Fixing member for cutting electronic component blank and cutting method

Abstract

The present invention provides a fixing member for cutting an electronic component blank and a cutting method, which suppress cracks generated when the electronic component blank is cut with a cutting knife. The fixing member (10) for the electronic component blank comprises a substrate (1) and a restraining material layer (2) arranged on a first main surface (1a) of the substrate (1) and fixing the electronic component blank (20) placed thereon. The Young's modulus of the restraining material layer (2) in a direction parallel to the first main surface (1a) of the substrate (1) is greater than 0.12 GPa and less than 10 GPa.

Description

Technical Field

[0001] The present invention relates to a cutting fixing member used when cutting an electronic component blank and a method for cutting the electronic component blank. Background Art

[0002] When manufacturing electronic components such as multilayer ceramic capacitors, a method is known in which a plurality of ceramic green sheets having internal electrode patterns formed thereon are stacked to form a mother laminate, the mother laminate is cut with a cutting blade to separate into a plurality of unfired laminates, and then fired.

[0003] Patent document 1 discloses a method in which a compression block as a mother laminate is bonded to a fixing sheet, and the compression block is placed on a cutting table via the fixing sheet, and the compression block is cut by a cutting blade. According to this cutting method, the position deviation of the compression block can be prevented and the compression block can be cut at a given position.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 7-94359

[0007] Here, when the mother laminate is cut by the cutting blade, if the cutting blade enters the mother laminate, a force is applied to the lower part of the mother laminate in the direction of being stretched to the left and right with the penetration position of the cutting blade as the center. At this time, if the deformation of the mother laminate exceeds the fracture strain of the mother laminate, cracks will be generated in the mother laminate.

[0008] The inventor of the present application found out after investigation that, when the mother laminate is fixed and cut by a fixing sheet as in the cutting method described in Patent Document 1, the generation of cracks cannot be suppressed due to the characteristics of the fixing sheet. In other words, simply fixing the mother laminate and cutting by a fixing sheet sometimes cannot suppress the generation of cracks in the mother laminate. Summary of the invention

[0009] Problems to be solved by the invention

[0010] The present invention is to solve the above-mentioned problems, and an object thereof is to provide a fixing member for cutting an electronic component blank and a method for cutting the electronic component blank, which can suppress the occurrence of cracks when cutting an electronic component blank such as a mother laminate with a cutting blade.

[0011] Means for solving problems

[0012] The fixing member for cutting an electronic component blank of the present invention is used to fix an electronic component blank to be cut, and is characterized in that the fixing member for cutting comprises:

[0013] substrate; and

[0014] The restraining material layer is arranged on the first main surface of the substrate and fixes the electronic component body placed thereon.

[0015] The Young's modulus of the constraining material layer in a direction parallel to the first main surface of the substrate is 0.12 GPa or more and 10 GPa or less.

[0016] A fixing member for cutting an electronic component blank in another aspect of the present invention is used to fix an electronic component blank to be cut, and is characterized in that the fixing member for cutting comprises:

[0017] substrate; and

[0018] a restraining material precursor layer, arranged on the first main surface of the substrate, on which the electronic component body is placed;

[0019] The restraining material precursor layer has a Young's modulus of less than 0.1 GPa in a direction parallel to the first main surface of the substrate, and by performing a given treatment, the restraining material layer has a Young's modulus of 0.12 GPa to 10 GPa and fixes the electronic component body.

[0020] The method for cutting an electronic component blank of the present invention uses the following electronic component blank cutting fixing member to cut the electronic component blank, the electronic component blank cutting fixing member comprising: a substrate; and a restraining material layer, which is arranged on the first main surface of the substrate and fixes the electronic component blank placed thereon, and has a Young's modulus in a direction parallel to the first main surface of the substrate of 0.12 GPa or more and 10 GPa or less, characterized in that:

[0021] The method has:

[0022] The step of placing and fixing the electronic component blank on the constraining material layer;

[0023] The step of cutting the electronic component blank placed and fixed on the restraining material layer with a cutting blade; and

[0024] a step of peeling the electronic component body from the restraint material layer.

