Heat dissipation

Abstract

An apparatus includes: a heat sink; a vapor chamber; a printed circuit board; an elastic biasing device positioned between the heat sink and the vapor chamber; and at least one retainer configured to overcome the elastic biasing device to urge the heat sink toward the vapor chamber and configured to urge the printed circuit board toward the vapor chamber.

Description

Technical Field

[0001] Embodiments of the present invention relate to heat dissipation. Some embodiments relate to an apparatus for dissipating heat from a printed circuit board. Background Art

[0002] Components on a printed circuit board may generate a large amount of heat, but may be very small in size. This may cause the temperature of the components to rise, which may affect their performance or cause them to malfunction. Therefore, it is common practice to use a heat sink to dissipate heat from the components on the printed circuit board. In some instances, a vapor chamber is connected between the components and the heat sink to improve the heat energy transfer from the components to the larger heat sink. It is beneficial to ensure good thermal conductivity between the components and the vapor chamber and between the vapor chamber and the heat sink during operation and use.

[0003] The thermal interface material used to thermally interconnect the components and the vapor chamber and the thermal interface material used to thermally interconnect the vapor chamber and the heat sink can provide good thermal conductivity and can also absorb manufacturing tolerances and stresses in use caused by temperature changes and / or physical vibration or shock. Summary of the Invention

[0004] According to various but not necessarily all embodiments, there is provided an apparatus including: a heat sink; a vapor chamber; a printed circuit board; an elastically biasing device positioned between the heat sink and the vapor chamber; and at least one retainer configured to overcome the elastically biasing device to urge the heat sink towards the vapor chamber and configured to urge the printed circuit board towards the vapor chamber.

[0005] In some but not necessarily all instances, the apparatus includes one or more protrusions extending from the heat sink into at least one of one or more corresponding apertures in the vapor chamber.

[0006] In some but not necessarily all instances, at least one protrusion extends through a corresponding aperture in the vapor chamber.

[0007] In some but not necessarily all instances, the at least one protrusion extends from the heat sink through an aperture in the vapor chamber and does not abut the printed circuit board.

[0008] In some but not necessarily all instances, the at least one protrusion extends from the heat sink through an aperture in the vapor chamber to abut the printed circuit board.

[0009] In some but not necessarily all instances, the elastically biasing device is positioned by the protrusion and the elastically biasing device surrounds the protrusion.

[0010] In some but not necessarily all instances, the heat sink includes a recessed portion for receiving and positioning the elastically biasing device.

[0011] In some but not necessarily all instances, the resilient biasing device is a spring.

[0012] In some but not necessarily all instances, the at least one retainer secures the printed circuit board to the heat sink.

[0013] In some but not necessarily all instances, the at least one retainer extends through an aperture in the vapor chamber.

[0014] In some but not necessarily all instances, the retainer extends through an aperture in the printed circuit board.

[0015] In some but not necessarily all instances, the at least one retainer is a screw.

[0016] In some but not necessarily all instances, the device includes at least one component on a printed circuit board, and includes a thermal interface material coupling the at least one component to the vapor chamber and a thermal interface material coupling the vapor chamber to the heat sink.

[0017] In some but not necessarily all instances, the vapor chamber includes a three-dimensional contact area sized to match the dimensions of the at least one component.

[0018] In some but not necessarily all instances, the device includes a plurality of components on a printed circuit board, wherein each of the plurality of components contacts the vapor chamber through a thermal interface material, and the vapor chamber has a three-dimensional shape conforming to at least the height dimension of the plurality of components.

[0019] In some but not necessarily all instances, the heat sink and the vapor chamber include mutually coupling features.

[0020] In some but not necessarily all instances, the telecommunications device includes the device. In some instances, the telecommunications device includes a fan for forced air cooling.

