Detachable device

Abstract

The present invention provides a device for attaching and detaching, which utilizes an electrostatic suction cup method and has excellent responsiveness in attaching and detaching a workpiece even if the workpiece is thin. The device for attaching and detaching can adsorb and detach a workpiece, wherein the device comprises: a machinable ceramic layer; a close contact activation layer disposed on the machinable ceramic layer; an electrode layer disposed on the close contact activation layer; and a dielectric layer disposed on the electrode layer, wherein the electrode layer is coated by the close contact activation layer and the dielectric layer, and the volume resistivity of the dielectric layer is 10 9 Ω·cm~10 12 Ω·cm.

Description

Technical Field

[0001] The present invention relates to an attachment and detachment device capable of adsorbing and detaching a workpiece (sometimes collectively referred to as attachment and detachment), and more specifically, to an attachment and detachment device having excellent responsiveness during attachment and detachment of the workpiece, which is particularly preferred for processing thin workpieces. Background Art

[0002] As a device for attaching and detaching a workpiece, there are known vacuum chucks utilizing vacuum suction, electrostatic chucks utilizing electrostatic adsorption force, and the like, which are used in a differentiated manner depending on the use environment and the type of workpiece.

[0003] That is, the vacuum suction cup method not only has excellent adsorption and holding force, but also has excellent responsiveness in workpiece attachment and detachment, so workpiece attachment and detachment devices using the vacuum suction cup method are generally widely used. However, in the case where the workpiece is processed in a vacuum environment, it is originally impossible to hold the workpiece by vacuum suction. In addition, if there are holes or gaps in the workpiece itself, such as a lead frame or a mask, vacuum suction is also not possible. In addition, in the case of a thin workpiece such as a film or foil, there is a risk that the workpiece will bend at the suction site, and suction marks will remain on the workpiece, so the vacuum suction cup method is not suitable.

[0004] On the other hand, in a vacuum environment where the vacuum chuck method cannot be applied or in a case where the workpiece has an opening, the electrostatic chuck method is suitable. For example, there is known a device for attaching and detaching a semiconductor chip or an insulating film by using an electrostatic adsorption force, which includes an insulating material in which a pair of electrodes are embedded on a base member (see Patent Document 1).

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2006-156550 Summary of the invention

[0008] Problems to be solved by the invention

[0009] When manufacturing electronic devices that are becoming thinner and more high-performance, such as smartphones and wearable terminals, not only the mounting parts such as lead frames and their materials, but also the components related to manufacturing, such as metal masks, are becoming thinner and shorter. Therefore, from this point of view, the demand for workpiece transportation using electrostatic chucks is increasing.

[0010] However, in an attachment and detachment device using an electrostatic suction cup method, residual charge when detaching after adsorbing the workpiece becomes a problem. In particular, in thin workpieces such as lead frames or metal foils, it is sometimes difficult to detach (disassemble) the workpiece even due to a small amount of residual charge. This problem of residual charge also exists when a plasma etching device is used to adsorb and detach silicon wafers. For example, after the DC voltage is turned off (OFF), an electrostatic elimination process such as applying an opposite voltage to the adsorption electrode or causing plasma discharge is performed. However, in the attachment and detachment device used for the workpiece conveying device as described above, it is difficult to perform plasma discharge. In addition, considering the processing speed of the workpiece conveying, etc., it is sometimes not realistic to apply the electrostatic elimination process every time the workpiece is conveyed.

[0011] Therefore, the inventors of the present invention have made great efforts to study the problem of residual charge, which has been a previous issue. As a result, they have found that by using an attachment and detachment device including a machinable ceramics layer, a close-contact activation layer, an electrode layer, and a dielectric layer with a specified volume resistivity, the residual charge after the voltage applied to the electrode layer is turned off can be further reduced, and even thin workpieces can be smoothly detached (disassembled), thereby completing the present invention.

[0012] Therefore, an object of the present invention is to provide an attachment and detachment device using an electrostatic chuck method, which is suitable for thin workpieces or workpieces with holes that cannot be vacuumed, and has excellent responsiveness in workpiece attachment and detachment.

