Laser processing platform and laser processing equipment

Abstract

The present application provides a laser processing platform and a laser processing device. The laser processing platform includes: the laser processing platform is provided with an annular groove, the top of the outer ring of the annular groove is higher than the top of the inner ring of the annular groove, and the top of the outer ring of the annular groove contacts the lower surface of the workpiece to be processed; the area to be processed of the workpiece to be processed is aligned with the upper opening of the annular groove; a drainage groove is provided in the inner ring of the annular groove; a water inlet for injecting the working fluid is provided on the side wall of the outer ring of the annular groove; during the laser processing, the working fluid enters the annular groove through the water inlet and fills the annular groove, the working fluid contacts the area to be processed of the workpiece to be processed, and the slag generated by the laser processing is discharged through the drainage groove. The laser processing platform and the laser processing device according to the embodiments of the present application can remove the dust generated during the laser processing by the moving working fluid, eliminate the slag hanging phenomenon, and improve the laser processing effect.

Description

Technical Field

[0001] The present application relates to the technical field of laser processing, and in particular, to a laser processing platform and a laser processing device. Background Art

[0002] During the process of laser processing (such as drilling, cutting, grooving, ablation, etc.) of workpieces, some dust will be generated. As the processing sample size increases (such as an increase in processing thickness or processing stroke), the dust will accumulate and adhere to the vicinity of the area to be processed on the workpiece, which is called slag hanging. The slag hanging phenomenon will cause many processed products to be unqualified and unable to meet the production requirements. Moreover, sparks will also be generated during the laser processing process. When the sparks splash onto the workpiece wall surface, a relatively thick recast layer will be generated, and a large number of microcracks will also be generated, seriously affecting the processing quality. Patent CN208772753U discloses a fixture for laser processing of small holes in glass, which includes a bottom plate with a positioning groove on the surface and a cushion block embedded in the positioning groove. The middle of the cushion block has a hollow groove, and a cooling structure for cooling the lower surface of the glass to be processed is provided on the bottom plate. An inlet hole and a cylindrical tube are provided in the middle of the cooling structure, and an outlet hole is provided at the edge. During cooling, water is pumped into the inlet hole by a water pump. After the cooling water gradually fills the cylindrical tube, it overflows to the position between the cylindrical tube and the water tank body and is discharged from the outlet hole, so that the cooling water cools the processing position of the glass workpiece. However, the structure of this fixture is complex, and it is necessary to pump water from the bottom up. If the water speed is too fast, it is easy to overflow over the glass workpiece. If the water speed is too slow, it is not easy to remove the processing debris, affecting the processing quality. Summary of the Invention

[0003] The purpose of the present application is to solve at least one of the above technical problems to a certain extent.

[0004] To this end, the first purpose of the present application is to propose a laser processing platform. By designing an annular groove at the position corresponding to the area to be processed on the laser processing platform and injecting a working fluid into the groove, the dust generated during the laser processing can be carried away by the moving working fluid, the slag hanging phenomenon can be eliminated, and the laser processing effect can be improved.

[0005] The second purpose of the present application is to propose a laser processing device.

[0006] To achieve the above object, an embodiment of the first aspect of the present application provides a laser processing platform, including: The laser processing platform is provided with an annular groove, the top of the outer ring of the annular groove is higher than the top of the inner ring of the annular groove, and the top of the outer ring of the annular groove is in contact with the lower surface of the workpiece to be processed; The area to be processed of the workpiece to be processed is aligned with the upper opening of the annular groove; A drainage groove is provided in the inner ring of the annular groove; An inlet for injecting a working fluid is provided on the side wall of the outer ring of the annular groove; During laser processing, the working fluid enters the annular groove through the inlet and fills the annular groove, the working fluid contacts the area to be processed of the workpiece to be processed, and the slag generated by laser processing is discharged through the drainage groove.

[0007] Optionally, the inlet is located at the bottom of the annular groove.

[0008] Optionally, the vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed is within a preset distance range.

