Packaging module and electronic device

Abstract

The embodiment of the present application discloses a packaging module and an electronic device, in which the first side and the second side of the PCB in the packaging module are respectively covered with a plastic layer, the conductive pins are electrically connected to the PCB, the conductive pins are arranged in the plastic layer along the stacking direction of the PCB and the plastic layer, and the conductive pins are partially exposed on the outer surface of the plastic layer. When the packaging module interacts electrically with other components, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, the packaging module can be arranged at a position close to the chip, and the wiring between the packaging module and the chip is short. In addition, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced.

Description

Technical Field

[0001] The present application relates to the field of circuit technology, and in particular to a packaging module and an electronic device. Background Art

[0002] In order to meet the growing demand for high-performance applications such as artificial intelligence and big data mining, the operating current of the main power chips of electronic devices continues to increase. At present, the demand for power supply in some electronic devices has reached hundreds of amperes. Therefore, it is particularly important to reduce the power loss in electronic devices.

[0003] In some devices, in existing packaging modules, the printed circuit board (PCB) is usually packaged using molding technology. After packaging, the packaging module needs to reserve through holes on the side of the package so that the pins can be connected to the PCB in the packaging module after being connected to the through holes. In this way, the packaging module can output electricity through the pins on the side, and then the packaging module can achieve electrical interaction with other components on the system motherboard through the output electricity, so as to achieve normal operation of the device.

[0004] Existing packaging modules usually use the pin-out method of side packaging, which requires a through hole to be reserved on the side of the package. The through hole will cut off the electrical signal routing arranged around the packaging module. Due to the high demand for chip routing, the packaging module needs to be arranged at a distance from the chip, and the routing between the packaging module and the chip is long. The long routing will increase the size of the electronic equipment and increase the power distribution loss of the electronic equipment. Summary of the invention

[0005] The embodiment of the present application provides a packaging module and an electronic device. When the packaging module interacts electrically with other components, the PCB in the packaging module outputs or inputs electricity through conductive leads. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, the packaging module can be arranged at a position close to the chip, and the wiring between the packaging module and the chip is short. Thus, the power distribution loss of the electronic device is reduced.

[0006] According to a first aspect of the present application, a packaging module is provided, which includes: a plastic packaging layer, a conductive pin and a printed circuit board (PCB); the first side and the second side of the PCB are respectively covered with the plastic packaging layer; the conductive pin is electrically connected to the PCB, the conductive pin is inserted into the plastic packaging layer along the stacking direction of the PCB and the plastic packaging layer, and the conductive pin is partially exposed on the outer surface of the plastic packaging layer.

[0007] The embodiment of the present application provides a packaging module, in which the first side and the second side of the PCB in the packaging module are respectively covered with a plastic layer, the conductive pins are electrically connected to the PCB, the conductive pins are arranged in the plastic layer along the stacking direction of the PCB and the plastic layer, and the conductive pins are partially exposed on the outer surface of the plastic layer. When the packaging module interacts electrically with other components, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, the packaging module can be arranged at a position close to the chip, and the wiring between the packaging module and the chip is short. Therefore, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced.

[0008] In a possible implementation of the first aspect, in the above-mentioned packaging module, the plastic packaging layer includes a first plastic packaging layer and a second plastic packaging layer, and the conductive pin includes a first conductive pin; the first surface of the PCB is covered with the first plastic packaging layer, and the second surface of the PCB is covered with the second plastic packaging layer; the first end of the first conductive pin is electrically connected to the first surface of the PCB, the first conductive pin is penetrated in the first plastic packaging layer along the stacking direction of the first surface of the PCB and the first plastic packaging layer, and the second end of the first conductive pin is partially exposed on the outer surface of the first plastic packaging layer.

[0009] In this possible implementation, the packaging module may include one or more first conductive pins. The packaging module can electrically interact with other components through the one or more first conductive pins. This possible implementation improves the convenience of connecting the packaging module to the system mainboard.

[0010] In a possible implementation of the first aspect, in the above-mentioned packaging module, the conductive pin also includes a second conductive pin; the first end of the second conductive pin is electrically connected to the second surface of the PCB, the second conductive pin is penetrated in the second plastic packaging layer along the stacking direction of the second surface of the PCB and the second plastic packaging layer, and the second end portion of the second conductive pin is exposed on the outer surface of the second plastic packaging layer.

[0011] In this possible implementation, the conductive pin includes a second conductive pin, and the second conductive pin and the first end of the first conductive pin are connected to different surfaces of the PCB, and the packaging module can achieve electrical interaction with other circuit elements through the first conductive pin and the second conductive pin. The second conductive pin is exposed on the outer surface of the second plastic packaging layer, so that the outer surface of the second plastic packaging layer can be surface-mounted with other circuit elements through the second conductive pin, thereby further making better use of the space inside the electronic device.

[0012] In a possible implementation of the first aspect, in the above-mentioned packaging module, the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB, or the outer surface of the plastic sealing layer is the side of the plastic sealing layer, or the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB and the side of the plastic sealing layer.

[0013] In this possible implementation, during the welding process of the packaging module and the system mainboard, if the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB, the packaging module can be attached to the system mainboard by soldering or other methods through the conductive pins exposed on the side of the plastic sealing layer away from the PCB, which can reduce the assembly difficulty of the packaging module, and the packaging module can achieve heat dissipation by attaching to the board and improve the heat dissipation efficiency. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer, the packaging module can be assembled on the system mainboard by soldering or other methods through the conductive pins exposed on the side of the plastic sealing layer away from the PCB, providing a new assembly method. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB and the side of the plastic sealing layer, the side of the plastic sealing layer away from the PCB and the conductive pins exposed on the side of the plastic sealing layer are assembled with the PCB by soldering or other methods, and the side of the plastic sealing layer away from the PCB and the conductive pins exposed on the side of the plastic sealing layer can achieve tin creeping. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the PCB more stable.

[0014] In a possible implementation manner of the first aspect, in the above-mentioned packaging module, the conductive pins are surface mounted on the PCB using surface mounting technology (SMT), or the conductive pins are embedded in the PCB.

[0015] In a possible implementation manner of the first aspect, in the above-mentioned packaging module, the packaging module is a system-in-package (SIP) power supply.

[0016] In a possible implementation manner of the first aspect, in the above-mentioned packaging module, a material of the conductive pin is metal, and the metal includes copper, silver or gold.

[0017] In this possible implementation, the conductive pins are made of metals such as copper, silver, and gold to achieve better conductivity, thereby reducing power distribution losses in electronic equipment.

