Method for preparing LED panel

Abstract

The embodiment of the present application discloses a method for preparing an LED panel, including forming a glue layer on a photoresist layer, the photoresist layer including a plurality of first parts and a plurality of second parts connected to each other; arranging LED devices on the area of ​​the glue layer corresponding to the first parts; softening at least the second part of the photoresist layer to form an LED transfer substrate; transferring the LED transfer substrate to align with a target substrate, and fixing the LED devices on the target substrate. The embodiment of the present application uses a photoresist layer as a flexible substrate of the LED transfer substrate, and by softening the second part of the photoresist layer corresponding to the non-LED device area, the flexibility of the transfer substrate is improved, so as to improve the application range of the LED transfer substrate.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for preparing an LED panel. Background Art

[0002] Micro-LED is a display technology that miniaturizes and matrices the traditional light emitting diode (LED) structure, uses integrated circuit technology to make a substrate to be transferred, and transfers the Micro-LED to the substrate through mass transfer technology to achieve addressing control and individual drive of each pixel.

[0003] In the process of research and practice of the prior art, the inventors of the present application found that in the process of mass transfer, hard substrates such as glass substrates are generally used as micro-LED transfer substrates, but hard transfer substrates are not easy to bend and are not suitable for curved and flexible panels. Summary of the invention

[0004] The embodiment of the present application provides a method for preparing an LED panel, which can achieve flexible transfer.

[0005] The present invention provides a method for preparing an LED panel, which comprises the following steps:

[0006] forming a glue layer on the photoresist layer, wherein the photoresist layer includes a plurality of first parts and a plurality of second parts connected to each other;

[0007] Arranging an LED device on the area of ​​the glue layer corresponding to the first portion;

[0008] softening at least a second portion of the photoresist layer to form an LED transfer substrate;

[0009] The LED transfer substrate is transferred to align with the target substrate, and the LED device is fixed on the target substrate.

[0010] Optionally, in some embodiments of the present application, softening at least the second portion of the photoresist layer comprises the following steps:

[0011] Acquiring a distribution image of the LED device;

[0012] According to the image, controlling the display to display a picture to illuminate the photoresist layer; the picture includes a first picture and a second picture, the first picture corresponds to the first part, and the second picture corresponds to the second part; the luminous brightness of the second picture is greater than the luminous brightness of the first picture;

[0013] At least a second portion of the photoresist layer softens.

[0014] Optionally, in some embodiments of the present application, the first picture is a black picture, and the second picture is a non-black picture.

[0015] Optionally, in some embodiments of the present application, both the first picture and the second picture are non-black pictures, and the softening depth of the first part is smaller than the softening depth of the second part.

[0016] Optionally, in some embodiments of the present application, the image includes respective position signals and size information of the first part and the second part.

[0017] Optionally, in some embodiments of the present application, softening at least the second portion of the photoresist layer comprises the following steps:

[0018] shielding a first portion of the photoresist layer and exposing a second portion of the photoresist layer;

[0019] The photoresist layer is illuminated with light to soften the second portion of the photoresist layer.

[0020] Optionally, in some embodiments of the present application, in the step of shielding the first portion of the photoresist layer:

[0021] A mask is used to shield the photoresist layer, the opening of the mask corresponds to the second portion of the photoresist layer, and the light shielding portion of the mask shields the first portion of the photoresist layer.

[0022] Optionally, in some embodiments of the present application, in the step of shielding the first portion of the photoresist layer:

[0023] A patterned light shielding layer is formed on a side of the photoresist layer facing away from the adhesive layer, and the light shielding layer shields the first portion of the photoresist layer.

[0024] Optionally, in some embodiments of the present application, softening at least the second portion of the photoresist layer comprises the following steps:

[0025] The photoresist layer is shielded by a mask, the mask comprising a first light-transmitting unit and a second light-transmitting unit, the light transmittance of the first light-transmitting unit is greater than the light transmittance of the second light-transmitting unit, and the light transmittance of the second light-transmitting unit is greater than 0; the first light-transmitting unit corresponds to the second part of the photoresist layer, and the second light-transmitting unit corresponds to the first part of the photoresist layer;

[0026] The photoresist layer is illuminated to soften the second portion of the photoresist layer, and the first portion of the photoresist layer close to the mask is softened, wherein the softening depth of the first portion is smaller than the softening depth of the second portion.

[0027] Optionally, in some embodiments of the present application, the preparation method further comprises the following steps:

[0028] The glue layer and the photoresist layer are peeled off.

