A substrate peeling system, a peeling blade detection method, a device and a computing device

Abstract

The embodiment of the present invention discloses a substrate stripping system, a stripping blade detection method, device and computing device, including receiving a blade image captured by a shooting device; extracting blade line data in the blade image; comparing the extracted blade line data with the stored standard data and outputting a result value; judging whether the stripping blade is damaged according to the result value, if damaged, controlling the substrate stripping device to stop running; if not damaged, controlling the substrate stripping device to continue running. The problem of substrate cracking caused by damage to the stripping blade is effectively avoided, and the loss of production costs is avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to a substrate stripping system, a stripping blade detection method, a device and a computing device. Background Art

[0002] The semiconductor and MEMS (micro-electromechanical systems) electronics industries are making great efforts to improve performance and reduce product size. To achieve this requirement, methods such as reducing the thickness of the substrate or forming a circuit on the back of the substrate are now widely used. In order to protect the product and the progress of the process, it is necessary to stick a support substrate on the product substrate, and after the necessary process is completed, it is necessary to quickly, economically and cleanly peel off the support substrate.

[0003] There are two ways to stick the supporting substrate to the product: the first is to apply adhesive on both sides or all of a substrate, and the second is to stick the substrate with sticky tape. After the subsequent process is completed, the viscosity of the adhesive or tape is usually reduced or the two substrates are separated by a mechanical force greater than the adhesive force after partial peeling. Generally, mechanical tools (peeling blades or saws) are used for partial separation and then mechanical force is used for separation. In the prior art, the peeling blades used are very thin and sharp, and are easily damaged by physical impact. After the blade is damaged, the peeling blade will damage the substrate if it continues to perform the separation operation, resulting in loss of production costs. Summary of the invention

[0004] To solve the above problems, at least one problem to be solved by the present invention is to provide a computing device capable of detecting a stripping blade, so as to monitor the stripping blade in real time and prevent the substrate from being damaged due to the breakage of the stripping blade.

[0005] Another problem to be solved by the present invention is to provide a method for detecting a stripping blade using the above-mentioned computing device.

[0006] Another problem to be solved by the present invention is to provide a substrate peeling system including the above-mentioned computing device.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] According to one aspect of the present invention, there is provided a stripping blade detection method, comprising:

[0009] S1, receiving a blade image captured by a shooting device;

[0010] S2, extracting blade line data from the blade image;

[0011] S3, comparing the extracted blade line data with the standard data stored in the memory, and outputting the result value;

[0012] S4, judging whether the stripping blade is damaged according to the result value, if damaged, controlling the substrate stripping device to stop running; if not damaged, controlling the substrate stripping device to continue running.

[0013] In addition, a preferred solution is that the step of judging whether the blade is damaged according to the result value comprises:

[0014] Compare the result value with the critical value pre-stored in the memory, and if the result value is higher than the critical value, it is determined that the stripping blade is not damaged;

[0015] If the result value is lower than or equal to the critical value, it is determined that the stripping blade is damaged.

[0016] In addition, a preferred solution is that after the stripping blade is replaced or before it is used, a blade image is captured and blade line data of the stripping blade is extracted, and the blade line data is stored as standard data.

[0017] In addition, it is preferred that the step of extracting the blade line data comprises:

[0018] Acquire a number of edge points of the blade in the blade image;

[0019] Determine the edge line of the blade according to each edge point;

[0020] The average distance between each edge point and the edge line is calculated and obtained as the blade line data.

[0021] According to another aspect of the present invention, there is provided a stripping blade detection device, comprising:

[0022] A receiving module, used for receiving the blade image captured by the shooting device and extracting the blade line data;

[0023] An analysis module, for comparing the extracted blade line data with the stored standard data to determine whether the stripping blade is damaged;

[0024] The control module is used to control the substrate stripping device to stop running when the stripping blade is judged to be damaged, and to control the substrate stripping device to continue running when the stripping blade is judged to be undamaged.

[0025] In addition, a preferred solution is that the receiving module includes:

[0026] An image receiving submodule, used for receiving a blade image captured by a photographing device;

[0027] The data extraction submodule is used to extract the blade line data of the blade image received by the image extraction submodule.