[0021] According to various but not necessarily all embodiments, instances as claimed in the appended claims are provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Some instances will now be described with reference to the drawings, wherein:

[0023] Figure 1 An instance of the subject matter described herein is shown;

[0024] Figure 2A 、 2B Another instance of the subject matter described herein is shown;

[0025] Figure 3 Another instance of the subject matter described herein is shown;

[0026] Figure 4 Shows another example of the subject matter described herein;

[0027] Figure 5 Shows another example of the subject matter described herein;

[0028] Figure 6A 、 6B 、6C shows another example of the subject matter described herein;

[0029] Figure 7A 、 7B Shows another example of the subject matter described herein;

[0030] Figure 8A 、 8B Shows another example of the subject matter described herein;

[0031] Figure 9 Shows another example of the subject matter described herein;

[0032] Figure 10 Shows another example of the subject matter described herein;

[0033] Figure 11 Shows another example of the subject matter described herein;

[0034] Figure 12 Shows another example of the subject matter described herein;

[0035] Figure 13A 、 13B 、13C shows another example of the subject matter described herein. Detailed Description

[0036] The following drawings show apparatus 10, including: a heat sink 20; a vapor chamber 30; an elastically biasing device 50 positioned between the heat sink 20 and the vapor chamber 30; and at least one retainer 60 configured to overcome the elastically biasing device 50 to urge the heat sink 20 towards the vapor chamber 30 and configured to urge a printed circuit board 40 towards the vapor chamber 30.

[0037] The thermal interface material 80 can be used to form a thermal conduction interface between the heat sink 20 and the vapor chamber 30 and between one or more components 70 that are separately formed between the vapor chamber 30 and the printed circuit board 40. The neutral balance obtained between the compressive force provided by the retainer 60 and the expansion force provided by the elastic biasing device 50 can mitigate the effects of manufacturing tolerances and / or differences in thermal expansion and / or vibration shock. The forces generated between the vapor chamber 30 and the heat sink 20 and between the vapor chamber 30 and the component 70 are controlled by the interaction of at least one retainer 60 and the elastic biasing device 50. Thus, the thermal interface material 80 can be configured for the desired thermal conductivity between the component 70 and the vapor chamber 30 and between the vapor chamber 30 and the heat sink 20.

[0038] The heat sink 20 can be formed of a material having a high specific heat capacity and a high thermal conductivity. For example, the heat sink can be formed of copper or aluminum metal or an alloy. The heat sink 20 dissipates heat by convection of a fluid (such as air) on its surface. The heat sink 20 can include fins, for example, that increase its surface area, thereby increasing the rate of heat dissipation from its surface. The heat sink 20 operates as a thermodynamic reservoir for transferring heat generated by one or more components 70 on the printed circuit board 40.

[0039] The vapor chamber 30 conducts heat from a heat source (such as one or more components 70 on the printed circuit board 40) to the heat sink 20. The vapor chamber 30 is designed to reduce the higher heat flux density at the interface between the vapor chamber 30 and the components 70 of the printed circuit board 40 to a lower heat flux density at the interface between the vapor chamber 30 and the heat sink 20. The heat sink 20 further reduces the heat flux density, thereby allowing air cooling, for example.

[0040] In some but not necessarily all instances, the heat sink 20 can be a material such as copper or aluminum alloy or a composite material. In some but not necessarily all instances, the vapor chamber 30 can include a vapor chamber. The vapor chamber includes a volatile fluid that transfers heat from the interface between the component 70 and the vapor chamber 30 by evaporation and transfers it to the interface between the vapor chamber 30 and the heat sink 20 by condensation. The vapor chamber 30 can be, for example, a metal vapor chamber, a vapor chamber, or a hybrid vapor chamber base that combines a high thermal conductivity component.

[0041] The components 70 on the printed circuit board 40 can be packaged components or lidless components. If the component 70 is a packaged component, the package housing is connected to the vapor chamber 30 using the thermal interface material 80. The semiconductor die within the component 70 is typically thermally connected to the package housing through a thermal conduction material within the package. If the component 70 is a lidless component, the semiconductor die can be directly thermally connected to the vapor chamber 30 through the thermal interface material 80.

