Robot for simultaneous substrate transport

Abstract

An example substrate processing system can include a transfer region enclosure defining an interior volume. A sidewall of the transfer region enclosure can define a sealable access port for providing and receiving substrates. The system can include a plurality of substrate supports disposed within the transfer region. The system can also include a transfer device having a central hub including a first shaft and a second shaft concentric with the first shaft and reversibly rotatable relative to the first shaft. The transfer device can include a first end effector coupled with the first shaft. The first end effector can include a first plurality of arms. The transfer device can also include a second end effector coupled with the second shaft. The second end effector can include a second plurality of arms having a second number of arms equal to a first number of arms of the first end effector.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 873,400, filed July 12, 2019, the contents of which are incorporated herein by reference in their entirety for all purposes.

[0003] This technology relates to the following applications, all filed simultaneously on July 12, 2019, and entitled: “ROBOTFOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,432), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,458), “ROBOT FOR SIMULTANEOUS SUBSTRATE TRANSFER” (US Provisional Application No. 62 / 873,480), “MULTI-LID STRUCTUREFOR SEMICONDUCTOR PROCESSING SYSTEMS” (US Provisional Application No. 62 / 873,518), and “HIGH-DENSITY SUBSTRATE PROCESSING SYSTEMS AND METHODS (High-density substrate processing systems and methods) (U.S. Provisional Application No. 62 / 873,503). Each of these applications is incorporated herein by reference in its entirety for all purposes. Technical Field

[0004] This technology relates to semiconductor processes and equipment. More specifically, this technology relates to substrate processing systems. Background Technology

[0005] Semiconductor processing systems typically utilize clustering tools to integrate multiple processing chambers together. This configuration can facilitate the execution of several sequential processing operations without removing the substrate from the controlled processing environment, or it can allow similar processes to be performed simultaneously on multiple substrates in varying chambers. These chambers may include, for example, degassing chambers, pretreatment chambers, transfer chambers, chemical vapor deposition chambers, physical vapor deposition chambers, etching chambers, metering chambers, and other chambers. The combination of chambers in the clustering tool, along with the operating conditions and parameters for running these chambers, is selected to fabricate specific structures using specific processing formulations and processes.

[0006] Cluster tools typically process many substrates by successively passing the substrates through a series of chambers and performing processing operations. A process recipe and sequence is typically programmed into a microprocessor controller that will direct, control, and monitor the processing of each substrate through the cluster tool. Once an entire wafer cassette has been successfully processed through the cluster tool, the cassette can be transported to yet another cluster tool or standalone tool, such as a chemical mechanical polisher, for further processing.

[0007] Typically, a robot is used to transport wafers through the various processing and holding chambers. The amount of time required for each process and processing operation has a direct impact on substrate throughput per unit of time. Substrate throughput in a cluster tool can be directly related to the speed of the substrate handling robot positioned in the transfer chamber. As processing chamber configurations continue to evolve, conventional wafer transport systems can be inadequate.

[0008] Accordingly, there is a need for improved systems and methods that can be used to efficiently direct substrates within a cluster tool environment. These and other needs are addressed by the present technology. SUMMARY

[0009] An example substrate processing system can include a transfer region enclosure defining a transfer region. A sidewall of the transfer region enclosure can define a sealable access for providing and receiving substrates. The system can include a plurality of substrate supports disposed within the transfer region. The system can also include a transfer device. The transfer device can include a central hub including a first shaft and a second shaft extending about and concentric with the first shaft. The second shaft can be counter-rotatable with the first shaft. The transfer device can include a first end effector coupled with the first shaft. The first end effector can include a plurality of first arms having a first arm quantity equal to a quantity of substrate supports in the plurality of substrate supports. The transfer device can also include a second end effector coupled with the second shaft. The second end effector can include a plurality of second arms having a second arm quantity equal to the first arm quantity of the first end effector.

[0010] In some embodiments, the plurality of substrate supports can include at least four substrate supports. The second terminal effector can be vertically offset from the first terminal effector along the central hub. The first terminal effector can further include a plurality of first end pieces, each first end piece coupled with a separate first arm of the plurality of first arms. The second terminal effector can further include a plurality of second end pieces, each second end piece coupled with a separate second arm of the plurality of second arms. Each first end piece and each second end piece can extend vertically to a similar plane extending orthogonally to the central hub. Each first end piece and each second end piece can define a recessed ledge and a rail. Each first end piece and each second end piece can be characterized by an arcuate outer profile. Each first end piece can include a force generating plunger configured to releasably engage a substrate against a corresponding second end piece. The central hub can be vertically translatable along a central axis of the central hub.

[0011] Some embodiments of the present technology can include a method of transporting a substrate. The method can include receiving a substrate at a first substrate support within a transport region of a substrate processing system. The substrate processing system can include a transport device. The transport device can include a central hub including a first shaft and a second shaft extending about and concentric with the first shaft. The transport device can include a first terminal effector coupled with the first shaft, and the first terminal effector can include a plurality of first arms. The transport device can further include a second terminal effector coupled with the second shaft, and the second terminal effector can include a plurality of second arms. The method can include rotating the first shaft about a central axis of the central hub in a first direction. The method can include rotating the second shaft about the central axis of the central hub in a second direction. The method can include engaging the substrate with a first arm of the plurality of first arms and a second arm of the plurality of second arms. The method can include co-rotating the first arm and the second arm about the central axis to reposition the substrate. The method can further include delivering the substrate to a second substrate support of the substrate processing system.

[0012] In some embodiments, the method can include disengaging the substrate from the transport device by rotating the first shaft in the second direction about the central axis and rotating the second shaft in the first direction about the central axis. The method can include, after engaging the substrate, lifting the substrate from the first substrate support by vertically translating the transport device within the transport region. The method can include, after engaging the substrate, recessing the first substrate support from the substrate. The first end effector can include a plurality of first end pieces, each first end piece coupled with a separate first arm of the plurality of first arms. The second end effector can include a plurality of second end pieces, each second end piece coupled with a separate second arm of the plurality of second arms. Each first end piece and each second end piece can define a recessed ledge and a rail. Engaging the substrate can include extending the rail of the first end piece of the first arm and the rail of the second end piece of the second arm under an outer edge of the substrate. The substrate processing system can include at least four substrates, and engaging the substrate can include simultaneously engaging the at least four substrates with the first end effector and the second end effector. The method can further include delivering the substrate to an alignment hub positioned between the first substrate support and the second substrate support prior to delivering the substrate to the second substrate support.

