Silicon wafer positioning structure and positioning method

Abstract

The present invention discloses a silicon wafer positioning structure, which is placed on the surface of a cold plate and fixed to the cold plate, comprising: a positioning portion, the positioning portion being a through strip piece with a surface concave inwardly, the concave through portion forming a waist groove at the bottom of the positioning portion in the same extension direction of the strip positioning portion, the outer wall surface of the positioning portion body being an inclined extension surface extending from top to bottom in a direction away from the waist groove; a gasket layer, which is a sheet structure extending horizontally from the end bottom of one end of the positioning portion in a direction away from the positioning portion, the gasket layer extending out of the positioning portion forming a flat placement surface around the side end surface of the positioning portion, wherein the fixing piece passes through the waist groove and is adapted to be positioned with the positioning hole on the cold plate, in a locked state, the fixing piece fixes the silicon wafer positioning structure to the cold plate, and in an adjusted state, the waist groove is limited by the fixing piece to move on the surface of the cold plate, which integrates the guide structure and the gasket structure, and can slide on the cold plate to realize flexible positioning and adjustment of the gasket.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing and processing equipment, and in particular to a silicon wafer positioning structure and a silicon wafer positioning method for storing silicon wafers on a cold plate during turnover. Background Art

[0002] In semiconductor device manufacturing, silicon wafers are typically stored on cold plates after completing the front-end process and awaiting transfer to the back-end. To ensure the wafer's positioning and guidance, conventional techniques involve placing multiple fixed pads on the cold plate, each of which is then pressed against a tapered guide post.

[0003] Figure 1 FIG is a top view showing the top view structure of a conventional gasket in the prior art. Figure 1 The conventional gasket 100 is in the shape of a "D" as shown in the figure, and may also be set in a circular shape in some situations. A through hole 101 is formed on the surface of the gasket 100, and the gasket body is finely ground to a thickness within the range of 0.1 mm to 0.15 mm by surface grinding or single-side grinding. The silicon wafer is placed flat on the placement surface formed by multiple gaskets placed on the cold plate. The guide column is as follows Figure 2 The structure shown includes a cylindrical base and a conical cylinder on the base. Figure 2 It is a side view showing the structure of the guide column set on the gasket. After the gasket 100 is placed on the surface of the cold plate 200, the guide column 300 is pressed on the gasket to compress the gasket 100. Figure 2 The guide post 300 is a table-shaped member with a circular cross-section. The diameter of the circular cross-section is smaller than the diameter of the circle on which the gasket 100 is located. In other words, the projected area of ​​the guide post 300 on the cold plate is smaller than the projected area of ​​the gasket 100 on the cold plate. Thus, when the guide post 300 is pressed onto the gasket 100 to form an integrated structure, an annular table 102 is formed on the surface of the gasket 100, extending outward from the outer contour of the bottom surface of the guide post 300 to the outer contour of the gasket 100. Multiple gaskets 100 and guide posts 300 form multiple annular table surfaces. Figure 3 , Figure 3 This diagram shows a silicon wafer placed on a cold plate and positioned by a gasket. Once the gasket is placed on the cold plate 200, it is pressed against the plate by four guide pins 300. The four integral structures formed by the guide pins 300 pressing the gasket 100 are spaced 90 degrees apart, centered around a predetermined circle. The annular surfaces formed by each of these four integral structures constitute the wafer placement surface. A circular silicon wafer 400 is inserted through the tapered surfaces of the guide pins and placed flat on the wafer fabric surface, with the circumference of the wafer 400 tangent to the cylindrical surfaces of each guide pin 300.

[0004] Conventional technology secures the guide post, gasket, and cold plate by forming a screw hole that runs through the guide post from top to bottom. The screw hole, the through-hole on the gasket, and the positioning hole on the cold plate are all of the same size. A tightening nut, threaded through each of these holes, secures the guide post, gasket, and cold plate. However, silicon wafer sizes vary; for example, in actual production, wafers range in size from 6 inches to 12 inches.

