Cooling fins and thermosyphon heat sinks

Abstract

The present invention discloses a heat dissipation fin and a thermosyphon radiator, wherein the heat dissipation fin comprises a plate body having a first end, wherein a condensation chamber and a reflux channel are formed in the plate body, wherein the condensation chamber is arranged near the first end and has a fluid inlet, wherein one end of the reflux channel is connected to the condensation chamber, and the other end extends in a direction away from the first end and has a fluid outlet. The technical solution improves the cooling effect on the heat source by combining phase change heat transfer and natural convection heat transfer, thereby improving the technical problem of poor heat dissipation efficiency of the thermosyphon radiator in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation, and in particular to a heat dissipation fin and a thermosyphon heat sink. Background Art

[0002] In the past decade, with the rapid development of communication equipment, supercomputing, data mining, e-commerce, artificial intelligence and other fields, the total heat dissipation demand has increased dramatically. The miniaturization of equipment has further increased the power density, and at the same time, it has also intensified the demand for efficient cooling solutions.

[0003] In the prior art, heat dissipation of electronic equipment can be achieved through a thermosyphon heat sink. Currently, the thermosyphon heat sink achieves heat dissipation through phase change heat transfer, and its heat dissipation efficiency is poor, and it is unable to achieve rapid heat dissipation of the heat source. Summary of the invention

[0004] Based on this, it is necessary to propose a heat dissipation fin and a thermosyphon heat sink to address the above problems, so as to improve the problem of poor heat dissipation efficiency of the thermosyphon heat sink in the prior art.

[0005] To this end, an embodiment provides a heat dissipation fin, including:

[0006] The plate body has a first end, and a condensation chamber and a reflux channel are formed in the plate body. The condensation chamber is arranged near the first end and has a fluid inlet. One end of the reflux channel is connected to the condensation chamber, and the other end extends in a direction away from the first end and has a fluid outlet.

[0007] In some embodiments of the heat dissipation fin, the fluid inlet and the fluid outlet are located on the same side of the plate body.

[0008] In some embodiments of the heat dissipation fin, the return channel extends in a curved manner.

[0009] In some embodiments of the heat dissipation fin, the return channel extends in a serpentine shape.

[0010] In some embodiments of the heat sink fin, the condensation chamber includes a first sub-chamber and a second sub-chamber, the fluid inlet and the first sub-chamber are respectively located on opposite sides of the second sub-chamber and are both connected to the second sub-chamber, and one end of the reflux channel is directly connected to the first sub-chamber.

[0011] In some embodiments of the heat dissipation fin, a distance between a wall of the fluid inlet away from the first end and the first end is smaller than a distance between a cavity wall of the second sub-cavity away from the first end and the first end.

[0012] In some embodiments of the heat sink fin, the heat sink fin further comprises a first support structure disposed in the condensing chamber, the first support structure comprises a plurality of first support assemblies spaced apart from each other, the first support assemblies comprise a plurality of first support members spaced apart from each other.

[0013] In some embodiments of the heat dissipation fin, a portion of the return channel close to the fluid outlet forms a return cavity, and in a first direction, a channel cross-sectional width of the return cavity is greater than a channel cross-sectional width of the return channel.

[0014] In some embodiments of the heat sink fin, the plate body also includes a second end arranged opposite to the first end, the reflux channel extends from the condensation chamber toward the second end, and the portion of the reflux channel near the fluid outlet is inclined from the second end toward the first end.

[0015] In some embodiments of the heat sink, there are more than one return channel.

[0016] The second aspect of the present invention provides a thermal siphon heat sink, comprising a substrate having a receiving cavity for accommodating a phase change working fluid and the heat dissipation fins as described in the first aspect, wherein the heat dissipation fins are fixed on the substrate, the condensation chamber is connected to the receiving cavity through the fluid inlet, and the reflux channel is connected to the receiving cavity through the fluid outlet.

