Camera modules and electronic equipment

Abstract

The camera module and electronic device disclosed in the present invention include a lens assembly, an elastic support structure, a chip assembly and a power assembly. The elastic support structure is arranged on the image side of the lens assembly, the chip assembly is arranged on the elastic support structure and is located between the elastic support structure and the lens assembly, the chip assembly is also electrically connected to the elastic support structure, the power assembly is located on the image side of the lens assembly, the power assembly is connected to the elastic support structure and / or the chip assembly, and the power assembly is used to move the chip assembly along the optical axis to achieve automatic focusing. The camera module and electronic device provided by the embodiment of the present invention, by arranging a power assembly to move the chip assembly along the optical axis to achieve automatic focusing of the camera module, because the weight of the chip assembly is small, the requirements for the load-bearing and driving force of the power assembly are low, so a power assembly with a smaller external size can be used, which is conducive to reducing the overall size of the camera module and realizing the miniaturized design of the camera module.

Description

Technical Field

[0001] The present invention relates to the technical field of imaging devices, and in particular to a camera module and electronic equipment. Background Art

[0002] In the related technology, the autofocus and optical image stabilization of most camera modules are achieved by driving the lens movement through a drive motor. As the pixel level of the photosensitive chip increases, the chip's external dimensions increase accordingly. At the same time, the size and weight of the lens also increase accordingly, and the requirements for the load-bearing capacity and driving force of the drive motor are getting higher and higher. The load-bearing performance of the drive motor is required to be higher and the driving force is getting stronger, which leads to an increase in the external dimensions of the drive motor, thereby increasing the overall size of the camera module, which is not conducive to the miniaturization design of the camera module. Summary of the invention

[0003] The embodiments of the present invention disclose a camera module and an electronic device, which can reduce the load-bearing and driving force requirements of a power component and reduce the external dimensions of the power component, thereby facilitating reduction of the overall dimensions of the camera module to achieve a miniaturized design of the camera module.

[0004] In order to achieve the above-mentioned object, in a first aspect, the present invention discloses a camera module, comprising:

[0005] Lens assembly;

[0006] An elastic support structure, wherein the elastic support structure is arranged on the image side of the lens assembly;

[0007] a chip assembly, the chip assembly being disposed on the elastic support structure and between the elastic support structure and the lens assembly, the chip assembly being also electrically connected to the elastic support structure; and

[0008] A power assembly, wherein the power assembly is located on the image side of the lens assembly, the power assembly is connected to the elastic support structure and / or the chip assembly, and the power assembly is used to move the chip assembly along the optical axis to achieve automatic focusing.

[0009] In the camera module provided in the present application, a power component is provided to drive the chip component to move along the optical axis to realize the automatic focus of the camera module. Although the external dimensions and weight of the chip component and the lens component increase with the increase of the pixel level of the chip component, the weight of the enlarged chip component is usually still much lighter than the weight of the lens component. Compared with the method of using the power component to drive the lens component to move along the optical axis to realize automatic focus, the power component is used to drive the chip component to move along the optical axis to realize the automatic focus of the camera module, and the load-bearing and driving force requirements of the power component are lower. Therefore, a power component with a smaller external dimension can be used to drive the chip component to move along the optical axis to realize the automatic focus function of the camera module. This is conducive to reducing the overall size of the camera module to realize the miniaturized design of the camera module.

[0010] As an optional embodiment, in an embodiment of the first aspect of the present invention, the elastic support structure includes a fixed part and a movable part connected to the fixed part, the power assembly includes a first bracket, a connecting bracket and a first power component, the first bracket is connected to the lens assembly and / or the fixed part of the elastic support structure, the connecting bracket is connected to the chip assembly and / or the movable part of the elastic support structure, the first power component is respectively connected to the first bracket and the connecting bracket, and the first power component is used to drive the connecting bracket to move relative to the first bracket along the optical axis direction, so that the chip assembly moves along the optical axis direction, thereby realizing the autofocus function of the camera module.

[0011] As an optional embodiment, in an embodiment of the first aspect of the present invention, the first bracket has a first hollow portion opening toward the chip assembly and a first accommodating space opening toward the optical axis, and the first accommodating space is connected to the first hollow portion; the first power component is located in the first accommodating space, and the connecting bracket is located in the first hollow portion, and the connecting bracket is at least partially extended to the outside of the opening of the first hollow portion to be connected to the chip assembly and / or the movable portion of the elastic support structure, and at least another portion of the connecting bracket extends into the first accommodating space to be connected to the first power component.

[0012] By adopting a first bracket with a first hollow portion, and setting the connecting bracket in the first hollow portion of the first bracket, the connecting bracket occupies the internal space of the first bracket. At the same time, the first bracket also has a first accommodating space connected to the first hollow portion, and the first power component is set in the first accommodating space of the first bracket. The first power component also occupies the internal space of the first bracket. In this way, the structure of the power component is more compact and the volume is relatively small, which avoids causing the overall volume of the camera module to be too large, thereby facilitating the miniaturization design of the camera module; moreover, the setting of the first hollow portion and the first accommodating space makes the mass of the first bracket relatively light, which avoids causing the overall mass of the camera module to be too heavy, thereby facilitating the lightweight design of the camera module.

[0013] As an optional implementation, in an embodiment of the first aspect of the present invention, the first power component includes a first coil, a first magnetic part, an upper spring sheet and a lower spring sheet, the first coil and the first magnetic part are spaced apart in a direction perpendicular to the optical axis, the first coil is arranged on the first bracket and located in the first accommodating space, the first magnetic part is arranged on the connecting bracket and located in the first accommodating space, the upper spring sheet is connected to the upper side of the first bracket and the upper side of the connecting bracket, and is located in the first accommodating space, the lower spring sheet is connected to the lower side of the first bracket and the lower side of the connecting bracket, and is located in the first accommodating space, so that when the first coil is powered on, the first coil will generate a thrust on the first magnetic part, so that the first magnetic part drives the connecting bracket to move along the optical axis direction, so that the chip assembly moves along the optical axis direction for automatic focusing, and at the same time, the upper spring sheet and the lower spring sheet will be deformed, and then when the first coil is de-energized, the upper spring sheet and the lower spring sheet restore the deformation to pull the connecting bracket back to its original position, thereby pulling the chip assembly back to its original position; or

[0014] The first power component includes a piezoelectric component and a connecting component, the piezoelectric component is arranged on the lower side or the upper side of the first bracket, and the piezoelectric component is located in the first accommodating space, the connecting component is connected to the lower side or the upper side of the piezoelectric component and the connecting bracket, and the connecting component is located in the first accommodating space, so that the piezoelectric component can be deformed along the optical axis when energized, so as to drive the connecting component and the connecting bracket to move along the optical axis, thereby driving the chip assembly to move along the optical axis to perform automatic focusing;

[0015] Among them, the upper side of the first bracket is the side of the first bracket close to the lens assembly, the lower side of the first bracket is the side of the first bracket away from the lens assembly, the upper side of the connecting bracket is the side of the connecting bracket close to the lens assembly, and the lower side of the connecting bracket is the side of the connecting bracket away from the lens assembly.

[0016] As an optional embodiment, in an embodiment of the first aspect of the present invention, the power assembly also includes a second bracket and a second power component, the second bracket is connected to the lens assembly and / or the fixed part, the second power component is respectively connected to the second bracket and the first bracket, and the second power component is used to drive the first bracket to move, so as to drive the chip assembly to move for optical image stabilization, that is, the power assembly can drive the chip assembly to move along the optical axis to realize the autofocus function of the camera module; at the same time, it can also drive the chip assembly to move in a direction perpendicular to the optical axis and rotate around the optical axis to realize the optical image stabilization function of the camera module, thereby helping to improve the shooting quality of the camera module.

[0017] As an optional embodiment, in an embodiment of the first aspect of the present invention, the second bracket has a second hollow portion opening toward the chip assembly and a second accommodating space opening toward the optical axis, the opening of the second hollow portion is arranged corresponding to the opening of the first hollow portion, the second accommodating space is connected to the second hollow portion, the second power component is arranged in the second accommodating space, the first bracket is located in the second accommodating space and connected to the second power component, and the connecting bracket is at least partially penetrated to the opening of the first hollow portion and the opening of the second hollow portion in sequence and connected to the chip assembly and / or the movable portion.

[0018] By adopting a second bracket with a second accommodating space, and arranging the second power component and the first bracket in the second accommodating space of the second bracket, the second power component and the first bracket occupy the internal space of the second bracket, so that the structure of the power component can be more compact and the volume can be smaller, which is conducive to making the overall volume of the camera module smaller, thereby facilitating the miniaturization design of the camera module; moreover, the setting of the second hollow portion and the second accommodating space makes the mass of the second bracket relatively light, which is conducive to making the overall mass of the camera module lighter, thereby facilitating the lightweight design of the camera module.