[0005] To address the positioning problem of silicon wafers of varying sizes, one readily contemplated approach is to create multiple sets of positioning holes on the cold plate. By selecting different sets of positioning holes for the guide posts and gaskets, surfaces for wafers of varying sizes can be formed. However, due to the cold plate's material, structure, and manufacturing process, and the fact that when removing silicon wafers, a robotic arm extends from the bottom of the cold plate into corresponding tracks therein to lift the wafers, these factors make it impossible to create multiple sets of positioning holes on the cold plate in existing technology. Furthermore, even if multiple sets of positioning holes were possible, the guide posts would need to be removed and new positioning holes would need to be selected to reposition the wafers of varying sizes. However, the surface roughness of the finely ground gasket is relatively low, making it susceptible to adhesion to similarly smooth wafers. Consequently, the gasket is susceptible to breakage and cracking during processing, whether during placement, installation, or cleaning of the finished product. Therefore, based on the above two aspects, the idea of ​​opening multiple groups of positioning holes on the cold plate cannot be used to solve the positioning problem of silicon wafers of different specifications.

[0006] In view of this, the existing technology should be improved to solve the technical problems that the silicon wafer positioning gasket is difficult to adjust according to the size of the silicon wafer and is easily broken and cracked during the processing, installation and cleaning. Summary of the Invention

[0007] In view of the deficiencies of the prior art, the present invention provides a silicon wafer positioning structure and positioning method in which a guide structure and a gasket structure are integrally formed and can slide on a cold plate to achieve positioning adjustment.

[0008] In order to solve the above technical problems, the present invention adopts a silicon wafer positioning structure, which is placed on the surface of the cold plate and fixed with the positioning hole on the surface of the cold plate. The silicon wafer gasket structure includes: a positioning portion, which is a through strip member with a surface concave inwardly, and its concave through portion forms a waist groove at the bottom of the positioning portion, which is consistent with the extension direction of the strip positioning portion, and the outer wall surface of the positioning portion body is an inclined extension surface extending from top to bottom in a direction away from the waist groove; a gasket layer, which is a sheet structure extending horizontally from the bottom end of one end of the positioning portion in a direction away from the positioning portion, and the part of the gasket layer extending out of the positioning portion forms a flat placement surface around the side end surface of the positioning portion, wherein the fixing part passes through the waist groove and is adapted to be positioned with the positioning hole on the cold plate. In the locked state, the fixing part fixes the positioning gasket structure to the cold plate, and in the adjusted state, the waist groove is limited by the fixing part to move on the surface of the cold plate.

[0009] Preferably, at least one end of the positioning groove forms an inwardly recessed paving portion toward the waist groove, and the paving portion forms an arcuate surface. The arcuate end surfaces on both sides of the arcuate surface are further extended, and each forms a docking with the outer side surface of the positioning portion through a recessed arcuate surface. The paving portion and the arcuate surfaces on both sides thereof are defined as a guide portion as a whole, and the gasket layer is a sheet-like structure arranged at the bottom of the guide portion and extending horizontally in a direction away from the positioning portion, and the gasket layer forms a flat placement surface for wrapping around the guide portion.

[0010] Further preferably, on the positioning portion, an edge of the relief portion forms a chamfer, and the chamfer ranges from 25° to 35°.

[0011] Still further preferably, at least three silicon wafer positioning structures are provided on the cold plate, and the placement surfaces of the three silicon wafer positioning structures form a coplanar surface, and the plane passing through the three placement surfaces is defined as a pad surface, wherein the silicon wafer is inserted from the guide portion of the yield portion and placed on the pad surface.

[0012] Also preferably, the protruding length of the gasket layer is in the range of 2 mm to 3 mm.

[0013] Correspondingly, another aspect of the present invention provides a silicon wafer positioning method based on the above-mentioned silicon wafer positioning structure, and the silicon wafer positioning method includes the following steps: step S1 of preparing the silicon wafer positioning structure as described above; step S2 of placing at least three of the silicon wafer positioning structures on the cold plate, and making the three silicon wafer positioning structures located at the three vertices of an equilateral triangle; step S3 of aligning the through grooves of the three silicon wafer positioning structures with the positioning holes on the cold plate, and inserting fixing parts respectively to position the silicon wafer positioning structure; step S4 of determining the preset position of the silicon wafer positioning structure according to the size of the silicon wafer to be circulated, and sliding the silicon wafer positioning structure to the preset position; step S5 of locking the fixing parts to fix the silicon wafer positioning structure, and then extending the silicon wafer to be circulated from the position of the yielding portion of the three silicon wafer positioning structures, and placing it on the pad formed by the placement surfaces of the three silicon wafer positioning structures.