[0042] Figure 1An example of the device 10 is shown. In this example, the printed circuit board 40 includes one or more components 70 to be cooled. In this figure and the following examples, a single component 70 will be referred to. However, it should be recognized that a single vapor chamber 30 can be thermally connected to one or more components 70. In addition, it should also be recognized that the heat sink 20 can be coupled to one or more vapor chambers 30 through respective resilient biasing devices 50.

[0043] The device 10 includes a heat sink 20, a vapor chamber 30, a printed circuit board 40 including one or more components 70, a resilient biasing device 50 positioned between the heat sink 20 and the vapor chamber 30, and at least one retainer 60. The at least one retainer 60 is configured to overcome the resilient biasing device 50 to urge the heat sink 20 towards the vapor chamber 30, and is configured to urge the printed circuit board 40 towards the vapor chamber. With the heat sink 20 as a reference point, the resilient biasing device 50 pushes the vapor chamber 30 away from the heat sink 20. The vapor chamber 30 in turn pushes the printed circuit board 40 away from the heat sink 20 through one or more components 70 of the printed circuit board 40. The at least one retainer 60 is under tension and prevents the printed circuit board 40 from moving away from the heat sink 20.

[0044] The at least one retainer 60 can be configured to be rigid and not bend. Thus it defines the maximum spacing between the heat sink 20 and the printed circuit board 40. However, in at least some instances, the at least one retainer 60 is fixed to the heat sink 20 but not to the printed circuit board 40, and allows relative movement of the printed circuit board 40 towards the heat sink 20. However, such movement has to overcome the resilient biasing device 50.

[0045] In at least some instances, although the at least one retainer 60 prevents the printed circuit board 40 and the heat sink 20 from separating by more than a predetermined distance, the position of the vapor chamber 30 within that distance can still change. As previously described, in at least some instances, it is also possible to move the printed circuit board 40 towards the heat sink 20 against the force provided by the resilient biasing device 50.

[0046] Therefore, it will be recognized that the device 10 is configured to mitigate the effects of manufacturing tolerances and / or thermal expansion / deformation and / or vibration.

[0047] Although not shown in Figure 1 , a thermal interface material can be used to form a thermally conductive interface between the vapor chamber 30 and the component 70 and separately between the vapor chamber 30 and the heat sink 20. This is shown in at least some of the following figures.

[0048] As Figure 2A , 2B , 3 and 4 show, the heat sink 20 can include a protrusion 22 that extends at least into the aperture 32 of the vapor chamber 30.

[0049] In Figure 2A Figure 2A , the protrusion 22 only partially extends from the heat sink 20 into the aperture 32 in the vapor chamber 30. The aperture 32 can be, for example, a blind aperture that does not penetrate through the vapor chamber 30.

[0050] In Figure 2B Figure 2B example, the protrusion 22 extends from the heat sink 20 through the aperture 32 in the vapor chamber 30. The aperture 32 in the vapor chamber 30 is a through aperture that fully extends through the vapor chamber 30.

[0051] In Figure 2A and 2B 2B example, the heat sink 20 and the vapor chamber 30 are separated to clearly show the protrusion 22 and the aperture 32. However, in use, the heat sink 20 will be adjacent to the vapor chamber 30 connected thereto by the thermal interface material 80, and the protrusion 22 will enter the aperture 32.

[0052] Figure 3 Figure 3 shows an example of the device 10, in which the heat sink 20 includes a protrusion 22 that extends through a through aperture 32 (not marked in Figure 3 Figure 3 ) in the vapor chamber 30 and abuts against the printed circuit board 40. The device 10 is otherwise the same as previously described. The device 10 includes an elastically biasing device 50 (not shown in the figure) positioned between the heat sink 20 and the vapor chamber 30, and at least one retainer 60 (not shown in the figure) configured to overcome the elastic biasing device 50 to urge the heat sink 20 towards the vapor chamber 30 and configured to urge the printed circuit board 40 towards the vapor chamber 30. Components 70 on the printed circuit board 40 can be thermally connected to the vapor chamber 30 through a thermal interface material 80 (not shown in the figure), and the vapor chamber 30 can be thermally connected to the heat sink 20 through a thermal interface material 80 (not shown in the figure). The abutment of the protrusion 22 of the heat sink 20 against the printed circuit board 40 prevents the printed circuit board 40 from moving towards the heat sink 20. In other examples, the protrusion 22 of the heat sink 20 may generally not abut against the printed circuit board 40, but may be separated therefrom by a small gap. In this example, the protrusion 22 limits the range of movement of the printed circuit board 40 towards the heat sink 20.

