033] Figure 1a A schematic diagram of assembling a display substrate and a flexible circuit board according to an embodiment of the present disclosure;

[0034] Figure 1b A schematic top view of a display substrate shown in an embodiment of the present disclosure;

[0035] Figure 1c A bottom view schematic diagram of a flexible circuit board shown in an embodiment of the present disclosure;

[0036] Figure 2 It is a partial side view schematic diagram of a display module shown in the related art;

[0037] Figure 3a and Figure 3b A schematic cross-sectional view of a display module according to an embodiment of the present disclosure;

[0038] Figure 4 It is a partial cross-sectional schematic diagram of a display substrate shown in an embodiment of the present disclosure. Description of the drawings:

[0040] 10. Display substrate; 10a. Display area; 10b. Binding area; 101. First pad; 102. Silicon substrate; 103. Driving transistor; 1031. Semiconductor layer; 1032. Source electrode; 1033. Drain electrode; 1034. Insulating layer; 1035. Gate; 104. Light-emitting element; 1041. Anode; 1042. Light-emitting layer; 1043. Cathode; 105. Driving substrate; 106. Conductive layer; 107. Conductive layer; 108. Contact hole; 109. Encapsulation layer; 110. Color filter layer; 111. Cover plate;

[0041] 20. flexible circuit board; 201. flexible substrate; 202a. second pad; 202b. main wiring portion; 202c. transition portion; 203. first reinforcement plate; 204. second reinforcement plate; 204a. first reinforcement area; 204b. second reinforcement area; 205. second wiring layer; 206. third reinforcement plate; 207. via; 208. fracture;

[0042] 3. Conductive adhesive; 30. Conductive particles. DETAILED DESCRIPTION

[0043] The technical solution of the present disclosure is further specifically described below through examples and in conjunction with the accompanying drawings. In the specification, the same or similar figure numbers indicate the same or similar parts. The following description of the embodiments of the present disclosure with reference to the accompanying drawings is intended to explain the overall inventive concept of the present disclosure and should not be construed as a limitation of the present disclosure.

[0044] In addition, in the following detailed description, for the purpose of explanation, numerous specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details.

[0045] It should be noted that the terms “on…”, “formed on…” and “disposed on…” mentioned herein may mean that one layer is directly formed or disposed on another layer, or may mean that one layer is indirectly formed or disposed on another layer, i.e., there are other layers between the two layers.

[0046] The terms "a", "an", "the", "said" and "at least one" are used to indicate the presence of one or more elements / components / etc.; the terms "including" and "having" are used to express an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the listed elements / components / etc.

[0047] It should be noted that, although the terms "first", "second", "third", etc. may be used herein to describe various parts, components, elements, regions, layers and / or parts, these parts, components, elements, regions, layers and / or parts should not be limited by these terms. Instead, these terms are used to distinguish one part, component, element, region, layer and / or part from another.

[0048] like Figure 1a to Figure 1c As shown, in an embodiment of the present disclosure, a display module is provided, which may include a display substrate 10 and a flexible circuit board 20, specifically:

[0049] like Figure 3a , Figure 3b and Figure 4 As shown, the display substrate 10 has a display area 10a and a binding area 10b located at least on one side of the display area 10a, and the binding area 10b is provided with a first pad 101. The first pad 101 can be a single-layer or multi-layer structure, and the first pad 101 can be made of materials such as metal or alloy, for example: a metal single-layer or multi-layer structure formed by copper, molybdenum, aluminum and titanium, but not limited thereto, the first pad 101 can also be made of other conductive materials.

[0050] The first pad 101 is usually used for bonding with external components (e.g., flexible circuit board 20) after the display area 10a device is manufactured to provide signals, such as power supply voltage signals, to the display substrate 10. The first pad 101 can be arranged in the same layer as the conductive structure in the display area 10a to save process. For example, the first pad 101 can be arranged in the same layer as the topmost conductive layer 107 (farthest from the base substrate) below the light-emitting element 104 in the display area 10a to facilitate the subsequent bonding process.

[0051] It should be noted that the “same-layer arrangement” in the embodiments of the present disclosure means that multiple structures are formed from the same material film through the same or different patterning processes, and thus have the same material.