[0013] Technical means of solving problems

[0014] That is, the present invention is an attachment and detachment device capable of adsorbing and detaching a workpiece, wherein the attachment and detachment device comprises: a machinable ceramic layer; a close contact activation layer disposed on the machinable ceramic layer; an electrode layer disposed on the close contact activation layer; and a dielectric layer disposed on the electrode layer, wherein the electrode layer is coated by the close contact activation layer and the dielectric layer, and the volume resistivity of the dielectric layer is 10 9 Ω·cm~10 12 Ω·cm.

[0015] In the present invention, as a sticking and removing device capable of adsorbing and removing the workpiece, a material having a volume resistivity of 10 9 Ω·cm~10 12An attachment and removal device for a dielectric layer having a volume resistivity of Ω·cm. By having the dielectric layer have such a volume resistivity (volume intrinsic resistivity), an attachment and removal device utilizing the so-called Johnson-Rahbek force can be made. That is, by applying a low voltage to the electrode layer in an attachment and removal device having a dielectric layer having a relatively low volume resistivity, electric charges can be accumulated on the surface of the dielectric layer forming the workpiece adsorption surface and the workpiece to adsorb the workpiece. In addition, when the voltage applied to the electrode layer is turned off, the dielectric layer acts as a resistor for dissipating the voltage applied to the electrode layer, thereby achieving rapid charge neutralization. Therefore, compared with the case of utilizing the Coulomb force generated between the workpiece and the electrode layer, the electric charges are easy to disappear, so the responsiveness of the adsorption and detachment of the workpiece can be improved.

[0016] The dielectric layer is preferably formed by a ceramic spray film. That is, there is no particular limitation on the ceramic spray film forming the dielectric layer as long as the volume resistivity is within the above range. However, in order to improve the wear resistance, the dielectric layer forming the adsorption surface of the workpiece and the workpiece may be trapped by foreign matter. Specifically, it may be an aluminum oxide ceramic spray film. More specifically, it may be an aluminum oxide ceramic spray film containing titanium oxide on the basis of making the volume resistivity within the specified range. In addition, the Vickers hardness of the dielectric layer formed by the ceramic spray film may be 750 to 1000.

[0017] In addition, as for the electrode layer of the putting-on and taking-off device of the present invention, as long as it is an electrode layer formed as a so-called internal electrode, there is no particular restriction on its material and formation means. For example, in addition to being able to form the electrode layer by using a spray film or a metal spray film of conductive ceramics, screen printing using a conductive paste can also be cited. Among them, if close adhesion is considered, it is preferred that it can be an electrode layer formed by using a spray film or a metal spray film of conductive ceramics. At this time, considering the stress caused by heat when the electrode layer is made, it can be a material close to the linear expansion coefficient of the dielectric layer, the machinable ceramic layer, and the close contact activation layer added as needed, so it is preferred that tungsten, molybdenum, titanium or their alloys can be used.

[0018] The electrode layer may include a monopolar electrode or a bipolar electrode to which voltages of different polarities are applied. In the case of a monopolar electrode, as long as voltages of different polarities are applied to each electrode, the workpiece can be attached and detached. Among them, it is preferred that the electrode layer may be a bipolar electrode to which voltages of different polarities are applied. There is no particular restriction on the shape of these electrodes. For example, in the case of a bipolar electrode, in a pair of electrodes in a comb-tooth shape, the comb teeth of the positive application electrode to which a positive voltage is applied and the comb teeth of the negative application electrode to which a negative voltage is applied can be arranged in an alternating manner to form a bipolar electrode. A pair of rectangular or semicircular electrodes can also be arranged at a predetermined interval, and one of them is used as a positive application electrode and the other as a negative application electrode to form a bipolar electrode. In the case of a monopolar electrode, as long as the shape range of the workpiece can be covered as much as possible by more than two electrodes, there is no particular restriction.