[0053] In Figure 2A , 2B 2B and the example shown in FIG. 3, the protrusion 22 from the heat sink 20 has a cross-sectional area that closely matches the cross-sectional area of the aperture 32 in the vapor chamber 30. That is, the protrusion 22 forms a tight or snug fit with the aperture 32. Thus, the protrusion 22 acts as a guiding projection for correctly positioning the heat sink 20 relative to the vapor chamber 30.

[0054] Figure 4An example of the device 10 is shown, and in particular an example of the resilient biasing device 50 is shown. In this example, the resilient biasing device 50 is positioned by the protrusion 22. In the example shown, the resilient biasing device 50 surrounds the protrusion 22. Figure 4 A cross-sectional view through the heat sink 20 having the protrusion 22 and the vapor chamber 30 having the aperture 32 is shown. In this example, the resilient biasing device 50 is a helical spring having a diameter slightly larger than the diameter of the protrusion 22 and also slightly larger than the diameter of the aperture 32. When the heat sink 20 and the vapor chamber 30 are brought together, the protrusion 22 enters the aperture 32, and the resilient biasing device 50 (spring) is compressed and held within the gap between the heat sink 20 and the vapor chamber 30.

[0055] In the example shown, the heat sink 20 includes a recessed portion 24 for receiving and positioning the resilient biasing device 50. As the heat sink 20 and the vapor chamber 30 are brought to adjacent positions, the resilient biasing device 50 (spring) is partially compressed into the recessed portion 24. In this example, the recessed portion 24 is a groove in the surface of the heat sink 20 surrounding the protrusion 22. In this example, the protrusion 22 is cylindrical, the resilient biasing device 50 is a helical spring, and the aperture 32 is also cylindrical. Other suitable forms may be used.

[0056] Figure 9 An alternative example of the resilient biasing device 50 is shown. The device 10 uses a highly elastic thermal conductive gasket or foam as the resilient biasing device 50.

[0057] As previously described, at least one retainer 60 secures the printed circuit board 40 to the heat sink 20, thereby preventing the printed circuit board 40 from separating from the heat sink 20. In Figure 5 the example shown, at least one retainer 60 extends through a through-aperture 62 in the printed circuit board 40. In the example shown, at least one retainer 60 is a screw having a screw head 64 sized larger than the through-aperture 62 in the printed circuit board 40. The retainer 60 (screw) has a threaded portion 66 received by a threaded receiving portion 28 of the heat sink 20.

[0058] In some but not necessarily all examples, the threaded receiving portion 28 of the heat sink 20 for receiving the threaded portion 66 of the retainer 60 (screw) is present in the protrusion 22 from the heat sink 20. Such a protrusion 22 forms a retaining projection.

[0059] In some examples ( Figure 6A 、 6B 、6C), the retaining projection and the guiding projection may be the same component (protrusion 22). In other examples ( Figure 8A 、 8B ), the retaining projection protrusion 221 and the guiding projection protrusion 222 may be different components.

[0060] In a case where the same protrusion 22 is used as both a guiding protrusion and a retaining protrusion ( Figures 6A to 6C ), the retainer 60 extends through the aperture 32 in the heat spreader 30. In an instance where the retaining protrusion 221 is different from the guiding protrusion 222, at least one retainer 60 does not necessarily pass through the aperture 32 in the heat spreader 30.

[0061] Figure 6A 、 6B and 6C illustrate an example of the device 10. Figure 6A Shows an exploded perspective view of the components of the device 10. Figure 6B Shows a side view of the assembled device 10. Figure 6C Shows a cross-sectional view through the assembled device 10.