[0052] In some embodiments, the thickness of the display substrate 10 may be 0.5 mm to 1 mm, such as 0.5 mm, 0.75 mm, 0.1 mm, etc., but not limited thereto, and the thickness of the display substrate 10 may also be other values, depending on the specific situation. The width of the first pad 101 may be 60 μm to 80 μm, such as 60 μm, 70 μm, 80 μm, etc., and the length of the first pad 101 may be 480 μm to 520 μm, such as 480 μm, 500 μm, 520 μm, etc., but not limited thereto, and the width and length of the first pad 101 may also be other values, depending on the specific situation. The spacing between the first pad 101 and the boundary of the display substrate 10 located in the first pad 101 away from the center of the display substrate 10 is 50 μm to 70 μm, such as 50 μm, 60 μm, 70 μm, etc., but not limited thereto, and may also be other values, depending on the specific situation.

[0053] It should be noted that in some embodiments of the present disclosure, thickness refers to Figure 1a , Figure 3a , Figure 3b The dimension in the first direction Z shown in FIG. , and the length refers to the dimension in the first direction Z shown in FIG. Figure 1b , Figure 1c , Figure 3a , Figure 3b The dimension in the second direction X shown in FIG. 1 is the width. Figure 1b , Figure 1c The dimension in the third direction Y is shown in .

[0054] like Figure 3a As shown, the flexible circuit board 20 includes a flexible substrate 201, a first wiring layer and a first reinforcement plate 203; the first wiring layer is formed on the flexible substrate 201, and the first wiring layer may include a main wiring portion 202b and a second pad 202a, and the first reinforcement plate 203 is formed on a side of the first wiring layer away from the flexible substrate 201.

[0055] In detail, the orthographic projection of the main wiring portion 202b on the flexible substrate 201 is located within the orthographic projection of the first reinforcement plate 203 on the flexible substrate 201. In other words, the orthographic projection of the first reinforcement plate 203 on the flexible substrate 201 covers the orthographic projection of the main wiring portion 202b on the flexible substrate 201; the first reinforcement plate 203 can protect the main wiring portion 202b on the flexible circuit board 20, and in addition, it can also ensure the structural stability of the flexible circuit board 20, and facilitate the overall assembly of the product.

[0056] The second pad 202a is electrically connected to the main wiring portion 202b and extends in a direction away from the main wiring portion 202b; wherein the second pad 202a is used to be electrically connected to the first pad 101 in the display substrate 10, and can be electrically connected through the conductive adhesive 3; since the second pad 202a needs to be electrically connected to the second pad 202a through the conductive adhesive 3, the orthographic projection of the second pad 202a on the flexible substrate 201 does not overlap with the orthographic projection of the first reinforcement plate 203 on the flexible substrate 201, that is, the second pad 202a is exposed relative to the first reinforcement plate 203, so that the second pad 202a can be bound to the first pad 101, thereby enabling the flexible circuit board 20 to be electrically connected to the display substrate 10.

[0057] It should be noted that the orthographic projection on the flexible substrate 201 mentioned in the embodiment of the present disclosure specifically refers to the orthographic projection on the central horizontal plane of the flexible substrate 201. The central horizontal plane refers to the plane located at the center of the flexible substrate 201 when the flexible circuit board is placed horizontally and is not bent, and the central horizontal plane is a plane perpendicular to the first direction Z.

[0058] Furthermore, it should be understood that Figure 1b As shown, a plurality of first pads 101 spaced apart in a third direction Y may be provided on the binding area 10b of the display substrate 10, and the third direction Y is perpendicular to the first direction Z; and the first wiring layer of the flexible circuit board 20 may also have a plurality of second pads 202a spaced apart in the third direction Y. The length direction of the first pad 101 and the second pad 202a is Figure 1b and Figure 1c The second direction X is shown; the second direction X is perpendicular to the third direction Y and the first direction Z; and each second pad 202a is bound to a corresponding first pad 101.

