Pixel structure, touch panel, display panel and preparation method

Abstract

The present invention relates to a pixel structure, a touch panel, a display panel and a preparation method. A pixel structure comprises: a plurality of repeating units arranged in an array. The repeating unit comprises at least one sub-pixel and a touch feedback structure. The touch feedback structure comprises: a light sensor and a functional unit. The light sensor is used to collect a touch feedback signal, which is a reflected light signal formed after the light signal emitted by the sub-pixel is reflected by a finger. The functional unit is connected to the light sensor and is used to elastically deform along a first direction under the control of the light sensor, and the first direction is a direction close to the finger. The above-mentioned pixel structure has a touch feedback function, which can improve the user experience.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a pixel structure, a touch panel, a display panel and a preparation method thereof. Background Art

[0002] Light Emitting Diode (LED) can be widely used in display devices due to its advantages such as high brightness, wide dynamic range, long service life, and stability and reliability.

[0003] With the rapid development of LED display technology, in addition to requiring LED display devices to have higher resolutions, LED display devices are also required to have some auxiliary functions. For example, a touch panel is set in the LED display device, which can add touch functions to facilitate users to perform corresponding operations without a mouse or remote control.

[0004] However, when the user touches the corresponding position of the touch panel, the touch panel may not respond in time (for example, it may take several seconds to jump to the corresponding interface). In this way, the user does not know whether he has completed the touch operation, and is prone to repeated clicks, thereby reducing the user experience.

[0005] Therefore, how to improve the user experience of LED display devices is an urgent problem to be solved. Summary of the invention

[0006] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a pixel structure, a touch panel, a display panel and a preparation method, aiming to solve the problem of how to improve the user experience of LED display devices.

[0007] A pixel structure includes: a plurality of repeating units arranged in an array. The repeating unit includes at least one sub-pixel and a touch feedback structure. The touch feedback structure includes: a light sensor and a functional part.

[0008] The light sensor is used to collect touch feedback signals, which are reflected light signals formed after the light signals emitted by the sub-pixels are reflected by the fingers.

[0009] The functional part is connected to the light sensor and is used for elastically deforming along a first direction under the control of the light sensor. The first direction is a direction close to the finger.

[0010] In the above-mentioned pixel structure, the light sensor and the functional part respectively form a repeating unit with the sub-pixel for repeated arrangement. Based on this, for the touch panel and display device using this pixel structure, when the user touches the touch panel with a finger, the finger can reflect the light signal (i.e., the touch feedback signal) emitted by the sub-pixel to the light sensor, so that the light sensor controls the elastic deformation of the functional part according to the touch feedback signal, such as forming a protrusion or depression in the direction close to the finger. In this way, the user can sense the elastic deformation of the functional part through the finger to obtain touch feedback. In this way, the user can obtain an effective sense of touch through the touch feedback to know that he has completed the touch operation, and will not click repeatedly in a short time, causing the display device to respond frequently. Thereby, it is beneficial to improve the user experience and extend the service life of the display device.

[0011] Optionally, the optical sensor is multiplexed into a touch sensor. The touch sensor is configured to generate a touch sensing signal in response to a touch operation of a finger.

[0012] In the above pixel structure, the light sensor can be reused as a touch sensor, so that the touch function and the touch feedback function can be realized simultaneously by using the same component. This can simplify the structure of the touch panel to avoid redundant components in the display device, thereby making the display device lighter and thinner.

[0013] Optionally, the light sensor includes a first pad and a second pad. The functional portion includes: a first conductive layer, a piezoelectric layer, and a second conductive layer stacked in layers. The first conductive layer is connected to the first pad, and the second conductive layer is connected to the second pad; the piezoelectric layer is configured to expand in response to an electrical signal transmitted from the light sensor to the first conductive layer and the second conductive layer to form a protrusion.

[0014] In the above pixel structure, the functional part is composed of the first conductive layer, the piezoelectric layer and the second conductive layer which are stacked. The structure is simple and easy to prepare, which is beneficial to improving the production efficiency while ensuring the touch feedback performance.

[0015] Based on the same inventive concept, the embodiment of the present application further provides a touch panel, which includes: a driving backplane and a pixel structure in some of the aforementioned embodiments arranged on the driving backplane. The technical effects that can be achieved by the pixel structure in some of the aforementioned embodiments can also be achieved by the touch panel, which will not be described in detail here.

[0016] Optionally, the sub-pixel includes a light emitting device, and the thickness of the functional portion is greater than the thickness of the light emitting device and greater than the thickness of the light sensor.

[0017] In the above touch panel, the thickness of the functional part is greater than the thickness of the light emitting device and the light sensor. In this way, when a finger touches the touch panel, the elastic deformation of the functional part can be clearly shown on the touch surface, so that the user can feel the elastic deformation of the functional part through the finger. This is conducive to the touch panel to better realize the touch feedback function.

[0018] Optionally, the functional part includes: a first conductive layer, a piezoelectric layer and a second conductive layer which are stacked. The second conductive layer is located on a side of the first conductive layer away from the driving backplane. The light sensor includes a first pad and a second pad. The touch panel also includes: a first conductive wire and a conductive sheet. The first conductive wire is arranged inside the driving backplane. Two ends of the first conductive wire are respectively connected to the first conductive layer and the first pad. The conductive sheet is arranged outside the driving backplane. Two ends of the conductive sheet are respectively connected to the second conductive layer and the second pad.

[0019] In the above touch panel, based on the structure of the light sensor and the functional part, a first conductive line is preset in the driving backplane, which is convenient for first preparing or connecting the functional part to the driving backplane, and then connecting the functional part and the light sensor by using the conductive sheet arranged outside the driving backplane, and then connecting the light sensor to the driving backplane. This is conducive to designing the preparation process of the touch panel to improve the production efficiency of the touch panel.

[0020] Optionally, the functional part includes: a first conductive layer, a piezoelectric layer and a second conductive layer which are stacked. The second conductive layer is located on a side of the first conductive layer away from the driving backplane. The sub-pixel includes a light emitting device, and the light emitting device includes a first electrode and a second electrode. The touch panel also includes: a first conductive line and a second conductive line.

[0021] The first conductive line includes: a first main line and a first auxiliary line interconnected with each other. The first main line is arranged in the driving backplane and connected to the first conductive layer. The first auxiliary line is located on the surface of the driving backplane, and one end of the first auxiliary line away from the first main line is connected to the first electrode.

[0022] The second conductive line includes: an interconnected second main line and a second auxiliary line. The second main line is arranged in the driving backplane and connected to the second electrode. The second auxiliary line is located outside the driving backplane, and one end of the second auxiliary line away from the second main line is connected to the second conductive layer.

[0023] Furthermore, before the electrical property test of the light emitting device is performed before packaging, the first auxiliary line is a passage, and the functional part is further configured to generate current under pressure and conduct the light emitting device to perform the electrical property test of the light emitting device before packaging. After the electrical property test of the light emitting device is performed before packaging, the first auxiliary line is an open circuit.

[0024] Optionally, the light sensor includes a first pad and a second pad; the first pad is connected to an end of the first auxiliary line close to the first main line. The touch panel also includes a conductive sheet. The conductive sheet is arranged outside the driving backplane. The second pad is connected to the second conductive layer through the conductive sheet.

[0025] In the above touch panel, the light-emitting device and the functional part are connected, specifically: the first main line and the first auxiliary line in the first conductive line are used to realize the connection between the first electrode of the light-emitting device and the first conductive layer of the functional part, and the second main line and the second auxiliary line in the second conductive line are used to realize the connection between the second electrode of the light-emitting device and the second conductive layer of the functional part. In this way, before the light-emitting device is packaged, for example, before the solder corresponding to the light-emitting device is solidified, the functional part generates current under pressure and turns on the light-emitting device, so as to perform electrical detection on the light-emitting device. In this way, the damaged light-emitting device can be replaced in time during the preparation process of the touch panel, and the transfer yield of the light-emitting device can be improved, so as to improve the reliability of the touch panel.

[0026] Furthermore, the first auxiliary line is located on the surface of the driving backplane, which is convenient for cutting off the first auxiliary line after the electrical property test before packaging the light-emitting device, even if the first auxiliary line is open. In this way, in the prepared touch panel, the connection between the light-emitting device and the functional part is disconnected. The light-emitting device emits light according to the driving signal of the driving backplane. The functional part is only used to connect with the light sensor to realize the touch feedback function of the touch panel.

[0027] Optionally, the touch panel further includes: an encapsulation adhesive layer covering the sub-pixels, the light sensors and the functional parts respectively.

[0028] In the above touch panel, the encapsulation adhesive layer covers the sub-pixels, the light sensor and the functional part respectively, and the sub-pixels, the light sensor and the functional part can be encapsulated simultaneously to effectively isolate them from water and oxygen corrosion.

[0029] Based on the same inventive concept, the present application also provides a method for preparing a touch panel, which is used to prepare the touch panels in some of the aforementioned embodiments. The method for preparing the touch panel can also achieve the technical effects that the touch panels in some of the aforementioned embodiments can achieve, and will not be described in detail here.

[0030] The method for preparing a touch panel includes: providing a driving backplane; docking a functional part and a light sensor on one side of the driving backplane, and connecting the functional part to the light sensor. The light sensor is used to collect a touch feedback signal, which is a reflected light signal formed by a light signal emitted by a sub-pixel after being reflected by a finger. The functional part is used to undergo elastic deformation along a first direction under the control of the light sensor, and the first direction is a direction close to the finger.

[0031] Optionally, the light sensor includes a first pad and a second pad. The functional part includes a first conductive layer, a piezoelectric layer and a second conductive layer which are stacked. A first conductive line is arranged in the driving backplane.

[0032] The functional part and the light sensor are respectively docked on one side of the driving backplane, and the functional part is connected to the light sensor, including the following steps.

[0033] The functional part is docked on one side of the driving backplane, and the first conductive layer is connected to the first end of the first conductive line.

[0034] A conductive sheet is provided, and a first end of the conductive sheet is connected to the second conductive layer.