[0028] In addition, it is preferred that the analysis module comprises:

[0029] The result value comparison submodule is used to compare the blade line data with the standard data and calculate the result value;

[0030] The detection submodule is used to determine whether the stripping blade is damaged according to the result value.

[0031] According to another aspect of the present invention, there is provided a computing device, comprising a processor and a memory, wherein the memory stores a program, and the processor implements the above-mentioned stripping blade detection method when executing the program.

[0032] According to another aspect of the present invention, there is provided a substrate peeling system, comprising:

[0033] A stripping blade, used for preliminarily separating the product substrate and the substrate to be stripped;

[0034] A substrate peeling device, used for peeling the substrate to be peeled off from the product substrate;

[0035] a camera for capturing an image of the blade edge of the stripping blade;

[0036] The computing device is used to detect whether the stripping blade is damaged;

[0037] The substrate peeling device comprises:

[0038] Mobile platform, fixed platform, mobile roller, lifting roller and roller controller;

[0039] The mobile platform is used to fix the substrate to be peeled off;

[0040] The fixed platform is used to fix the product substrate;

[0041] The roller controller is used to apply a set force to the moving roller and the lifting roller, and control the moving roller and the lifting roller to move in a direction parallel to the surface of the product substrate and a direction perpendicular to the surface of the product substrate, so that when the substrate to be peeled off is peeled off, the lifting roller is located on the side of the substrate to be peeled off that is adjacent to the product substrate, and the moving roller is located on the side of the substrate to be peeled off that is away from the product substrate, and the lifting roller and the moving roller are moved in a direction parallel to the surface of the product substrate with a preset height difference, so that the substrate to be peeled off is peeled off from the product substrate along the moving trajectory of the moving roller.

[0042] In addition, a preferred solution is that the roller controller includes a roller support structure and a roller driver;

[0043] The roller support structure is used to support the lifting roller and the moving roller;

[0044] The roller driver is used to apply a set force to the moving roller and the lifting roller, and control the moving roller and the lifting roller to move in a direction parallel to the surface of the product substrate and a direction perpendicular to the surface of the product substrate.

[0045] The beneficial effects of this application are as follows:

[0046] In response to the technical problems existing in the prior art, the embodiments of the present application provide a substrate stripping system, a stripping blade detection method, device and computing equipment. On the basis of the original wafer stripping system, a computing equipment for detecting the stripping blade is added. Before each substrate stripping operation, the stripping blade is photographed by a photographing device, and the photographed blade information is compared with the complete blade information stored in the computing equipment. According to the comparison result, it is determined whether the stripping blade needs to be replaced, thereby effectively avoiding the problem of substrate breakage caused by damage to the stripping blade and avoiding the loss of production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0048] Figure 1 A schematic structural diagram of a substrate peeling system provided in this embodiment is shown.

[0049] Figure 2 A schematic structural diagram of the substrate peeling device provided in this embodiment is shown.

[0050] Figure 3a-3d A schematic diagram showing the working process of the substrate peeling device provided in this embodiment is shown.

[0051] Figure 4 A schematic diagram showing the lifting roller and the moving roller provided in this embodiment.

[0052] Figure 5 A schematic structural diagram of another substrate peeling device provided in this embodiment is shown.

[0053] Figure 6 A schematic structural diagram of the stripping blade detection device provided in this embodiment is shown.

[0054] Figure 7 A schematic diagram showing the structure of a computing device provided in this embodiment is shown.

[0055] Figure 8 A schematic flow chart of the stripping blade detection method provided in this embodiment is shown.

[0056] Fig. 9 An image of the blade edge of an unused stripping blade is shown.

[0057] Fig.10 A magnified image of a random portion of the blade image of an unused stripping blade is shown.

[0058] Fig.11 An image of the blade edge of a stripping blade after use is shown.

