Probe test machine and test system, and method for replacing probe card

Abstract

A probe test machine and a test system, and a method for replacing a probe card, the probe test machine comprising: a test chamber; a carrier, arranged in the test chamber and configured to carry a wafer to be tested; a first probe card accommodating chamber, arranged adjacent to the test chamber and configured to accommodate a first probe card; a second probe card accommodating chamber, arranged adjacent to the test chamber and configured to accommodate a second probe card; a first temperature control device, arranged in the first probe card accommodating chamber and configured to adjust the temperature of the first probe card accommodating chamber; a second temperature control device, arranged in the second probe card accommodating chamber and configured to adjust the temperature of the second probe card accommodating chamber; and a third temperature control device, arranged in the test chamber and configured to adjust the temperature in the test chamber.

Description

Technical Field

[0001] The present disclosure relates to the technical field of integrated circuit testing, and in particular to a probe testing machine and a testing system, and a method for replacing a probe card. Background Art

[0002] The field of integrated circuit testing technology is a core industry of the new generation of information technology industry. It has an extremely important strategic position and is one of the most important high-tech technologies to promote the development of national economy and social informatization. Integrated circuits, such as wafers, need to undergo various tests, such as low-temperature environment tests, to detect the working performance of integrated circuits in low-temperature environments. Summary of the invention

[0003] Some embodiments of the present disclosure provide a probe test machine, the probe test machine comprising:

[0004] Test chamber;

[0005] A carrier, disposed in the test chamber and configured to carry a wafer to be tested;

[0006] A first probe card accommodating cavity is disposed adjacent to the test cavity and configured to accommodate a first probe card;

[0007] A second probe card accommodating cavity, disposed adjacent to the test cavity and configured to accommodate a second probe card;

[0008] A first temperature adjustment device, disposed in the first probe card accommodating cavity, configured to adjust the temperature of the first probe card accommodating cavity;

[0009] a second temperature adjustment device, disposed in the second probe card accommodating cavity and configured to adjust the temperature of the second probe card accommodating cavity; and

[0010] The third temperature adjustment device is disposed in the test cavity and is configured to adjust the temperature in the test cavity.

[0011] In some embodiments, the first probe card accommodating cavity comprises:

[0012] a first inner door, disposed on a side of the first probe card accommodating chamber close to the test chamber, and configured to switch between an open state and a closed state, wherein in response to the first inner door being opened, the first probe card accommodating chamber is connected to the test chamber, and in response to the first inner door being closed, the first probe card accommodating chamber is isolated from the test chamber; and

[0013] The first outer door is arranged on the side of the first probe card accommodating cavity away from the test cavity and is configured to switch between an open state and a closed state. In response to the first outer door being opened, the first probe card accommodating cavity is connected to the outside world. In response to the first outer door being closed, the first probe card accommodating cavity is isolated from the outside world.

[0014] In some embodiments, the second probe card accommodating cavity includes:

[0015] a second inner door, disposed on a side of the second probe card accommodating chamber close to the test chamber, and configured to switch between an open state and a closed state, wherein in response to the second inner door being opened, the second probe card accommodating chamber is connected to the test chamber, and in response to the second inner door being closed, the second probe card accommodating chamber is isolated from the test chamber; and

[0016] The second outer door is arranged on the side of the second probe card accommodating cavity away from the test cavity and is configured to switch between an open state and a closed state. In response to the second outer door being opened, the second probe card accommodating cavity is connected to the outside world. In response to the second outer door being closed, the second probe card accommodating cavity is isolated from the outside world.

[0017] In some embodiments, the probe test machine further includes:

[0018] The conveying device is configured to carry the first probe card and / or the second probe card.

[0019] In some embodiments, the probe test machine further includes:

[0020] a first ventilation device, connected to the first probe card accommodating chamber and configured to deliver dry gas to the first probe card accommodating chamber;

[0021] a second ventilation device, connected to the second probe card accommodating chamber and configured to deliver dry gas to the second probe card accommodating chamber; and

[0022] The third ventilation device is connected to the test cavity and is configured to deliver dry gas to the test cavity.