[0035] The light sensor is docked on the same side of the driving backplane docking functional part, and the first pad is connected to the second end of the first conductive line, and the second pad is connected to the second end of the conductive sheet.

[0036] Optionally, the light sensor includes a first pad and a second pad. The functional part includes a first conductive layer, a piezoelectric layer and a second conductive layer which are stacked. A first main line and a second main line are respectively arranged in the driving backplane; and a first auxiliary line interconnected with the first main line is arranged on the surface of the driving backplane.

[0037] The functional part and the light sensor are respectively docked on one side of the driving backplane, and the functional part is connected to the light sensor, including the following steps.

[0038] A docking functional part is connected on one side of the driving backplane, and the first conductive layer is connected to an end of the first main line away from the first auxiliary line. A conductive sheet is provided, and the first end of the conductive sheet is connected to the second conductive layer. A light sensor is docked on the same side of the driving backplane as the docking functional part, and the first soldering pad is connected to an end of the first auxiliary line close to the first main line, and the second soldering pad is connected to the second end of the conductive sheet. A second auxiliary line is provided, and the two ends of the second auxiliary line are respectively connected to the second conductive layer and the second main line. Among them, the end of the first auxiliary line away from the first main line is used to dock the first electrode of the light-emitting device, and the end of the second main line away from the second auxiliary line is used to dock the second electrode of the light-emitting device.

[0039] Optionally, the method for preparing the touch panel further includes the following steps.

[0040] A transfer substrate prepared with a plurality of light emitting devices is provided.

[0041] The transfer substrate is butted with the driving backplane so that the first electrode of the light-emitting device is butted with an end of the first auxiliary line away from the first main line, and the second electrode of the light-emitting device is butted with an end of the second main line away from the second auxiliary line.

[0042] Pressure is applied to the transfer substrate from a side of the transfer substrate away from the driving backplane, and the functional part is used to generate current and turn on the light-emitting device under the action of the pressure.

[0043] The light emitting device is electrically tested according to the conducting state of the light emitting device to determine the position of the damaged light emitting device on the driving backplane.

[0044] The transfer substrate is removed and the damaged light emitting device is replaced.

[0045] Cut the first auxiliary wire.

[0046] In the above touch panel manufacturing method, after the transfer substrate is docked with the driving backplane, pressure can be applied to the transfer substrate so that the functional part generates current under the pressure and turns on the light-emitting device. In this way, the functional part can be reused to perform electrical testing on the light-emitting device before packaging, so as to timely identify and replace the damaged light-emitting device, thereby improving the transfer yield of the light-emitting device.

[0047] Furthermore, the first auxiliary line is located on the surface of the driving backplane, which is convenient for cutting off the first auxiliary line after the electrical property test before packaging the light-emitting device, even if the first auxiliary line is open. In this way, in the prepared touch panel, the connection between the light-emitting device and the functional part is disconnected. The light-emitting device emits light according to the driving signal of the driving backplane. The functional part is only used to connect with the light sensor to realize the touch feedback function of the touch panel.

[0048] Optionally, the first electrode of the light-emitting device is connected to an end of the first auxiliary line away from the first main line, and the second electrode of the light-emitting device is connected to an end of the second main line away from the second auxiliary line, including: welding the first electrode of the light-emitting device to an end of the first auxiliary line away from the first main line through solder, and welding the second electrode of the light-emitting device to an end of the second main line away from the second auxiliary line through solder.

[0049] Accordingly, electrical testing of the light emitting device according to the conduction state of the light emitting device and replacement of the damaged light emitting device are all performed before the solder solidifies.

[0050] In the above touch panel manufacturing method, the electrical property test of the light emitting device before packaging can be performed before the solder of the corresponding light emitting device is solidified. At this time, the damaged light emitting device can be identified and replaced in time according to the conduction state of the light emitting device. In this way, there is no need to remove the solder before replacing the damaged light emitting device, which is conducive to improving the transfer yield of the light emitting device, simplifying the manufacturing process of the touch panel and improving the production efficiency of the touch panel.

[0051] Based on the same inventive concept, an embodiment of the present application also provides a display panel. The display panel includes: a driving backplane, a light-emitting device, and a functional unit. The driving backplane is provided with an electrical detection circuit. The light-emitting device is arranged on the driving backplane. The functional unit is arranged beside the light-emitting device and connected to the light-emitting device through the electrical detection circuit. The functional unit is used to generate current under pressure and turn on the light-emitting device. Moreover, before the electrical detection of the light-emitting device before packaging, the electrical detection circuit is a pass circuit. After the electrical detection of the light-emitting device before packaging, the electrical detection circuit is an open circuit.

[0052] In the above display panel, before the electrical property test of the light emitting device before packaging, the electrical property test circuit is a path, and at this time, by applying pressure to the functional part, the functional part generates current under the action of pressure to conduct the light emitting device connected thereto. In this way, the damaged light emitting device can be found and removed in time according to the conduction state of the light emitting device, thereby improving the transfer yield of the light emitting device and further improving the reliability of the display panel.

[0053] Furthermore, after the electrical detection of the light emitting device before packaging, the electrical detection circuit is open. That is, in the prepared display panel, the electrical detection circuit between the light emitting device and the functional part is disconnected. The light emitting device can emit light according to the driving signal of the driving backplane.

[0054] Optionally, the functional part includes: a first conductive layer, a piezoelectric layer, and a second conductive layer which are stacked in sequence in a direction away from the driving back plate.

[0055] Optionally, the light emitting device includes a first electrode and a second electrode. The electrical property detection circuit includes: a first conductive line and a second conductive line.

[0056] The first conductive line includes: a first main line and a first auxiliary line interconnected with each other. The first main line is arranged in the driving backplane and connected to the first conductive layer. The first auxiliary line is located on the surface of the driving backplane, and one end of the first auxiliary line away from the first main line is connected to the first electrode.

[0057] The second conductive line includes: an interconnected second main line and a second auxiliary line. The second main line is arranged inside the driving backplane and connected to the second electrode. The second auxiliary line is located outside the driving backplane, and one end of the second auxiliary line away from the second main line is connected to the second conductive layer.

[0058] Furthermore, after the electrical property test is performed on the light emitting device before packaging, at least one of the first auxiliary line and the second auxiliary line is open.

[0059] In the above display panel, the electrical property detection circuit adopts the above structure, which is convenient for first preparing or connecting the functional part to the first main line of the driving backplane, and then connecting the functional part and the second main line by using the second auxiliary line arranged outside the driving backplane, and then connecting the light-emitting device to the second main line and the first auxiliary line respectively. This is conducive to designing the preparation process of the display panel to improve the production efficiency of the display panel.

[0060] In addition, the first auxiliary line and the second auxiliary line are arranged outside the driving backplane, so that at least one of the first auxiliary line or the second auxiliary line can be cut off after the electrical property detection of the light-emitting device before packaging. In this way, in the prepared display panel, the electrical property detection circuit between the light-emitting device and the functional part is disconnected. The light-emitting device can emit light according to the driving signal of the driving backplane.

[0061] Optionally, the display panel further includes: a light sensor. The light sensor is disposed beside the light emitting device and is used to collect a touch feedback signal. The touch feedback signal is a reflected light signal formed after the light signal emitted by the light emitting device is reflected by the finger. The functional part is also connected to the light sensor, and the functional part is also used to elastically deform along a first direction under the control of the light sensor; the first direction is a direction close to the finger.

[0062] In the above-mentioned display panel, a light sensor connected to the functional part is arranged beside the light-emitting device. In this way, when the user touches the display panel with a finger, the finger can reflect the light signal (i.e., the touch feedback signal) emitted by the light-emitting device to the light sensor, so that the light sensor controls the elastic deformation of the functional part according to the touch feedback signal, such as forming a protrusion or depression in the direction close to the finger. In this way, the user can sense the elastic deformation of the functional part through the finger to obtain touch feedback. In this way, the user can obtain an effective touch through the touch feedback to know that he has completed the touch operation, and will not click repeatedly in a short time, causing the display device to respond frequently. This is conducive to improving the user experience and extending the service life of the display device.

[0063] Based on the same inventive concept, the present application also provides a method for preparing a display panel, which is used to prepare the display panels in some of the aforementioned embodiments. The display panel in some of the aforementioned embodiments can also achieve the technical effects achieved by the display panel preparation method, which will not be described in detail here.

[0064] The method for preparing a display panel includes the following steps.

[0065] A driving backplane is provided, wherein a first main line and a second main line are arranged inside the driving backplane, and a first auxiliary line connected to the first main line is arranged on the surface of the driving backplane.

[0066] A first conductive layer, a piezoelectric layer and a second conductive layer are sequentially stacked on one side of the driving back plate; the first conductive layer is connected to the first main line.

[0067] A second auxiliary line is provided, and two ends of the second auxiliary line are respectively connected to the second conductive layer and the second main line.

[0068] The transfer substrate prepared with the light-emitting device is butted against the driving backplane, so that the first electrode of the light-emitting device is connected to an end of the first auxiliary line away from the first main line, and the second electrode of the light-emitting device is connected to the second main line.

[0069] Pressure is applied to the transfer substrate from the side of the transfer substrate away from the driving back plate, and the piezoelectric layer generates current under the action of the pressure and turns on the light-emitting device.

[0070] The light emitting device is electrically tested according to the conducting state of the light emitting device to determine the position of the damaged light emitting device on the driving backplane.

[0071] The transfer substrate is removed and the damaged light emitting device is replaced.

[0072] Cut the first auxiliary line or the second auxiliary line.

[0073] In the above-mentioned method for manufacturing a display panel, after the light-emitting device and the driving backplane are connected by using a transfer substrate, pressure can be applied to the transfer substrate so that the piezoelectric layer generates current under the action of pressure and turns on the light-emitting device. In this way, electrical properties of the light-emitting device can be tested before packaging, and damaged light-emitting devices can be identified and replaced in time, thereby improving the transfer yield of the light-emitting device.