[0018] In a possible implementation manner of the first aspect, in the above packaging module, the conductive pin is L-shaped.

[0019] In this possible implementation, making the conductive pin into an L-shape will make the processing technology of the conductive pin simpler, thereby reducing the processing cost of the conductive pin.

[0020] In a possible implementation manner of the first aspect, in the above-mentioned packaging module, the material used for the plastic packaging layer includes epoxy resin.

[0021] A second aspect of the present application provides an electronic device, which includes: a packaging module, a system mainboard and a functional module, the packaging module includes a plastic packaging layer, a conductive pin and a printed circuit board PCB, the packaging module supplies power to the functional module, the packaging module and the functional module are surface-mounted or embedded in the system mainboard, and the packaging module is the packaging module described in the above-mentioned first aspect or any possible implementation method of the first aspect.

[0022] The third aspect of the present application provides a method for manufacturing a packaging module, which includes: installing circuit elements and conductive pins on at least one of the first surface and the second surface of a printed circuit board PCB, wherein the conductive pins are electrically connected to the PCB; plastic-sealing the PCB, the circuit elements and the conductive pins, wherein the conductive pins are inserted into the plastic layer along the stacking direction of the PCB and the plastic layer; grinding a side of the plastic layer away from the PCB, wherein the conductive pins in the ground plastic layer are partially exposed on the side of the plastic layer away from the PCB; cutting the ground plastic layer to obtain the packaging module, wherein the conductive pins of the packaging module are partially exposed on the side of the plastic layer.

[0023] The embodiment of the present application provides a method for manufacturing a packaging module, wherein circuit elements and conductive pins are installed on at least one of the first and second surfaces of a printed circuit board PCB, and the conductive pins are electrically connected to the PCB; the PCB, circuit elements and conductive pins are plastic-sealed, and the conductive pins are arranged in the plastic layer along the stacking direction of the PCB and the plastic layer; the side of the plastic layer away from the PCB is ground, and the conductive pins in the ground plastic layer are partially exposed on the side of the plastic layer away from the PCB; the ground plastic layer is cut to obtain a packaging module, and part of the conductive pins of the packaging module are exposed on the side of the plastic layer. When the packaging module interacts electrically with other components, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, and the packaging module can be arranged at a position close to the chip, and the routing between the packaging module and the chip is short. In addition, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced.

[0024] In a possible implementation manner of the third aspect, preparing circuit elements on the first surface and / or the second surface of the PCB and preparing conductive pins on the first surface and / or the second surface of the PCB belong to the same operation process.

[0025] In this possible implementation, the circuit elements and the conductive pins are mounted on the PCB in the same process. Compared with the existing packaging module manufacturing process, there is no need to mount pins on the side of the plastic package body after the circuit elements are plastic-sealed, which reduces the assembly process and reduces the production cost of the packaging module.

[0026] In a possible implementation of the third aspect, the conductive pin is a U-shaped conductive pin, the first end and the second end of the U-shaped conductive pin are surface-mounted or embedded in the PCB, and the crossbeam of the U-shaped conductive pin is away from the PCB; grinding the side of the plastic encapsulation layer away from the PCB after plastic encapsulation, including: grinding the side of the plastic encapsulation layer away from the PCB to the grinding line after plastic encapsulation, the grinding line is tangent to the crossbeam of the U-shaped conductive pin, and after grinding, the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic encapsulation layer away from the PCB; cutting the ground component, including: cutting the ground component along the cutting line, the first end of the U-shaped conductive pin and the second end of the U-shaped conductive pin are respectively located on both sides of the cutting line, and after cutting, the cross section formed by cutting the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic encapsulation layer.

[0027] In this possible implementation, a surface-mountable U-shaped conductive pin is provided, wherein the first end of the U-shaped conductive pin and the second end of the U-shaped conductive pin are respectively located on both sides of the cutting line. When surface-mounting, the U-shaped conductive pin is surface-mounted on the PCB by means of surface-mounting at both ends. This type of U-shaped conductive pin is more stable when surface-mounted, which reduces the difficulty of assembling the conductive pin. After grinding, the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic layer away from the PCB, and after cutting, the cross section formed by cutting the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic layer. Both the conductive pins exposed on the side of the plastic layer away from the PCB and the side of the plastic layer can achieve tin creeping. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the PCB more stable.

[0028] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0029] The embodiment of the present application provides a packaging module, in which the first side and the second side of the PCB in the packaging module are respectively covered with a plastic layer, the conductive pins are electrically connected to the PCB, the conductive pins are arranged in the plastic layer along the stacking direction of the PCB and the plastic layer, and the conductive pins are partially exposed on the outer surface of the plastic layer. When the packaging module interacts electrically with other components, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, the packaging module can be arranged at a position close to the chip, and the wiring between the packaging module and the chip is short. In addition, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1a It is a schematic diagram of the pin-out method adopted by the existing packaging module;

[0031] Figure 1b It is an application diagram of an existing packaging module;

[0032] Figure 1c is an application schematic diagram of the packaging module provided in an embodiment of the present application;

[0033] Figure 2 is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0034] Figure 3 is a structural schematic diagram of a packaging module provided in an embodiment of the present application;

[0035] Figure 4 is another structural schematic diagram of the packaging module provided in an embodiment of the present application;

[0036] Figure 5 is another structural schematic diagram of the packaging module provided in an embodiment of the present application;

[0037] Figure 6 is another structural schematic diagram of the packaging module provided in an embodiment of the present application;

[0038] Figure 7a is a schematic diagram of an embodiment of a method for preparing a packaging module provided in an embodiment of the present application;

[0039] Figure 7b is a schematic diagram of another embodiment of a method for preparing a packaging module provided in an embodiment of the present application;

[0040] Figure 8 is a schematic diagram of another embodiment of a method for preparing a packaging module provided in an embodiment of the present application;

[0041] Fig. 9 is a schematic diagram of another embodiment of a method for preparing a packaging module provided in an embodiment of the present application;

[0042] Fig.10a is a schematic diagram of another embodiment of a method for preparing a packaging module provided in an embodiment of the present application;

[0043] Fig.10b It is a schematic diagram of another embodiment of the method for preparing a packaging module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of the present application more clear, the embodiments of the present application are described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. It is known to those skilled in the art that with the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0045] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0046] The following will be combined with the drawings in this application to clearly and completely describe the technical solutions in this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. The following specific embodiments can be combined with each other, and the same or similar contents will not be repeated in different embodiments. It should also be noted that the length, width, height (or thickness) of the various components shown in the embodiments of this application are only exemplary descriptions and are not limitations on the packaging module structure of this application.