[0017] The embodiments of the present invention have the following beneficial effects:

[0018] In the present invention, the heat dissipation fins are fixed to the substrate so that the first end of the plate body corresponds to the higher end of the substrate. Therefore, the condensation chamber of the heat dissipation fins is connected with the upper part of the receiving chamber through the fluid inlet, and the reflux channel formed by extending in the direction away from the first end is connected with the lower part of the receiving chamber through the fluid outlet, that is, in the vertical direction, the condensation chamber is higher than the reflux channel; the heat source is installed on the substrate, and the heat is transferred to the phase change working medium in the receiving chamber based on heat conduction. The liquid phase change working medium is evaporated into a gaseous phase change working medium by heat, and diffused into the condensation chamber through the fluid inlet. The gaseous phase change working medium in the condensation chamber The liquid phase-change working fluid will be condensed into liquid phase-change working fluid by heat exchange in the receiving chamber; the liquid phase-change working fluid will flow into the reflux channel due to gravity and then flow back into the receiving chamber. In this process, the phase-change working fluid in the reflux channel will further exchange heat with the outside world to reduce the temperature. The phase-change working fluid in the reflux channel has a lower temperature and a higher density than the phase-change working fluid in the receiving chamber. Conversely, the phase-change working fluid in the receiving chamber has a higher temperature and a lower density than the phase-change working fluid in the reflux channel. Therefore, the phase-change working fluid in the reflux channel flows into the receiving chamber and drives the phase-change working fluid in the receiving chamber to move upward, forming natural convection to enhance the cooling effect on the heat source. This technical solution improves the cooling effect on the heat source by combining phase change heat exchange and natural convection heat exchange, thereby improving the technical problem of poor heat dissipation efficiency of the thermosiphon radiator in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] in:

[0021] Figure 1 A schematic diagram of the overall structure of a thermosyphon radiator provided by the present invention at a first viewing angle is shown;

[0022] Figure 2 A schematic diagram of the overall structure of a thermosyphon radiator provided by the present invention at a second viewing angle is shown;

[0023] Figure 3 shows a schematic diagram of the exploded structure of a thermosyphon heat sink;

[0024] Figure 4 A partial structural schematic diagram of a heat dissipation fin is shown;

[0025] Figure 5 Another partial structural schematic diagram of the heat dissipation fins is shown.

[0026] Description of main component symbols:

[0027] 100, thermal siphon heat sink; 10, substrate; 10a, receiving cavity; 10b, injection hole; 10c, first plate surface; 10d, second plate surface; 10e, first connecting hole; 10f, second connecting hole; 11, main board; 12, cover plate; 13, second supporting structure; 131, second supporting assembly; 1311, second supporting member; 20, cooling fin; 20a, fluid inlet; 20b, fluid outlet; 21, plate body; 211, condensation chamber; 2111, first sub-chamber; 2112, second sub-chamber; 212, reflux channel; 213, reflux chamber; 214, first end; 215, second end; 22, first supporting structure; 221, first supporting assembly; 2211, first supporting member; 30, heat source. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many other different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0031] See also Figure 1-Figure 5In an embodiment of the present invention, a thermosyphon heat sink 100 is provided. The thermosyphon heat sink 100 can dissipate heat from heat sources 30 such as a central processing unit and a chip of a power electronic device, thereby ensuring that the power electronic device operates stably within a rated temperature range. The thermosyphon heat sink includes a substrate 10 having a receiving cavity 10a for accommodating a phase-change medium and a heat sink 20 fixed on the substrate 10 and connected to the receiving cavity 10a. Usually, the heat sink 20 and the heat source 30 are respectively fixed on two opposite surfaces of the substrate 10. The receiving cavity 10a can accommodate the phase-change medium. The liquid phase-change medium is evaporated by the heat source 30 to form a gaseous phase-change medium and flows into the heat sink 20. The gaseous phase-change medium condenses in the heat sink 20 to form a liquid phase-change medium and flows back to the receiving cavity 10a, thereby completing a heat dissipation cycle.