[0009] Optionally, the first flow rate of the working fluid injected into the inlet is maintained within a first flow rate range, and the vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed is within a preset distance range, so that the working fluid always contacts the area to be processed of the workpiece to be processed during laser processing.

[0010] Optionally, the first distance from the bottom of the annular groove to the top of the inner ring is greater than the vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed, so that the working fluid first contacts the area to be processed of the workpiece to be processed and then is discharged through the drainage groove.

[0011] Optionally, the second flow rate of the working fluid discharged from the drainage groove is maintained within a second flow rate range.

[0012] Optionally, the second flow rate of the working fluid discharged from the drainage groove and the first flow rate of the working fluid injected into the inlet are in a multiple relationship.

[0013] Optionally, the working fluid rises uniformly in the annular groove at a third flow rate.

[0014] Optionally, the cross-sectional area of the drainage groove is larger than the cross-sectional area of the area to be processed of the workpiece to be processed.

[0015] Optionally, the upper surface of the laser processing platform is further provided with adsorption holes, an adsorption channel is arranged inside the laser processing platform, one end of the adsorption channel is communicated with the adsorption holes, and the other end of the adsorption channel is connected to a vacuum generating device that provides adsorption force.

[0016] In the laser processing platform of the present application, an annular groove is designed at the position corresponding to the area to be processed on the laser processing platform, and a working fluid is injected into the groove. The moving working fluid can carry away the dust generated during the laser processing, eliminate the slag hanging phenomenon, and improve the laser processing effect. At the same time, it avoids the generation of sparks and recast layers during laser processing, and avoids the generation of microcracks in the processing area.

[0017] To achieve the above object, an embodiment of the second aspect of the present application provides a laser processing device, including the laser processing platform and the laser processing module described in the above embodiment. The laser processing module is arranged above the laser processing platform, and the laser emitted by the laser processing module irradiates on the area to be processed of the workpiece to be processed.

[0018] Optionally, the laser processing module further includes a laser optical path control device. During the laser processing, the laser optical path control device controls the laser to penetrate the workpiece to be processed and controls the processing point of the laser to always be located on the contact surface between the area to be processed of the workpiece to be processed and the working fluid.

[0019] Optionally, the starting position of the processing point of the laser is the lower surface of the area to be processed of the workpiece to be processed.

[0020] Optionally, the workpiece to be processed is a transparent workpiece.

[0021] In the laser processing device of the present application, an annular groove is designed at the position corresponding to the area to be processed on the laser processing platform, and a working fluid is injected into the groove. The moving working fluid can carry away the dust generated during the laser processing, eliminate the slag hanging phenomenon, and improve the laser processing effect. At the same time, it avoids the generation of sparks and recast layers during laser processing, and avoids the generation of microcracks in the processing area.

[0022] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0023] The schematic diagrams in the specification forming a part of the present application are used to provide a further understanding of the present application. The schematic embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0024] Figure 1 is a schematic structural diagram of a laser processing platform according to an embodiment of the present application;

[0025] Figure 2 is a top view of a laser processing platform according to an embodiment of the present application;

[0026] Figure 3 is a top view of a laser processing platform according to another embodiment of the present application;

[0027] Figure 4 The first top view of the flow direction of the working fluid according to an embodiment of the present application;

[0028] Figure 5 The second top view of the flow direction of the working fluid according to an embodiment of the present application;

[0029] Figure 6 The third top view of the flow direction of the working fluid according to an embodiment of the present application;

[0030] Figure 7 The side view of the flow direction of the working fluid according to an embodiment of the present application;

[0031] Figure 8 The structural schematic diagram of the laser processing platform according to another embodiment of the present application;

[0032] Figure 9 The structural schematic diagram of the laser processing equipment according to an embodiment of the present application;

[0033] Figure 10 The structural schematic diagram of the laser processing equipment according to another embodiment of the present application. Detailed implementation manners

[0034] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the drawings and in conjunction with the embodiments.

[0035] The following further describes the present application in detail with specific embodiments, and these embodiments should not be construed as limiting the scope claimed by the present application.