[0013] Some embodiments of the present technology can include a substrate processing system including a transport region enclosure defining a transport region. A sidewall of the transport region enclosure can define a sealable access for providing and receiving substrates. The system can include a plurality of substrate supports disposed within the transport region. The system can include a transport device. The transport device can include a central hub including a first shaft and a second shaft extending about and concentric with the first shaft. The second shaft can be independently rotatable from the first shaft. The transport device can include a first end effector coupled with the first shaft. The first end effector can include a plurality of first arms extending radially outward from the central hub to a distal end of each first arm of the plurality of first arms. Each first arm can be characterized by an arcuate shape extending to the distal end of each first arm along a first arcuate path. The transport device can include a second end effector coupled with the second shaft. The second end effector can include a plurality of second arms extending radially outward from the central hub to a distal end of each second arm of the plurality of second arms. Each second arm can be characterized by an arcuate shape extending to the distal end of each second arm along a second arcuate path. The second arcuate path can be a mirror image of the first arcuate path about a transverse axis extending about a central axis of the central hub perpendicular to the central axis of the central hub.

[0014] In some embodiments, the first end effector can include a plurality of first end pieces, each first end piece coupled with a separate first arm of the plurality of first arms. The second end effector can also include a plurality of second end pieces, each second end piece coupled with a separate second arm of the plurality of second arms. The central hub can be vertically translatable along a central axis of the central hub.

[0015] Such technology can provide numerous benefits over conventional systems and technology. For example, a processing system can provide increased transfer speeds as compared to conventional designs. Additionally, a processing system can accommodate a transfer region with multiple rows of substrates. These and other embodiments, along with many of their advantages and features, are described in more detail in conjunction with the below description and attached figures. BRIEF DESCRIPTION OF DRAWINGS

[0016] A further understanding of the nature and advantages of the disclosed technology can be realized by reference to the remaining portions of the specification and the attached drawings.

[0017] FIG. 1A FIG. illustrates a schematic top view of an exemplary processing system, in accordance with some embodiments of the present technology.

[0018] FIG. 1B FIG. illustrates a schematic partial cross-sectional view of an exemplary chamber system, in accordance with some embodiments of the present technology.

[0019] FIG. 2 FIG. illustrates a schematic perspective view of a transfer region of an exemplary chamber system, in accordance with some embodiments of the present technology.

[0020] FIGS. 3A-3B FIG. illustrates a schematic cross-sectional view of an exemplary transfer device, in accordance with some embodiments of the present technology.

[0021] FIG. 4 FIG. illustrates exemplary operations of a method of transferring a substrate, in accordance with some embodiments of the present technology.

[0022] FIGS. 5A-5H FIG. illustrates a schematic top view of a substrate being transferred, in accordance with some embodiments of the present technology.

[0023] FIGS. 6A-6B FIG. illustrates a schematic view of a substrate pedestal, in accordance with some embodiments of the present technology.

[0024] Some of the drawings are included as schematic illustrations. It should be understood that the drawings are merely schematic and are not drawn to scale unless otherwise specifically noted. Additionally, as is customary in schematic illustrations, the drawings included herewith are provided for purposes of explanation only and are not included for purposes of limitation, of description, and of characterization. Furthermore, the drawings can include exaggerated material to help the understanding of the technology.

[0025] In the drawings, like references may have similar terminology and may interact with or be governed by similar principles. The specific embodiments are described herein for illustrative purposes, and various modifications can be made within the scope and / or equivalency of the appended claims as will be appreciated by those skilled in the art. For example, it will be readily apparent to those skilled in the art that other methods, based on the principles described herein, can be employed apart from those methods described in the following embodiments. Thus, the present embodiments are not intended to be limited to the embodiments described herein but are to be accorded the widest scope consistent with the principles and novel features disclosed herein. DETAILED DESCRIPTION

[0026] Substrate processing can include time-intensive operations for adding, removing, or otherwise modifying material on a wafer or semiconductor substrate. Efficient movement of substrates can reduce queue times and increase substrate throughput. To increase the number of substrates processed in a cluster tool, additional chambers can be incorporated onto the mainframe. While additional transfer robots and processing chambers can be added in series by lengthening the tool, this can become space-inefficient as the footprint of the cluster tool continues to expand. Accordingly, the present technology can include cluster tools with an increased number of processing chambers within a defined footprint. To accommodate the limited footprint with respect to the transfer robot, the present technology can increase the number of processing chambers laterally outward from the robot. For example, some conventional cluster tools can include one or two processing chambers positioned around a portion of a centrally located transfer robot to maximize the number of chambers radially around the robot. The present technology can expand on this concept by incorporating additional chambers laterally outward as another row or group of chambers. For example, the present technology can be applied with cluster tools that include three, four, five, six, or more processing chambers accessible at each of one or more robot access locations.

[0027] However, with the addition of additional processing locations, it can no longer be feasible to access these locations from the central robot without additional transfer functionality at each location. Some conventional techniques can include wafer carriers on which the substrates are held during transfer. However, wafer carriers can cause thermal non-uniformity and particle contamination on the substrates. The present technology overcomes these issues by combining a transfer section that is vertically aligned with the processing chamber area and a puck transfer or transport device that can operate in concert with the central robot to access additional wafer locations. In some embodiments, the present technology can not use traditional wafer carriers and can transfer specific wafers from one substrate support to a different substrate support within the transfer area. Although the remainder of the disclosure will conventionally identify specific structures that can employ the present structures and methods, such as a four-location transfer area, it will be readily understood that the systems and methods are equally applicable to any number of structures and elements that can benefit from the explained transfer functionality. Thus, the technology should not be considered as limited to use with only any particular structure. Also, although an exemplary tool system will be described as providing the basis for the present technology, it will be understood that the present technology can be incorporated with any number of semiconductor processing chambers and tools that can benefit from some or all of the operations and systems to be described.