[0059] For example, the flexible substrate 201 and the first reinforcement plate 203 in the flexible circuit board 20 can be a single-layer structure or a multi-layer structure; and the flexible substrate 201 and the first reinforcement plate 203 can be made of materials such as PI (polyimide). The first wiring layer can be made of materials such as Al (aluminum) or Cu (copper). The conductive adhesive 3 can be an anisotropic conductive film (Anisotropic Conductive Film, referred to as ACF), which uses conductive particles 30 to bind the second pad 202a of the flexible circuit board 20 to the first pad 101 of the display substrate 10, so that the flexible circuit board 20 and the display substrate 10 are electrically conductive. At the same time, since the anisotropic conductive adhesive 3 is only conductive in the thickness direction of the flexible substrate 201, the thickness direction of the flexible substrate 201 is Figure 3a and Figure 3bThe first direction Z is shown; therefore, a short circuit between adjacent pads in the horizontal direction can be avoided to ensure the electrical connection stability between the flexible circuit board 20 and the display substrate 10.

[0060] In addition, since the anisotropic conductive adhesive is only conductive in the thickness direction of the flexible substrate 201, in the process of binding multiple pairs of first pads 101 and second pads 202a, the anisotropic conductive adhesive can be disposed on the entire surface to reduce the difficulty of binding.

[0061] Since the first wiring layer is usually made of materials such as Al (aluminum) or Cu (copper), the portion not covered by the first reinforcing plate 203 (such as the second pad 202a) is prone to oxidation. In order to ensure that the second pad 202a has good conductivity, an anti-oxidation film layer with good conductivity, such as a gold (Au) material film, can be coated on the second pad 202a. Since the second pad 202a is coated with an anti-oxidation film layer, the thickness of the second pad 202a is greater than the thickness of the main wiring portion 202b, such as Figure 3a shown.

[0062] In addition, if Figure 3b As shown, the main wiring portion 202b and the second pad 202a can be connected through a transition portion 202c, and the transition portion 202c has the same structure as the second pad 202a, which can be understood as the transition portion 202c and the second pad 202a being integrally formed. In order to prevent the portion of the main wiring portion 202b that is connected to the second pad 202a from being oxidized, during the process of manufacturing the flexible circuit board 20, the first reinforcement plate 203 can cover the transition portion 202c to ensure that the first reinforcement plate 203 can completely cover the main wiring portion 202b to prevent the main wiring portion 202b from being exposed.

[0063] It should be understood that in order to ensure the structural stability of the flexible circuit board 20, the thickness of the first reinforcing plate 203 can be greater than the thickness of the second pad 202a. However, in the process of connecting the second pad 202a to the first pad 101, if the first reinforcing plate 203 is overlapped to the edge of the display substrate 10, the part of the second pad 202a close to the first reinforcing plate 203 will be warped. Figure 2 As shown, at this time, the contact area between the second pad 202a and the first pad 101 is reduced, so that the contact impedance between the second pad 202a and the first pad 101 becomes larger, and the electrical connection stability between the flexible circuit board 20 and the display substrate 10 is poor. In addition, since the first reinforcing plate 203 is overlapped at the edge of the display substrate 10, the first reinforcing plate 203 can be used as a retaining wall, so that the conductive particles 30 of some conductive adhesives 3 cannot be discharged smoothly after being squeezed, and are accumulated in the suspended part, thereby reducing the reliability of the flexible circuit board 20.

[0064] Therefore, in order to avoid this situation, in some embodiments, after the second pad 202a is electrically connected to the first pad 101 through the conductive adhesive 3, the first reinforcement plate 203 can be located on the outside of the display substrate 10 in the extension direction of the second pad 202a, that is, the first reinforcement plate 203 is not overlapped at the edge of the display substrate 10, so that the second pad 202a can be prevented from warping, so as to ensure the connection area between the second pad 202a and the first pad 101, improve the bonding yield between the flexible circuit board 20 and the display substrate 10, thereby ensuring the connection stability between the flexible circuit board 20 and the display substrate 10, so that the display module has good signal transmission performance.