[0032] In order to improve the heat dissipation efficiency of the thermosyphon heat sink 100 so as to quickly dissipate heat from the heat source 30, the present invention further provides a heat dissipation fin 20, which includes a plate body 21, the plate body 21 having a first end 214 and a second end 215 opposite to each other, and a first direction from the first end 214 to the second end 215 is defined as a first direction. Figure 4 The Z1 direction shown in . A condensation chamber 211 and a reflux channel 212 are formed in the plate body 21. The condensation chamber 211 is arranged near the first end 214 and has a fluid inlet 20a. One end of the reflux channel 212 is connected to the condensation chamber 211, and the other end extends in a direction away from the first end 214 and has a fluid outlet 20b. It is worth mentioning that the relative arrangement of the first end 214 and the second end 215 mentioned here does not necessarily mean that the second end 215 is located at an absolutely opposite position to the first end 214. The second end 215 can be slightly offset relative to the first end 214, as long as it can be ensured that the reflux channel 212 as a whole extends downward in the vertical direction, and the liquid phase change working medium can flow back from the condensation chamber 211 along the reflux channel 212 to the receiving chamber 10a of the substrate 10 under the action of gravity.

[0033] In the present invention, the heat dissipation fin 20 is fixed to the substrate 10 so that the first end 214 of the plate body 21 corresponds to the higher end of the substrate 10. Therefore, the condensation chamber 211 of the heat dissipation fin 20 is connected to the upper side of the receiving chamber 10a through the fluid inlet 20a, and the return channel 212 extending in the direction away from the first end 214 is connected to the lower side of the receiving chamber 10a through the fluid outlet 20b, that is, in the vertical direction, the condensation chamber 211 is higher than the return channel 212; the heat source 30 is installed on the substrate 10, and the heat is transferred to the phase change working medium in the receiving chamber 10a based on heat conduction. The liquid phase change working medium is evaporated into a gaseous phase change working medium by heat, and diffused into the condensation chamber 211 through the fluid inlet 20a. The phase-change working medium in the condensing chamber 211 exchanges heat and condenses into a liquid phase-change working medium; the liquid phase-change working medium will flow into the reflux channel 212 based on gravity and then flow back into the receiving chamber 10a. In this process, the phase-change working medium in the reflux channel 212 further exchanges heat with the outside to reduce the temperature. The phase-change working medium in the reflux channel 212 has a lower temperature and a higher density than the phase-change working medium in the receiving chamber 10a. Conversely, the phase-change working medium in the receiving chamber 10a has a higher temperature and a lower density than the phase-change working medium in the reflux channel 212. Therefore, the phase-change working medium in the reflux channel 212 flows to the receiving chamber 10a and drives the phase-change working medium in the receiving chamber 10a to move upward, forming natural convection to enhance the cooling effect on the heat source 30. The technical solution improves the cooling effect on the heat source 30 by combining phase change heat exchange and natural convection heat exchange, thereby improving the technical problem of poor heat dissipation efficiency of the thermosiphon radiator 100 in the prior art.

[0034] At the same time, the liquid phase-change medium in the condensation chamber 211 flows back to the receiving chamber 10a through the reflux channel 212, avoiding the problem that the heat dissipation fins 20 need to be offset and set on the upper side of the substrate 10 to form reflux, thereby solving the problem that the thermal siphon radiator 100 occupies a large space due to the vertical offset setting of the heat dissipation fins 20 and the substrate 10; on the other hand, for heat sources 30 at different heights and different horizontal positions, there is no need to divide the height of the substrate 10, that is, the same receiving chamber 10a can be used to cool heat sources 30 at different horizontal positions and different heights, thereby improving the versatility of the thermal siphon radiator 100 and adapting to a variety of heat sources 30 with different structures. It should be noted that the phase-change medium in the receiving chamber 10a must be guaranteed to cover the heat source 30 at the highest point.

[0035] In some specific embodiments, the fluid inlet 20a and the fluid outlet 20b are located on the same side of the plate body 21 to ensure the fluid inlet 20a, the fluid outlet 20b are connected to the substrate 10, so that the relative position structure between the heat dissipating fins 20 and the substrate 10 is sufficiently simplified.

[0036] In one embodiment, the return channel 212 is bent and extended, so the return channel 212 has a curved structure, which is beneficial to the processing of the return channel 212 on the one hand, and lengthens the return path of the return channel 212 on the other hand, thereby increasing the heat exchange area and enhancing the heat exchange effect of the phase change medium in the return channel 212. In a preferred embodiment, the return channel 212 is bent and extended in a serpentine shape.