[0047] In order to meet the growing demand for high-performance applications such as artificial intelligence and big data mining, the operating current of the main power chips of electronic devices continues to increase. At present, the demand for power supply in some electronic devices has reached hundreds of amperes. Therefore, it is particularly important to reduce the power loss in electronic devices. For example, how to reduce the power loss by designing the position arrangement between the packaging module and the chip is a question worth pondering.

[0048] Figure 1a A schematic diagram of a pin-out method used in an existing packaging module.

[0049] like Figure 1aAs shown, the packaging modules in electronic devices usually provide power for multiple components such as chips. Some existing packaging modules usually adopt the form of double-sided packaging (Molding). For example, some system-level packaging (SIP) packaging modules have both upper and lower sides of the PCB sealed with plastic. The pin-out method of the double-sided packaging SIP packaging module is different from that of the single-sided packaging SIP packaging module. The single-sided packaging SIP usually uses a frame or a carrier board to form a bottom pin-out to lead out the electrical. Figure 1a As shown, the double-sided SIP package module is limited by the mold design and cannot reuse the bottom pin out method used by the single-sided SIP package module to lead out electricity. The double-sided SIP package module needs to reserve through holes on the side of the package so that the pins can be connected to the PCB after being connected to the through holes. In this way, the package module can output electricity through the pins on the side. The output electricity can be used to power other components in the electronic device to maintain the normal operation of the device.

[0050] Figure 1b It is a schematic diagram of the application of the existing packaging module.

[0051] like Figure 1b As shown, since the existing packaging module needs to have a pin on the side, the existing packaging module needs to reserve a through hole on the side of the package so that after the pin is inserted into the through hole, the packaging module can electrically interact with the outside world through the through hole. However, the through hole reserved on the side will cut off the electrical signal routing arranged around the packaging module. Since the chip has a high demand for wiring, in order to prevent the through hole reserved on the side wall of the packaging module from cutting off the routing of the chip, it is necessary to increase the distance between the packaging module and the chip to meet the wiring requirements of the chip, so the packaging module needs to be arranged at a position farther away from the chip. The longer the line, the higher the copper loss caused on the line. The increase in the distance between the packaging module and the chip causes the copper loss Rpath of the line between the packaging module and the chip to increase, reducing the power utilization rate of the electronic device. In addition, the routing between the packaging module and the chip is lengthy. The lengthy routing will increase the size of the electronic device and increase the power distribution loss of the electronic device.

[0052] Figure 1c This is a schematic diagram of the application of the packaging module provided in an embodiment of the present application.

[0053] like Figure 1cAs shown, in response to the above-mentioned problems existing in the existing packaging modules, an embodiment of the present application provides a packaging module, in which the first side and the second side of the PCB in the packaging module are respectively covered with a plastic sealing layer, the conductive pins are electrically connected to the PCB, the conductive pins are arranged in the plastic sealing layer along the stacking direction of the PCB and the plastic sealing layer, and the conductive pins are partially exposed on the outer surface of the plastic sealing layer. When the packaging module supplies power to other components, the PCB outputs current through the conductive pins. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, the packaging module can be arranged at a position close to the chip, and the wiring between the packaging module and the chip is short. Therefore, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced.

[0054] In the embodiment of the present application, the packaging module may have other advantages in outputting electricity by means of conductive pins. For example, the packaging module is described by taking a SIP power supply as an example.

[0055] First, in order to meet the demand for increased chip computing power in electronic devices, it is necessary to double the chip area while keeping the size of the system motherboard unchanged. At the same time, the SIP power supply capacity is required to be improved compared with the previous generation of products, and the size of the power supply needs to be reduced. If the existing sidewall pin solution is adopted, the power supply needs to be arranged at a position far away from the chip. The increase in distance causes the line copper loss Rpath to increase, which reduces the power utilization rate of the electronic device. The SIP power supply prepared by the packaging module structure provided by the present application can be arranged at a position relatively close to the chip, and the wiring between the packaging module and the chip is short. Thereby, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced.

[0056] Secondly, in order to meet the dense wiring requirements of the main power chip, the SIP power supply is required to be surface mounted on the system motherboard, and the height is reduced as much as possible, so that the heat sink can be shared with the chip to reduce the heat dissipation cost. If the existing side wall pin-out solution is adopted, the through holes reserved for the side wall pins will cause the power supply size to be larger, and the pin height of the side wall pins cannot be reduced, resulting in the height of the power supply cannot be reduced, so it will not be able to meet the needs of common heat dissipation, and the manufacturing cost is high. The SIP power supply prepared by the packaging module structure provided by the present application does not need to reserve through holes, which reduces the size of the power supply. Since the side wall does not need to insert pins, the height of the SIP power supply can be reduced, and the size requirements of sharing the heat sink with the chip can be met.

[0057] Then, in the existing sidewall pin-out solution, the pin needle needs to be inserted into the through hole and soldered on the PCB, which adds a step of soldering in the manufacturing process, and the soldering process is relatively complicated, and the production cost is high. In the packaging module provided by the present application, the conductive pin is surface-mounted or embedded on the PCB together with the circuit elements on the PCB in the same step, the manufacturing process is relatively simple, and compared with the existing sidewall pin-out solution, the process is saved.

[0058] Figure 2 It is a structural diagram of an electronic device 100 provided in an embodiment of the present application.

[0059] See also Figure 2 ,like Figure 2 As shown, the electronic device 100 provided in the embodiment of the present application includes: a packaging module 101, a system mainboard 102, and a functional module 103.

[0060] The packaging module 101 and the functional module 103 are surface mounted or embedded in the system mainboard 102 , and the packaging module 101 and the functional module 103 are connected.

[0061] The packaging module 101 may be a functional module. The packaging module is an SIP power supply as an example for illustrative description. The SIP power supply is a module that provides power to electronic devices. The SIP power supply provides the electrical energy required by all components in the electronic device. Whether the current and voltage provided by the SIP power supply are stable will directly affect the working performance and service life of the electronic device.

[0062] Functional module 103 is a module that implements the functions of the electronic device with the support of packaging module 101. Optionally, functional module 103 may include a chip, a heat sink, or other components, which are not specifically limited here.