[0062] In the example shown from Figures 6A to 6C , the device 10 includes a heat sink 20, a heat spreader 30 connected to the heat sink 20 via a thermal interface material 80, and a printed circuit board 40 that supports the assembly 70, where the assembly 70 is thermally connected to the heat spreader 30 via the thermal interface material 80. The heat sink 20 includes protrusions 22 that serve as both guiding protrusions and retaining protrusions. The protrusions 22 extend through the aperture 32 in the heat spreader 30 and abut against the printed circuit board 40 adjacent to the through-aperture 62 in the printed circuit board 40. A retainer 60 (screw) extends through the aperture 62 in the printed circuit board 40, through the through-aperture 32 in the heat spreader 30, and into the threaded receiving portion 28 of the protrusion 22 of the heat sink 20. The head 64 of the retainer 60 (screw) is larger than the aperture 62 in the printed circuit board 40.

[0063] The protrusion 22 of the heat sink 20 has a circumferential recessed portion 24 that partially receives the resilient biasing device 50. In this example, the resilient biasing device 50 is a helical spring. The resilient biasing device is compressed at the position between the heat sink 20 and the heat spreader 30. The retainer 60 (screw) presses the heat sink 20 and the heat spreader 30 together onto the resilient biasing device 50 (spring) and presses the printed circuit board 40 and the heat spreader 30 together. In some instances, as Figure 7A shown, the resilient biasing device 50 (spring) can be attached to the heat spreader 30 at a position overlapping the aperture 32 in the heat spreader 30. In other instances, as Figure 7B shown, the resilient biasing device 50 (spring) can be connected to the heat sink 20, for example, within the recessed portion 24 of the heat sink 20.

[0064] Figure 8A and 8B illustrate another example of the device 10. This device 10 is the same as Figure 6A 、 6BSimilar to the device shown in 6C, except that in the previous example, a single protrusion 22 was used as both a guiding protrusion and a retaining protrusion, while in Figure 8A and 8B example, different physical components are used as the guiding protrusion 221 and the retaining protrusion 222. Thus, in this example, the retainer 60 (screw) passes through the aperture 62 in the printed circuit board 40 into the threaded receiving portion 28 of the retaining protrusion 221, without passing through the aperture 32 in the heat spreader 30.

[0065] Figure 8A Shows a cross-section through the assembled device 10. Figure 8B Shows an exploded perspective view of the components of the device 10.

[0066] In this example, the device 10 includes a heat sink 20, a heat spreader 30 connected to the heat sink 20 through a thermal interface material 80, and a printed circuit board 40 that supports the assembly 70, where the assembly 70 is thermally connected to the heat spreader 30 through a thermal interface material 80 (the thermal interface material 80 is not shown in Figure 8B . The heat sink 20 includes a guiding protrusion 222 and a retaining protrusion 221. The guiding protrusion 222 extends through the aperture 32 in the heat spreader 30. The retaining protrusion 221 abuts against the printed circuit board 40 adjacent to the through aperture 62 in the printed circuit board 40, but does not extend through the aperture 32 in the heat spreader 30. The retainer 60 (screw) extends through the aperture 62 in the printed circuit board 40 into the threaded receiving portion 28 of the retaining protrusion 221 of the heat sink 20. The head 64 of the retainer 60 (screw) is larger than the aperture 62 in the printed circuit board 40.

[0067] The guiding protrusion 222 of the heat sink 20 has a surrounding recessed portion 24 that at least partially receives the resilient biasing device 50. In this example, the resilient biasing device 50 is a helical spring. The resilient biasing device 50 is compressed at a position between the heat sink 20 and the heat spreader 30.

[0068] The retainer 60 (screw) presses the heat sink 20 towards the heat spreader 30 against the resilient biasing device 50 (spring), and presses the printed circuit board 40 towards the heat spreader 30. In some examples, the resilient biasing device 50 (spring) can be attached to the heat spreader 30 or connected to the heat sink 20, for example, within the recessed portion 24 of the heat sink 20.