[0019] As an optional embodiment, in an embodiment of the first aspect of the present invention, a first limiting portion extends at the opening of the second accommodating space along the direction of the optical axis, and a second limiting portion is provided at the position of the connecting bracket corresponding to the first limiting portion. When the second power component drives the first bracket to move relative to the second bracket along the first direction, the second limiting portion can abut against the first limiting portion to limit the moving distance of the first bracket relative to the second bracket, and the first direction is perpendicular to the direction of the optical axis. This is mainly because the second power component is an OIS (Optical Image Stabilization) motor, which can usually adopt an anti-shake motor such as a suspension wire structure anti-shake motor or a magnet structure anti-shake motor. If the moving distance of the first bracket relative to the second bracket along the first direction is too large, it is easy to cause the suspension wire in the suspension wire structure anti-shake motor or the elastic component in the magnet structure anti-shake motor to exceed their own deformation range and fail elastically, and may even cause the suspension wire in the suspension wire structure anti-shake motor or the elastic component in the magnet structure anti-shake motor to break, affecting the use of the second power component. Therefore, the first limit part and the second limit part are provided to limit the moving distance of the first bracket relative to the second bracket, so as to avoid the situation where the suspension wire in the suspension wire structure anti-shake motor or the elastic component in the magnet structure anti-shake motor exceeds their own deformation range and fails elastically or breaks, so as to ensure that the second power component can be used normally.

[0020] And when the first power component drives the connecting bracket to move relative to the first bracket along the optical axis, the second limiting portion can also abut against the first limiting portion to limit the moving distance of the connecting bracket relative to the first bracket. This is mainly because the first power component is mainly a voice coil motor, which usually includes a first coil, a first magnetic portion, an upper spring sheet and a lower spring sheet. If the moving distance of the connecting bracket relative to the first bracket along the optical axis is too large, it is easy to cause the upper spring sheet and the lower spring sheet to exceed their own deformation range and fail elastically, and may even cause the upper spring sheet and the lower spring sheet to break, affecting the use of the upper spring sheet and the lower spring sheet. Therefore, the first limiting portion and the second limiting portion are set to limit the moving distance of the connecting bracket relative to the first bracket, so as to avoid the upper spring sheet and the lower spring sheet from exceeding their own deformation range and failing elastically or breaking, so as to ensure that the upper spring sheet and the lower spring sheet can be used normally.

[0021] As an optional embodiment, in an embodiment of the first aspect of the present invention, the chip component and / or the movable part is provided with a first pad, and the chip component and the movable part are connected through the first pad. This is mainly due to the consideration that: if the chip component is directly stacked on the movable part, the chip component will be in contact with the flexible connecting belt. When the chip component moves for optical image stabilization, there will be relative movement and friction between the chip component and the flexible connecting belt, which is not conducive to the deformation of the flexible connecting belt, resulting in increased resistance to the chip component during movement. Therefore, by providing the first pad between the chip component and the movable part, a gap can be provided between the chip component and the flexible connecting belt to avoid friction between the chip component and the flexible connecting belt, making the flexible connecting belt more easily stretched and deformed, thereby reducing the resistance encountered by the chip component during movement, thereby improving the response speed of optical image stabilization to ensure the optical image stabilization effect.

[0022] As an optional implementation, in an embodiment of the first aspect of the present invention, the first bracket of the power assembly is arranged on the side of the fixed part facing away from the chip assembly, the connecting bracket of the power assembly is connected to the movable part, and the first power component of the power assembly is used to move the movable part along the optical axis direction to drive the chip assembly to move along the optical axis direction to achieve automatic focusing. By arranging the power assembly on the side of the elastic support structure facing away from the chip assembly, the distance from the lens assembly to the chip assembly can be shortened, which is equivalent to reducing the image distance of the camera module to make a short back-focus camera module; at the same time, the overall thickness of the camera module in the optical axis direction can also be reduced.

[0023] As an optional implementation, in an embodiment of the first aspect of the present invention, the power assembly is connected to the lens assembly and is located between the lens assembly and the elastic support structure, the power assembly has a light channel corresponding to the chip assembly, and the power assembly is also connected to the elastic support structure and / or the chip assembly, and the power assembly is used to move the chip assembly along the optical axis to achieve automatic focusing.

[0024] The above structural design makes reasonable use of space and has a strong structural integrity, which is conducive to the power component driving the chip component to perform autofocus and optical image stabilization.

[0025] As an optional embodiment, in an embodiment of the first aspect of the present invention, the camera module also includes a first base, which is arranged on the side of the elastic support structure facing away from the chip assembly, and the first base has an avoidance groove opening toward the elastic support structure, and the avoidance groove is used to avoid the chip assembly when the chip assembly moves along the optical axis.

[0026] By setting the first base, and setting the first base on the side of the elastic support structure facing away from the chip assembly, the camera module is formed into a closed structure, which can not only prevent external light from entering the lens assembly from the hollow part of the fixed part and affecting the imaging effect of the lens assembly, but also protect the chip assembly, connecting bracket or first bracket and other components encapsulated inside from the outside world. In addition, since the chip assembly and the movable part will move along the optical axis when performing automatic focusing, in order to avoid interference between the chip assembly and the movable part and the first base, the first base is provided with an avoidance groove with an opening facing the movable part, so that the avoidance groove can be used to avoid the chip assembly and the movable part when the chip assembly moves along the optical axis, providing the possibility for the movement of the chip assembly and the movable part.

[0027] As an optional implementation, in an embodiment of the first aspect of the present invention, the camera module also includes a filter assembly, and the filter assembly cover is arranged on the side of the chip assembly facing the lens assembly, and the chip assembly is connected to the power assembly through the filter assembly, or, the filter assembly is arranged on the side of the lens assembly facing the chip assembly and is arranged corresponding to the chip assembly, or, the filter assembly is arranged on the power assembly and is arranged corresponding to the chip assembly.

[0028] By setting a filter assembly, such as an infrared filter assembly, light in other bands such as visible light can be filtered out, and only infrared light is allowed to pass. Therefore, an infrared filter assembly is selected to filter out infrared light and improve imaging quality, making the imaging more in line with the visual experience of the human eye; and the camera module can be used as an infrared camera module, that is, the camera module can also image in dim environments and other special application scenarios and can obtain better imaging effects.

[0029] As an optional embodiment, in an embodiment of the first aspect of the present invention, the filter assembly includes a fixed bracket and a filter, the fixed bracket includes a first part and a second part, the first part is covered on the side of the chip assembly facing the lens assembly, the second part is connected to the side of the first part away from the chip assembly, and in the direction perpendicular to the optical axis, the size of the second part is smaller than the size of the first part, the outer peripheral surface of the second part is fitly connected to the inner surface of the light channel, and the filter is arranged on the side of the second part away from the first part and corresponding to the chip assembly.

[0030] When the filter assembly is covered on the side of the chip assembly facing the lens assembly, and the power assembly is connected to the fixed bracket of the filter assembly, by limiting the distance between the power assembly and the chip assembly in the optical axis direction, the effective focal length, object distance and image distance of the camera module can be controlled in a certain proportion to ensure the imaging quality of the camera module; and the connection between the power assembly and the fixed bracket is usually bonded by the side of the power assembly facing away from the lens assembly and the side of the fixed bracket facing the lens assembly. Since the thickness of the adhesive in the optical axis direction is uncontrollable, the distance from the power assembly to the chip assembly in the optical axis direction is also uncontrollable. Therefore, in order to accurately control the distance between the power assembly and the chip assembly in the optical axis direction, the fixed bracket includes a second part with a certain height in the optical axis direction, so that the inner wall surface of the light channel of the power assembly fits the outer peripheral surface of the second part, so that the position of the power assembly on the second part can be adjusted by the locking machine to adjust the relative position between the power assembly and the chip assembly in the optical axis direction, and perform alignment correction, so that the distance between the power assembly and the chip assembly in the optical axis direction can be accurately controlled.

[0031] In a second aspect, the present invention discloses an electronic device, which has a camera module as described in the first aspect. The electronic device having the camera module drives the chip component to move along the optical axis through the power component to perform automatic focusing of the camera module, and the requirements for the load-bearing and driving force of the power component are relatively low. The chip component can be driven to move along the optical axis by using a power component with a smaller outer size to achieve the automatic focusing function of the camera module, which is conducive to reducing the overall size of the camera module to achieve a miniaturized design of the camera module.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The camera module and electronic device provided by the embodiments of the present invention, by setting a power component to drive the chip component to move along the optical axis direction to achieve automatic focus of the camera module. Although the outer dimensions and weight of the chip component and the lens component increase with the increase of the pixel level of the chip component, the weight of the enlarged chip component is usually much lighter than the weight of the lens component. Compared with the method of using the power component to drive the lens component to move along the optical axis direction to achieve automatic focus, the power component drives the chip component to move along the optical axis direction to achieve automatic focus of the camera module, and the requirements for the load-bearing and driving force of the power component are lower. Therefore, a power component with a smaller outer dimension can be used to drive the chip component to move along the optical axis direction to achieve the automatic focus function of the camera module. This is conducive to reducing the overall size of the camera module to achieve a miniaturized design of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 is a structural schematic diagram of a camera module disclosed in an embodiment of the present invention;

[0036] Figure 2 yes Figure 1 Schematic diagram of the decomposition structure of the camera module;

