Sample detection system, heating device, heating component and method of using the heating device

Abstract

The present invention relates to a sample detection system, a heating device, a heating component and a method for using the heating device. The sample detection system includes a detection device and a heating device. The heating device includes a heating component and a sample carrier. The sample carrier is used to carry a sample. The heating component includes a first heating component and a second heating component. A placement plane is provided on the first heating component. A heating hole is provided on the placement plane. One side of the second heating component abuts against the first heating component, and the other side of the second heating component can be inserted into the heating hole. The outer surface of the second heating component is spaced from the inner wall of the heating hole. The heat of the second heating component is not equal to the heat of the first heating component. The sample carrier is placed on the placement plane and covers the heating hole. The detection device detects the heated sample. The heating device can thermally desorb substances with different boiling points in different time windows, thereby ensuring the continuous and effective operation of the sample detection system and the accuracy of the detection results.

Description

Technical Field

[0001] The present invention relates to the technical field of sample detection, and in particular to a sample detection system, a heating device, a heating component and a method for using the heating device. Background Art

[0002] With the widespread application of liquid chromatography-mass spectrometry systems in the analysis of complex compound systems, atmospheric pressure electrospray ionization sources and atmospheric pressure chemical ionization sources play an important role. The thermal desorption device is used to increase the saturated vapor pressure of substances with poor volatility under atmospheric pressure, and is a key component of in-situ ionization mass spectrometry. The current thermal desorption device cannot take into account substances with low desorption temperatures and high desorption temperatures. When the temperature is low, high-boiling point analytes cannot be effectively desorbed and cannot be detected; when the temperature is high, the components of the mixture will be desorbed at the same time, resulting in ionization competition among the components and congestion of mass spectrometry peaks. More importantly, if the desorption temperature is set too high, low-boiling point analytes are easily cracked and cannot be effectively detected. At the same time, the membrane strip is in direct contact with the high-temperature heating component. If it is in a high-temperature environment for a long time, it will melt, break, and even release other irrelevant chemicals, affecting the continuous and effective operation of the entire thermal desorption device and the detection accuracy. Summary of the invention

[0003] Based on this, it is necessary to provide a sample detection system, a heating device, a heating assembly and a method for using the heating device for thermal desorption of substances with different boiling points in order to address the above problems.

[0004] A heating assembly comprises a first heating element and a second heating element, wherein the first heating element is provided with a placement plane, the placement plane is used for placing a sample carrier and for transferring heat from the first heating element to the sample carrier, and a heating hole is opened on the placement plane; the second heating element can be inserted into the heating hole, the position of the second heating element facing a side of the sample carrier in the direction of gravity is not higher than the position of the placement plane in the direction of gravity, the outer surface of the second heating element is spaced from the inner wall of the heating hole, and the heat of the second heating element is not equal to that of the first heating element.

[0005] In one embodiment, the first heating element includes a heating body and a first heating portion, the heating body is provided with the placement plane, the heating body is connected to one end of the second heating element, the first heating portion is provided in the heating body, and the heat of the first heating portion can be transferred to the placement plane through the heating body.

[0006] In one embodiment, the second heating element includes a fixing portion and a second heating portion, the fixing portion is in contact with the first heating element, one end of the second heating portion is connected to the fixing portion, and the other end of the second heating portion is inserted into the heating hole.

[0007] In one embodiment, the second heating element further includes a heat insulating portion, one side of the heat insulating portion is connected to the fixed portion, the other side of the heat insulating portion facing away from the fixed portion is connected to the first heating element, one end of the second heating element is connected to the heat insulating portion, and the second heating element is located between the first heating element and the fixed portion.

[0008] In one of the embodiments, a waist-shaped hole is provided on the heat insulation part, and the second heating part can be movably connected to the heat insulation part through the waist-shaped hole.

[0009] In one embodiment, the diameter of the heating hole is in the range of 2 mm to 8 mm, and the outer diameter of the second heating portion is in the range of 2 mm to 3 mm.

[0010] A heating device comprises the heating assembly as described above and a sample carrier, wherein the sample carrier is used for carrying samples, and the sample carrier is placed on the placement plane and covers the heating hole.