[0063] based on Figure 2 The structural schematic diagram of the electronic device 100 described herein describes the packaging module provided in the embodiment of the present application.

[0064] Figure 3 It is a structural schematic diagram of a packaging module provided in an embodiment of the present application.

[0065] like Figure 3 As shown, an embodiment of the present application provides a packaging module 200, the packaging module 200 includes: a plastic packaging layer 201, a conductive pin 202 and a PCB 203;

[0066] The first surface and the second surface of the PCB 203 are respectively covered with the plastic packaging layer 201;

[0067] The conductive pin 202 is electrically connected to the PCB 203 , and is disposed in the plastic packaging layer 201 along the stacking direction of the PCB 203 and the plastic packaging layer 201 , and a portion of the conductive pin 202 is exposed on the outer surface of the plastic packaging layer.

[0068] When the package module 200 electrically interacts with other components, the PCB 203 outputs or inputs electricity through the conductive pins.

[0069] In an embodiment of the present application, a plurality of circuit elements are integrated on the first surface and the second surface of the PCB. The circuit composed of the plurality of circuit elements can electrically interact with other components in the electronic device through conductive pins. Exemplarily, the conductive pins are electrically connected to the circuit elements integrated on the first surface or the second surface of the PCB, and the conductive pins are partially exposed outside the upper surface and the side surface of the plastic cover. In this way, the portion of the conductive pins exposed outside the plastic cover can be electrically connected to the system main board or other components on the system main board through soldering or the like, and then, the circuit elements integrated on the PCB can output electricity or input electricity through the conductive pins to realize electrical interaction with other components in the electronic device. Exemplarily, the packaging module is explained by taking the SIP power supply as an example, and the circuit elements integrated on the PCB in the SIP power supply receive control signals through the conductive pins, or the circuit elements integrated on the PCB output current through the conductive pins, thereby realizing that the SIP power supply supplies power to other components in the electronic device.

[0070] In an embodiment of the present application, in the above-mentioned packaging module, the outer surface of the plastic encapsulation layer is the side of the plastic encapsulation layer away from the PCB, or the outer surface of the plastic encapsulation layer is the side of the plastic encapsulation layer, or the outer surface of the plastic encapsulation layer is the side of the plastic encapsulation layer away from the PCB and the side of the plastic encapsulation layer.

[0071] In the present application embodiment, Figure 3 As shown in FIG. 1 , the side of the plastic encapsulation layer away from the PCB is the side of the plastic encapsulation layer that does not contact the PCB, and the side of the plastic encapsulation layer close to the PCB is the side in contact with the plastic encapsulation layer. Figure 3 As shown in the figure, the side of the plastic packaging layer refers to the side that is located in the same plane as the exposed part of the PCB.

[0072] In the embodiment of the present application, during the welding process of the packaging module and the system mainboard, if the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB, the packaging module can be attached to the system mainboard by soldering or other methods through the conductive pins exposed on the side of the plastic sealing layer away from the PCB, which can reduce the assembly difficulty of the packaging module, and the packaging module can achieve heat dissipation by attaching the board, thereby improving the heat dissipation efficiency. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer, the packaging module can be assembled on the system mainboard by soldering or other methods through the conductive pins exposed on the side of the plastic sealing layer away from the PCB, thereby providing a new assembly method. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB and the side of the plastic sealing layer, the side of the plastic sealing layer away from the PCB and the conductive pins exposed on the side of the plastic sealing layer can be assembled with the PCB by soldering or other methods, and the side of the plastic sealing layer away from the PCB and the conductive pins exposed on the side of the plastic sealing layer can achieve tin creeping. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the PCB more stable.

[0073] The packaging module provided in the embodiment of the present application may be a SIP packaging module, or may be other types of packaging modules, which are not specifically limited here.

[0074] In the embodiment of the present application, the material used for the plastic sealing layer 201 included in the packaging module may be bisphenol A type epoxy resin, the material used for the plastic sealing layer may also be phenolic type epoxy resin, the material used for the plastic sealing layer may also be other types of epoxy resins and other types of organic substances that can play a protective role and have thermal conductivity and insulation properties, and the specifics are not limited here.

[0075] In the embodiment of the present application, the material used for the conductive pin 202 included in the packaging module is a conductive material. The material used for the conductive pin 202 may be metallic copper, the material used for the conductive pin 202 may be metallic silver, the material used for the conductive pin may be metal such as metallic gold or other materials, and the material used for the conductive pin may also be other conductive materials besides metal, which is not specifically limited here.

[0076] In the embodiment of the present application, the conductive pins may be surface mounted on the PCB using SMT, or the conductive pins may be embedded in the PCB, which is not specifically limited here.

[0077] In the embodiment of the present application, the shape of the conductive pin can be as follows: Figure 3 The "L" shape shown in the figure may also be other shapes, which are not limited here.

[0078] In the embodiment of the present application, optionally, the packaging module may include one conductive pin, and the packaging module may also include multiple conductive pins, which is not specifically limited here.

[0079] In an embodiment of the present application, optionally, the conductive pins in the packaging module can be electrically connected to the first side of the PCB, the conductive pins in the packaging module can be electrically connected to the second side of the PCB, or multiple conductive pins included in the packaging module can be electrically connected to the first side of the PCB and multiple pins can be electrically connected to the second side of the PCB. The specific details are not limited here.

[0080] In an embodiment of the present application, the first side and the second side of the PCB in the packaging module are respectively covered with a plastic layer, the conductive pins are electrically connected to the PCB, the conductive pins are arranged in the plastic layer along the stacking direction of the PCB and the plastic layer, and the conductive pins are partially exposed on the outer surface of the plastic layer. When the packaging module interacts electrically with other components, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, the packaging module can be arranged at a position close to the chip, and the wiring between the packaging module and the chip is short. In addition, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced.

[0081] Figure 4 It is a schematic structural diagram of a packaging module including a first conductive pin provided in an embodiment of the present application.

[0082] like Figure 4 As shown, in a possible implementation, optionally, the plastic encapsulation layer includes a first plastic encapsulation layer and a second plastic encapsulation layer, and the conductive pin includes a first conductive pin.

[0083] The first surface of the PCB is covered with a first plastic sealing layer, and the second surface of the PCB is covered with a second plastic sealing layer.

[0084] The first end of the first conductive pin is electrically connected to the first surface of the PCB, the first conductive pin is arranged in the first plastic packaging layer along the stacking direction of the first surface of the PCB and the first plastic packaging layer, and the second end portion of the first conductive pin is exposed on the outer surface of the first plastic packaging layer.

