An automatic design method for solder mask large copper surface based on Genesis

Abstract

The present invention provides a Genesis-based automatic design method for solder-proof large copper surfaces, and relates to the technical field of solder-proof large copper surface design. The Genesis-based automatic design method for solder-proof large copper surfaces comprises the following steps: S1, copying all large copper surfaces of the circuit layer corresponding to the solder-proof surface to an auxiliary layer big_copper_layer; S2, finding all the disks that need solder-proof windows on the circuit layer corresponding to the solder-proof surface, and at the same time, the disks touch the corresponding elements on the big_copper_layer layer prepared in step 1, and putting these satisfying disks uniformly into the pad_touch_copper auxiliary layer. The present invention improves the working method, so that the working efficiency is increased by more than 98%, the error rate is reduced to zero, the copper surface is optimized, and the effect of removing small objects is achieved by zooming in and out.

Description

Technical Field

[0001] The invention relates to the technical field of solder-resistant large copper surface design, and in particular to a Genesis-based automatic solder-resistant large copper surface design method. Background Art

[0002] Genesis is a computer-aided manufacturing software used in circuit board manufacturing companies. It allows users to perform secondary development based on the existing functions to meet their own needs.

[0003] Before PCB production, it is generally necessary to optimize the design data to meet production needs. In the preparation of solder mask data, one particularly important thing is that the window part on the large copper surface needs to be reduced in size, so that the welding area can meet the customer's design requirements. However, currently, personnel complete the production of graphics by manually adding negative film data to the copper surface part. The workload of personnel during production is large, there are various shapes, and the complexity is high. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the deficiencies in the prior art, the present invention provides a Genesis-based automatic design method for solder-resistant large copper surfaces, which solves the defects and deficiencies in the prior art.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented by the following technical scheme: a Genesis-based automatic design method for solder mask large copper surface, the method comprising the following steps:

[0008] S1. Copy all the large copper surfaces of the circuit layer corresponding to the solder mask to an auxiliary layer big_copper_layer;

[0009] S2. Find all the pads that need solder mask openings on the corresponding circuit layer of the solder mask surface. At the same time, the pads touch the corresponding elements on the big_copper_layer layer prepared in step 1. Put these pads that meet the requirements into the pad_touch_copper auxiliary layer.

[0010] S3. Based on all pads on the auxiliary layer pad_touch_copper prepared in step 2, find the original design window on the solder mask window layer, and copy this part of the window to the pad_opening auxiliary layer. At the same time, remove the special window situations that the user defines and does not need to be processed through attributes. Check whether the window size on this auxiliary layer meets the optimal window size produced in the factory based on the circuit layer disk size. If not, the system automatically increases the window size to meet the requirements. The optimal window size is set by parameters, and the default value is 1.5mil for a single side.

[0011] S4, copy the big copper surface temporary layer big_copper_layer prepared in step 1 to opt_big_copper and enlarge the minimum size that the solder mask needs to cover on one side;

[0012] S5. Copy the optimal copper surface window single-side size of all elements on the pad_touch_copper auxiliary layer prepared in step 2, which is twice the size of the single-side, plus the minimum solder mask coverage size, to the opt_big_copper layer defined in step 4 with negative polarity to form a new copper surface shape.

[0013] S6. Optimize the opt_big_copper copper surface using the sel_cont_resize command. The optimization parameters are:

[0014] accuracy=>0.1,break_to_islands=>"yes",island_size=>0,hole_size=>0,drill_filter=>"no",corner_ctl=>"no"; At the same time, enlarge the minimum solder mask coverage size on one side of the opt_big_copper auxiliary layer copper surface to restore the part removed in the previous step 5;

[0015] S7, enlarge the auxiliary layer pad_opening made in step 3 by 2mil on one side and copy it to the new auxiliary layer correct_sm_opening, then copy all the elements on the opt_big_copper auxiliary layer to the correct_sm_opening auxiliary layer in the form of a negative film, process it into a copper surface, and optimize the copper surface. The optimization function uses sel_cont_resize, and the optimization parameters are:

[0016] accuracy=>0.1, break_to_islands=>"yes", island_size=>0, hole_size=>0, drill_filter=>"no", corner_ctl=>"no";

[0017] S8. To make a window on the copper surface, it is necessary to remove some element auxiliary layers. Enlarge the auxiliary layer pad_opening made in step 3 by 1 mil on one side and copy it to the new auxiliary layer sm_opening_free. Copy all elements on the correct_sm_opening auxiliary layer defined in step 7 to sm_opening_free in the form of a negative film, and optimize the copper surface.