[0028] FIG. 1A A top view of one embodiment of a substrate processing tool or processing system 100 according to some embodiments of the present technology is illustrated. In the drawing, a set of front opening unified pods 102 provide substrates of various sizes that are received by robotic arms 104a and 104b within a factory interface 103 and placed into load locks or low pressure holding areas 106 that are then delivered to one of substrate processing areas 108 located in chamber systems or quad sections 109a-c, which can each be substrate processing systems having a transfer area fluidly coupled to multiple processing areas 108. Although a quad system is illustrated, it will be understood that platforms incorporating standalone chambers, dual chamber, and other multi-chamber systems are equally encompassed by the present technology. A second robotic arm 110 housed in a transfer chamber 112 can be used to transfer substrate wafers from holding areas 106 to quad sections 109 and back, and the second robotic arm 110 can be housed in a transfer chamber that can be connected to each quad section or processing system. Each substrate processing area 108 can be outfitted to perform a number of substrate processing operations, including any number of deposition processes (including cyclic layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition) as well as etching, precleaning, annealing, plasma treatment, degassing, orientation, and other substrate processes.

[0029] Each quad 109 can include a transfer region that can receive a substrate from and deliver a substrate to the second robot 110. The transfer region of the chamber system can be aligned with a transfer chamber having the second robot 110. In some embodiments, the transfer region can be laterally accessible to the robot hands. In subsequent operations, components of the transfer section can translate the substrate vertically into the covered processing region 108. Similarly, the transfer region can also be operable to rotate the substrate between locations within each transfer region. The substrate processing regions 108 can include any number of system components for depositing, annealing, curing, and / or etching a film of material on a substrate or wafer. In one configuration, two sets of processing regions, such as the processing regions in quads 109a and 109b, can be used to deposit material on a substrate, and a third set of processing chambers, such as the processing chambers or regions in quad 109c, can be used to cure, anneal, or process the deposited film. In another configuration, all three sets of chambers, such as all twelve chambers shown, can be configured to both deposit and / or cure a film on a substrate.

[0030] As shown, the second robot 110 can include two arms for simultaneously delivering and / or retrieving multiple substrates. For example, each quad 109 can include two access ports 107 along a surface of the housing of the transfer region, which can be laterally aligned with the second robot. The access ports can be defined along a surface adjacent to the transfer chamber 112. In some embodiments, such as shown, a first access port can be aligned with a first substrate support of the plurality of substrate supports of the quad. Additionally, a second access port can be aligned with a second substrate support of the plurality of substrate supports of the quad. In some embodiments, the first substrate support can be adjacent to the second substrate support, and the two substrate supports can define a first row of substrate supports. As illustrated by the configuration shown, a second row of substrate supports can be positioned behind the first row of substrate supports, laterally outward from the transfer chamber 112. The two arms of the second robot 110 can be spaced apart to allow both arms to simultaneously access the quad or chamber system to deliver or retrieve one or two substrates to the substrate supports within the transfer region.

[0031] Any one or more of the described transfer regions can be incorporated with additional chambers separate from the manufacturing system illustrated from different embodiments. It should be appreciated that additional configurations of deposition, etch, anneal, and cure chambers for material films can be considered for processing system 100. Additionally, any number of other processing systems can be used with the present technology, which can incorporate a transfer system for performing any of the specific operations such as substrate movement. In some embodiments, a processing system that can provide access to multiple processing chamber regions while maintaining a vacuum environment in various portions such as the described holding and transfer regions can allow for performing operations in multiple chambers while maintaining a particular vacuum environment between discrete processes.

[0032] FIG. 1B A schematic cross-sectional elevation view (such as through a chamber system) of one embodiment of an exemplary processing tool according to some embodiments of the present technology is illustrated. FIG. 1B A cross-sectional view through any two adjacent processing regions 108 of any quadruple portion 109 can be illustrated. An elevation view can illustrate a configuration or fluidic coupling of one or more processing regions 108 with a transfer region 120. For example, a continuous transfer region 120 can be defined by a transfer region enclosure 125. The enclosure can define an open interior space in which a plurality of substrate supports 130 can be disposed. For example, as illustrated, the substrate supports can be pedestals, although many other configurations can also be used. In some embodiments, the pedestals can translate vertically between the transfer region 120 and a processing region overlying the transfer region. The substrate supports can translate vertically along a central axis of the substrate support along a path between a first position and a second position within the chamber system. Thus, in some embodiments, each substrate support 130 can be axially aligned with an overlying processing region 108 defined by one or more chamber components. FIG. 1A As illustrated, an exemplary processing system can include four or more, including a plurality of substrate supports 130 distributed within an enclosure about a transfer region. As illustrated, the substrate supports can be pedestals, although many other configurations can also be used. In some embodiments, the pedestals can translate vertically between the transfer region 120 and a processing region overlying the transfer region. The substrate supports can translate vertically along a central axis of the substrate support along a path between a first position and a second position within the chamber system. Thus, in some embodiments, each substrate support 130 can be axially aligned with an overlying processing region 108 defined by one or more chamber components.

[0033] An open transfer region can provide the ability for a transfer device 135, such as a carousel transfer, to engage and move substrates between various substrate supports, such as rotationally. The transfer device 135 can rotate about a central axis. This can allow for positioning of substrates for processing within any of the processing regions 108 within the processing system. The transfer device 135 can include one or more end effectors that can engage substrates from above, below, or can engage outer edges of the substrates for movement about the substrate supports. The transfer device can receive substrates from a transfer chamber robot, such as robot 110 previously described. The transfer device can then rotate the substrates to alternate the substrate supports to facilitate delivery of additional substrates.

[0034] Once positioned and awaiting processing, the transport apparatus can position the terminal actuators or arms between the substrate supports, which can allow the substrate supports to be lifted through the transport apparatus 135 and deliver the substrates into the processing regions 108, which can be vertically offset from the transport region. For example, and as shown, the substrate supports 130a can deliver substrates into the processing region 108a, while the substrate supports 130b can deliver substrates into the processing region 108b. This can occur with the other two substrate supports and processing regions, and additional substrate supports and processing regions in embodiments including additional processing regions. In this configuration, the substrate supports can at least partially define the processing regions 108 from below when, such as at the second position, operatively engaged to process substrates, and the processing regions can be axially aligned with the associated substrate support. The processing regions can be defined from above by the faceplate 140 and other cover stack components. In some embodiments, each processing region can have a separate cover stack component, although in some embodiments, components can house multiple processing regions 108. Based on this configuration, in some embodiments, each processing region 108 can be fluidically coupled with the transport region, while being fluidically isolated from above from each other processing region within the chamber system or quadruple portion.