[0059] Fig.12 An enlarged image of a random portion of the blade edge image of a used exfoliation blade is shown. DETAILED DESCRIPTION

[0060] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0061] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0062] It should also be noted that, in the description of the present application, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or equipment. In the absence of further restrictions, the elements defined by the statement "comprise one..." do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0063] In order to overcome the defects of the prior art, an embodiment of the present invention provides a substrate peeling system, combined with Figure 1-5As shown, the substrate peeling system includes a peeling blade 1, a substrate peeling device 2, a photographing device 3 and a computing device 4. In this embodiment, the peeling blade 1 is used to be inserted between the bonding surface of the product substrate 101 and the substrate to be peeled 102 before the substrate peeling device 2 performs the peeling work, so that a certain gap is generated between the two, which facilitates the peeling work of the substrate peeling device 2. The photographing device 3 is used to photograph the peeling blade 1 after the substrate peeling device 2 completes the peeling work, collect the image of its blade and transmit it to the computing device 4, and the computing device 4 detects whether the peeling blade 1 is damaged and whether it will damage the substrate in the subsequent peeling work.

[0064] In a specific embodiment, the substrate peeling device 2 includes a moving platform 21, a fixed platform 22, a moving roller 23, a lifting roller 24 and a roller controller 25;

[0065] The mobile platform 21 is used to fix the substrate 102 to be peeled off;

[0066] The fixing platform 22 is used to fix the product substrate 101;

[0067] The roller controller 25 is used to apply a set force to the moving roller 23 and the lifting roller 24, and control the moving roller 23 and the lifting roller 24 to move in a direction parallel to the surface of the product substrate 101 and a direction perpendicular to the surface of the product substrate 101, so that when the substrate 102 to be peeled off is peeled off, the lifting roller 24 is located on the side of the substrate 102 to be peeled off that is adjacent to the product substrate 101, and the moving roller 23 is located on the side of the substrate 102 to be peeled off that is away from the product substrate 101, and the lifting roller 24 and the moving roller 23 are moved in a direction parallel to the surface 103 of the product substrate with a preset height difference, so that the substrate 102 to be peeled off is peeled off from the product substrate 101 along the moving trajectory of the moving roller 23.

[0068] The movable platform 21 may include a movable fixing plate 211, which moves along with the substrate 102 to be peeled when the substrate 102 to be peeled is peeled, and when the substrate 102 to be peeled is completely peeled off from the product substrate 101, the substrate 102 to be peeled can be moved away along with the movable fixing plate 211. The preset height difference can be adjusted according to the peeling situation.

[0069] Figure 3a-3d It is a schematic diagram of the substrate peeling process provided in this embodiment. In this embodiment, before peeling, the product substrate 101 and the substrate to be peeled 102 are bonded together by the adhesive layer 103, the product substrate 101 is fixed on the fixed platform 22, and the movable fixed plate 211 moves downward to contact and fix the substrate to be peeled 102. Once the fixing is completed, the preparation work before peeling is completed.

[0070] After the peeling work is ready, the roller controller 25 controls the lifting roller 24 and the moving roller 23 to move to the vicinity of the peeling fulcrum, and the moving roller 23 moves downward, and the movable fixed plate 211 is pressed with a certain force. The pressing force at this time is set or actively selected according to the engineering and product conditions in advance, and an exemplary pressing force can be 400-600N. The roller controller 25 controls the lifting roller 24 to rise, and applies a load force to the movable fixed plate 211. The load force can also be set in advance or actively selected according to the engineering environment and material conditions.

[0071] After the lifting roller 24 rises to the preset position, the moving roller 23 and the lifting roller 24 move in a direction parallel to the surface of the product substrate 101, and start to peel the substrate 102 to be peeled. When there is no abnormality in the peeling, the moving roller 23 and the lifting roller 24 move in a stable position state, and separate the substrate 102 to be peeled and the product substrate 101 with a balanced force.

[0072] After the peeling is completed, the force loaded on the moving roller 23 and the lifting roller 24 is released, and the substrate 102 to be peeled is adsorbed on the moving fixed plate 211 and returns to its original position, completing the peeling process.