[0025] A method for cutting an electronic component blank in another embodiment of the present invention uses the following electronic component blank cutting fixing member to cut the electronic component blank, the electronic component blank cutting fixing member comprising: a substrate; and a restraining material precursor layer, which is arranged on the first main surface of the substrate and on which the electronic component blank is placed, and the Young's modulus in a direction parallel to the first main surface of the substrate is less than 0.1 GPa, and by performing a given treatment, the restraining material layer becomes a restraining material layer that has a Young's modulus of 0.12 GPa or more and 10 GPa or less and fixes the electronic component blank, characterized in that:

[0026] The method has:

[0027] The step of placing the electronic component blank on the constraining material precursor layer;

[0028] A step of making the constraining material precursor layer become the constraining material layer by performing a given treatment;

[0029] The step of cutting the electronic component blank placed and fixed on the restraining material layer with a cutting blade; and

[0030] a step of peeling the electronic component body from the restraint material layer.

[0031] Effects of the Invention

[0032] According to the fixing member for cutting the electronic component blank of the present invention, since the electronic component blank can be cut while being held by the restraining material layer, it is possible to prevent the electronic component blank from being stretched to the left and right around the intrusion position of the cutting blade during cutting, thereby preventing cracks from being generated in the electronic component blank during cutting.

[0033] According to the electronic component blank cutting method of the present invention, the electronic component blank is cut while being held by the restraining material layer, thereby preventing the electronic component blank from being stretched to the left and right around the intrusion position of the cutting blade during cutting. Thus, cracks can be prevented from being generated in the electronic component blank during cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a side view schematically showing the structure of the fixing member for cutting the electronic component body in the first embodiment of the present invention.

[0035] Figure 2 This is a flowchart for explaining the method of cutting the electronic component blank in the first embodiment.

[0036] Figure 3 This is a diagram showing a state where a constraining material layer is formed on the first main surface of a substrate.

[0037] Figure 4 This is a diagram showing a state where an electronic component body is placed and adhered on a restraint material layer.

[0038] Figure 5 This is a diagram showing a state where an adhesive layer is provided between the restraint material layer and the electronic component body.

[0039] Figure 6 This is a diagram showing a state where the electronic component blank temporarily fixed on the restraining material layer is cut by a cutting blade.

[0040] Figure 7 It is a side view schematically showing the structure of a fixing member for cutting an electronic component body in a second embodiment of the present invention.

[0041] Figure 8 This is a flowchart for explaining a method of cutting an electronic component blank in the second embodiment.

[0042] Fig. 9 This is a diagram showing a state where a restraining material precursor layer is formed on the first main surface of a substrate.

[0043] Fig.10 This is a diagram showing a state where an electronic component blank is placed and adhered on a restraining material precursor layer.

[0044] Fig.11 This is a diagram showing a state where an adhesive layer is provided between the restraint material precursor layer and the electronic component body.

[0045] Fig.12 This is a diagram showing a state where a constraining material precursor layer on a substrate is cured to form a constraining material layer.

[0046] Explanation of symbols

[0047] 1. Base material;

[0048] 1a: a first main surface of the substrate;

[0049] 2 Constraint material layer;

[0050] 3 adhesive layer;

[0051] 5. Constraint material precursor layer;

[0052] 10. 10A A fixing member for cutting an electronic component blank;

[0053] 20 Electronic component blanks;

[0054] 30 Cutting table;

[0055] 40 Cutting knife. DETAILED DESCRIPTION

[0056] Embodiments of the present invention are shown below, and features of the present invention are described in detail.

[0057] <First Embodiment>

[0058] Figure 1 The figure is a side view schematically showing the structure of a fixing member 10 for cutting an electronic component blank in the first embodiment of the present invention. The fixing member 10 for cutting an electronic component blank in the first embodiment includes a substrate 1 and a restraining material layer 2 arranged on a first main surface 1a of the substrate 1 and fixing an electronic component blank 20 placed thereon.