[0019] In addition, in the attachment and detachment device of the present invention, the electrode layer can be provided with a plurality of divided areas divided into an array shape. That is, the electrode layer as the internal electrode can include a monopolar electrode corresponding to each divided area, or can include a bipolar electrode corresponding to each divided area, and a power supply terminal for supplying power from the outside can be independently provided with respect to the monopolar electrode or bipolar electrode of each divided area. Thus, on the workpiece adsorption surface for adsorbing the workpiece, the electrode (monopolar electrode or bipolar electrode) to be operated can be selected according to the size and shape of the workpiece, and the workpiece can be adsorbed efficiently without waste, and no excess charge will be generated, so the workpiece can be detached more smoothly.

[0020] In addition, in the present invention, a grounding may be provided to allow the electric charge in the electrode layer to escape, so that the grounding is performed to discharge the electrode layer when the workpiece is detached. Furthermore, after the power supply is turned off to stop the voltage applied to the electrode layer, a voltage with a polarity opposite to the applied voltage may be applied to perform reverse voltage application, and the polarity of the power supply output may be switched in such a way that the polarity of the voltage applied to the electrode layer is changed each time the workpiece is adsorbed for more stable operation.

[0021] In addition, the putting-on and taking-off device of the present invention includes a machinable ceramic layer as a base member. Generally speaking, machinable ceramics are easier to process and cheaper than conventional engineering ceramics including sintered ceramics.

[0022] The material of the machinable ceramic forming such a machinable ceramic layer is not particularly limited, and examples thereof include machinable ceramics comprising a composite material of boron nitride or boron nitride and silicon nitride, machinable ceramics comprising a composite material of aluminum nitride and boron nitride, composite mica ceramics with glass as a matrix, etc. In addition, among commercially available products, as an example thereof, Macor (registered trademark) manufactured by NTK Ceratec, Macerite series manufactured by Kurosaki Harima, Photoveel series manufactured by Ferrotec Ceramics, etc.

[0023] In addition, the putting-on and taking-off device of the present invention includes a close contact activation layer on the machinable ceramic layer. That is, an electrode layer is included on the machinable ceramic layer via the close contact activation layer. Such a close contact activation layer functions as a close contact activation layer when the electrode layer or the dielectric layer is laminated on the machinable ceramic layer, and has the function of further reducing residual charge.

[0024] Among them, regarding the former function, by providing a close-contact activation layer on the machinable ceramic layer, during the film formation process of the electrode layer or the dielectric layer, the peeling of these films caused by heat can be prevented, and the peeling caused by the residual stress of the film can be prevented. In addition, due to the presence of the close-contact activation layer, an anchor (anchor) that exhibits a better close contact force than when the machinable ceramic layer is sandblasted (blast) is also formed. On the other hand, regarding the latter function, by coating the electrode layer with a dielectric layer and a close-contact activation layer, when a low voltage of about direct current (DC) ±500V or less is applied relative to the electrode layer, the residual charge when the workpiece is detached can be further reduced. At this time, the volume resistivity of the close-contact activation layer can of course be set to 10 9 Ω·cm~10 12 Ω·cm, but can also be 10 14 Ω·cm~10 16 However, when a high voltage of DC ±750 V or more is applied to the electrode layer, it is desirable to make the dielectric layer 10 9 Ω·cm~10 12 Low volume resistivity such as Ω·cm.

[0025] Here, there is no particular limitation on the material and means for forming the adhesion activation layer. However, from the viewpoint of the latter function of the adhesion activation layer, the adhesion activation layer can be formed using an aluminum oxide-based ceramic spray film containing titanium oxide, similarly to the case of the ceramic spray film forming the dielectric layer. On the other hand, from the viewpoint of the former function, the adhesion activation layer can be formed using an aluminum oxide-based ceramic spray film containing titanium oxide. 9 Ω·cm~10 12 A low volume resistivity of about 10 Ω·cm or a relatively high volume resistivity of about 10 Ω·cm can be used without titanium oxide. 14 Ω·cm~10 16 Ω·cm. Moreover, as mentioned above, the machinable ceramics with high machinability are formed by combining various particles of the glassy matrix, so it is also easy to roughen the surface by sandblasting. Therefore, it is also suitable in terms of seeking close contact with the close contact activation layer. In particular, when the close contact activation layer includes a sprayed film, it is also believed that the glass contained in the machinable ceramics can improve the close contact with these sprayed films. That is, since the glass easily forms a silicide-based compound, for example, Al of alumina and SiO2 contained in the machinable ceramics can obtain a strong close contact.

