Silicon wafer chucking device

Abstract

The application provides a silicon wafer chuck structure, which comprises a chuck body, a vacuum generator, a baffle and exhaust holes, wherein the chuck body has a central axis; the vacuum generator is arranged around the central axis; the baffle comprises a first baffle which is arranged upwards along the outer edge of the chuck body and a plurality of second baffles which are arranged upwards along the upper surface of the chuck body in a radial manner; the exhaust holes are arranged in an array on the chuck body; the exhaust holes are located obliquely below the inclined exhaust ports; in the upward extending direction, the orthographic projection of the exhaust holes surrounds the orthographic projection of the inclined exhaust ports; the lower surface of the chuck body is used for contacting and sucking the silicon wafer; the vacuum generator is used for generating a negative pressure airflow and for generating exhaust air from the inclined exhaust ports and discharging the exhaust air through the exhaust holes.

Description

Technical Field

[0001] This invention relates to the field of solar cell manufacturing technology, and in particular to a silicon wafer suction cup device. Background Technology

[0002] like Figures 1 to 6 As shown, the existing silicon wafer chuck 100 picks up silicon wafers 300 from the silicon wafer cassette device 200, switches to pick up another set of silicon wafers 300 via the rotating mechanism 400, and then transports the silicon wafer cassette device 200 via the silicon wafer conveyor 500, repeating the process in sequence. The rotating mechanism 400 includes a servo motor 410 and a telescopic cylinder 420. One end of the servo motor 410 is connected to one end of the telescopic cylinder 420. A vacuum generator 110 is provided above the silicon wafer chuck 100, and the telescopic cylinder 420 is positioned above the vacuum generator 110. It has an air inlet 111, which is connected to the telescopic cylinder 420. The existing silicon wafer suction cup 100 is a circular suction cup. When switching to rotary transfer, the circular silicon wafer suction cup 100 is more likely to damage or break the silicon wafer 300 during movement. Secondly, after the silicon wafer 300 is picked up, the vacuum generator 110 has a direct exhaust port 120 at the bottom to discharge airflow, but it will directly blow onto the surface of the silicon wafer 300, making the silicon wafer 300 easy to be damaged during movement. This will seriously affect subsequent processes, resulting in excessively high costs and high defect rates. Summary of the Invention

[0003] Purpose of the invention: To provide a silicon wafer suction cup device that can solve the problem of damage and breakage that easily occurs during the silicon wafer suction process.

[0004] Technical Solution: A silicon wafer chuck device includes a chuck body with a central axis at its center. The device also includes a vacuum generator, multiple baffles, and multiple exhaust ports arranged around the central axis. The vacuum generator is positioned above the chuck body, and its bottom has multiple oblique exhaust ports and multiple suction ports. Each oblique exhaust port extends upward from the bottom of the vacuum generator, and the cross-sectional width of each port gradually decreases from bottom to top. The baffles include a first baffle protruding upward around the outer edge of the chuck body and multiple second baffles radially distributed protruding upward from the upper surface of the chuck body. Each second baffle extends from the side surface of the vacuum generator to connect with the first baffle. The exhaust vents are arranged in a circumferential array on the suction cup body; the exhaust vents are located diagonally below the inclined exhaust port, and in the downward extension direction, the orthographic projection of the exhaust vents surrounds the orthographic projection of the inclined exhaust port; the bottom of the suction cup body has a lower surface, which is used to contact and pick up the silicon wafer; the vacuum generator is used to generate negative pressure airflow from the suction vent and then discharge it, and to generate exhaust from the inclined exhaust port and discharge it through the exhaust vent; wherein, a baffle is added to the suction cup body, the air above the silicon wafer is turbulent due to the baffle, the airflow velocity is reduced, the pressure above the silicon wafer is reduced, the pressure is reduced, the relative pressure difference between the upper and lower surfaces of the silicon wafer is increased, making the silicon wafer more reliably picked up; the vacuum generator picks up the silicon wafer in a non-contact manner, without contamination, ensuring flatness.