[0023] Some embodiments of the present disclosure provide a method for replacing a probe card. The probe test machine described in the above embodiment is characterized in that the method includes:

[0024] Lowering the temperature of the first probe card accommodating cavity and the second probe card accommodating cavity to a first predetermined temperature, wherein the first probe card is in a test position in the test cavity to perform a low temperature probe test, and the second probe card is stored in the second probe card accommodating cavity;

[0025] Opening a first inner door of the first probe card accommodating chamber, moving the first probe card from the testing position to the first probe card accommodating chamber, and closing the first inner door; and

[0026] The second inner door of the second probe card accommodating chamber is opened, the second probe card is moved to the testing position, and the second inner door is closed.

[0027] In some embodiments, before lowering the temperature of the first probe card accommodating cavity and the second probe card accommodating cavity to the first predetermined temperature, the method further includes:

[0028] The second outer door of the second probe card accommodating chamber is opened, the second probe card is moved from the outside to the second probe card accommodating chamber, and the second outer door is closed.

[0029] In some embodiments, after opening the second inner door of the second probe card accommodating chamber, moving the second probe card to the testing position, and closing the second inner door, the method further includes:

[0030] Raising the temperature of the first probe card accommodating cavity to a second predetermined temperature; and

[0031] The first outer door of the first probe card accommodating chamber is opened, the first probe card is moved out of the first probe card accommodating chamber, and the first outer door is closed.

[0032] In some embodiments, the first predetermined temperature is not lower than the temperature at which each of the first probe card and the second probe card performs a low temperature probe test.

[0033] After opening the second inner door of the second probe card accommodating chamber, moving the second probe card to the testing position, and closing the second inner door, the method further includes:

[0034] The temperature of the test chamber is adjusted to a temperature of the second probe card for performing a low temperature probe test.

[0035] Some embodiments of the present disclosure provide a testing system, including: the probe testing machine described in the aforementioned embodiments.

[0036] Compared with the related art, the above solution of the embodiment of the present disclosure has at least the following beneficial effects:

[0037] By setting up at least two probe card accommodating cavities adjacent to the test cavity in the probe testing machine, the two probe card accommodating cavities can be connected to or isolated from the test cavity through their inner doors, and each probe card accommodating cavity can independently adjust its internal temperature, thereby realizing rapid replacement of probe cards in the probe testing machine and improving work efficiency.

[0038] Each probe card accommodating cavity is also provided with an independent ventilation device, so that during the temperature adjustment process of each probe card accommodating cavity, the probe card stored therein is ensured to be in a dry state, thereby protecting the probe card. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The drawings herein are incorporated into the specification and constitute a part of the specification, showing embodiments consistent with the present disclosure, and together with the specification, are used to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0040] Figure 1 A schematic diagram of the structure of a test system provided in an embodiment of the present disclosure;

[0041] Figure 2 A partial structural schematic diagram of a probe test machine provided in some embodiments of the present disclosure; and

[0042] Figure 3 A flowchart of a method for replacing a probe card provided in some embodiments of the present disclosure. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0044] The terms used in the embodiments of the present disclosure are only for the purpose of describing specific embodiments, and are not intended to limit the present disclosure. The singular forms "a", "said" and "the" used in the embodiments of the present disclosure and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0045] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0046] It should be understood that although the terms first, second, third, etc. may be used to describe in the present disclosure, these should not be limited to these terms. These terms are only used to distinguish. For example, without departing from the scope of the present disclosure, the first may also be referred to as the second, and similarly, the second may also be referred to as the first.

[0047] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a product or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such product or device. In the absence of more restrictions, the elements defined by the sentence "comprises a" do not exclude the presence of other identical elements in the product or device including the elements.