[0037] It should be noted that the shape of the reflux channel 212 is not limited to a curved structure, and there may be more than one reflux channel 212 .

[0038] See also Figure 4 In one embodiment, the condensation chamber 211 includes a first sub-chamber 2111 and a second sub-chamber 2112, the fluid inlet 20a and the first sub-chamber 2111 are respectively located on opposite sides of the second sub-chamber 2112 and are both connected to the second sub-chamber 2112, and one end of the reflux channel 212 is directly connected to the first sub-chamber 2111. The gas phase-change medium first diffuses into the second sub-chamber 2112 through the fluid inlet 20a, and then diffuses into the first sub-chamber 2111, and finally condenses in the first sub-chamber 2111 to form a liquid phase-change medium. Therefore, one end of the reflux channel 212 is connected to the first sub-chamber 2111 to redirect the liquid phase-change medium back to the receiving chamber 10a of the substrate 10; at the same time, since the first sub-chamber 2111 is far away from the fluid inlet 20a, the reflux path of the reflux channel 212 connected to the first sub-chamber 2111 is lengthened, thereby improving the heat exchange effect of the phase-change medium flowing through the reflux channel 212.

[0039] Furthermore, in the first direction, the width of the first sub-chamber 2111 is greater than the width of the second sub-chamber 2112, that is, the cross-sectional area of ​​the flow channel of the gaseous phase change medium in the first sub-chamber 2111 is greater than the cross-sectional area of ​​the flow channel of the gaseous phase change medium in the second sub-chamber 2112, thereby ensuring that the gaseous phase change medium condenses in the first sub-chamber 2111.

[0040] In one embodiment, the distance between the wall surface of the fluid inlet 20a away from the first end 214 and the first end 214 is smaller than the distance between the wall surface of the second sub-cavity 2112 away from the first end 214 and the first end 214. Therefore, the wall surface of the fluid inlet 20a away from the first end 214 is higher than the wall surface of the second sub-cavity 2112 away from the first end 214, which increases the condensation space of the condensation cavity 211 on the one hand, and increases the inflow height of the fluid inlet 20a on the other hand to prevent the liquid phase-change working medium from directly flowing from the receiving cavity 10a into the condensation cavity 211.

[0041] In one embodiment, a guide structure (not shown in the figure) is formed on the cavity wall of the condensation cavity 211 away from the first end 214, and the guide structure is used to guide the phase change medium in the condensation cavity 211 to the return channel 212. The guide effect of the guide structure ensures that the liquid phase change medium formed by condensation basically flows into the return channel 212.

[0042] Specifically, the flow-guiding structure can be set as an inclined surface structure, a curved surface structure, etc., so as to ensure the flow-guiding effect.

[0043] See also Figure 4 In one embodiment, the heat sink 20 further includes a first support structure 22 disposed in the condensation chamber 211 to prevent the heat sink 20 from collapsing or swelling due to the working environment of the condensation chamber 211 being set to vacuum or high pressure.

[0044] Furthermore, the first support structure 22 is located in the first sub-cavity 2111. That is, the first support structure 22 is not provided in the second sub-cavity 2112, and the first support structure 22 is provided only in the first sub-cavity 2111, which prevents the heat dissipation fins 20 from easily collapsing or bulging, and also ensures the communication effect between the condensation cavity 211 and the receiving cavity 10a.

[0045] In one embodiment, the first support structure 22 includes a plurality of groups of first support components 221 spaced apart from each other.

[0046] Specifically, a plurality of groups of first support components 221 are arranged parallel to the second direction, and the second direction is perpendicular to the first direction, that is, the second direction is Figure 4 On the one hand, the first support structure 22 provides balanced and stable support to the heat dissipation fins 20, and on the other hand, the gaseous phase-change medium formed by heat can diffuse in the condensation chamber 211 along the gap between two adjacent groups of first support components 221, thereby reducing the resistance of the first support structure 22 to the gaseous phase-change medium and ensuring the fluidity and diffusion speed of the phase-change medium.