[0005] Furthermore, the silicon wafer chuck device also includes multiple weight-reducing holes arranged around the central axis, with each weight-reducing hole arranged in a circumferential array on the chuck body. These holes penetrate the chuck body vertically and surround multiple vent holes. A vent hole and a weight-reducing hole are correspondingly provided between any two adjacent second edges. The weight-reducing holes are used to reduce the weight of the chuck body, making the silicon wafer less prone to vibration and reducing the probability of wafer drop.

[0006] Furthermore, the silicon wafer chuck device also includes multiple reinforcing ribs arranged around the central axis, with each rib circumferentially arrayed on the chuck body. These ribs are radially distributed around the central axis and located below the exhaust holes. The reinforcing ribs increase the strength of the chuck body, reduce deformation, and prevent wafer breakage during chuck suction. They also isolate the direct suction of the silicon wafer surface by the vacuum generator, reducing breakage and contamination rates.

[0007] Furthermore, a hollow section is provided between any two adjacent reinforcing ribs, and the hollow section is positioned opposite to the weight-reducing hole. The hollow section is used to reduce the weight of the suction cup body.

[0008] Furthermore, the suction cup body has a first layer and a second layer arranged opposite to each other. The vent and weight reduction holes penetrate the first layer vertically, and the reinforcing ribs are distributed radially around the central axis on the second layer. The hollow part penetrates the second layer vertically.

[0009] Furthermore, the first guard edge protrudes upward around the outer edges of the first and second layers, and multiple second guard edges protrude upward from the upper surface of the first layer and are distributed radially. The first guard edges connect the first layer and the second layer respectively.

[0010] Furthermore, the suction cup body and the vacuum generator are fixedly connected, and the first layer and the second edge, the first layer and the first edge, the first edge and the second edge, the first edge and the second layer, and the second layer and the reinforcing rib are all integrally connected.

[0011] Furthermore, the suction cup body is a synthetic foamed resin structural component.

[0012] Furthermore, the number of vents, weight reduction holes, second baffles, reinforcing ribs, and hollow sections are all 8.

[0013] Furthermore, the outer contour dimensions of the suction cup body are smaller than the dimensions of the silicon wafer; the contact area between the suction cup body and the silicon wafer is increased, making the silicon wafer more stable after being picked up.

[0014] Beneficial effects: Compared to a circular silicon wafer suction cup body, this silicon wafer suction cup device increases the contact area between the suction cup body and the silicon wafer during suction, resulting in a larger supporting area for the silicon wafer and greater stability after suction. Furthermore, the vacuum generator on the suction cup body employs a non-contact suction method with the silicon wafer, eliminating contamination and ensuring flatness. A first baffle is added to the outer edge of the suction cup body. According to Bernoulli's principle, the air above the silicon wafer experiences turbulence due to the first baffle, reducing airflow velocity and decreasing pressure above the wafer. This increases the relative pressure difference between the upper and lower surfaces of the silicon wafer, making suction more reliable. An annular vent is added to the suction cup body, and a bevel is added to the bottom of the vacuum generator to connect with the vent of the vacuum generator and the vent of the suction cup body. Compared to existing devices where the vacuum generator's vent directly blows onto the silicon wafer surface, resulting in reduced suction, this silicon wafer suction cup device exhausts air through the vacuum generator's vent and then through the bevel into the vent of the suction cup body, effectively reducing the reduction in suction. This silicon wafer chuck device can greatly reduce the loss during the silicon wafer chuck process. It has a simple structure, reduces costs, improves efficiency, and simplifies subsequent manual operations. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an existing silicon wafer chuck;

[0016] Figure 2 yes Figure 1 A schematic diagram of the silicon wafer picking and rotating mechanism;

[0017] Figure 3 This is a schematic diagram of the silicon wafer chuck device;

[0018] Figure 4 yes Figure 3 A cross-sectional view of the silicon wafer chuck device in the image;

[0019] Figure 5 This is a 3D schematic diagram of a silicon wafer chuck;

[0020] Figure 6 yes Figure 5 A partial schematic diagram;

[0021] Figure 7 This is a schematic diagram of the silicon wafer chuck device of the present invention;

[0022] Figure 8 yes Figure 7 Schematic diagram of the bottom structure of the silicon wafer suction cup device;