[0085] When the package module electrically interacts with other components, the PCB outputs or inputs electricity through the first conductive pin.

[0086] In the embodiment of the present application, a plurality of circuit elements are integrated on the first surface of the PCB. The circuit composed of the plurality of circuit elements can output or input electricity through the first conductive pin, and then electrically interact with other elements. The first end and the second end of the first conductive pin penetrate the first plastic layer, the first conductive pin is arranged in the first plastic layer along the stacking direction of the first surface of the PCB and the first plastic layer, the first end of the first conductive pin is electrically connected to the circuit element integrated on the first surface of the PCB, and the second end of the first conductive pin is exposed on the outer surface of the first plastic layer. In this way, the part of the first conductive pin exposed outside the first plastic layer can be electrically connected to the system mainboard or other components on the system mainboard through soldering and other methods, and the circuit element integrated on the PCB can output electricity or input electricity through the first conductive pin to realize electrical interaction with other components in the electronic device. Exemplarily, the packaging module is explained by taking the SIP power supply as an example, the circuit element integrated on the PCB in the SIP power supply receives the control signal through the first conductive pin, or the circuit element integrated on the PCB outputs current through the first conductive pin, thereby realizing that the SIP power supply supplies power to other elements in the electronic device.

[0087] In the embodiment of the present application, the packaging module may include one first conductive pin, and the packaging module may also include more than two first conductive pins, which is not specifically limited here.

[0088] In the present application embodiment, Figure 4 As shown in FIG. 1 , the side of the plastic encapsulation layer away from the PCB is the side of the plastic encapsulation layer that does not contact the PCB, and the side of the plastic encapsulation layer close to the PCB is the side in contact with the plastic encapsulation layer. Figure 4 As shown in the figure, the side of the plastic packaging layer refers to the side that is located in the same plane as the exposed part of the PCB.

[0089] In the embodiment of the present application, during the welding process of the packaging module and the system mainboard, if the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB, the packaging module can be attached to the system mainboard by soldering or other methods through the first conductive pin exposed on the side of the plastic sealing layer away from the PCB, which can reduce the assembly difficulty of the packaging module, and the packaging module can achieve heat dissipation by attaching to the board and improve the heat dissipation efficiency. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer, the packaging module can be assembled on the system mainboard by soldering or other methods through the first conductive pin exposed on the side of the plastic sealing layer away from the PCB, providing a new assembly method. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB and the side of the plastic sealing layer, the side of the plastic sealing layer away from the PCB and the first conductive pin exposed on the side of the plastic sealing layer are assembled with the PCB by soldering or other methods, and the side of the plastic sealing layer away from the PCB and the first conductive pin exposed on the side of the plastic sealing layer can achieve tin creeping. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the PCB more stable.

[0090] In the embodiment of the present application, the type of the packaging module is the same as that described above. Figure 3 The embodiments shown are similar and will not be described in detail here.

[0091] In the embodiment of the present application, the material types used for the first plastic sealing layer and the second plastic sealing layer are the same as those mentioned above. Figure 3 The materials used for the plastic sealing layers described in the illustrated embodiments are similar and will not be described in detail here.

[0092] In the embodiment of the present application, the material type and shape of the first conductive pin are similar to those described above. Figure 3 The material types and shapes used for the conductive pins described in the illustrated embodiments are similar and will not be described in detail here.

[0093] Figure 5 It is a structural schematic diagram of a packaging module provided by an embodiment of the present application, in which the plastic packaging layer includes a plurality of first conductive pins.

[0094] like Figure 5 As shown, in a possible implementation, optionally, the conductive pin further includes a plurality of first conductive pins.

[0095] A plurality of first conductive pins are arranged in the first plastic packaging layer, the first ends of the plurality of first conductive pins are electrically connected to the first surface of the PCB, and the second ends of the plurality of first conductive pins are exposed outside the outer surface of the first plastic packaging layer.

[0096] In the embodiment of the present application, when the packaging module electrically interacts with other components, the PCB outputs or inputs electricity through the plurality of first conductive pins.

[0097] A plurality of circuit elements are integrated on the first surface of the PCB. The circuit composed of the plurality of circuit elements can output or input electricity through a plurality of first conductive pins, and then electrically interact with other elements. The first end and the second end of the plurality of first conductive pins penetrate the first plastic layer, and the plurality of first conductive pins are arranged in the first plastic layer along the stacking direction of the first surface of the PCB and the first plastic layer. The first ends of the plurality of first conductive pins are electrically connected to the circuit elements integrated on the first surface of the PCB, and the second ends of the plurality of first conductive pins are exposed on the outer surface of the first plastic layer. In this way, the plurality of first conductive pins and the portion of the second conductive pins exposed outside the first plastic layer can be electrically connected to the system mainboard or other components on the system mainboard through soldering or the like, and the circuit elements integrated on the PCB can output electricity or input electricity through a plurality of first conductive pins to realize electrical interaction with other components in the electronic device. Exemplarily, the packaging module is described by taking a SIP power supply as an example, and the circuit elements integrated on the PCB in the SIP power supply receive control signals through a plurality of first conductive pins, or the circuit elements integrated on the PCB output current through a plurality of first conductive pins, thereby realizing that the SIP power supply supplies power to other elements in the electronic device.

[0098] In the present application embodiment, Figure 5 As shown in FIG. 1 , the side of the plastic encapsulation layer away from the PCB is the side of the plastic encapsulation layer that does not contact the PCB, and the side of the plastic encapsulation layer close to the PCB is the side in contact with the plastic encapsulation layer. Figure 5 As shown in the figure, the side of the plastic packaging layer refers to the side that is located in the same plane as the exposed part of the PCB.

[0099] In the embodiment of the present application, during the welding process of the packaging module and the system mainboard, if the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB, the packaging module can be attached to the system mainboard by soldering or other methods through the multiple first conductive pins exposed on the side of the plastic sealing layer away from the PCB, which can reduce the assembly difficulty of the packaging module, and the packaging module can achieve heat dissipation by attaching to the board and improve the heat dissipation efficiency. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer, the packaging module can be assembled on the system mainboard by soldering or other methods through the multiple first conductive pins exposed on the side of the plastic sealing layer away from the PCB, which provides a new assembly method. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB and the side of the plastic sealing layer, the first conductive pins exposed on the side of the plastic sealing layer away from the PCB and the side of the plastic sealing layer are assembled with the PCB by soldering or other methods, and the side of the plastic sealing layer away from the PCB and the multiple first conductive pins exposed on the side of the plastic sealing layer can achieve tin creeping. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the PCB more stable.