[0035] In some embodiments, the faceplate 140 can serve as an electrode for a system to generate a localized plasma within the processing regions 108. As shown, each processing region can utilize or incorporate a separate faceplate. For example, a faceplate 140a can be included to define the processing region 108a from above, and a faceplate 140b can be included to define the processing region 108b from above. In some embodiments, the substrate supports can serve as a companion electrode for generating a capacitively coupled plasma between the faceplate and the substrate support. Depending on the volume geometry, a pumping liner 145 can at least partially define the processing regions 108 radially or laterally. Again, a separate pumping liner can be used for each processing region. For example, a pumping liner 145a can at least partially define the processing region 108a radially, and a pumping liner 145b can at least partially define the processing region 108b radially. In embodiments, a partition 150 can be positioned between the cover 155 and the faceplate 140, and can again include separate partitions to facilitate fluid distribution within each processing region. For example, a partition 150a can be included for distribution toward the processing region 108a, and a partition 150b can be included for distribution toward the processing region 108b.

[0036] The lid 155 can be a separate component for each processing region, or can include one or more common aspects. In some embodiments such as those shown, the lid 155 can be a single component that defines multiple apertures 160 for delivering fluid to the various processing regions. For example, the lid 155 can define a first aperture 160a for delivering fluid to the processing region 108a, and the lid 155 can define a second aperture 160b for delivering fluid to the processing region 108b. When including additional processing regions within each section, additional apertures can be defined for the additional processing regions within the section. In some embodiments, each quad section 109 or multi-processing region section that can accommodate more or less than four substrates can include one or more remote plasma units 165 for delivering plasma effluent into the processing chamber. In some embodiments, a separate plasma unit can be incorporated for each chamber processing region, although in some embodiments fewer remote plasma units can be used. For example, as shown, a single remote plasma unit 165 can be used for multiple chambers, such as two, three, four, or more chambers, up to all of the chambers of a particular quad section. In embodiments of the present technology, a conduit can extend from the remote plasma unit 165 to each aperture 160 for delivering plasma effluent for processing or cleaning.

[0037] As noted, the processing system 100, or more specifically the quad section or chamber system in conjunction with the system 100 or other processing systems, can include a transfer region positioned below the processing chamber regions shown. FIG. 2 A schematic isometric view of an exemplary substrate processing system 200 according to some embodiments of the present technology is illustrated. The system shown can include a transfer region enclosure 205 defining an interior volume or transfer region, which can include a number of components. The transfer region can additionally be defined from above by processing chambers, such as the quad section 109 of processing chambers shown. The sidewalls of the transfer region enclosure can define one or more access locations 207 through which substrates can be delivered and retrieved, such as by the second robot 110 as described above. In some embodiments, the access locations 207 can be slit valves or other sealable access locations, which include doors or other sealing mechanisms to provide a gas-tight environment within the transfer region enclosure 205. Although two such access locations 207 are illustrated, it will be understood that in some embodiments only a single access location 207 can be included. It will also be understood that the substrate processing system 200 can be sized to accommodate any substrate size, including 200mm, 300mm, 450mm, or larger or smaller substrates, including substrates featuring any number of geometries or shapes. FIG. 1A

[0038] ​Within the transport region enclosure 205 can be a plurality of substrate supports 210 positioned about the transport region volume. Although four substrate supports are illustrated, it should be understood that embodiments of the present technology similarly encompass any number of substrate supports. For example, in accordance with embodiments of the present technology, greater than or about three, four, five, six, eight, or more substrate supports 210 can be accommodated in the transport region. In some embodiments, the second robot 110 can deliver substrates through the access port 207 into one or both of the substrate supports 210a or 210b, and can deliver substrates directly to a transport device within the transport region. Similarly, the second robot 110 can retrieve substrates from these locations. Lift pins 212 can protrude from the substrate supports 210, and can allow a robot to access beneath the substrates. In some embodiments, the lift pins can be fixed to the substrate supports, or fixed at locations where the substrate supports can be recessed beneath, or the lift pins can additionally be raised or lowered through the substrate supports. The substrate supports 210 can be vertically translatable, and in some embodiments can extend to a processing chamber positioned above the transport region enclosure 205, such as the processing chamber 108.

[0039] The transport region enclosure 205 can provide access for an alignment system 215, which can include an aligner that can extend through a hole of the transport region as shown, and can operate with a laser, camera, or other monitoring device that protrudes or is transmitted through an adjacent hole, and can determine whether a translated substrate is properly aligned. The transport region enclosure 205 can also include a transport device 220, which can operate in a variety of ways to position substrates and move substrates between various substrate supports. Although example operations will be described below, in one example, the transport device 220 can move substrates on the substrate supports 210a and 210b to the substrate supports 210c and 210d, which can allow additional substrates to be delivered into the transport region.

[0040] The transport apparatus 220 can include a central hub 225, which can include one or more shafts extending into the transport region. Coupled with the central hub can be a first end effector 230 and a second end effector 235. The first end effector 230 can include a plurality of first arms 233 extending radially or laterally outward from the central hub. Similarly, the second end effector 235 can include a plurality of second arms 237 extending radially or laterally outward from the central hub. Although illustrated with a central body from which the arms extend, each of the end effectors can additionally include individual arms each coupled with the central hub 225. Any number of arms can be included in embodiments of the present technology. In some embodiments, the number of first arms 233 can be similar or equal to the number of substrate supports 210 included in the chamber, and the number of second arms 237 can be similar or equal to the number of first arms 233. Thus, as illustrated, for four substrate supports, the transport apparatus 220 can include four arms for each of the first end effector and the second end effector. The arms can feature any number of shapes and profiles, such as straight profiles and arcuate profiles as illustrated. Although any profile can be utilized, in some embodiments, the arcuate profile can accommodate a substrate, which in some embodiments can be circular.