[0011] A sample detection system comprises a detection device and the heating device as described above, wherein the detection device is used to detect the sample heated by the heating device.

[0012] A method for using a heating device comprises the following steps:

[0013] Placing the sample carrier on the placement plane and covering the heating hole;

[0014] placing a sample on the sample carrier;

[0015] Controlling the temperature of the heating hole to a first temperature, heating the sample carrier, and maintaining a preset low-temperature heating time;

[0016] Controlling the temperature of the heating hole to a second temperature; wherein the second temperature is lower than the first temperature;

[0017] Heating is finished.

[0018] In one embodiment, the step of maintaining the preset low temperature heating time further comprises:

[0019] Controlling the temperature of the central area of ​​the heating hole to a third temperature and maintaining a preset high temperature heating time; wherein the third temperature is higher than the first temperature;

[0020] Controlling the temperature of the heating hole to a second temperature; wherein the second temperature is lower than the first temperature;

[0021] Heating is finished.

[0022] In one embodiment, controlling the temperature of the heating hole to a first temperature comprises:

[0023] controlling the temperature of the first heating element to the first temperature; or

[0024] The temperatures of the first heating element and the second heating element are controlled to the first temperature.

[0025] In one embodiment, the temperature of the heating hole is controlled to a first temperature, and the first temperature is not greater than 200°C.

[0026] In one of the embodiments, the temperature of the central area of ​​the heating hole is controlled to a third temperature, and the third temperature is not greater than 800°C.

[0027] The sample detection system, heating device, heating assembly and method of using the heating device are as follows: when detection is required, the sample is placed on the sample carrier, the sample carrier is placed on the placement plane and covered on the heating hole. When the liquid sample is heated, the first heating element and the second heating element are heated separately. Since the heat of the second heating element is not equal to the heat of the first heating element, and the outer surface of the second heating element is spaced from the inner wall of the heating hole. The inner wall temperature of the heating hole can be adjusted to be higher than the temperature of the second heating element by heat regulation, so that the liquid sample is directed to move to a relatively low temperature area, that is, above the second heating element, during the heating process, and at the same time, the liquid sample is restricted above the relatively low temperature second heating element to prevent the sample from sliding to the outer area of ​​the high temperature heating hole, thereby realizing the positioning of the liquid sample during the heating process, ensuring that the position of the liquid sample is consistent, and making the difference in the stability of the detection small. The repeatability of the detection device during detection is improved, and the detection accuracy is improved. The heat of the first heating element is maintained to keep the temperature of the inner wall and edge of the heating hole constant, thereby achieving a constant temperature heating function, avoiding the Leidenfrost effect of the liquid sample, and ensuring the safety and reliability of the heating process.

[0028] Samples with different boiling points can be heated, tested and analyzed only by adjusting the heat of the first heating element or the second heating element. The sample can also be heated, tested and analyzed by controlling the heat of the first heating element so that the temperature near the heating hole reaches the first temperature and the temperature of the second heating element reaches the first temperature. The temperature of the first heating element and the temperature of the second heating element are consistent and kept constant, so that most of the low-boiling-point components can be desorbed without cracking. Then the heat of the second heating element is controlled so that the temperature of the second heating element is quickly increased to the third temperature, which is higher than the temperature at the edge of the heating hole. After desorption and analysis of the high-boiling-point components, the temperature of the second heating element is quickly lowered to return to the second temperature, and the heating is terminated or prepared for the next analysis. Since the preset high-temperature heating time of the second heating element is short, it will not damage the sample carrier. The preset high-temperature heating time is usually 3s-10s.

[0029] The sample detection system can meet the desorption and detection requirements of complex analyte systems with different desorption temperatures. The heating device and heating components can achieve thermal desorption of substances with different boiling points in different time windows, reduce the ionization competition effect brought by traditional single components, provide a certain degree of separation function, improve qualitative and quantitative accuracy, ensure the continuous and effective operation of the sample detection system, and ensure the accuracy of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 is a schematic structural diagram of a heating device in an embodiment;

[0033] Figure 2 for Figure 1 A schematic structural diagram of a heating assembly in an embodiment.