[0026] In addition, about at least one of the dielectric layer, electrode layer and close contact activation layer in the stripping device of the present invention, when they are formed by spray coating, it is desirable to use resin for sealing. Generally speaking, the spray coating has a lamellar structure in which the melted particles collide with the spraying object and become flat and stacked. Therefore, there are gaps at the interface of the flattened particles, and the gaps will form open pores in the spray coating. If moisture is enclosed inside the pores, it is possible to become a factor that causes the insulation properties of the spray coating to decrease or the resistance to change. In addition, there is also the possibility of a change in volume resistivity due to humidity. Therefore, in order to avoid these situations, resin can be used for sealing. The type of resin is not particularly limited, for example, epoxy resin, silicone, water glass, acrylic resin, etc. can be used. Among them, from the perspective of avoiding moisture from the outside to invade the inside of the product through the open pores, at least the dielectric layer can include a sealing formed by sealing with a resin, and preferably both the dielectric layer and the electrode layer can include a sealing. In addition, from the viewpoint of reducing the risk of fluctuation in volume resistivity due to moisture absorption, the adhesion activation layer may also include sealing.

[0027] The workpiece to be removed by the removal device of the present invention preferably has a thickness of 0.001 mm to 1.5 mm. There is no particular limitation on the type of workpiece, which may be in the form of a sheet, foil, paper or film, for example: a conductor such as a metal frame or a precious metal foil, a non-ferrous metal foil; a semiconductor such as a silicon wafer or a gallium nitride substrate, a germanium substrate; a paper body; or an insulator. Among them, the removal device of the present invention can further reduce the residual charge compared with the past, so the thickness of the workpiece is preferably 0.001 mm to 0.3 mm, more preferably 0.001 mm to 0.15 mm. In addition, it can be said that the workpiece preferably includes a conductor or a semiconductor.

[0028] Effects of the Invention

[0029] According to the attaching and removing device of the present invention, the residual charge after the power supply is turned off and the voltage application to the electrode layer is stopped can be further reduced. Therefore, the responsiveness of the workpiece attaching and removing is excellent, so the attaching and removing device of the present invention is particularly preferred in the workpiece conveying accompanied by the attaching and removing of thin workpieces. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic cross-sectional explanatory view showing an example of a putting on and taking off device in the workpiece conveying device of the present invention.

[0031] Figure 2 It is a schematic explanatory diagram showing the manufacturing process of the putting on and taking off device of the present invention.

[0032] [Explanation of Symbols]

[0033] 1: Machinable ceramic layer

[0034] 2: Through hole

[0035] 3: Power supply terminal

[0036] 4: Close contact activation layer

[0037] 5: Electrode layer

[0038] 6: Dielectric layer

[0039] 7: DC power supply

[0040] 8: Workpiece adsorption surface

[0041] 10: Attaching and taking off device. DETAILED DESCRIPTION

[0042] Hereinafter, the present invention will be described using the drawings.