[0029] The embodiment of the present application uses a photoresist layer as a flexible substrate of the LED transfer substrate, and improves the flexibility of the transfer substrate by softening the second portion of the photoresist layer corresponding to the non-LED device area, thereby increasing the application range of the LED transfer substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0031] Figure 1 It is a schematic diagram of a process for preparing an LED panel provided in an embodiment of the present application;

[0032] Figure 2 is a structural schematic diagram of step B2 of the method for preparing an LED panel provided in an embodiment of the present application;

[0033] Figure 3 This is a first structural schematic diagram of step B3 of the method for preparing an LED panel provided in an embodiment of the present application;

[0034] Figure 4 This is a second structural schematic diagram of step B3 of the method for preparing an LED panel provided in an embodiment of the present application;

[0035] Figure 5 It is a third structural schematic diagram of step B3 of the method for preparing an LED panel provided in an embodiment of the present application;

[0036] Figure 6 is a structural schematic diagram of step B4 of the method for preparing an LED panel provided in an embodiment of the present application;

[0037] Figure 7 It is a structural schematic diagram of step B5 of the method for preparing an LED panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0039] Please refer to Figure 1 The present application provides a method for preparing an LED panel, which is described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.

[0040] The present invention provides a method for preparing an LED panel, which comprises the following steps:

[0041] Step B1: forming a glue layer on the photoresist layer, wherein the photoresist layer includes a plurality of first parts and a plurality of second parts connected to each other;

[0042] Step B2: Arranging an LED device on the area of ​​the adhesive layer corresponding to the first portion;

[0043] Step B3: softening at least the second portion of the photoresist layer to form an LED transfer substrate;

[0044] Step B4: transferring the LED transfer substrate to align with the target substrate, and fixing the LED device on the target substrate;

[0045] Step B5: peeling off the adhesive layer and the photoresist layer.

[0046] The preparation method of the LED panel in the embodiment of the present application uses a photoresist layer as a flexible substrate of the LED transfer substrate, and improves the flexibility of the transfer substrate by softening the second part of the photoresist layer corresponding to the non-LED device area, thereby improving the application range of the LED transfer substrate.

[0047] The following is a detailed description of the method for preparing the LED panel of this embodiment.

[0048] Step B1: forming a glue layer 12 on the photoresist layer 11. The photoresist layer 11 includes a plurality of first portions 111 and a plurality of second portions 112 connected to each other.

[0049] Optionally, the material of the adhesive layer 12 may be polydimethylsiloxane (PDMS) or photosensitive adhesive.

[0050] Please refer to Figure 2 , step B2: arrange the LED device 13 on the area of ​​the glue layer 12 corresponding to the first part 111 .

[0051] Optionally, the LED device 13 may be a micro light emitting diode device (Micro-LED), a sub-millimeter light emitting diode device (Mini-LED) or other light emitting diode devices.

[0052] Step B3: soften at least the second portion 112 of the photoresist layer 11 to form an LED transfer substrate zy.

[0053] Optionally, in the first embodiment of the present application, please refer to Figure 3 , step B3 comprises the following steps:

[0054] Step B301: Acquire a distribution image of the LED device 13 .

[0055] Optionally, the image includes position signals and size information of the first part 111 and the second part 112 , respectively.

[0056] It should be noted that the position information and the size information of the first part 111 correspond to and are the same as the position information and the size information of the LED device 13 .

[0057] Step B302: According to the image, control the display pn to display a picture to illuminate the photoresist layer 11. The picture includes a first picture and a second picture, the first picture corresponds to the first part, the second picture corresponds to the second part; the luminous brightness of the second picture is greater than the luminous brightness of the first picture.

[0058] Specifically, the picture to be displayed by the display pn can be set according to the position information and size information of the image. The first picture corresponds to the first part 111, and the second picture corresponds to the second part 112. Since the first picture and the second picture can be locally and accurately controlled, compared with using an exposure machine for irradiation, not only a mask is saved, but also more arrangement patterns of LED devices 13 can be applied.

[0059] Optionally, the display pn may be a liquid crystal display, an OLED display, a Micro-LED display, a Mini-LED display, an electrophoretic display or other displays.

[0060] Step B303: at least the second portion 112 of the photoresist layer 11 is softened.

[0061] The first image is a black image, and the second image is a non-black image. That is, in the first embodiment, only the second portion 112 is illuminated, thereby only the second portion 112 of the photoresist layer 11 is softened.