[0014] Preferably, in step S2, the step of making the three silicon wafer positioning structures located at the three vertices of an equilateral triangle is specifically as follows: setting a point on the cold plate as the center point, the axis extension line of any gasket layer of the silicon wafer positioning structure passes through the center point, and the angles formed by the intersection of the axis extension lines of any two gasket layers of the silicon wafer positioning structures are equal.

[0015] Further preferably, in step S4, the step of sliding the silicon wafer positioning structure to a preset position is specifically: making the silicon wafer positioning structure move linearly toward or away from the center point, and / or making the silicon wafer positioning structure rotate around the fixing part as the center point.

[0016] Due to the adoption of the above technical solution, the present invention has the following beneficial technical effects compared with the prior art:

[0017] 1. Under the existing technology, a gasket structure for supporting silicon wafers is pressed onto the surface of the cold plate through a guide post, and a fixing nut is successively passed through the guide post and the gasket, so that the guide post and the gasket form an integral positioning structure, and then the structure is fixed to the cold plate as a whole. Although the separate structure of the guide post and the gasket is conducive to position adjustment between the two, the existing guide post and the gasket need to be fixed with the positioning holes on the cold plate. Due to the limitation of the cold plate positioning holes, the separate gasket structure is difficult to apply to the positioning of silicon wafers of different specifications and sizes. Therefore, the first idea of ​​the present invention to solve its technical problem is to integrate the positioning structure and the gasket structure, and improve the fixing method between the overall structure formed by the two and the cold plate. Based on this idea, the silicon wafer positioning structure of the present invention is a through waist groove formed inwardly on its body, thereby improving the hole-to-hole positioning and fixing method to a slot-to-hole fixing method. In this way, the fixing nut passes through the waist groove and the positioning hole on the cold plate to achieve positioning. At this time, the silicon wafer positioning structure can be limited by the fixing nut to slide on the cold plate, thereby making it possible for the silicon wafer positioning structure to move on the cold plate;

[0018] 2. The gasket layer is no longer a circular or D-shaped monolithic structure with a central opening. Instead, it only includes a sheet-like structure that extends 2 to 3 mm from at least one end of the bottom of the silicon wafer positioning structure. The gasket layer forms a flat placement surface at the bottom of the positioning portion that surrounds the end of the positioning portion. In this way, the gasket layer can move with the positioning portion while reducing damage to the gasket during use.

[0019] 3. In the prior art, when placing a silicon wafer, the cylindrical surface of the guide column can guide the outer contour of the circular silicon wafer. In the present invention, at least one end of the positioning portion of the silicon wafer positioning structure is configured to form a relief structure. The surface of the relief structure is a semicircular curved surface, and its two ends are respectively connected to the side wall of the positioning portion through a concave surface;

[0020] 4. Based on the above three structural improvements, the positioning structure on the cold plate is now adjusted to a waist-groove-to-hole method. Furthermore, when adapting to silicon wafers of varying sizes, the wafer positioning structure can not only translate linearly toward or away from the center of the cold plate, but also rotate about the cold plate surface around the fixed nut. This makes the positioning structure more flexible in its adjustment on the cold plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a top view showing the top structure of a conventional gasket in the prior art;

[0022] Figure 2 is a side view showing the structure of the guide column provided on the gasket;

[0023] Figure 3This is a state diagram showing the state where the silicon wafer is placed on the cold plate surface and positioned by the spacer;

[0024] Figure 4 is a top view showing the top structure of the silicon wafer positioning structure described in the first embodiment of the present invention;

[0025] Figure 5 Schematic diagram showing the silicon wafer positioning structure described in the second embodiment of the present invention;

[0026] Figure 6 A top view showing Figure 5 The top view structure of the silicon wafer positioning structure shown;

[0027] Figure 7 is a flow chart showing the steps of the silicon wafer positioning method according to the third embodiment of the present invention;

[0028] Figure 8 The state diagram shows the state where three silicon wafer positioning structures are set on the cold plate.