[0034] The components in the figure are marked as follows:

[0035] 10. Heating device; 100. Sample carrier; 110. First plate; 120. Second plate; 200. Heating assembly; 210. First heating element; 211. Fixing block; 212. Heating plate; 2121. Placement plane; 213. Heating hole; 214. Mounting hole; 220. Second heating element; 221. Fixing part; 222. Second heating part; 230. Heat insulating part; 300. Mounting part. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0037] See also Figure 1 and Figure 2 , a sample detection system in an embodiment includes a detection device and a heating device 10. The heating device 10 includes a heating assembly 200 and a sample carrier 100. The sample carrier 100 is used to carry the sample. The heating assembly 200 includes a first heating element 210 and a second heating element 220. A placement plane 2121 is provided on the first heating element 210. The placement plane 2121 is used to place the sample carrier 100 and to transfer the heat of the first heating element 210 to the sample carrier 100. A heating hole 213 is provided on the placement plane 2121. The second heating element 220 can be inserted into the heating hole 213. The position of the second heating element 220 facing a side of the sample carrier 100 in the direction of gravity is not higher than the position of the placement plane 2121 in the direction of gravity. The outer surface of the second heating element 220 is spaced from the inner wall of the heating hole 213. The heat of the second heating element 220 is not equal to the heat of the first heating element 210. The sample carrier 100 is placed on the placement plane 2121 and covers the heating hole 213. The detection device is used to detect the sample after being heated by the heating device 10.

[0038] When the test is required, the sample is placed on the sample carrier 100, and the sample carrier 100 is placed on the placement plane 2121 and covered on the heating hole 213. When the liquid sample is heated, the first heating element 210 and the second heating element 220 are heated separately. Since the heat of the second heating element 220 is not equal to the heat of the first heating element 210, and the outer surface of the second heating element 220 is spaced from the inner wall of the heating hole 213. The inner wall temperature of the heating hole 213 can be adjusted to be higher than the temperature of the second heating element 220, and then the liquid sample is directed to move to a relatively low temperature area, that is, above the second heating element 220, during the heating process, and at the same time, the liquid sample is limited above the relatively low temperature second heating element 220 to prevent the sample from sliding to the outer area of ​​the high temperature heating hole 213, thereby realizing the positioning of the liquid sample during the heating process, ensuring that the position of the liquid sample is consistent, and making the difference in the stability of the test small. The repeatability of the detection device during the test is improved, and the detection accuracy is improved. The heat of the first heating element 210 is maintained to keep the temperature of the inner wall and edge of the heating hole 213 constant, thereby achieving a constant temperature heating function, avoiding the Leidenfrost effect of the liquid sample, and ensuring the safety and reliability of the heating process.

[0039] In one embodiment, a method for using the heating device 10 of any of the above embodiments comprises the following steps:

[0040] Place the sample carrier 100 on the placement plane 2121 and cover the heating hole 213;

[0041] Placing a sample on the sample carrier 100;

[0042] Controlling the temperature of the heating hole 213 to a first temperature, heating the sample carrier 100, and maintaining a preset low-temperature heating time;

[0043] Controlling the temperature of the heating hole 213 to a second temperature; wherein the second temperature is lower than the first temperature;

[0044] Heating is finished.

[0045] The second heating element 220 is disposed in the heating hole 213 and is located in the central area of ​​the heating hole 213. A side of the second heating element 220 facing the sample carrier 100 may be flush with the placement plane 2121 or may be lower than the placement plane 2121.

[0046] In one embodiment, the step of maintaining the preset low temperature heating time further comprises:

[0047] Controlling the temperature of the central area of ​​the heating hole 213 to a third temperature and maintaining a preset high temperature heating time; wherein the third temperature is higher than the first temperature;

[0048] Controlling the temperature of the heating hole 213 to a second temperature; wherein the second temperature is lower than the first temperature;

[0049] Heating is finished.

[0050] In one embodiment, controlling the temperature of the heating hole 213 to a first temperature includes:

[0051] Controlling the temperature of the first heating element 210 to a first temperature; or

[0052] The temperatures of the first heating member 210 and the second heating member 220 are controlled to a first temperature.