[0048] In the related art, when wafers are probed, they usually need to be tested on a probe tester (Prober) in conjunction with an automatic test equipment (ATE). The test head of the automatic test equipment (ATE) connects the probe board through a spring pin connection tower to perform probe testing on the wafer placed on the carrier in the probe tester (Prober).

[0049] The probe card can be sent in through the transfer gate on the probe test machine (Prober) shell, and carried by a transfer device, such as a robotic arm, to the test position in the test chamber of the probe test machine (Prober) to perform the probe test. After the test is completed, or when the probe card needs to be replaced, the transfer device will move the probe card that has completed the test from the test position to the transfer gate. The test chamber is directly connected to the space at the transfer gate inside the probe test machine. The operator can take out the probe card that has completed the test, and put in another probe card to be tested, and then the transfer device will move it to the test position in the test chamber of the probe test machine (Prober) to perform the probe test.

[0050] This method of replacing the probe card is acceptable for performing normal temperature tests. However, a considerable part of the wafer probe test needs to be performed in a low temperature environment. For example, in the case where the probe tests of two consecutive probe cards need to be performed in a low temperature environment, when replacing the probe card to perform the test, it is necessary to raise the temperature of the test chamber where the previous probe card is located to room temperature after the previous probe card completes the test task, and then move the probe card that has completed the test from the test position to the transfer gate. The operator opens the transfer gate to replace the probe card, that is, takes out the previous probe card that has completed the test, and puts in another subsequent probe card to be tested. The transfer gate is then closed and the subsequent probe card is moved to the test position in the test chamber. After the test chamber is cooled to the low-temperature probe test temperature of the subsequent probe card, the wafer probe test step is performed.

[0051] This means that replacing the probe card requires a large test chamber that has to be heated from low temperature to room temperature and then cooled from room temperature to low temperature, resulting in low test efficiency. If the temperature adjustment step is not performed, the delicate probe card may condense on its surface in an environment with drastic temperature changes, causing damage to the probe card.

[0052] The present disclosure provides a probe test machine, the probe test machine comprising: a test chamber; a carrier, arranged in the test chamber, configured to carry a wafer to be tested; a first probe card accommodating chamber, arranged adjacent to the test chamber, configured to accommodate a first probe card; a second probe card accommodating chamber, arranged adjacent to the test chamber, configured to accommodate a second probe card; a first temperature control device, arranged in the first probe card accommodating chamber, configured to adjust the temperature of the first probe card accommodating chamber; a second temperature control device, arranged in the second probe card accommodating chamber, configured to adjust the temperature of the second probe card accommodating chamber; and a third temperature control device, arranged in the test chamber, configured to adjust the temperature in the test chamber. By arranging at least two probe card accommodating chambers adjacent to the test chamber in the probe test machine, the two probe card accommodating chambers can be connected to or isolated from the test chamber through their inner doors, and each probe card accommodating chamber can independently regulate its internal temperature, thereby realizing rapid replacement of probe cards in the probe test machine and improving work efficiency.

[0053] The optional embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0054] Figure 1 A schematic diagram of the structure of a test system provided in an embodiment of the present disclosure is shown in FIG. Figure 2 A partial structural schematic diagram of a probe testing machine provided in some embodiments of the present disclosure.

[0055] like Figure 1As shown, the testing system 1000 includes a probe testing machine 100 and an automatic testing machine 200 . Figure 1 The test system 1000 is shown in the state of performing a test. The test head 210 of the automatic test machine 200 is connected to the probe card 400 performing a probe test through the spring pin connection tower 300 , and performs a probe test on the wafer 500 located in the test cavity 110 of the probe test machine 100 .

[0056] Combination Figure 1 and Figure 2 As shown, the probe test machine 100 includes a test chamber 110 , a carrier 120 , a first probe card accommodating chamber 130 , a second probe card accommodating chamber 140 , a first temperature regulating device 150 , a second temperature regulating device 160 and a third temperature regulating device 170 .