[0018] S9, remove small filaments, copy the solder mask that needs to be optimized to the temporary layer tmp_layer, copy the sm_opening_free made in step 8 to the temporary layer tmp_layer in the form of a negative film, and optimize the copper surface at the same time. After processing, copy these elements to the auxiliary layer sliver_layer, and reduce the size of the single side of tmp_layer by 1mil and enlarge the copper surface size by 1mil, then enlarge the single side by 0.05mil and put it in the form of a negative film to sliver_layer, and optimize the copper surface at the same time. After processing, the elements on the sliver_layer are the filaments that need to be removed;

[0019] S10. Enlarge the element on the sliver_layer by 0.05mil on one side and copy it to the sm_opening_free layer, thus forming a large copper window part that needs to be removed from the solder mask.

[0020] S11. Copy the sliver_layer layer as a negative film to the formal solder mask layer to complete the production process of shrinking the window part on the large copper surface.

[0021] Preferably, the large copper surface in step 1 also includes thick lines and arcs that meet the conditions. The conditions for meeting the thick lines can be set through parameters, and the default value is 5 mil and above lines.

[0022] Preferably, the size in step 4 is defined by parameters, and the default value is 0.5 mil.

[0023] (III) Beneficial effects

[0024] The present invention provides a Genesis-based automatic design method for solder-resistant large copper surfaces. It has the following beneficial effects:

[0025] The present invention improves the working method, so that the working efficiency is increased by more than 98%, the error rate is reduced to zero, the copper surface is optimized, and the effect of removing small objects is achieved by zooming in and out. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram before the present invention is improved;

[0027] Figure 2 This is a schematic diagram of the improved embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Example:

[0030] like Figure 1-2 As shown, an embodiment of the present invention provides a Genesis-based automatic design method for solder mask large copper surface, the method comprising the following steps:

[0031] S1. Copy all the large copper surfaces of the circuit layer corresponding to the solder mask to an auxiliary layer big_copper_layer. The large copper surface also includes the thick circuits and arcs that meet the conditions. The conditions for meeting the thick circuits can be set through parameters. The default value is 5mil and above circuits.

[0032] S2. Find all the pads that need solder mask openings on the corresponding circuit layer of the solder mask surface. At the same time, the pads touch the corresponding elements on the big_copper_layer layer prepared in step 1. Put these pads that meet the requirements into the pad_touch_copper auxiliary layer.

[0033] S3. Based on all pads on the auxiliary layer pad_touch_copper prepared in step 2, find the original design window on the solder mask window layer, and copy this part of the window to the pad_opening auxiliary layer. At the same time, remove the special window situations that the user defines and does not need to be processed through attributes. Check whether the window size on this auxiliary layer meets the optimal window size produced in the factory based on the circuit layer disk size. If not, the system automatically increases the window size to meet the requirements. The optimal window size is set by parameters, and the default value is 1.5mil for a single side.

[0034] S4. Copy the big copper surface temporary layer big_copper_layer prepared in step 1 to opt_big_copper and enlarge the minimum size of the solder mask to be covered on one side. The size is defined by parameters and the default value is 0.5mil.

[0035] S5. Copy the optimal copper surface window single-side size of all elements on the pad_touch_copper auxiliary layer prepared in step 2, which is twice the size of the single-side, plus the minimum solder mask coverage size, to the opt_big_copper layer defined in step 4 with negative polarity to form a new copper surface shape.

[0036] S6. Optimize the opt_big_copper copper surface using the sel_cont_resize command. The optimization parameters are:

[0037] accuracy=>0.1,break_to_islands=>"yes",island_size=>0,hole_size=>0,drill_filter=>"no",corner_ctl=>"no"; At the same time, enlarge the minimum solder mask coverage size on one side of the opt_big_copper auxiliary layer copper surface to restore the part removed in the previous step 5;

[0038] S7, enlarge the auxiliary layer pad_opening made in step 3 by 2mil on one side and copy it to the new auxiliary layer correct_sm_opening, then copy all the elements on the opt_big_copper auxiliary layer to the correct_sm_opening auxiliary layer in the form of a negative film, process it into a copper surface, and optimize the copper surface. The optimization function uses sel_cont_resize, and the optimization parameters are:

[0039] accuracy=>0.1, break_to_islands=>"yes", island_size=>0, hole_size=>0, drill_filter=>"no", corner_ctl=>"no";

[0040] S8. To make a window on the copper surface, it is necessary to remove some element auxiliary layers. Enlarge the auxiliary layer pad_opening made in step 3 by 1 mil on one side and copy it to the new auxiliary layer sm_opening_free. Copy all elements on the correct_sm_opening auxiliary layer defined in step 7 to sm_opening_free in the form of a negative film, and optimize the copper surface.