[0037] Figure 3 yes Figure 1 A top view of the camera module;

[0038] Figure 4 yes Figure 3 A first cross-sectional view of the camera module along the AA direction;

[0039] Figure 5 yes Figure 3 A second cross-sectional view of the camera module along the AA direction;

[0040] Figure 6 yes Figure 3 A third cross-sectional view of the camera module along the AA direction;

[0041] Figure 7 yes Figure 3 A fourth cross-sectional view of the camera module along the AA direction;

[0042] Figure 8 is a schematic diagram of the structure of a power assembly disclosed in an embodiment of the present invention;

[0043] Fig. 9 yes Figure 8 A cross-sectional view of the camera module along the BB direction;

[0044] Fig.10 yes Figure 3 A fifth cross-sectional view of the camera module along the AA direction;

[0045] Fig.11 yes Figure 3 A sixth cross-sectional view of the camera module along the AA direction;

[0046] Fig.12 yes Figure 3 A seventh cross-sectional view of the camera module along the AA direction;

[0047] Fig.13 yes Figure 3An eighth cross-sectional view of the camera module along the AA direction;

[0048] Fig.14 yes Figure 3 A ninth cross-sectional view of the camera module along the AA direction;

[0049] Fig.15 is a schematic diagram of a first structure of an elastic support structure disclosed in an embodiment of the present invention;

[0050] Fig.16 is a schematic diagram of a second structure of the elastic support structure disclosed in an embodiment of the present invention;

[0051] Fig.17 is a schematic diagram of a third structure of the elastic support structure disclosed in an embodiment of the present invention;

[0052] Fig.18 yes Fig.17 A local enlarged view of the M in FIG.

[0053] Fig.19 It is a schematic diagram of the structure of an electronic device disclosed in an embodiment of the present invention.

[0054] Icons: 100, camera module; 101, second pad; 102, third pad; 1, lens assembly; 2, elastic support structure; 21, fixed part; 211, hollow part; 22, movable part; 221, fourth pad; 23, connecting part; 24, flexible connecting belt; 24a, sub-flexible connecting belt; 241, first connecting end; 242, second connecting end; 3, chip assembly; 31, circuit board; 32, photosensitive chip; 4, power assembly; 40, light channel; 41, first bracket; 411, first hollow part; 412, first accommodating space; 42, connecting bracket; 421, first connecting part; 422, second connecting part; 423, second limiting part; 4231, bottom surface; 4232, side surface; 43. first power component; 431. first coil; 432. first magnetic part; 433. upper spring sheet; 434. lower spring sheet; 435. piezoelectric component; 436. connecting component; 44. second bracket; 441. second hollow part; 442. second accommodating space; 443. first limiting part; 4431. first abutting surface; 4432. second abutting surface; 45. second power component; 451. second coil; 452. second magnetic part; 46. detection window; 5. first base; 51. avoidance groove; 6. filter assembly; 61. fixing bracket; 611. first part; 612. second part; 62. filter; 7. second base; 8. first cushion block; 200. electronic device; 201. shell. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0056] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like are based on the directions or positional relationships shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0057] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0058] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0059] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0060] The technical solution of the present invention will be further described below in conjunction with embodiments and drawings.

[0061] See also Figure 1 and Figure 2The embodiment of the present invention discloses a camera module, the camera module 100 may include a lens assembly 1, an elastic support structure 2, a chip assembly 3 and a power assembly 4, the elastic support structure 2 is arranged on the image side of the lens assembly 1, the chip assembly 3 is arranged on the elastic support structure 2 and is located between the elastic support structure 2 and the lens assembly 1, and the chip assembly 3 is also electrically connected to the elastic support structure 2 to achieve electrical connection between the chip assembly 3 and an external circuit. The power assembly 4 is located on the image side of the lens assembly 1, the power assembly 4 is connected to the elastic support structure 2 and / or the chip assembly 3, and the power assembly 4 can be used to move the chip assembly 3 along the optical axis direction to achieve automatic focusing of the camera module 100.

[0062] In the camera module 100 provided in the present application, a power component 4 is provided to drive the chip component 3 to move along the optical axis to achieve automatic focus of the camera module 100. Since the mass of the chip component 3 is usually much lighter than the weight of the lens component 1, although the dimensions and weight of the chip component 3 and the lens component 1 increase with the increase of the pixel level of the chip component 3, the weight of the enlarged chip component 3 is usually still much lighter than the weight of the lens component 1. Therefore, compared with the method of driving the lens component 1 to move along the optical axis by the power component 4 to achieve automatic focus, the camera module 100 is automatically focused by driving the chip component 3 to move along the optical axis by the power component 4. The requirements for the load-bearing and driving force of the power component 4 are lower. Therefore, a power component 4 with a smaller dimension can be used to drive the chip component 3 to move along the optical axis to achieve the automatic focus function of the camera module 100. This is conducive to reducing the overall size of the camera module 100 to achieve a miniaturized design of the camera module 100.

[0063] Optionally, the chip assembly 3 in this embodiment may include a circuit board 31 and a photosensitive chip 32 disposed on the circuit board 31. The elastic support structure 2 in this embodiment may be a plate-like structure that can be deformed and conductive, such as a flexible circuit board, so that the chip assembly 3 can be electrically connected to an external circuit and deformed when subjected to force.

[0064] In some embodiments, such as Figure 3 and Figure 4As shown, the power assembly 4 can be connected to the lens assembly 1 and located between the lens assembly 1 and the elastic support structure 2. The power assembly 4 has a light channel 40 corresponding to the chip assembly 3, so that the incident light entering through the lens assembly 1 can pass through the light channel 40 to enter the chip assembly 3 and can form an image on the photosensitive surface of the photosensitive chip 32. The power assembly 4 is also connected to the elastic support structure 2 and / or the circuit board 31 of the chip assembly 3. The power assembly 4 can be used to move the chip assembly 3 along the optical axis to achieve autofocus. The above structural design makes reasonable use of space and has a strong structural integrity, which is conducive to the power assembly 4 driving the chip assembly 3 to perform autofocus and optical image stabilization.

[0065] In some embodiments, such as Figure 3 and Figure 4 As shown, the camera module 100 may further include a filter assembly 6, which is disposed between the lens assembly 1 and the chip assembly 3. By providing a filter assembly 6, such as an infrared filter assembly 6, light of other bands such as visible light can be filtered out, and only infrared light can be allowed to pass through. Therefore, the infrared filter assembly 6 is selected to filter out light of other bands such as visible light, thereby improving the imaging quality and making the imaging more in line with the visual experience of the human eye; and the camera module 100 can be used as an infrared camera module 100, that is, the camera module 100 can also form images in dim environments and other special application scenarios and can obtain better imaging effects.

[0066] In some embodiments, such as Figure 3 and Figure 4 As shown, the elastic support structure 2 may include a fixed part 21 and a movable part 22 connected to the fixed part 21. The circuit board 31 of the chip assembly 3 is arranged on the movable part 22 of the elastic support structure 2 and is electrically connected to the movable part 22. When the camera module 100 is applied to electronic devices such as mobile phones and tablet computers, the fixed part 21 can be used to electrically connect to the motherboard of the electronic device. For example, the fixed part 21 can be electrically connected to the motherboard of the electronic device through a gold finger, a board-to-board connector, etc., so as to electrically connect the chip assembly 3 to the electronic device. The power assembly 4 may include a first bracket 41, a connecting bracket 42 and a first power component 43, the first bracket 41 is connected to the fixed part 21 of the lens assembly 1 and / or the elastic support structure 2, the connecting bracket 42 is connected to the circuit board 31 of the chip assembly 3 and / or the movable part 22 of the elastic support structure 2, and the connecting bracket 42 has the aforementioned light channel 40, the first power component 43 is respectively connected to the first bracket 41 and the connecting bracket 42, so that the first power component 43 can be used to drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction, so that the chip assembly 3 moves along the optical axis direction, thereby realizing the autofocus function of the camera module 100.

[0067] For example, in Figure 4 In the illustrated embodiment, the first bracket 41 of the power assembly 4 is connected to the lens assembly 1 and the fixed part 21 of the elastic support structure 2, wherein the first bracket 41 of the power assembly 4 can be connected to the fixed part 21 of the elastic support structure 2 via the second pad 101, and the connecting bracket 42 of the power assembly 4 can be connected to the circuit board 31 of the chip assembly 3 via the filter assembly 6. When performing autofocus, the first power component 43 will drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction (z direction), so as to drive the chip assembly 3 to move along the optical axis direction, thereby realizing the autofocus function of the camera module 100.

[0068] Or for example, in Figure 5 In the illustrated embodiment, the first bracket 41 of the power assembly 4 is connected to the lens assembly 1 and the fixed part 21 of the elastic support structure 2, wherein the first bracket 41 of the power assembly 4 can be connected to the fixed part 21 of the elastic support structure 2 through the second pad 101, and the connecting bracket 42 of the power assembly 4 is connected to the movable part 22 of the elastic support structure 2. When autofocusing is performed, the first power component 43 will drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction (z direction), so as to drive the movable part 22 of the elastic support structure 2 to move along the optical axis direction. At the same time, the chip assembly 3 provided on the movable part 22 will move along the optical axis direction, thereby realizing the autofocus function of the camera module 100.