[0074] Furthermore, the first auxiliary line is located on the surface of the driving backplane, and the second auxiliary line is arranged outside the driving backplane. This facilitates cutting off at least one of the first auxiliary line or the second auxiliary line after electrical testing of the light-emitting device before packaging. In this way, in the prepared display panel, the connection between the light-emitting device and the functional part is disconnected. The light-emitting device can emit light according to the driving signal of the driving backplane.

[0075] Optionally, the transfer substrate on which the light-emitting device is prepared has a boss, and the light-emitting device is prepared on the boss. The first conductive layer, the piezoelectric layer and the second conductive layer together constitute the functional part. The sum of the thickness of the boss and the light-emitting device is equal to the thickness of the functional part.

[0076] In the above-mentioned method for manufacturing a display panel, the transfer substrate has a boss, and the light-emitting device is manufactured on the boss. Based on this, the sum of the thickness of the boss and the light-emitting device is equal to the thickness of the functional part, and the transfer substrate and the driving backplane can be brought into surface contact with each other after the transfer substrate and the driving backplane are connected. In this way, it is convenient to uniformly pressurize the functional part to generate current, and it is also easy to avoid damage to the functional layer and the light-emitting device due to excessive pressure.

[0077] Optionally, the transfer substrate prepared with the light-emitting device is connected to the driving backplane, including: soldering the first electrode of the light-emitting device to the end of the first auxiliary line away from the first main line, and soldering the second electrode of the light-emitting device to the second main line.

[0078] Accordingly, electrical testing of the light emitting device according to the conduction state of the light emitting device and replacement of the damaged light emitting device are all performed before the solder solidifies.

[0079] In the above-mentioned method for manufacturing the display panel, the electrical property test of the light-emitting device before packaging can be performed before the solder for soldering the corresponding light-emitting device has solidified. At this time, the damaged light-emitting device can be identified and replaced in time according to the conduction state of the light-emitting device. In this way, there is no need to remove the solder before replacing the damaged light-emitting device, which is conducive to improving the transfer yield of the light-emitting device, simplifying the manufacturing process of the display panel and improving the production efficiency of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] Figure 1 A schematic top view of a touch panel provided by an embodiment;

[0081] Figure 2 A cross-sectional schematic diagram of the connection relationship between an LED chip and a driving backplane provided by an embodiment;

[0082] Figure 3 A schematic top view of a repeating unit provided by an embodiment;

[0083] Figure 4 A cross-sectional schematic diagram of another connection relationship between an LED chip and a driving backplane provided by an embodiment;

[0084] Figure 5 An embodiment provides Figure 1 A schematic cross-sectional view of the middle touch panel along the II' direction;

[0085] Figure 6 A schematic cross-sectional view of a touch panel structure after protrusions are formed according to an embodiment;

[0086] Figure 7 A cross-sectional schematic diagram of another touch panel provided by an embodiment;

[0087] Figure 8 A cross-sectional schematic diagram of another touch panel provided by an embodiment;

[0088] Fig. 9 A schematic diagram of a process for preparing a touch panel provided by an embodiment;

[0089] Fig.10A schematic flow chart of another method for preparing a touch panel provided by an embodiment;

[0090] Fig.11 A schematic diagram of the flow of each step in steps S1211 to S1213 provided in an embodiment;

[0091] Fig.12 A schematic cross-sectional view of a structure obtained in steps S1211 to S1213 provided in an embodiment;

[0092] FIG13( a ) is a cross-sectional schematic diagram of a structure obtained in step S131 according to an embodiment;

[0093] FIG13( b ) is a cross-sectional schematic diagram of a structure obtained in step S132 according to an embodiment;

[0094] FIG13( c ) is a cross-sectional schematic diagram of a structure obtained in step S133 and step S134 provided in an embodiment;

[0095] Fig.14 A schematic diagram of the flow of each step in steps S1221 to S1224 provided in an embodiment;

[0096] Fig.15 A schematic cross-sectional view of a structure obtained in steps S1221 to S1224 provided in an embodiment;

[0097] FIG16( a ) is a cross-sectional schematic diagram of a structure obtained in step S141 according to an embodiment;

[0098] FIG16( b ) is a cross-sectional schematic diagram of a structure obtained in steps S142 to S144 according to an embodiment;

[0099] FIG16( c ) is a cross-sectional schematic diagram of a structure obtained in steps S145 to S147 according to an embodiment;

[0100] Fig.17 A schematic diagram of the working principle of piezoelectric materials in d31 mode and d33 mode provided by an embodiment;

[0101] Fig.18 A cross-sectional schematic diagram of a display panel provided by an embodiment;

[0102] Fig.19 A cross-sectional schematic diagram of another display panel provided by an embodiment;

[0103] Fig. 20 A cross-sectional schematic diagram of another display panel provided by an embodiment;

[0104] Fig.21 A schematic diagram of a process for preparing a display panel provided by an embodiment;

[0105] FIG22( a ) is a cross-sectional schematic diagram of a structure obtained in step S210 and step S220 provided in an embodiment;

[0106] FIG22( b ) is a cross-sectional schematic diagram of a structure obtained in step S230 according to an embodiment;

[0107] FIG22( c ) is a cross-sectional schematic diagram of a structure obtained in steps S240 to S260 according to an embodiment;

[0108] FIG22( d ) is a schematic cross-sectional view of a structure obtained in steps S270 to S290 provided in an embodiment.

[0109] Description of reference numerals:

[0110] 1-driving backplane; 11-substrate; 12-circuit layer; 121-signal line contact point; 122-gate line contact point;

[0111] 123 - gate insulating layer; 124 - interlayer insulating layer; 125 - driving transistor; 1251 - active layer;

[0112] 1252 - gate electrode; 1253 - source electrode; 1254 - drain electrode; 13 - planarization layer; 131 - first contact electrode;

[0113] 132 - second contact electrode; 133 - third contact electrode; 134 - fourth contact electrode; 135 - fifth contact electrode;

[0114] 136 - sixth contact electrode; 14 - buffer layer; 15 - solder; 2 - light emitting device; 21 - epitaxial layer;

[0115] 211 - first semiconductor layer; 212 - light emitting layer; 213 - second semiconductor layer; 22 - first electrode; 23 - second electrode;

[0116] 3-light sensor; 31-body; 32-first pad; 33-second pad; 4-functional part;

[0117] 41-first conductive layer; 42-piezoelectric layer; 43-second conductive layer; 51-first conductive line; 511-first main line;

[0118] 512-first auxiliary line; 52-second conductive line; 521-second main line; 522-second auxiliary line; 6-conductive sheet;

[0119] 7-encapsulation adhesive layer; 8-transfer substrate; 81-boss; 82-adhesive adhesive; P-pixel structure; A-repeating unit;

[0120] X-protrusion; H-conductive through hole; T-touch feedback structure. DETAILED DESCRIPTION

[0121] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0122] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0123] LED can be widely used in display devices due to its advantages such as high brightness, wide dynamic range, long service life, and stability and reliability.

[0124] With the rapid development of LED display technology, in addition to requiring LED display devices to have higher resolutions, LED display devices are also required to have some auxiliary functions. For example, a touch panel is set in the LED display device, which can add touch functions to facilitate users to perform corresponding operations without a mouse or remote control.

[0125] However, when the user touches the corresponding position of the touch panel, the touch panel may not respond in time (for example, it may take several seconds to jump to the corresponding interface). In this way, the user does not know whether he has completed the touch operation, and is prone to repeated clicks, thereby reducing the user experience.

[0126] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0127] See also Figure 1 An embodiment of the present application provides a touch panel, which includes: a driving backplane 1 and a pixel structure P arranged on the driving backplane 1.

[0128] See also Figure 2 The driving backplane 1 includes a substrate 11, a circuit layer 12 and a planarization layer 13 which are stacked.

[0129] The material of the substrate 11 includes: a transparent glass material or a transparent plastic material. The transparent glass material is, for example, silicon dioxide (SiO2). The transparent plastic material is, for example, an organic material such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene terephthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide, polycarbonate (PC), triacetyl cellulose (TAC) or cellulose propionate (CAP).

[0130] The circuit layer 12 at least includes a pixel driving circuit for driving the pixel to emit light. The pixel driving circuit includes a driving transistor (TFT), a signal line, and a gate line. The signal line and the gate line are respectively led out of the circuit layer 12, and a signal line contact point 121 and a gate line contact point 122 are formed on the surface of the circuit layer 12 away from the substrate 11.

[0131] The planarization layer 13 covers the circuit layer 12 and can planarize the circuit layer 12 to eliminate the step difference on the circuit layer 12. The material of the planarization layer 13 may include an organic material, such as polymethyl methacrylate (PMMA), polystyrene (PS), a polymer derivative having a phenolic group, an propylene polymer, an imide polymer, an aromatic ether polymer, an amide polymer, a fluorine polymer, a p-xylene polymer, a vinyl alcohol polymer, or any combination thereof.

[0132] The surface of the planarization layer 13 is also provided with a first contact electrode 131 and a second contact electrode 132. The first contact electrode 131 and the second contact electrode 132 are used to connect with the signal line and the gate line (the gate line can send an on / off signal to the TFT) in the circuit layer 12 through the conductive through hole H filled with a filling material on the planarization layer 13.

[0133] The materials of the first contact electrode 131, the second contact electrode 132, the filling material in the conductive through hole H, the signal line, and the gate line may include: aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum, titanium (Ti), tungsten (W) or copper (Cu).

[0134] Please combine Figure 1 and Figure 3 It is understood that the pixel structure P includes: a plurality of repeating units A arranged in an array. The repeating unit A includes at least one sub-pixel and a touch feedback structure T.

[0135] The number of sub-pixels and their luminous colors in each repeating unit A can be set according to actual needs. In some examples, each repeating unit includes three sub-pixels, for example: a red sub-pixel (R), a green sub-pixel (G), and a blue sub-pixel (B).

[0136] It can be understood that the sub-pixel is used to emit a light signal. The sub-pixel generally includes a light emitting device. The light emitting device may be an LED chip. The LED chip may be a micro LED chip or a mini LED chip.