[0065] In some embodiments, in the extension direction of the second pad 202a, it can also be understood that Figure 3a and Figure 3b In the second direction X shown, there should be a non-zero spacing between the first reinforcement plate 203 and the display substrate 10, that is, the edge of the first reinforcement plate 203 does not contact the edge of the display substrate 10, so as to avoid the first reinforcement plate 203 blocking the discharge of the conductive adhesive 3, that is: such a design can ensure that part of the conductive adhesive 3 can be discharged smoothly during the extrusion and bonding process between the first pad 101 and the second pad 202a, so as to alleviate the accumulation of conductive particles 30 in the conductive adhesive 3, ensure that the conductive particles 30 can be evenly distributed, and thus ensure the reliability of the flexible circuit board 20.

[0066] Furthermore, in the extension direction of the second pad 202 a , the distance H1 between the first reinforcing plate 203 and the display substrate 10 is not less than 200 μm to avoid accumulation of the conductive particles 30 in the conductive adhesive 3 , thereby further ensuring the reliability of the flexible circuit board 20 .

[0067] In some embodiments, Figure 3a and Figure 3b As shown, the conductive adhesive 3 covers the first pad 101 and the edge area of ​​the display substrate 10 close to the main wiring portion 202 b.

[0068] Optionally, the conductive adhesive 3 extends toward the direction close to the main wiring portion 202b and extends out of the boundary of the display substrate 10, and the portion of the conductive adhesive 3 extending out of the boundary of the display substrate 10 is not less than 200μm, that is, the spacing H1 between the end surface of the conductive adhesive 3 close to the main wiring portion 202b and the boundary of the display substrate is not less than 200μm; to avoid accumulation of conductive particles 30 in the conductive adhesive 3, thereby further ensuring the reliability of the flexible circuit board 20.

[0069] In some embodiments, the flexible circuit board 20 further includes a second reinforcing plate 204, which can be made of materials such as PI (polyimide). The second reinforcing plate 204 is located on the side of the flexible substrate 201 away from the first wiring layer, and the second reinforcing plate 204 has at least a first reinforcing area 204a, and the orthographic projection of the first reinforcing area 204a on the flexible substrate 201 overlaps with the orthographic projection of the second pad 202a on the flexible substrate 201. This design can increase the structural strength of the area where the second pad 202a is set in the flexible circuit board 20.

[0070] Among them, the second reinforcement plate 204 may also have a second reinforcement area 204b, and the second reinforcement area 204b and the first reinforcement area 204a are arranged in sequence and connected in the extension direction of the second pad 202a, and the orthographic projection of the second reinforcement area 204b on the flexible substrate 201 is located within the orthographic projection of the first reinforcement plate 203 on the flexible substrate 201. That is to say, a part of the second reinforcement plate 204 can also extend to the area where the main wiring portion 202b is set in the flexible circuit board 20, so as to avoid a sudden change in rigidity at the junction of the area where the second pad 202a is located and the area where the main wiring portion 202b is located in the flexible circuit board 20, thereby causing the junction to be easily damaged during the press-fit binding process of the second pad 202a and the first pad 101, that is, to avoid the problem of easy fracture of the second pad 202a and the connection between the second pad 202a and the main wiring portion 202b, so as to ensure the structural stability of the flexible circuit board 20 during the binding process.

[0071] It should be noted that the second reinforcement area 204 b and the first reinforcement area 204 a of the second reinforcement plate 204 may be integrally formed, so that the second reinforcement plate 204 is an integral structure, thereby ensuring the structural strength of the second reinforcement plate 204 .

[0072] Optionally, the dimension H2 of the second reinforcement region 204b in the extension direction of the second pad 202a is not less than 500 μm, which can also be understood as the dimension H2 of the second reinforcement region 204b in the extension direction of the second pad 202a. Figure 3a and Figure 3b The dimension H2 in the second direction X shown is not less than 500 μm; it can also be understood that the length of the overlapping portion of the second reinforcement plate 204 and the first reinforcement plate 203 in the first direction Z is not less than 500 μm, so as to further prevent the second pad 202a and the connection between the second pad 202a and the main wiring portion 202b from being easily broken, thereby ensuring the structural stability of the flexible circuit board 20 during the binding process.