[0069] For example, in Figure 6 In the illustrated embodiment, the first bracket 41 of the power assembly 4 is connected to the lens assembly 1 and the fixed part 21 of the elastic support structure 2, wherein the first bracket 41 of the power assembly 4 can be connected to the fixed part 21 of the elastic support structure 2 through the second pad 101, and the connecting bracket 42 of the power assembly 4 is connected to the movable part 22 of the elastic support structure 2 and the circuit board 31 of the chip assembly 3. When autofocusing is performed, the first power component 43 will drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction (z direction), so as to drive the movable part 22 and the chip assembly 3 to move along the optical axis direction, thereby realizing the autofocus function of the camera module 100.

[0070] For example, in Figure 7 In the illustrated embodiment, the first bracket 41 of the power assembly 4 is connected to the lens assembly 1, and the connecting bracket 42 of the power assembly 4 is connected to the movable part 22 of the elastic support structure 2. When autofocusing is performed, the first power component 43 will drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction (z direction), so as to drive the movable part 22 of the elastic support structure 2 to move along the optical axis direction. At the same time, the chip assembly 3 provided on the movable part 22 will move along the optical axis direction, thereby realizing the autofocus function of the camera module 100.

[0071] Considering that the power assembly 4 of the present application includes at least the first bracket 41, the first power component 43, the connecting bracket 42 and other components, its structure is relatively complex, so that the overall height of the power assembly 4 in the optical axis direction is usually relatively high. Figure 4 In the embodiment shown, the connecting bracket 42 of the power assembly 4 is connected to the chip assembly 3 through the filter assembly 6, which may cause the effective focal length of the camera module 100 to be too long, so that the overall thickness of the camera module 100 in the optical axis direction is increased. Figure 5 In the illustrated embodiment, the connecting bracket 42 of the power component 4 is connected together with the movable part 22 of the elastic support structure 2, so that the power component 4 can also drive the chip component 3 to move along the optical axis, and at the same time shorten the distance from the lens component 1 to the chip component 3, which is equivalent to reducing the effective focal length of the camera module 100, thereby helping to reduce the overall thickness of the camera module 100 in the optical axis direction and facilitating the miniaturization design of the camera module 100.

[0072] In some embodiments, the first bracket 41 may have a first hollow portion 411 opening toward the chip assembly 3 and a first accommodating space 412 opening toward the optical axis, the first accommodating space 412 is connected to the first hollow portion 411, the first power component 43 is located in the first accommodating space 412, the connecting bracket 42 is located in the first hollow portion 411, the connecting bracket 42 is at least partially extended to the outside of the opening of the first hollow portion 411 and connected to the circuit board 31 of the chip assembly 3 and / or the movable portion 22 of the elastic support structure 2, and at least another portion of the connecting bracket 42 extends into the first accommodating space 412 and is connected to the first power component 43. By adopting a first bracket 41 with a first hollow portion 411, and setting the connecting bracket 42 in the first hollow portion 411 of the first bracket 41, the connecting bracket 42 occupies the internal space of the first bracket 41. At the same time, the first bracket 41 also has a first accommodating space 412, and the first power component 43 is set in the first accommodating space 412 of the first bracket 41. The first power component 43 also occupies the internal space of the first bracket 41. In this way, the structure of the power component 4 is relatively compact and the volume is relatively small, which avoids causing the overall volume of the camera module 100 to be too large, thereby facilitating the miniaturization design of the camera module 100; moreover, the setting of the first hollow portion 411 and the first accommodating space 412 makes the mass of the first bracket 41 relatively light, which avoids causing the overall mass of the camera module 100 to be too heavy, thereby facilitating the lightweight design of the camera module 100.

[0073] exist Figure 4 and Figure 5In the illustrated embodiment, the connecting bracket 42 may include a first connecting portion 421 and a second connecting portion 422, the first connecting portion 421 being located in the first hollow portion 411 and extending outside the opening of the first hollow portion 411 to be connected to the circuit board 31 of the chip assembly 3, the second connecting portion 422 being connected to the first connecting portion 421 at approximately a right angle, and the second connecting portion 422 extending into the first accommodating space 412 to be connected to the first power component 43.

[0074] Combination Figure 8 and Fig. 9 As shown, the first power component 43 of the present application can be an auto focus motor (AF motor for short) such as a voice coil motor or a piezoelectric motor.

[0075] An exemplary example is Figure 8 and Fig. 9 As shown in (a) and (b), the first power component 43 may include a first coil 431, a first magnetic part 432, an upper spring piece 433 and a lower spring piece 434. The first coil 431 and the first magnetic part 432 are spaced apart in a direction perpendicular to the optical axis. The first coil 431 may be arranged on the first bracket 41 and located in the first accommodating space 412. The first magnetic part 432 may be arranged on the connecting bracket 42 and located in the first accommodating space 412. The upper spring piece 433 is connected to the upper side of the connecting bracket 42 and the upper side of the first bracket 41 and is located in the first accommodating space 412. The lower spring piece 434 is connected to the lower side of the connecting bracket 42 and the lower side of the first bracket 41 and is located in the first accommodating space 412. Therefore, when the first coil 431 is powered on, the first coil 431 will generate thrust on the first magnetic part 432, so that the first magnetic part 432 drives the connecting bracket 42 to move along the optical axis, so that the chip assembly 3 moves along the optical axis for automatic focusing, and at the same time, the upper spring sheet 433 and the lower spring sheet 434 are deformed, and then when the first coil 431 is powered off, the upper spring sheet 433 and the lower spring sheet 434 recover the deformation to pull the connecting bracket 42 back to the original position, thereby pulling the chip assembly 3 back to the original position. Among them, the first magnetic part 432 can be a magnet or a magnet.

[0076] Another exemplary example is Figure 8 and Fig. 9As shown in (c), the first power component 43 may include a piezoelectric component 435 and a connecting component 436. The piezoelectric component 435 is arranged on the upper side or the lower side of the first bracket 41 and is located in the first accommodating space 412. One end of the connecting component 436 is connected to the piezoelectric component 435, and the other end of the connecting component 436 is connected to the upper side or the lower side of the connecting bracket 42. The piezoelectric component 435 can be deformed along the optical axis when energized to drive the connecting component 436 and the connecting bracket 42 to move along the optical axis, thereby driving the chip assembly 3 to move along the optical axis for automatic focusing.

[0077] Among them, the upper side of the first bracket 41 is the side of the first bracket 41 close to the lens assembly 1, the lower side of the first bracket 41 is the side of the first bracket 41 away from the lens assembly 1, the upper side of the connecting bracket 42 is the side of the connecting bracket 42 close to the lens assembly 1, and the lower side of the connecting bracket 42 is the side of the connecting bracket 42 away from the lens assembly 1.

[0078] In some embodiments, such as Figures 4 to 7 As shown, the power assembly 4 may also include a second bracket 44 and a second power component 45. The second bracket 44 is connected to the fixed portion 21 of the lens assembly 1 and / or the elastic support structure 2. The second power component 45 is respectively connected to the second bracket 44 and the first bracket 41. The second power component 45 is used to drive the first bracket 41 to move so that the chip assembly 3 moves for optical image stabilization, that is, the second power component 45 can drive the first bracket 41, the first power component 43, the connecting bracket 42 and the chip assembly 3 to move as a whole for optical image stabilization. It can be seen that the power assembly 4 of the present application can drive the chip assembly 3 to move along the optical axis to realize the autofocus function of the camera module 100; at the same time, it can also drive the chip assembly 3 to move in a direction perpendicular to the optical axis and rotate in a direction around the optical axis to realize the optical image stabilization function of the camera module 100, which is beneficial to improve the shooting quality of the camera module 100.

[0079] For example, in Figure 4In the illustrated embodiment, the second bracket 44 of the power assembly 4 is connected to the lens assembly 1 and the fixing portion 21 of the elastic support structure 2, wherein the second bracket 44 of the power assembly 4 can be connected to the fixing portion 21 of the elastic support structure 2 through the second cushion block 101, and the first bracket 41 of the power assembly 4 is connected to the second bracket 44 through the second power component 45, and the connecting bracket 42 is connected to the circuit board 31 of the chip assembly 3 through the filter assembly 6. When performing autofocus, the first power component 43 will drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction (z direction), so as to drive the chip assembly 3 to move along the optical axis direction, thereby realizing the autofocus function of the camera module 100; and when performing optical image stabilization, for example, taking x-direction compensation as an example, the second power component 45 will drive the first bracket 41, the first power component 43, and the connecting bracket 42 as a whole to move relative to the second bracket 44 along the x direction, so as to drive the chip assembly 3 to move along the x direction, thereby realizing the optical image stabilization function of the camera module 100.