[0057] The test chamber 110 provides space for probe testing. The carrier 120 is disposed in the test chamber 110 and is configured to carry the wafer 500 to be tested. The carrier 120 can, for example, drive the wafer to move in multiple directions, such as up and down, left and right, and front and back, and can also drive the wafer to rotate to position the wafer in a suitable test position.

[0058] The first probe card accommodating cavity 130 is disposed adjacent to the test cavity 110 and is configured to accommodate the first probe card. Figure 2 As shown, the first probe card accommodating cavity 130 is substantially surrounded by the accommodating cavity 110 , and a side wall thereof is located on a side wall of the probe testing machine 100 .

[0059] The second probe card accommodating cavity 140 is disposed adjacent to the test cavity 110 and is configured to accommodate a second probe card. Figure 2 As shown, the second probe card accommodating cavity 130 is substantially surrounded by the accommodating cavity 110 , and a side wall thereof is located on a side wall of the probe testing machine 100 .

[0060] In some embodiments, the first probe card accommodating cavity 130 and the second probe card accommodating cavity 140 may be disposed adjacent to each other or spaced apart. When the first probe card accommodating cavity 130 and the second probe card accommodating cavity 140 are disposed adjacent to each other, it is convenient for operators to pick up or place the first probe card and / or the second probe card.

[0061] The first temperature adjustment device 150 is disposed in the first probe card accommodating cavity 130 , and is configured to adjust the temperature of the first probe card accommodating cavity 130 , and can accurately and quickly adjust the temperature in the first probe card accommodating cavity 130 .

[0062] The second temperature adjustment device 160 is disposed in the second probe card accommodating cavity 140 , and is configured to adjust the temperature of the second probe card accommodating cavity 140 , and can accurately and quickly adjust the temperature in the second probe card accommodating cavity 140 .

[0063] The third temperature control device 170 is disposed in the test chamber 110 and is configured to adjust the temperature in the test chamber 110, and can accurately and quickly adjust the temperature in the test chamber 110. Since the space of the test chamber 110 is significantly larger than the first probe card accommodating chamber 130 and the second probe card accommodating chamber 140, the third temperature control device 170 needs to use a higher power temperature control device to improve work efficiency.

[0064] In some embodiments, Figure 1 and Figure 2 As shown, the first probe card accommodating chamber 130 includes a first inner door 131 and a first outer door 132. The first inner door 131 is disposed on the side of the first probe card accommodating chamber 130 close to the test chamber 110, and is configured to switch between an open state and a closed state. In response to the opening of the first inner door 131, the first probe card accommodating chamber 130 is connected to the test chamber 110. In this case, the first probe card can be transported between the first probe card accommodating chamber 130 and the test chamber 110. In response to the closing of the first inner door 131, the first probe card accommodating chamber 130 is isolated from the test chamber 110. In this case, the first probe card accommodating chamber 130 and the test chamber 110 can adjust the temperature independently so that the two are at different temperatures.

[0065] The first outer door 132 is arranged on the side of the first probe card accommodating chamber 130 away from the test chamber 110, for example, it is arranged on the outer shell side wall of the probe test machine 100, as a part of the outer shell side wall of the probe test machine 100. The first outer door 132 is arranged opposite to the first inner door 131, for example, and is configured to switch between an open state and a closed state. In response to the opening of the first outer door 132, the first probe card accommodating chamber 130 is connected to the outside world, and the operator can place the first probe card in the first probe card accommodating chamber 130, or take the first probe card out of the first probe card accommodating chamber 130. In response to the closing of the first outer door 132, the first probe card accommodating chamber 130 is isolated from the outside world, and the first probe card accommodating chamber 130 can be adjusted to different temperatures from the outside world under the action of the first temperature adjustment device 150. The outside temperature is, for example, room temperature.