[0029] Figure 9 3 is a state diagram showing the state of linear and / or rotational adjustment of the silicon wafer positioning structure in the third embodiment. DETAILED DESCRIPTION

[0030] The following describes embodiments of a silicon wafer positioning structure and positioning method according to the present invention with reference to the accompanying drawings. Those skilled in the art will recognize that the described embodiments may be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the drawings and description are illustrative in nature and are not intended to limit the scope of the claims. Furthermore, throughout this specification, the drawings are not drawn to scale, and like reference numerals represent like parts.

[0031] It should be noted that the expressions "first" and "second" used in the embodiments of the present invention are intended to distinguish two non-identical entities with the same name or non-identical parameters. It can be seen that "first" and "second" are only for the convenience of expression and should not be understood as limitations on the embodiments of the invention. Subsequent embodiments will not explain this one by one.

[0032] Under existing technology, positioning the gasket on the cold plate requires aligning the guide post, gasket, and positioning hole on the cold plate, and then passing the fixing nut through the three holes and tightening them to secure them. It can be seen that due to the limitations of its structure and positioning method, the gasket cannot be adjusted on the surface of the cold plate. When it is necessary to adapt to carry silicon wafers of different specifications (for example, 6 inches, 8 inches, 12 inches, etc.), the main problems faced include:

[0033] 1) Because the positioning holes on the cold plate are fixed, the positions of the corresponding guide posts and gaskets cannot be changed in the prior art. In other words, the size of the silicon wafer placement surface formed by the coplanar multiple gaskets is limited. In addition, it is impossible to open more positioning holes on the cold plate to accommodate the adjustment needs of the guide posts and gaskets. Therefore, in order to meet the load requirements of different specifications, cold plates of different sizes can only be configured according to the different specifications of silicon wafers.

[0034] 2) Even so, another problem is that although it is possible to configure corresponding guide posts and gaskets on cold plates of different sizes, or to repeatedly disassemble and assemble the guide posts and gaskets, the former requires increased manufacturing and production costs, while the latter has the problem that the thin gaskets are very likely to break during repeated disassembly and assembly.

[0035] In response to the above problems, the technical purpose that the present invention attempts to achieve is: without the need for repeated disassembly and assembly or the preparation of more positioning structures, it is also possible to carry silicon wafers of different specifications on a single cold plate, and accordingly improve the existing silicon wafer positioning and fixing method to make it more flexible.

[0036] The following will describe how the preferred embodiments of the present invention achieve their technical effects in conjunction with the accompanying drawings and embodiments.

[0037] Example 1

[0038] Figure 4 FIG2 is a top view showing the top view of the silicon wafer positioning structure according to the first embodiment of the present invention. Referring to the figure, the silicon wafer positioning structure 10 according to the first embodiment of the present invention is a long straight strip-shaped member, including a positioning portion 11 as a main body and a gasket layer 12 at the bottom end of one side of the positioning portion 11.

[0039] The surface of the positioning portion 11 is recessed inward to form a through waist groove 111. As shown in the figure, the extension direction of the waist groove 111 is the same direction as the positioning portion 11, and the waist groove 111 extends from one end of the positioning portion 11 to the other end. The walls on both sides of the opening of the waist groove 111 form inclined slopes. At the same time, the notch size of the waist groove 111 is also set to be consistent with the fixing nut, that is, the fixing nut can be inserted from the notch of the waist groove 111 and then docked with the positioning hole (not shown) on the cold plate to achieve positioning.

[0040] The outer wall of the positioning portion 11 is formed with two arcuate end surfaces 112 and two long straight sidewall surfaces 113. The arcuate end surfaces and the sidewall surfaces form the outer wall surface of the positioning portion 11. The arcuate end surfaces 112 also form the guide surfaces for the silicon wafer.