[0069] Figure 9An example of the device 10 as previously described is shown, where the resilient biasing device 50 is a thermally conductive elastically deformable layer. The elastically deformable layer is compressed between the heat sink 20 and the vapor chamber 30. The elastically deformable layer forms a thermal bridge between the heat sink 20 and the vapor chamber 30, and in addition provides an elastic biasing force that pushes the vapor chamber 30 towards the component 70 and the printed circuit board 40. The elastically deformable layer provides: a resilient biasing device (functioning similar to a spring) and a thermal conduction bridge (functioning similar to a thermal interface material).

[0070] Figure 10 An example of the device 10 is shown, where the shape of the vapor chamber 30 is adjusted to conform to the shapes of different components 70 on the printed circuit board 40. In this example, the printed circuit board 40 has a plurality of components 70. Each of the plurality of components 70 contacts the vapor chamber 30 through a thermal interface material 80. The vapor chamber 30 has a three-dimensional shape that conforms to at least the height dimension 76 of the plurality of components 70. Thus, the vapor chamber 30 has variable convexities. The vapor chamber 30 has a raised profile adjacent to the thinner component 70 on the left side of the drawing, and a lower profile adjacent to the thicker component 70 in the middle of the drawing.

[0071] In some examples, such as Figure 11 shown in, the device 10 includes a vapor chamber 30 configured to match the lateral dimensions of the component 70. In this example, the vapor chamber 30 includes a three-dimensional contact area 34 sized to match the lateral dimension 74 and the height dimension 76 of the component 70. In this example, the vapor chamber 30 includes a wall portion designed to closely circumscribe the three-dimensional contact area 34 of the component 70. However, the height of the wall is less than the height of the component 70. As before, the thermal interface material 80 can be used to form a thermal bridge between the vapor chamber 30 and the component 70. In this example, the thermal interface material 80 can extend over the entire three-dimensional contact area 34, including the inner portion of the wall.

[0072] As Figure 12As shown, the apparatus 10 may additionally include physical features (ribs 21, 31) designed to improve thermal conductivity within the stack of elements / components (heat sink 20, vapor chamber 30, components 70). In this example, by using surface features (ribs 21) on the heat sink 20 that correspond to surface features (ribs 31) on the vapor chamber 30 in proximity, the surface area between the vapor chamber 30 and the heat sink 20 can be significantly increased. In the illustrated example, the vapor chamber 30 includes a series of parallel ribs 31, and the heat sink 20 includes a corresponding series of parallel ribs 21. The ribs 31, 21 are configured to interleave with each other and form a tight fit network with a high contact surface area. The gap between the ribs 21, 31 is filled with a thermal interface material 80. In other examples, one of the vapor chamber 30 and the heat sink 20 includes a series of parallel ribs, and the other of the vapor chamber 30 and the heat sink 20 includes a corresponding series of parallel depressions that receive the ribs and form a tight fit network with a high contact surface area. The gap between the ribs and the depressions is filled with a thermal interface material 80. Thus, the vapor chamber 30 includes a series of features, and the heat sink 20 includes a series of corresponding features configured to couple with each other and form a tight fit network with a high contact surface area.

[0073] In all of the foregoing examples, a thermal bridge may be formed between the vapor chamber 30 and the heat sink 20, and a thermal bridge may be formed between the vapor chamber 30 and one or more components 70 of the printed circuit board 40.

[0074] In some but not necessarily all examples, a thermal bridge may be formed using the thermal interface material 80. The material is preferably one that is compatible with the components as the interface therebetween, fills the gap well, and has a high thermal conductivity. The thermal interface material 80 may be, for example, a phase change material or a thermal grease. In some but not necessarily all examples, the thickness of the thermal interface material 80 is between 30 and 150 micrometers, or between 50 and 100 micrometers.