[0100] In the embodiment of the present application, the plurality of first conductive pins may be arranged at equal intervals or unequal intervals along the edge line of the packaging module, and the specific arrangement is not limited here.

[0101] In the embodiment of the present application, the type of packaging module, the type of materials used for the first plastic packaging layer and the second plastic packaging layer, and the above Figure 4 The embodiments shown are similar and are not specifically limited here.

[0102] In the embodiment of the present application, the material type and shape of the plurality of first conductive pins are similar to those described above. Figure 4 The material type and shape of the first conductive pins described in the illustrated embodiments are similar and will not be described in detail here.

[0103] Figure 6 It is a structural schematic diagram of a packaging module provided in an embodiment of the present application, in which the plastic packaging layer includes a first conductive pin and a second conductive pin.

[0104] like Figure 6 As shown, in a possible implementation, optionally, the conductive pin further includes a second conductive pin.

[0105] The first end of the second conductive pin is electrically connected to the second surface of the PCB, the second conductive pin is arranged in the second plastic packaging layer along the second surface of the PCB and the stacking direction of the second plastic packaging layer, and the second end portion of the second conductive pin is exposed on the outer surface of the second plastic packaging layer.

[0106] In the embodiment of the present application, when the packaging module electrically interacts with other components, the PCB outputs or inputs electricity through the first conductive pin and the second conductive pin.

[0107] In an embodiment of the present application, a plurality of circuit elements are integrated on the first surface of the PCB. The circuit composed of the plurality of circuit elements can output or input electricity through the first conductive pin and the second conductive pin, and then electrically interact with other elements. The first end and the second end of the first conductive pin pass through the first plastic encapsulation layer, the first conductive pin is arranged in the first plastic encapsulation layer along the stacking direction of the first surface of the PCB and the first plastic encapsulation layer, the first end of the first conductive pin is electrically connected to the circuit element integrated on the first surface of the PCB, and the second end of the first conductive pin is exposed to the outer surface of the first plastic encapsulation layer. The first end and the second end of the second conductive pin pass through the second plastic encapsulation layer, the second conductive pin is arranged in the second plastic encapsulation layer along the stacking direction of the second surface of the PCB and the second plastic encapsulation layer, the first end of the second conductive pin is electrically connected to the circuit element integrated on the second surface of the PCB, and the second end of the second conductive pin is exposed to the outer surface of the second plastic encapsulation layer. In this way, the first conductive pin and the part of the second conductive pin exposed on the outer surface of the first plastic layer and the second plastic layer can be electrically connected to the system mainboard or other components on the system mainboard by soldering or the like, and the circuit elements integrated on the PCB can output electricity or input electricity through the first conductive pin and the second conductive pin to realize electrical interaction with other components in the electronic device. Exemplarily, the packaging module is explained by taking the SIP power supply as an example, and the circuit elements integrated on the PCB in the SIP power supply receive control signals through the first conductive pin and the second conductive pin, or the circuit elements integrated on the PCB output current through the first conductive pin and the second conductive pin, thereby realizing the SIP power supply to other components in the electronic device. In the embodiment of the present application, one or more first conductive pins may be included on the first side of the PCB, and one or more second conductive pins may be included on the second side of the PCB, which is not specifically limited here.

[0108] In an embodiment of the present application, multiple second conductive pins can be arranged on the edge line of the second surface of the PCB in an equal-pitch or non-equal-pitch arrangement manner, or can be arranged at other positions on the second surface of the PCB in other equal-pitch or non-equal-pitch arrangements, which are not specifically limited here.

[0109] In the present application embodiment, Figure 6 As shown in FIG. 1 , the side of the plastic encapsulation layer away from the PCB is the side of the plastic encapsulation layer that does not contact the PCB, and the side of the plastic encapsulation layer close to the PCB is the side in contact with the plastic encapsulation layer. Figure 6 As shown in the figure, the side of the plastic packaging layer refers to the side that is located in the same plane as the exposed part of the PCB.

[0110] In the embodiment of the present application, during the welding process of the packaging module and the system mainboard, if the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB, the packaging module can be attached to the system mainboard by soldering or other methods through the first conductive pin exposed on the side of the plastic sealing layer away from the PCB, which can reduce the assembly difficulty of the packaging module, and the packaging module can achieve heat dissipation by attaching to the board and improve the heat dissipation efficiency. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer, the packaging module can be assembled on the system mainboard by soldering or other methods through the first conductive pin exposed on the side of the plastic sealing layer away from the PCB, providing a new assembly method. If the outer surface of the plastic sealing layer is the side of the plastic sealing layer away from the PCB and the side of the plastic sealing layer, the side of the plastic sealing layer away from the PCB and the first conductive pin exposed on the side of the plastic sealing layer are assembled with the PCB by soldering or other methods, and the side of the plastic sealing layer away from the PCB and the first conductive pin exposed on the side of the plastic sealing layer can achieve tin creeping. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the PCB more stable.

[0111] In the embodiment of the present application, other circuit elements in the electronic device including the packaging module can be surface-mounted on the packaging module through the second conductive pins, thereby further making better use of the space inside the electronic device.

[0112] In the embodiment of the present application, other circuit elements can be surface mounted on the packaging module through the second conductive pin. If the outer surface of the plastic layer is the side of the plastic layer away from the PCB, the circuit element can be surface mounted with the second conductive pin exposed on the side of the plastic layer away from the PCB by soldering or other methods. This outer surface setting method can reduce the difficulty of surface mounting between the circuit element and the packaging module. If the outer surface of the plastic layer is the side of the plastic layer away from the PCB and the side of the plastic layer, the side of the plastic layer away from the PCB and the second conductive pin exposed on the side of the plastic layer are assembled with the circuit element by soldering or other methods. The side of the plastic layer away from the PCB and the second conductive pin exposed on the side of the plastic layer can achieve tin creep. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the circuit element more stable.

[0113] In the embodiment of the present application, the type of packaging module, the type of materials used for the first plastic packaging layer and the second plastic packaging layer, and the above Figure 4 The embodiments shown are similar and are not specifically limited here.

[0114] In the embodiment of the present application, the material type and shape of the first conductive pin and the second conductive pin are the same as those described above. Figure 4The material type and shape of the first conductive pins described in the illustrated embodiments are similar and will not be described in detail here.