[0041] The gasket layer 12 can be regarded as a sheet-like structure extending horizontally from the bottom of one end of the positioning portion 11 to a direction away from the positioning portion. Figure 4In the first embodiment of the present invention, the spacer layer 12 is attached to the bottom of the curved end surface of the positioning portion 11 and extends outward by 2 mm. Thus, the portion of the spacer layer 12 that extends beyond the positioning portion 11 forms a flat placement surface that surrounds the curved end surface 112 of the positioning portion 11. It is envisioned that multiple wafer positioning structures shown above could be provided on a cold plate, with the multiple flat placement surfaces forming a coplanar pattern, thereby forming a padding surface for placing a wafer.

[0042] When the fixing nut, which serves as a fixing part, passes through the waist groove 111 and fits into the positioning hole on the cold plate, the silicon wafer positioning structure is initially positioned. In other words, before the fixing part is locked, the silicon wafer positioning structure can still be moved and adjusted on the surface of the cold plate, and its position adjustment is limited by the fixing nut, which serves as a fixing part. In actual use, the silicon wafer positioning structure on the cold plate is positioned to the correct position according to the specifications of the silicon wafer to be carried. The position adjustment of the silicon wafer positioning structure can be a translation on the surface of the cold plate or a rotational movement around the fixing part. The details will be explained in the positioning method and will not be repeated here.

[0043] Example 2

[0044] In the first embodiment, a silicon wafer positioning structure with a waist groove is proposed, so that after the fixing part is inserted into the groove and positioned with the cold plate positioning hole, the silicon wafer positioning structure can still be positioned and adjusted on the cold plate. However, another problem in carrying silicon wafers is the guiding problem in the silicon wafer carrying. That is, the outer contour of the circular silicon wafer should be tangent to the edge position of the gasket under the guidance of the guiding structure. Although, in the first embodiment, the end face of the positioning part is set as an arc-shaped end face, so that the arc-shaped end face can also achieve a certain guiding effect. However, on the one hand, in the first embodiment, the arc-shaped end faces with symmetry at both ends extend downward from the top of the positioning part and in the direction away from the waist groove, so the guiding effect is limited; on the other hand, since it is necessary to adapt to the rotation adjustment of the silicon wafer positioning structure on the surface of the cold plate, the guiding effect of the structure described in the first embodiment should be improved.

[0045] One readily conceivable approach is to change the inclination of the curved end faces in Example 1, allowing the silicon wafer to slide in along the curved end faces. However, this approach requires adjusting the extended width of the spacer layer accordingly. Therefore, simply changing the inclination of the curved end faces is not sufficient to solve this technical problem.

[0046] Figure 5 Schematic diagram showing the silicon wafer positioning structure described in the second embodiment of the present invention. Figure 6 A top view showing Figure 5 The top view of the silicon wafer positioning structure is shown. Figure 5 and Figure 6In the silicon wafer positioning structure described in the second embodiment of the present invention, one end of the positioning portion 11 forms an inwardly concave relief portion 13 toward the waist groove 111. Similarly, the relief portion 13 also forms an arc-shaped curved surface, and the relief portion 13 is set to a 35° chamfered structure. On the other hand, the curved end surfaces on both sides of the relief portion 13 are further extended and respectively connect with the side wall surface 113 of the positioning portion through a concave arc surface. Figure 5 , two "S"-shaped recessed yielding structures are formed on both sides of the yielding portion 13. Then, the yielding portion 13 including the "S"-shaped recessed yielding structures on both sides is defined as a guide portion as a whole. In this way, the silicon wafer can be slid in from multiple positions of the guide portion, which significantly improves the guiding effect of the preferred embodiment of the present invention and can also meet the rotation adjustment needs of the silicon wafer positioning structure described in the present invention. In the second embodiment, the gasket layer 12 is a sheet-like structure formed at the bottom of the entire guide portion and extending horizontally in the direction away from the positioning portion 11. Similarly, multiple coplanar gasket layers 12 can form a padding surface for supporting silicon wafers on the surface of the cold plate.

[0047] Example 3

[0048] The first and second embodiments illustrate one aspect of the present invention, namely, providing a silicon wafer positioning structure disposed on a cold plate with adjustable position. Another aspect of the present invention is to improve the positioning method of silicon wafers based on this improved silicon wafer positioning structure.