[0137] Please continue reading Figure 2 The LED chip can adopt a flip-chip structure, and the LED chip includes: an epitaxial layer 21 and a first electrode 22 and a second electrode 23 located on the side of the epitaxial layer 21 close to the driving backplane 1. The epitaxial layer 21 includes: a first semiconductor layer 211, a light-emitting layer 212 and a second semiconductor layer 213. The first electrode 22 and the second electrode 23 are respectively connected to the first contact electrode 131 and the second contact electrode 132 on the driving backplane 1.

[0138] The first semiconductor layer 211 may be an N / P type doped GaN layer, the light emitting layer 212 may be a quantum well layer; and the second semiconductor layer 213 may be a P / N type doped GaN layer.

[0139] The material of the first electrode 22 and the second electrode 23 may be metal or other conductive materials. Optionally, the metal may be, for example, aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu).

[0140] When an electrical signal is applied to the first electrode 22 and the second electrode 23 , electrons in the N-type semiconductor and holes in the P-type semiconductor collide and recombine violently in the light-emitting layer 212 to generate photons, thereby emitting energy in the form of photons.

[0141] like Figure 4 As shown, the driving backplane 1 further includes: a buffer layer 14 disposed between the substrate 11 and the circuit layer 12. The circuit layer 12 includes: a driving transistor 125. The driving transistor 125 may include an active layer 1251, a gate 1252, a source 1253 and a drain 1254. The drain 1254 is connected to the second contact electrode 132 through a conductive through hole H.

[0142] The driving backplane 1 further includes a gate insulating layer 123 disposed between the gate 1252 and the active layer 1251 and an interlayer insulating layer 124 disposed between the gate 1252, the source 1253 and the drain 1254. The gate insulating layer 123 is used to insulate the gate 1252 and the active layer 1251. The interlayer insulating layer 124 is used to insulate the gate 1252, the source 1253 and the drain 1254.

[0143] The driving transistor 125 may be a top-gate driving transistor or a bottom-gate driving transistor. The material of the active layer 1251 may include a semiconductor material, such as amorphous silicon, polycrystalline silicon, an organic semiconductor material or an oxide semiconductor material.

[0144] The materials of the gate 1252, the source 1253 and the drain 1254 can all include low-resistance metal materials, such as: aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu).

[0145] Materials of the gate insulating layer 123 and the interlayer insulating layer 124 may each include an inorganic material, such as SiO 2 , SiN x , SiON, Al 2 O 3 , TiO 2 , tantalum oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ), or zinc oxide (ZnO 2 ).

[0146] The gate line contact point 122 may be formed on one of the plurality of insulating films below the planarization layer 13. For example, the gate line contact point 122 may be formed on the interlayer insulating layer 124 or the gate insulating layer 123.

[0147] The buffer layer 14 can provide a substantially flat surface above the substrate 11 and can reduce or prevent foreign matter or moisture from penetrating the substrate 11. The material of the buffer layer 14 can include an inorganic material or an organic material. Inorganic materials are, for example, silicon oxide (SiO2), silicon nitride (SiNx), silicon oxynitride (SiON), aluminum oxide (Al2O3), aluminum nitride (AlN), titanium oxide (TiO2) or titanium nitride (TiN). Organic materials are, for example, polyimide, polyester or propylene.

[0148] The pixel structure P will be further described below through some embodiments. Figure 3 , Figure 5 and Figure 6 understand.

[0149] The sub-pixel includes: a light emitting device 2 . The touch feedback structure T includes: a light sensor 3 and a functional part 4 .

[0150] The light sensor 3 is used to collect a touch feedback signal, which is a reflected light signal formed when the light signal emitted by the sub-pixel is reflected by the finger.

[0151] The functional part 4 is connected to the light sensor 3, and is used for elastically deforming along a first direction under the control of the light sensor 3. The first direction is a direction close to the finger.

[0152] It should be noted that the first direction is a direction that is not parallel to the driving backplane 1 , for example, a direction that is perpendicular to the driving backplane 1 .

[0153] In the above-mentioned pixel structure P, the light sensor 3 and the functional part 4 respectively form a repeating unit with the sub-pixel for repeated arrangement. Based on this, for the touch panel and display device using the pixel structure P, when the user touches the touch panel with a finger, the finger can reflect the light signal emitted by the sub-pixel (i.e., the touch feedback signal) to the light sensor 3, so that the light sensor 3 controls the functional part 4 to undergo elastic deformation according to the touch feedback signal, such as forming a protrusion or depression in the direction close to the finger. In this way, the user can sense the elastic deformation of the functional part through the finger to obtain touch feedback. In this way, the user can obtain an effective sense of touch through the touch feedback to know that he has completed the touch operation, and will not click repeatedly in a short time, causing the display device to respond frequently. Thereby, it is beneficial to improve the user experience and extend the service life of the display device.

[0154] See also Figure 6 In some embodiments, the light sensor 3 may be a photodiode. The photodiode includes: a body 31, a first pad 32, and a second pad 33. The functional portion 4 includes: a first conductive layer 41, a piezoelectric layer 42, and a second conductive layer 43 that are stacked. The first conductive layer 41 is connected to the first pad 32, and the second conductive layer 43 is connected to the second pad 33; the piezoelectric layer 42 is configured to expand in response to the electrical signal transmitted from the light sensor 3 to the first conductive layer 41 and the second conductive layer 43 to form a protrusion X.

[0155] For example, the material of the first conductive layer 41 and the second conductive layer 43 can be selected from metals with good conductivity, such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu).

[0156] For example, the material of the piezoelectric layer 42 includes a piezoelectric material, such as piezoelectric ceramics, piezoelectric crystals, or polyvinylidene fluoride (PVDF).

[0157] In one example, after collecting the touch feedback signal, the photodiode will accumulate negative charges on the first pad 32 and positive charges on the second pad 33. The negative charges will be transmitted to the first conductive layer 41, and the positive charges will be transmitted to the second conductive layer 43. In this way, the piezoelectric layer 42 can be turned on, thereby expanding to form a protrusion X.

[0158] In the above pixel structure, the functional part 4 is composed of the first conductive layer 41, the piezoelectric layer 42 and the second conductive layer 43 which are stacked. The structure is simple and easy to prepare, which is beneficial to improving the production efficiency while ensuring the touch feedback performance.

[0159] In some embodiments, the optical sensor 3 is multiplexed as a touch sensor. The touch sensor is configured to generate a touch sensing signal in response to a touch operation of a finger.

[0160] When a finger touches the corresponding position of the pixel structure P, the light intensity collected by the touch sensor will change, thereby generating a touch sensing signal. A touch signal line is also provided in the driving backplane 1, and the touch signal line is used to transmit the touch sensing signal to the touch IC to realize the touch function. The touch IC can be integrated on a touch panel or a printed circuit board (PCB), and connected to the touch signal line through a flexible circuit board.

[0161] In the above pixel structure, the light sensor 3 can be reused as a touch sensor, so that the touch function and the touch feedback function can be realized simultaneously by using the same component. This can simplify the structure of the touch panel to avoid redundant components in the display device, thereby making the display device thinner and lighter.

[0162] The touch panel will be further described below through some embodiments. Figures 5 to 8 understand.

[0163] In some embodiments, the sub-pixel includes a light emitting device 2 . The thickness of the functional portion 4 is greater than the thickness of the light emitting device 2 , and greater than the thickness of the light sensor 3 .

[0164] In the above touch panel, the thickness of the functional part 4 is greater than the thickness of the light emitting device 2 and the light sensor 3. Thus, when a finger touches the touch panel, the elastic deformation of the functional part 4 can be clearly presented on the touch surface, so that the user can feel the elastic deformation of the functional part 4 through the finger. This is conducive to the touch panel to better realize the touch feedback function.

[0165] In some embodiments, a plurality of contact electrodes are provided on one side of the driving backplane 1 for leading out the circuits in the driving backplane 1. The light emitting device 2 includes an epitaxial layer 21 and a first electrode 22 and a second electrode 23 located on a side of the epitaxial layer 21 close to the driving backplane 1. The first electrode 22 is welded to a first contact electrode 131 on one side of the driving backplane 1 through a solder 15. The second electrode 23 is welded to a second contact electrode 132 on one side of the driving backplane 1 through a solder 15.

[0166] The light sensor 3 includes: a first pad 32 and a second pad 33. The functional part 4 includes: a first conductive layer 41, a piezoelectric layer 42 and a second conductive layer 43 which are stacked. The second conductive layer 43 is located on the side of the first conductive layer 41 away from the driving backplane 1. The touch panel has a variety of wiring methods to achieve the connection between the driving backplane 1, the light emitting device 2, the light sensor 3 and the functional part 4.

[0167] Please continue reading Figure 5 In some examples, the touch panel further includes: a first conductive line 51 and a conductive sheet 6 .

[0168] The first conductive line 51 is disposed in the driving backplane 1. Two ends of the first conductive line 51 are connected to the first conductive layer 41 and the first pad 32 respectively.

[0169] The conductive sheet 6 is disposed outside the driving backplane 1. Two ends of the conductive sheet 6 are connected to the second conductive layer 43 and the second pad 33 respectively.

[0170] Optionally, the material of the conductive sheet 6 can be a metal with good conductivity, such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu).

[0171] Optionally, the surface of the driving backplane 1 is provided with a third contact electrode 133, a fourth contact electrode 134 and a fifth contact electrode 135. The first pad 32 and the first conductive layer 41 are respectively welded to the third contact electrode 133 and the fifth contact electrode 135 through the solder 15. The two ends of the first conductive wire 51 are respectively connected to the third contact electrode 133 and the fifth contact electrode 135 through the conductive through hole H. In this way, the connection between the first pad 32 and the first conductive layer 41 can be achieved.

[0172] The second pad 33 is firstly soldered to one end of the conductive sheet 6 through the solder 15, and then connected to the fourth contact electrode 134 through the conductive sheet 6. In this way, the connection between the second pad 33 and the second conductive layer 43 and the connection between the second pad 33 and the driving backplane 1 can be achieved.