[0043] exist Figure 1An example of the stripping device of the present invention is shown in FIG. The stripping device 10 of the example includes: a machinable ceramic layer 1, which includes a machinable ceramic; a close contact activation layer 4, which is formed on the machinable ceramic layer 1 by a second ceramic spray film; an electrode layer 5 (5a, 5b), which is formed by a metal spray film; and a dielectric layer 6, which is formed by a first ceramic spray film so as to cover the electrode layer 5, and the volume resistivity of the dielectric layer 6 is 10 9 Ω·cm~10 12 Ω·cm. In addition, the electrode layer 5 is connected to an external DC power source 7 (7a, 7b) via the power supply terminal 3. Figure 1 In the example, electrode 5a is a positive application electrode, and electrode 5b is a negative application electrode, which constitutes a bipolar electrode. Furthermore, an example of a stripping device having a set of bipolar electrodes is shown here, but the electrode layer 5 may also have a plurality of divided areas divided into an array, and include bipolar electrodes (or monopolar electrodes) corresponding to each divided area, so that the electrode to be operated can be selected in accordance with the shape of the workpiece W. Figure 1 In the figure, symbol 8 represents the workpiece adsorption surface.

[0044] The workpiece W to be adsorbed and detached by the attaching and detaching device 10 is a conductor, semiconductor or insulator with a thickness of 0.001 mm to 1.5 mm. For example, the lead frame used in the manufacture of semiconductor packages such as large scale integrated circuits (LSI) contains a conductor such as a Cu alloy and has a thickness of about 0.01 mm to 1.5 mm. When such a lead frame is transported (supplied) to a chip bonding device, etc., it is generally carried out at room temperature. Therefore, if the attaching and detaching device 10 of the present invention is used for the transport of such a lead frame, the volume resistivity of the dielectric layer 6 is set to the above value.

[0045] In addition, the volume resistivity of the adhesion activation layer 4 in this case can be set to 10 9 Ω·cm~10 12 Ω·cm, the volume resistivity can also be relatively high to 10 14 Ω·cm~10 16 Ω·cm, but from the viewpoint of further reducing the residual charge when the power is turned off, the volume resistivity is preferably 10 9 Ω·cm~10 12Ω·cm. When the lead frame as described above is adsorbed, a voltage of about DC ±200V to 500V may be applied to the electrodes 5a and 5b, respectively. However, in order to further increase the adsorption force, or in the case of a thick workpiece or a slightly warped workpiece, a higher voltage (about DC ±750V to 1500V) is required. Therefore, the volume resistivity of the close contact activation layer 4 may be set to 10 9 Ω·cm~10 12 Ω·cm.

[0046] As a method of obtaining such a putting on and taking off device 10, for example, Figure 2 First, Figure 2 As shown in (a), a plate-shaped machinable ceramic is prepared, and if necessary, it is cut into a specified size or subjected to mechanical processing such as grinding to prepare a machinable ceramic layer 1. At this time, it is sufficient to process it in accordance with the size and shape of the adsorbed lead frame. There is no particular restriction on the thickness, but if processing is taken into consideration, it can be about 3 mm to 30 mm. In addition, a through hole 2 for the power supply terminal 3 for embedding the power supply to the electrodes 5a and 5b can also be made in advance. At this time, the machinable ceramic itself is an insulator (generally, the volume resistivity is 10 14 Ω·cm~10 15 Ω·cm), so there is no need to install a sleeve for the purpose of insulation.

[0047] Then, if Figure 2 As shown in (b), a power supply terminal 3 is installed relative to the through hole 2 formed in the machinable ceramic layer 1. At this time, while considering the thickness of the close contact activation layer 4, the top end of the power supply terminal 3 is made to protrude toward the electrode layer 5 to obtain connection with the electrode layer 5. In addition, at this time, the surface of the machinable ceramic layer 1 can also be sandblasted.

[0048] Then, if Figure 2 As shown in (c), the second ceramic sprayed film is sprayed to form the adhesion activation layer 4. When the device for attaching and detaching the lead frame is used, the thickness of the adhesion activation layer 4 is about 0.03 mm to 1.0 mm.

[0049] Then, if Figure 2 As shown in (d), a metal spray film is sprayed to form an electrode layer 5. At this time, a heat-resistant masking tape or a heat-resistant resist may be used to perform a masking process corresponding to the electrode shape, or a portion of the electrode may be removed by sandblasting or other techniques after the electrode layer is sprayed without performing a masking process to form an electrode layer 5 of a predetermined shape (in Figure 2In the example, the electrodes 5a and 5b are used. In addition, the thickness of each electrode forming the electrode layer 5 is about 0.03 mm to 0.15 mm as in the previous case.