[0066] In some embodiments, Figure 1 and Figure 2As shown, the second probe card accommodating chamber 140 includes: a second inner door 141 and a second outer door 142. The second inner door 141 is arranged on the side of the second probe card accommodating chamber 140 close to the test chamber 110, and is configured to switch between an open state and a closed state. In response to the second inner door 141 being opened, the second probe card accommodating chamber 140 is connected to the test chamber 110. In this case, the second probe card can be transported between the second probe card accommodating chamber 140 and the test chamber 110. In response to the second inner door 141 being closed, the second probe card accommodating chamber 140 is isolated from the test chamber 110. In this case, the second probe card accommodating chamber 140 and the test chamber 110 can adjust the temperature independently so that the two are at different temperatures.

[0067] The second outer door 142 is arranged on the side of the second probe card accommodating chamber 140 away from the test chamber 110, for example, it is arranged on the outer shell side wall of the probe test machine 100, as a part of the outer shell side wall of the probe test machine 100. The second outer door 1422 is arranged opposite to the second inner door 141, for example, and is configured to switch between an open state and a closed state. In response to the opening of the second outer door 142, the second probe card accommodating chamber 140 is connected to the outside world, and the operator can place the second probe card in the second probe card accommodating chamber 140, or take the second probe card out of the second probe card accommodating chamber 140. In response to the closing of the second outer door 142, the second probe card accommodating chamber 140 is isolated from the outside world, and the second probe card accommodating chamber 140 can be adjusted to different temperatures from the outside world under the action of the second temperature control device 160. The outside temperature is, for example, room temperature.

[0068] With such an arrangement, when the low-temperature probe test of the first probe card and the second probe card is performed sequentially, the operation of heating the test cavity 110 with a larger space to room temperature and then cooling it to the test temperature may not be performed. Specifically, during the process of performing the low-temperature probe test on the first probe card, the second probe card is transported from the outside to the second probe card accommodating cavity through the second outer door, and the temperatures in the second probe card accommodating cavity and the first probe card accommodating cavity are lowered to a first predetermined temperature, such as -10°C, -20°C, etc., and then the first probe card that has completed the test is transported from the test position in the test cavity to the first probe card accommodating cavity via the first inner door, and the second probe card to be tested is transported from the second probe card accommodating cavity to the test position in the test cavity via the second inner door. During this process, the test cavity is kept in a low-temperature state, so that the switching of the probe cards can be completed quickly, thereby improving work efficiency.

[0069] In some embodiments, the probe test machine further comprises a conveying device, such as a robotic arm, configured to carry the first probe card and / or the second probe card. In some embodiments, the probe card needs to be placed in a card tray, and the robotic arm contacts the card tray to carry the probe card.

[0070] In some embodiments, the probe test machine further includes a plurality of ventilation devices, for example, a first ventilation device, a second ventilation device, and a third ventilation device.

[0071] The first ventilation device is connected to the first probe card accommodating cavity 130, and is configured to deliver dry gas, such as dry nitrogen, to the first probe card accommodating cavity 130, so that during the temperature adjustment process of the first probe card accommodating cavity 130 storing the first probe card, the first probe card is always kept dry to avoid condensation of liquid, such as water, thereon, thereby preventing the first probe card from being damaged by moisture.

[0072] The second ventilation device is connected to the second probe card accommodating cavity 140, and is configured to deliver dry gas, such as dry nitrogen, to the second probe card accommodating cavity 140, so that during the temperature adjustment process of the second probe card accommodating cavity 140 storing the second probe card, the second probe card is always kept dry to avoid condensation of liquid, such as water, thereon, thereby preventing the second probe card from being damaged by moisture.

[0073] The third ventilation device is connected to the test chamber 110 and is configured to deliver dry gas, such as dry nitrogen, to the test chamber 110, so that the probe card can always remain dry during the temperature adjustment process of the test chamber 110 storing the probe card to avoid condensation of liquid, such as water, thereon, thereby preventing the probe card from being damaged by moisture.