[0173] In the above touch panel, based on the structure of the light sensor 3 and the functional part 4, the first conductive line 51 is preset in the driving back plate 1, which is convenient for first preparing or docking the functional part 4 on the driving back plate 1, and then connecting the functional part 4 and the light sensor 3 by using the conductive sheet 6 arranged outside the driving back plate 1, and then docking the light sensor 3 on the driving back plate 1. This is conducive to designing the preparation process of the touch panel to improve the production efficiency of the touch panel.

[0174] See also Figure 7 In some other examples, the touch panel further includes: a first conductive line 51 and a second conductive line 52 .

[0175] The first conductive line 51 includes: an interconnected first main line 511 and a first auxiliary line 512. The first main line 511 is disposed in the driving backplane 1 and connected to the first conductive layer 41. The first auxiliary line 512 is located on the surface of the driving backplane 1, and one end of the first auxiliary line 512 away from the first main line 511 is connected to the first electrode 22.

[0176] The second conductive line 52 includes: an interconnected second main line 521 and a second auxiliary line 522. The second main line 521 is disposed in the driving backplane 1 and connected to the second electrode 23. The second auxiliary line 522 is located outside the driving backplane 1, and one end of the second auxiliary line 522 away from the second main line 521 is connected to the second conductive layer 43.

[0177] Furthermore, before the electrical property test of the light emitting device 2 is performed before packaging, the first auxiliary line 512 is a passage, and the functional part 4 is further configured to generate current under pressure and conduct the light emitting device 2, so as to perform the electrical property test of the light emitting device 2 before packaging. After the electrical property test of the light emitting device 2 is performed before packaging, the first auxiliary line 512 is an open circuit (such as Figure 8 shown).

[0178] Here, the electrical testing before packaging needs to be explained. In the process of preparing touch panels, mass transfer is a very critical step. Mass transfer refers to: transferring millions or even tens of millions of light-emitting devices from the growth substrate to the driving backplane. However, due to the large number of transfers, it is difficult to ensure that each light-emitting device can emit light normally after the transfer. Based on this, the touch panel in the embodiment of the present application adopts the aforementioned structure, which can perform electrical testing on the light-emitting device before packaging the transferred light-emitting device and promptly replace the damaged light-emitting device that cannot emit light normally, thereby ensuring the transfer yield of mass transfer.

[0179] Optionally, the first auxiliary line 512 and the second auxiliary line 522 may be made of conductive sheets.

[0180] Optionally, the first electrode 22 is connected to an end of the first auxiliary line 512 away from the first main line 511 through the first contact electrode 131. The first conductive layer 41 is soldered to the fifth contact electrode 135 through the solder 15. Both ends of the first main line 511 are respectively connected to the first auxiliary line 512 and the fifth contact electrode 135 through the conductive through hole H. In this way, the connection between the first electrode 22 and the first conductive layer 41 can be achieved.

[0181] The two ends of the second main line 521 are respectively connected to the second contact electrode 132 and the sixth contact electrode 136 on the surface of the driving backplane 1 through the conductive through hole H. One end of the second auxiliary line 522 is connected to the sixth contact electrode 136 through the solder 15, and the other end of the second auxiliary line 522 is connected to the second conductive layer 43. In this way, the connection between the second electrode 23 and the second conductive layer 43 can be achieved.

[0182] In some embodiments, please refer to Figure 7 The light sensor 3 includes: a first pad 32 and a second pad 33 .

[0183] The first pad 32 is connected to an end of the first auxiliary line 512 close to the first main line 511. The second pad 33 is connected to the second conductive layer 43 through the conductive sheet 6.

[0184] Optionally, the first pad 32 is welded to the third contact electrode 133 of the first auxiliary line 512 away from the surface of the driving backplane 1 through the solder 15 , so that it can be connected to the first conductive layer 41 through the first auxiliary line 512 and the first main line 511 .

[0185] The second pad 33 is firstly soldered to one end of the conductive sheet 6 through the solder 15, and then connected to the fourth contact electrode 134 through the conductive sheet 6. In this way, the connection between the second pad 33 and the second conductive layer 43 and the connection between the second pad 33 and the driving backplane 1 can be achieved.

[0186] In the above touch panel, the light emitting device 2 and the functional part 3 are connected, specifically: the first main line 511 and the first auxiliary line 512 in the first conductive line 51 are used to realize the connection between the first electrode 22 of the light emitting device 2 and the first conductive layer 41 of the functional part 4, and the second main line 521 and the second auxiliary line 522 in the second conductive line 52 are used to realize the connection between the second electrode 23 of the light emitting device 2 and the second conductive layer 43 of the functional part 4. In this way, before the light emitting device 2 is packaged, for example, before the solder corresponding to the light emitting device 2 is solidified, the functional part 4 generates current under pressure and turns on the light emitting device 2, so as to perform electrical detection on the light emitting device 2. Therefore, the damaged light emitting device can be replaced in time during the preparation process of the touch panel, and the transfer yield of the light emitting device can be improved, so as to improve the reliability of the touch panel.

[0187] Furthermore, the first auxiliary line 512 is located on the surface of the driving backplane 1, which is convenient for cutting off the first auxiliary line 512 after the electrical detection of the light-emitting device 2 before packaging, even if the first auxiliary line 512 is open. In this way, in the prepared touch panel, the connection between the light-emitting device 2 and the functional part 4 is disconnected. The light-emitting device 2 emits light according to the driving signal of the driving backplane 1. The functional part 4 is only used to connect with the light sensor 3 to realize the touch feedback function of the touch panel.

[0188] In some embodiments, see Figure 5 and Figure 8 The touch panel further includes: a packaging adhesive layer 7 covering the sub-pixels, the light sensor 3 and the functional part 4 respectively.

[0189] Illustratively, the material of the packaging adhesive layer 7 includes: epoxy resin, silica gel or silicone resin.

[0190] In the above touch panel, the encapsulation adhesive layer 7 covers the sub-pixels, the light sensor 3 and the functional part 4 respectively, and can simultaneously encapsulate the sub-pixels, the light sensor 3 and the functional part 4 to effectively isolate them from water and oxygen corrosion.

[0191] Based on the same inventive concept, the present application also provides a method for preparing a touch panel, which is used to prepare the touch panels in some of the aforementioned embodiments. The method for preparing the touch panel can also achieve the technical effects that the touch panels in some of the aforementioned embodiments can achieve, and will not be described in detail here.

[0192] See also Fig. 9 and Fig.10 , the preparation method of the touch panel includes the following steps.

[0193] S110, provides the driver backplane.

[0194] S120, docking the functional part and the light sensor at one side of the driving backplane, and connecting the functional part to the light sensor.

[0195] Furthermore, the optical sensor is used to collect a touch feedback signal, which is a reflected light signal formed by the light signal emitted by the sub-pixel after being reflected by the finger. The functional part is used to elastically deform along a first direction under the control of the optical sensor, and the first direction is a direction close to the finger.

[0196] In some embodiments, the light sensor includes a first pad and a second pad. The functional part includes a first conductive layer, a piezoelectric layer, and a second conductive layer that are stacked. The connection between the light sensor and the functional part can refer to the relevant records in some of the above embodiments, which will not be described in detail here.

[0197] In one example, a first conductive line is disposed in the driving backplane. Fig.11As shown, step S120 includes steps S1211 to S1213. Fig.12 It is a cross-sectional schematic diagram of the structure obtained after executing steps S1211 to S1213.

[0198] S1211 , docking the functional part 4 on one side of the driving backplane 1 , and connecting the first conductive layer 41 to the first end of the first conductive line 51 .

[0199] S1212 , provide a conductive sheet 6 , and connect a first end of the conductive sheet 6 to the second conductive layer 43 .

[0200] S1213 , docking the light sensor 3 on the same side of the driving backplane 1 as the docking functional portion 4 , connecting the first pad 32 to the second end of the first conductive line 51 , and connecting the second pad 33 to the second end of the conductive sheet 6 .

[0201] On this basis, please continue to refer to the example Fig. 9 The method for preparing the touch panel also includes steps S131 to S134.

[0202] S131, please refer to FIG. 13(a), providing a transfer substrate 8 on which a plurality of light-emitting devices 2 are prepared.

[0203] S132, please refer to FIG. 13(b), the transfer substrate 8 is connected to the driving backplane 1. For example, the first electrode 22 of the light emitting device 2 is connected to the first contact electrode 131 on the driving backplane 1, and the second electrode 23 of the light emitting device 2 is connected to the second contact electrode 132 on the driving backplane 1.

[0204] S133, please refer to FIG. 13(c), remove the transfer substrate 8.

[0205] S134, please continue to refer to FIG. 13(c), coating a packaging adhesive layer 7 to respectively encapsulate the light emitting device 2, the light sensor 3 and the functional part 4.

[0206] In another example, a first main line and a second main line are respectively arranged in the driving backplane, and a first auxiliary line interconnected with the first main line is arranged on the surface of the driving backplane.

[0207] See also Fig.14 , step S120 also includes steps S1221 to S1224. Fig.15 It is a cross-sectional schematic diagram of the structure obtained after executing steps S1221 to S1224.

[0208] S1221 , docking the functional part 4 on one side of the driving backplane 1 , and connecting the first conductive layer 41 to an end of the first main line 511 away from the first auxiliary line 512 .

[0209] S1222 , provide a conductive sheet 6 , and connect a first end of the conductive sheet 6 to the second conductive layer 43 .

[0210] S1223 , dock the light sensor 3 on the same side of the driving backplane 1 as the docking functional part 4 , connect the first pad 32 to an end of the first auxiliary line 512 close to the first main line 511 , and connect the second pad 33 to the second end of the conductive sheet 6 .

[0211] S1224, providing a second auxiliary line 522, and connecting two ends of the second auxiliary line 522 to the second conductive layer 43 and the second main line 521 respectively.