[0041] When utilized, the arcuate profile of the first arms of the first end effector can feature a particular arcuate profile extending along an edge of each first arm to a distal end of the first arm. Additionally, the second arms of the second end effector can also feature a particular arcuate profile extending along an edge of each second arm to a distal end. However, the arcuate profile of the second arms, which can accommodate an opposite edge of a substrate being transported, can be opposite or mirrored to the arcuate profile of the first arms. The mirroring can be along an axis extending radially or laterally outward from the central hub between the first arms of the first end effector and the second arms of the second end effector, such as an axis perpendicular to a central axis extending vertically through the central hub. Thus, in some embodiments, the second end effector can be an inverted version of the first end effector, as illustrated.

[0042] The first end effector 230 can additionally include a plurality of first end pieces 240. Each first end piece 240 can be coupled with a separate one of the plurality of first arms 233. Similarly, the second end effector 235 can additionally include a plurality of second end pieces 242. Each second end piece 242 can be coupled with a separate one of the plurality of second arms 237. Each end piece can also be characterized by an arcuate outer profile to accommodate a circular or other arcuate substrate. The end pieces will be described in greater detail below and can be used to contact the substrate during transport or movement. The end pieces, as well as the end effectors, can be made of or include a variety of materials including conductive and / or insulating materials. In some embodiments, the materials can be coated or plated to withstand contact with precursors or other chemicals that can enter the transport region from a processing chamber above.

[0043] Additionally, materials can be provided or selected to withstand other environmental characteristics, such as temperature. In some embodiments, the substrate support is operable to heat a substrate disposed on the support. The substrate support can be configured to increase a surface or substrate temperature to greater than or about 100 °C, greater than or about 200 °C, greater than or about 300 °C, greater than or about 400 °C, greater than or about 500 °C, greater than or about 600 °C, greater than or about 700 °C, greater than or about 800 °C, or higher. Any of these temperatures can be maintained during operation, and thus components of the transport apparatus 220 can be exposed to any of the specified or encompassed temperatures. Accordingly, in some embodiments, any materials can be selected to accommodate the temperature range, and can include materials such as ceramics and metals that can be characterized by a relatively low coefficient of thermal expansion or other beneficial characteristics. The component couplings can also be adapted to operate in high temperature and / or corrosive environments. For example, where both the end effector and end pieces are ceramic, the couplings can include crimp fittings, snap fittings, or other fittings that can not include additional materials, such as bolts, that can expand and contract with temperature and can cause cracking of the ceramic. In some embodiments, the end pieces can be continuous with the end effector and can be integrally formed with the end effector. Any number of other materials that can facilitate operation or resistance during operation can be utilized and are similarly encompassed by the present technology.

[0044] The transport apparatus 220 can include a plurality of components and configurations that can facilitate movement of the end effector, as will be described further below. FIGS. 3A-3B A schematic cross-sectional view of an exemplary transport apparatus 220 is illustrated, in accordance with some embodiments of the present technology, although it should be understood that any other configuration providing independent rotational motion to be described is similarly encompassed by the present technology.

[0045] The central hub 225 may include a first axis 310 and a second axis 320, the second axis 320 being axially aligned with the first axis 310. For example, the first axis 310 and the second axis 320 may be concentric about a central axis extending vertically through the central hub. In some embodiments, the first axis 310 may extend through the second axis 320 or aspects thereof. FIG. 3A As shown, the first axis 310 and the second axis 320 may be coaxial, although the two axes may be coupled to separate motors or drive systems. As shown, the first axis 310a may be coupled to a first drive system 312a, which may include a motor and allow rotation about a central axis. The first drive system 312a may cause the first terminal actuator 230 to rotate about the central axis in a first direction or in a second direction opposite to the first direction. Similarly, the second axis 320a may be coupled to a second drive system 314a, which may independently allow the second terminal actuator 235 to rotate about the central axis in either the first or second direction. In some embodiments, a vertical translation driver 325 may be included, which may allow the transmission device to translate vertically along the central axis. In some embodiments, this may facilitate lifting the substrate from a substrate support or a lifting rod, although in some embodiments, the lifting rod and / or substrate support may be used to raise and lower the substrate, and the transmission device 220 may not include a vertical drive mechanism.

[0046] FIG. 3B Another embodiment of the transmission device 220 is illustrated, which can utilize a gearbox to facilitate reverse rotation of the first shaft 310b relative to the second shaft 320b. For example, the second shaft 320b can be coupled to a gearbox 330, which includes a gear set 332 having a first gear coupled to the first shaft 310b. As will be readily understood, driving the first gear in a first direction using a first drive system 312b will produce reverse rotation in an opposite gear, which can be coupled to the second shaft 320b and a second end effector 235. Additionally, a second drive system 314b can be coupled to components to rotate the gearbox and the first shaft together, which will facilitate the common rotation of the end effector. The figures also illustrate an optional vertical translation actuator 325, which can linearly move the transmission device up and down as described above. It should be understood that... FIGS. 3A-3B This is merely an illustration of any number of configurations and components that can be used to independently rotate the first and second axes, thereby providing individual control of the first and second end actuators. Therefore, in some embodiments, the first and second axes can rotate together about a central axis, or the two axes can rotate in opposite directions relative to the other axis. This operation will be described in more detail below.

[0047] As shown in the two figures, in some embodiments, the first end effector 230 and the second end effector 235 can be vertically offset from each other along the central hub. In some embodiments, this can cause the associated components, such as the first end piece and the second end piece, to be offset. Accordingly, the present technology can further modify the first end piece and the second end piece to accommodate the vertical offset of the first end effector and the second end effector, as will be further described below.

[0048] FIG. 4 A method 400 in a transport substrate is illustrated, in accordance with some embodiments of the present technology. For example, the method 400 can be performed in one or more transport systems, such as the system 200, which can be incorporated into the processing system 100. The method can include a number of optional operations as illustrated, which can or can not be particularly relevant to some embodiments of the method in accordance with the present technology. The method 400 describes FIGS. 5A-5H The operations illustrated in FIG. 5 will be described in connection with the operations of the method 400. It will be appreciated that FIG. 5 illustrates only partial schematic views with limited detail, and in some embodiments, the system can include more or less substrate supports and other components, as well as alternative structural aspects that can still benefit from any aspect of the present technology.