[0059] The substrate 1 includes, for example, polyethylene, polypropylene, polyethylene terephthalate, polyamide, polycarbonate, polyacetal, polybutylene terephthalate, or polyimide. The substrate 1 has, for example, a sheet-like shape, and its thickness is, for example, 0.001 mm or more and 10 mm or less. In the case where a flexible material composed of a raw material with a low Young's modulus is used as the substrate 1, it is easy to be wound into a roll shape, so the convenience is improved from the perspectives of transportation and storage. In addition, in the case where the substrate 1 is flexible, after the electronic component blank 20 described later is cut, when the electronic component blank 20 is peeled off from the object formed by the substrate 1, the constraint material layer 2, and the electronic component blank 20, it becomes easy to peel off the electronic component blank 20, so that the electronic component blank 20 can be peeled off with low damage. Therefore, the substrate 1 is preferably flexible.

[0060] The restraining material layer 2 holds and fixes the electronic component blank 20 so that the movement of the electronic component blank 20 is restrained when cutting. The Young's modulus of the restraining material layer 2 in a direction parallel to the first main surface 1a is 0.12 GPa or more and 10 GPa or less. The restraining material layer 2 includes, for example, epoxy resin, acrylic resin, silicone resin, polyethylene, polypropylene, polyvinyl chloride, or polyethylene terephthalate. The thickness of the restraining material layer 2 is, for example, 0.001 mm or more and 5 mm or less.

[0061] The electronic component blank 20 to be cut is processed to become an electronic component, which can correspond to one electronic component or be used to manufacture multiple electronic components at one time. As an example, the electronic component blank 20 is an unfired mother laminate produced in the middle of manufacturing laminated ceramic electronic components such as laminated ceramic capacitors and laminated coils. However, the electronic component finally manufactured from the electronic component blank is not limited to laminated ceramic electronic components, but can also be a ceramic substrate, a glass epoxy substrate, a resin substrate such as a flexible substrate, an electronic component module, or a module substrate, a package, etc.

[0062] When the electronic component body 20 is cut, as described later, the substrate 1 is placed on a cutting table 30 , and the cutting is performed in a state where the electronic component body 20 is temporarily fixed to the restraining material layer 2 .

[0063] (Method for cutting electronic component blank)

[0064] Figure 2 This is a flowchart for explaining the method of cutting the electronic component blank 20 in the first embodiment.

[0065] In step S1, a material for a constraining material layer is supplied onto the first main surface 1a of the substrate 1 to form a constraining material layer 2 (see Figure 3 As the material of the constraining material layer 2, for example, at least one of epoxy resin, acrylic resin, silicone resin, polyethylene, polypropylene, polyvinyl chloride, and polyethylene terephthalate can be used. The Young's modulus of the constraining material layer 2 in a direction parallel to the first main surface 1a of the substrate 1 is greater than or equal to 0.12 GPa and less than or equal to 10 GPa.

[0066] The material of the constraining material layer 2 can be supplied by a die coater, a doctor blade, a roll coater, a dip coater, an inkjet coater, etc. The supply speed of the material of the constraining material layer 2 is, for example, 0.01 m / min or more and 200 m / min or less, and the temperature during the material supply is, for example, 20° C. or more and 100° C. or less. In addition, the thickness of the constraining material layer 2 is, for example, 0.001 mm or more and 5 mm or less.

[0067] Furthermore, when it is necessary to dry the constraining material layer 2 after it is formed, it may be dried in a drying furnace.

[0068] In step S2 following step S1, the electronic component blank 20 (see Figure 4 ).

[0069] Here, when the thermoplastic constraining material layer 2 is used, the electronic component body 20 is placed after the constraining material layer 2 is heated to be softened. The heating temperature is, for example, 30° C. or higher and 150° C. or lower.

[0070] In addition, if Figure 5As shown, an adhesive layer 3 may be provided between the restraining material layer 2 and the electronic component blank 20 as required. The adhesive layer 3 is provided on the surface of the restraining material layer 2 on which the electronic component blank 20 is placed, and has the function of bonding the restraining material layer 2 and the electronic component blank 20. For example, the adhesive layer 3 is provided by applying a known adhesive or pressure-sensitive adhesive to the surface of the restraining material layer 2 on which the electronic component blank 20 is placed. However, the adhesive layer 3 may also be provided by applying an adhesive or pressure-sensitive adhesive on the surface of the electronic component blank 20. The temperature and formation method when forming the adhesive layer 3 can be set to be the same as the conditions when forming the restraining material layer 2.