[0036] The laser processing platform and the laser processing equipment according to the embodiments of the present application will be described below with reference to the drawings.

[0037] As Figures 1 - 3 shown, an annular groove 1 is provided on the upper surface of the laser processing platform.

[0038] It can be seen from the figure that the top of the outer ring of the annular groove 1 is higher than the top of the inner ring of the annular groove 1, and the top of the outer ring of the annular groove is in contact with the lower surface of the workpiece to be processed.

[0039] The processing area 21 of the workpiece 2 to be processed is aligned with the upper opening of the annular groove 1.

[0040] A drainage groove 3 is provided in the inner ring of the annular groove 1. The cross-sectional area A4 of the drainage groove 3 is smaller than the cross-sectional area A3 of the inner ring of the annular groove 1.

[0041] The outer ring side wall of the annular groove 1 is provided with a water inlet 4 for injecting the working fluid. In the prior art, the water inlet is arranged in the middle. At the moment of impact of the working fluid, a part of the working fluid flows to the middle part of the area to be machined of the workpiece to be machined, and a part of the working fluid flows to the periphery of the area to be machined of the workpiece to be machined, resulting in an uncontrollable discharge direction of the slag during the laser machining process, and the slag scatters everywhere, affecting the machining effect. In addition, since the working fluid directly impacts the workpiece to be machined, when the laser machining is completed, a through hole will be formed in the center of the workpiece to be machined, and the working fluid will directly overflow from the through hole. At this time, the laser has not been turned off, and the laser will refract when passing through the overflowing working fluid, resulting in laser damage in other areas. Therefore, in this application, setting the water inlet on the side wall can effectively solve the problems existing in the prior art.

[0042] Further, the water inlet 4 is located at the bottom of the annular groove 1, specifically, it can be as Figure 1 shown, on the side of the bottom of the annular groove 1. If the height of the water inlet 4 is set too high, it will cause the working fluid to impact the area to be machined 21 of the workpiece to be machined 2 before the working fluid is evenly diffused to the area between the inner ring and the outer ring. At this time, an uneven water flow will be formed, and the working fluid will overflow from the through hole formed by the workpiece to be machined 2 when the machining is completed.

[0043] During the laser machining process, as Figure 4 shown, the working fluid first passes through the water inlet 4. Among them, the first flow rate V1 of the working fluid injected into the water inlet 4 is maintained within the first flow rate range.

[0044] Immediately afterwards, as Figure 5 shown, the working fluid impacts the inner ring of the annular groove 1 and starts to flow around the annular groove 1.

[0045] As Figure 6 shown, the working fluid fills the bottom of the annular groove 1 to form a ring.

[0046] As Figure 7 shown, the working fluid starts to rise at a uniform speed until the working fluid contacts the area to be machined 21 of the workpiece to be machined 2.

[0047] Among them, the flow rate of the working fluid moving at a uniform speed upward in the annular groove 1 is the third flow rate V23.

[0048] Since the vertical distance H2 between the top of the inner ring of the annular groove 1 and the lower surface of the workpiece to be machined is within the preset distance range. The range of H2 is 0.1 - 3 mm. In this way, after the area between the inner ring and the outer ring of the annular groove 1 is filled with the working fluid, the working fluid first flows to the surface of the area to be machined, rather than directly discharging from the drainage groove 3 in the inner ring without flowing along the area to be machined.

[0049] Among them, the first distance H1 from the bottom of the annular groove to the top of the inner ring is greater than the vertical distance H2 between the top of the inner ring of the annular groove and the lower surface of the workpiece to be machined, so as to ensure that the working fluid can rise uniformly after entering the annular groove.

[0050] Finally, the flow of the working fluid takes away the slag generated by laser machining and discharges it downward through the drainage groove 3.

[0051] The cross-sectional area A4 of the drainage groove 3 is greater than the cross-sectional area A5 of the area to be machined 21, so that it can be ensured that the working fluid is discharged from the drainage groove 3 and overflows from the area to be machined 21 is avoided.