[0049] FIG. 5A A substrate processing system 500 can be illustrated as described previously, and can include any of the features and aspects of the substrate processing system 200 described above, including any of the drive components previously discussed with respect to FIG. 3, as well as any other drive components as will be appreciated to be similarly encompassed by the present technology. Additionally, the system 500 can be illustrated as having a plurality of substrates 501 disposed within the chamber, for example as placed on the substrate supports 510 as illustrated. The figure can illustrate a configuration of the present technology after the initial operations of the method 400, which can include receiving a substrate at the first substrate support 510a at operation 405, such as by a robot as described previously with an inlet port. The robot can deliver one or two or more substrates into the transport region 505 onto the substrate supports proximate the inlet port or slit valve. The transport device 520 can rotate the two substrates to opposing substrate supports, and can deliver two additional substrates. It will be appreciated that the same process can be performed with any number of substrates, including delivering one substrate at a time into the processing chamber. FIG. 5A It can be illustrated that after the four substrates have been positioned within the transport region, and the transport device 520 can be positioned in a recessed configuration.

[0050] The transport process can involve rotating the transport device in a variety of ways. For example, to engage the substrates, the method can include rotating the first shaft of the central hub about the central axis of the central hub in a first direction at operation 410. Before, after, or concurrently, the method can include rotating the second shaft about the central axis of the second hub in a second direction at operation 415. As previously described, the second direction can be a reverse rotation from the first direction. The rotation can continue until the first arm 533 of the first end effector 530 and the second arm 537 of the second end effector 535 engage the substrates as shown at operation 420. FIG. 5B

[0051] Depending on whether the transport device has vertical movement capabilities, the moving and engaging can or can not include raising or lowering one or both of the substrates or the transport device. Additionally, in some embodiments, engaging the substrates can include one or more operations that include passive engagement and active engagement. For example, as will be further explained below, the end pieces of the first and second end effectors can include a variety of forms that facilitate engagement. In one form of passive engagement, the end pieces can define recessed ledges and rails on which the substrates can be placed. Thus, for end pieces configured in this manner, the first and second arms can be counter-rotated toward the substrates until the rails of each end piece extend under the edges of the substrates. In a form of active engagement, one or both of the end pieces can physically and / or forcibly engage the substrates, including compressing or clamping the substrates between the end pieces. When more than one substrate is incorporated into the transport region, the substrates can be engaged simultaneously as shown at operation 425. Because the arms can be equidistantly distributed about the central hub, the arms can be configured to engage all of the substrates together. FIG. 5B

[0052] Once the substrates have been engaged by the transport device, full transport of the one or more substrates between the substrate supports and the transport device can occur. For example, in some embodiments, the transport device can lift the substrates in optional operation 425, and the substrates can be lifted from the substrate supports or lift poles on which they can be placed. This can be performed, for example, by vertically translating the transport device. In some embodiments, the substrate supports can recess away from the one or more substrates to complete the transport.

[0053] After completing the transport of the transport device, the substrates can be rotated between the substrate supports for further processing in different chambers, or delivered to substrate supports that can be accessed by a transport robot, such as the second robotic arm 110 described above. The translation of the one or more substrates can occur at operation 430, and as FIG. 5C ​​The substrate can be rotated about the central axis in either direction in embodiments, although the figures illustrate counterclockwise rotation. Rotation translation of the substrate can be performed by co-rotating the first and second arms 533, 537 at a common rate to maintain engagement of the substrate 501. As shown, the co-rotation can occur about the central axis in a second direction. Thus, the direction of rotation of the first axis can be reversed while the rotation of the second axis can continue in the same direction as used for engagement. Of course, if the substrate is translated in the first direction, the direction of axis rotation will also be reversed.

[0054] As previously mentioned, a substrate processing system according to embodiments of the present technology can have a monitoring and alignment system including an alignment hub 540 positioned between each pair of substrate supports. Additional access ports 542 can allow a camera or laser to impinge on the substrate to identify misalignment conditions, which can be based on a recess or other identifier on the substrate. In some embodiments, an optional alignment operation can be performed on each of the substrates at optional operation 435. In some embodiments, as FIG. 5D As shown, the transport device can release the substrate onto the aligner when the substrate has been translated on the alignment device. Depending on how many substrates are to be transported, one or more of the aligners can protrude into the transport region and receive a substrate. Alignment adjustments can be made and the transport device can re-engage the substrate.

[0055] Additionally, FIG. 5D FIG. 5B illustrates an aspect that can be a transport region that accommodates rotation of the substrates through the chamber. As shown, during rotation, the substrates can pass through zenithal positions between adjacent substrate supports. Although the transport region 505 can be straight, the rotation path can be elliptical or circular as shown. In some embodiments, the transport region 505 can be large enough to extend beyond the rotation path. However, in some embodiments, the transport region 505 can include accommodations along the path at which recesses 550 can be formed in the transport region walls to limit or prevent collisions between the translated substrates 501 and the walls of the transport region. In some embodiments, such recesses 550 can be formed in each wall of the transport region.

[0056] As FIG. 5E As shown, the transport device can continue to rotate the substrate toward the substrate support to which the substrate 501 is to be delivered. Although transport to an adjacent substrate support in a counterclockwise direction is illustrated, it will be appreciated that delivery to any other substrate support can similarly be performed in either rotational direction. At operation 440, the substrate 501 can be delivered to the second substrate support 510b, as FIG. 5FThe transport device can disengage the substrate from the transport device once delivered. Again, the substrate can be lowered with the transport device and / or substrate support, or the lift posts of the substrate support can engage the substrate to accept the substrate from the transport device.