[0212] Furthermore, one end of the first auxiliary line 512 away from the first main line 511 is used to connect to the first electrode 22 of the light-emitting device 2, and one end of the second main line 521 away from the second auxiliary line 522 is used to connect to the second electrode 23 of the light-emitting device 2. The connection between the light-emitting device 2 and the light sensor 3 and the functional part 4 can refer to the relevant records in some of the aforementioned embodiments, which will not be described in detail here.

[0213] On this basis, please continue to refer to the example Fig.10 The method for preparing the touch panel also includes steps S141 to S147.

[0214] S141, please refer to FIG. 16(a), providing a transfer substrate 8 on which a plurality of light-emitting devices 2 are prepared.

[0215] S142, please refer to Figure 16(b), dock the transfer substrate 8 with the driving backplane 1 so that the first electrode 22 of the light-emitting device 2 is docked with the end of the first auxiliary line 512 away from the first main line 511, and the second electrode 23 of the light-emitting device 2 is docked with the end of the second main line 521 away from the second auxiliary line 522.

[0216] S143, please continue to refer to FIG. 16(b), a pressure N is applied to the transfer substrate 8 from the side of the transfer substrate 8 away from the driving backplane 1, and the functional part 4 is used to generate current under the action of the pressure N and turn on the light-emitting device 2.

[0217] S144 , please continue to refer to FIG. 16 ( b ), perform electrical detection on the light emitting device 2 according to the conduction state of the light emitting device 2 to determine the position of the damaged light emitting device on the driving backplane 1 .

[0218] S145, please refer to FIG. 16(c), remove the transfer substrate 8 and replace the damaged light emitting device.

[0219] S146, please continue to refer to FIG. 16(c), the first auxiliary line 512 is cut off.

[0220] Optionally, the method of cutting the first auxiliary line 512 includes: laser cutting.

[0221] S147, please continue to refer to FIG. 16(c), coating a packaging adhesive layer 7 to respectively encapsulate the light emitting device 2, the light sensor 3 and the functional part 4.

[0222] The following is a specific example to explain the detection principle of the electrical detection of the light emitting device 2 in the above example.

[0223] First, the piezoelectric layer 42 is briefly introduced.

[0224] The piezoelectric layer 42 can be made of piezoelectric material. Fig.17 As shown, according to the different stress directions of the piezoelectric material, the working modes of the piezoelectric material are mainly divided into two types: d31 mode and d33 mode. The d31 mode is a working mode in which the stress or strain direction of the piezoelectric material is perpendicular to the voltage or electric field direction generated by it. This working mode uses the upper and lower surfaces of the piezoelectric material as positive and negative electrodes to collect charges. The d33 mode is a working mode in which the stress or strain direction of the piezoelectric material is consistent with the voltage or electric field direction generated by it. Optionally, the piezoelectric layer 42 in the embodiment of the present application can be prepared using a piezoelectric material of the d33 mode.

[0225] The first electrode 22 of the light emitting device 2 is a positive electrode, and the second electrode 23 is a negative electrode. The light sensor 3 is, for example, a photodiode, and the first pad 32 thereof is a negative electrode, and the second pad 33 thereof is a positive electrode.

[0226] When the piezoelectric layer 42 is compressed, positive charges are accumulated in the first conductive layer 41 and negative charges are accumulated in the second conductive layer 43. The positive charges are transferred to the first electrode 22 and the first pad 32, and the negative charges are transferred to the second electrode 23 and the second pad 33. In this way, a current can be generated to turn on the light-emitting device 2 and reversely cut off the photodiode.

[0227] After the light emitting device 2 is turned on, the light emitting device that can emit light normally is a normal light emitting device, and the light emitting device that cannot emit light is a damaged light emitting device.

[0228] In the above touch panel manufacturing method, after the transfer substrate 8 is docked with the driving backplane 1, a pressure N can be applied to the transfer substrate 8, so that the functional part 4 generates current and turns on the light-emitting device under the action of the pressure N. In this way, the functional part 4 can be reused to perform electrical testing on the light-emitting device 2 before packaging, so as to timely identify and replace the damaged light-emitting device, thereby improving the transfer yield of the light-emitting device.

[0229] Furthermore, the first auxiliary line 512 is located on the surface of the driving backplane 1, which is convenient for cutting off the first auxiliary line 512 after the electrical detection of the light-emitting device 2 before packaging, even if the first auxiliary line 512 is open. In this way, in the prepared touch panel, the connection between the light-emitting device 2 and the functional part 4 is disconnected. The light-emitting device 2 emits light according to the driving signal of the driving backplane 1. The functional part 4 is only used to connect with the light sensor 2 to realize the touch feedback function of the touch panel.

[0230] In some embodiments, the first electrode 22 of the light-emitting device 2 is connected to the end of the first auxiliary line 512 away from the first main line 511, and the second electrode 23 of the light-emitting device 2 is connected to the end of the second main line 521 away from the second auxiliary line 522, including: the first electrode 22 of the light-emitting device 2 is welded to the end of the first auxiliary line 512 away from the first main line 511 through the solder 15, and the second electrode 23 of the light-emitting device 2 is welded to the end of the second main line 521 away from the second auxiliary line 522 through the solder 15.

[0231] Accordingly, electrical testing of the light emitting device 2 according to the conducting state of the light emitting device 2 and replacement of damaged light emitting devices are all performed before the solder 15 solidifies.

[0232] In the above-mentioned method for manufacturing the touch panel, the electrical property test of the light emitting device 2 before packaging can be performed before the solder 15 corresponding to the light emitting device 2 is solidified. At this time, the damaged light emitting device can be identified and replaced in time according to the conduction state of the light emitting device 2. In this way, there is no need to remove the solder 15 before replacing the damaged light emitting device, which is conducive to improving the transfer yield of the light emitting device 2, simplifying the manufacturing process of the touch panel and improving the production efficiency of the touch panel.

[0233] In some embodiments, the transfer substrate 8 on which the light emitting device 2 is prepared has a boss 81 , and the light emitting device 2 is prepared on the boss 81 . The sum of the thickness of the boss 81 and the light emitting device 2 is equal to the thickness of the functional part 4 .

[0234] For example, the light emitting device 2 may be bonded to the boss 81 by adhesive 82 .

[0235] In the above-mentioned method for manufacturing a touch panel, the transfer substrate 8 has a boss 81, and the light emitting device 2 is manufactured on the boss 81. Based on this, the sum of the thickness of the boss 81 and the light emitting device 2 is equal to the thickness of the functional part 4, and the transfer substrate 8 can be brought into surface contact with the functional part 4 after the transfer substrate 8 and the driving backplane 1 are docked. In this way, it is convenient to uniformly pressurize the functional part 4 to generate current, and it is also easy to avoid damage to the functional layer 4 and the light emitting device 2 due to excessive pressure.

[0236] See also Fig.18Based on the same inventive concept, an embodiment of the present application further provides a display panel, which includes: a driving backplane 1, a light-emitting device 2 and a functional part 4.

[0237] By way of example, the light emitting device 2 includes: an LED chip.

[0238] The driving backplane 1 is provided with an electrical property detection circuit.

[0239] For example, a pixel driving circuit is also provided in the circuit layer of the driving backplane 1, which is used to drive the light emitting device 2 to emit light. The pixel driving circuit includes a driving transistor (TFT), a signal line, a gate line, and the like.

[0240] The light emitting device 2 is disposed on the driving backplane 1. The functional part 4 is disposed beside the light emitting device 2 and connected to the light emitting device 2 through an electrical property detection circuit. The functional part 4 is used to generate current under pressure and turn on the light emitting device 2.

[0241] Before the electrical property test is performed on the light emitting device 2 before packaging, the electrical property test circuit is open. After the electrical property test is performed on the light emitting device 2 before packaging, the electrical property test circuit is open.

[0242] In the above display panel, before the electrical property test of the light emitting device 2 is performed before packaging, the electrical property test circuit is a path, and at this time, pressure can be applied to the functional part 4 so that the functional part 4 generates current under the action of pressure to conduct the light emitting device 2 connected thereto. In this way, the damaged light emitting device can be found and removed in time according to the conduction state of the light emitting device 2. This improves the transfer yield of the light emitting device, and further improves the reliability of the display panel.

[0243] Furthermore, after the electrical detection of the light emitting device 2 before packaging, the electrical detection circuit is open. That is, in the prepared display panel, the electrical detection circuit between the light emitting device 2 and the functional part 4 is disconnected. The light emitting device 2 can emit light according to the driving signal of the driving backplane 1.

[0244] In some embodiments, the functional part 4 includes: a first conductive layer 41 , a piezoelectric layer 42 , and a second conductive layer 43 which are sequentially stacked in a direction away from the driving back plate 1 .

[0245] For example, the material of the first conductive layer 41 and the second conductive layer 43 can be selected from metals with good conductivity, such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) or copper (Cu).

[0246] For example, the material of the piezoelectric layer 42 includes a piezoelectric material, such as piezoelectric ceramics, piezoelectric crystals, or polyvinylidene fluoride (PVDF).

[0247] In some embodiments, please refer to Fig.18 The light emitting device 2 includes a first electrode 22 and a second electrode 23. The electrical property detection circuit includes: a first conductive line 51 and a second conductive line 52.

[0248] The first conductive line 51 includes: an interconnected first main line 511 and a first auxiliary line 512. The first main line 511 is disposed in the driving backplane 1 and connected to the first conductive layer 41. The first auxiliary line 512 is located on the surface of the driving backplane 1, and one end of the first auxiliary line 512 away from the first main line 511 is connected to the first electrode 22.

[0249] The second conductive line 52 includes: an interconnected second main line 521 and a second auxiliary line 522. The second main line 521 is disposed inside the driving backplane 1 and connected to the second electrode 23. The second auxiliary line 522 is located outside the driving backplane 1, and one end of the second auxiliary line 522 away from the second main line 521 is connected to the second conductive layer 43.

[0250] Furthermore, after the electrical property test is performed on the light emitting device 2 before packaging, at least one of the first auxiliary line 512 and the second auxiliary line 522 is open.