[0053] The method of controlling the heating hole 213 to the first temperature can be selected and adjusted according to actual detection conditions.

[0054] In one embodiment, the temperature of the heating hole 213 is controlled to a first temperature, and the first temperature is not greater than 200°C.

[0055] In one embodiment, the temperature of the central area of ​​the heating hole 213 is controlled to a third temperature, and the third temperature is not greater than 800°C.

[0056] In one embodiment, controlling the temperature of the central area of ​​the heating hole 213 to a third temperature includes:

[0057] The temperature of the second heating member 220 is increased to the third temperature.

[0058] In one embodiment, if the sample is in liquid state, the first heating element 210 is controlled to a first temperature; or, the first heating element 210 is controlled to a first temperature, and the second heating element 220 is controlled to a second temperature to heat the sample carrier 100 .

[0059] When the sample is liquid, only the first heating element 210 can be controlled to heat, and the second heating element 220 is not heated. In this way, the temperature near the heating hole 213 is higher than that of the second heating element 220. The liquid sample is confined above the relatively low temperature second heating element 220 to prevent the sample from sliding to the outer area of ​​the high temperature heating hole 213, thereby positioning the liquid sample during the heating process, ensuring that the position of the liquid sample is consistent, and reducing the difference in detection stability.

[0060] In one embodiment, if the sample is solid, the first heating element is controlled to the first temperature; or the second heating element is controlled to the first temperature. Solid samples can be heated by a single heating element to improve heating efficiency.

[0061] In one embodiment, lowering the temperature of the first heating element 210 and the temperature of the second heating element 220 to the second temperature comprises:

[0062] The heated samples are tested using a testing device.

[0063] The sample can be heated, tested and analyzed for samples with different boiling points only by adjusting the heat of the first heating element 210 or the second heating element 220. The sample can also be heated, tested and analyzed for samples with different boiling points by controlling the heat of the first heating element 210 so that the temperature near the heating hole 213 reaches the first temperature and the temperature of the second heating element 220 reaches the first temperature. The temperature of the first heating element 210 and the temperature of the second heating element 220 are consistent and kept constant, so that most of the low-boiling-point components can be desorbed without cracking. Then the heat of the second heating element 220 is controlled so that the temperature of the second heating element 220 is quickly increased to the third temperature, which is higher than the temperature at the edge of the heating hole 213. After desorption and analysis of the high-boiling-point components, the temperature of the second heating element 220 is quickly lowered to restore it to the second temperature, and heating is terminated or prepared for the next analysis. Since the preset high-temperature heating time of the second heating element 220 is short, it will not damage the sample carrier 100.

[0064] It should be noted that the first temperature, the third temperature and the second temperature in the above-mentioned embodiment are not fixed temperatures, nor do they specifically refer to a certain temperature value, and can be changed and adjusted according to actual detection needs or heating needs of sample components. At the same time, the high temperature heating time is usually preset to be 3s-10s. As long as it does not cause damage to the sample carrier 100, the preset high temperature heating time can also be increased according to the sample heating needs, and 12s, 20s or 30s are all possible.

[0065] The sample detection system can meet the desorption and detection requirements of complex analyte systems with different desorption temperatures. The heating device 10 and the heating component 200 can achieve thermal desorption of substances with different boiling points in different time windows, reduce the ionization competition effect brought by traditional single components, provide a certain degree of separation function, improve qualitative and quantitative accuracy, ensure the continuous and effective operation of the sample detection system, and also ensure the accuracy of the detection results.

[0066] The heating device 10 can also heat solid samples. The solid samples in powder or block form are directly placed on the sample carrier 100 and then heated and analyzed by the first heating element 210 and the second heating element 220 .

[0067] In one embodiment, the heating device 10 further includes a mounting member 300. The mounting member 300 is used to mount the heating assembly 200 in an instrument. The instrument includes but is not limited to a mass spectrometer, and other instruments requiring a heating function may also be equipped with the heating assembly 200.