[0071] Furthermore, pressure may be applied in the direction in which the restraining material layer 2 and the electronic component body 20 face each other to improve the adhesion between the restraining material layer 2 and the electronic component body 20. The pressure may be, for example, 1 Pa or more and 100 MPa or less.

[0072] Alternatively, after the restraining material layer 2 is formed on the surface of the electronic component body 20 , the base material 1 may be placed and adhered on the restraining material layer 2 .

[0073] In step S3 following step S2, the substrate 1, the restraining material layer 2, and the electronic component blank 20 are placed and fixed on the cutting table 30, and after the cutting position is aligned, the electronic component blank 20 is cut by the cutting blade 40 (see Figure 6 ). When the substrate 1, the constraining material layer 2, and the electronic component blank 20 are integrated and placed on the cutting table 30, as shown in FIG. Figure 6 As shown, the substrate 1 is placed opposite to the cutting table 30 .

[0074] The means for fixing the object formed by integrating the substrate 1, the restraining material layer 2, and the electronic component blank 20 on the cutting table 30 can use any method such as attraction, magnetism, friction, etc. As an example, the cutting table 30 is provided with a suction hole that passes through from one main surface to the other main surface, and the object formed by integrating the substrate 1, the restraining material layer 2, and the electronic component blank 20 is fixed on the cutting table 30 by suction from the side of the cutting table 30 that is not opposite to the substrate 1 through the suction hole. At this time, a member that increases the attraction force may be interposed between the cutting table 30 and the substrate 1.

[0075] The material of the cutting blade 40 can be any material as long as it is harder than the electronic component blank 20 to be cut, such as metal, ceramic, carbon, etc. The thickness of the cutting blade 40 is, for example, 0.01 mm or more and 5 mm or less, and the height is, for example, 0.1 mm or more and 100 mm or less. In addition, the width of the cutting blade 40 in the width direction orthogonal to the thickness direction and the height direction is, for example, 1 mm or more and 600 mm or less.

[0076] The penetration speed of the cutting blade 40 when cutting the electronic component body 20 is, for example, 0.1 mm / sec or more and 1000 mm / sec or less. However, the penetration speed of the cutting blade 40 needs to be set to a speed at which the cutting blade 40 does not break.

[0077] The temperature of the electronic component blank 20 may be adjusted during cutting. For example, in order to prevent the cutting blade 40 from breaking, the electronic component blank 20 may be heated to soften it. In addition, the temperature of the electronic component blank 20 may be adjusted to increase the fracture strain of the electronic component blank 20 during cutting so that cracks are not generated. The temperature of the electronic component blank 20 during cutting is, for example, 20°C or more and 200°C or less.

[0078] As an example, when the electronic component blank 20 is cut, the cutting blade 40 cuts the electronic component blank 20 at a depth that penetrates into a midway position in the thickness direction of the restraining material layer 2. The depth that penetrates into a midway position in the thickness direction of the restraining material layer 2 means a depth that does not reach the substrate 1. When the cutting blade 40 cuts the electronic component blank 20 at a depth that penetrates into a midway position in the thickness direction of the restraining material layer 2, it becomes difficult for the components constituting the restraining material layer 2 to adhere to the cutting blade 40, so the frequency of cleaning the cutting blade 40 can be reduced.

[0079] Furthermore, as another example, when the electronic component blank 20 is cut, the cutting blade 40 cuts the electronic component blank 20 at a depth that penetrates into a midway position in the thickness direction of the substrate 1. The so-called depth that penetrates into a midway position in the thickness direction of the substrate 1 refers to a depth at which the cutting blade 40 penetrates into the substrate 1 but does not completely cut the substrate 1. In the case where the cutting blade 40 cuts the electronic component blank 20 at a depth that penetrates into a midway position in the thickness direction of the substrate 1, when the cutting blade 40 is lifted, the friction between the cutting blade 40 and the electronic component blank 20 becomes smaller. Therefore, in the case where the electronic component blank 20 includes a plurality of layers, the peeling between the layers of the electronic component blank 20 can be suppressed. In addition, in the case where the electronic component blank 20 has an internal electrode pattern, the internal electrode pattern can be suppressed from collapsing, etc.