[0057] Disengagement can also include rotating the first and second shafts in a direction opposite the original movement to engage. For example, as shown in FIG. 6B, the first shaft can rotate in the second direction, while the second shaft can rotate in the first direction to separate the first arm 533 of the first end effector and the second arm 537 of the second end effector from each other and away from the substrate. As shown in FIG. 6B, the arms can rotate to a recessed configuration to avoid interaction with the substrate support during further processing. Additionally, when including the alignment hub 540, such a position can align the arms of the first and second end effectors on the alignment hub 540, for example, which can provide protection for the alignment hub from particle accumulation. FIG. 5G FIG. 5H

[0058] As previously described, the transport device can include passive engagement or active engagement of the substrate with different end piece configurations. FIGS. 6A-6B A schematic view of a substrate pedestal is illustrated in accordance with some embodiments of the present technology. The drawing can include any aspects of the previously described systems or transport devices, and can illustrate additional aspects of the previously illustrated components. Although the drawing can illustrate examples of both passive engagement and active engagement, it should be understood that any number of variations can also be used, and similarly encompassed by the present technology.

[0059] FIG. 6A An end view such as at the distal end of the transport device 600 is illustrated. The drawing can include a distal end of the first arm 633 of the first end effector 630, and a distal end of the second arm 637 of the second end effector 635. As previously described, the first end effector 630 and the second end effector 635 can be vertically offset from each other along the central hub. Although the first end effector 630 is illustrated above the second end effector 635, it should be understood that these components can be reversed. As previously described, the first end piece 640 can be coupled with the first arm 633 of the first end effector 630, and the second end piece 642 can be coupled with the second arm 637 of the second end effector 635. FIG. 6A ​​Passive engagement of the substrate 601 can be illustrated, where a support surface is provided on which the substrate can be placed. Each of the first end piece 640 and the second end piece 642 can define a recessed ledge that includes a shelf portion extending toward the associated end piece for substrate support. The first end piece 640 can define a shelf 641 extending toward the associated second end piece 642, and the second end piece 642 can define a shelf 643 extending toward the associated first end piece 640. The shelves can together create a wafer support surface around both outer or radial edges of the substrate 601.

[0060] While in some embodiments the first end piece and the second end piece can be similar components, in some embodiments the two components can be modified to account for the vertical offset of the end effector. For example, while the end effector is vertically offset, the first end piece and the second end piece can extend vertically through the central hub's central axis to a similar horizontal plane. Thus, the first end piece and the second end piece can compensate for the vertical offset to maintain or create a substantially planar surface for substrate support. Thus, the first end piece 640 can extend vertically farther than the second end piece 642 to account for the offset. Thus, with this accommodation, the shelf 641 and the shelf 643 can be substantially aligned along a horizontal plane.

[0061] FIG. 6B Active engagement can be illustrated, which can facilitate faster translation, as in the case of active engagement the substrate can not be as easily moved. An illustration can show a transport device 650 for supporting a substrate 651. Components of the device can include a distal end of a first arm 663 of a first end effector 660, and a distal end of a second arm 667 of a second end effector 665. Again as previously described, the first end effector 660 and the second end effector 665 can be vertically offset from one another along the central hub, and while the first end effector 660 is illustrated above the second end effector 665, it should be understood that these components can be reversed. A first end piece 670 can be coupled with the first arm 663 of the first end effector 660, and a second end piece 672 can be coupled with the second arm 667 of the second end effector 665.

[0062] With FIG. 6AThe first end piece 670 and the second end piece 672 can be configured to contact the edge region of the substrate 651, which can be different for different end pieces. The second end piece 672 can be configured to receive the substrate against a surface of the end piece, and can include a material configured to support contact between the substrate and the end piece within the transport region environmental conditions. The first end piece 670 can be configured to apply a force to the substrate 651 to mechanically, electrically, or otherwise place the substrate against the second end piece. For example, the first end piece 670 can include a spring-loaded or similar physical coupling plunger that can mechanically or otherwise force the substrate against the second end piece, and the first end piece 670 can include a roller 674 or other component for direct contact with the substrate. Additionally, the force-generating end piece can provide an electrical coupling, such as by electrostatically engaging the substrate along the component 674, which can be conductive or can facilitate coupling. In such configurations, where the first end effector is coupled with the inner shaft or first shaft, electrical leads can be routed through the first shaft of the central hub and out to the first end piece 670 of each first arm without affecting any other components of the central hub. Any number of other mechanical or attractive forces can be applied during transport within the substrate processing system to releasably engage the substrate.

[0063] The present technology includes substrate processing systems that can accommodate additional substrate supports that can otherwise not be accessible to a centrally located transport robot. By incorporating a transport device according to embodiments of the present technology, multiple substrate supports can be utilized and accessed during substrate processing. When the transport device includes first and second end effectors as described throughout the present technology, movement for engagement with, transport of, and disengagement from the substrate can all be performed along the outer edge of the substrate, which can facilitate avoidance of lift pins along the interior of the substrate support. The system can also provide for increased transport speed by maintaining the arms of the end effectors in contact with and recessed positions relative to the outer portion of the substrate.

[0064] In the preceding description, for purposes of explanation, numerous details are set forth in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to one skilled in the art that certain embodiments can be practiced without some or all of these details. Unless otherwise specified, the description herein is not intended to be limited to a single embodiment, but rather intended to be broad in scope to cover all modifications, alternatives, and equivalents falling within the spirit and scope of the technology.

[0065] Having disclosed several embodiments, those skilled in the art will recognize that various modifications, alternative constructions, and equivalents can be used without departing from the spirit of the embodiments. Additionally, a number of well-known processes and elements have not been described in order to avoid unnecessarily obscuring the present technology. Accordingly, the above description should not be taken as limiting the scope of the technology. Additionally, methods or processes can be described as sequential or in steps, but it is to be understood that the operations can be performed concurrently, or in different orders than as listed.

[0066] In the case of providing ranges of values, it is to be understood that every intermediate value of the range is also specifically disclosed. Any narrower ranges of intermediate values within the disclosed ranges are also specifically disclosed. The upper and lower limits of these smaller ranges can independently be included or excluded in the smaller ranges, and the inclusion or exclusion of either, neither, or both of the tight values in a tight range is also encompassed. Where the stated range includes both tight values, ranges excluding either both tight values are also included.

[0067] As used herein and in the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a substrate" includes a plurality of such substrates, and reference to "an arm" includes reference to one or more arms, and equivalents thereof known to those skilled in the art, and so forth.