[0023] Figure 9 yes Figure 7 A partial schematic diagram of a silicon wafer chuck;

[0024] Figure 10 This is a diagram showing the location of the exhaust port;

[0025] Figure 11 This is a schematic diagram of the structure of the direct exhaust port corresponding to an existing vacuum generator;

[0026] Figure 12 This is a schematic diagram of the oblique exhaust port structure of the present invention. Detailed Implementation

[0027] The technical solution provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0028] like Figure 7 , Figure 8 and Figure 12 As shown, the silicon wafer suction cup device is used to pick up silicon wafers. It includes a suction cup body 1 with a central axis 11. The silicon wafer suction cup device also includes a vacuum generator 2, a baffle 3, an exhaust port 4, multiple weight-reducing holes 5, and reinforcing ribs 7 arranged around the central axis 11. The vacuum generator 2 is fixedly installed at the upper center position of the suction cup body 1. The vacuum generator 2 is a cylindrical structure. The bottom of the vacuum generator 2 is provided with multiple suction holes 6, multiple oblique exhaust ports 21, and an air inlet 22.

[0029] like Figure 12 As shown, multiple inclined exhaust ports 21 extend upwards from the bottom of the vacuum generator 2, and the longitudinal cross-sectional width of each inclined exhaust port 21 gradually decreases from bottom to top. The inclined exhaust ports 21 and the vacuum generator 2 are used for exhausting air, while the suction port 6 is used to discharge the negative pressure airflow generated by the vacuum generator to adsorb the silicon wafer. Figure 11 As shown, the angled exhaust port 21 is easier to guide airflow compared to the straight exhaust port 120 provided at the bottom of the existing vacuum generator 110.

[0030] The existing suction cup device 100 has a hollow center, and the vacuum generator 110 is fixed inside the suction cup device 110 by screws. The surface of the vacuum generator 110 directly picks up the silicon wafer 300. The surfaces of the suction cup device 100 and the vacuum generator 110 are not easily on the same plane, resulting in flatness error and fragmentation. Furthermore, direct picking up can lead to contamination and fragmentation of the silicon wafer 300. In contrast, the vacuum generator 2 on the suction cup body 1 of the present invention adopts a non-contact picking up method with the silicon wafer, which is contamination-free and ensures flatness.

[0031] Most silicon wafers are square. The suction cup body 1 described in this invention is preferably a quadrilateral or octagonal structure, with the outer contour dimensions of the suction cup body 1 smaller than the size of the silicon wafer. Compared to existing suction cups, the existing suction cup device 100 is circular in shape. The circular shape does not match the square silicon wafer, which is detrimental to stable suction. However, this suction cup body 1 increases the contact area between the square silicon wafer and the suction cup body. Because the bearing area of ​​the square silicon wafer is increased, the square silicon wafer becomes more stable after suction. Furthermore, the suction cup body 1 is a synthetic foamed resin structure.

[0032] like Figure 7 As shown, the edge 3 includes a first edge 31 protruding upwards around the outer edge of the suction cup body 1, and a plurality of second edges 32 radially distributed protruding upwards from the upper surface of the suction cup body 1. Each second edge 32 extends from the side surface of the vacuum generator 2 to connect with the first edge 31. By adding the edge 3 as an edge guard on the suction cup body 1, according to Bernoulli's principle, the air above the silicon wafer is turbulent due to the edge 3, the air velocity decreases, the pressure above the silicon wafer decreases, and the relative pressure difference between the upper and lower surfaces of the silicon wafer increases, making the silicon wafer more reliably sucked up.

[0033] The suction cup body 1 has a first layer 12 and a second layer 13 arranged opposite to each other. A first retaining edge 31 protrudes upward around the outer edges of the first layer 12 and the second layer 13. Multiple second retaining edges 32 protrude upward from the upper surface of the first layer 12 and are distributed radially. The first retaining edges 31 connect the first layer 12 and the second layer 13 respectively. The first layer 12 and the second retaining edge 32, the first layer 12 and the first retaining edge 31, the first retaining edge 31 and the second retaining edge 32, and the first retaining edge 31 and the second layer 13 are all integrally connected.