[0068] Furthermore, the sample carrier 100 and the second heating element 220 are arranged at intervals. If the placement plane 2121 is a horizontal plane, the second heating element 220 is located below the horizontal plane, and the sample carrier 100 is located on the horizontal plane. The placement plane 2121 can also be other planes, as long as the interval between the second heating element 220 and the sample carrier 100 is set. The second heating element 220 and the sample carrier 100 are not in contact, which can prevent the second heating element 220 from melting, breaking, and releasing other unnecessary components of the sample carrier 100 when the high temperature is generated, thereby ensuring the continuous and effective operation of the sample detection system. At the same time, it can also be achieved that the high boiling point components will not be lost during low-temperature desorption; during high-temperature desorption, the low boiling point components will not be cracked. The accuracy of the detection results is also guaranteed. In one embodiment, if the placement plane 2121 is a horizontal plane, the second heating element 220 is flush with the horizontal plane on one side facing the sample carrier 100, and the sample carrier 100 can contact the placement plane 2121 and one side of the second heating element 220 at the same time. Whether the sample carrier 100 and the second heating element 220 are arranged at an interval, that is, the positional relationship between the placement plane 2121 and a side surface of the second heating element 220 can be adjusted according to actual detection conditions.

[0069] In one embodiment, the sample carrier 100 includes a first plate 110 and two second plates 120 respectively connected to both sides of the first plate 110. The first plate 110 is placed on a placement plane 2121 and is used to carry the sample, and the second plate 120 is located outside the placement plane 2121. In this way, when the first plate 110 is placed on the placement plane 2121, under the action of the gravity of the second plate 120, the first plate 110 can be closely attached to the placement plane 2121, so that the first plate 110 has good contact with the placement plane 2121, which is conducive to the placement plane 2121 to transfer heat to the first plate 110 evenly. Furthermore, the second plate 120 is inclined relative to the first plate 110, that is, it forms an angle with the first plate 110. The height position of the second plate 120 away from the side of the first plate 110 is lower than the placement plane 2121. This is equivalent to the sample carrier 100 being buckled on the placement plane 2121. On the one hand, it can be stably installed on the placement plane 2121. On the other hand, it can also achieve good contact between the sample carrier 100 and the placement plane 2121 to achieve a tight fit.

[0070] Specifically, the sample carrier 100 is a membrane tape structure. The membrane bag is a flat membrane tape. The membrane tape includes but is not limited to polytetrafluoroethylene film. The material of the membrane tape can also be polyether ketone, aluminum foil or copper foil. The width of the membrane tape ranges from 8mm to 12mm. The thickness of the membrane tape ranges from 0.08mm to 0.12mm. In one embodiment, the width of the membrane tape is 10mm. The thickness of the membrane tape is 0.1mm. The membrane tape structure is continuous and easy to replace. There will be no cross-contamination of samples, and the detection accuracy is guaranteed. The sample carrier 100 can also be a carrier plate structure. The carrier plate includes but is not limited to a glass plate. As long as the heating operation is convenient and the detection accuracy is guaranteed.

[0071] Further, the first heating element 210 includes a heating body and a first heating part. A placement plane 2121 is provided on the heating body. The heating body is connected to one end of the second heating element 220. The first heating part is arranged in the heating body. The heat of the first heating part can be transferred to the placement plane 2121 through the heating body. Specifically, the heating body includes a fixed block 211 and a heating plate 212. The fixed block 211 is used to be installed on the mounting member 300. The heating plate 212 is installed on the fixed block 211. The first heating part is arranged in the heating plate 212. The side of the heating plate 212 facing away from the mounting member 300 is the placement plane 2121. The fixed block 211 and the heating plate 212 are both made of materials with high heat resistance and thermal conductivity. Specifically, the fixed block 211 includes but is not limited to a copper block, an aluminum block or a stainless steel block. The heating plate 212 includes but is not limited to a copper plate, an aluminum plate or a stainless steel plate. The fixed block 211 can provide a stable support for the heating plate 212 to ensure the structural stability of the heating assembly 200. The heating plate 212 can make the sample carrier 100 more stably placed. The heating plate 212 can also ensure that the heat of the first heating part is dissipated more evenly, thereby ensuring the practicality and reliability of the heating component 200.