[0075] In some but not necessarily all examples, the thermal interface material 80 between the vapor chamber 30 and the heat sink 20 and the thermal interface material 80 between the vapor chamber 30 and one or more components 70 of the printed circuit board 40 may be different materials, or may be the same material.

[0076] In some but not necessarily all instances, the thermal interface material 80 between the vapor chamber 30 and the heat sink 20 is thinner than the thermal interface material 80 between the vapor chamber 30 and one or more components 70 of the printed circuit board 40, and can be a different material. In some but not necessarily all instances, the thermal interface material 80 (TIM1) between the vapor chamber 30 and the heat sink 20 has a thickness between 30 and 150 micrometers or between 50 and 100 micrometers. In some but not necessarily all instances, the thermal interface material 80 (TIM2) between the vapor chamber 30 and one or more components 70 of the printed circuit board 40 has a thickness of 0.5 mm.

[0077] The thermal interface material 80 between the vapor chamber 30 and the heat sink 20 fills the gap between the vapor chamber 30 and the heat sink 20. Manufacturing tolerances and deformations are mainly absorbed by this thermal interface layer. The thermal interface material 80 can be, for example, a thermal gel, a thermal foam, or a thermal gasket.

[0078] The thermal interface material 80 between the vapor chamber 30 and one or more components 70 of the printed circuit board 40 can be, for example, a phase change material or a thermal grease.

[0079] In some but not necessarily all instances, the vapor chamber 30 has the thermal interface material 80 on a first surface adjacent to the components 70 of the printed circuit board 40 and on an opposite second surface adjacent to the heat sink 20.

[0080] The devices described above can be particularly applied in high heat flux density applications. It is particularly advantageous in the case of air cooling. The air cooling can be forced air cooling, where a fan is used to generate an air flow. Or, the air cooling can be natural or passive, where no fan is used. It is expected that the device 10 can be used in 5G telecommunications equipment.

[0081] Therefore, the device 10 can be part of a larger component, such as a radio frequency transceiver, a mobile terminal, a base station, or an access point.

[0082] Figure 13A 、 13B and 13C illustrate an example of a method for manufacturing the device 10. In Figure 13A , the elastic biasing device 50 (spring) is placed into a holding portion 24 (not labeled) adjacent to the protrusion 22 of the heat sink 20 over the protrusion 22 of the heat sink 20. The thermal interface material 80 (not shown) is placed on the surface of the heat sink 20 on the same side as the protrusion 22. The vapor chamber 30 is positioned over the heat sink 20. The through-hole aperture 32 (not labeled) in the vapor chamber 30 receives the protrusion 22.

[0083] In Figure 13BIn [the figure], a printed circuit board 40 including at least one component 70 is connected to an exposed surface of a vapor chamber 30 via a thermal interface material 80 (not shown).

[0084] As Figure 13C As shown in [the figure], a retainer 60 is placed through an aperture 62 in the printed circuit board 40 and into a protrusion 22 (not labeled) of a heat sink 20. In this example, the same physical component (the protrusion 22) operates as both a guiding protrusion and a retaining protrusion. The printed circuit board 40 is fixed to the heat sink 20 by tightening a screw into a threaded receiving portion 28 of the protrusion 22.

[0085] In the case where structural features are described, the structural features may be replaced by means for implementing one or more of the functions of the structural features, regardless of whether the function or functions are explicitly or implicitly described.

[0086] The term "comprising" used in this document has an inclusive rather than an exclusive meaning. That is, whenever it is stated that X comprises Y, it means that X may comprise only one Y, or may comprise more than one Y. If the intention is to use "comprising" with an exclusive meaning, it will be clearly indicated in the context by referring to "comprising only one" or by using "consisting of".

[0087] In the descriptions herein, various examples are mentioned. The description of the features or functions of one example indicates that such features or functions exist in that example. The use of the terms "example" or "for example" or "may" or "might" in the text indicates that such features or functions exist at least in the described example whether or not explicitly stated, and the features or functions may (but need not) exist in some or all of the other examples. Thus, "example", "for example", "may" or "might" refer to a particular instance among a class of instances. The attributes of the instance may be the attributes of only that instance, or the attributes of the class, or the attributes of a subclass of the class that includes some but not all of the instances in the class. Thus, it is implicitly disclosed that features described with reference to one example but not with reference to another example may, where possible, be used as part of a working combination in that other example, but need not necessarily be used in that other example.