[0034] like Figure 9 , Figure 10As shown, the exhaust holes 4 are arranged in a circumferential array on the suction cup body 1. Specifically, the exhaust holes 4 penetrate the first layer 12 vertically. The exhaust holes 4 are located diagonally below the inclined exhaust port 21, and in the downward extension direction, the orthographic projection of the exhaust holes 4 surrounds the orthographic projection of the inclined exhaust port 21. Alternatively, multiple exhaust holes 4 can be connected to form a single annular exhaust port. By adding annularly arranged exhaust holes 4 to the suction cup body 1, and connecting the inclined exhaust port 21 at the bottom of the vacuum generator 2 to the exhaust holes 4, compared to the reduced suction caused by the exhaust port of the existing vacuum generator directly blowing onto the silicon wafer surface, this silicon wafer suction cup device exhausts through the inclined exhaust port 21 of the vacuum generator 2 and then enters the exhaust holes 4 of the suction cup body 1 through the inclined exhaust port 21 for discharge, which is equivalent to reducing the reduction in suction.

[0035] The weight-reducing holes 5 are arranged in a circumferential array on the suction cup body 1. Multiple weight-reducing holes 5 penetrate the suction cup body 1 vertically and surround multiple vent holes 4. Specifically, the weight-reducing holes 5 penetrate the first layer 12 vertically, and an vent hole 4 and a weight-reducing hole 5 are provided between any two adjacent second baffles 32. Compared with the existing suction cup device, the design of the weight-reducing holes 5 on the suction cup body 1 reduces the weight of the suction cup body, making the suction cup body 2 lighter. During the transfer of silicon wafers, the inertia is reduced due to the reduced weight, making the silicon wafer less prone to excessive vibration, reducing the probability of silicon wafer falling off, and improving the yield.

[0036] A reinforcing rib 7 is arranged in a circumferential array on the suction cup body 1. Multiple reinforcing ribs 7 are radially distributed around the central axis 11 and located below the exhaust hole 4. A hollow portion 71 is correspondingly provided between any two adjacent reinforcing ribs 7. Furthermore, the reinforcing ribs 7 are radially distributed around the central axis 11 on the second layer 13. The hollow portion 71 penetrates the second layer 13 vertically. The hollow portion 71 is arranged opposite to the weight reduction hole 5. The second layer 13 and the reinforcing ribs 7 are integrally connected. The setting of the reinforcing ribs 7 on the suction cup body 1 not only increases the strength of the suction cup body 1 and reduces the phenomenon of excessive flatness deformation of the suction cup body after the hollow portion 71 is removed, thereby avoiding the impact of breakage after the square suction cup is picked up, the reinforcing rib 7 can also isolate the vacuum generator from directly picking up the silicon wafer surface, reducing the fragmentation rate and contamination rate.

[0037] There are 8 weight-reducing holes 5, 8 second retaining edges 32, 8 reinforcing ribs 7, and 8 hollowed-out parts 71.

[0038] The silicon wafer suction cup device of this invention features an increased contact area between the suction cup body 1 and the silicon wafer, resulting in more stable wafer suction. The vacuum generator 2 performs contactless suction of the silicon wafer, eliminating contamination. A baffle 3 is added above the suction cup body 1, reducing the pressure above the silicon wafer and increasing the relative pressure difference between the upper and lower surfaces, making wafer suction more reliable. An exhaust port 4 is provided on the suction cup body 1, and an inclined exhaust port 21 is provided at the bottom of the vacuum generator 2, connected to the exhaust port 4. The exhaust gas is discharged through the exhaust port 4, reducing the decrease in suction force; the reinforcing rib 7 increases the strength of the suction cup body 1, reduces excessive flatness deformation of the suction cup body 1, and avoids the impact of wafer breakage after the square suction cup is picked up. The reinforcing rib 7 can also isolate the vacuum generator 2 from directly picking up the silicon wafer surface, reducing the breakage rate and contamination rate; the weight reduction hole 5 reduces the weight of the suction cup body 1, so that during the transfer of silicon wafers, the inertia is reduced due to the reduced weight, the silicon wafer is less likely to vibrate excessively, the probability of silicon wafer falling off is reduced, and the yield is improved.