[0080] Or for example, in Figure 5 In the illustrated embodiment, the second bracket 44 of the power assembly 4 is connected to the lens assembly 1 and the fixed part 21 of the elastic support structure 2, wherein the second bracket 44 of the power assembly 4 can be connected to the fixed part 21 of the elastic support structure 2 via a second pad 101, and the first bracket 41 of the power assembly 4 is connected to the second bracket 44 via a second power component 45, and the connecting bracket 42 is connected to the movable part 22 of the elastic support structure 2. When performing autofocus, the first power component 43 will drive the connecting bracket 42 to move along the optical axis direction (z direction) relative to the first bracket 41, so as to drive the movable part 22 of the elastic supporting structure 2 to move along the optical axis direction. At the same time, the chip component 3 provided on the movable part 22 will move along the optical axis direction, thereby realizing the autofocus function of the camera module 100; and when performing optical image stabilization, for example, taking x-direction compensation as an example, the second power component 45 will drive the first bracket 41, the first power component 43, and the connecting bracket 42 as a whole to move along the x direction relative to the second bracket 44, so as to drive the movable part 22 to move along the x direction. At the same time, the chip component 3 provided on the movable part 22 moves along the x direction, thereby realizing the optical image stabilization function of the camera module 100.

[0081] For example, in Figure 6In the illustrated embodiment, the second bracket 44 of the power assembly 4 is connected to the lens assembly 1 and the fixed part 21 of the elastic support structure 2, wherein the second bracket 44 of the power assembly 4 can be connected to the fixed part 21 of the elastic support structure 2 via a second pad 101, and the first bracket 41 of the power assembly 4 is connected to the second bracket 44 via a second power component 45, and the connecting bracket 42 is connected to the movable part 22 of the elastic support structure 2 and the circuit board 31 of the chip assembly 3. When performing autofocus, the first power component 43 will drive the connecting bracket 42 to move along the optical axis direction (z direction) relative to the first bracket 41, so as to drive the movable part 22 and the chip assembly 3 to move along the optical axis direction, thereby realizing the autofocus function of the camera module 100; and when performing optical image stabilization, for example, taking x-direction compensation as an example, the second power component 45 will drive the first bracket 41, the first power component 43, and the connecting bracket 42 as a whole to move along the x direction relative to the second bracket 44, so as to drive the chip assembly 3 and the movable part 22 to move along the x direction, thereby realizing the optical image stabilization function of the camera module 100.

[0082] For example, in Figure 7 In the illustrated embodiment, the second bracket 44 of the power assembly 4 is connected to the lens assembly 1, and the first bracket 41 of the power assembly 4 is connected to the second bracket 44 through the second power component 45, and the connecting bracket 42 is connected to the movable part 22 of the elastic support structure 2. When performing autofocus, the first power component 43 will drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction (z direction), so as to drive the movable part 22 of the elastic support structure 2 to move along the optical axis direction. At the same time, the chip assembly 3 provided on the movable part 22 will move along the optical axis direction, thereby realizing the autofocus function of the camera module 100; and when performing optical image stabilization, for example, taking the provision of x-direction compensation as an example, the second power component 45 will drive the first bracket 41, the first power component 43, and the connecting bracket 42 as a whole to move relative to the second bracket 44 along the x-direction, so as to drive the movable part 22 to move along the x-direction. At the same time, the chip assembly 3 provided on the movable part 22 moves along the x-direction, thereby realizing the optical image stabilization function of the camera module 100.

[0083] It should be noted that the camera module 100 provided in the embodiment of the present application has an internal coordinate system (also called an internal reference coordinate system). Figure 1 and Figure 2, the internal coordinate system is a three-dimensional coordinate system, which takes the center of the chip assembly 3 as the origin, and includes: a z-axis parallel to the optical axis direction of the lens assembly 1, an x-axis perpendicular to the z-axis and parallel to the length direction of the lens assembly 1, and a y-axis perpendicular to the z-axis and perpendicular to the length direction of the lens assembly 1. Rotation around the z-axis is called roll, also known as providing roll compensation. In order to show the coordinate system more clearly, Figure 1 and Figure 2 The origin of the internal coordinate system shown in is translated relative to the actual coordinate system origin, but does not represent the actual position of the coordinate system.

[0084] In the camera module 100 provided in the present application, the first power component 43 can drive the chip assembly 3 to move along the z direction for automatic focusing, and the second power component 45 can drive the movement along the x direction (i.e., providing x-direction compensation), the movement along the y direction (i.e., providing y-direction compensation) and the rotation around the z-axis (i.e., providing roll compensation) to perform optical image stabilization, thereby improving the imaging quality of the camera module 100.

[0085] In some embodiments, such as Figures 4 to 7 As shown, the second bracket 44 may have a second hollow portion 441 with an opening toward the chip assembly 3 and a second accommodating space 442 with an opening toward the optical axis, the opening of the second hollow portion 441 is arranged to correspond to the opening of the first hollow portion 411, the second accommodating space 442 is communicated with the second hollow portion 441, the second power component 45 is arranged in the second accommodating space 442, the first bracket 41 is located in the second accommodating space 442 and connected to the second power component 45, and the connecting bracket 42 is at least partially penetrated to the opening of the first hollow portion 411 and the opening of the second hollow portion 441 in sequence and connected to the chip assembly 3 and / or the movable portion 22. By adopting a second bracket 44 with a second accommodating space 442, and arranging the second power component 45 and the first bracket 41 in the second accommodating space 442 of the second bracket 44, the second power component 45 and the first bracket 41 occupy the internal space of the second bracket 44, so that the structure of the power component 4 can be more compact and smaller in size, which is beneficial to making the overall volume of the camera module 100 smaller, thereby facilitating the miniaturization design of the camera module 100; moreover, the setting of the second hollow portion 441 and the second accommodating space 442 makes the second bracket 44 relatively light in weight, which is beneficial to making the overall weight of the camera module 100 lighter, thereby facilitating the lightweight design of the camera module 100.

[0086] Combination Figure 8 and Fig. 9As shown, the second power component 45 of the present application is an OIS (Optical Image Stabilization) motor, which can be a suspension wire structure anti-shake motor, a magnet structure anti-shake motor, a piezoelectric structure anti-shake motor or other anti-shake motors.

[0087] An exemplary example is Figure 8 and Fig. 9 As shown in (a), the second power component 45 can be a suspension wire structure anti-shake motor, that is, the second power component 45 is located in the second accommodating space 442, and the lower side of the first bracket 41 and the lower side of the second bracket 44 are connected by a shape memory alloy (Shape Memory Alloys, SMA) suspension wire. The SMA suspension wire contracts when heated and stretches when dissipating heat. The contraction and stretching of the SMA suspension wire can be used to drive the chip assembly 3 to move in a direction perpendicular to the optical axis (x, y direction) and rotate around the optical axis (roll axis) to perform optical image stabilization.

[0088] Another exemplary example is Figure 8 and Fig. 9 As shown in (b) and (c), the second power component 45 may include a second coil 451 and a second magnetic part 452, the second coil 451 and the second magnetic part 452 are arranged at intervals along the optical axis direction and are located in the second accommodating space 442, and the second coil 451 is arranged on the second bracket 44, and the second magnetic part 452 is arranged on the first bracket 41, so that when the second coil 451 is powered on, the second coil 451 will generate a thrust on the second magnetic part 452, so that the second magnetic part 452 drives the first bracket 41 to move in a direction perpendicular to the optical axis (x, y direction) and rotate around the optical axis (roll axis), thereby driving the chip assembly 3 to move in a direction perpendicular to the optical axis (x, y direction) and rotate around the optical axis (roll axis) to perform optical image stabilization. Among them, the second magnetic part 452 can be a magnet or a magnet.

[0089] In some embodiments, such as Figures 4 to 7As shown, a first limiting portion 443 extends along the optical axis direction at the opening of the second accommodating space 442, and a second limiting portion 423 is provided at the position of the connecting bracket 42 corresponding to the first limiting portion 443. When the second power component 45 drives the first bracket 41 to move relative to the second bracket 44 along the first direction, the second limiting portion 423 can abut against the first limiting portion 443 to limit the moving distance of the first bracket 41 relative to the second bracket 44. The first direction is a direction perpendicular to the optical axis direction. This is mainly because the second power component 45 is mainly an OIS (Optical Image Stabilization) motor, which can usually adopt an anti-shake motor such as a suspension wire structure anti-shake motor or a magnet structure anti-shake motor. If the moving distance of the first bracket 41 relative to the second bracket 44 along the first direction is too large, it is easy to cause the suspension wire in the suspension wire structure anti-shake motor or the elastic component in the magnet structure anti-shake motor to exceed its own deformation range and fail elastically, and it may even cause the suspension wire in the suspension wire structure anti-shake motor or the elastic component in the magnet structure anti-shake motor to break, affecting the use of the second power component 45. Therefore, the first limit portion 443 and the second limit portion 423 are set to limit the moving distance of the first bracket 41 relative to the second bracket 44, so as to avoid the suspension wire in the suspension wire structure anti-shake motor or the elastic component in the magnet structure anti-shake motor exceeding its own deformation range and causing elastic failure or breakage, so as to ensure that the second power component 45 can be used normally.