[0073] In some embodiments, the flexible circuit board 20 may further include a second wiring layer 205 and a third reinforcement plate 206. The second wiring layer 205 is located on the side of the flexible substrate 201 away from the first wiring layer, and is electrically connected to the main wiring portion 202b through the via 207. The second wiring layer 205 may be made of materials such as Al (aluminum) or Cu (copper); the third reinforcement plate 206 is formed on the side of the second wiring layer 205 away from the flexible substrate 201, and the third reinforcement plate 206 may be made of materials such as PI (polyimide); wherein the orthographic projection of the second wiring layer 205 on the flexible substrate 201 is located within the orthographic projection of the first reinforcement plate 203 on the flexible substrate 201, and is located within the orthographic projection of the third reinforcement plate 206 on the flexible substrate 201. In this embodiment, by providing the flexible circuit board 20 with two wiring layers, wiring can be facilitated, and by providing the third reinforcement plate 206, the second wiring layer 205 can be protected on the one hand, and the structural strength of the flexible circuit board 20 can be enhanced on the other hand.

[0074] It should be understood that the flexible circuit board 20 can be provided with not only two wiring layers but also more layers, for example, three layers, four layers, etc., depending on the specific situation.

[0075] Optionally, a plurality of vias 207 for connecting the first wiring layer and the second wiring layer 205 may be provided to ensure connection stability between the first wiring layer and the second wiring layer 205 .

[0076] There is a break 208 between the third reinforcing plate 206 and the second reinforcing area 204 b, that is, the second reinforcing plate 204 and the third reinforcing plate 206 are disconnected and have a distance therebetween in the second direction X. In this embodiment, the flexible circuit board 20 can be bent at the break 208 to improve the bending ability of the flexible circuit board 20 .

[0077] Optionally, a third reinforcement plate 206 is also formed on the side of the second wiring layer 205 facing the second reinforcement area 204b to prevent the second wiring layer 205 from being exposed on the side facing the second reinforcement area 204b. On the one hand, it can prevent the second wiring layer 205 from being oxidized, thereby ensuring that the second wiring layer 205 has good conductivity; on the other hand, it can also prevent the second wiring layer 205 from accidentally touching other conductive components at the break 208.

[0078] In some embodiments, during the process of manufacturing the second reinforcement plate 204 and the third reinforcement plate 206, a whole-surface film layer may be firstly manufactured on the side of the flexible substrate 201 away from the first circuit layer, and then a fracture 208 may be cut or etched on the whole-surface film layer to form the second reinforcement plate 204 and the third reinforcement plate 206 that are disconnected from each other, but not limited thereto, the second reinforcement plate 204 and the third reinforcement plate 206 may also be formed separately and independently, depending on the specific circumstances.

[0079] In some embodiments, the overall thickness of the flexible circuit board 20 is less than the thickness of the display substrate 10; the thickness of the flexible circuit board is 0.1 mm to 0.2 mm, for example: 0.1 mm, 0.15 mm, 0.2 mm, etc., but not limited to this, the thickness of the flexible circuit board 20 can also be other values, depending on the specific situation. The length of the second pad 202a in the flexible circuit board is greater than the length of the first pad 101 in the display substrate 10; the length of the second pad 202a is 1mm to 1.5mm, such as 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc.; the width of the second pad 202a may be greater than or equal to the width of the first pad 101, and the width of the second pad 202a may be 60μm to 80μm, such as 60μm, 70μm, 80μm, etc.; but not limited to this, the length and width of the second pad 202a may also be other values, depending on the specific situation; it should be understood that the orthographic projection of the second pad 202a on the display substrate 10 can completely cover the first pad 101 to ensure the binding stability between the second pad 202a and the first pad 101.

[0080] In some embodiments, the length of the break 208 between the third reinforcement plate 206 and the second reinforcement area 204b of the second reinforcement plate 204 may be 7 mm to 9 mm, such as 7 mm, 8 mm, 9 mm, etc., but not limited thereto, and the length of the break 208 may be determined according to the specific bend.

[0081] In some embodiments, Figure 4 As shown, the display substrate 10 specifically includes a base substrate and a driving circuit; wherein:

[0082] The base substrate may be a silicon substrate 102 , which may be, for example, single crystal silicon or high purity silicon.