[0073] Specifically, during the peeling process, the peeling fulcrum is located below the moving roller 23. The position of the peeling fulcrum can be adjusted by adjusting the position of the moving roller 23. The peeling speed can be adjusted by controlling the moving speed of the moving roller 23 and the lifting roller 24. The relative position of the lifting roller 24 and the moving roller 23 is adjusted according to the peeling situation, thereby adjusting the peeling angle of the substrate to be peeled, and adjusting the peeling force by adjusting the force applied to the lifting roller 24. The solution of this embodiment can accurately and quickly adjust the position of the peeling fulcrum, the peeling angle and the peeling force according to the adhesion of different products, and can perform precise peeling control. According to the changes in materials and environment, the best and minimum force can be used to peel a variety of products, thereby improving the peeling efficiency. In addition, during the substrate peeling process, the solution of this embodiment can adjust the force and position of the moving roller and the lifting roller in real time according to the adhesive force between the substrates to prevent damage to the product substrate 101.

[0074] In a specific embodiment, the roller controller 25 includes a roller support structure 251 and a roller driver 252;

[0075] The roller support structure 251 is used to support the lifting roller 24 and the moving roller 23;

[0076] The roller driver 252 is used to apply a set force to the moving roller 23 and the lifting roller 24 , and control the moving roller 23 and the lifting roller 24 to move in a direction parallel to the surface of the product substrate 101 and a direction perpendicular to the surface of the product substrate 101 .

[0077] Specifically, the roller support structure 251 can also move in a direction parallel to the surface of the product substrate 101 and perpendicular to the surface of the product substrate 101 under the drive of the roller driver 252. When the moving roller 23 and the lifting roller 24 need to move synchronously, the support structure 113 can be directly driven to move the moving roller 23 and the lifting roller 24 synchronously. The roller driver 252 can also drive the moving roller 23 and the lifting roller 24 to move independently.

[0078] The figure only shows the position of the roller driver 252 by way of example, and is not intended to limit the present invention.

[0079] In a specific embodiment, the mobile platform 21 includes a movable fixed plate 211, a base 212 and a support table 213;

[0080] The support platform 213 is fixed to the base 212;

[0081] The movable fixing plate 211 is connected to the support platform 213, and the support platform 213 includes a slide rail, and the movable fixing plate 211 can move along the slide rail;

[0082] The movable fixing plate 211 is used to fix the substrate 102 to be peeled off.

[0083] Specifically, the movable fixing plate 211 can fix the substrate 102 to be peeled off by vacuum pressure. When the substrate 102 to be peeled off is peeled off, the movable fixing plate 211 moves with the peeled substrate 102 to be completely peeled off. Figure 3a-3b , the peeled portion of the substrate 102 to be peeled and the position of the movable fixing plate 211 are raised.

[0084] In a specific embodiment, the fixing platform 22 includes a vacuum suction cup (not shown), and the vacuum suction cup is used to fix the product substrate 101 .

[0085] Specifically, the vacuum suction cup fixes the product substrate 101 through vacuum pressure, which can effectively prevent the product substrate 101 from being damaged.

[0086] In a specific embodiment, the substrate peeling device further includes:

[0087] Position sensor 26 and pressure sensor 27;

[0088] The position sensor 26 is used to detect the positions of the lifting roller 24 and the moving roller 23;

[0089] The pressure sensor 27 is used to detect the force applied by the lifting roller 24 and the moving roller 23 to the substrate 102 to be peeled.

[0090] Specifically, the position sensor 26 may be an optical position sensor such as a laser position sensor or an ultrasonic position sensor, or may be other types of position sensors, such as a camera, which can determine the positions of the lifting roller 24 and the moving roller 23 by taking images, and this embodiment does not specifically limit this. The pressure sensor 27 can determine the force applied by the lifting roller 24 and the moving roller 23 to the substrate 102 to be peeled off by detecting the force applied by the roller driver 252 to the lifting roller 24 and the moving roller 23. In this case, the pressure sensor 27 can be arranged between the lifting roller 24 and the moving roller 23 and the roller driver 252. The pressure sensor 27 can also directly detect the force applied by the lifting roller 24 and the moving roller 23 to the substrate 102 to be peeled off. In this case, the pressure sensor 27 can be directly arranged on the surface of the lifting roller 24 and the moving roller 23.