Claims

1. A silicon wafer chuck device, comprising a chuck body (1), wherein a central shaft (11) is provided at the center of the chuck body (1), characterized in that, It also includes a vacuum generator (2) arranged around the central axis (11), multiple baffles (3), and multiple exhaust holes (4); the suction cup body (1) is square; The vacuum generator (2) is located above the suction cup body (1). The bottom of the vacuum generator (2) is provided with multiple inclined exhaust ports (21) and multiple suction holes (6). Each inclined exhaust port (21) extends upward from the bottom of the vacuum generator (2), and the longitudinal cross-sectional width of each inclined exhaust port (21) gradually decreases from bottom to top. The baffle (3) includes a first baffle (31) that protrudes upward around the outer edge of the suction cup body (1) and a plurality of second baffles (32) that protrude upward from the upper surface of the suction cup body (1) and are distributed radially. Each second baffle (32) extends from the side surface of the vacuum generator (2) to connect with the first baffle (31). Multiple exhaust holes (4) are arranged in a circumferential array on the suction cup body (1); the exhaust holes (4) are located diagonally below the oblique exhaust port (21), and in the downward extension direction, the orthographic projection of the exhaust holes (4) surrounds the orthographic projection of the oblique exhaust port (21); The bottom of the suction cup body (1) has a lower surface for contacting and picking up the silicon wafer; the vacuum generator (2) is used to generate negative pressure airflow from the suction port (6) and to generate exhaust from the inclined exhaust port (21) and to be discharged through the exhaust port (4).

2. The silicon wafer chuck device according to claim 1, characterized in that, It also includes multiple weight-reducing holes (5) arranged around the central axis (11), and the multiple weight-reducing holes (5) are arranged in a circumferential array on the suction cup body (1); the multiple weight-reducing holes (5) penetrate the suction cup body (1) vertically and surround multiple exhaust holes (4); an exhaust hole (4) and a weight-reducing hole (5) are provided between any two adjacent second stops (32).

3. The silicon wafer chuck device according to claim 2, characterized in that, It also includes multiple reinforcing ribs (7) arranged around the central axis (11), and the multiple reinforcing ribs (7) are arranged in a circumferential array on the suction cup body (1); the multiple reinforcing ribs (7) are radially distributed around the central axis (11) and located below the exhaust hole (4).

4. The silicon wafer chuck device according to claim 3, characterized in that, A hollow part (71) is provided between any two adjacent reinforcing ribs (7), and the hollow part (71) and the weight reduction hole (5) are arranged opposite to each other.

5. The silicon wafer chuck device according to claim 4, characterized in that, The suction cup body (1) has a first layer (12) and a second layer (13) arranged opposite to each other. The exhaust hole (4) and the weight reduction hole (5) both penetrate the first layer (12) vertically. The reinforcing rib (7) is distributed radially around the central axis (11) on the second layer (13). The hollow part (71) penetrates the second layer (13) vertically.

6. The silicon wafer chuck device according to claim 5, characterized in that, The first guard edge (31) protrudes upward around the outer edge of the first layer (12) and the second layer (13). Multiple second guard edges (32) protrude upward from the upper surface of the first layer (12) and are distributed radially. The first guard edge (31) connects the first layer (12) and the second layer (13) respectively.

7. The silicon wafer chuck device according to claim 6, characterized in that, The suction cup body (1) and the vacuum generator (2) are fixedly connected. The first layer (12) and the second side (32), the first layer (12) and the first side (31), the first side (31) and the second side (32), the first side (31) and the second layer (13), and the second layer (13) and the reinforcing rib (7) are all integrally connected.

8. The silicon wafer chuck device according to claim 1, characterized in that, The suction cup body (1) is a synthetic foamed resin structural component.

9. The silicon wafer chuck device according to claim 6, characterized in that, The number of exhaust holes (4), weight reduction holes (5), second retaining edge (32), reinforcing ribs (7), and hollow parts (71) are all 8.

10. The silicon wafer chuck device according to claim 4, characterized in that, The outer contour dimensions of the suction cup body (1) are smaller than the dimensions of the silicon wafer.

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