[0068] Further, as used herein and in the appended claims, the terms "comprise(s)," "comprising," "contain(s)," "containing," "include(s)," and "including" are intended to be open-ended, and not limit the nature, scope, or meaning of the disclosure.

Claims

1. A substrate processing system, comprising: A transmission area housing that defines a transmission area, wherein the sidewalls of the transmission area housing define sealable inlets and outlets for providing and receiving substrates; Multiple substrate supports are disposed within the transmission area; as well as Transmission device, the transmission device comprising: A central hub, comprising a first axis and a second axis, the second axis extending around and concentric with the first axis, wherein the second axis is capable of rotating in the opposite direction to the first axis; A first terminal actuator, coupled to a first shaft, includes a plurality of first arms, the number of which is equal to the number of substrate supports among the plurality of substrate supports. The first terminal actuator further includes a plurality of first end members, each coupled to a single first arm among the plurality of first arms. The top surface of each first end member is coupled to the bottom surface of an associated first arm among the plurality of first arms, such that each first end member protrudes downward from the bottom surface of its associated first arm among the plurality of first arms. A second terminal actuator, coupled to the second shaft, includes a plurality of second arms, the number of which is equal to the number of first arms of the first terminal actuator. The second terminal actuator further includes a plurality of second end members, each coupled to a separate second arm among the plurality of second arms. The top surface of each second end member is coupled to the bottom surface of an associated second arm among the plurality of second arms, such that each second end member protrudes downward from the bottom surface of its associated second arm among the plurality of second arms.

2. The substrate processing system of claim 1, wherein the second terminal actuator is vertically offset from the first terminal actuator along the central pivot.

3. The substrate processing system of claim 1, wherein each first end member and each second end member extends vertically to a similar plane extending orthogonally to the central hub, and wherein each first end member and each second end member defines recessed ledges and railings.

4. The substrate processing system of claim 1, wherein each first end member and each second end member is characterized by an arcuate outer contour.

5. The substrate processing system of claim 1, wherein each first end member includes a force-generating plunger configured to releasably engage the substrate against a corresponding second end member.

6. The substrate processing system of claim 1, wherein the central hub is vertically translatable along the central axis of the central hub.

7. A method for transmitting a substrate, the method comprising: A substrate is received at a first substrate support within the transmission area of ​​a substrate processing system, the substrate processing system including a transmission device, the transmission device comprising: The central hub includes a first axis and a second axis, the second axis extending around and concentric with the first axis. A first terminal actuator, coupled to a first shaft, includes a plurality of first arms, wherein the first terminal actuator includes a plurality of first end members, each first end member being coupled to a separate first arm among the plurality of first arms, the top surface of each of the plurality of first end members being coupled to the bottom surface of an associated first arm among the plurality of first arms, such that each first end member protrudes downward from the bottom surface of the associated first arm among the plurality of first arms. A second terminal actuator, coupled to the second shaft, includes a plurality of second arms, wherein the second terminal actuator includes a plurality of second end members, each second end member being coupled to a separate second arm among the plurality of second arms, the top surface of each of the plurality of second end members being coupled to the bottom surface of an associated second arm among the plurality of second arms, such that each second end member protrudes downward from the bottom surface of the associated second arm among the plurality of second arms; The first axis is rotated about the central axis of the central hub in a first direction; The second axis is rotated in a second direction about the central axis of the central hub; The substrate is joined to the first arm of the plurality of first arms and the second arm of the plurality of second arms; The first arm and the second arm are rotated together about the central axis to reposition the substrate; and The substrate is delivered to the second substrate support of the substrate processing system.

8. The method for a transmission substrate as described in claim 7, further comprising: The substrate is disengaged from the transmission device by rotating the first axis about the central axis in the second direction and rotating the second axis about the central axis in the first direction.

9. The method for a transmission substrate as described in claim 7, further comprising: After the substrate is joined, the substrate is lifted from the first substrate support by vertically translating the transmission device within the transmission area.

10. The method for a transmission substrate as claimed in claim 7, further comprising: After the substrate is joined, the first substrate support is recessed from the substrate.

11. The method of transmitting a substrate as claimed in claim 7, wherein each first end member and each second end member defines a recessed ledge and a railing, and wherein engaging the substrate includes the railing of the first end member extending below the outer edge of the substrate and the railing of the second end member extending below the first arm.

12. The method for a transmission substrate as claimed in claim 7, further comprising: Before delivering the substrate to the second substrate support, the substrate is delivered to an alignment hub located between the first substrate support and the second substrate support.

13. A substrate processing system, comprising: A transmission area housing that defines a transmission area, wherein the sidewalls of the transmission area housing define sealable inlets and outlets for providing and receiving substrates; Multiple substrate supports are disposed within the transmission area; as well as Transmission device, the transmission device comprising: A central hub, comprising a first axis and a second axis, the second axis extending about and concentric with the first axis, wherein the second axis is rotatable independently of the first axis. A first terminal actuator, coupled to the first shaft, includes a plurality of first arms extending radially outward from the central pivot to the distal end of each of the plurality of first arms, wherein each first arm is characterized by an arcuate shape extending along a first arcuate path to the distal end of each first arm, wherein the first terminal actuator further includes a plurality of first end members, each first end member coupled to a separate first arm of the plurality of first arms, the top surface of each of the plurality of first end members coupled to the bottom surface of an associated first arm of the plurality of first arms, such that each first end member protrudes downward from the bottom surface of the associated first arm of the plurality of first arms. A second terminal actuator, coupled to the second shaft, includes a plurality of second arms extending radially outward from the central hub to the distal end of each of the plurality of second arms. The second terminal actuator further includes a plurality of second end members, each coupled to a separate second arm of the plurality of second arms. Each second arm is characterized by an arcuate shape extending along a second arcuate path to the distal end of each second arm, wherein the second arcuate path is a mirror image of the first arcuate path about a transverse axis extending perpendicularly to the central hub. The top surface of each of the plurality of second end members is coupled to the bottom surface of an associated second arm of the plurality of second arms, such that each second end member protrudes downward from the bottom surface of the associated second arm of the plurality of second arms.

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