[0091] It should be noted that this embodiment only illustrates the positions of the position sensor 26 and the pressure sensor 27 by way of example, and does not limit the present invention. The specific positions of the position sensor 26 and the pressure sensor 27 can be set as required.

[0092] Optionally, the roller driver 252 is also used to adjust the force applied to the moving roller 23 and the lifting roller 24 and adjust the position of the moving roller 23 and the lifting roller 24 according to the data measured by the position sensor 26 and the pressure sensor 27.

[0093] Specifically, the roller driver 252 can determine the current substrate peeling state according to the data measured by the position sensor 26. For example, when the peeling force is equal to the adhesive force, there is no need to adjust the force applied to the moving roller 23 and the lifting roller 24. When the peeling force is greater than the adhesive force, the force applied to the lifting roller 24 can be reduced, and the relative position of the lifting roller 24 and the moving roller 23 can be adjusted to reduce the peeling angle. When the peeling force is less than the adhesive force, the force applied to the lifting roller 24 can be increased, and the relative position of the lifting roller 24 and the moving roller 23 can be adjusted to increase the peeling angle.

[0094] Figure 4 Schematic diagram of the lifting roller and the moving roller provided in this embodiment. Figure 4 The lifting roller includes at least two sub-rollers 241 , and the at least two sub-rollers 241 are arranged in sequence along the length direction of the moving roller 23 .

[0095] Specifically, each sub-roller 241 corresponds to a part of the substrate 102 to be peeled off, and is used to peel off the part of the substrate 102 to be peeled off. At least two sub-rollers 241 can be controlled separately, and the peeling force can be controlled more accurately. In addition, for products with different bonding strengths between the product substrate 101 and the substrate 102 to be peeled off, the substrate 102 to be peeled off can also be peeled off by adjusting the position and strength of each sub-roller 241 to avoid insufficient peeling force or excessive peeling force.

[0096] Figure 5 is a schematic diagram of another substrate peeling device provided in this embodiment, optionally, refer to Figure 5 , the substrate peeling device also includes:

[0097] The pressure detector 28 is used to detect the vacuum pressure between the vacuum suction cup and the product substrate 101, and the vacuum pressure between the movable fixing plate 211 and the substrate 102 to be peeled off.

[0098] Specifically, by detecting the vacuum pressure between the vacuum suction cup and the product substrate 101, and the vacuum pressure between the movable fixing plate 211 and the substrate 102 to be peeled off, the fixing stability of the vacuum suction cup on the product substrate 101 and the fixing stability of the movable fixing plate 211 on the substrate 102 to be peeled off can be determined. When there is no abnormality in the fixation, the peeling process is started to avoid the product substrate 101 or the substrate 102 to be peeled off from falling due to fixing problems during the peeling process.

[0099] In the actual work process, the preparation work is first carried out, and the product to be peeled is placed on the fixed platform 22. The fixed platform 22 adsorbs and fixes the product substrate 101, and the movable fixed plate 211 moves down to adsorb and fix the substrate 102 to be peeled. Then the peeling blade 1 is inserted between the joint surface of the product substrate 101 and the substrate 102 to be peeled, and the movable fixed plate 211 begins to lift with the set force. At this time, the moving roller 23 and the lifting roller 24 move to the half position with appropriate force and speed to ensure that the product substrate 101 and the substrate 102 to be peeled will not form cracks or breakage during the separation process. When the product substrate 101 and the substrate 102 to be peeled are separated by more than half, in order to avoid damaging the substrates, it is necessary to reduce the force and speed of the moving roller 23 and the lifting roller 24 until the product substrate 101 and the substrate 102 to be peeled are completely separated. After removing the product substrate 101 and the substrate to be stripped 102, the shooting device 3 is started to take a picture to obtain the blade image of the stripping blade 1, and the blade image is transmitted to the computing device 4, and the computing device 4 determines whether it is necessary to replace the stripping blade 1. The computing device 4 extracts the blade line data of the received blade image, compares the blade line data with the stored standard data, obtains the result value, and compares the comparison result with the preset critical value. If the result value is lower than or equal to the critical value, it indicates that the stripping blade 1 has not reached the degree of damage and can continue to be used; if the result value is higher than the critical value, the stripping blade 1 may damage the substrate and needs to be replaced, and the computing device 4 controls the substrate stripping device to stop running.