[0049] Figure 7 The flowchart shows the steps of the silicon wafer positioning method in the third embodiment of the present invention. Figure 7 As shown, the silicon wafer positioning method includes the following steps:

[0050] Step S1: placing at least three silicon wafer positioning structures as described in Example 1 or Example 2 on a cold plate, and positioning the three silicon wafer positioning structures at three vertices of an equilateral triangle;

[0051] Step S2 of aligning the through slots of the three silicon wafer positioning structures with the positioning holes on the cold plate and inserting fixing pieces into each of the through slots to position the silicon wafer positioning structures;

[0052] Determine a preset position of the silicon wafer positioning structure according to the size of the silicon wafer to be turned over, and slide the silicon wafer positioning structure to the preset position (S3);

[0053] Lock the fixing member to fix the silicon wafer positioning structure, then extend the silicon wafer to be rotated from the three silicon wafer positioning structures to the yielding portion and place it on the pad formed by the placement surfaces of the three silicon wafer positioning structures in step S4.

[0054] Specifically, the first step of the method described in Example 3 is to determine the position of the silicon wafer positioning structure on the cold plate. Since the silicon wafers to be rotated are circular, ideally, three silicon wafer positioning structures are used, each placed at the vertices of the largest equilateral triangle defined by the circle containing the silicon wafer.

[0055] According to the preset position, a point is determined on the cold plate as the center point, and the positions of the three vertices of the equilateral triangle are determined by the center point, and three positioning holes are opened. Then, three silicon wafer positioning structures are respectively set corresponding to the positioning holes. Figure 8 The diagram shows the state where three silicon wafer positioning structures are provided on the cold plate. Figure 8 As shown in the figure, the axis extension line of the gasket layer of any silicon wafer positioning structure passes through the center point determined on the cold plate. Since the three silicon wafer positioning structures are located at the three vertices of an equilateral triangle, the angle formed by the intersection of the axis extension lines of any two silicon wafer positioning structures is equal. Figure 8 In the structure shown, the angle formed is 120°.

[0056] As mentioned above, the step of sliding the silicon wafer positioning structure to the preset position is specifically: making the silicon wafer positioning structure move linearly toward or away from the center point, and / or making the silicon wafer positioning structure rotate around the fixing member as the center point.

[0057] Let's talk about the adjustment in the straight line direction first. Assume that Figure 8 The position shown is for rotating 8-inch silicon wafers. When rotating 6-inch silicon wafers, the orientation of the shim layer of each wafer positioning structure remains unchanged, and the wafer positioning structure moves linearly toward the center point. Conversely, when rotating 12-inch silicon wafers, the orientation of the shim layer of each wafer positioning structure remains unchanged, and the wafer positioning structure moves linearly away from the center point.

[0058] However, considering that both the gasket and the silicon wafer are thin, it is difficult to achieve an ideal tangent between the edge of the silicon wafer and the edge of the gasket. In practice, the two often rub or squeeze each other during the guide rotation process, which will undoubtedly cause varying degrees of damage to both. Therefore, the linear adjustment method described above is still not enough to cope with the actual rotation situation.

[0059] In a preferred embodiment of the present invention, the silicon wafer positioning structure also provides a rotation adjustment method, that is, the rotation can be achieved with the fixed nut as the center. Figure 9 FIG is a state diagram showing the state of linear and / or rotational adjustment of the silicon wafer positioning structure in the third embodiment. Figure 9According to the orientation of the drawings, the top silicon wafer positioning structure is defined as the first group 300, and the bottom silicon wafer positioning structure is defined as the second group 400 and the third group 500, respectively. In the initial position, the padding formed by the first through third groups can be used to rotate 6-inch silicon wafers. When it is necessary to rotate 8-inch silicon wafers, the first through third groups can be linearly adjusted away from the center point in the manner described above. Alternatively, the first group 300 can be linearly moved away from the center point while the second and third groups 400 and 500 are rotated to a vertical orientation.