[0050] Then, if Figure 2 As shown in (e), the first ceramic sprayed film is sprayed to cover the electrode layer 5 to form a dielectric layer 6. As in the previous case, the thickness of the dielectric layer 6 here can be about 0.1 mm to 1.0 mm as long as the thickness of the dielectric layer 6 provided on the surface of the electrode layer 5 is about 0.1 mm to 1.0 mm.

[0051] Then, after the spraying step is completed, the dielectric layer 6, the electrode layer 5, and the close contact activation layer 4 are sealed. There is no particular limitation on the method, and for example, a resin solution with a predetermined solid content concentration can be used for impregnation. Then, the surface of the dielectric layer 6 is ground, and the surface roughness is adjusted by grinding (lap) or polishing (polish) as needed, so that the stripping device can be obtained.

[0052] Example

[0053] Hereinafter, embodiments of the present invention will be described in more detail.

[0054] The embodiment prepared four kinds of attaching and removing devices as described in the following Table 1. Devices 1 to 2 are attaching and removing devices of the present invention. Devices 3 to 4 are comparative examples. Among them, device 1 is a device comprising an electrode layer including two quadrilateral electrodes of 136mm×8.15mm×0.05mm thickness formed by a tungsten (W) sprayed film and a dielectric layer of 140mm×170mm×0.3mm thickness including an Al2O3-TiO2 sprayed film, separated by a 140mm×170mm×0.05mm thickness close-contact activation layer including an Al2O3-TiO2 sprayed film. In addition, device 2 is a device formed in the same manner as device 1 except that it includes a 140mm×170mm×thickness 0.05mm close-contact activation layer including an Al2O3 sprayed film. Furthermore, device 3 is a device formed in the same manner as device 1 except that a close-contact activation layer is not used. Furthermore, device 4 is a device that uses an aluminum metal substrate instead of a machinable ceramic layer and uses a polyimide film in a dielectric layer, etc. Furthermore, in these attachment and removal devices of devices 1 to 3, the dielectric layer, the electrode layer, and the close-contact activation layer are sealed with a silicone impregnation agent. In addition, the volume resistivities of the dielectric layer, the close-contact activation layer, and the machinable ceramic layer are as shown in the table (the volume resistivities are all values ​​after the sealing treatment).

[0055] [Table 1]

[0056]

[0057] (Film adhesion test)

[0058] The adhesion of the film was evaluated using a tensile tester for the attachment and detachment devices of the devices 1 to 3 prepared above. In the test, epoxy adhesive was applied to a test area of ​​Φ8 mm of the dielectric layer forming the workpiece adsorption surface to fix it, and a tensile test was performed. Three tensile tests were performed on each device, and the values ​​where the film peeled off were converted into area to obtain the adhesion.

[0059] The results and the positions of the fracture surfaces are shown in Table 2, and it is found that the adhesion of the film is superior in Device 1 and Device 2 compared to Device 3. That is, it was confirmed that the adhesion of the sprayed film was further improved by providing the adhesion activation layer.

[0060] [Table 2]

[0061]

[0062] (Workpiece release (dechuck) test)

[0063] Regarding the devices 1 and 2 with excellent film adhesion, a workpiece release test was conducted to investigate the detachability (release) after adsorbing the workpiece. At this time, for comparative reference, a workpiece release test was also conducted on the device 4 using a polyimide film. As shown in the previous Table 1, the device 4 is a device that uses a 120mm×120mm×thickness 0.05mm polyimide film instead of a dielectric layer and a close contact activation layer, respectively. In addition, as an electrode layer, two quadrilateral electrodes of 100mm×100mm×thickness 0.01mm formed of copper foil (Cu foil) are used, and an aluminum metal substrate of 120mm×120mm×thickness 5mm is used instead of a machinable ceramic layer.