[0251] Optionally, the first electrode 22 is welded to the first contact electrode 131 on one side of the driving backplane 1 through the solder 15 . The second electrode 23 is welded to the second contact electrode 132 on one side of the driving backplane 1 through the solder 15 .

[0252] The first electrode 22 is connected to an end of the first auxiliary line 512 away from the first main line 511 through the first contact electrode 131. The first conductive layer 41 is soldered to the fifth contact electrode 135 through the solder 15. The two ends of the first main line 511 are respectively connected to the first auxiliary line 512 and the fifth contact electrode 135 through the conductive through hole H. In this way, the connection between the first electrode 22 and the first conductive layer 41 can be achieved.

[0253] The two ends of the second main line 521 are respectively connected to the second contact electrode 132 and the sixth contact electrode 136 on the surface of the driving backplane 1 through the conductive through hole H. One end of the second auxiliary line 522 is soldered to the sixth contact electrode 136 through the solder 15, and the other end of the second auxiliary line 522 is connected to the second conductive layer 43. In this way, the connection between the second electrode 23 and the second conductive layer 43 can be achieved.

[0254] Optionally, the first auxiliary line 512 and the second auxiliary line 522 may be conductive sheets.

[0255] Optionally, the first auxiliary line 512 and / or the second auxiliary line 522 may be cut off by laser cutting, so that at least one of the first auxiliary line 512 and the second auxiliary line 522 is disconnected.

[0256] In the above display panel, the electrical property detection circuit adopts the above structure, which is convenient for first preparing or connecting the functional part 4 to the first main line 511 of the driving backplane 1, and then connecting the functional part 4 and the second main line 521 by using the second auxiliary line 522 arranged outside the driving backplane 1, and then connecting the light-emitting device 4 to the second main line 521 and the first auxiliary line 512 respectively. This is conducive to designing the preparation process of the display panel to improve the production efficiency of the display panel.

[0257] In addition, the first auxiliary line 512 and the second auxiliary line 522 are arranged outside the driving backplane 1, so that at least one of the first auxiliary line 512 or the second auxiliary line 522 can be cut off after the electrical detection of the light-emitting device 2 before packaging. In this way, in the prepared display panel, the electrical detection circuit between the light-emitting device 2 and the functional part 4 is disconnected. The light-emitting device 2 can emit light according to the driving signal of the driving backplane 1.

[0258] In some embodiments, see Fig.19 The display panel further includes: a light sensor 3. The light sensor 3 is, for example, a photodiode.

[0259] The light sensor 3 is arranged beside the light emitting device 2 and is used to collect a touch feedback signal. The touch feedback signal is a reflected light signal formed after the light signal emitted by the light emitting device 2 is reflected by the finger.

[0260] The functional part 4 is also connected to the light sensor 3 , and is also used for elastically deforming along a first direction under the control of the light sensor 3 ; the first direction is a direction close to the finger.

[0261] It should be noted that the first direction is a direction that is not parallel to the driving backplane, for example, a direction perpendicular to the driving backplane.

[0262] For example, the light sensor 3 includes: a body 31 , a first pad 32 and a second pad 33 . The display panel also includes: a conductive sheet 6 .

[0263] The first pad 32 is connected to an end of the first auxiliary line 512 close to the first main line 511. The second pad 33 is connected to the second conductive layer 43 through the conductive sheet 6.

[0264] Optionally, the first pad 32 is welded to the third contact electrode 133 of the first auxiliary line 512 away from the surface of the driving backplane 1 through the solder 15 , so that it can be connected to the first conductive layer 41 through the first auxiliary line 512 and the first main line 511 .

[0265] The second pad 33 is firstly soldered to one end of the conductive sheet 6 through the solder 15, and then connected to the fourth contact electrode 134 through the conductive sheet 6. In this way, the connection between the second pad 33 and the second conductive layer 43 and the connection between the second pad 33 and the driving backplane 1 can be achieved.

[0266] In the above-mentioned display panel, a light sensor 3 connected to the functional part 4 is arranged beside the light emitting device 2. In this way, when the user touches the display panel with a finger, the finger can reflect the light signal (i.e., the touch feedback signal) emitted by the light emitting device 2 to the light sensor 3, so that the light sensor 3 controls the elastic deformation of the functional part 4 according to the touch feedback signal, such as forming a protrusion or depression in the direction close to the finger. In this way, the user can sense the elastic deformation of the functional part 4 through the finger to obtain touch feedback. In this way, the user can obtain an effective sense of touch through the touch feedback to know that he has completed the touch operation, and will not click repeatedly in a short time, causing the display device to respond frequently. This is conducive to improving the user experience and extending the service life of the display device.

[0267] In some embodiments, the optical sensor 3 is multiplexed as a touch sensor. The touch sensor is configured to generate a touch sensing signal in response to a touch operation of a finger.

[0268] When a finger touches the corresponding position of the display panel, the light intensity collected by the touch sensor will change, thereby generating a touch sensing signal. A touch signal line is also provided in the driver backplane 1, and the touch signal line is used to transmit the touch sensing signal to the touch IC to realize the touch function. The touch IC can be integrated on the touch panel or printed circuit board, and connected to the touch signal line through a flexible circuit board.

[0269] In the above display panel, the light sensor 3 can be reused as a touch sensor, so as to use the same component to realize the touch function and the touch feedback function at the same time. This can simplify the structure of the display panel to avoid redundant components in the display device, which is conducive to making the display device lighter and thinner.

[0270] In some embodiments, the thickness of the functional portion 4 is greater than the thickness of the light emitting device 2 , and greater than the thickness of the light sensor 3 .

[0271] In the above display panel, the thickness of the functional part 4 is greater than the thickness of the light emitting device 2 and the light sensor 3. In this way, when a finger touches the touch panel, the elastic deformation of the functional part 4 can be clearly presented on the touch surface, so that the user can feel the elastic deformation of the functional part 4 through the finger. This is conducive to better realizing the touch feedback function of the display panel.

[0272] In some embodiments, see Fig. 20The display panel further includes: a packaging glue layer 7 covering the light emitting device 2, the light sensor 3 and the functional part 4 respectively.

[0273] Illustratively, the material of the packaging adhesive layer 7 includes: epoxy resin, silica gel or silicone resin.

[0274] In the above display panel, the encapsulation adhesive layer covers the sub-pixels, the light sensor and the functional part respectively, and the sub-pixels, the light sensor and the functional part can be encapsulated simultaneously to effectively isolate them from water and oxygen corrosion.

[0275] Based on the same inventive concept, the present application also provides a method for preparing a display panel, which is used to prepare the display panels in some of the aforementioned embodiments. The display panel in some of the aforementioned embodiments can also achieve the technical effects achieved by the display panel preparation method, which will not be described in detail here.

[0276] See also Fig.21 The method for preparing the display panel includes steps S210 to S280. The specific connection between the driving backplane 1, the light emitting device 2 and the functional part 4 can refer to the display panels in some of the above embodiments.

[0277] S210, please refer to Figure 22(a), provide a driving backplane 1, the interior of the driving backplane 1 is provided with a first main line 511 and a second main line 521, and the surface of the driving backplane 1 is provided with a first auxiliary line 512 connected to the first main line 511.

[0278] S220 , please continue to refer to FIG. 22 ( a ), a first conductive layer 41 , a piezoelectric layer 42 and a second conductive layer 43 are sequentially stacked on one side of the driving backplane 1 ; the first conductive layer 41 is connected to the first main line 511 .

[0279] Here, the first conductive layer 41 , the piezoelectric layer 42 , and the second conductive layer 43 together constitute the functional portion 4 .

[0280] S230 , please refer to FIG. 22( b ), provide a second auxiliary line 522 , and connect two ends of the second auxiliary line 522 to the second conductive layer 43 and the second main line 521 , respectively.

[0281] S240, please refer to Figure 22(c), dock the transfer substrate 8 prepared with the light-emitting device 2 with the driving backplane 1, so that the first electrode 22 of the light-emitting device 2 is connected to the end of the first auxiliary line 512 away from the first main line 511, and the second electrode 23 of the light-emitting device 2 is connected to the second main line 521.

[0282] S250, please refer to Figure 22(c), a pressure N is applied to the transfer substrate 8 from the side of the transfer substrate 8 away from the driving backplane 1, and the piezoelectric layer 42 generates current under the action of the pressure N and turns on the light-emitting device 2.

[0283] S260 , please continue to refer to FIG. 22 ( c ), perform electrical detection on the light emitting device 2 according to the conduction state of the light emitting device 2 to determine the position of the damaged light emitting device on the driving backplane 1 .

[0284] S270, please refer to FIG. 22(d), remove the transfer substrate 8 and replace the damaged light emitting device.

[0285] S280 , please refer to FIG. 22( d ), cutting off the first auxiliary line 512 or the second auxiliary line 522 .

[0286] The following is a specific example to explain the detection principle of the electrical detection of the light emitting device 2 in the above example.

[0287] The first electrode 22 of the light emitting device 2 is a positive electrode, and the second electrode 23 is a negative electrode.

[0288] When the piezoelectric layer 42 is compressed, positive charges are accumulated in the first conductive layer 41 and negative charges are accumulated in the second conductive layer 43. The positive charges are transferred to the first electrode 22 and the negative charges are transferred to the second electrode 23. In this way, a current can be generated to turn on the light emitting device 2.

[0289] After the light emitting device 2 is turned on, the light emitting device that can emit light normally is a normal light emitting device, and the light emitting device that cannot emit light is a damaged light emitting device.

[0290] In the above-mentioned method for manufacturing the display panel, after the light emitting device 2 and the driving backplane 1 are docked by using the transfer substrate 8, pressure can be applied to the transfer substrate 8 so that the piezoelectric layer 42 generates current under the action of the pressure and turns on the light emitting device 2. In this way, the electrical properties of the light emitting device 2 can be tested before packaging, so that the damaged light emitting device can be identified and replaced in time, thereby improving the transfer yield of the light emitting device.