[0074] Figure 3 A flowchart of a method for replacing a probe card provided in some embodiments of the present disclosure, such as Figure 3 As shown, some embodiments of the present disclosure provide a method for replacing a probe card, using the probe test machine 100 described in the above embodiment, the method includes the following steps:

[0075] S103: Lowering the temperature of the first probe card accommodating cavity and the second probe card accommodating cavity to a first predetermined temperature, wherein the first probe card is at a test position in the test cavity to perform a low temperature probe test, and the second probe card is stored in the second probe card accommodating cavity.

[0076] For the foreseeable operation of switching probe cards, and two consecutive probe cards need to perform low-temperature probe tests, during the process of performing low-temperature probe tests when the first probe card is at the test position in the test cavity 110, the first temperature control device 150 and the second temperature control device 160 are used to respectively lower the temperature of the first probe card accommodating cavity 130 and the second probe card accommodating cavity 140 where the second probe card to be tested is stored to a first predetermined temperature, such as -10°C, -20°C, etc.

[0077] S105: opening a first inner door of the first probe card accommodating chamber, moving the first probe card from the testing position to the first probe card accommodating chamber, and closing the first inner door;

[0078] Specifically, the first inner door 131 of the first probe card accommodating chamber 130 is opened, and a transmission device, such as a mechanical arm, is used to pick up the first probe card that has completed the low-temperature probe test and is located at the test position of the accommodating chamber 110, and transport it to the first probe card accommodating chamber 130. Since the first probe card accommodating chamber 130 is at a first predetermined temperature, the first probe card transported to the first probe card accommodating chamber 130 will not condense liquid on the surface due to the temperature difference. In some embodiments, the first predetermined temperature can be equal to the ambient temperature in the accommodating chamber 130, that is, the ambient temperature when the first probe card performs the low-temperature probe test. After the first probe card is stored in the first probe card accommodating chamber 130, the first inner door 131 is closed to isolate the first probe card accommodating chamber 130 from the test chamber 110.

[0079] S107: Open the second inner door of the second probe card accommodating chamber, move the second probe card to the testing position, and close the second inner door.

[0080] Specifically, the second inner door 141 of the second probe card accommodating chamber 140 is opened, and a transmission device, such as a robotic arm, is used to pick up the second probe card in the second probe card accommodating chamber 140, and the test position of the accommodating chamber 110 is used to perform a low-temperature probe test. Since the second probe card accommodating chamber 140 is at a first predetermined temperature, the second probe card in the first predetermined temperature environment can be transported to the test position in the test chamber 110 without condensation of liquid on the surface due to the temperature difference. After the second probe card is moved out of the second probe card accommodating chamber 140, the second inner door 141 is closed to isolate the second probe card accommodating chamber 140 from the test chamber 110.

[0081] By adopting the above-mentioned method of replacing probe boards, when performing low-temperature probe tests on the first probe board and the second probe board in sequence, it is not necessary to heat the test cavity 110 with a larger space to room temperature and then cool it to the test temperature. The test cavity remains in a low-temperature state, so that the switching of probe boards can be completed quickly, thereby improving work efficiency.

[0082] In some embodiments, Figure 3 As shown, before lowering the temperature of the first probe card accommodating cavity and the second probe card accommodating cavity to a first predetermined temperature, the method further includes:

[0083] S101: opening a second outer door of the second probe card accommodating chamber, moving the second probe card from the outside into the second probe card accommodating chamber, and closing the second outer door.

[0084] Specifically, the second probe card accommodating chamber 140 is at room temperature, for example. The second outer door 142 of the second probe card accommodating chamber 140 is opened, so that the second probe card accommodating chamber 140 is connected to the outside world at room temperature. The second probe card is transported from the outside to the second probe card accommodating chamber 140. Since the second probe card accommodating chamber 140 is at room temperature, for example, the second probe card in the outside world at room temperature can be transported to the second probe card accommodating chamber 140 without condensation of liquid on the surface due to the temperature difference. After the second probe card is transported to the second probe card accommodating chamber 140, the second outer door 142 is closed, so that the second probe card accommodating chamber 140 is isolated from the outside world.