[0080] Since the electronic component body 20 is fixed by the restraining material layer 2, it is possible to suppress the electronic component body 20 from being stretched left and right around the intrusion position of the cutting blade 40 during cutting. This can suppress the occurrence of cracks in the electronic component body 20 during cutting.

[0081] In step S4 following step S3, the electronic component body 20 is peeled from the restraining material layer 2. The electronic component body 20 may be peeled by applying a force, or the electronic component body 20 may be peeled after the restraining force of the restraining material layer 2 is reduced.

[0082] For example, when the constraining material layer 2 having thermoplasticity is used, the electronic component body 20 is peeled off after the constraining material layer 2 is softened by heating. The heating temperature is, for example, 40° C. or higher and 200° C. or lower.

[0083] When the restraining material layer 2 is used, which has UV curability and whose restraining force is reduced by curing, the restraining material layer 2 is irradiated with UV to reduce the restraining force, and then the electronic component body 20 is peeled off. The cumulative light amount of the irradiated UV is, for example, 1 kJ / m 2 Above and 100kJ / m 2 the following.

[0084] In addition, when a restraining material layer 2 that is decomposed by heating and thus vaporized is used, the restraining material layer 2 is heated to vaporize and removed, and then the electronic component body 20 is peeled off. In the case of a heating step such as sintering the electronic component body 20, the restraining material layer 2 can also be vaporized and removed during the heating step.

[0085] When the restraining material layer 2 that is soluble in water or a solvent is used, the restraining material layer 2 is dissolved and removed by washing with water or a solvent, and then the electronic component body 20 is peeled off.

[0086] In the above flowchart, in step S1, the material of the restraining material layer is supplied on the first main surface 1a of the substrate 1 to form the restraining material layer 2, thereby manufacturing the fixing member 10 for cutting the electronic component blank. In contrast, the fixing member 10 for cutting the electronic component blank having the restraining material layer 2 formed on the first main surface 1a of the substrate 1 may be prepared in advance, and the processing of step S1 may be omitted.

[0087] (Example)

[0088] A plurality of fixing members for cutting with different Young's modulus of the constrained material layer were prepared, and the incidence of cracks when the electronic component blank was cut was investigated. Here, 100 of three types of fixing members for cutting with Young's modulus of 0.2 GPa, 0.12 GPa, and 0.07 GPa of the constrained material layer were prepared respectively. The fixing members for cutting with Young's modulus of 0.2 GPa and 0.12 GPa of the constrained material layer are the fixing members for cutting of the present invention. In addition, for comparison, regarding the existing cutting method without a constrained material layer, that is, the incidence of cracks when the electronic component blank is placed on a substrate for cutting, the evaluation number was also set to 100 and investigated. The relationship between the Young's modulus of the constrained material layer and the incidence of cracks is shown in Table 1.

[0089] [Table 1]

[0090] Young's modulus(GPa) Crack generation rate (%) 0.2 3 0.12 4 0.07 100 Unconstrained material layer 100

[0091] As shown in Table 1, the crack generation rate when the Young's modulus of the constrained material layer is 0.07 GPa and the crack generation rate by the conventional cutting method without the constrained material layer are both 100%. That is, in the case of no constrained material layer and in the case of the constrained material layer having a Young's modulus of less than 0.12 GPa, cracks are likely to occur when the electronic component body is cut.

[0092] On the other hand, the crack generation rate was 3% when the Young's modulus of the constraining material layer 2 was 0.2 GPa, and the crack generation rate was as low as 4% when the Young's modulus of the constraining material layer 2 was 0.12 GPa. That is, by using the fixing member 10 for cutting of the present invention, it is possible to suppress the generation of cracks in the electronic component body 20 during cutting.

[0093] If the Young's modulus of the constraining material layer 2 exceeds 10 GPa, the cutting blade 40 may be damaged when the cutting blade 40 enters the constraining material layer 2 when cutting the electronic component body 20. Therefore, the Young's modulus of the constraining material layer 2 is preferably 10 GPa or less.