[0090] When the first power component 43 drives the connecting bracket 42 to move relative to the first bracket 41 along the optical axis, the second limiting portion 423 can also abut against the first limiting portion 443 to limit the moving distance of the connecting bracket 42 relative to the first bracket 41. This is mainly because the first power component 43 is mainly a voice coil motor, which usually includes a first coil 431, a first magnetic portion 432, an upper spring sheet 433 and a lower spring sheet 434. If the moving distance of the connecting bracket 42 relative to the first bracket 41 along the optical axis is too large, it is easy to cause The upper spring piece 433 and the lower spring piece 434 exceed their own deformation range and fail to elastically, and may even cause the upper spring piece 433 and the lower spring piece 434 to break, affecting the use of the upper spring piece 433 and the lower spring piece 434. Therefore, the first limit portion 443 and the second limit portion 423 are provided to limit the moving distance of the connecting bracket 42 relative to the first bracket 41, so as to avoid the upper spring piece 433 and the lower spring piece 434 exceeding their own deformation range and failing to elastically or breaking, so as to ensure that the upper spring piece 433 and the lower spring piece 434 can be used normally.

[0091] exist Figures 4 to 7In the illustrated embodiment, the first limiting portion 443 may be a limiting column arranged at the opening of the second accommodating space 442, and the second limiting portion 423 may be a limiting groove arranged at the second connecting portion 422 and opening toward the first limiting portion 443, the limiting groove includes a bottom surface 4231 and a side surface 4232, and the limiting column includes a first abutting surface 4431 and a second abutting surface 4432, the first abutting surface 4431 is arranged toward the bottom surface 4231, and the second abutting surface 4432 is arranged toward the side surface 4232. When the second power component 45 drives the first bracket 41 to move relative to the second bracket 44 along the first direction, the side surface 4232 of the limiting groove can abut against the second abutting surface 4432 of the limiting column to limit the moving distance of the first bracket 41 relative to the second bracket 44; when the first power component 43 drives the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction, the bottom surface 4231 of the limiting groove abuts against the first abutting surface 4431 of the limiting column to limit the moving distance of the connecting bracket 42 relative to the first bracket 41.

[0092] In some embodiments, such as Figures 4 to 7 As shown, the camera module 100 may also include a first base 5, and the first base 5 may be arranged on the side of the elastic support structure 2 facing away from the chip assembly 3, specifically, the first base 5 may be arranged on the side of the fixing portion 21 facing away from the chip assembly 3. This is mainly because the elastic support structure 2 of the present application usually includes a hollow fixing portion 21, so that the camera module 100 cannot form a sealed structure. By providing the first base 5 and arranging the first base 5 on the side of the elastic support structure 2 facing away from the chip assembly 3, the camera module 100 is formed into a closed structure, which can not only prevent external light from entering the lens assembly 1 from the hollow portion 211 of the fixing portion 21 and affecting the imaging effect of the lens assembly 1, but also protect the chip assembly 3, the connecting bracket 42, the first bracket 41 and other components encapsulated inside from the outside world. Moreover, since the chip assembly 3 and the movable part 22 will move along the optical axis when autofocusing is performed, in order to avoid interference between the chip assembly 3 and the movable part 22 and the first base 5, the first base 5 is provided with an avoidance groove 51 opening toward the movable part 22, so that the avoidance groove 51 can be used to avoid the chip assembly 3 and the movable part 22 when the chip assembly 3 moves along the optical axis, thereby providing possibility for movement of the chip assembly 3 and the movable part 22.

[0093] As a first optional implementation, Figures 4 to 7 As shown, the filter assembly 6 can be covered on the side of the chip assembly 3 facing the lens assembly 1, so as to filter out light in other bands such as visible light and only allow infrared light to pass through, so as to improve the imaging quality and make the imaging more in line with the visual experience of the human eye.

[0094] In this embodiment, if Figures 4 to 7As shown, the filter assembly 6 may include a fixed bracket 61 and a filter 62. The fixed bracket 61 may be covered on the side of the circuit board 31 facing the lens assembly 1. The connecting bracket 42 of the power assembly 4 may be connected to the fixed bracket 61 to realize the connection between the connecting bracket 42 and the chip assembly 3. The filter 62 is arranged on the fixed bracket 61 and corresponds to the photosensitive chip 32 of the chip assembly 3.

[0095] It should be known that by limiting the distance between the power assembly 4 and the chip assembly 3 in the optical axis direction, the effective focal length, object distance and image distance of the camera module 100 can be controlled within a certain ratio to ensure the imaging quality of the camera module 100. If the connection between the connecting bracket 42 and the fixing bracket 61 is usually achieved by bonding the side of the connecting bracket 42 facing away from the lens assembly 1 to the side of the fixing bracket 61 facing the lens assembly 1, the thickness of the adhesive in the optical axis direction is uncontrollable, so that the distance between the power assembly 4 and the chip assembly 3 in the optical axis direction is also uncontrollable, and it is difficult to accurately control the distance between the power assembly 4 and the chip assembly 3 in the optical axis direction.

[0096] like Fig.10 As shown, in order to accurately control the distance between the power component 4 and the chip component 3 in the direction of the optical axis, the fixed bracket 61 includes a first part 611 and a second part 612. The first part 611 is covered on the side of the circuit board of the chip component 3 facing the lens component 1, and the second part 612 is connected to the side of the first part 611 away from the chip component 3, and in the direction perpendicular to the optical axis, the size of the second part 612 is smaller than the size of the first part 611, and the outer peripheral surface of the second part 612 is fitted and connected with the inner surface of the light channel 40, and the filter 62 is arranged on the side of the second part 612 away from the first part 611 and corresponds to the photosensitive chip 32 of the chip component 3. By limiting the fixed bracket 61 to include a second part 612 with a certain height in the optical axis direction, the inner wall surface of the light channel 40 of the connecting bracket 42 is made to fit against the outer peripheral surface of the second part 612, so that the connection between the connecting bracket 42 and the fixed bracket 61 is no longer a surface-to-surface connection in the optical axis direction, so that the position of the connecting bracket 42 on the second part 612 can be adjusted by a locking machine to adjust the relative position between the power component 4 and the chip component 3 in the optical axis direction, and to perform alignment correction, thereby accurately controlling the distance between the power component 4 and the chip component 3 in the optical axis direction.

[0097] As a second optional implementation, Fig.11As shown, the filter assembly 6 is arranged on the power assembly 4 and corresponds to the chip assembly 3. Specifically, a first accommodating groove is arranged on the side of the connecting bracket 42 of the power assembly 4 facing the lens assembly 1, and the filter assembly 6 is built in the first accommodating groove. With such a design, compared with the method of directly covering the filter assembly 6 on the circuit board 31 of the chip assembly 3, and the connecting bracket 42 of the power assembly 4 is connected to the circuit board 31 of the chip assembly 3 and surrounds the outer periphery of the filter assembly 6, it is not necessary to reserve the attachment position of the filter assembly 6 on one side of the circuit board 31 in the vertical optical axis direction, so that the size of the connecting bracket 42 in the vertical optical axis direction can be reduced accordingly, which is conducive to reducing the overall size of the power assembly 4 in the vertical optical axis direction, which meets the miniaturized design. In this embodiment, the filter assembly 6 can include only a filter, or a fixing bracket and a filter.

[0098] As a third optional implementation, Fig.12 As shown, the filter assembly 6 can be arranged on the side of the lens assembly 1 facing the chip assembly 3, specifically, a second accommodating groove is arranged on the side of the lens assembly 1 facing the chip assembly 3, and the filter assembly 6 is built in the second accommodating groove. Similarly, with such a design, compared with the method of directly covering the filter assembly 6 on the circuit board 31 of the chip assembly 3, and the connecting bracket 42 of the power assembly 4 is connected to the circuit board 31 of the chip assembly 3 and surrounds the outer periphery of the filter assembly 6, it is not necessary to reserve the attachment position of the filter assembly 6 on one side of the circuit board 31 in the vertical optical axis direction, so that the size of the connecting bracket 42 in the vertical optical axis direction can be reduced accordingly, which is conducive to reducing the overall size of the power assembly 4 in the vertical optical axis direction, which meets the miniaturized design. Similarly, in this embodiment, the filter assembly 6 can include only a filter, or a fixing bracket and a filter.

[0099] As can be seen from the foregoing, the power assembly 4 can be connected to the lens assembly 1 and is located between the lens assembly 1 and the elastic support structure 2. Since the power assembly 4 is arranged between the lens assembly 1 and the chip assembly 3, it is easy to cause a large distance between the lens assembly 1 and the chip assembly 3. In order to shorten the distance from the lens assembly 1 to the chip assembly 3, as shown in FIG. Fig.13As shown, the first bracket 41 of the power assembly 4 can be arranged on the side of the elastic support structure 2 facing away from the chip assembly 3, that is, the second bracket 44 of the power assembly 4 can be arranged on the side of the fixed part 21 of the elastic support structure 2 facing away from the chip assembly, and the connecting bracket 42 of the power assembly 4 is connected to the movable part 22 of the elastic support structure 2, so that the first power component 43 of the power assembly 4 can be used to move the movable part 22 of the elastic support structure 2 along the optical axis direction, so as to drive the chip assembly 3 to move along the optical axis direction, thereby realizing the autofocus function of the camera module 100. By arranging the power assembly 4 on the side of the elastic support structure 2 facing away from the chip assembly 3, compared with the method of arranging the power assembly 4 between the lens assembly 1 and the elastic support structure 2, the distance from the lens assembly 1 to the chip assembly 3 can be shortened, which is equivalent to reducing the image distance of the camera module 100 and making it a short back focus camera module 100; at the same time, the overall thickness of the camera module 100 in the optical axis direction can also be reduced.