[0085] In some embodiments, Figure 3 As shown, after opening the second inner door of the second probe card accommodating cavity, moving the second probe card to the test position, and closing the second inner door, the method further includes:

[0086] S109: Raising the temperature of the first probe card accommodating cavity to a second predetermined temperature;

[0087] Specifically, the first temperature regulating device 150 is used to increase the temperature of the first probe card accommodating cavity 130 storing the first probe card to a second predetermined temperature, such as room temperature.

[0088] S111: opening a first outer door of the first probe card accommodating chamber, moving the first probe card out of the first probe card accommodating chamber, and closing the first outer door.

[0089] Specifically, the first probe card accommodating chamber 130 is, for example, at room temperature, and the first outer door 132 of the first probe card accommodating chamber 130 is opened, so that the first probe card accommodating chamber 130 is connected to the outside world at room temperature, and the first probe card is taken out of the first probe card accommodating chamber 130. Since the first probe card accommodating chamber 130 is at room temperature, liquid will not condense on the surface of the first probe card due to the temperature difference when the first probe card is taken out of the first probe card accommodating chamber 130. After the first probe card is taken out, the first outer door 132 is closed, so that the first probe card accommodating chamber 130 is isolated from the outside world. The first probe card is, for example, stored in a probe card storage container at room temperature.

[0090] In some embodiments, during the operation of the probe test machine, the first ventilation device, the second ventilation device and the third ventilation device are always in operation, and continuously deliver dry gas to the first probe card accommodating cavity 130, the second probe card accommodating cavity 140 and the test cavity 110, respectively, to ensure that the insides of them are in a dry state, thereby drying the probe cards therein.

[0091] In some embodiments, for at least one of the first probe card accommodating cavity 130, the second probe card accommodating cavity 140, and the test cavity 110 accommodating the probe card, especially when the temperature needs to be adjusted, the dry gas flow rate of the corresponding ventilation device can be increased to ensure that the probe card is always in a dry state.

[0092] In some embodiments, for at least one of the first probe card accommodating cavity 130 , the second probe card accommodating cavity 140 and the test cavity 110 that does not accommodate a probe card and whose temperature does not change, the corresponding ventilation device can be stopped to save energy.

[0093] In some embodiments, the first predetermined temperature is, for example, not lower than the temperature at which each of the first probe card and the second probe card performs a low-temperature probe test. In the art, the temperature of the low-temperature probe test performed by the probe card is usually not higher than -20°C, such as -20°C, -30°C, -40°C, etc. The applicant found that when a probe card at -10°C is directly placed in a lower temperature environment, such as -20°C, -30°C, or -40°C, or a probe card at a temperature below -20°C is directly placed in an environment of -10°C, basically no condensation of liquid will occur. Therefore, the first predetermined temperature can be selected, for example, at -10°C, without having to be lowered to a lower temperature to save energy.

[0094] In this case, after opening the second inner door of the second probe card accommodating chamber, moving the second probe card to the testing position, and closing the second inner door, the method further includes:

[0095] The temperature of the test chamber 110 is adjusted to a temperature of the second probe card for performing a low-temperature probe test.

[0096] Specifically, since the test chamber 110 is connected to the first probe card accommodating chamber 130 and the second probe card accommodating chamber 140, after the first probe card and the second probe card are moved, the temperature in the test chamber 110 may not meet the temperature for performing the low-temperature probe test of the second probe card. Therefore, it is necessary to adjust the temperature of the test chamber 110 to the temperature for performing the low-temperature probe test of the second probe card to perform the low-temperature probe test.

[0097] In some embodiments, Figure 1 As shown, the present disclosure provides a testing system 1000 , including the probe testing machine 100 in the aforementioned implementation.