[0094] According to the fixing member 10 for cutting the electronic component blank in the first embodiment, since the electronic component blank 20 can be cut while being held by the restraining material layer 2, it is possible to suppress the electronic component blank 20 from being stretched to the left and right with the intrusion position of the cutting blade 40 as the center during cutting. Thus, it is possible to suppress the generation of cracks in the electronic component blank 20 during cutting. As described above, in the case where the restraining material layer exists but the Young's modulus of the restraining material layer in the direction parallel to the first main surface of the substrate is less than 0.12 GPa, the force for fixing the electronic component blank 20 is weak, so cracks are likely to be generated in the electronic component blank 20 during cutting.

[0095] In addition, if Figure 5 As shown, when the adhesive layer 3 is provided to bond the restraining material layer 2 and the electronic component blank 20, it is possible to prevent the electronic component blank 20 from being separated from the restraining material layer 2 during cutting. Therefore, it is possible to more reliably prevent the electronic component blank 20 from being stretched to the left and right during cutting, and to more effectively prevent the occurrence of cracks.

[0096] <Second Embodiment>

[0097] Figure 71 is a side view schematically showing the structure of a fixing member 10A for cutting an electronic component blank in the second embodiment of the present invention. The fixing member 10A for cutting an electronic component blank in the second embodiment includes a substrate 1 and a restraining material precursor layer 5 arranged on a first main surface 1a of the substrate 1 and on which an electronic component blank 20 is placed.

[0098] The restraining material precursor layer 5 has a Young's modulus of less than 0.1 GPa in a direction parallel to the first main surface 1a of the substrate 1, and when subjected to a given treatment, becomes a restraining material layer having a Young's modulus of 0.12 GPa to 10 GPa and fixing the electronic component blank 20. The restraining material layer having a Young's modulus of 0.12 GPa to 10 GPa and fixing the electronic component blank 20 is the restraining material layer 2 provided in the fixing member 10 for cutting the electronic component blank in the first embodiment.

[0099] The predetermined process for making the constrained material precursor layer 5 into the constrained material layer is at least one of irradiation with electromagnetic waves, heating, and cooling. The electromagnetic waves include light, UV (ultraviolet rays), and the like.

[0100] Figure 8 This is a flowchart for explaining a method of cutting the electronic component blank 20 in the second embodiment.

[0101] In step S11, a material for a constraining material precursor layer is supplied onto the first main surface 1a of the substrate 1 to form a constraining material precursor layer 5 (see Fig. 9 As the material of the constraining material precursor layer 5, for example, at least one of epoxy resin, acrylic resin, silicone resin, polyethylene, polypropylene, polyvinyl chloride, and polyethylene terephthalate can be used. The Young's modulus of the constraining material precursor layer 5 in a direction parallel to the first main surface 1a of the substrate 1 is less than 0.1 GPa.

[0102] The material of the restraining material precursor layer 5 can be supplied by a die coater, a doctor blade, a roll coater, a dip coater, an inkjet coater, etc. The supply speed of the material of the restraining material precursor layer 5 is, for example, 0.01 m / min or more and 200 m / min or less, and the temperature during the material supply is, for example, 20° C. or more and 100° C. or less. In addition, the thickness of the restraining material precursor layer 5 is, for example, 0.001 mm or more and 5 mm or less.

[0103] Furthermore, when it is necessary to dry the restraint material precursor layer 5 after it is formed, it may be dried in a drying furnace.

[0104] In step S12 following step S11, the electronic component blank 20 (see Fig.10 ).

[0105] Here, when the thermoplastic restraint material precursor layer 5 is used, the restraint material precursor layer 5 is heated to be softened, and then the electronic component blank 20 is placed. The heating temperature is, for example, 30° C. or higher and 150° C. or lower.

[0106] In addition, if Fig.11 As shown, an adhesive layer 3 may be provided between the restraining material precursor layer 5 and the electronic component blank 20 as required. The adhesive layer 3 is provided on the surface of the restraining material precursor layer 5 on which the electronic component blank 20 is placed, and has the function of bonding the restraining material precursor layer 5 and the electronic component blank 20. For example, the adhesive layer 3 is provided by applying a known adhesive or pressure-sensitive adhesive to the surface of the restraining material precursor layer 5 on which the electronic component blank 20 is placed. However, the adhesive layer 3 may also be provided by applying an adhesive or pressure-sensitive adhesive to the surface of the electronic component blank 20. The temperature and formation method when forming the adhesive layer 3 can be set to the same conditions as those when forming the restraining material precursor layer 5.