[0083] At least part of the driving circuit is embedded in the base substrate so that the whole is formed into a driving substrate 105. It should be understood that the driving circuit may include a circuit structure located in the display area 10a, and may also include a circuit structure located in the binding area 10b. The driving circuit may include a transistor, and the transistor has a semiconductor layer, and the semiconductor layer is located inside the silicon substrate 102, wherein the number of transistors in the driving circuit is multiple, and the transistors can be distributed not only in the display area 10a, but also in the binding area 10b, or in other non-display areas.

[0084] The driving circuit of the embodiment of the present disclosure can be electrically connected to the first pad 101 of the binding area 10b, and the first pad 101 is bound to the second pad 202a of the flexible circuit board 20 to provide a signal, such as a power supply voltage signal, to the display substrate 10; that is, the driving circuit may include a power supply voltage signal line (not shown in the figure), and this power supply voltage signal line can be electrically connected to the first pad 101, that is, the power supply voltage signal line can be electrically connected to the driving end through the first pad 101 and the flexible circuit board 20 to obtain the power supply voltage signal from the driving end.

[0085] Specifically, the driving circuit may include a pixel circuit located in the display area 10a, and the pixel circuit may be formed on the silicon substrate 102 by a semiconductor process, for example, a semiconductor layer 1031 (i.e., an active layer), a source electrode 1032, and a drain electrode 1033 of the driving transistor 103 are formed on the silicon substrate 102 by a doping process, and an insulating layer 1034 is formed by a silicon oxidation process, and a gate 1035 and a plurality of conductive layers 106, 107 are formed by a sputtering process or other processes. The semiconductor layer 1031 of the driving transistor 103 is located inside the base substrate; that is, the semiconductor layer 1031 may be part of the silicon substrate 102.

[0086] It should be noted that the driving circuit may also include a gate driving circuit, a data driving circuit, a data signal line and a scanning signal line, and the data driving circuit and the gate driving circuit are respectively connected to the pixel circuit of the light-emitting element 104 through the data signal line and the scanning signal line to provide electrical signals. The data driving circuit is used to provide a data signal, and the gate driving circuit is used to provide a scanning signal, and can also be further used to provide various control signals, power supply signals, etc.

[0087] In some embodiments, the gate drive circuit and the data drive circuit can also be integrated in the silicon substrate 102 through the above-mentioned semiconductor process. That is to say, when the display substrate 10 uses the silicon substrate 102 as the base substrate, the pixel circuit, the gate drive circuit and the data drive circuit can be integrated on the silicon substrate 102. In this case, since the silicon-based circuit can achieve higher precision, the gate drive circuit and the data drive circuit can also be formed in the area corresponding to the display area 10a of the display substrate 10, and are not necessarily located in the non-display area. Among them, the gate drive circuit and the data drive circuit can adopt conventional circuit structures in the art, and the embodiments of the present disclosure are not limited to this.

[0088] In some embodiments, Figure 4As shown, the display substrate 10 may further include a light emitting element 104, which is formed on a side of the driving circuit away from the silicon substrate 102 and located in the display area 10a, and the light emitting element 104 may be electrically connected to the driving circuit. In detail, the light emitting element 104 may include an anode 1041, a light emitting layer 1042, and a cathode 1043 sequentially formed on the driving substrate 105, and the anode 1041 may be electrically connected to the drain electrode 1033 in the driving transistor 103 through a contact hole 108 filled with a conductive material (e.g., metal tungsten, etc.) and a plurality of conductive layers 106 and 107; Figure 4 As shown, one insulating layer 1034 and two conductive layers 106 and 107 are shown, but the embodiment of the present disclosure does not limit the number of insulating layers and conductive layers.

[0089] There may be a plurality of light emitting elements 104, the anodes 1041 of the plurality of light emitting elements 104 are disconnected from each other, and the cathodes 1043 of the plurality of light emitting elements 104 may be provided in a whole layer. It should be noted that a spacer (PDL) may be provided between adjacent anodes 1041, or may not be provided, depending on the specific situation.