[0100] The substrate stripping system provided by the present invention takes the blade image of the stripping blade 1 as the object, and the computing device 4 uses an algorithm to extract the blade line data of the blade image of the brand new stripping blade as standard data for storage. Before each substrate stripping operation, the blade image of the stripping blade 1 is obtained, and its blade line data is extracted for comparison with the standard data. If the result value does not exceed the critical value, the stripping blade 1 does not need to be replaced, and the substrate stripping operation can continue; if the result value is higher than the critical value, the stripping blade 1 may damage the substrate during use, and the stripping blade 1 needs to be replaced, and the substrate stripping device 2 is controlled to stop running and the stripping blade 1 is replaced. The substrate stripping system provided by this embodiment effectively avoids the problem of substrate damage caused by the damage of the stripping blade, and avoids the loss of production materials and production costs.

[0101] In one embodiment, Figure 6 As shown, the computing device 4 includes a memory 41, a processor 42, and a computer program stored in the memory 41 and executable by the processor 42. The computer program is used to detect whether the stripping blade 1 is damaged. The computer program is stored in a space for program code in the memory 41. When the computer program is executed by the processor 42, a method for detecting whether the stripping blade 1 is damaged is implemented.

[0102] The embodiment of the present application also provides a stripping blade detection device 5, such as Figure 7 As shown, the stripping blade detection device 5 includes a receiving module 51, an analyzing module 52 and a control module 53. The receiving module 51 is used to receive the blade image taken by the shooting device 3 and extract the blade line data of the blade image. The analyzing module 52 is used to compare the extracted blade line data with the standard data to analyze whether the stripping blade is damaged. The control module 53 is used to control whether the substrate stripping device 2 continues to operate according to the result of the analyzing module 52.

[0103] In a specific embodiment, the receiving module 51 includes an image receiving submodule 511 and a data extraction submodule 512. The image receiving submodule 511 is used to receive the blade image of the stripping blade 1 taken by the shooting device 3, and the data extraction submodule 512 is used to extract the blade line data of the blade image received by the image receiving submodule 511. The analysis module 52 analyzes the blade line data to detect whether the stripping blade 1 is damaged.

[0104] In a specific embodiment, the analysis module 52 includes a result value comparison submodule 521 and a detection submodule 522. The result value comparison submodule 521 compares the blade line data extracted by the receiving module 51 with the stored standard data and outputs a result value; the detection submodule 522 compares the result value with a preset critical value and determines whether the stripping blade 1 needs to be replaced according to the comparison structure. If the result value is higher than the critical value, it is determined that the stripping blade is not damaged and does not need to be replaced; if the result value is lower than or equal to the critical value, it is determined that the stripping blade 1 is damaged, which may cause damage to the substrate during operation, and the control module controls the substrate stripping device 2 to stop running and replace the stripping blade 1.

[0105] Specifically, the critical value may be set according to actual needs or production experience, and may also be modified and adjusted according to changes in needs during subsequent production processes.

[0106] In this embodiment, if the stripping blade is determined to be a new stripping blade, the result value output by the result value comparison submodule 521 is the blade line data of the new stripping blade, which can be used as the standard data of the blade after subsequent use. Therefore, the blade line data needs to be stored in the standard database for subsequent call.