[0107] Furthermore, pressure may be applied in the direction in which the restraint material precursor layer 5 and the electronic component body 20 face each other to improve the adhesion between the restraint material precursor layer 5 and the electronic component body 20. The pressure may be, for example, 1 Pa or more and 100 MPa or less.

[0108] Alternatively, after the restraint material precursor layer 5 is formed on the surface of the electronic component body 20 , the base material 1 may be placed and adhered on the restraint material precursor layer 5 .

[0109] In step S13 following step S12, the constraining material precursor layer 5 is cured by performing a predetermined process to form the constraining material layer 2 (see Fig.12 ). For example, in the case where the constrained material precursor layer 5 is formed by mixing a curing agent into the main components constituting the constrained material precursor layer 5, the object formed by integrating the substrate 1, the constrained material precursor layer 5, and the electronic component blank 20 is placed under curing conditions to be cured. In addition, in the case of using a constrained material precursor layer 5 that is cured by volatilizing a solvent, etc., the object formed by integrating the substrate 1, the constrained material precursor layer 5, and the electronic component blank 20 is placed in a curing atmosphere for a certain period of time to dry, thereby curing.

[0110] When a thermosetting constraining material precursor layer is used as the constraining material precursor layer 5, the constraining material precursor layer 5 is cured by heating at a temperature and for a time that cures the constraining material precursor layer 5. For example, the constraining material precursor layer 5 is cured by heating at a temperature of 40°C to 150°C for a time of 1 minute to 60 minutes.

[0111] When a UV-curable restraining material precursor layer is used as the restraining material precursor layer 5, the restraining material precursor layer 5 is cured by irradiating with UV light having a cumulative light intensity sufficient to cure the restraining material precursor layer 5. For example, 1 kJ / m 2 Above and 100kJ / m 2 The following is the accumulated light amount of UV.

[0112] When a thermoplastic constraining material precursor layer is used as the constraining material precursor layer 5 , the constraining material precursor layer 5 is solidified by adjusting the temperature to a temperature at which the constraining material precursor layer 5 solidifies by cooling or the like.

[0113] In the step of curing the restraint material precursor layer 5, pressure may be applied in the direction in which the restraint material precursor layer 5 and the electronic component body 20 face each other. The magnitude of the pressure is, for example, 1 Pa or more and 100 MPa or less.

[0114] In step S14 following step S13, the substrate 1, the restraining material layer 2, and the electronic component blank 20 are placed and fixed on the cutting table 30, and after the positions are aligned, the substrate 1, the restraining material layer 2, and the electronic component blank 20 are cut by the cutting blade 40. Figure 2 The processing in step S3 of the flowchart shown in FIG. Figure 6 )same.

[0115] In step S15 following step S14, the electronic component body 20 is peeled off from the restraining material layer 2. Figure 6 The processing in step S4 of the flowchart shown is the same.

[0116] In the above flowchart, in step S11, the material of the restraining material precursor layer is supplied to the first main surface 1a of the substrate 1 to form the restraining material precursor layer 5, thereby manufacturing the fixing member 10A for cutting the electronic component blank. In contrast, the fixing member 10A for cutting the electronic component blank having the restraining material precursor layer 5 formed on the first main surface 1a of the substrate 1 may be prepared in advance, and the processing of step S11 may be omitted.

[0117] According to the fixing member 10A for cutting of the electronic component blank in the second embodiment, similarly to the fixing member 10 for cutting of the electronic component blank in the first embodiment, it is possible to suppress the occurrence of cracks in the electronic component blank 20 during cutting.

[0118] The present invention is not limited to the above-described embodiment, and various applications and modifications are possible within the scope of the present invention.