[0115] Optionally, the outer surface of the plastic encapsulation layer described in the above embodiment may be the side of the plastic encapsulation layer away from the PCB. Optionally, the outer surface of the plastic encapsulation layer may be the side of the plastic encapsulation layer. Optionally, the outer surface of the plastic encapsulation layer may be the side of the plastic encapsulation layer away from the PCB and the side of the plastic encapsulation layer. The specific details are not limited here.

[0116] The above embodiments provide different structures of a packaging module. The following embodiments will provide a method for preparing a packaging module, which will be described in detail in the following embodiments.

[0117] Figure 7a , 7b It is a schematic diagram of an embodiment of preparing circuit elements and conductive pins in a packaging module provided in an embodiment of the present application.

[0118] Circuit elements and conductive pins are prepared on the first side and / or the second side of the PCB.

[0119] like Figure 7a As shown, in the embodiment of the present application, the conductive pin is described by taking a U-shaped conductive pin as an example. Among them, the U-shaped conductive pin is made of metal material. The metal material can be a conductive material such as copper, aluminum or its alloy, which is not limited here. And there is a layer of solderable coating on the U-shaped conductive pin, and the material of the coating can be tin Sn, silver Ag or gold Au, etc., which is not limited here. The size of the U-shaped conductive pin can be adjusted according to the requirements of current flow, heat dissipation, etc., which is not limited here.

[0120] First, a conductive pattern is engraved on the first surface and / or the second surface of the PCB. The conductive pattern corresponds one-to-one to the shape of the circuit elements and the U-shaped conductive pins that need to be surface mounted or embedded later. Then, welding material is applied to the engraved conductive pattern. The welding material can be tin, or other materials, which are not limited here. Finally, the circuit elements and the U-shaped conductive pins are soldered to the PCB. The height of the U-shaped conductive pins on the PCB can be higher than other circuit elements. Among them, auxiliary lines are provided on the PCB. The auxiliary lines are used to indicate the actual edge lines of the PCB after the PCB is cut and processed. The auxiliary lines coincide with the edge lines. Figure 7a As shown, the first end of the conductive pin is located within the auxiliary line, and the first end of the U-shaped conductive pin is electrically connected to the circuit element in the PCB. Figure 7b As shown, Figure 7bThat is, it is a schematic diagram of the circuit element and the conductive pin after being surface mounted or embedded in the PCB. Optionally, the first end of the U-shaped conductive pin can be connected to the copper foil on the surface of the PCB, or the first end of the U-shaped conductive pin can be connected to the copper foil inside the PCB, or the first end of the U-shaped conductive pin can be electrically connected to the circuit element in the PCB by other methods, which are not limited here. The second end of the U-shaped conductive pin is located outside the auxiliary line, and the electrical signal inside the packaging module is led out through the second end.

[0121] In the embodiment of the present application, the circuit elements and the conductive pins are surface mounted on the PCB in the same process. Compared with the existing packaging module manufacturing process, it is not necessary to surface mount the pins on the side of the plastic package body after the circuit elements are plastic-sealed, which reduces the assembly process and reduces the production cost of the packaging module.

[0122] The PCB with integrated circuit components and conductive pins is plastic-encapsulated as a whole.

[0123] Figure 8 It is a schematic diagram of an embodiment of preparing a plastic sealing layer in a packaging module provided in an embodiment of the present application.

[0124] like Figure 8 As shown, in the embodiment of the present application, the PCB integrated with circuit elements and conductive pins is integrally encapsulated by injection molding, and the first side and the second side of the PCB, all circuit elements and conductive pins are placed in the plastic encapsulation layer to form an intermediate PCB, and the upper and lower plastic encapsulation layers are wrapped. Optionally, the material used for the plastic encapsulation layer can be bisphenol A-type epoxy resin, the material used for the plastic encapsulation layer can also be phenolic epoxy resin, the material used for the plastic encapsulation layer can also be other types of epoxy resins and other types of organic substances that can play a protective role and have insulating properties, which are not specifically limited here.

[0125] The encapsulated module is ground and thinned.

[0126] Fig. 9 It is a schematic diagram of an embodiment of a polishing packaging module provided in an embodiment of the present application.

[0127] like Fig. 9 As shown, in the embodiment of the present application, the package module formed after injection molding is polished by a grinding tool such as a grinding disc or a grinding wheel. The excess plastic sealing material on the U-shaped conductive pin in the first plastic sealing layer after injection molding is ground off until the cross beam portion of the U-shaped conductive pin is exposed.

[0128] Optionally, the second side of the PCB may also be integrated with U-shaped conductive pins, and the lower surface of the packaging module may also be ground to grind off excess plastic material on the lower surface of the U-shaped conductive pins in the second plastic layer after injection molding until the crossbeam portion of the U-shaped conductive pins is exposed.

[0129] Cut the ground packaging module.

[0130] Fig.10a , 10b It is a schematic diagram of an embodiment of cutting the plastic packaging layer to obtain a packaging module provided in an embodiment of the present application.

[0131] like Fig.10a As shown, in the embodiment of the present application, the ground packaging module module can be cut according to the edge line by using a cutting method such as wire cutting and CNC machine cutting. When cutting, the cutting is performed from the position of the edge line between the beams of the U-shaped conductive pins. After cutting, a packaging module of a pre-designed size will be obtained, and the obtained L-shaped conductive pins are exposed on the surface and side of the packaging module, such as Fig.10b As shown, the finished product after cutting is Fig.10b The packaged modules shown.

[0132] In an embodiment of the present application, a surface-mountable U-shaped conductive pin is provided, wherein the first end of the U-shaped conductive pin and the second end of the U-shaped conductive pin are respectively located on both sides of the cutting line. When surface-mounting, the U-shaped conductive pin is surface-mounted on the PCB by means of surface-mounting at both ends. This type of U-shaped conductive pin is more stable when surface-mounted, which reduces the difficulty of assembling the conductive pin. After grinding, the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic layer away from the PCB, and after cutting, the cross section formed by cutting the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic layer. Both the conductive pins exposed on the side of the plastic layer away from the PCB and the side of the plastic layer can achieve tin creeping. Such a setting method can further increase the volume of the solder joint, improve the stability of the solder joint, extend the service life of the solder joint, and make the assembly between the packaging module and the PCB more stable.