[0072] When the heating plate 212 is performing heating work, the temperature of each part on the placement plane 2121 remains consistent. The heat distribution on the placement plane 2121 is uniform, so that the sample on the sample carrier 100 is heated more evenly, and it is not easy to slip during the heating process, thereby improving the stability of the test result. Further, the shape of the first heating part is rod-shaped. A mounting hole 214 is provided on the heating plate 212. The rod-shaped first heating part is inserted into the mounting hole 214. It can achieve a more uniform heat distribution on the placement plane 2121, so that the sample is heated more evenly and it is not easy to slip during the heating process. In addition, the rod-shaped first heating part is specifically, for example, an electric heating rod. The electric heating rod is connected to an external device through a first wire. When the external device is started, the electric heating rod is powered through the first wire, and the electric heating rod generates heat and transfers it to the heating plate 212. Of course, the heating rod is not limited to the method of electric heating, and it can also be a feasible solution that the external heat source transfers heat to the heating rod, and then the heat is transferred to the heating plate 212 through the heating rod. In addition, it should be noted that the present embodiment is not limited to heating the heating plate 212 by a heating rod. For example, an electric thermal resistance wire may be arranged inside the heating plate 212, and the heating plate 212 may be heated when the electric thermal resistance wire is energized. For example, the heat generated by combustion and the heat generated by chemical reaction may be directly transferred to the heating plate 212. Of course, heat may be transferred to the heating plate 212 in other ways, which are not limited here.

[0073] Further, the second heating element 220 abuts against the first heating element 210. The second heating element 220 includes a fixed portion 221 and a second heating portion 222. The fixed portion 221 abuts against the first heating element 210. One end of the second heating portion 222 is connected to the fixed portion 221. The other end of the second heating portion 222 is inserted into the heating hole 213. The second heating portion 222 can also be an electric heating rod. Specifically, the second heating portion 222 is a high-temperature microcrystalline ceramic heating rod. Other feasible schemes of the second heating portion 222 are the same as those of the first heating portion, as described above for the first heating portion, and are not repeated here. It should be noted that the upper temperature limit of the high-temperature microcrystalline ceramic heating rod is 800°C, and the upper temperature limit of the first heating portion is 200°C. The temperature of the first heating portion and the temperature of the second heating portion 222 are significantly different, which is conducive to positioning of liquid samples and is also convenient for desorption of components with different boiling points. The second heating portion 222 and the fixed portion 221 are in point contact. It is avoided that the second heating portion 222 transfers heat to the fixed portion 221. Ensure that heat can be gathered on the second heating part 222 to achieve rapid high-temperature heating.

[0074] If the sample carrier 100 is directly heated at a high temperature through the placement plane 2121, even if it is instantaneous high temperature heating, it will cause damage to the sample carrier 100. In this embodiment, in contrast to the high temperature surface heating of the placement plane 2121, the rod-shaped second heating part 222 is inserted into the heating hole 213 for heating. The heating mode of the second heating part 222 for the sample carrier 100 is high temperature spot heating. Instantaneous high temperature spot heating will not cause damage to the sample carrier 100. Generally, the second heating part can make its own temperature higher than the temperature of the first heating part within a time range of 3s-10s.

[0075] Specifically, a connecting hole is provided on one end of the fixing portion 221. The connecting hole is connected to the heating hole 213. The other end of the fixing portion 221 abuts against the first heating element 210. The other end of the second heating portion 222 passes through the connecting hole and is inserted into the heating hole 213. The connecting hole can increase the length of the heating hole 213, making it easier to insert and install the second heating portion 222.