[0062] Optionally, for example, the second picture may be a pure color picture such as a red picture, a green picture, a white picture, a gray picture or a blue picture, or may be a color pattern.

[0063] Optionally, the softening depth of the second portion 112 located in the middle area of ​​the photoresist layer 11 is greater than the softening depth of the second portion 112 located in the peripheral area of ​​the photoresist layer 11. This arrangement allows the transfer substrate zy to better fit the target substrate.

[0064] In the second embodiment of the present application, compared with the first embodiment, the difference between the second embodiment and the first embodiment is that the first picture and the second picture are both non-black pictures, and the softening depth of the first part 111 is less than the softening depth of the second part 112.

[0065] That is, the display device pn is used to soften the first part 111 and the second part 112 at the same time, but the degree of softening is controlled by different luminous brightness. Compared with the first embodiment, such a setting improves the flexibility of the transfer substrate zy.

[0066] Optionally, the second picture includes a middle area and a peripheral area arranged around the middle area, and the luminous brightness of the middle area is greater than the luminous brightness of the peripheral area to reduce the influence of light on the first part 111.

[0067] In the third embodiment of the present application, please refer to Figure 4 The difference between the third embodiment and the first embodiment is that step B3 includes the following steps:

[0068] Step B311 : shielding the first portion 111 of the photoresist layer 11 and exposing the second portion 112 of the photoresist layer 11 .

[0069] Optionally, a mask plate ym is used to shield the photoresist layer 11. The opening y1 of the mask plate ym corresponds to the second portion 112 of the photoresist layer 11, and the light shielding portion y2 of the mask plate ym shields the first portion 111 of the photoresist layer 11.

[0070] In some embodiments, the first portion 111 of the photoresist layer 11 may be shielded in the following manner: a patterned light shielding layer is formed on a side of the photoresist layer facing away from the adhesive layer, and the light shielding layer shields the first portion of the photoresist layer.

[0071] Step B312: irradiating the photoresist layer 11 with light to soften the second portion 112 of the photoresist layer 11 .

[0072] The third embodiment uses an exposure machine + mask plate method to soften the photoresist layer 11 . Compared with the method using a display, the third embodiment has better lighting accuracy and can reduce the risk of light irradiating the first portion 111 .

[0073] In the fourth embodiment of this application, please refer to Figure 5 The difference between the fourth embodiment and the third embodiment is that step B3 includes the following steps:

[0074] B322: Use a mask plate ym to block the photoresist layer 11. The mask plate ym includes a first light-transmitting unit m1 and a second light-transmitting unit m2, wherein the transmittance of the first light-transmitting unit m1 is greater than the transmittance of the second light-transmitting unit m2. The transmittance of the second light-transmitting unit m2 is greater than 0. The first light-transmitting unit m1 corresponds to the second portion 112 of the photoresist layer 11, and the second light-transmitting unit m2 corresponds to the first portion 111 of the photoresist layer 11.

[0075] B323: irradiating the photoresist layer 11 with light to soften the second portion 112 of the photoresist layer 11 and softening the first portion 111 of the photoresist layer 11 close to the mask ym. The softening depth of the first portion 111 is less than the softening depth of the second portion 112.

[0076] Compared with the third embodiment, the fourth embodiment adopts the front lighting method. Under the same time and exposure amount, the different light transmittances of different light-transmitting units of the mask plate ym are utilized to make the softening degree of the second part 112 higher than that of the first part 111, thereby improving the flexibility of the transfer substrate zy.

[0077] Please refer to Figure 6 , step B4: transfer the LED transfer substrate zy to align with the target substrate mb, and fix the LED device 13 on the target substrate mb.

[0078] Optionally, the target substrate mb includes a base, a thin film transistor layer arranged on the base, and a conductive pad. The LED device 13 and the conductive pad are fixedly connected.

[0079] The LED device 13 and the conductive pad can be fixedly connected by welding, hot pressing with conductive adhesive, bonding, etc.

[0080] Please refer to Figure 7 , step B5: peeling off the adhesive layer 12 and the photoresist layer 11.

[0081] Optionally, laser or ultraviolet light irradiation may be used to reduce the viscosity of the adhesive layer 12 , thereby peeling off the adhesive layer 12 and the photoresist layer 11 .

[0082] This completes the preparation process of the method for preparing the LED panel of the embodiment of the present application.

[0083] The embodiment of the present application uses a photoresist layer as a flexible substrate of the LED transfer substrate, and improves the flexibility of the transfer substrate by softening the second portion of the photoresist layer corresponding to the non-LED device area, thereby increasing the application range of the LED transfer substrate.