[0052] The second flow rate V4 of the working fluid discharged from the drainage groove 3 is maintained within a second flow rate range. The range of V4 is 0.1 - 3 m / s. In this way, during laser machining, it will neither be that the working fluid speed is too fast and the slag cannot be taken away in time, nor will it be that the flow rate is too slow and the slag removal efficiency is not high.

[0053] In addition, before the working fluid is injected into the annular groove 1, the area between the workpiece 2 to be machined and the annular groove 1 is air. If the flow rate V4 is too slow, it will cause the working fluid to not be able to drain the air between the workpiece 2 to be machined and the annular groove 1 completely. Under this circumstance, when laser machining is carried out, a large amount of slag will be generated. If the flow rate V4 is too fast, it will cause the working fluid to overflow at the moment when the laser drilling breaks through.

[0054] Furthermore, the second flow rate V4 of the working fluid discharged from the drainage groove and the first flow rate V1 injected into the water inlet are in a multiple relationship, for example, V1 ≥ 0.5V4, to ensure that the working fluid can contact the lower surface of the area to be machined and then be discharged from the drainage groove 3.

[0055] Furthermore, the working fluid rises uniformly in the annular groove at a third flow rate, which can ensure that the working fluid can contact the lower surface of the area to be machined, cool it, take away the slag, and can also avoid the problem of working fluid overflow in the prior art.

[0056] It should be understood that the shape of the annular groove 1 is not limited to the circular shape shown in the figure, and can also be an elliptical shape or other shapes.

[0057] The following takes the annular groove as a circle and laser drilling as an example for detailed description.

[0058] As Figures 1 - 2As shown in the figure, the workpiece 2 to be processed is placed on the laser processing platform. At least one annular groove 1 for injecting working fluid is provided on the laser processing platform, and the processing area 21 of the workpiece 2 to be processed is aligned with the annular groove 1. Among them, the bottom area between the outer ring and the inner ring of the annular groove 1 is closed, and the wall height (H1 + H2) of the outer ring is greater than the wall height (H1) of the inner ring. A drain groove 3 is provided in the inner ring of the annular groove 1, and the lower end is in an open state for discharging the working fluid. An inlet 4 for injecting the working fluid is provided on the outer side of the bottom end of the outer ring wall, and its diameter is D1. The working fluid is injected from the side inlet 4, and then the working fluid impacts the wall of the inner ring. During the impact process, the local flow rate of the working fluid is reduced, so that the working fluid is evenly dispersed within the annular groove body between the inner ring and the outer ring, and rises uniformly to fill the annular groove body between the inner ring and the outer ring, reducing the impact force of the working fluid on the workpiece to be processed, ensuring that the water flow of the working fluid is uniform and in the same direction during laser processing, and ensuring that the working fluid does not overflow when laser processing is completed.

[0059] Among them, the relationship between the flow rate V1 of the working fluid injected into the inlet 4 and the flow rate V23 of the working fluid entering the area between the outer ring and the inner ring of the annular groove 1 is V1 ≥ 0.5 * V23. The relationship among the wall height H1 of the inner ring, the diameter D1 of the inlet 4, and the vertical distance H2 between the top of the inner ring of the annular groove 1 and the upper surface of the laser processing platform is H1 ≥ D1 + H2. This makes the working fluid always contact the processing area of the workpiece to be processed during laser processing.

[0060] The number of the annular grooves 1 can be multiple, and the number is related to the requirements of laser drilling. One annular groove corresponds to one drilling area.

[0061] In the laser processing platform of the embodiment of the present application, by designing an annular groove at the position corresponding to the processing area on the laser processing platform and injecting the working fluid into the groove, the moving working fluid can carry away the dust generated during laser processing, eliminate the slag hanging phenomenon, and improve the laser processing effect. At the same time, it avoids generating sparks and recast layers during laser processing and avoids generating microcracks in the processing area.

[0062] As Figure 1 and Figure 3 shown in the embodiment, its solution is the same as the technical solution of the first embodiment, except that the annular groove is oval.