[0100] exist Fig.13 In the illustrated embodiment, the second bracket 44 of the power component 4 can be connected to the fixed part 21 of the elastic support structure 2 through the third pad 102, and the connecting bracket 42 of the power component 4 is connected to the movable part 22 of the elastic support structure 2. When performing autofocus, the first power component 43 will drive the connecting bracket 42 to move relative to the first bracket 41 along the optical axis direction (z direction), so as to drive the movable part 22 of the elastic support structure 2 to move along the optical axis direction. At the same time, the chip component 3 provided on the movable part 22 will move along the optical axis direction, thereby realizing the autofocus function of the camera module 100; and when performing optical image stabilization, for example, taking the provision of x-direction compensation as an example, the second power component 45 will drive the first bracket 41, the first power component 43, and the connecting bracket 42 as a whole to move relative to the second bracket 44 along the x-direction, and at the same time, it will also drive the movable part 22 to deform along the x-direction. At the same time, the chip component 3 provided on the movable part 22 moves along the x-direction, thereby realizing the optical image stabilization function of the camera module 100.

[0101] Furthermore, if Fig.14As shown, a fourth pad 221 is provided on the side of the movable part 22 of the elastic support structure 2 facing away from the chip assembly 3, and the connecting bracket 42 of the power assembly 4 is sleeved on the outer periphery of the fourth pad 221. By extending a fourth pad 221 with a certain height on the side of the movable part 22 facing away from the chip assembly 3, and allowing the connecting bracket 42 of the power assembly 4 to be sleeved on the fourth pad 221, the connection between the connecting bracket 42 and the movable part 22 is no longer a surface-to-surface connection in the optical axis direction, so that the position of the connecting bracket 42 on the fourth pad 221 can be adjusted by a locking machine, alignment correction can be performed, and then glue is dispensed between the connecting bracket 42 and the fourth pad 221 to achieve fixation, or a threaded structure is provided between the connecting bracket 42 and the fourth pad 221 to achieve fixation by spiral connection.

[0102] From the above, it can be seen that when the power component 4 is arranged on the side of the elastic support structure 2 facing away from the chip component 3, the second bracket 44 of the power component 4 is connected to the fixed part 21 of the elastic support structure 2, and the connecting bracket 42 of the power component 4 is connected to the movable part 22 of the elastic support structure 2. Considering that when the connecting bracket 42 is assembled with the movable part 22, the position of the movable part 22 plate and the connecting bracket 42 will be offset. If the position of the movable part 22 is offset, the movable space of the movable part 22 will be compressed, thereby affecting the movement of the chip component 3; if the position of the connecting bracket 42 is offset, the center position of the power component 4 will be offset, which may affect the drive of the power component 4 and affect the movement of the chip component 3. In addition, considering that the camera module 100 is blocked from top and bottom after assembly, and the position offset of the connecting bracket 42 and the movable part 22 cannot be detected, a detection window 46 is provided on the side of the power component 4 facing away from the elastic support structure 2, and specifically, the second bracket 44 of the power component 4 is provided with the detection window 46. The detection window 46 can be used to detect the position offset of the connecting bracket 42 of the power component 4 and the movable part 22 of the elastic support structure 2.

[0103] By setting a detection window 46 on the side of the power component 4 facing away from the elastic support structure 2, it is possible to detect through the detection window 46 whether the positions of the movable part 22 of the elastic support structure 2 and the connecting bracket 42 of the power component 4 are offset, thereby ensuring that the assembled movable part 22 and the connecting bracket 42 are in the correct position, so as to ensure the movement of the chip component 3, thereby ensuring the focusing effect and the optical image stabilization effect.

[0104] Furthermore, if Fig.14As shown, the camera module 100 may further include a second base 7, and the second base 7 may be sealed on the detection window 46. Since the second bracket 44 of the power assembly 4 has the detection window 46, the camera module 100 cannot be formed into a sealed structure. By providing the second base 7 to cover the detection window 46 on the second bracket 44, the camera module 100 is formed into a closed structure, which can not only prevent external light from entering the lens assembly 1 from the detection window 46 and affecting the imaging effect of the lens assembly 1, but also protect the chip assembly 3, the connecting bracket 42 or the first bracket 41 and other components encapsulated inside from the outside world.

[0105] As an optional implementation, Fig.15 As shown, the fixed portion 21 is a hollow structure, that is, the fixed portion 21 includes a hollow portion 211, and the movable portion 22 may be multiple, and the multiple movable portions 22 are arranged at intervals and located in the hollow portion 211; and the elastic support structure 2 may also include a connecting portion 23 and a plurality of spiral flexible connecting belts 24, the connecting portion 23 is located in the hollow portion 211, and the multiple flexible connecting belts 24 are arranged at intervals and located in the hollow portion 211, and the multiple flexible connecting belts 24 are all fixed and electrically connected to the connecting portion 23, and each flexible connecting belt 24 extends spirally in the same direction around the connecting portion 23. Among the multiple flexible connection belts 24, one end of a part of the flexible connection belts 24 away from the connection part 23 has a first connection end 241, and one end of another part of the flexible connection belts 24 away from the connection part 23 has a second connection end 242, the first connection end 241 is electrically connected to the fixed part 21, each movable part 22 is respectively provided at the corresponding second connection end 242 and electrically connected to the corresponding second connection end 242, and the chip assembly 3 is provided at each movable part 22 and electrically connected to each movable part 22. By providing the connection part 23 and limiting the multiple flexible connection belts 24 to be electrically connected to the connection part 23, electrical conduction between the multiple flexible connection belts 24 is achieved, so that the electrical connection between the chip assembly 3 and the external circuit can be achieved through the fixed part 21, the movable part 22, the connection part 23 and the flexible connection belts 24.

[0106] Moreover, by using a plurality of flexible connecting strips 24 to realize the connection between the movable part 22 and the fixed part 21, the flexible connecting strip 24 can be in the shape of a strip without affecting the electrical connection and conduction of the chip assembly 3 while ensuring that the amount of wiring remains unchanged. The flexible connecting strip 24 only needs to overcome a small material stress to bend and deform when subjected to force, so that the chip assembly 3 is subjected to less resistance when moving; and the flexible connecting strip 24 is spirally extended, and has a certain amount of redundancy relative to the linear strip structure. When the chip assembly 3 moves, it only needs to overcome a small material stress to bend and deform, which is conducive to reducing the resistance that needs to be overcome when the flexible connecting strip 24 is deformed, so that the chip assembly 3 is subjected to less resistance when moving. In other words, when performing autofocus and optical image stabilization, the resistance of the photosensitive chip 32 during movement can be reduced, which is conducive to improving the response speed of autofocus and optical image stabilization, and facilitating autofocus and optical image stabilization.

[0107] As another optional implementation, Fig.16 As shown, the fixed part 21 is a hollow structure, that is, the fixed part 21 includes a hollow part 211, and there may be multiple movable parts 22, and the multiple movable parts 22 are arranged at intervals and located in the hollow part 211; and the elastic support structure 2 may also include multiple spiral flexible connecting belts 24, and the multiple flexible connecting belts 24 are independently arranged and located in the hollow part 211, and each flexible connecting belt 24 has a first connecting end 241 and a second connecting end 242, the first connecting end 241 is electrically connected to the fixed part 21, and each movable part 22 is arranged at the corresponding second connecting end 242 and is electrically connected to the corresponding second connecting end 242, and the chip component 3 is arranged at each movable part 22 and is electrically connected to each movable part 22, so that the electrical connection between the chip component 3 and the external circuit can be achieved through the fixed part 21, the movable part 22 and the flexible connecting belt 24.

[0108] By arranging a plurality of flexible connecting belts 24 relatively independently, that is, the flexible connecting belts 24 are disconnected from each other and arranged at intervals, in this way, during the process of each flexible connecting belt 24 being stretched and deformed under force, the restraining effect between the flexible connecting belts 24 can be reduced to avoid mutual interference during deformation, so that each flexible connecting belt 24 is more easily stretched and deformed, so as to further reduce the resistance encountered by the chip component 3 during movement, thereby further improving the response speed of autofocus and optical image stabilization, and making autofocus and optical image stabilization more convenient.