[0047] Furthermore, the first supporting assembly 221 includes a plurality of first supporting members 2211 spaced apart from each other.

[0048] Specifically, a plurality of first support members 2211 are arranged parallel to the first direction, that is, the first support structures 22 are arranged in a matrix structure. On the one hand, the balanced stability of the first support structure 22 in supporting the heat dissipation fins 20 is further improved. On the other hand, the flow diffusion path of the gaseous phase change medium in the condensation chamber 211 is increased, and the resistance of the first support structure 22 to the gaseous phase change medium is further reduced, and the fluidity and diffusion speed of the phase change medium are further improved.

[0049] In one embodiment, see Figure 5A reflux chamber 213 is formed in the part of the reflux channel 212 near the fluid outlet 20b. In the first direction, the channel cross-sectional width of the reflux chamber 213 is greater than the long channel cross-sectional width of the reflux channel 212, so as to cache the liquid phase change medium flowing back from the reflux channel 212 to the receiving chamber 10a, thereby ensuring the natural convection heat exchange effect.

[0050] In one embodiment, see Figure 4 The reflux channel 212 extends from the condensing chamber 211 toward the second end 215, and part of the reflux channel 212 near the fluid outlet 20b is inclined from the second end 215 toward the first end 214, that is, part of the reflux channel 212 near the fluid outlet 20b is inclined upward, thereby preventing the gas formed by the phase change working medium in the receiving chamber 10a from flowing back into the reflux channel 212 due to heating.

[0051] See also Figure 1 and Figure 2 The substrate 10 has a first plate surface 10c and a second plate surface 10d which are arranged opposite to each other. The first plate surface 10c is formed with a heat dissipation station for installing the heat source 30, and the heat dissipation fins 20 are arranged on the second plate surface 10d. This is to avoid the heat source 30 interfering with the heat dissipation of the heat dissipation fins 20 when the heat source 30 and the heat dissipation fins 20 are located on the same side of the substrate 10, thereby ensuring the heat exchange efficiency between the heat dissipation fins 20 and the environment.

[0052] Combination Figure 3 In one embodiment, a second supporting structure 13 is formed in the receiving cavity 10a. The second supporting structure 13 is provided to prevent the substrate 10 from collapsing or swelling due to the receiving cavity 10a being in a vacuum or high pressure state.

[0053] In one embodiment, the second support structure 13 includes a plurality of groups of second support components 131 spaced apart from each other.

[0054] Specifically, the second support assembly 131 is arranged parallel to the third direction, wherein the third direction is the same as the height extension direction of the substrate 10, see Figure 3 , the third direction is the Z2 direction shown in the figure. On the one hand, the support of the second support structure 13 to the substrate 10 is guaranteed, and on the other hand, the gaseous phase-change medium formed by heat can diffuse toward the condensation chamber 211 along the gap between two adjacent groups of second support components 131, thereby reducing the influence of the resistance of the second support structure 13 to the gaseous phase-change medium on the flow velocity of the gaseous phase-change medium.

[0055] In one embodiment, the second support assembly 131 includes a plurality of second support members 1311 spaced apart from each other.

[0056] Furthermore, the plurality of second support members 1311 are arranged parallel to the fourth direction, wherein the fourth direction is perpendicular to the third direction, see Figure 3 , and the fourth direction is the Y direction shown in the figure. On the one hand, the equilibrium stability of the second supporting structure 13 supporting the substrate 10 is further improved, and on the other hand, the fluidity of the liquid phase change medium in the receiving chamber 10a is increased, the natural convection heat transfer effect is improved, and the speed of the gas phase change medium flowing to the condensation chamber 211 is increased.