[0107] Another embodiment of the present invention provides a stripping blade detection method, which uses a computing device 4 to detect whether the stripping blade 1 is damaged, comprising the following steps:

[0108] S1, the image receiving submodule 511 receives the blade image of the peeling blade 1 taken by the shooting device 3;

[0109] S2, the data extraction submodule 512 extracts the blade line data in the blade image received by the image receiving submodule 511;

[0110] S3, the analysis module 52 compares the blade line data with the stored standard data and outputs the result value;

[0111] S4, the analysis module 52 determines whether the stripping blade is damaged according to the result value, and the control module 53 controls the start and stop of the substrate stripping device according to the analysis result of the analysis module 52. Specifically, if the result output by the analysis module 52 is that the stripping blade 1 is damaged, the control module 53 controls the substrate stripping device 2 to stop running and replace the stripping blade 1; if the result output by the analysis module 52 is that the stripping blade 1 is not damaged and can continue to be used, the control module 53 controls the substrate stripping device 2 to continue running.

[0112] In a specific embodiment, if the method for obtaining the standard data in step S3 is: after replacing a new stripping blade or before the stripping blade is used, photograph the stripping blade to obtain a blade image of the stripping blade, extract the blade line data in the blade image, and store the blade line data as standard data. Since the blade information of each stripping blade is different, if the same standard data is used, the detection result will not be consistent with the actual situation. Therefore, when performing data comparison in this embodiment, the blade line data of the stripping blade after use is compared with the blade line data when it is not used; in order to further ensure accuracy, the blade line data can also be obtained by taking an average of multiple measurements.

[0113] In a specific embodiment, in step S4, the analysis module 52 compares the result value with the critical value pre-stored in the memory 41 to determine whether the stripping blade 1 is damaged. If the result value is lower than or equal to the critical value, it is determined that the stripping blade 1 has reached the degree of damage and can continue to be used, and the control module 53 controls the substrate stripping device 2 to continue to operate; if the result value is higher than the critical value, it is determined that the stripping blade 1 has reached the degree of damage, and continued use may cause damage to the substrate, resulting in loss of production costs, and needs to be replaced, and the control module 53 controls the substrate stripping device 2 to stop operating.

[0114] Specifically, the step of extracting the blade line data includes:

[0115] Find several edge points at the cutting edge of the peeling blade in the blade image.

[0116] The edge line of the blade is determined according to each edge point. Specifically, the edge line of the blade can be calculated by using the Hough transform method, the RMS (root mean square value) algorithm, the RAMSAC (random sampling consensus) algorithm or the SVD (singular value decomposition) algorithm.

[0117] The average distance between each edge point and the edge line is calculated and obtained, and the average distance is the blade line data.

[0118] Due to environmental influences such as the quality of the captured image and the assembly condition of the blade, there may be a certain error between the calculated blade line data and the actual data, and it cannot be used directly as a result. In this embodiment, the blade line data of an unused stripping blade is used as standard data, and the blade line data of the used stripping blade is compared with the standard data, which can eliminate the above environmental errors and obtain a relatively accurate result value.

[0119] By comparing the result value with the preset critical value, it is possible to accurately determine whether the stripping blade is damaged.

[0120] Specifically, after replacing a new stripping blade, or before the stripping blade is used, the stripping blade is photographed to obtain a blade image of the stripping blade. Fig. 9 As shown in the figure, the local enlarged image of the blade image is as follows Fig.10 As shown, the blade line data in the blade image is extracted by the following formula:

[0121] Margin Line A:

[0122] ax+by+c=0

[0123] Any edge point P n Distance from line A:

[0124]

[0125] Each edge point P n The sum of all distances to edge line A:

[0126]

[0127] Each edge point P n Average distance from edge line A:

[0128]

[0129] The desired e new The value is the extracted blade line data, which is stored as standard data for comparison with the blade line data of the used stripping blade, and the result value is output to determine whether the blade is damaged.

[0130] After the stripping blade is used, a blade image of the stripping blade after use is captured. Fig.11 As shown, a partial enlarged view of the blade image is shown in 12, and the blade line data in the blade image is extracted by the following formula:

[0131] Margin line A':

[0132] ax'+by'+c=0

[0133] Any edge point P n The distance between ' and line A':

[0134]

[0135] Each edge point P n The sum of all distances between ' and edge line A':

[0136]

[0137] Each edge point P n The average distance between ' and edge line A':

[0138]

[0139] The desired e dmg The value is the blade line data of the used stripping blade. The blade line data is compared with the standard data and the result value Δ is output:

[0140] Δ=e dmg -e new

[0141] If the result value Δ is higher than a preset critical value, it is determined that the stripping blade is damaged; if the result value Δ is lower than or equal to the critical value, it is determined that the stripping blade is not damaged.