[0041] S9, remove small filaments, copy the solder mask that needs to be optimized to the temporary layer tmp_layer, copy the sm_opening_free made in step 8 to the temporary layer tmp_layer in the form of a negative film, and optimize the copper surface at the same time. After processing, copy these elements to the auxiliary layer sliver_layer, and reduce the size of the single side of tmp_layer by 1mil and enlarge the copper surface size by 1mil, then enlarge the single side by 0.05mil and put it in the form of a negative film to sliver_layer, and optimize the copper surface at the same time. After processing, the elements on the sliver_layer are the filaments that need to be removed;

[0042] S10. Enlarge the element on the sliver_layer by 0.05mil on one side and copy it to the sm_opening_free layer, thus forming a large copper window part that needs to be removed from the solder mask.

[0043] S11. Copy the sliver_layer layer as a negative film to the formal solder mask layer to complete the production process of shrinking the window part on the large copper surface.

[0044] The present invention improves the working method, so that the working efficiency is increased by more than 98%, the error rate is reduced to zero, the copper surface is optimized, and the effect of removing small objects is achieved by zooming in and out.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A Genesis-based automatic design method for solder mask large copper surface, characterized by: The method comprises the following steps: S1. Copy all the large copper surfaces of the circuit layer corresponding to the solder mask to an auxiliary layer big_copper_layer; S2. Find all the pads that need solder mask openings on the corresponding circuit layer of the solder mask surface. At the same time, the pads touch the corresponding elements on the big_copper_layer layer prepared in step 1. Put these pads that meet the requirements into the pad_touch_copper auxiliary layer. S3. Based on all pads on the auxiliary layer pad_touch_copper prepared in step 2, find the original design window on the solder mask window layer, and copy this part of the window to the pad_opening auxiliary layer. At the same time, remove the special window situations that the user defines and does not need to be processed through attributes. Check whether the window size on this auxiliary layer meets the optimal window size produced in the factory based on the circuit layer disk size. If not, the system automatically increases the window size to meet the requirements. The optimal window size is set by parameters, and the default value is 1.5mil for a single side. S4, copy the big copper surface temporary layer big_copper_layer prepared in step 1 to opt_big_copper and enlarge the minimum size that the solder mask needs to cover on one side; S5. Copy the optimal copper surface window single-side size of all elements on the pad_touch_copper auxiliary layer prepared in step 2, which is twice the size of the single-side, plus the minimum solder mask coverage size, to the opt_big_copper layer defined in step 4 with negative polarity to form a new copper surface shape. S6. Optimize the opt_big_copper copper surface using the sel_cont_resize command. The optimization parameters are: accuracy=>0.1,break_to_islands=>"yes",island_size=>0,hole_size=>0,drill_filter=>"no",corner_ctl=>"no"; At the same time, enlarge the minimum solder mask coverage size on one side of the opt_big_copper auxiliary layer copper surface to restore the part removed in the previous step 5; S7, enlarge the auxiliary layer pad_opening made in step 3 by 2mil on one side and copy it to the new auxiliary layer correct_sm_opening, then copy all the elements on the opt_big_copper auxiliary layer to the correct_sm_opening auxiliary layer in the form of a negative film, process it into a copper surface, and optimize the copper surface. The optimization function uses sel_cont_resize, and the optimization parameters are: accuracy=>0.1, break_to_islands=>"yes", island_size=>0, hole_size=>0, drill_filter=>"no", corner_ctl=>"no"; S8. To make a window on the copper surface, it is necessary to remove some element auxiliary layers. Enlarge the auxiliary layer pad_opening made in step 3 by 1 mil on one side and copy it to the new auxiliary layer sm_opening_free. Copy all elements on the correct_sm_opening auxiliary layer defined in step 7 to sm_opening_free in the form of a negative film, and optimize the copper surface. S9, remove small filaments, copy the solder mask that needs to be optimized to the temporary layer tmp_layer, copy the sm_opening_free made in step 8 to the temporary layer tmp_layer in the form of a negative film, and optimize the copper surface at the same time. After processing, copy these elements to the auxiliary layer sliver_layer, and reduce the size of the single side of tmp_layer by 1mil and enlarge the copper surface size by 1mil, then enlarge the single side by 0.05mil and put it in the form of a negative film to sliver_layer, and optimize the copper surface at the same time. After processing, the elements on the sliver_layer are the filaments that need to be removed; S10. Enlarge the element on the sliver_layer by 0.05mil on one side and copy it to the sm_opening_free layer, thus forming a large copper window part that needs to be removed from the solder mask. S11. Copy the sliver_layer layer as a negative film to the formal solder mask layer to complete the production process of shrinking the window part on the large copper surface.

2. The Genesis-based automatic design method for solder mask large copper surface according to claim 1, characterized in that: The large copper surface in step 1 also includes thick lines and arcs that meet the conditions. The conditions for meeting the thick lines can be set through parameters, and the default value is 5 mil and above lines.

3. The Genesis-based automatic design method for solder mask large copper surface according to claim 1, characterized in that: The size in step 4 is defined by parameters, and the default value is 0.5mil.

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