[0133] The embodiment of the present application provides a method for manufacturing a packaging module, wherein circuit elements and conductive pins are installed on at least one of the first and second surfaces of a printed circuit board PCB, and the conductive pins are electrically connected to the PCB; the PCB, circuit elements and conductive pins are plastic-sealed, and the conductive pins are arranged in the plastic layer along the stacking direction of the PCB and the plastic layer; the side of the plastic layer away from the PCB is ground, and the conductive pins in the ground plastic layer are partially exposed on the side of the plastic layer away from the PCB; the ground plastic layer is cut to obtain a packaging module, and part of the conductive pins of the packaging module are exposed on the side of the plastic layer. When the packaging module interacts electrically with other components, the PCB outputs or inputs electricity through the conductive pins. Therefore, there is no need to reserve through holes on the packaging side of the packaging module, and the packaging module can be arranged at a position close to the chip, and the routing between the packaging module and the chip is short. In addition, the size of the electronic device is reduced, and the power distribution loss of the electronic device is reduced.

[0134] The reset circuit provided in the embodiment of the present application is described in detail above. The principle and implementation method of the present application are described in detail using specific examples herein. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. A packaging module, characterized in that: include: Plastic encapsulation layer, conductive pins, printed circuit boards and circuit components; The first surface and the second surface of the printed circuit board, which are arranged opposite to each other, are respectively covered with the plastic sealing layer; The circuit element is arranged on at least one of the first surface and the second surface of the printed circuit board; The conductive pin includes a first sub-pin and a second sub-pin, the first sub-pin is electrically connected to the printed circuit board, the first sub-pin extends along a first direction and is disposed in the plastic packaging layer, the second sub-pin extends along a second direction and is disposed in the plastic packaging layer, the first direction is the stacking direction of the printed circuit board and the plastic packaging layer, the second direction intersects with the first direction, and the second sub-pin is partially exposed on the outer surface of the plastic packaging layer; The conductive pin is formed by cutting a U-shaped conductive pin along a cutting line. The first end and the second end of the U-shaped conductive pin are surface-mounted or embedded in the printed circuit board. The crossbeam of the U-shaped conductive pin is away from the printed circuit board. The crossbeam of the U-shaped conductive pin is exposed on a side of the plastic packaging layer away from the printed circuit board. The first end of the U-shaped conductive pin and the second end of the U-shaped conductive pin are respectively located on both sides of the cutting line. After cutting, the cross section formed by cutting the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic packaging layer.

2. The packaging module according to claim 1, characterized in that: The plastic encapsulation layer includes a first plastic encapsulation layer and a second plastic encapsulation layer, and the conductive pin includes a first conductive pin; The first surface of the printed circuit board is covered with a first plastic sealing layer, and the second surface of the printed circuit board is covered with a second plastic sealing layer; The first end of the first conductive pin is electrically connected to the first surface of the printed circuit board, the first conductive pin is inserted into the first plastic packaging layer along the stacking direction of the first surface of the printed circuit board and the first plastic packaging layer, and the second end portion of the first conductive pin is exposed on the outer surface of the first plastic packaging layer.

3. The packaging module according to claim 2, characterized in that: The conductive pin further includes a second conductive pin; The first end of the second conductive pin is electrically connected to the second surface of the printed circuit board, the second conductive pin is arranged in the second plastic packaging layer along the stacking direction of the second surface of the printed circuit board and the second plastic packaging layer, and the second end portion of the second conductive pin is exposed on the outer surface of the second plastic packaging layer.

4. The packaging module according to any one of claims 1 to 3, characterized in that: The outer surface of the plastic encapsulation layer is the side of the plastic encapsulation layer away from the printed circuit board, or the outer surface of the plastic encapsulation layer is the side of the plastic encapsulation layer, or the outer surface of the plastic encapsulation layer is the side of the plastic encapsulation layer away from the printed circuit board and the side of the plastic encapsulation layer.

5. The packaging module according to any one of claims 1 to 3, characterized in that: The packaging module is a system-in-package (SIP) power supply.

6. The packaging module according to any one of claims 1 to 3, characterized in that: The conductive pin is L-shaped.

7. An electronic device, characterized in that: include: A packaging module, a system mainboard and a functional module, wherein the packaging module supplies power to the functional module, the packaging module and the functional module are surface-mounted or embedded in the system mainboard, and the packaging module is a packaging module as described in any one of claims 1 to 6.

8. A method for manufacturing a packaging module, characterized in that: include: Installing circuit elements and conductive pins on at least one of the first surface and the second surface of the printed circuit board, wherein the conductive pins are electrically connected to the printed circuit board; The printed circuit board, the circuit element and the conductive pin are plastic-encapsulated to form a plastic-encapsulation layer, wherein the conductive pin includes a first sub-pin and a second sub-pin, the first sub-pin is electrically connected to the printed circuit board, the first sub-pin extends along a first direction and penetrates the plastic-encapsulation layer, the second sub-pin extends along a second direction and penetrates the plastic-encapsulation layer, the first direction is the stacking direction of the printed circuit board and the plastic-encapsulation layer, and the second direction intersects with the first direction; Grinding the side of the plastic encapsulation layer away from the printed circuit board, so that the second sub-pin portion of the ground plastic encapsulation layer is exposed on the side of the plastic encapsulation layer away from the printed circuit board; Cutting the ground plastic encapsulation layer to obtain the packaging module, wherein a portion of the conductive pins of the packaging module is exposed at a side surface of the plastic encapsulation layer; The conductive pin is a U-shaped conductive pin, the first end and the second end of the U-shaped conductive pin are surface-mounted or embedded in the printed circuit board, and the crossbeam of the U-shaped conductive pin is away from the printed circuit board; Grinding the side of the plastic-sealed layer away from the printed circuit board after plastic sealing, comprising: Grinding the side of the plastic-sealed layer away from the printed circuit board to the grinding line after plastic sealing, wherein the grinding line is tangent to the crossbeam of the U-shaped conductive pin, and after grinding, the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic-sealed layer away from the printed circuit board; Cut and ground components, including: The polished component is cut along the cutting line, the first end of the U-shaped conductive pin and the second end of the U-shaped conductive pin are respectively located on both sides of the cutting line, and the cross section formed by cutting the crossbeam of the U-shaped conductive pin is exposed on the side of the plastic packaging layer.

9. The method for manufacturing a packaging module according to claim 8, characterized in that: The method of installing circuit elements and conductive pins on at least one of the first surface and the second surface of the printed circuit board comprises: Mounting circuit components on at least one of the first and second surfaces of the printed circuit board, and mounting conductive pins on at least one of the first and second surfaces of the printed circuit board belong to the same operation process.

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