[0088] Although some examples have been described in the preceding paragraphs with reference to various instances, it should be recognized that modifications may be made to the given examples without departing from the scope of the claims.

[0089] The features described in the foregoing description may be used in other combinations than those explicitly described above.

[0090] Although some functions are described with reference to specific features, these functions can be implemented by other features, whether or not they are described.

[0091] Although some features are described with reference to specific instances, these features can also exist in other instances, whether or not they are described.

[0092] The terms "a" or "the" used in this document have an inclusive rather than an exclusive meaning. That is, unless the context clearly indicates the contrary, whenever it is mentioned that X includes a / the Y, it means that X can include only one Y, or can include more than one Y. If the intention is to use "a" or "the" with an exclusive meaning, it will be clearly indicated in the context. In some cases, "at least one" or "one or more" may be used to emphasize the inclusive meaning, but the absence of these terms should not be taken to imply an exclusive meaning.

[0093] The presence of a feature (or combination of features) in a claim relates not only to the feature (or combination of features) itself, but also to features (equivalent features) that achieve substantially the same technical effect. Equivalent features include, for example, features that are variants and achieve substantially the same result in substantially the same way. Equivalent features include, for example, features that implement substantially the same function in substantially the same way so as to achieve substantially the same result.

[0094] In the description herein, adjectives or adjective phrases are used to refer to individual instances in order to describe the characteristics of the instances. Such a description of a characteristic of an instance indicates that the characteristic exists in some instances exactly as described, and in other instances substantially as described.

[0095] Although the foregoing specification has been dedicated to drawing attention to those features that are considered important, it should be understood that the applicant may seek protection by claims for any patentable feature or combination of features mentioned above and / or shown in the drawings, whether or not emphasis has been placed thereon.

Claims

1. A device for heat dissipation, comprising: A heat sink, including one or more protrusions; A heat pipe, including at least one aperture for receiving the protrusions to extend therein; A printed circuit board; One or more elastic biasing devices positioned between the heat sink and the heat pipe around the one or more protrusions; And At least one retainer configured to overcome the elastic biasing device to urge the heat sink towards the heat pipe and configured to urge the printed circuit board towards the heat pipe, the retainer passing through the printed circuit board and into a corresponding receiving portion of the heat sink to fix the printed circuit board to the heat sink.

2. The device according to claim 1, wherein The heat sink includes a recessed portion for receiving and positioning the elastic biasing device.

3. The device according to claim 1, wherein The elastic biasing device is a spring.

4. The apparatus according to claim 1, wherein The protrusion penetrates through the heat pipe.

5. The device according to claim 4, wherein, The protrusion penetrates through the heat pipe to abut against the printed circuit board, and the retainer is within the protrusion at the corresponding receiving portion of the heat sink.

6. The device according to claim 5, wherein, The retainer penetrates through the heat pipe by entering into the corresponding receiving portion of the protrusion.

7. The device according to claim 1, wherein A first protrusion among the one or more protrusions penetrates through the heat pipe, and a second protrusion among the one or more protrusions includes a receiving portion for receiving the retainer.

8. The apparatus according to claim 1, wherein, The retainer is a screw.

9. The apparatus according to claim 1, wherein, The heat pipe includes a three-dimensional contact area whose size matches the dimension of at least one component on the printed circuit board.

10. The apparatus according to claim 1, wherein, The heat pipe has a three-dimensional shape conforming to at least the height dimension of multiple components on the printed circuit board.

11. The device according to claim 1, wherein, The heat sink and the heat pipe include mutually coupling features.

12. A telecommunication device, comprising the device according to any one of the preceding claims.

13. The telecommunication device according to claim 12, including a fan for forced air cooling.

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