[0291] Furthermore, the first auxiliary line 512 is located on the surface of the driving backplane 1, and the second auxiliary line 522 is arranged outside the driving backplane 1. This facilitates cutting off at least one of the first auxiliary line 512 or the second auxiliary line 522 after electrical testing of the light-emitting device 2 before packaging. In this way, in the prepared display panel, the connection between the light-emitting device 2 and the functional part 4 is disconnected. The light-emitting device 2 can emit light according to the driving signal of the driving backplane 1.

[0292] In some embodiments, after cutting the first auxiliary line 512 or the second auxiliary line 522 , the preparation method further includes step S290 .

[0293] S290, please refer to FIG. 22(d), coating a packaging adhesive layer 7 to respectively encapsulate the light emitting device 2 and the functional part 4.

[0294] Illustratively, the material of the packaging adhesive layer 7 includes: epoxy resin, silica gel or silicone resin.

[0295] In some embodiments, before the transfer substrate with the light-emitting device is connected to the driving backplane, the method for preparing the display panel further includes: connecting the light sensor to the driving backplane. The specific connection method can refer to the method for preparing the touch panel in some of the above embodiments (steps S1221 to S1224) and Fig.15 , I will not go into details here.

[0296] After the optical sensor is connected to the driving backplane, the subsequent preparation process may also refer to the touch panel preparation method in some of the aforementioned embodiments (steps S141 to S147) and Figure 16(a) to Figure 16(c) .

[0297] In some embodiments, the transfer substrate 8 on which the light emitting device 2 is prepared has a boss 81, and the light emitting device 2 is prepared on the boss 81. The first conductive layer 41, the piezoelectric layer 42, and the second conductive layer 43 together constitute the functional part 4. The sum of the thickness of the boss 81 and the light emitting device 2 is equal to the thickness of the functional part 4.

[0298] For example, the light emitting device 2 may be bonded to the boss 81 by adhesive 82 .

[0299] In the above-mentioned method for manufacturing a display panel, the transfer substrate 8 has a boss 81, and the light-emitting device 2 is manufactured on the boss 81. Based on this, the sum of the thickness of the boss 81 and the light-emitting device 2 is equal to the thickness of the functional part 4, that is, after the transfer substrate 8 and the driving backplane 1 are docked, the transfer substrate 8 is in surface contact with the functional part 4. In this way, it is convenient to uniformly pressurize the functional part 4 to generate current, and it is also easy to avoid damage to the functional layer 4 and the light-emitting device 2 due to excessive pressure.

[0300] In some embodiments, the transfer substrate 8 prepared with the light-emitting device 2 is docked with the driving backplane 1, including: welding the first electrode 22 of the light-emitting device 2 to the end of the first auxiliary line 512 away from the first main line 511 through solder 15, and welding the second electrode 23 of the light-emitting device 2 to the second main line 521 through solder 15.

[0301] Accordingly, electrical testing of the light emitting device 2 according to the conducting state of the light emitting device 2 and replacement of damaged light emitting devices are all performed before the solder 15 solidifies.

[0302] In the above-mentioned method for manufacturing the display panel, the electrical property test of the light-emitting device 2 before packaging can be performed before the solder 15 corresponding to the light-emitting device 2 is solidified. At this time, the damaged light-emitting device can be identified and replaced in time according to the conduction state of the light-emitting device 2. In this way, there is no need to remove the solder 15 before replacing the damaged light-emitting device, which is conducive to improving the transfer yield of the light-emitting device 2, simplifying the manufacturing process of the display panel and improving the production efficiency of the display panel.

[0303] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A touch panel, characterized in that: It includes a driving backplane and a pixel structure arranged on the driving backplane, wherein the pixel structure includes a plurality of repeating units arranged in an array; the repeating unit includes at least one sub-pixel and a touch feedback structure; The sub-pixel includes a light emitting device, and the light emitting device includes a first electrode and a second electrode; The touch feedback structure comprises: a light sensor, used to collect a touch feedback signal; the touch feedback signal is a reflected light signal formed after the light signal emitted by the sub-pixel is reflected by the finger; and A functional part connected to the light sensor, and configured to undergo elastic deformation along a first direction under the control of the light sensor; the first direction is a direction close to the finger; the functional part comprises: a first conductive layer, a piezoelectric layer, and a second conductive layer stacked; the touch panel further comprises: The first conductive line comprises: a first main line and a first auxiliary line that are interconnected; wherein the first main line is connected to the first conductive layer; and an end of the first auxiliary line away from the first main line is connected to the first electrode; The second conductive line comprises: a second main line and a second auxiliary line interconnected with each other; wherein the second main line is connected to the second electrode; and an end of the second auxiliary line away from the second main line is connected to the second conductive layer; Wherein, before the electrical test is performed on the light-emitting device before packaging, the electrical test circuit is a path, and the functional part is also configured to generate current under pressure and turn on the light-emitting device to perform electrical test on the light-emitting device before packaging; after the electrical test is performed on the light-emitting device before packaging, at least one of the first auxiliary line and the second auxiliary line is open circuit.

2. The touch panel according to claim 1, wherein: The optical sensor is multiplexed into a touch sensor; the touch sensor is configured to generate a touch sensing signal in response to a touch operation of the finger.

3. The touch panel according to claim 1, wherein: The light sensor includes a first pad and a second pad; The first conductive layer is connected to the first pad, and the second conductive layer is connected to the second pad; the piezoelectric layer is configured to expand in response to the electrical signal transmitted by the light sensor to the first conductive layer and the second conductive layer to form a protrusion.

4. The touch panel according to claim 1, wherein: The thickness of the functional part is greater than the thickness of the light emitting device and greater than the thickness of the light sensor.

5. The touch panel according to claim 1, wherein: The first main line and the second main line are arranged in the driving back plate, and the first auxiliary line and the second auxiliary line are located on the surface of the driving back plate.

6. The touch panel according to claim 3, wherein: The first pad is connected to an end of the first auxiliary line close to the first main line; the touch panel further includes: A conductive sheet is arranged outside the driving backplane; the second pad is connected to the second conductive layer through the conductive sheet.

7. The touch panel according to claim 1, wherein: The touch panel further includes: a packaging adhesive layer covering the sub-pixels, the light sensors and the functional parts respectively.

8. A display panel, characterized in that: include: The driving backplane is provided with an electrical property detection circuit; A light emitting device is arranged on the driving backplane; The light emitting device comprises a first electrode and a second electrode; and, a functional part, which is arranged beside the light emitting device and connected to the light emitting device through the electrical property detection circuit; The functional part is used to generate current under pressure and turn on the light-emitting device; the functional part includes: a first conductive layer, a piezoelectric layer and a second conductive layer stacked in sequence in a direction away from the driving backplane; The electrical property detection circuit comprises: The first conductive line comprises: a first main line and a first auxiliary line that are interconnected; the first main line is connected to the first conductive layer; and an end of the first auxiliary line away from the first main line is connected to the first electrode; The second conductive line comprises: a second main line and a second auxiliary line interconnected with each other; the second main line is connected to the second electrode; and one end of the second auxiliary line away from the second main line is connected to the second conductive layer; Wherein, before the electrical property test is performed on the light-emitting device before packaging, the electrical property test circuit is open; after the electrical property test is performed on the light-emitting device before packaging, at least one of the first auxiliary line and the second auxiliary line is open.

9. The display panel according to claim 8, wherein: The first main line and the second main line are arranged in the driving back plate, and the first auxiliary line and the second auxiliary line are located on the surface of the driving back plate.

10. The display panel according to claim 8 or 9, characterized in that: The display panel further includes: A light sensor is arranged beside the light emitting device and is used to collect a touch feedback signal; the touch feedback signal is a reflected light signal formed after the light signal emitted by the light emitting device is reflected by the finger; Wherein, the functional part is also connected to the light sensor, and the functional part is also used to undergo elastic deformation along a first direction under the control of the light sensor; the first direction is a direction close to the finger.

11. A method for preparing a display panel, characterized in that: include: Providing a driving backplane, wherein the driving backplane is provided with a first main line and a second main line, and the driving backplane is further provided with a first auxiliary line connected to the first main line; A first conductive layer, a piezoelectric layer and a second conductive layer are sequentially stacked on one side of the driving backplane; the first conductive layer is connected to the first main line; Providing a second auxiliary line, and connecting two ends of the second auxiliary line to the second conductive layer and the second main line respectively; Butt the transfer substrate prepared with the light-emitting device with the driving backplane, so that the first electrode of the light-emitting device is connected to the end of the first auxiliary line away from the first main line, and the second electrode of the light-emitting device is connected to the second main line; Applying pressure to the transfer substrate from a side of the transfer substrate away from the driving backplane, so that the piezoelectric layer generates current under the action of the pressure and turns on the light-emitting device; Performing electrical detection on the light emitting device according to the conduction state of the light emitting device to determine the position of the damaged light emitting device on the driving backplane; removing the transfer substrate and replacing the damaged light-emitting device; The first sub-line and / or the second sub-line are cut off.

12. The method for preparing a display panel according to claim 11, wherein: The transfer substrate on which the light-emitting device is prepared has a boss, and the light-emitting device is prepared on the boss; the first conductive layer, the piezoelectric layer and the second conductive layer together constitute a functional part; wherein, The sum of the thickness of the boss and the light emitting device is equal to the thickness of the functional part.

13. The method for preparing a display panel according to claim 11, wherein: The step of docking the transfer substrate with the light-emitting device with the driving backplane includes: soldering the first electrode of the light-emitting device to an end of the first auxiliary line away from the first main line by soldering, and soldering the second electrode of the light-emitting device to the second main line by soldering; Electrical detection of the light emitting device is performed according to the conducting state of the light emitting device, and the damaged light emitting device is replaced, both of which are performed before the solder is solidified.

14. The method for preparing a display panel according to any one of claims 11 to 13, characterized in that: The first main line and the second main line are arranged inside the driving back plate, and the first auxiliary line and the second auxiliary line are located on the surface of the driving back plate.

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