[0090] In some embodiments, the topmost conductive layer 107 in the driving substrate 105 is reflective, for example, a stacked structure of titanium / titanium nitride / aluminum. For example, the conductive layer 107 includes a plurality of sub-layers arranged at intervals, which are arranged one-to-one with the anodes 1041 of each light-emitting element 104. In the top emission structure, the conductive layer 107 can be set as a reflective layer for reflecting the light emitted by the light-emitting element 104 to improve the light extraction efficiency. For example, the orthographic projection of the anode 1041 of each light-emitting element 104 on the silicon substrate 102 falls within the orthographic projection of the corresponding portion of the conductive layer on the silicon substrate 102. In this case, the anode 1041 can be made of a transparent conductive oxide material with a high work function, such as ITO (indium tin oxide), IZO (indium zinc oxide), etc.

[0091] In some embodiments, the display substrate 10 further includes an encapsulation layer 109, a color filter layer 110, and a cover plate 111, etc., which are located on the side of the light-emitting element 104 away from the silicon substrate 102. For example, the first encapsulation layer 109 is configured to seal the light-emitting element 104 to prevent external moisture and oxygen from penetrating into the light-emitting element 104 and the pixel circuit and causing damage to the device. For example, the first encapsulation layer 109 includes an inorganic film or a structure including an organic film and an inorganic film alternately stacked. The color filter layer 110 may include color blocks such as R (red), G (green), and B (blue). The cover plate 111 is, for example, a glass cover plate. Among them, an encapsulation layer 109 may also be provided between the color filter layer 110 and the cover plate 111 to encapsulate the color filter layer 110.

[0092] In some embodiments, the display substrate 10 is an organic light emitting diode (OLED) display substrate 10 or a micro OLED (Micro OLED) display substrate 10 .

[0093] An embodiment of the present disclosure further provides a display device, which includes the display module described in any of the above embodiments.

[0094] According to the embodiments of the present disclosure, the specific type of the display device is not particularly limited, and any type of display device commonly used in the art can be used, such as display screens, mobile phones, laptop computers and other mobile devices, watches and other wearable devices, VR devices, etc. Those skilled in the art can make corresponding choices based on the specific purpose of the display device, which will not be repeated here.

[0095] It should be noted that, in addition to the array substrate, the display device also includes other necessary components and components. Taking the display as an example, it may also include a housing, a main circuit board, a power cord, etc. Those skilled in the art may make corresponding supplements according to the specific use requirements of the display device, which will not be repeated here. After considering the specification and practicing the contents disclosed herein, those skilled in the art will easily think of other embodiments of the present disclosure. This application is intended to cover any variations, uses or adaptive changes of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary technical means in the technical field that are not disclosed in the present disclosure. The description and embodiments are to be regarded as exemplary only, and the true scope and spirit of the present disclosure are indicated by the claims.

Claims

1. A display module, wherein: include: A display substrate, comprising a silicon substrate, a driving circuit and a first pad, wherein at least a portion of the driving circuit is embedded in the silicon substrate, the driving circuit comprises a transistor, the transistor has a semiconductor layer, the semiconductor layer is located inside the silicon substrate, and the first pad is electrically connected to the driving circuit; A flexible circuit board, the flexible circuit board comprising a flexible substrate, a first wiring layer and a first reinforcement plate, the first wiring layer is formed on the flexible substrate, and the first wiring layer comprises a main wiring portion and a second pad, the second pad is electrically connected to the main wiring portion and extends in a direction away from the main wiring portion, and the second pad is electrically connected to the first pad through a conductive adhesive; The first reinforcing plate is formed on a side of the first wiring layer away from the flexible substrate; The orthographic projection of the first reinforcing plate on the flexible substrate covers the orthographic projection of the main wiring portion on the flexible substrate, and does not overlap with the orthographic projection of the second pad on the flexible substrate; wherein, In the extension direction of the second pad, the first reinforcing plate is located outside the display substrate and has a non-zero spacing with the display substrate; In the extension direction of the second pad, a distance between the first reinforcing plate and the display substrate is not less than 200 μm.