[0063] In another embodiment of the present application, as Figure 8 shown in the figure, an adsorption hole 5 is further provided on the upper surface of the laser processing platform. An adsorption channel 6 is arranged inside the laser processing platform. One end of the adsorption channel 6 is communicated with the adsorption hole 5, and the other end of the adsorption channel 6 is connected to a vacuum generating device 7 that provides adsorption force. The vacuum generating device 7 can suck the air in the adsorption channel 6, so that the adsorption hole 5 adsorbs the workpiece 2 to be processed, thereby better fixing the workpiece 2 to be processed.

[0064] To implement the above embodiments, the present application also provides a laser processing device.

[0065] As Figure 9 shown, the laser processing device includes the laser processing platform 100 and the laser processing module 200 described in the previous embodiment.

[0066] The laser processing module 200 is disposed above the laser processing platform 100, and the laser emitted by the laser processing module 200 irradiates the processing area 21 of the workpiece 2 to be processed.

[0067] Wherein, the workpiece 2 to be processed is a transparent workpiece.

[0068] In an embodiment of the present application, the laser processing module 200 may include a laser, a beam expander, a field lens, etc., for focusing the laser on the workpiece 2 to be processed. The wavelength of the laser covers the entire spectrum.

[0069] The lower surface of the processing area 21 of the workpiece 2 to be processed is in contact with the working fluid below it. By arranging the working fluid below the lower surface of the processing area 21 of the workpiece 2 to be processed, during laser processing, heat can be removed, sparks generated during processing can be avoided, recast layers can be avoided, and at the same time, a cooling effect can be achieved, and the problem of slag hanging caused by dust cladding generated during laser processing can be avoided. On the other hand, microcracks generated during laser processing can also be reduced.

[0070] Taking glass laser drilling with water as the working fluid as an example: During laser processing, the laser penetrates through the glass and starts drilling at the bottom surface of the glass (the interface between the bottom surface of the glass and water). During the processing, the laser processing focus is controlled to move from bottom to top until the drilling is completed. During the processing, the water gradually rises along the opening, so that the laser processing point is always at the interface between water and the glass sheet. On the one hand, heat is removed, sparks generated during laser processing are avoided, recast layers are avoided, and at the same time, a cooling effect is achieved, and the problem of slag hanging caused by dust cladding generated during laser processing is avoided. On the other hand, microcracks generated during laser processing can also be reduced. During the laser processing process, the water is always in contact with the lower surface of the glass sheet.

[0071] In another embodiment of the present application, as Figure 10 shown, the laser processing module 200 further includes a laser optical path control device 210.

[0072] During laser processing, the laser optical path control device 210 controls the laser to penetrate through the workpiece 2 to be processed and controls the processing point of the laser to always be located on the contact surface between the processing area of the workpiece 2 to be processed and the working fluid.

[0073] The starting position of the processing point of the laser is the lower surface of the processing area 21 of the workpiece 2 to be processed.

[0074] Specifically, the starting position of the processing point of the laser is the lower surface of the to-be-processed area 21 of the workpiece 2 to be processed. It scans while slowly moving upward to complete the processing. The specific implementation methods may include the following: First, use a 3D galvanometer for scanning to achieve three-dimensional scanning processing; Second, use a 2D galvanometer to complete planar processing, and the laser optical path control system drives the laser processing module to move up and down to achieve three-dimensional scanning processing; or by moving the position of the product, three-dimensional scanning processing is achieved; Third, a three-dimensional motion mechanism drives the laser processing module or the workpiece to be processed to move in three dimensions to achieve three-dimensional processing. Or combine the above three methods to achieve processing on different focal planes.

[0075] Among them, the workpiece 2 to be processed is a transparent workpiece, and the material can be any one of glass, sapphire, silicon crystal, and transparent polymer material.