[0064] As the workpiece, a commercially available aluminum foil cut into 80 mm × 80 mm was used. In addition, in order to adsorb the aluminum foil, a voltage of DC ± 300 V was applied to the electrode layers of the apparatus 1, the apparatus 2, and the apparatus 4. In the test, the aluminum foil was adsorbed with the workpiece adsorption surface facing downward in the vertical direction, and the time required for the aluminum foil to fall freely after the voltage was cut off (closed) was measured three times in each apparatus.

[0065] The results are shown in Table 3. In Devices 1 and 2, the aluminum foil immediately fell after the voltage applied to the electrode layer was cut off, showing good releasability. In contrast, in Device 4, the aluminum foil sometimes did not even fall freely, and the workpiece release could not be controlled.

[0066] [Table 3]

[0067]

[0068] (Static elimination of workpiece adsorption surface)

[0069] For devices 1 and 2 with excellent film adhesion, a surface potential meter was used to measure the surface potential of the workpiece adsorption surface when a voltage of DC ± 300 V was applied to the electrode layer, and the surface potential of the workpiece adsorption surface after the voltage was cut off was measured. At the same time, the decay time of the surface potential after the voltage was cut off was measured to evaluate the static elimination property of the workpiece adsorption surface.

[0070] The results are shown in Table 4. For any of the devices, it was confirmed that the static electricity on the workpiece adsorption surface was quickly eliminated within 1 second.

[0071] [Table 4]

[0072]

[0073] (Static elimination properties of machinable ceramic layers)

[0074] Similarly, for apparatus 1 and apparatus 2, a surface potential meter was used to measure the surface potential of the machinable ceramic layer when a voltage of DC ± 300 V was applied to the electrode layer, and the surface potential of the machinable ceramic layer after the voltage was cut off was measured. At the same time, the decay time of the surface potential after the voltage was cut off was measured to evaluate the static elimination property in the machinable ceramic layer.

[0075] The results are shown in Table 5. For any device, it was confirmed that the static electricity on the machinable ceramic layer was eliminated within 5 seconds, and in particular, device 1 had good static elimination. That is, since both devices had good release properties and the static electricity on the previous workpiece adsorption surface was eliminated within 1 second, it is believed that the release properties of the devices 1 and 2 are extremely good.

[0076] [Table 5]

[0077]

Claims

1. A putting on and taking off device, characterized in that: The workpiece can be adsorbed and detached, and the adsorption and detachment device includes: a machinable ceramic layer, the machinable ceramic layer contains SiO2; a close contact activation layer, which is arranged on the machinable ceramic layer; an electrode layer, which is arranged on the close contact activation layer; and a dielectric layer, which is arranged on the electrode layer. The close contact activation layer is formed by a ceramic spray film containing an aluminum oxide system, and the volume resistivity at room temperature is 10 9 Ω·cm ~10 12 Ω·cm or 10 14 Ω·cm ~10 16 Ω·cm, The electrode layer is covered by the close contact activation layer and the dielectric layer, and the volume resistivity of the dielectric layer is 10 9 Ω·cm~10 12 Ω·cm.

2. The putting on and taking off device according to claim 1, characterized in that: The thickness of the workpiece is 0.001 mm to 1.5 mm.

3. The putting on and taking off device according to claim 1 or 2, characterized in that: The workpiece is any of a conductor, a semiconductor, or an insulator.

4. The putting on and taking off device according to claim 1 or 2, characterized in that: The workpiece is a thin sheet.

5. The putting on and taking off device according to claim 4, characterized in that: The thin sheet is any one of foil, paper or film.

6. The putting on and taking off device according to claim 1, characterized in that: The dielectric layer and / or the electrode layer comprises sealed pores.

7. The putting on and taking off device according to claim 1, characterized in that: The close contact activation layer includes sealing.

8. The putting on and taking off device according to claim 1, characterized in that: The electrode layer constitutes a monopolar electrode or a bipolar electrode to which voltages of different polarities are applied.

9. The putting on and taking off device according to claim 1, characterized in that: The electrode layer includes a plurality of divided regions divided into an array shape.

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