[0098] Finally, it should be noted that: each embodiment in this specification is described by way of example, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the system or device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0099] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A method for replacing a probe card, applied to a probe test machine, characterized in that: The probe test machine comprises: Test chamber; A carrier, disposed in the test chamber and configured to carry a wafer to be tested; A first probe card accommodating chamber is provided adjacent to the test chamber and configured to accommodate a first probe card. The first probe card accommodating chamber comprises a first inner door provided at a side of the first probe card accommodating chamber close to the test chamber and configured to switch between an open state and a closed state. In response to the first inner door being opened, the first probe card accommodating chamber is connected to the test chamber. In response to the first inner door being closed, the first probe card accommodating chamber is isolated from the test chamber. A first outer door is provided at a side of the first probe card accommodating chamber away from the test chamber and configured to switch between an open state and a closed state. In response to the first outer door being opened, the first probe card accommodating chamber is connected to the outside world. In response to the first outer door being closed, the first probe card accommodating chamber is isolated from the outside world. A second probe card accommodating chamber is arranged adjacent to the test chamber and configured to accommodate a second probe card. The second probe card accommodating chamber includes a second inner door, which is arranged on a side of the second probe card accommodating chamber close to the test chamber and configured to switch between an open state and a closed state. In response to the second inner door being opened, the second probe card accommodating chamber is connected to the test chamber. In response to the second inner door being closed, the second probe card accommodating chamber is isolated from the test chamber. A second outer door is arranged on a side of the second probe card accommodating chamber away from the test chamber and configured to switch between an open state and a closed state. In response to the second outer door being opened, the second probe card accommodating chamber is connected to the outside world. In response to the second outer door being closed, the second probe card accommodating chamber is isolated from the outside world. A first temperature adjustment device, disposed in the first probe card accommodating cavity, configured to adjust the temperature of the first probe card accommodating cavity; a second temperature adjustment device, disposed in the second probe card accommodating cavity and configured to adjust the temperature of the second probe card accommodating cavity; and A third temperature adjustment device is disposed in the test cavity and is configured to adjust the temperature in the test cavity. The method comprises: Lowering the temperature of the first probe card accommodating cavity and the second probe card accommodating cavity to a first predetermined temperature, wherein the first probe card is in a test position in the test cavity to perform a low temperature probe test, and the second probe card is stored in the second probe card accommodating cavity; Opening a first inner door of the first probe card accommodating chamber, moving the first probe card from the testing position to the first probe card accommodating chamber, and closing the first inner door; and The second inner door of the second probe card accommodating chamber is opened, the second probe card is moved to the testing position, and the second inner door is closed.

2. The method according to claim 1, wherein: Before lowering the temperature of the first probe card accommodating cavity and the second probe card accommodating cavity to a first predetermined temperature, the method further includes: The second outer door of the second probe card accommodating chamber is opened, the second probe card is moved from the outside to the second probe card accommodating chamber, and the second outer door is closed.

3. The method according to claim 1, wherein: After opening the second inner door of the second probe card accommodating chamber, moving the second probe card to the testing position, and closing the second inner door, the method further includes: Raising the temperature of the first probe card accommodating cavity to a second predetermined temperature; and The first outer door of the first probe card accommodating chamber is opened, the first probe card is moved out of the first probe card accommodating chamber, and the first outer door is closed.

4. The method according to claim 1, wherein: The first predetermined temperature is not lower than the temperature at which each of the first probe card and the second probe card performs a low temperature probe test, After opening the second inner door of the second probe card accommodating chamber, moving the second probe card to the testing position, and closing the second inner door, the method further includes: The temperature of the test chamber is adjusted to a temperature of the second probe card for performing a low temperature probe test.

5. The method according to any one of claims 1 to 4, wherein: The probe test machine also includes: The conveying device is configured to carry the first probe card and / or the second probe card.

6. The method according to any one of claims 1 to 4, wherein: The probe test machine also includes: a first ventilation device, connected to the first probe card accommodating chamber and configured to deliver dry gas to the first probe card accommodating chamber; a second ventilation device, connected to the second probe card accommodating chamber and configured to deliver dry gas to the second probe card accommodating chamber; and The third ventilation device is connected to the test cavity and is configured to deliver dry gas to the test cavity.

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