A combined processing technology for surface treatment of printed circuit board

Abstract

The present invention provides a combined processing technology for surface treatment of a printed circuit board, which sequentially includes a first solder mask process, a first text process, a first gold plating process, a second text process, a second gold plating process, a second solder mask process and a gold plating process. The present invention has the advantages of optimizing the processing flow, saving the cost of processing materials, manpower and time, and improving the stability of product quality.

Description

Technical Field

[0001] The invention relates to the field of PCB, and in particular to a combined processing technology for surface treatment of a printed circuit board. Background Art

[0002] With the development of science and technology, electronic products require more and more functions, and this demand places higher and higher requirements on the surface treatment of printed circuit boards. Now there are different surface treatment combinations in the industry, such as OSP+metallic plating, OSP+tin spraying, metallic plating+gold plating, OSP+metallic plating+gold plating, etc.

[0003] This patent mainly introduces the "chemical gold + gold plating + OSP" process: solder mask (printing → exposure → development → baking) → text (printing → baking) → circuit (pre-treatment → lamination → exposure → development) → chemical gold (pre-treatment → chemical gold → post-processing) → circuit (chemical gold pre-treatment → lamination → development) → gold plating (pre-treatment → gold plating → post-processing) → pressing and baking → molding → beveling → testing → visual inspection (inspection 1 → OSP → inspection 2) → FQA → packaging → warehousing; the whole process can meet product needs, but the process is long, the cost is high, and the quality stability is poor.

[0004] After solder mask, two dry film processes are required. When removing the film, the film remover will seriously attack the solder mask ink, which often causes the ink to change color, fog, fall off, poor OSP, poor solderability, etc.

[0005] Therefore, it is necessary to provide a new technical solution. Summary of the invention

[0006] In order to solve the technical problems existing in the prior art, the present invention discloses a combined processing technology for surface treatment of a printed circuit board, and the specific technical scheme is as follows:

[0007] The invention provides a combined processing technology for surface treatment of a printed circuit board, which sequentially comprises a first solder mask process, a first text process, a first gold plating process, a second text process, a second gold plating process, a second solder mask process and a gold plating process.

[0008] Furthermore, the first solder mask process includes printing, pre-baking, exposure, development and baking steps, and the solder mask ink is evenly brushed onto the surface of the circuit board, and the solder mask ink is dried and hardened.

[0009] Furthermore, the first text process includes printing and baking steps, printing the text ink onto the surface of the circuit board, and drying and hardening the text ink.

[0010] Furthermore, the first electroplating process includes brushing, micro-etching, sandblasting, ultrasonic water washing, acid washing, water washing and drying steps to clean the surface of the circuit board.

[0011] Furthermore, the second text process includes printing and baking steps, using wet film ink to print on the corresponding position of the circuit board surface, covering all the OSP surface treatment areas with ink, and then drying and hardening the text ink.

[0012] Furthermore, the second gold plating process includes gold plating pre-treatment, gold plating line and gold plating post-treatment steps, and uses chemical immersion plating reaction, replacement reaction and self-reduction reaction to deposit a nickel layer and a gold layer on the copper surface.

[0013] Furthermore, the second solder mask process includes printing, pre-baking, exposure and development steps, and the OSP and gold-plated surface treatment areas are all covered with ink, and the exposed copper surface is gold-plated.

[0014] The gold plating process includes gold plating pre-treatment, gold plating line and gold plating post-treatment steps. Through electrochemical reaction, the circuit board is immersed in a chemical solution as a cathode, the circuit board is used as an anode, and a direct current is connected to deposit the required plating layer on the circuit board.

[0015] The present invention has the following beneficial effects:

[0016] 1. The combined processing technology for surface treatment of printed circuit boards provided by the present invention can optimize the processing flow.

[0017] 2. The combined processing technology for surface treatment of printed circuit boards provided by the present invention can save costs in processing materials, manpower and time.

[0018] 3. The combined processing technology for surface treatment of printed circuit boards provided by the present invention can improve the stability of product quality.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. DETAILED DESCRIPTION

[0020] To further illustrate the technical means adopted by the present invention and the technical effects achieved, the following is a detailed description in conjunction with embodiments.

[0021] The invention provides a combined processing technology for surface treatment of a printed circuit board, which sequentially comprises a first solder mask process, a first text process, a first gold plating process, a second text process, a second gold plating process, a second solder mask process and a gold plating process.

[0022] The first solder mask process includes printing, pre-baking, exposure, development and baking steps, and the solder mask ink is evenly brushed onto the surface of the circuit board, and the solder mask ink is dried and hardened.

[0023] The first text process includes printing and baking steps, printing text ink onto the surface of the circuit board, and drying and hardening the text ink.

[0024] The first electroplating process includes brushing, micro-etching, sandblasting, ultrasonic water washing, acid washing, water washing and drying steps to clean the surface of the circuit board.

[0025] The second text process includes printing and baking steps, using wet film ink to print on the corresponding position of the circuit board surface, covering all the OSP surface treatment areas with ink, and then drying and hardening the text ink.

[0026] The second gold plating process includes gold plating pre-treatment, gold plating line and gold plating post-treatment steps, and uses chemical immersion plating reaction, displacement reaction and self-reduction reaction to deposit a nickel layer and a gold layer on the copper surface.

[0027] The second solder mask process includes printing, pre-baking, exposure and development steps. The OSP and gold-plated surface treatment areas are all covered with ink, and the exposed copper surface is gold-plated.

[0028] The gold plating process includes gold plating pre-treatment, gold plating line and gold plating post-treatment steps. Through electrochemical reaction, the circuit board is immersed in a chemical solution as a cathode, the circuit board is used as an anode, and a direct current is connected to deposit the required plating layer on the circuit board.

[0029] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification.

[0030] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify and vary the above embodiments within the scope of the present invention.

Claims

1. A combined processing technology for surface treatment of a printed circuit board, characterized in that: It includes the first solder mask process, the first text process, the first gold plating process, the second text process, the second gold plating process, the second solder mask process and the gold plating process. The first solder mask process includes printing, pre-baking, exposure, development and baking steps, brushing the solder mask ink evenly onto the surface of the circuit board, and drying and hardening the solder mask ink. The first text process includes printing and baking steps, printing the text ink on the surface of the circuit board, and drying and hardening the text ink. The first electroplating process includes brushing, micro-etching, sandblasting, ultrasonic water washing, pickling, water washing and drying steps to clean the surface of the circuit board. The second text process includes printing and baking steps, using wet film ink to print on the corresponding position of the circuit board surface, covering all the OSP surface treatment areas with ink, and then drying and hardening the text ink. The second gold plating process includes gold plating pre-treatment, gold plating wire and gold plating post-treatment steps, using chemical immersion plating reaction, displacement reaction, and self-reduction reaction to deposit a nickel layer and a gold layer on the copper surface. The second solder mask process includes printing, pre-baking, exposure and development steps. The OSP and gold-plated surface treatment areas are all covered with ink, and the exposed copper surface is gold-plated.

2. The combined processing technology for surface treatment of printed circuit boards according to claim 1, characterized in that: The gold plating process includes gold plating pre-treatment, gold plating line and gold plating post-treatment steps. Through electrochemical reaction, the circuit board is immersed in a chemical solution as a cathode, the circuit board is used as an anode, and a direct current is connected to deposit the required plating layer on the circuit board.