[0060] Example 4

[0061] Of course, other embodiments of the present invention can also be arranged according to positioning and turnover requirements. For example, in the fourth embodiment of the present invention, four silicon wafer positioning structures are set on the cold plate. The four silicon wafer positioning structures should be located at the four vertices of the square of the inscribed circle. The four silicon wafer positioning structures can be arranged as follows:

[0062] 1) According to the method of Example 3, the axis line of any of the four silicon wafer positioning structures is extended through the center point determined on the cold plate, or it can be understood that the axis line connecting the two silicon wafer positioning structures located at the two end points of any diagonal line of the square passes through the center point of the cold plate;

[0063] 2) The four silicon wafer positioning structures are arranged horizontally, and the four silicon wafer positioning structures are divided into two groups, with two silicon wafer positioning structures in each group, and their spacer layers are arranged opposite to each other.

[0064] During the turnover of silicon wafers of different sizes, the position of the silicon wafer positioning structure in the fourth embodiment can still be adjusted in the manner of the third embodiment.

[0065] The above embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A silicon wafer positioning structure, which is placed on a cold plate surface and fixed to a positioning hole on the cold plate surface, characterized in that: The silicon wafer positioning structure includes: The positioning portion is a through strip with an inwardly concave surface. The concave through portion forms a waist groove at the bottom of the positioning portion in the same direction as the extension of the strip positioning portion. The outer wall surface of the positioning portion body is an inclined extension surface extending from top to bottom in a direction away from the waist groove. At least one end of the positioning portion forms an inwardly concave yield portion toward the waist groove. The yield portion forms an arcuate surface. The arcuate end surfaces on both sides of the arcuate surface further extend and each forms a butt joint with the outer side surface of the positioning portion through a concave arc surface. The shim layer defines the shim portion and the arc surfaces on both sides thereof as a guide portion. The shim layer is a sheet-like structure disposed at the bottom of the guide portion and extending horizontally in a direction away from the positioning portion. The shim layer forms a flat placement surface around the guide portion, wherein: After passing through the waist groove, the fixing piece is adapted to be positioned with the positioning hole on the cold plate. In the locked state, the fixing piece fixes the silicon wafer positioning structure to the cold plate. In the adjustment state, the waist groove is limited by the fixing piece to translate on the surface of the cold plate or rotate around the fixing piece, and the silicon wafer slides into the silicon wafer positioning structure from multiple positions of the guide part. A point on the cold plate is set as a center point, and the positions of three vertices of an equilateral triangle are determined by the center point, and at least three silicon wafer positioning structures are arranged on the three vertices of the equilateral triangle.

2. The silicon wafer positioning structure according to claim 1, characterized in that: On the positioning portion, an edge of the relief portion is chamfered, and the chamfer ranges from 25° to 35°.

3. The silicon wafer positioning structure according to claim 1 or 2, characterized in that: The protruding length of the gasket layer is in the range of 2 mm to 3 mm.

4. A silicon wafer positioning method, characterized in that: The silicon wafer positioning method comprises the following steps: Step S1 of placing at least three silicon wafer positioning structures according to any one of claims 1 to 3 on a cold plate, such that the three silicon wafer positioning structures are located at three vertices of an equilateral triangle; Step S2 of aligning the through slots of the three silicon wafer positioning structures with the positioning holes on the cold plate and inserting fixing pieces into each of the through slots to position the silicon wafer positioning structures; Determine a preset position of the silicon wafer positioning structure according to the size of the silicon wafer to be turned over, and slide the silicon wafer positioning structure to the preset position (S3); Lock the fixing member to fix the silicon wafer positioning structure, then extend the silicon wafer to be rotated from the three silicon wafer positioning structures to the yielding portion and place it on the pad formed by the placement surfaces of the three silicon wafer positioning structures in step S4.

5. The silicon wafer positioning method according to claim 4, characterized in that: In step S1, the steps of positioning the three silicon wafer positioning structures at the three vertices of an equilateral triangle are specifically as follows: A point on the cold plate is set as the center point, and the axis extension line of any gasket layer of the silicon wafer positioning structure passes through the center point, and the angles formed by the intersection of the axis extension lines of any two gasket layers of the silicon wafer positioning structure are equal.

6. The silicon wafer positioning method according to claim 5, characterized in that: In step S3, the step of sliding the silicon wafer positioning structure to a preset position is specifically as follows: The silicon wafer positioning structure is caused to move linearly in a direction close to or away from the center point, and / or the silicon wafer positioning structure is caused to rotate around the fixing member as the center point.

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