[0142] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. A stripping blade detection method, characterized in that: The following steps are involved: S1, receiving a blade image captured by a shooting device; S2, extracting blade line data from the blade image; S3, comparing the extracted blade line data with the standard data stored in the memory, and outputting the result value; S4, judging whether the stripping blade is damaged according to the result value, if damaged, controlling the substrate stripping device to stop running; if not damaged, controlling the substrate stripping device to continue running; The step of extracting blade line data in step S2 includes: Acquire a number of edge points of the blade in the blade image; Determine the edge line of the blade according to each edge point; The average distance between each edge point and the edge line is calculated and obtained as the blade line data.

2. The stripping blade detection method according to claim 1, characterized in that: The step of judging whether the blade is damaged according to the result value comprises: Compare the result value with the critical value pre-stored in the memory, and if the result value is higher than the critical value, it is determined that the stripping blade is damaged; If the result value is lower than or equal to the critical value, it is determined that the stripping blade is not damaged.

3. The stripping blade detection method according to claim 1 or 2, characterized in that: Also includes: After the stripping blade is replaced or before it is used, a blade image is captured and blade line data of the stripping blade is extracted, and the blade line data is stored as standard data.

4. A stripping blade detection device, characterized in that: include: A receiving module, used for receiving the blade image captured by the shooting device and extracting the blade line data; An analysis module, for comparing the extracted blade line data with the stored standard data to determine whether the stripping blade is damaged; A control module, used for controlling the substrate peeling device to stop running when the peeling blade is judged to be damaged, and controlling the substrate peeling device to continue running when the peeling blade is judged to be undamaged; The blade line data is the average distance between each edge point of the blade and the edge line in the blade image captured by the shooting device.

5. The detection device according to claim 4, characterized in that: The receiving module comprises: An image receiving submodule, used for receiving a blade image captured by a photographing device; The data extraction submodule is used to extract the blade line data of the blade image received by the image extraction submodule.

6. The detection device according to claim 4, characterized in that: The analysis module comprises: The result value comparison submodule is used to compare the blade line data with the standard data and calculate the result value; The detection submodule is used to determine whether the stripping blade is damaged according to the result value.

7. A computing device comprising a processor and a memory, wherein the memory stores a program, characterized in that: When the processor runs the program, the stripping blade detection method according to any one of claims 1 to 3 is executed.

8. A substrate peeling system, characterized in that: include: A stripping blade, used for preliminarily separating the product substrate and the substrate to be stripped; A substrate peeling device, used for peeling the substrate to be peeled off from the product substrate; a camera for capturing an image of the blade edge of the stripping blade; The computing device of claim 7 is used to detect whether a stripping blade is damaged; The substrate peeling device comprises: Mobile platform, fixed platform, mobile roller, lifting roller and roller controller; The mobile platform is used to fix the substrate to be peeled off; The fixing platform is used to fix the product substrate; The roller controller is used to apply a set force to the moving roller and the lifting roller, and control the moving roller and the lifting roller to move in a direction parallel to the surface of the product substrate and a direction perpendicular to the surface of the product substrate, so that when the substrate to be peeled off is peeled off, the lifting roller is located on the side of the substrate to be peeled off that is adjacent to the product substrate, and the moving roller is located on the side of the substrate to be peeled off that is away from the product substrate, and the lifting roller and the moving roller are moved in a direction parallel to the surface of the product substrate with a preset height difference, so that the substrate to be peeled off is peeled off from the product substrate along the moving trajectory of the moving roller.

9. The substrate peeling system according to claim 8, characterized in that: The roller controller includes a roller support structure and a roller driver; The roller support structure is used to support the lifting roller and the moving roller; The roller driver is used to apply a set force to the moving roller and the lifting roller, and control the moving roller and the lifting roller to move in a direction parallel to the surface of the product substrate and a direction perpendicular to the surface of the product substrate.

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