[0109] In some embodiments, such as Fig.17 As shown, at least one flexible connecting belt 24 includes a plurality of sub-flexible connecting belts 24a. Fig.17 and Fig.18In the illustrated embodiment, each flexible connection belt 24 includes a plurality of sub-flexible connection belts 24a, and the plurality of sub-flexible connection belts 24a are arranged at intervals in a direction perpendicular to the optical axis. This is equivalent to decomposing a single wide flexible connection belt 24 into a plurality of thinner sub-flexible connection belts 24a, so that the elastic modulus of the flexible connection belt 24 can be reduced while ensuring that the amount of wiring remains unchanged, and the softness of the flexible connection belt 24 can be improved, and the deformation resistance can be reduced, so that the flexible connection belt 24 is more easily stretched and deformed, and the resistance to the chip assembly 3 during movement can be reduced, thereby improving the response speed of autofocus and optical image stabilization to ensure the focusing effect and optical image stabilization effect.

[0110] In some embodiments, such as Figures 14 to 17 As shown, the chip component 3 and / or the movable part 22 are provided with a first pad 8, so that the chip component 3 and the movable part 22 can be connected through the first pad 8. This is mainly due to the following considerations: if the chip component 3 is directly stacked on the movable part 22, the chip component 3 will be in contact with the flexible connecting belt 24. When the chip component 3 moves for optical image stabilization, there will be relative movement and friction between the chip component 3 and the flexible connecting belt 24, which is not conducive to the deformation of the flexible connecting belt 24, resulting in an increase in the resistance encountered by the chip component 3 during movement. Therefore, by providing the first pad 8 between the chip component 3 and the movable part 22, a gap can be provided between the chip component 3 and the flexible connecting belt 24 to avoid friction between the chip component 3 and the flexible connecting belt 24, making the flexible connecting belt 24 more easily stretched and deformed, thereby reducing the resistance encountered by the chip component 3 during movement, thereby improving the response speed of optical image stabilization to ensure the optical image stabilization effect.

[0111] See also Fig.19 The present invention discloses an electronic device, wherein the electronic device 200 has the camera module 100 as described in the above embodiment. Specifically, Fig.19As shown, the electronic device 200 may include a housing 201 and the aforementioned camera module 100, a mainboard is provided in the housing 201, and the camera module 100 is provided in the housing 201 and electrically connected to the mainboard in the housing 201, so that the electronic device 200 has a camera function. Among them, the electronic device 200 may be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a smart watch, a monitor, etc. It can be understood that the electronic device 200 having the camera module 100 described in the aforementioned embodiment also has all the technical effects of the camera module 100 described in the aforementioned embodiment. That is, the electronic device 200 having the camera module 100 can drive the chip component to move along the optical axis direction to perform automatic focusing of the camera module 100, and the requirements for the load-bearing and driving force of the power component are relatively low. The power component with a smaller outer size can drive the chip component to move along the optical axis direction to realize the automatic focusing function of the camera module 100, which is conducive to reducing the overall size of the camera module 100 to realize the miniaturized design of the camera module 100.

[0112] A camera module and an electronic device disclosed in an embodiment of the present invention are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the camera module and the electronic device of the present invention and their core ideas. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A camera module, characterized in that: include: Lens assembly; An elastic support structure, wherein the elastic support structure is arranged on the image side of the lens assembly; A chip assembly, the chip assembly is arranged on the elastic support structure and located between the elastic support structure and the lens assembly, and the chip assembly is also electrically connected to the elastic support structure; A power assembly, the power assembly is located on the image side of the lens assembly, the power assembly is connected to the elastic support structure and / or the chip assembly, and the power assembly is used to move the chip assembly along the optical axis direction of the lens assembly to achieve automatic focusing; The elastic support structure includes a fixed part and a movable part electrically connected to the fixed part, the chip component is arranged on the movable part and electrically connected to the movable part, and the power component includes: A first bracket, the first bracket is connected to the lens assembly and / or the fixing portion, the first bracket has a first hollow portion with an opening toward the chip assembly and a first accommodating space with an opening toward the optical axis, and the first accommodating space is in communication with the first hollow portion; A connecting bracket, the connecting bracket is connected to the chip assembly and / or the movable part, the connecting bracket is located in the first hollow part, and the connecting bracket is at least partially passed through the opening of the first hollow part to be connected to the chip assembly and / or the movable part; a second bracket, the second bracket being connected to the lens assembly and / or the fixed portion, the second bracket having a second hollow portion with an opening facing the chip assembly and a second accommodating space with an opening facing the optical axis, the second accommodating space being communicated with the second hollow portion, the first bracket being arranged in the second accommodating space, the opening of the second hollow portion being arranged corresponding to the opening of the first hollow portion, and the connecting bracket at least partially being sequentially arranged outside the opening of the first hollow portion and the opening of the second hollow portion to be connected to the chip assembly and / or the movable portion; a first power component, the first power component is located in the first accommodating space to be connected to the inner wall surface of the first bracket, and at least another part of the connecting bracket extends into the first accommodating space to be connected to the first power component, and the first power component is used to drive the connecting bracket to move relative to the first bracket along the optical axis direction, so that the chip assembly moves along the optical axis direction; and The second power component is located in the second accommodating space, and the second power component is connected to the outer wall surface of the first bracket, and the second power component is connected to the inner wall surface of the second bracket. The second power component is used to drive the first bracket and the connecting bracket to move, so as to drive the chip assembly to move for optical image stabilization.

2. The camera module according to claim 1, characterized in that: The first power component includes a first coil, a first magnetic part, an upper spring sheet and a lower spring sheet, the first coil and the first magnetic part are spaced apart in a direction perpendicular to the optical axis, the first coil is arranged on the first bracket and located in the first accommodating space, the first magnetic part is arranged on the connecting bracket and located in the first accommodating space, the upper spring sheet is connected to the upper side of the first bracket and the upper side of the connecting bracket and is located in the first accommodating space, the lower spring sheet is connected to the lower side of the first bracket and the lower side of the connecting bracket and is located in the first accommodating space; or The first power component includes a piezoelectric component and a connecting component, the piezoelectric component is arranged on the lower side or the upper side of the first bracket, and the piezoelectric component is located in the first accommodating space, the connecting component is connected to the piezoelectric component and the lower side or the upper side of the connecting bracket, and the connecting component is located in the first accommodating space; The upper side of the first bracket is the side of the first bracket close to the lens assembly, the lower side of the first bracket is the side of the first bracket away from the lens assembly, the upper side of the connecting bracket is the side of the connecting bracket close to the lens assembly, and the lower side of the connecting bracket is the side of the connecting bracket away from the lens assembly.

3. The camera module according to claim 1, characterized in that: A first limiting portion is extended at the opening of the second accommodating space along the optical axis direction, and a second limiting portion is provided on the connecting bracket at a position corresponding to the first limiting portion; When the second power component drives the first bracket to move relative to the second bracket along a first direction, the second limiting portion can abut against the first limiting portion to limit the moving distance of the first bracket relative to the second bracket, wherein the first direction is perpendicular to the optical axis direction; When the first power component drives the connecting bracket to move relative to the first bracket along the optical axis direction, the second limiting portion can also abut against the first limiting portion to limit the moving distance of the connecting bracket relative to the first bracket.

4. The camera module according to any one of claims 1 to 3, characterized in that: The chip assembly and / or the movable part is provided with a first pad, and the chip assembly and the movable part are connected via the first pad.

5. The camera module according to any one of claims 1 to 3, characterized in that: The first bracket of the power component is arranged on the side of the fixed part facing away from the chip component, the connecting bracket of the power component is connected to the movable part, and the first power component of the power component is used to move the movable part along the optical axis to drive the chip component to move along the optical axis to achieve automatic focusing.

6. The camera module according to any one of claims 1 to 3, characterized in that: The power assembly is connected to the lens assembly and is located between the lens assembly and the elastic support structure. The power assembly has a light channel corresponding to the chip assembly. The power assembly is also connected to the elastic support structure and / or the chip assembly. The power assembly is used to move the chip assembly along the optical axis to achieve automatic focusing.

7. The camera module according to claim 6, characterized in that: The camera module also includes a first base, which is arranged on the side of the elastic support structure facing away from the chip assembly, and the first base is provided with an avoidance groove opening toward the elastic support structure, and the avoidance groove is used to avoid the chip assembly when the chip assembly moves along the optical axis direction.

8. The camera module according to claim 6, characterized in that: The camera module also includes a filter assembly, and the filter assembly cover is arranged on the side of the chip assembly facing the lens assembly, and the chip assembly is connected to the power assembly through the filter assembly, or the filter assembly is arranged on the side of the lens assembly facing the chip assembly and is arranged corresponding to the chip assembly, or the filter assembly is arranged on the power assembly and is arranged corresponding to the chip assembly.

9. The camera module according to claim 8, characterized in that: The filter assembly comprises: A fixing bracket, the fixing bracket comprising a first part and a second part, the first part covering a side of the chip assembly facing the lens assembly, the second part connected to a side of the first part away from the chip assembly, and in a direction perpendicular to the optical axis, the size of the second part is smaller than that of the first part, and the outer peripheral surface of the second part is in close contact with the inner surface of the light channel; and A filter is arranged on a side of the second part away from the first part and corresponding to the chip component.

10. An electronic device, characterized in that: The electronic device has a camera module as described in any one of claims 1-9.

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