2. The display module according to claim 1, wherein: The flexible circuit board also includes a second reinforcement plate, which is located on a side of the flexible substrate away from the first wiring layer. The second reinforcement plate has at least a first reinforcement area, and the orthographic projection of the first reinforcement area on the flexible substrate overlaps with the orthographic projection of the second pad on the flexible substrate.

3. The display module according to claim 2, wherein: The second reinforcement plate further has a second reinforcement area, which is arranged in sequence and connected to the first reinforcement area in the extension direction of the second pad, and the orthographic projection of the second reinforcement area on the flexible substrate is located within the orthographic projection of the first reinforcement plate on the flexible substrate.

4. The display module according to claim 3, wherein: A size of the second reinforcement region in an extension direction of the second pad is not less than 500 μm.

5. The display module according to claim 3, wherein: The first reinforcement area and the second reinforcement area are integrally formed.

6. The display module according to claim 4, wherein: The flexible circuit board further includes a second wiring layer and a third reinforcement plate, wherein the second wiring layer is located on a side of the flexible substrate away from the first wiring layer and is electrically connected to the main wiring portion through a via hole; The third reinforcing plate is formed on a side of the second wiring layer away from the flexible substrate; The orthographic projection of the second wiring layer on the flexible substrate is located within the orthographic projection of the first reinforcement plate on the flexible substrate, and is located within the orthographic projection of the third reinforcement plate on the flexible substrate.

7. The display module according to claim 6, wherein: A plurality of via holes are provided.

8. The display module according to claim 6, wherein: A fracture is formed between the third reinforcement plate and the second reinforcement area.

9. The display module according to claim 8, wherein: The third reinforcement plate covers a side of the second wiring layer facing the second reinforcement region.

10. The display module according to claim 1, wherein: The conductive adhesive is anisotropic conductive adhesive.

11. The display module according to claim 1, wherein: The display substrate comprises a display area and a binding area located at least on one side of the display area, and the first pad is located in the binding area; The display substrate further comprises a light emitting element located in the display area. The light emitting element is formed on a side of the driving circuit away from the base substrate and is electrically connected to the driving circuit.

12. A display module, wherein: include: A display substrate, comprising a silicon substrate, a driving circuit and a first pad, wherein at least a portion of the driving circuit is embedded in the silicon substrate, the driving circuit comprises a transistor, the transistor has a semiconductor layer, the semiconductor layer is located inside the silicon substrate, and the first pad is electrically connected to the driving circuit; A flexible circuit board comprises a flexible substrate and a first wiring layer formed on the flexible substrate, wherein the first wiring layer comprises a main wiring portion and a second pad, the second pad is electrically connected to the main wiring portion and extends in a direction away from the main wiring portion, and the second pad is electrically connected to the first pad through a conductive adhesive; wherein: The conductive adhesive covers the first pad and an edge area of ​​the display substrate close to the main wiring portion; The conductive adhesive extends in a direction close to the main wiring portion and extends out of the boundary of the display substrate, and a portion of the conductive adhesive extending out of the boundary of the display substrate is not less than 200 μm.

13. The display module according to claim 12, wherein: The flexible circuit board also includes a first reinforcement plate and a second reinforcement plate. The first reinforcing plate is formed on a side of the first wiring layer away from the flexible substrate, the orthographic projection of the first reinforcing plate on the flexible substrate covers the orthographic projection of the main wiring portion on the flexible substrate, and does not overlap with the orthographic projection of the second pad on the flexible substrate; The second reinforcing plate is located at a side of the flexible substrate away from the first wiring layer, the second reinforcing plate has a first reinforcing area and a second reinforcing area, and the orthographic projection of the first reinforcing area on the flexible substrate overlaps with the orthographic projection of the second pad on the flexible substrate; The second reinforcement area and the first reinforcement area are sequentially arranged and connected in the extension direction of the second pad, and the orthographic projection of the second reinforcement area on the flexible substrate is located within the orthographic projection of the first reinforcement plate on the flexible substrate.

14. The display module according to claim 13, wherein: A size of the second reinforcement region in an extension direction of the second pad is not less than 500 μm.

15. A display device, wherein: A display module comprising any one of claims 1 to 14.

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