Claims

1. A fixing member for cutting an electronic component blank, used for fixing an electronic component blank to be cut, characterized in that: The cutting fixing member comprises: Base material; and a restraining material layer disposed on the first main surface of the substrate and fixing the electronic component body placed on the restraining material layer so as to be in direct contact with the electronic component body; The Young's modulus of the constraining material layer in a direction parallel to the first main surface of the substrate is 0.12 GPa or more and 10 GPa or less, The restraining material layer has ultraviolet (UV) curing properties, and is configured so that the placed electronic component body can be peeled off after the restraining force is reduced by irradiating the restraining material layer with UV.

2. The fixing member for cutting the electronic component blank according to claim 1, wherein: The constraining material layer has a thickness of 0.001 mm or more and 5 mm or less.

3. A fixing member for cutting an electronic component blank, used for fixing an electronic component blank to be cut, characterized in that: The cutting fixing member comprises: Base material; and A restraining material precursor layer is disposed on the first main surface of the substrate, and the electronic component blank is placed on the restraining material precursor layer so as to be in direct contact with the restraining material precursor layer. The restraining material precursor layer has a Young's modulus of less than 0.1 GPa in a direction parallel to the first main surface of the substrate, and is subjected to a given treatment to thereby become a restraining material layer having a Young's modulus of 0.12 GPa or more and 10 GPa or less and fixing the electronic component blank. The restraining material layer has ultraviolet (UV) curing properties, and is configured so that the placed electronic component body can be peeled off after the restraining force is reduced by irradiating the restraining material layer with UV.

4. The fixing member for cutting the electronic component blank according to claim 3, characterized in that: The thickness of the constraining material precursor layer is greater than or equal to 0.001 mm and less than or equal to 5 mm.

5. A method for cutting an electronic component blank, wherein the electronic component blank is cut using a fixing member for cutting the electronic component blank, the fixing member for cutting the electronic component blank comprising: a substrate; and a restraining material layer disposed on a first main surface of the substrate, the electronic component blank directly placed on the restraining material layer being fixed, the Young's modulus in a direction parallel to the first main surface of the substrate being 0.12 GPa or more and 10 GPa or less, characterized in that: The method has: The step of placing and fixing the electronic component blank on the restraining material layer so that the electronic component blank is in direct contact with the restraining material layer; The step of cutting the electronic component blank placed and fixed on the restraining material layer with a cutting blade; and A step of irradiating the restraining material layer with ultraviolet rays UV to reduce the restraining force of the restraining material layer and then peeling the electronic component body from the restraining material layer.

6. A method for cutting an electronic component blank, wherein the electronic component blank is cut using a fixing member for cutting the electronic component blank, wherein the fixing member for cutting the electronic component blank comprises: a substrate; and a restraining material precursor layer, which is arranged on a first main surface of the substrate, and on which the electronic component blank is placed so as to be directly in contact, and the restraining material precursor layer has a Young's modulus of less than 0.1 GPa in a direction parallel to the first main surface of the substrate, and is subjected to a given treatment to thereby obtain a restraining material layer having a Young's modulus of not less than 0.12 GPa and not more than 10 GPa and for fixing the electronic component blank, wherein: The method has: a step of placing the electronic component blank on the restraining material precursor layer so that the electronic component blank is in direct contact with the restraining material precursor layer; A step of making the constraining material precursor layer become the constraining material layer by performing a given treatment; The step of cutting the electronic component blank placed and fixed on the restraining material layer with a cutting blade; and A step of irradiating the restraining material layer with ultraviolet rays UV to reduce the restraining force of the restraining material layer and then peeling the electronic component body from the restraining material layer.

7. The method for cutting an electronic component blank according to claim 6, wherein: The given treatment is at least one of irradiation with electromagnetic waves, heating, and cooling.

8. The method for cutting an electronic component blank according to any one of claims 5 to 7, characterized in that: In the step of cutting the electronic component body with the cutting blade, the cutting blade cuts the electronic component body at a depth that penetrates into a midway position in the thickness direction of the restraint material layer.

9. The method for cutting an electronic component blank according to any one of claims 5 to 7, characterized in that: In the step of cutting the electronic component body with the cutting blade, the cutting blade cuts the electronic component body at a depth that penetrates into a midway position in the thickness direction of the substrate.

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