[0076] In one embodiment, the second heating element 220 further includes an insulating portion 230. One side of the insulating portion 230 is connected to the fixed portion 221, and the other side of the insulating portion 230 facing away from the fixed portion 221 is connected to the first heating element 210. One end of the second heating portion 222 is connected to the insulating portion 230, and the second heating portion 222 is located between the first heating element 210 and the fixed portion 221. When the temperature of the second heating portion 222 is higher than that of the first heating portion, the insulating portion 230 can isolate the heat of the second heating portion 222 from being transferred from the fixed portion 221 to the second heating portion 222. Ensure that the temperature of the first heating portion and the second heating portion 222 is stable and the heating process is reliable. Specifically, the insulating portion 230 is made of high-temperature insulating material. The upper limit of the insulation temperature of the insulating portion 230 is not less than the upper limit of the temperature of the second heating portion 222. When the second insulating portion 230 is a high-temperature microcrystalline ceramic heating rod, the upper limit of the insulation temperature of the insulating portion 230 is 800°C.

[0077] Furthermore, a waist-shaped hole is provided on the heat insulating part 230. The second heating part 222 can be movably connected to the heat insulating part 230 through the waist-shaped hole. Since the heat insulating part 230 is provided with a waist-shaped hole, a bolt can be passed through the waist-shaped hole, and the second heating part 222 abuts against the bolt. The height position of the bolt in the waist-shaped hole can be adjusted up and down, so that the installation position of the second heating part 222 can be adjusted. Other high-temperature resistant components can also be inserted into the waist-shaped hole, as long as the structure of the second heating part 222 can be guaranteed to be stable and safe.

[0078] In one embodiment, the heating assembly 200 further includes a temperature sensing element. The temperature sensing element is used to sense the temperature of the first heating part and the second heating part 222. In this way, the temperature of the first heating part and the second heating part 222 is sensed by the temperature sensing element, and the heating rod is controlled to work accordingly according to the temperature sensed by the temperature sensing element, so as to control the temperature on the supporting plane of the first heating part and the second heating part 222 within a preset range. Specifically, the temperature sensing element is connected to the external device through the second wire. Of course, the temperature sensing element can also send a signal to the external device through wireless transmission.

[0079] Specifically, the temperature sensing element includes a PT100 temperature sensor and a K-type thermocouple temperature sensor. The PT100 temperature sensor is used to monitor the temperature of the first heating part. The K-type thermocouple temperature sensor is used to monitor the temperature of the second heating part 222, and the K-type thermocouple temperature sensor can be used to set a gradient temperature program, which is more convenient for controlling the second heating part 222 to quickly increase the temperature.

[0080] In one embodiment, the heating hole 213 is a through hole. The shape of the heating hole 213 is a circular hole, an elliptical hole, a square hole or a triangular hole. It can also be a hole of other shapes, which is not limited here. The aperture range of the heating hole 213 is 2mm-8mm, and the outer diameter range of the second heating part 222 is 2mm-3mm. In one embodiment, the aperture of the heating hole 213 is 4mm.

[0081] In addition to the electric thermal desorption device, the single-component constant temperature thermal desorption device also has other desorption methods, such as ultrasonic vibration desorption devices and halogen light thermal desorption devices, which cannot take into account both low desorption temperature and high desorption temperature substances. When the temperature is low, high boiling point analytes cannot be effectively desorbed and cannot be detected; when the temperature is high, the components of the mixture will be desorbed at the same time, resulting in ionization competition among the components and mass spectrum peak congestion. If the desorption temperature is set too high, low boiling point analytes are easy to cleave and cannot be effectively detected. However, in actual applications, complex analytical systems such as pesticides and veterinary drug residues in food with many types and large differences in physicochemical properties often contain both low desorption temperature substances and high desorption temperature substances. In order to take into account the problems of material desorption and cross contamination, disposable, thin and chemically stable membrane strips are usually used. If the membrane strip is in direct contact with the high-temperature heating component 200 and is in a high temperature environment for a long time, it will melt, break, and even release other irrelevant chemicals, affecting the continuous and effective operation of the entire heating device 10. Some combined thermal desorption devices in the prior art are generally selected from a combination of an electric thermal desorption device, a photothermal desorption device, and an acoustic wave desorption device. However, the photothermal desorption device or the acoustic wave desorption device inevitably makes the desorption device complex, bulky, and difficult to control. In particular, the core heating component 200 cannot be heated for a long time due to its life span limitation.