[0076] In some embodiments, a thin film is also coated on the surface of the workpiece 2 to be processed. The thin film may include an ITO film, a metal film, or a thin film of other materials. The laser processing equipment of the present application has a better processing effect on the workpiece to be processed coated with a thin film, which can avoid the adverse effects (such as the phenomenon of forming white fog) caused by the heat generated during processing on the product, and reduce the thermal impact and damage to the thin film.

[0077] In some embodiments, the workpiece 2 to be processed can also be an optical lens, and a thin film can be coated on the optical lens. The thin film includes any one or more of an antireflection film, a high-reflection film, a filter film, a polarization film, a protective film, and a conductive film.

[0078] The laser processing equipment of the present application has a better processing effect on the optical lens coated with a thin film, which can avoid the adverse effects (such as the phenomenon of forming white fog) caused by the heat generated during processing on the product, and reduce the thermal impact and damage to the thin film.

[0079] It should be understood that the above laser processing process can be, for example, cutting, drilling blind holes, partial ablation, modification, etc., and the present application does not limit it.

[0080] It should be noted that in this text, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variation thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0081] It should be noted that in the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

Claims

1. A laser processing platform, characterized in that, Comprising: The laser processing platform is provided with an annular groove, the top of the outer ring of the annular groove is higher than the top of the inner ring of the annular groove, and the top of the outer ring of the annular groove contacts the lower surface of the workpiece to be processed; The processing area of the workpiece to be processed is aligned with the upper opening of the annular groove; A drainage groove is provided in the inner ring of the annular groove; The side wall of the outer ring of the annular groove is provided with a water inlet for injecting the working fluid; During the laser processing, the working fluid enters the annular groove through the water inlet and fills the annular groove. The working fluid contacts the processing area of the workpiece to be processed, and discharges the slag generated by the laser processing through the drainage groove; The first distance from the bottom of the annular groove to the top of the inner ring is greater than the vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed, so that the working fluid first contacts the processing area of the workpiece to be processed and then is discharged through the drainage groove; The water inlet is located at the bottom of the annular groove.

2. The laser processing platform according to claim 1, wherein The vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed is within a preset distance range.

3. The laser processing platform according to claim 1, characterized in that, The first flow rate of the working fluid injected into the water inlet is maintained within a first flow rate range, and the vertical distance between the top of the inner ring of the annular groove and the lower surface of the workpiece to be processed is within a preset distance range, so that the working fluid always contacts the processing area of the workpiece to be processed during the laser processing.

4. The laser processing platform according to claim 1, wherein, The second flow rate of the working fluid discharged from the drainage groove is maintained within a second flow rate range.

5. The laser processing platform according to claim 4, wherein The second flow rate of the working fluid discharged from the drainage groove and the first flow rate of the working fluid injected into the water inlet are in a multiple relationship.

6. The laser processing platform according to claim 1, wherein, The working fluid rises uniformly in the annular groove at a third flow rate.

7. The laser processing platform according to claim 1, characterized in that, The cross-sectional area of the drainage groove is larger than the cross-sectional area of the processing area of the workpiece to be processed.

8. The laser processing platform according to claim 1, wherein, The upper surface of the laser processing platform is further provided with adsorption holes, an adsorption channel is arranged inside the laser processing platform, one end of the adsorption channel is communicated with the adsorption holes, and the other end of the adsorption channel is connected to a vacuum generating device that provides adsorption force.

9. A laser processing device, characterized in that, Comprising the laser processing platform and the laser processing module according to any one of claims 1-8, the laser processing module is arranged above the laser processing platform, and the laser emitted by the laser processing module irradiates the processing area of the workpiece to be processed.

10. The laser processing device according to claim 9, characterized in that, The laser processing module further includes a laser light path control device. During the laser processing, the laser light path control device controls the laser to penetrate through the workpiece to be processed and controls the processing point of the laser to always be located on the contact surface between the processing area of the workpiece to be processed and the working fluid.

11. The laser processing device according to claim 10, characterized in that, The starting position of the processing point of the laser is the lower surface of the processing area of the workpiece to be processed.

12. The laser processing equipment according to claim 9, characterized in that, The workpiece to be processed is a transparent workpiece.

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