[0057] In one embodiment, the substrate 10 is further formed with a first connecting hole 10e connecting the fluid inlet 20a and the receiving chamber 10a, and a second connecting hole 10f connecting the fluid outlet 20b and the receiving chamber 10a, and the first connecting hole 10e and the second connecting hole 10f are both formed on the board surface of the substrate 10 between two groups of adjacent second support components 131, so as to ensure that the second support structure 13 does not block the first connecting hole 10e and the second connecting hole 10f while ensuring the stable operation of the substrate 10 to ensure the connection between the receiving chamber 10a and the condensation chamber 211 and the reflux channel 212; on the other hand, the strength of the substrate 10 will be reduced due to the opening of the first connecting hole 10e and the second connecting hole 10f, and the strength of the substrate 10 is improved by opening the first connecting hole 10e and the second connecting hole 10f on the board surface of the substrate 10 between two groups of adjacent second support components 131.

[0058] In one embodiment, the substrate 10 includes a main board 11 and a cover plate 12 covering the main board 11. A surface of the main board 11 on one side facing the cover plate 12 is concave to form a groove, or a surface of the cover plate 12 on one side facing the main board 11 is concave to form a groove. The cover plate 12 covers the groove on the main board 11, or the main board 11 covers the groove of the cover plate 12 to form a receiving cavity 10a.

[0059] In some specific embodiments, the second support structure 13 is integrally formed with the main board 11; or, the second support structure 13 is integrally formed with the cover plate 12; or, part of the second support structure 13 is integrally formed with the main board 11, and part of the second support structure 13 is integrally formed with the cover plate 12.

[0060] In one embodiment, the substrate 10 is further provided with a liquid injection hole 10 b communicating with the receiving cavity 10 a ; wherein the liquid injection hole 10 b may be provided at the top of the substrate 10 .

[0061] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A thermosyphon radiator, characterized in that: It includes heat dissipation fins and a substrate having a receiving cavity for accommodating a phase-change working medium; The heat dissipation fin comprises a plate body, the plate body has a first end, a condensation cavity and a reflux channel are formed in the plate body, the condensation cavity is arranged near the first end and has a fluid inlet, one end of the reflux channel is communicated with the condensation cavity, and the other end extends in a direction away from the first end and has a fluid outlet; The reflux channel extends in a curved manner, the fluid outlet is communicated with the lower part of the receiving chamber, and the condensing chamber is higher than the reflux channel, the gaseous phase-change working medium diffuses into the condensing chamber through the fluid inlet, the gaseous phase-change working medium is condensed into a liquid phase-change working medium through heat exchange in the condensing chamber, and the liquid phase-change working medium flows into the reflux channel based on gravity and then flows back into the receiving chamber; The condensation chamber comprises a first sub-chamber and a second sub-chamber, the fluid inlet and the first sub-chamber are respectively located on opposite sides of the second sub-chamber and are both connected to the second sub-chamber, and one end of the reflux channel is directly connected to the first sub-chamber; The distance between the wall of the fluid inlet away from the first end and the first end is smaller than the distance between the cavity wall of the second sub-cavity away from the first end and the first end; The heat dissipation fins are fixed on the base plate, the condensation chamber is communicated with the upper side of the receiving chamber through the fluid inlet, and the reflux channel is communicated with the receiving chamber through the fluid outlet.

2. The thermosyphon radiator according to claim 1, characterized in that: The fluid inlet and the fluid outlet are located on the same side of the plate body.

3. The thermosyphon radiator according to claim 1, characterized in that: The reflux channel extends in a serpentine shape.

4. The thermosyphon radiator according to claim 1, characterized in that: The heat dissipation fin further comprises a first support structure arranged in the condensation chamber, wherein the first support structure comprises a plurality of groups of first support assemblies spaced apart from each other, and the first support assemblies comprise a plurality of first support members spaced apart from each other.

5. The thermosyphon radiator according to claim 1, characterized in that: A portion of the reflux channel close to the fluid outlet forms a reflux cavity, and in a first direction, a channel cross-sectional width of the reflux cavity is greater than a channel cross-sectional width of the reflux channel.

6. The thermosyphon radiator according to claim 1, characterized in that: The plate body also includes a second end arranged opposite to the first end, the reflux channel extends from the condensation chamber toward the second end, and a portion of the reflux channel near the fluid outlet is inclined from the second end toward the first end.

7. The thermosyphon radiator according to any one of claims 1 to 6, characterized in that: There are more than one reflux channel.

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