[0082] The above embodiment provides a combined high-efficiency thermal desorption device. It can be used to heat liquid or solid samples, which helps mass spectrometry detect more types of samples, and can achieve thermal desorption of substances with different boiling points in different time windows, reduce the ionization competition effect brought by traditional single components, provide a certain degree of separation function, and improve qualitative and quantitative accuracy. At the same time, the electric thermal desorption device has stable control, simple structure, convenient processing, and is easy to mass produce.

[0083] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0084] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0085] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0086] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct conflict, or the first and second features are in indirect conflict through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0087] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0088] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A heating component, characterized in that: The heating assembly comprises: A first heating element, wherein a placement plane is provided on the first heating element, the placement plane is used to place the sample carrier and to transfer the heat of the first heating element to the sample carrier, and a heating hole is opened on the placement plane; and a second heating element, the second heating element being capable of being inserted into the heating hole, the position of the second heating element facing a side surface of the sample carrier in the gravity direction being no higher than the position of the placement plane in the gravity direction, the outer surface of the second heating element being spaced from the inner wall of the heating hole, and the heat of the second heating element being unequal to that of the first heating element; The second heating element comprises a fixing portion and a second heating portion, the fixing portion abuts against the first heating element, one end of the second heating portion is connected to the fixing portion, and the other end of the second heating portion is inserted into the heating hole; The first heating element comprises a heating body and a first heating portion, the heating body comprises a fixing block and a heating plate; the fixing block is used to be mounted on the mounting member; the heating plate is mounted on the fixing block; the first heating portion is arranged in the heating plate; the side of the heating plate facing away from the mounting member is a placement plane; the second heating element is located on a side of the heating plate close to the mounting member; The temperature of the heating hole is controlled to a first temperature; and the second heating element is controlled to make the temperature of the central area of ​​the heating hole reach a third temperature, wherein the third temperature is higher than the first temperature.

2. The heating assembly according to claim 1, characterized in that The second heating element also includes an insulating part, one side of the insulating part is connected to the fixed part, the other side of the insulating part facing away from the fixed part is connected to the first heating element, one end of the second heating part is connected to the insulating part, and the second heating part is located between the first heating element and the fixed part.

3. The heating assembly according to claim 2, characterized in that The heat insulating portion is provided with a waist-shaped hole, and the second heating portion can be movably connected to the heat insulating portion through the waist-shaped hole; and / or The aperture range of the heating hole is 2mm-8mm, and the outer diameter range of the second heating part is 2mm-3mm.

4. A heating device, characterized in that: The heating device comprises: A heating assembly as claimed in any one of claims 1 to 3; and A sample carrier, wherein the sample carrier is used to carry a sample, and the sample carrier is placed on the placement plane and covers the heating hole.

5. A sample detection system, characterized in that: The sample detection system comprises: detection devices; and The heating device as described in claim 4, wherein the detection device is used to detect the sample after being heated by the heating device.

6. A method for using a heating device, characterized in that: The method is implemented by the heating device according to claim 4, and comprises the following steps: Placing the sample carrier on the placement plane and covering the heating hole; placing a sample on the sample carrier; Controlling the temperature of the first heating element to a first temperature; or controlling the temperatures of the first heating element and the second heating element to a first temperature; controlling the temperature of the heating hole to a first temperature, heating the sample carrier, and maintaining a preset low-temperature heating time; Lowering the temperature of the first heating element and the temperature of the second heating element to a second temperature, so as to control the temperature of the heating hole to a second temperature; wherein the second temperature is lower than the first temperature; Heating is finished.

7. The method for using the heating device according to claim 6, characterized in that: The method further comprises maintaining the preset low temperature heating time and then: Controlling the temperature of the central area of ​​the heating hole to a third temperature and maintaining a preset high temperature heating time; wherein the third temperature is higher than the first temperature; Controlling the temperature of the heating hole to a second temperature; wherein the second temperature is lower than the first temperature; Heating is finished.

8. The method for using the heating device according to claim 7, characterized in that: controlling the temperature of the heating hole to a first temperature, wherein the first temperature is not greater than 200° C.; and / or The temperature of the central area of ​​the heating hole is controlled to a third temperature, and the third temperature is not greater than 800°C.

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