[0084] The above is a detailed introduction to a method for preparing an LED panel provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for preparing an LED panel, It is characterized in that The following steps are involved: forming a glue layer on the photoresist layer, wherein the photoresist layer includes a plurality of first parts and a plurality of second parts connected to each other; Arranging an LED device on the area of ​​the glue layer corresponding to the first portion; Softening the first part and the second part of the photoresist layer by light to form an LED transfer substrate, wherein the photoresist layer is a flexible substrate of the LED transfer substrate, and the softening depth of the first part is less than the softening depth of the second part; The LED transfer substrate is transferred to align with the target substrate, and the LED device is fixed on the target substrate.

2. The method for preparing an LED panel according to claim 1, It is characterized in that Softening the first and second parts of the photoresist layer by irradiating light comprises the following steps: Acquiring a distribution image of the LED device; According to the image, controlling the display to display a picture to illuminate the photoresist layer; the picture includes a first picture and a second picture, the first picture corresponds to the first part, and the second picture corresponds to the second part; the luminous brightness of the second picture is greater than the luminous brightness of the first picture; The first portion and the second portion of the photoresist layer are softened.

3. The method for preparing an LED panel according to claim 2, It is characterized in that The first picture and the second picture are both non-black pictures.

4. The method for preparing an LED panel according to claim 2, It is characterized in that The image includes position signals and size information of the first part and the second part, respectively.

5. The method for preparing an LED panel according to claim 1, It is characterized in that Softening the first and second parts of the photoresist layer by irradiating light comprises the following steps: The photoresist layer is shielded by a mask, the mask comprising a first light-transmitting unit and a second light-transmitting unit, the light transmittance of the first light-transmitting unit is greater than the light transmittance of the second light-transmitting unit, and the light transmittance of the second light-transmitting unit is greater than 0; the first light-transmitting unit corresponds to the second part of the photoresist layer, and the second light-transmitting unit corresponds to the first part of the photoresist layer; The photoresist layer is illuminated with light to soften the second portion of the photoresist layer and soften the first portion of the photoresist layer close to the mask.

6. The method for preparing an LED panel according to claim 1, It is characterized in that The preparation method further comprises the following steps: The glue layer and the photoresist layer are peeled off.

7. A method for preparing an LED panel, It is characterized in that The following steps are involved: forming a glue layer on the photoresist layer, wherein the photoresist layer includes a plurality of first parts and a plurality of second parts connected to each other; Arranging an LED device on the area of ​​the glue layer corresponding to the first portion; Only the second portion of the photoresist layer is softened by light to form an LED transfer substrate, wherein the photoresist layer is a flexible substrate of the LED transfer substrate; The LED transfer substrate is transferred to align with the target substrate, and the LED device is fixed on the target substrate.

8. The method for preparing an LED panel according to claim 7, It is characterized in that Only the second portion of the photoresist layer is softened by light, comprising the following steps: Acquiring a distribution image of the LED device; According to the image, controlling the display to display a picture to illuminate the photoresist layer; the picture includes a first picture and a second picture, the first picture corresponds to the first part, and the second picture corresponds to the second part; the luminous brightness of the second picture is greater than the luminous brightness of the first picture, the first picture is a black picture, and the second picture is a non-black picture; The second portion of the photoresist layer is softened.

9. The method for preparing an LED panel according to claim 8, It is characterized in that The image includes position signals and size information of the first part and the second part, respectively.

10. The method for preparing an LED panel according to claim 7, It is characterized in that Only the second portion of the photoresist layer is softened by light, comprising the following steps: shielding a first portion of the photoresist layer and exposing a second portion of the photoresist layer; The photoresist layer is illuminated with light to soften the second portion of the photoresist layer.

11. The method for preparing an LED panel according to claim 10, It is characterized in that In the step of shielding the first portion of the photoresist layer: A mask is used to shield the photoresist layer, the opening of the mask corresponds to the second portion of the photoresist layer, and the light shielding portion of the mask shields the first portion of the photoresist layer.

12. The method for preparing an LED panel according to claim 10, It is characterized in that In the step of shielding the first portion of the photoresist layer: A patterned light shielding layer is formed on a side of the photoresist layer facing away from the adhesive layer, and the light shielding layer shields the first portion of the photoresist layer.

13. The method for preparing an LED panel according to claim 7, It is characterized in that The preparation method further comprises the following steps: The glue layer and the photoresist layer are peeled off.

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